TPS3836H30DBVTG4 [TI]
NanoPower Supervisory Circuits 5-SOT-23 -40 to 85;
| 型号： | TPS3836H30DBVTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | NanoPower Supervisory Circuits 5-SOT-23 -40 to 85 光电二极管 |
| 文件： | 总22页 (文件大小：898K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS3836
TPS3837
TPS3838
www.ti.com
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
NanoPower Supervisory Circuits
Check for Samples: TPS3836, TPS3837, TPS3838
1
FEATURES
DESCRIPTION
23
•
Supply Current: 220 nA (typical)
The TPS3836, TPS3837, and TPS3838 families of
supervisory circuits provide circuit initialization and
timing supervision, primarily for DSP and
processor-based systems.
•
Precision Supply Voltage Supervision Range:
1.8 V, 2.5 V, 3.0 V, and 3.3 V
•
•
Power-On Reset Generator With Selectable
Delay Time: 10 ms or 200 ms
During power-on, RESET is asserted when the
supply voltage VDD becomes higher than 1.1 V.
Thereafter, the supervisory circuit monitors VDD and
keeps the RESET output active as long as VDD
remains below the threshold voltage of VIT. An
internal timer delays the return of the output to the
inactive state (high) to ensure proper system reset.
The delay time starts after VDD has risen above the
threshold voltage VIT.
Push/Pull RESET Output (TPS3836), Push/Pull
RESET Output (TPS3837), or Open-Drain
RESET Output (TPS3838)
•
•
•
Manual Reset
SOT23-5 and 2x2 SON-6 Packages
Temperature Range: –40°C to +85°C
When CT is connected to GND, a fixed delay time of
APPLICATIONS
typical 10 ms is asserted. When connected to VDD
,
•
Applications Using Low-Power DSPs,
Microcontrollers, or Microprocessors
the delay time is typically 200 ms. When the supply
voltage drops below the threshold voltage VIT, the
output becomes active (low) again. All the devices of
this family have a fixed-sense threshold voltage (VIT)
set by an internal voltage divider.
•
•
•
•
•
•
Portable- and Battery-Powered Equipment
Intelligent Instruments
Wireless Communication Systems
Notebook Computers
Automotive Systems
The TPS3836 has an active-low, push-pull RESET
output. The TPS3837 has an active-high, push-pull
RESET, and the TPS3838 integrates an active-low,
open-drain RESET output. The product spectrum is
designed for supply voltages of 1.8 V, 2.5 V, 3.0 V,
and 3.3 V. The circuits are available in either a
SOT23-5 or 2x2 SON-6 package. The TPS3836,
TPS3837, and TPS3838 families are characterized
for operation over a temperature range of –40°C to
+85°C.
Applications Using the MSP430™
blank
blank
TPS3838DRV
2mm x 2mm SON-6
(TOP VIEW)
VDD
GND
1
2
3
6
5
4
CT
N/C(1)
GND
RESET
MR
TPS3836K33
VDD
MSP430
VCC
TPS3837
DBV PACKAGE
(TOP VIEW)
TPS3836, TPS3838
DBV PACKAGE
(TOP VIEW)
CT
Lithium
Battery
3.6 V
RST
RESET
1
5
VDD
CT
1
2
3
5
4
VDD
CT
MR
T
VSS
GND
MR
2
GND
GND
MR
3
4
RESET
RESET
(1) N/C: Not connected.
Typical Application Circuit
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
MSP430 is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2010, Texas Instruments Incorporated
TPS3836
TPS3837
TPS3838
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Table 1. ORDERING INFORMATION(1)
PRODUCT
TPS383xE18
TPS383xJ25
TPS383xH30
TPS383xL30
TPS383xK33
NOMINAL SUPPLY VOLTAGE
THRESHOLD VOLTAGE (VIT)(2)
1.8 V
2.5 V
3.0 V
3.0 V
3.3 V
1.71 V
2.25 V
2.79 V
2.64 V
2.93 V
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Custom threshold voltages are available. Minimum order quantities apply. Contact factory for details and availability.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
TPS383xx
UNIT
V
(2)
Supply voltage, VDD
All other pins(2) (3)
7
–0.3 to 7
V
Maximum low output current, IOL
5
mA
mA
mA
mA
Maximum high output current, IOH
Input clamp current, IIK (VI < 0 or VI > VDD
–5
)
±10
Output clamp current, IOK (VO < 0 or VO > VDD
Continuous total power dissipation
Operating temperature range, TA
Storage temperature range, TSTG
Soldering temperature
)
±10
See Dissipation Ratings Table
–40 to +85
–65 to +150
+260
°C
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND.
(3) If RESET or RESET are pulled above VDD, the internal ESD structure will present an effective 1.5 kΩ resistor between these pins,
causing leakage current to flow into the RESET or RESET pin.
DISSIPATION RATINGS
TA < +25°C
POWER RATING
DERATING FACTOR
ABOVE TA = +25°C
TA = +70°C
POWER RATING
TA = +85°C
POWER RATING
PACKAGE
DBV
DRV Low-K(1)
DRV High-K(2)
437 mW
715 mW
1540 mW
3.5 mW/°C
7.1 mW/°C
15.4 mW/°C
280 mW
395 mW
845 mW
227 mW
285 mW
615 mW
(1) The JEDEC low-K (1s) board used to derive this data was a 3in x 3in, two-layer board with 2-ounce copper traces on top of the board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on the top and bottom of the board.
2
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Copyright © 2000–2010, Texas Instruments Incorporated
TPS3836
TPS3837
TPS3838
www.ti.com
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
RECOMMENDED OPERATING CONDITIONS
MIN
1.6
MAX
6
UNIT
V
Supply voltage, VDD
Voltage range, CT, MR, RESET, and RESET pins
High-level input voltage, VIH
0
VDD + 0.3
V
0.7 × VDD
V
Low-level input voltage, VIL
0.3 × VDD
100
V
Input transition rise and fall rate at MR, Δt/ΔV
Operating temperature range, TA
ns/V
°C
–40
+85
V
Pull-up
Pull-up resistor value, RESET pin (TPS3838 only)
Ω
50 μA
ELECTRICAL CHARACTERISTICS
Over recommended operating conditions, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
RESET
(TPS3836)
VDD = 3.3 V, IOH = –2 mA
VDD = 6 V, IOH = –3 mA
VDD = 1.8 V, IOH = –1 mA
VDD = 3.3 V, IOL = –2 mA
VDD = 1.8 V, IOL = 1 mA
VOH
High-level output voltage
0.8 × VDD
V
V
RESET
(TPS3837)
RESET
(TPS3836,
TPS3838)
VDD = 3.3 V, IOL = 2 mA
VOL
Low-level output voltage
Power-up reset voltage(1)
0.4
0.2
RESET
(TPS3837)
VDD = 3.3 V, IOL = 2 mA
VDD = 6 V, IOL = 3 mA
TPS3836,
TPS3838
VDD ≥ 1.1 V, IOL = 50 mA
VDD ≥ 1.1 V, IOL = –50 mA
V
V
TPS3837
0.8 × VDD
1.66
TPS383xE18
TPS383xJ25
TPS383xH30
TPS383xL30
TPS383xK33
1.71
2.25
2.79
2.64
2.93
30
1.74
2.29
2.85
2.69
2.99
2.18
Negative-going input threshold
voltage(2)
VIT
TA = –40°C to +85°C
2.70
V
2.56
2.84
1.7 V < VIT < 2.5 V
2.5 V < VIT < 3.5 V
3.5 V < VIT < 5 V
VHYS
Hysteresis at VDD input
High-level input current
40
mV
50
(3)
MR
MR = 0.7 × VDD, VDD = 6 V
CT = VDD = 6 V
–40
–25
–60
–100
+25
–340
+25
25
mA
nA
mA
nA
nA
IIH
CT
(3)
MR
MR = 0 V, VDD = 6 V
CT = 0 V, VDD = 6 V
VDD = VIT + 0.2 V, VOH = VDD
VDD > VIT, VDD < 3 V
VDD > VIT, VDD > 3 V
VDD < VIT
–130
–25
–200
IIL
Low-level input current
High-level output current
CT
IOH
TPS3838
220
250
10
30
5
400
450
15
nA
IDD
Supply current
mA
kΩ
pF
Internal pull-up resistor at MR
Input capacitance at MR and CT
CI
VI = 0 V to VDD
(1) The lowest voltage at which the RESET output becomes active. tR, VDD ≥ 15 ms/V.
(2) To ensure best stability of the threshold voltage, a bypass capacitor (ceramic, 0.1 mF) should be placed near the supply terminal.
(3) If manual reset is unused, MR should be connected to VDD to minimize current consumption.
Copyright © 2000–2010, Texas Instruments Incorporated
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3
TPS3836
TPS3837
TPS3838
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
www.ti.com
SWITCHING CHARACTERISTICS
At TA = +25°C, RL = 1 MΩ, and CL = 50 pF, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
DD ≥ VIT + 0.2 V, MR = 0.7 × VDD
,
5
10
15
CT = GND, (See Timing Diagram)
tD
Delay time
ms
V
DD ≥ VIT + 0.2 V, MR = 0.7 × VDD,
100
200
300
CT = VDD, (See Timing Diagram)
VDD to RESET
delay (TPS3836,
TPS3838)
VIL = VIT – 0.2 V, VIH = VIT + 0.2 V
VIL = 1.6 V
10
50
Propagation (delay) time,
high-to-low-level output
tPHL
ms
ms
VIL = VIT – 0.2 V, VIH = VIT + 0.2 V
VIL = 1.6 V
10
50
Propagation (delay) time,
low-to-high-level output
VDD to RESET
delay (TPS3837)
tPLH
MR to RESET
delay (TPS3836,
TPS3838)
Propagation (delay) time,
high-to-low-level output
V
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIL
tPHL
0.1
0.1
ms
ms
= 0.7 × VDD
Propagation (delay) time,
low-to-high-level output
MR to RESET
delay (TPS3837)
VDD ≥ VIT + 0.2 V, VIL = 0.3 × VDD,
tPLH
VIL = 0.7 × VDD
TIMING REQUIREMENTS
At TA = +25°C, RL = 1 MΩ, and CL = 50 pF, unless otherwise noted.
PARAMETER
TEST CONDITIONS
MIN
6
TYP
MAX
UNIT
at VDD
at MR
VIH = VIT + 0.2 V, VIL = VIT – 0.2 V
tW
Pulse width
ms
V
DD ≥ VIT + 0.2 V, VIL = 0.3 × VDD, VIH = 0.7 × VDD
1
4
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Copyright © 2000–2010, Texas Instruments Incorporated
TPS3836
TPS3837
TPS3838
www.ti.com
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
FUNCTIONAL BLOCK DIAGRAM
VDD
R3
CT
MR
RESET (TPS3837-Push-Pull)
C1
R1
Reset Logic
and Timer
+
RESET (TPS3836-Push-Pull
TPS3838-Open-Drain)
S1
–
R2
S2
C2
S3
Band-Gap
Reference
C3
Refresh
Timer
GND
FUNCTION TABLE
(1)
MR
VDD > VIT
RESET
RESET(2)
L
L
0
1
0
1
L
L
H
H
H
L
H
H
L
H
(1) TPS3836 and TPS3838.
(2) TPS3837.
Copyright © 2000–2010, Texas Instruments Incorporated
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5
TPS3836
TPS3837
TPS3838
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
www.ti.com
TIMING DIAGRAM
A
B
C
D
E
F
G
VDD
VIT
< 1.1 V
t
MR
t
RESET
t
tD
tD
tD
Undefined
Output
Undefined
Output
TYPICAL CHARACTERISTICS
SUPPLY CURRENT
vs
MANUAL RESET CURRENT
vs
SUPPLY VOLTAGE
MANUAL RESET VOLTAGE
10
8
100
MR = Open
CT = GND
VDD = 6 V
CT = GND
TA = 85°C
0
-100
-200
-300
-400
-500
TA = -40°C
TA = 25°C
TA = 0°C
6
TA = 0°C
TA = 25°C
4
TA = -40°C
TA = 85°C
2
0
0
2
4
6
-2
0
2
4
6
VDD - Supply Voltage - V
V
MR - Manual Reset Voltage - V
Figure 1.
Figure 2.
6
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Copyright © 2000–2010, Texas Instruments Incorporated
TPS3836
TPS3837
TPS3838
www.ti.com
SLVS292E –JUNE 2000–REVISED OCTOBER 2010
TYPICAL CHARACTERISTICS (continued)
LOW-LEVEL OUTPUT VOLTAGE
HIGH-LEVEL OUTPUT VOLTAGE
vs
vs
LOW-LEVEL OUTPUT CURRENT
HIGH-LEVEL OUTPUT CURRENT
2.0
2.0
1.5
1.0
0.5
0
VDD = 2 V
MR = OPEN
CT = GND
VDD = 2 V
MR = OPEN
CT = GND
1.5
1.0
0.5
0
TA = 85°C
TA = 25°C
TA = 25°C
TA = 0°C
TA = 85°C
TA = 0°C
TA = -40°C
TA = -40°C
0
1
2
3
4
5
6
7
0
1
2
3
4
5
IOL - Low-Level Output Current - mA
IOH - High-Level Output Current - mA
Figure 3.
Figure 4.
NORMALIZED RESET THRESHOLD VOLTAGE
MINIMUM PULSE DURATION AT VDD
vs
VS
FREE-AIR TEMPERATURE
VDD THRESHOLD OVERDRIVE
22
20
18
16
14
12
10
8
1.001
1.000
MR = Open
CT = GND
TA = +25°C
CT = GND
MR = Open
0.999
0.998
0.997
6
4
0.996
0.995
2
0
-40
-15
10
35
60
85
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
TA - Free-Air Temperature - °C
V
DD - Threshold Overdrive - V
Figure 5.
Figure 6.
Copyright © 2000–2010, Texas Instruments Incorporated
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7
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
TPS3836E18DBVR
TPS3836E18DBVRG4
TPS3836E18DBVT
TPS3836E18DBVTG4
TPS3836H30DBVR
TPS3836H30DBVRG4
TPS3836H30DBVT
TPS3836H30DBVTG4
TPS3836J25DBVR
TPS3836J25DBVRG4
TPS3836J25DBVT
TPS3836J25DBVTG4
TPS3836K33DBVR
TPS3836K33DBVRG4
TPS3836K33DBVT
TPS3836K33DBVTG4
TPS3836L30DBVR
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
PDNI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
3000
250
Green (RoHS
& no Sb/Br)
PDNI
PDNI
PDNI
PHRI
PHRI
PHRI
PHRI
PDSI
PDSI
PDSI
PDSI
PDTI
PDTI
PDTI
PDTI
PCAI
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
TPS3836L30DBVRG4
TPS3836L30DBVT
TPS3836L30DBVTG4
TPS3837E18DBVT
TPS3837E18DBVTG4
TPS3837J25DBVR
TPS3837J25DBVRG4
TPS3837J25DBVT
TPS3837J25DBVTG4
TPS3837K33DBVR
TPS3837K33DBVRG4
TPS3837K33DBVT
TPS3837K33DBVTG4
TPS3837L30DBVR
TPS3837L30DBVRG4
TPS3837L30DBVT
TPS3837L30DBVTG4
TPS3838E18DBVR
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
PCAI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
250
250
Green (RoHS
& no Sb/Br)
PCAI
PCAI
PDOI
PDOI
PDRI
PDRI
PDRI
PDRI
PDUI
PDUI
PDUI
PDUI
PCBI
PCBI
PCBI
PCBI
PDQI
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
TPS3838E18DBVRG4
TPS3838E18DBVT
TPS3838E18DBVTG4
TPS3838J25DBVR
TPS3838J25DBVRG4
TPS3838J25DBVT
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SON
DBV
5
5
5
5
5
5
5
5
5
5
5
6
6
6
6
5
5
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
PDQI
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DRV
DRV
DRV
DRV
DBV
DBV
DBV
250
250
Green (RoHS
& no Sb/Br)
PDQI
PDQI
PDPI
PDPI
PDPI
PDPI
PDVI
PDVI
PDVI
PDVI
CCS
CCS
CCS
CCS
PCCI
PCCI
PCCI
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
TPS3838J25DBVTG4
TPS3838K33DBVR
TPS3838K33DBVRG4
TPS3838K33DBVT
TPS3838K33DBVTG4
TPS3838K33DRVR
TPS3838K33DRVRG4
TPS3838K33DRVT
TPS3838K33DRVTG4
TPS3838L30DBVR
TPS3838L30DBVRG4
TPS3838L30DBVT
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
250
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
SON
250
Green (RoHS
& no Sb/Br)
SOT-23
SOT-23
SOT-23
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
TPS3838L30DBVTG4
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 85
PCCI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS3836E18, TPS3836H30, TPS3836J25, TPS3836K33, TPS3836L30, TPS3837E18, TPS3837J25, TPS3837K33, TPS3837L30,
TPS3838E18, TPS3838J25, TPS3838K33, TPS3838L30 :
Automotive: TPS3836E18-Q1, TPS3836H30-Q1, TPS3836J25-Q1, TPS3836K33-Q1, TPS3836L30-Q1, TPS3837E18-Q1, TPS3837J25-Q1, TPS3837K33-Q1, TPS3837L30-Q1,
TPS3838E18-Q1, TPS3838J25-Q1, TPS3838K33-Q1, TPS3838L30-Q1
•
Enhanced Product: TPS3836J25-EP, TPS3836L30-EP, TPS3837K33-EP
•
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3836E18DBVR
TPS3836E18DBVT
TPS3836H30DBVR
TPS3836H30DBVT
TPS3836J25DBVR
TPS3836J25DBVT
TPS3836K33DBVR
TPS3836K33DBVT
TPS3836L30DBVR
TPS3836L30DBVT
TPS3837E18DBVT
TPS3837E18DBVT
TPS3837J25DBVR
TPS3837J25DBVT
TPS3837K33DBVR
TPS3837K33DBVT
TPS3837L30DBVR
TPS3837L30DBVR
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
179.0
180.0
178.0
178.0
178.0
178.0
179.0
178.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
8.4
9.0
9.0
9.0
9.0
9.0
8.4
9.0
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.23
3.2
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.17
3.2
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3000
250
3000
250
3000
250
3000
250
250
250
3.15
3.23
3.23
3.23
3.23
3.2
3.2
1.4
3000
250
3.17
3.17
3.17
3.17
3.2
1.37
1.37
1.37
1.37
1.4
3000
250
3000
3000
3.23
3.17
1.37
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS3837L30DBVT
TPS3837L30DBVT
TPS3838E18DBVR
TPS3838E18DBVR
TPS3838E18DBVT
TPS3838E18DBVT
TPS3838J25DBVR
TPS3838J25DBVR
TPS3838J25DBVR
TPS3838J25DBVT
TPS3838J25DBVT
TPS3838K33DBVR
TPS3838K33DBVR
TPS3838K33DBVR
TPS3838K33DBVT
TPS3838K33DBVT
TPS3838K33DRVR
TPS3838K33DRVT
TPS3838L30DBVR
TPS3838L30DBVR
TPS3838L30DBVR
TPS3838L30DBVT
TPS3838L30DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SON
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DRV
DRV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
5
250
250
178.0
179.0
179.0
180.0
180.0
179.0
180.0
178.0
179.0
179.0
180.0
180.0
179.0
178.0
180.0
179.0
179.0
179.0
180.0
179.0
178.0
179.0
180.0
9.0
8.4
8.4
9.0
9.0
8.4
9.0
9.0
8.4
8.4
9.0
9.0
8.4
9.0
9.0
8.4
8.4
8.4
9.0
8.4
9.0
8.4
9.0
3.23
3.2
3.17
3.2
3.2
3.2
3.2
3.2
3.2
3.17
3.2
3.2
3.2
3.2
3.2
3.17
3.2
3.2
2.2
2.2
3.2
3.2
3.17
3.2
3.2
1.37
1.4
1.4
1.4
1.4
1.4
1.4
1.37
1.4
1.4
1.4
1.4
1.4
1.37
1.4
1.4
1.2
1.2
1.4
1.4
1.37
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q2
Q2
Q3
Q3
Q3
Q3
Q3
3000
3000
250
3.2
3.15
3.15
3.2
250
3000
3000
3000
250
3.15
3.23
3.2
3.2
250
3.15
3.15
3.2
3000
3000
3000
250
3.23
3.15
3.2
250
3000
250
2.2
SON
2.2
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
3000
3000
3000
250
3.15
3.2
3.23
3.2
250
3.15
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3836E18DBVR
TPS3836E18DBVT
TPS3836H30DBVR
TPS3836H30DBVT
TPS3836J25DBVR
TPS3836J25DBVT
TPS3836K33DBVR
TPS3836K33DBVT
TPS3836L30DBVR
TPS3836L30DBVT
TPS3837E18DBVT
TPS3837E18DBVT
TPS3837J25DBVR
TPS3837J25DBVT
TPS3837K33DBVR
TPS3837K33DBVT
TPS3837L30DBVR
TPS3837L30DBVR
TPS3837L30DBVT
TPS3837L30DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
203.0
182.0
180.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
203.0
182.0
180.0
180.0
180.0
180.0
203.0
180.0
180.0
203.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
18.0
35.0
20.0
18.0
18.0
18.0
18.0
35.0
18.0
18.0
35.0
3000
250
3000
250
3000
250
3000
250
250
250
3000
250
3000
250
3000
3000
250
250
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Aug-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS3838E18DBVR
TPS3838E18DBVR
TPS3838E18DBVT
TPS3838E18DBVT
TPS3838J25DBVR
TPS3838J25DBVR
TPS3838J25DBVR
TPS3838J25DBVT
TPS3838J25DBVT
TPS3838K33DBVR
TPS3838K33DBVR
TPS3838K33DBVR
TPS3838K33DBVT
TPS3838K33DBVT
TPS3838K33DRVR
TPS3838K33DRVT
TPS3838L30DBVR
TPS3838L30DBVR
TPS3838L30DBVR
TPS3838L30DBVT
TPS3838L30DBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SON
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DRV
DRV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
6
6
5
5
5
5
5
3000
3000
250
203.0
182.0
182.0
203.0
182.0
180.0
203.0
203.0
182.0
182.0
203.0
180.0
182.0
203.0
203.0
203.0
182.0
203.0
180.0
203.0
182.0
203.0
182.0
182.0
203.0
182.0
180.0
203.0
203.0
182.0
182.0
203.0
180.0
182.0
203.0
203.0
203.0
182.0
203.0
180.0
203.0
182.0
35.0
20.0
20.0
35.0
20.0
18.0
35.0
35.0
20.0
20.0
35.0
18.0
20.0
35.0
35.0
35.0
20.0
35.0
18.0
35.0
20.0
250
3000
3000
3000
250
250
3000
3000
3000
250
250
3000
250
SON
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
3000
3000
3000
250
250
Pack Materials-Page 4
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
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