TPS3899DL49DSE [TI]

Nano 125 nA IQ, 1% Accurate Voltage Supervisor, Push-Button Monitor with Programmable Sense and Reset Delay;
TPS3899DL49DSE
型号: TPS3899DL49DSE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Nano 125 nA IQ, 1% Accurate Voltage Supervisor, Push-Button Monitor with Programmable Sense and Reset Delay

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TPS3899  
SLVSFM0 – SEPTEMBER 2020  
TPS3899  
Nano 125 nA IQ, 1% Accurate Voltage Supervisor, Push-Button Monitor with  
Programmable Sense and Reset Delay  
1 Features  
3 Description  
Supply voltage monitor and push-button monitor  
VDD range: 0.7 V to 6 V  
Programmable sense and reset delay  
Nano quiescent current: 125 nA (typ)  
High threshold accuracy: ±0.5% (typ)  
Precision hysteresis: 5% (typ)  
Adjustable threshold voltage: 0.51 V (typ)  
Multiple output topologies  
– DL: open-drain active-low  
– PL: push-pull active-low  
– PH: push-pull active-high  
Temperature range: –40°C to +125°C  
Package: 1.5-mm × 1.5-mm WSON  
The TPS3899 is a nano-Iq, precision voltage  
supervisor that monitors system voltages or push-  
button inputs as low as 0.51 V. When the voltage of  
SENSE drops below the VIT- threshold, RESET/  
RESET will toggle after the programmed sense delay,  
set by CTS, has been reached. The TPS3899 asserts  
an open-drain or push-pull RESET/RESET signal to  
active-low logic (RESET) or active-high logic (RESET).  
The RESET/RESET output remains active until the  
SENSE voltage returns above the rising voltage  
threshold (VIT- + VHYS) for the reset delay set by CTR.  
The TPS3899 family uses a precision reference to  
achieve ±1% threshold accuracy. The sense delay  
and reset delay time can be user-adjusted by  
connecting a capacitor to the CTS and CTR pins  
respectively. The TPS3899 has a nano quiescent  
current of 125 nA (typ) and is available in a small 1.5-  
mm × 1.5-mm WSON package, making the device  
2 Applications  
Electricity meters  
Building Automation  
well-suited  
for  
battery-powered  
and  
space-  
Body Control Module (BCM)  
Data center and enterprise computing  
Notebooks, desktop computers, servers  
Smartphones, hand-held products  
Portable, battery-powered equipment  
Solid-state drives  
constrained applications. The device is fully specified  
over a temperature range of –40°C to +125°C (TA).  
Device Information  
PART NUMBER  
TPS3899  
PACKAGE (1)  
BODY SIZE (NOM)  
WSON (6) DSE  
1.50 mm × 1.50 mm  
STB & DVR  
1. For all available packages, see the orderable  
addendum at the end of the data sheet  
0.7 V to 6.0 V  
*Rpull-up  
VDD  
SENSE  
RESET  
CTR  
Push-button  
input  
TPS3899  
CTS  
GND  
Rpull-up required for open-drain variants only  
Figure 3-1. Typical Application Circuit  
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. ADVANCE INFORMATION for preproduction products; subject to change  
without notice.  
 
 
 
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Table of Contents  
1 Features............................................................................1  
2 Applications.....................................................................1  
3 Description.......................................................................1  
4 Revision History.............................................................. 2  
5 Device Comparison.........................................................3  
6 Pin Configuration and Functions...................................4  
Pin Functions.................................................................... 4  
7 Specifications.................................................................. 5  
7.1 Absolute Maximum Ratings........................................ 5  
7.2 ESD Ratings .............................................................. 5  
7.3 Recommended Operating Conditions.........................5  
7.4 Thermal Information....................................................6  
7.5 Electrical Characteristics.............................................7  
7.6 Timing Requirements..................................................8  
7.7 Timing Diagram...........................................................9  
7.8 Typical Characteristics..............................................10  
8 Detailed Description......................................................12  
8.1 Overview...................................................................12  
8.2 Functional Block Diagram.........................................12  
8.3 Feature Description...................................................12  
8.4 Device Functional Modes..........................................14  
9 Application and Implementation..................................15  
9.1 Application Information............................................. 15  
9.2 Typical Application.................................................... 15  
10 Power Supply Recommendations..............................17  
11 Layout...........................................................................18  
11.1 Layout Guidelines................................................... 18  
11.2 Layout Example...................................................... 18  
12 Device and Documentation Support..........................19  
12.1 Device Support ...................................................... 19  
12.2 Receiving Notification of Documentation Updates..20  
12.3 Support Resources................................................. 20  
12.4 Trademarks.............................................................20  
12.5 Electrostatic Discharge Caution..............................21  
12.6 Glossary..................................................................21  
13 Mechanical, Packaging, and Orderable  
Information.................................................................... 21  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
DATE  
REVISION  
NOTES  
September 2020  
*
Initial release.  
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5 Device Comparison  
Figure 5-1 shows the device naming nomenclature of the TPS3899. For all possible output types and threshold  
voltages options, see Device Naming Convention for a more detailed explanation. Contact TI sales  
representatives or on TI's E2E forum for detail and availability of other options; minimum order quantities apply.  
TPS3899 XX XX XXX  
Package  
DSE: WSON  
Threshold Voltage  
01: 0.51 V (adjustable)  
Output Type  
08: 0.8 V  
...  
54: 5.4 V  
DL: Open-Drain Active-Low  
PL: Push-Pull Active-Low  
PH: Push-Pull Active-High  
Figure 5-1. Device Naming Nomenclature  
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6 Pin Configuration and Functions  
6
5
4
CTR  
CTS  
1
2
3
RESET /RESET  
SENSE  
GND  
VDD  
Figure 6-1. DSE Package, 6-Pin , TPS3899 Top View  
Pin Functions  
PIN  
I/O  
DESCRIPTION  
NO.  
NAME  
Capacitor programmable reset delay. The CTR pin offers a user-adjustable delay time when returning from  
reset condition. Connecting this pin to a ground-referenced capacitor sets the RESET/RESET delay time to  
deassert.  
1
CTR  
Capacitor programmable sense delay.The CTS pin offers a user-adjustable delay time when asserting  
reset condition. Connecting this pin to a ground-referenced capacitor sets the RESET/RESET delay time to  
assert.  
2
CTS  
3
4
GND  
VDD  
I
Ground  
Supply voltage pin. Good analog design practice is to place a 0.1-µF ceramic capacitor close to this pin.  
This pin is connected to the voltage to be monitored for fixed variants or to a resistor divider for the  
adjustable variant. When the voltage on the SENSE pin transistions below the negative threshold voltage  
VIT-, RESET/RESET asserts to active logic after the sense delay set by CTS. When the voltage on the  
SENSE pin transistions above the positive threshold voltage VIT- + VHYS, RESET/RESET releases to  
inactive logic (deasserts) after the reset delay set by CTR.  
5
SENSE  
I
RESETactive-low output that asserts to a logic low state after CTS delay when the monitored voltage on  
the SENSE pin is lower than the negative threshold voltage (VIT-). RESETremains logic low (asserted) until  
the SENSE input rises above VIT- + VHYS and the CTR reset delay expires.  
6
6
RESET  
RESET  
O
O
RESET active-high output that asserts to a logic high state after CTS delay when the monitored voltage on  
the SENSE pin is lower than the negative threshold voltage (VIT-). RESET remains logic high (asserted)  
until the SENSE input rises above VIT- + VHYS and the CTR reset delay expires.  
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7 Specifications  
7.1 Absolute Maximum Ratings  
Over operating free-air temperature range, unless otherwise noted(1)  
MIN  
–0.3  
–0.3  
–0.3  
-0.3  
MAX  
6.5  
UNIT  
V
Voltage  
Voltage  
VDD, SENSE  
CTR, CTS  
VDD+0.3 (3)  
V
RESET(TPS3899DL)  
6.5  
Voltage  
V
RESET(TPS3899PL), RESET (TPS3899PH)  
RESET pin and RESET pin  
Operating Ambient temperature, TA  
Storage, Tstg  
VDD+0.3 (3)  
±20  
Current  
mA  
°C  
Temperature(2)  
Temperature(2)  
–40  
–65  
125  
150  
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under  
Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability.  
(2) As a result of the low dissipated power in this device, it is assumed that TJ = TA.  
(3) The absolute maximum rating is (VDD + 0.3) V or 6.5 V, whichever is smaller  
7.2 ESD Ratings  
VALUE  
UNIT  
Human body model (HBM), per ANSI/ESDA/JEDEC  
JS-001(1)  
± 2000  
V(ESD)  
Electrostatic discharge  
V
Charged device model (CDM), per JEDEC specification  
JESD22-C101(2)  
± 750  
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
7.3 Recommended Operating Conditions  
Over operating free-air temperature range (unless otherwise noted)  
MIN  
0
NOM  
MAX  
VDD  
6
UNIT  
V
Voltage  
Voltage  
SENSE, CTR,CTS  
VDD  
0
V
RESET(TPS3899DL)  
0
6
Voltage  
V
RESET(TPS3899PL), RESET (TPS3899PH)  
RESET pin and RESET pin current  
Junction temperature (free air temperature)  
CTR pin capacitor range  
0
VDD  
±5  
Current  
TJ  
0
mA  
°C  
–40  
0
125  
10  
CCTR  
CCTS  
µF  
µF  
CTS pin capacitor range  
0
10  
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7.4 Thermal Information  
TPS3899  
DSE  
THERMAL METRIC(1)  
UNIT  
6 PINS  
RθJA  
Junction-to-ambient thermal resistance  
214.9  
°C/W  
RθJC(top)  
RθJB  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
Junction-to-top characterization parameter  
153.7  
112.3  
25.5  
°C/W  
°C/W  
°C/W  
ψJT  
ψJB  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
111.8  
N/A  
°C/W  
°C/W  
RθJC(bot)  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
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7.5 Electrical Characteristics  
CTR = CTS = Open, RESETpull-up resistor (Rpull-up) = 100 kΩ to VDD, output reset load (CLOAD) = 10 pF and  
over the operating free-air temperature range – 40°C to 125°C, unless otherwise noted. Typical values are at  
TA = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
COMMON PARAMETERS  
Input supply voltage (Open Drain Low  
and Push Pull Low)  
VDD  
VDD  
0.7  
1
6
6
V
V
V
Input supply voltage (Push Pull High)  
Negative-going input threshold range  
VIT-  
Range  
for all output configs  
0.8  
5.4  
VREF-ADJ- Reference voltage for adjustable sense  
0.51  
±1  
V
threshold version  
VIT  
VIT-  
Negative-going input threshold accuracy  
accuracy  
TBD  
TBD  
%
VIT- = 0.8 V, VIT- = 0.51 V  
VIT- = 0.9 V to 5.4 V  
3
3
5
5
8
7
%
%
VHYS  
Hysteresis on VIT- pin  
ISENSE-  
Current into Sense pin when sense pin is VDD = VSENSE = 6 V  
separate VIT- = 0.8 V to 5.4 V  
0.025  
0.3  
µA  
SEP-  
SENSE  
ISENSE-  
Current into Sense pin when sense pin is VDD = VSENSE = 6 V  
separate,ADJ version VIT- = 0.51 V  
0.025  
0.125  
0.05  
1.2  
µA  
µA  
SEP-  
SENSE  
IDD-SEP- Supply current into VDD pin when sense VDD = VSENSE = 6 V  
pin is separate  
VIT- = 0.8 V to 5.4 V  
SENSE  
RCTS  
CTS pin internal resistance  
CTR pin internal resistance  
500  
500  
kΩ  
kΩ  
RCTR  
TPS3899DL (Open-drain active-low)  
VOL(max) = 300 mV  
IOUT(Sink) = 15 µA  
VPOR  
Power on Reset Voltage  
700  
300  
300  
100  
350  
mV  
mV  
mV  
nA  
VDD = 0.85 V  
IOUT(Sink) = 15 µA  
Low level output voltage  
VOL  
VDD = 3.3 V  
IOUT(Sink) = 2 mA  
VDD = VPULLUP = 6V  
―40°C to 85°C  
10  
10  
Ilkg(OD)  
Open-Drain output leakage current  
VDD = VPULLUP = 6V  
―40°C to 125°C  
nA  
TPS3899PL (Push-pull active-low)  
VOL(max) = 300 mV  
IOUT(Sink) = 15 µA  
VPOR  
Power on Reset Voltage (5)  
700  
300  
300  
mV  
mV  
mV  
V
VDD = 0.85V  
IOUT(Sink) = 15 µA  
Low level output voltage  
VOL  
VDD = 3.3 V  
IOUT(Sink) = 2mA  
VDD = 1.8 V  
IOUT(Source) = 500 µA  
0.8VDD  
0.8VDD  
0.8VDD  
High level output voltage  
VDD = 3.3 V  
IOUT(Source) = 500 µA  
VOH  
V
VDD = 6 V  
IOUT(Source) = 2 mA  
V
TPS3899PH (Push-pull active-high)  
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CTR = CTS = Open, RESETpull-up resistor (Rpull-up) = 100 kΩ to VDD, output reset load (CLOAD) = 10 pF and  
over the operating free-air temperature range – 40°C to 125°C, unless otherwise noted. Typical values are at  
TA = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
VOH(min) = 0.8VDD  
IOUT (Source) = 15 uA  
V
VPOR  
Power on Reset Voltage(1)  
900  
mV  
VDD = 3.3 V  
IOUT(Sink) = 500 µA  
300  
300  
mV  
mV  
V
Low level output voltage  
High level output voltage  
VOL  
VDD = 6 V  
IOUT(Sink) = 2 mA  
VDD = 1V  
IOUT(Sink) = 15 µA  
0.8VDD  
0.8VDD  
0.8VDD  
VDD = 1.5 V  
IOUT(Sink) = 500 µA  
VOH  
V
VDD = 3.3 V  
IOUT(Sink) = 2 mA  
V
(1) VPOR is the minimum VDD voltage level for a controlled output state.  
7.6 Timing Requirements  
At 0.7 V ≤ VDD ≤ 6 V, CTR = CTS = Open, RESETpull-up resistor (Rpull-up) = 100 kΩ to VDD, output reset  
load (CLOAD) = 10 pF and over the operating free-air temperature range ―40°C to 125°C, unless otherwise  
noted. Typical values are at TA = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
CTS pin = Open or NC; VDD  
=
tD-SENSE  
tD-SENSE  
tD-SENSE  
TPS3899x  
Detect time delay  
Detect time delay  
Detect time delay  
(VIT+ + 10%) to (VIT- - 10%)(2)  
30  
50  
µs  
CTS pin = 10 nF; VDD = (VIT+  
10%) to (VIT- - 10%)(2)  
+
TPS3899x+Detect  
Pin  
6.2  
ms  
CTS pin = 1 µF; VDD = (VIT+  
10%) to (VIT- - 10%)(2)  
+
TPS3899x+Detect  
Pin  
619  
40  
ms  
µs  
CTR pin = Open or NC  
80  
tD  
Reset time delay  
CTR pin = 10 nF  
CTR pin = 1 µF  
6.2  
ms  
ms  
619  
Glitch immunity VIT-  
when sense pin is  
separate  
Glitch immunity VIT-  
when sense pin is  
separate  
tGI_VIT-  
5% VIT- overdrive(3)  
10  
10  
µs  
SENSE  
tGI_VIT-  
tSTRT  
Glitch immunity VIT-  
Startup Delay(1)  
5% VIT- overdrive(3)  
µs  
µs  
CTR pin = Open or NC  
300  
(1) When VDD starts from less than the specified minimum VDD and then exceeds VIT-, reset is release after the startup delay (tSTRT), a  
capacitor at CT pin will add tD delay to tSTRT time  
(2) tP_HL measured from threhold trip point (VIT-) to VOL for active low variants and VOH for active high variants.  
(3) Overdrive % = [(VDD/ VIT-) - 1] × 100%  
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7.7 Timing Diagram  
VDD  
VPOR  
SENSE  
VIT- + VHYS  
VIT-  
tSTRT + tD  
tD-SENSE  
tD  
RESET  
tD-SENSE is controlled by CTS  
tD is controlled by CTR  
Undefined  
Figure 7-1. TPS3899DL01 and TPS3899PL01 Timing Diagram  
VDD  
VPOR  
SENSE  
VIT- + VHYS  
VIT-  
tSTRT + tD  
tD-SENSE  
tD  
RESET  
tD-SENSE is controlled by CTS  
tD is controlled by CTR  
Undefined  
Figure 7-2. TPS3899PH01 Timing Diagram  
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7.8 Typical Characteristics  
Typical characteristics show the typical performance of the TPS3899 device. Test conditions are TA = 25°C, VDD  
= 3.3V, and Rpull-up = 100KΩ, unless otherwise noted.  
Figure 7-3. Supply Current vs Supply Voltage  
Figure 7-4. SENSE Current vs VSENSE  
Figure 7-5. VIT- Accuracy vs Temperature  
Figure 7-6. VHYS vs Temperature  
145  
140  
135  
130  
125  
120  
115  
110  
105  
-40  
-20  
0
20  
40 60  
Temperature (°C)  
80  
100 120 140  
Figure 7-7. SENSE Glitch Immunity (VIT-) vs  
Overdrive  
Figure 7-8. Startup Delay vs Temperature  
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VDD falling below VIT-  
CTR = OPEN  
Figure 7-9. Propagation Delay vs Temperature  
Figure 7-10. Reset Time Delay vs Temperature  
CTS = OPEN  
Figure 7-11. SENSE Delay vs Temperature  
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8 Detailed Description  
8.1 Overview  
The TPS3899 voltage supervisor, push-button monitor asserts a RESET/RESET signal to active when the  
SENSE pin voltage drops below VIT- for the duration of the sense delay set by CTS. If the SENSE pin voltage  
rises above VIT- + VHYS before the sense delay expires, the RESET/RESET pin does not assert. When asserted,  
the RESET/RESET output remains asserted until SENSE voltage returns above VIT- + VHYS for the duration of  
the reset delay set by CTR. If the SENSE pin voltage falls below VIT- before the reset delay expires while RESET  
is asserted, RESET/RESET will remain asserted.  
8.2 Functional Block Diagram  
Push-pull variants only  
VDD  
VDD  
RESET  
LOGIC  
TIMER  
Cap ladder  
Fixed  
RESET (active-low variants: DL, PL)  
ADJ  
RESET (active-high variants: PH)  
SENSE  
+
œ
Reference  
GND  
VDD  
VDD  
RCTS  
RCTR  
CTR  
CTS  
GND  
8.3 Feature Description  
The combination of user-adjustable sense delay time via CTS and reset delay time via CTR with a broad range  
of threshold voltages allow these devices to be used in a wide array of applications. Fixed negative threshold  
voltages (VIT-) can be factory set from 0.8 V to 5.4 V in steps of 100 mV. CTS and CTR pins allows the sense  
delay and reset delay to be set to a minimum of 80 μs by leaving these pins floating, or the CTS and CTS pins  
can connect to an external capacitor to program the sense delay and reset delay independently.  
8.3.1 User-Programmable Sense and Reset Time Delay  
The sense delay corresponds to the configuration of CTS and the reset delay corresponds to the configuration of  
CTR. The sense and reset time delay can be set to a minimum value of 50 µs and 80 µs by leaving the CTS and  
CTR pins floating respectively, or a maximum value of approximately 6.2 seconds by connecting 10 µF delay  
capacitor.  
The relationship between external capacitor (CCT_EXT) in Farads at CTS or CTR pins and the time delay in  
seconds is given by Equation 1.  
tD = -ln (0.29) x RCT x CCT_EXT + tD (CTS or CTR = OPEN)  
(1)  
Equation 1 is simplified to Equation 2 and Equation 3 by plugging RCT and tD (CTS or CTR = OPEN) given in Electrical  
Characteristics and Timing Requirements section:  
tD-SENSE = 618937 x CCTS_EXT + 50µs  
tD = 618937 x CCTR_EXT + 80µs  
(2)  
(3)  
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Equation 4 and Equation 5 solves for both external capacitor values (CCTS_EXT) and (CCTR_EXT) in units of  
Farads where tD-SENSE and tD are in units of seconds  
CCTS_EXT = (tD-SENSE - 50µs) ÷ 618937  
CCTR_EXT = (tD - 80µs) ÷ 618937  
(4)  
(5)  
The recommended maximum sense and reset delay capacitors for the TPS3899 is limited to 10 µF as this  
ensures there is enough time for either capacitors to fully discharge when a voltage fault occurs. When a voltage  
fault occurs, the previously charged up capacitor discharges, and if the monitored voltage returns from the fault  
condition before either delay capacitors discharges completely, both delays will be shorter than expected  
because the capacitors will begin charging from a voltage above zero. Larger delay capacitors can be used so  
long as the capacitors have enough time to fully discharge during the duration of the voltage fault.  
Figure 8-1 shows the charge and discharge behavior on CTS and CTR that defines the sense and reset delays  
respectively. When SENSE transitions below VIT-, the capacitor connected to CTS begins to charge. Once the  
CTS capacitor charges to an internal threshold shown as VTH_CTS, RESETtransistions to active-low logic state  
and the CTS capacitor then begins to discharge immediately. When SENSE transistions above VIT- + VHYS, the  
capacitor connected to CTR begins to charge. Once the CTR capacitor charges to the internal threhold VTH_CTR  
,
RESET releases back to inactive logic high state and the CTR capacitor beginds to discharge immediately.  
Please note that for active-high devices, RESET follows the inverse behavior of RESET.  
SENSE  
tdischarge-CTR  
Vth_CTR  
CTR  
tdischarge-CTS  
CTS  
Vth_CTS  
tD-SENSE  
tD  
RESET  
Figure 8-1. CTS and CTS Charge and Discharge Behavior Relative to SENSE and RESET  
8.3.2 RESET/RESET Output  
Upon power up, RESET/RESET begins asserted and remains asserted until the SENSE pin voltage rises above  
the positive voltage threshold (VIT- + VHYS) for the duration of the reset delay set by CTR. After the SENSE pin  
voltage is above VIT- + VHYS for the reset delay, RESET/RESET deasserts. RESET/RESET remains deasserted  
long as the SENSE pin voltage is above the positive threshold. If the SENSE pin voltage falls below the negative  
threshold (VIT-) for the duration of the sense delay set by CTS, then RESET/RESET is asserted.  
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A pull-up resistor is required for the open-drain variants. Connect the pull-up resistor to the proper voltage rail to  
enable the outputs to be connected to other devices at the correct interface voltage level. RESET/RESET can be  
pulled up to any voltage up to 6.0 V, independent of the device supply voltage.  
8.3.3 SENSE Input  
The SENSE input can vary from ground to 6.0 V, regardless of the device supply voltage used. The SENSE pin  
is used to monitor the critical voltage rail or push-button input. If the voltage on this pin drops below VIT-, then  
RESET/RESET is asserted after the sense delay time set by CTS. When the voltage on the SENSE pin rises  
above the positive threshold voltage (VIT- + VHYS), RESET/RESET deasserts after the reset delay time set by  
CTR.  
The internal comparator has built-in hysteresis to ensure well-defined RESET/RESET assertions and  
deassertions even when there are small changes on the voltage rail being monitored.  
The TPS3899 device is relatively immune to short transients on the SENSE pin. Glitch immunity, tGI_V SENSE, is  
IT-  
dependent on threshold overdrive, as illustrated in Figure 7-7. Although not required in most cases, for noisy  
applications good analog design practice is to place a 1-nF to 10-nF bypass capacitor at the SENSE input to  
reduce sensitivity to transient voltages on the monitored signal.  
8.3.3.1 Immunity to SENSE Pin Voltage Transients  
The TPS3899 is immune to short voltage transient spikes on the input pins. Sensitivity to transients depends on  
both transient duration and overdrive (amplitude) of the transient. Overdrive is defined by how much VSENSE  
exceeds the specified threshold, and is important to know because the smaller the overdrive, the slower the  
response of the outputs. Threshold overdrive is calculated as a percent of the threshold in question, as shown in  
Equation 6.  
Overdrive = | (VSENSE / VIT- – 1) × 100% |  
(6)  
8.4 Device Functional Modes  
Table 8-1 summarizes the various functional modes of the device.  
Table 8-1. Truth Table  
VDD  
VDD < VPOR  
SENSE(2)  
RESET  
RESET  
Undefined  
Undefined  
(1)  
VPOR < VDD < VDD(MIN)  
VDD ≥ VDD(MIN)  
VDD ≥ VDD(MIN)  
L
L
H
H
L
VSENSE < VIT-  
VSENSE > VIT- + VHYS  
H
(1) When VDD falls below VDD(MIN), undervoltage-lockout (UVLO) takes effect and RESETis held logic low (RESET is held logic high) until  
VDD falls below VPOR at which the RESET/RESET output is undefined.  
(2) SENSE pin voltage must be < VIT- for the sense delay set by CTS or > VIT- + VHYS for the reset delay set by CTR before RESET  
transistions  
8.4.1 Normal Operation (VDD > VDD(min)  
)
When VDD is greater than VDD(min), the RESET/RESET pin is determined by the voltage on the SENSE pin and  
the sense delay and reset delay set by CTS and CTR respecively.  
8.4.2 Above Power-On-Reset But Less Than VDD(min) (VPOR < VDD < VDD(min)  
)
When the voltage on VDD is less than the VDD(min) voltage, and greater than the power-on-reset voltage (VPOR),  
the RESET/RESET signal is asserted regardless of the voltage on the SENSE pin.  
8.4.3 Below Power-On-Reset (VDD < VPOR  
)
When the voltage on VDD is lower than VPOR, the device does not have enough voltage to internally pull the  
asserted RESET output low and RESET is undefined. RESET is also undefined and may pull up to VDD or to  
the pull-up voltage. Neither output should be relied upon for proper device function.  
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9 Application and Implementation  
Note  
Information in the following applications sections is not part of the TI component specification, and TI  
does not warrant its accuracy or completeness. TI’s customers are responsible for determining  
suitability of components for their purposes. Customers should validate and test their design  
implementation to confirm system functionality.  
9.1 Application Information  
The following sections describe in detail how to properly use this device, depending on the requirements of the  
final application.  
9.2 Typical Application  
Design 1: Adjustable Voltage Supervisor with Push-Button Functionality  
A typical application for the TPS3899 is voltage rail monitoring with push-button functionality and specific timing  
requirements.  
In this design application, the TPS3899DL01 is being used to monitor a 3.3V power rail and will trigger a reset  
when the voltage drops below 2.9V or when the push-button is pressed. The reset output connects to an MCU  
for system resetting or servicing the push-button.  
3.3V  
0.1µF  
Rpull-up  
10kΩ  
47.5kΩ  
R1  
VDD  
RESET  
TPS3899DL01  
CTS CTR  
SENSE  
Push-button  
input  
R2  
10kΩ  
0.1µF  
GND  
0.1µF  
Figure 9-1. Design 1 - Adjustable Voltage Supervisor with Push-Button Functionality Circuit  
9.2.1 Design Requirements  
The design requirements, described in Table 9-1, for this design cover a defined reset threshold voltage of 2.9V,  
a sense delay of 60ms, a reset delay of 60ms, and an output current no larger than 500µA.  
Table 9-1. Design Requirements  
PARAMETER  
Reset Asserting  
DESIGN REQUIREMENTS  
DESIGN RESULTS  
Reset needs to assert when under the reset Reset asserts when under the reset condition  
condition of a button press or VDD ≤ 2.9V. of a button press or VDD ≤ 2.93V.  
Reset Asserting Timing  
Output Current  
Reset output needs to assert when the reset Reset output asserts when the reset  
conditions are met for 60ms, and needs to  
de-assert after 60ms of no reset conditions.  
conditions are met for 62ms and will deassert  
after 62ms of no reset conditions.  
The output current must not exceed 500µA.  
The output current is 300µA under the reset  
condition.  
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9.2.2 Detailed Design Procedure  
The TPS3899DL01 can monitor any voltage above 0.51V using an external voltage divider. This device has a  
negative going input threshold voltage of 0.51V, however, the design needs to assert a reset when VDD drops  
below 2.9V. By using a resistor divider (R1 = 47.5kΩ, R2 = 10kΩ) the negative going threshold voltage becomes  
2.93V. The device's positive going voltage threshold is VIT- + VHYS. The typical VHYS is 25.5mV. This in  
combination with the resistor divider makes the design's positive going threshold voltage equal to 3.08V. If VDD  
falls below 2.93V for the duration of sense delay (tD-SENSE), the reset will assert. If VDD rises above 3.08V for the  
duration of reset delay (tD), the reset will deassert. See Figure 9-2 for a timing diagram detailing the voltage  
levels and reset assertion/deassertion conditions.  
3.3 V  
VIT+ = 3.08V  
VIT- = 2.93V  
SENSE  
tD  
tD-SENSE  
tD  
tD-SENSE  
RESET  
Figure 9-2. Design 1 Timing Diagram  
This design will also enter a reset condition when the push-button (PB) is asserted. The push-button is tied to  
ground and when pressed will drop the SENSE voltage to 0V, making the device assert a reset. As a good  
analog practice, a 0.1µF capacitor was also placed on VDD.  
The desired reset timing conditions are sense delay time of 60ms (how long it takes to trigger a reset) and a  
reset delay time of 60ms (how long it takes to recover from a reset). Using Equation 4 and Equation 5,  
respectively, to solve for CTS and CTR capacitor values, CTS = 0.1µF and CTR = 0.1µF. These capacitor values  
give a nominal sense delay time of 62ms and nominal reset delay time of 62ms.  
For the requirement of a maximum output current, a pull-up resistor needs to be selected so that the current  
through the pull-up resistor exceeds no more than 500µA. When the reset output is low, the voltage drop across  
the pull-up resistor is equal to VDD. Ohm’s law is used to calculate the minimum resistor value. The resistor  
needs to be greater than 6kΩ in order to pull less than 500µA in the reset asserted low condition. A resistor  
value of 10kΩ was selected to accomplish this.  
Note that this design does not account for tolerances.  
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9.2.3 Application Curve  
Figure 9-3. Sense Delay  
Figure 9-4. Reset Delay  
10 Power Supply Recommendations  
These devices are designed to operate from an input supply with a voltage range between 0.7 V and 6 V. An  
input supply capacitor is not required for this device; however, if the input supply is noisy, then good analog  
practice is to place a 0.1-µF capacitor between the VDD pin and the GND pin. Also, placing a 1-nF to 10-nF  
capacitor between the SENSE pin and GND can reduce the sensitivity to transient voltages on the monitored  
signal. This device has a 6.5 V absolute maximum rating on the VDD pin. If the voltage supply providing power  
to VDD is susceptible to any large voltage transient that can exceed 6.5 V, additional precautions must be taken.  
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11 Layout  
11.1 Layout Guidelines  
Make sure that the connection to the VDD pin is low impedance. Good analog design practice is to place a 0.1-  
µF ceramic capacitor near the VDD pin. If a capacitor is not connected to the CTS or CTS pins, then minimize  
parasitic capacitance on this pin so the sense delay or reset delay times are not adversely affected. For fixed  
voltage threshold devices, good analog design practice is to place a 0.1-µF ceramic capacitor near the SENSE  
pin.  
11.2 Layout Example  
The layout example in Figure 11-1 shows how the TPS3899 is laid out on a printed circuit board (PCB) with a  
user-defined sense delay and reset delay.  
RPU  
RESET  
CTR  
CTS  
GND  
CCTS  
SENSE  
CCTS  
VDD  
CIN  
GND  
Figure 11-1. Recommended Layout  
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12 Device and Documentation Support  
12.1 Device Support  
12.1.1 Device Nomenclature  
Figure 5-1 in Device Comparison shows how to decode the function of the device based on its part number  
shown in Table 12-1.  
Table 12-1. Device Naming Convention  
ORDERABLE DEVICE NAME  
THRESHOLD VOLTAGE (V)  
-DL (OPEN-DRAIN ACTIVE-LOW) -PL (PUSH-PULL ACTIVE-LOW) -PH (PUSH-PULL ACTIVE-HIGH)  
TPS3899DL01DSE  
TPS3899DL08DSE  
TPS3899DL09DSE  
TPS3899DL10DSE  
TPS3899DL11DSE  
TPS3899DL12DSE  
TPS3899DL13DSE  
TPS3899DL14DSE  
TPS3899DL15DSE  
TPS3899DL16DSE  
TPS3899DL17DSE  
TPS3899DL18DSE  
TPS3899DL19DSE  
TPS3899DL20DSE  
TPS3899DL21DSE  
TPS3899DL22DSE  
TPS3899DL23DSE  
TPS3899DL24DSE  
TPS3899DL25DSE  
TPS3899DL26DSE  
TPS3899DL27DSE  
TPS3899DL28DSE  
TPS3899DL29DSE  
TPS3899DL30DSE  
TPS3899DL31DSE  
TPS3899DL32DSE  
TPS3899DL33DSE  
TPS3899PL01DSE  
TPS3899PL08DSE  
TPS3899PL09DSE  
TPS3899PL10DSE  
TPS3899PL11DSE  
TPS3899PL12DSE  
TPS3899PL13DSE  
TPS3899PL14DSE  
TPS3899PL15DSE  
TPS3899PL16DSE  
TPS3899PL17DSE  
TPS3899PL18DSE  
TPS3899PL19DSE  
TPS3899PL20DSE  
TPS3899PL21DSE  
TPS3899PL22DSE  
TPS3899PL23DSE  
TPS3899PL24DSE  
TPS3899PL25DSE  
TPS3899PL26DSE  
TPS3899PL27DSE  
TPS3899PL28DSE  
TPS3899PL29DSE  
TPS3899PL30DSE  
TPS3899PL31DSE  
TPS3899PL32DSE  
TPS3899PL33DSE  
TPS3899PH01DSE  
TPS3899PH08DSE  
TPS3899PH09DSE  
TPS3899PH10DSE  
TPS3899PH11DSE  
TPS3899PH12DSE  
TPS3899PH13DSE  
TPS3899PH14DSE  
TPS3899PH15DSE  
TPS3899PH16DSE  
TPS3899PH17DSE  
TPS3899PH18DSE  
TPS3899PH19DSE  
TPS3899PH20DSE  
TPS3899PH21DSE  
TPS3899PH22DSE  
TPS3899PH23DSE  
TPS3899PH24DSE  
TPS3899PH25DSE  
TPS3899PH26DSE  
TPS3899PH27DSE  
TPS3899PH28DSE  
TPS3899PH29DSE  
TPS3899PH30DSE  
TPS3899PH31DSE  
TPS3899PH32DSE  
TPS3899PH33DSE  
0.51  
0.80  
0.90  
1.00  
1.10  
1.20  
1.30  
1.40  
1.50  
1.60  
1.70  
1.80  
1.90  
2.00  
2.10  
2.20  
2.30  
2.40  
2.50  
2.60  
2.70  
2.80  
2.90  
3.00  
3.10  
3.20  
3.30  
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Table 12-1. Device Naming Convention (continued)  
ORDERABLE DEVICE NAME  
THRESHOLD VOLTAGE (V)  
-DL (OPEN-DRAIN ACTIVE-LOW) -PL (PUSH-PULL ACTIVE-LOW) -PH (PUSH-PULL ACTIVE-HIGH)  
TPS3899DL34DSE  
TPS3899DL35DSE  
TPS3899DL36DSE  
TPS3899DL37DSE  
TPS3899DL38DSE  
TPS3899DL39DSE  
TPS3899DL40DSE  
TPS3899DL41DSE  
TPS3899DL42DSE  
TPS3899DL43DSE  
TPS3899DL44DSE  
TPS3899DL45DSE  
TPS3899DL46DSE  
TPS3899DL47DSE  
TPS3899DL48DSE  
TPS3899DL49DSE  
TPS3899DL50DSE  
TPS3899DL51DSE  
TPS3899DL52DSE  
TPS3899DL53DSE  
TPS3899DL54DSE  
TPS3899PL34DSE  
TPS3899PL35DSE  
TPS3899PL36DSE  
TPS3899PL37DSE  
TPS3899PL38DSE  
TPS3899PL39DSE  
TPS3899PL40DSE  
TPS3899PL41DSE  
TPS3899PL42DSE  
TPS3899PL43DSE  
TPS3899PL44DSE  
TPS3899PL45DSE  
TPS3899PL46DSE  
TPS3899PL47DSE  
TPS3899PL48DSE  
TPS3899PL49DSE  
TPS3899PL50DSE  
TPS3899PL51DSE  
TPS3899PL52DSE  
TPS3899PL53DSE  
TPS3899PL54DSE  
TPS3899PH34DSE  
TPS3899PH35DSE  
TPS3899PH36DSE  
TPS3899PH37DSE  
TPS3899PH38DSE  
TPS3899PH39DSE  
TPS3899PH40DSE  
TPS3899PH41DSE  
TPS3899PH42DSE  
TPS3899PH43DSE  
TPS3899PH44DSE  
TPS3899PH45DSE  
TPS3899PH46DSE  
TPS3899PH47DSE  
TPS3899PH48DSE  
TPS3899PH49DSE  
TPS3899PH50DSE  
TPS3899PH51DSE  
TPS3899PH52DSE  
TPS3899PH53DSE  
TPS3899PH54DSE  
3.40  
3.50  
3.60  
3.70  
3.80  
3.90  
4.00  
4.10  
4.20  
4.30  
4.40  
4.50  
4.60  
4.70  
4.80  
4.90  
5.00  
5.10  
5.20  
5.30  
5.40  
12.2 Receiving Notification of Documentation Updates  
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper  
right corner, click on Alert me to register and receive a weekly digest of any product information that has  
changed. For change details, review the revision history included in any revised document.  
12.3 Support Resources  
TI E2Esupport forums are an engineer's go-to source for fast, verified answers and design help — straight  
from the experts. Search existing answers or ask your own question to get the quick design help you need.  
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do  
not necessarily reflect TI's views; see TI's Terms of Use.  
12.4 Trademarks  
TI E2Eis a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
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12.5 Electrostatic Discharge Caution  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled  
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric changes could cause the device not to meet its published  
specifications.  
12.6 Glossary  
TI Glossary  
This glossary lists and explains terms, acronyms, and definitions.  
13 Mechanical, Packaging, and Orderable Information  
The following pages include mechanical, packaging, and orderable information. This information is the most  
current data available for the designated devices. This data is subject to change without notice and revision of  
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.  
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PACKAGE OPTION ADDENDUM  
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12-Sep-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
PTPS3899DL01DSER  
PREVIEW  
WSON  
DSE  
6
3000  
TBD  
Call TI  
Call TI  
-40 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE AND DISCLAIMER  
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TPS3899DL54DSE

Nano 125 nA IQ, 1% Accurate Voltage Supervisor, Push-Button Monitor with Programmable Sense and Reset Delay

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TPS3899PH01-Q1

TPS3899-Q1 Nano-Power, Precision Voltage Supervisor, Push-Button Monitor with Programmable Sense and Reset Delay

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TI

TPS3899PH01DSE

Nano 125 nA IQ, 1% Accurate Voltage Supervisor, Push-Button Monitor with Programmable Sense and Reset Delay

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