TPS3839G18DQNT [TI]

Ultra-Low Power, Supply Voltage Supervisor; 超低功耗,电源电压监控器
TPS3839G18DQNT
型号: TPS3839G18DQNT
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Ultra-Low Power, Supply Voltage Supervisor
超低功耗,电源电压监控器

监控
文件: 总11页 (文件大小:227K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS3839  
www.ti.com  
SBVS193 JUNE 2012  
Ultra-Low Power, Supply Voltage Supervisor  
Check for Samples: TPS3839  
1
FEATURES  
DESCRIPTION  
The TPS3839 is an ultra-low current, 150-nA (typ)  
voltage supervisory circuit that monitors a single  
voltage. The device asserts an active-low reset signal  
whenever the VDD supply voltage drops below the  
factory-trimmed reset threshold voltage. The reset  
output remains asserted for 200 ms (typ) after the  
VDD voltage rises above the threshold voltage. The  
TPS3839 is designed to ignore fast transients on the  
VDD pin.  
2
1-mm × 1-mm µSON or 3-Pin SOT23 Package  
Ultra-Low Supply Current: 150 nA (typ)  
Operating Supply Voltage: 0.6 V to 6.5 V  
Ensured Valid RESET for VDD > 0.6 V  
Push-Pull RESET Output  
Temperature Range: –40°C to +85°C  
Factory-Trimmed RESET Threshold Voltages  
The ultra-low current consumption of 150 nA makes  
the TPS3839 ideal for use in low-power and portable  
applications. The TPS3839 is ensured to have the  
correct output logic state for supply voltages down to  
0.6 V.  
APPLICATIONS  
Portable and Battery-Powered Equipment  
Industrial Equipment  
Cell Phones  
The device features precision factory-trimmed  
threshold voltages and extremely low power  
operation. The TPS3839 is available is a 3-pin  
SOT23 (DBZ) package or a 4-pin 1-mm × 1-mm  
(DQN) µSON package.  
Glucose Monitors  
Metering  
Televisions  
3.3 V  
DBZ PACKAGE  
SOT23-3  
(TOP VIEW)  
DQN PACKAGE  
1-mm ´ 1-mm TBD  
(TOP VIEW)  
C1  
0.1 mF  
VDD  
VDD  
VDD  
1
4
RESET  
GND  
1
VDD  
mP  
3
TPS3839K33  
NC  
2
3
GND  
RESET  
GND  
RST  
2
RESET  
GND  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCT PREVIEW information concerns products in the  
formative or design phase of development. Characteristic data and  
other specifications are design goals. Texas Instruments reserves  
the right to change or discontinue these products without notice.  
Copyright © 2012, Texas Instruments Incorporated  
TPS3839  
SBVS193 JUNE 2012  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
PRODUCT  
THRESHOLD VOLTAGE (V)  
PACKAGE TYPE  
X2SON  
X2SON  
SOT23  
TOP MARKINGS  
TBD  
TPS3839A09DQN  
TPS3839G12DQN  
TPS3839G12DBZ  
TPS3839E16DQN  
TPS3839G18DQN  
TPS3839G18DBZ  
TPS3839L30DBZ  
TPS3839K33DQN  
TPS3839K33DBZ  
TPS3839G33DQN  
TPS3839K50DQN  
TPS3839K50DBZ  
0.900  
1.120  
1.120  
1.520  
1.670  
1.670  
2.630  
2.930  
2.930  
3.080  
4.380  
4.380  
TBD  
TBD  
X2SON  
X2SON  
SOT23  
TBD  
TBD  
TBD  
SOT23  
TBD  
X2SON  
SOT23  
TBD  
TBD  
X2SON  
X2SON  
SOT23  
TBD  
TBD  
TBD  
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or visit the  
device product folder at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range, unless otherwise noted.  
VALUE  
MIN  
–0.3  
–0.3  
MAX  
UNIT  
V
VDD  
7
7
5
Voltage  
On RESET  
RESET pin  
V
Current  
mA  
Continuous total power dissipation  
See Thermal Information Table  
Operating ambient, TA  
Storage, Tstg  
–40  
–65  
+85  
+150  
2
°C  
°C  
kV  
V
Temperature(2)  
Human body model (HBM)  
Charge device model (CDM)  
Electrostatic discharge (ESD) rating:  
500  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods my affect device reliability.  
(2) As a result of the low dissipated power in this device, it is assumed that TJ is equal to TA.  
THERMAL INFORMATION  
TPS3839  
THERMAL METRIC(1)  
DRY (µSON)  
6 PINS  
293.8  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
θJCtop  
θJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
165.1  
160.8  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
27.3  
ψJB  
65.8  
θJCbot  
65.8  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
Submit Documentation Feedback  
2
Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS3839  
TPS3839  
www.ti.com  
SBVS193 JUNE 2012  
ELECTRICAL CHARACTERISTICS  
At TA = –40°C to +85°C, 0.9 V < VDD< 6.5 V, and C1 = 0.1 µF, unless otherwise noted.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VDD  
V(VO)  
IDD  
Input supply range  
0.9  
6.5  
0.6  
600  
0.4  
0.4  
0.4  
V
V
Minimum VDD voltage for valid output  
Supply current (into VDD pin)  
IOL = 1 µA  
Output not connected  
150  
mA  
V
VDD = 0.9 V to 1.2 V, IOL = 120 µA  
VDD = 1.2 V to 2.8 V, IOL = 0.5 mA  
VDD = 2.8 V to 6.5 V, IOL = 2 mA  
VDD = 0.9 V to 1.8 V, IOH = –50 µA  
VDD = 1.8 V to 3.3 V, IOH = –0.5 mA  
VDD = 3.3 V to 6.5 V, IOH = –2 mA  
VOL  
Low-level output voltage RESET  
High-level output voltage RESET  
V
V
VDD – 0.4  
VDD – 0.4  
VDD – 0.4  
V
VOH  
V
V
Negative-going input threshold  
accuracy  
V(THA)  
–2.0  
±1.0  
+2.0  
%
TPS3839A09  
TPS3839G12  
TPS3839E16  
TPS3839G18  
TPS3839L30  
TPS3839K33  
TPS3839G33  
TPS3839K50  
V(SENSE) falling  
0.882  
1.098  
1.490  
1.637  
2.577  
2.871  
3.018  
4.292  
0.900  
1.120  
1.520  
1.670  
2.630  
2.930  
3.080  
4.380  
10  
0.918  
1.142  
1.550  
1.703  
2.683  
2.989  
3.142  
4.468  
V
V
V
V
VIT–  
Negative-going threshold voltage  
V
V
V
V
Vhys  
Hysteresis voltage  
mV  
TIMING REQUIREMENTS  
PARAMETER  
MIN  
TYP  
1
MAX  
UNIT  
tW  
Minimum VDD pulse width to RESET  
µs  
ms  
µs  
tD  
RESET delay time (power-up delay)  
120  
200  
20  
320  
tPHL  
Propagation delay, VDD falling (power-down delay)  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TPS3839  
TPS3839  
SBVS193 JUNE 2012  
www.ti.com  
PIN CONFIGURATIONS  
DQN PACKAGE  
1-mm × 1-mm TBD  
(TOP VIEW)  
DBZ PACKAGE  
SOT23-3  
(TOP VIEW)  
VDD  
1
4
RESET  
GND  
1
VDD  
3
NC  
2
3
GND  
2
RESET  
PIN ASSIGNMENTS  
PIN NO  
PIN NAME  
GND  
DQN  
DBZ  
1
DESCRIPTION  
3
2
Ground  
NC  
Do not connect  
Active low RESET output. RESET has a push-pull output drive and is capable of directly  
driving input pins. This in remains low as long as VDD is below the factory threshold voltage  
and remains low until a certain time (tD) after VDD rises above the threshold voltage.  
RESET  
VDD  
1
4
2
3
Supply voltage  
FUNCTIONAL BLOCK DIAGRAM  
VDD  
Delay  
RESET  
VREF  
GND  
Figure 1. TPS3895A Block Diagram  
4
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS3839  
TPS3839  
www.ti.com  
SBVS193 JUNE 2012  
APPLICATION INFORMATION  
APPLICATION CIRCUIT  
Figure 2 shows an example typical application circuit.  
3.3 V  
C1  
0.1 mF  
VDD  
VDD  
mP  
TPS3839K33  
RESET  
GND  
RST  
GND  
Figure 2. Typical Application Circuit  
VDD TRANSIENT REJECTION  
The TPS3839 has built-in rejection of fast transients on the VDD pin. Transient rejection is dependent on both  
transient duration and transient amplitude. Transient amplitude is measured from the bottom of the transient to  
the negative threshold voltage of the TPS3839, as shown in Figure 3.  
VTH  
VDD  
Transient  
Amplitude  
Duration  
(tW)  
Figure 3. Voltage Transient Measurement  
The TPS3839 does not respond to fast-duration, low-amplitude or long-duration, small-amplitude transients.  
Figure 4 shows the relationship between the transient amplitude and duration required to trigger a reset. Any  
combination of duration and amplitude above the curve generates a reset signal.  
FPO  
Figure 4. TPS3839 Transient Rejection  
Copyright © 2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TPS3839  
 
 
 
TPS3839  
SBVS193 JUNE 2012  
www.ti.com  
INPUT CAPACITOR  
The TPS3839 uses a unique sampling scheme to maintain an extremely low average quiescent current of 150  
nA. The TPS3839 typically only consumes approximately 100 nA of dc current. However, this current rises to  
approximately 15 µA for about 200 µs while the TPS3839 samples the input voltage. If the source impedance is  
high then the additional current during sampling may trigger a false reset because of the apparent voltage drop  
at VDD. For high VDD source or trace impedance applications, it is recommended to add a small 0.1-µF bypass  
capacitor near the TPS3839 VDD pin. The bypass capacitor effectively keeps the average current at 150 nA and  
reduces the effects of a high-impedance voltage source.  
BIDIRECTIONAL RESET PINS  
Some microcontrollers have bidirectional RESET pins that act both as an input and an output. A series resistor  
should be placed between the TPS3839 output and the microcontroller RESET pin to protect against excessive  
current flow when both the TPS3839 and the microcontroller attempt to drive the RESET line. Figure 5 shows the  
connection of the TPS3839 with a microcontroller using a series resistor to drive a bidirectional RESET line.  
3.3 V  
VCC  
VDD  
mP  
RESET  
RST  
TPS3839K33  
47 kW  
GND  
Figure 5. Connection to Bidirectional RESET Pin  
SINGLE ALKALINE CELL MONITORING  
The low operating voltage and threshold options make the TPS3839 well-suited for monitoring single-cell alkaline  
battery applications. Figure 6 shows the TPS3839A09 used to disable a boost converter when the cell voltage  
reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage  
reaches 0.9 V, the TPS61261 enable pin is driven low. This setting disables the TPS61261 and places it in a  
low-current shutdown state. The combination of the TPS3839 and TPS61261 only consumes 250 nA (typical)  
from the discharged battery.  
TPS61261  
VIN  
L
VOUT  
FB  
3.3 V at 40 mA  
4.7 mH  
10 mF  
10 mF  
VDD  
GND  
One Cell  
Alkaline  
EN  
RI  
RESET  
5 kW  
GND  
TPS3839A09  
Figure 6. Disabled Boost Converter  
6
Submit Documentation Feedback  
Copyright © 2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS3839  
 
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS3839A09DBZR  
TPS3839A09DBZT  
TPS3839A09DQNR  
TPS3839A09DQNT  
TPS3839E16DBZR  
TPS3839E16DBZT  
TPS3839E16DQNR  
TPS3839E16DQNT  
TPS3839G12DBZR  
TPS3839G12DBZT  
TPS3839G12DQNR  
TPS3839G12DQNT  
TPS3839G18DBZR  
TPS3839G18DBZT  
TPS3839G18DQNR  
TPS3839G18DQNT  
TPS3839G33DBZR  
TPS3839G33DBZT  
TPS3839G33DQNR  
TPS3839G33DQNT  
TPS3839K33DBZR  
TPS3839K33DBZT  
TPS3839K33DQNR  
TPS3839K33DQNT  
TPS3839K50DBZR  
TPS3839K50DBZT  
TPS3839K50DQNR  
TPS3839K50DQNT  
TPS3839L30DBZR  
TPS3839L30DBZT  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
PREVIEW  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
X2SON  
X2SON  
SOT-23  
SOT-23  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
DQN  
DQN  
DBZ  
DBZ  
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
4
4
3
3
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
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Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Aug-2012  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS3839L30DQNR  
TPS3839L30DQNT  
PREVIEW  
PREVIEW  
X2SON  
X2SON  
DQN  
DQN  
4
4
TBD  
TBD  
Call TI  
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(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
IMPORTANT NOTICE  
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