TPS40000DGS [TI]
SWITCHING CONTROLLER, 345kHz SWITCHING FREQ-MAX, PDSO10, MSOP-10;型号: | TPS40000DGS |
厂家: | TEXAS INSTRUMENTS |
描述: | SWITCHING CONTROLLER, 345kHz SWITCHING FREQ-MAX, PDSO10, MSOP-10 开关 光电二极管 |
文件: | 总28页 (文件大小:998K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
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FEATURES
APPLICATIONS
D
D
D
D
D
D
D
D
Operating Input Voltage 2.25 V to 5.5 V
Output Voltage as Low as 0.7 V
1% Internal 0.7 V Reference
D
D
D
D
D
D
Networking Equipment
Telecom Equipment
Base Stations
Servers
Predictive Gate Drivet N-Channel MOSFET
Drivers for Higher Efficiency
DSP Power
Externally Adjustable Soft-Start and
Overcurrent Limit
Power Modules
DESCRIPTION
Source-Only Current or Source/Sink Current
Versions for Starting Into V
Pre-Bias
OUT
The TPS4000x are controllers for low-voltage,
10-Lead MSOP PowerPadt Package for
non-isolated synchronous buck regulators. These
controllers drive an N-channel MOSFET for the
primary buck switch, and an N-channel MOSFET
for the synchronous rectifier switch, thereby
achieving very high-efficiency power conversion. In
addition, the device controls the delays from main
switch off to rectifier turn-on and from rectifier
turn-off to main switch turn-on in such a way as to
minimize diode losses (both conduction and
recovery) in the synchronous rectifier with TI’s
proprietary Predictive Gate Drivet technology. The
reduction in these losses is significant and increases
efficiency. For a given converter power level, smaller
FETs can be used, or heat sinking can be reduced
or even eliminated.
Higher Performance
D
D
D
Thermal Shutdown
Internal Boostrap Diode
Fixed-Frequency, Voltage-Mode Control
− TPS40000/1/4 300-kHz
− TPS40002/3/5 600-kHz
SIMPLIFIED APPLICATION DIAGRAM
V
IN
TPS40000
1
2
3
4
ILIM
BOOT 10
FB
HDRV
9
COMP
SS/SD
V
OUT
SW
VDD
8
7
6
5
GND
LDRV
UDG−01141
PowerPADt and Predictive Gate Drivet are trademarks of Texas Instruments Incorporated.
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Copyright 2005, Texas Instruments Incorporated
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
DESCRIPTION (continued)
The current-limit threshold is adjustable with a single resistor connected to the device. The TPS4000x
controllers implement a closed-loop soft start function. Startup ramp time is set by a single external capacitor
connected to the SS/SD pin. The SS/SD pin is also used for shutdown.
ORDERING INFORMATION
(2)
PACKAGED DEVICES MSOP (DGQ)
APPLICATION
(3)
SOURCE/SINK
SOURCE
ONLY
SOURCE/SINK
T
FREQUENCY
A
(3)
WITH PREBIAS
TPS40001DGQ
TPS40003DGQ
300 kHz
600 kHz
TPS40000DGQ
TPS40002DGQ
TPS40004DGQ
TPS40005DGQ
−40°C to 85°C
(2)
(3)
The DGQ package is available taped and reeled. Add R suffix to device type (e.g.
TPS40000DGQR) to order quantities of 2,500 devices per reel and 80 units per tube.
See Application Information section, p. 8.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS4000x
V + 6.5
SW
UNIT
BOOT
COMP, FB, ILIM, SS/SD
SW
−0.3 to 6
−0.7 to 10.5
−2.5
Input voltage range, V
IN
V
SW (SW transient < 50 ns)
T
VDD
6
Operating junction temperature range, T
−40 to 150
−55 to 150
260
J
Storage temperature, T
stg
°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions”
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(4).(5
DGQ PACKAGE
(TOP VIEW)
)
BOOT
HDRV
SW
ILIM
FB
1
2
3
4
5
10
9
8
7
6
COMP
SS/SD
GND
VDD
LDRV
ACTUAL SIZE
3,05mm x 4,98mm
(4)
(5)
See technical brief SLMA002 for PCB guidelines for PowerPAD packages.
PowerPADt heat slug can be connected to GND (pin 5).
2
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range, T = −40_C to 85_C, V
= 5.0 V, all parameters measured at zero
A
DD
power dissipation (unless otherwise noted)
input supply
PARAMETER
Input voltage range
High-side gate voltage
Shutdown current
Quiescent current
Switching current
Minimum on-voltage
Hysteresis
TEST CONDITIONS
MIN
2.25
TYP
MAX
5.5
UNIT
V
DD
V
V
V
− V
5.5
0.45
2.0
HGATE
BOOT
SW
SS/SD = 0 V,
FB = 0.8 V
Outputs off
0.25
1.4
1.5
I
mA
DD
No load at HDRV/LDRV
4.0
UVLO
1.95
80
2.05
140
2.15
200
V
mV
oscillator
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TPS40000
TPS40001
TPS40004
250
500
300
600
350
700
f
Oscillator frequency
2.25 V ≤ V
DD
≤ 5.00 V
kHz
OSC
TPS40002
TPS40003
TPS40005
V
Ramp voltage
V
PEAK
− V
0.80
0.24
0.93
0.31
1.07
0.41
RAMP
VALLEY
V
Ramp valley voltage
PWM
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TPS40000
TPS40001
TPS40004
87%
83%
94%
93%
97%
(2)
Maximum duty cycle
FB = 0 V,
V
DD
= 3.3 V
TPS40002
TPS40003
TPS40005
97%
0%
Minimum duty cycle
error amplifier
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Line,
Temperature
0.689
0.693
0.700
0.700
30
0.711
0.707
130
V
FB input voltage
V
FB
T
A
= 25°C
FB input bias current
High-level output voltage
Low-level output voltage
Output source current
Output sink current
nA
V
V
FB = 0 V,
I
I
= 0.5 mA
= 0.5 mA
2.0
2.5
0.08
6
OH
OH
V
FB =V
DD
,
0.15
OL
OL
I
I
COMP = 0.7 V,
COMP = 0.7 V,
FB = GND
FB = V
2
3
OH
mA
8
OL
DD
(1)
G
Gain bandwidth
Open loop gain
5
10
MHz
dB
BW
A
OL
55
85
(1)
(2)
Ensured by design. Not production tested.
At V input voltage of 2.25 V, derate the maximum duty cycle by 3%.
DD
3
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range, T = −40_C to 85_C, V
= 5.0 V, all parameters measured at zero
A
DD
power dissipation (unless otherwise noted)
current limit
PARAMETER
TEST CONDITIONS
MIN
11
TYP
15
MAX
19
UNIT
V
V
= 5 V
DD
I
ILIM sink current
µA
SINK
= 2.25 V
9.5
−20
2
13.0
0
16.5
20
DD
(1)
V
V
Offset voltage SW vs ILIM
2.25 V ≤ V
DD
≤ 5.00
mV
V
OS
Input voltage range
VDD
300
ILIM
t
Minimum HDRV pulse time in overcurrent
V
DD
= 3.3 V
200
100
6
ns
ON
SW leading edge blanking pulse in over-
current detection
ns
(1)
Soft-start capacitor cycles as fault timer
t
SS
rectifier zero current comparator
PARAMETER
TEST CONDITIONS
LDRV output OFF
MIN
−15
TYP
MAX
−2
UNIT
Sense voltage to turn off
rectifier
TPS40000
TPS40002
V
SW
−7
75
mV
SW leading edge blanking pulse in zero
current detection
ns
predictive delay
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
mV
ns
V
SWP
Sense threshold to modulate delay time
Maximum delay modulation range time
Predictive counter delay time per bit
Maximum delay modulation range
Predictive counter delay time per bit
−350
75
T
LDRV OFF − to − HDRV ON
LDRV OFF − to − HDRV ON
HDRV OFF − to − LDRV ON
HDRV OFF − to − LDRV ON
50
3.0
40
100
6.2
90
LDHD
4.5
65
ns
T
ns
HDLD
2.4
4.0
5.6
ns
shutdown
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
Shutdown threshold voltage
Outputs OFF
0.09
0.14
0.13
0.17
0.205
0.235
SD
Device active threshold voltage
V
EN
soft start
PARAMETER
Soft-start source current
Soft-start clamp voltage
TEST CONDITIONS
MIN
TYP
MAX
5.4
UNIT
µA
I
Outputs OFF
2.0
1.1
3.7
1.5
SS
V
1.9
V
SS
bootstrap
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
100
70
UNIT
V
V
= 3.3 V
= 5 V
50
35
DD
R
Bootstrap switch resistance
Ω
BOOT
DD
(1) Ensured by design. Not production tested.
(2) At V
DD
input voltage of 2.25 V, derate the maximum duty cycle by 3%.
4
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ꢉ
SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range, T = −40_C to 85_C, V
= 5.0 V, all parameters measured at zero
A
DD
power dissipation (unless otherwise noted)
output driver
PARAMETER
TEST CONDITIONS
= 3.3 V
MIN
TYP
MAX
5.5
UNIT
V
−V
BOOT SW
,
R
R
HDRV pull-up resistance
3
HDHI
I
= −100 mA
SOURCE
V
SINK
− V
= 3.3 V
,
BOOT
SW
HDRV pull-down resistance
1.5
3
HDLO
Ω
I
= 100 mA
= 3.3 V,
R
R
LDRV pull-up resistance
LDRV pull-down resistance
LDRV rise time
V
I
I
= −100 mA
3
1.0
15
10
15
10
5.5
2.0
35
25
35
25
LDHI
LDLO
RISE
FALL
DD
DD
SOURCE
= 100 mA
V
= 3.3 V,
SINK
t
t
LDRV fall time
C
= 1 nF
ns
LOAD
HDRV rise time
HDRV fall time
thermal shutdown
PARAMETER
TEST CONDITIONS
TEST CONDITIONS
MIN
MIN
TYP
MAX
UNIT
(1)
Shutdown temperature
t
165
15
SD
°C
(1)
Hysteresiss
sw node
PARAMETER
Leakage current in shutdown
(1) Ensured by design. Not production tested.
TYP
15
MAX
UNIT
(1)
I
µA
SW
(2) At V
DD
input voltage of 2.25 V, derate the maximum duty cycle by 3%.
5
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
NO.
Provides a bootstrapped supply for the topside MOSFET driver, enabling the gate of the topside
MOSFET to be driven above the input supply rail
BOOT
10
O
COMP
FB
3
2
O
I
Output of the error amplifier
Inverting input of the error amplifier. In normal operation the voltage at this pin is the internal reference level of 700 mV.
Power supply return for the device. The power stage ground return on the board requires a separate path from other
sensitive signal ground returns.
GND
5
9
−
This is the gate drive output for the topside N-channel MOSFET. HDRV is bootstrapped to near 2×V
for good en-
DD
HDRV
O
hancement of the topside MOSFET.
A resistor is connected between this pin and VDD to set up the over current threshold voltage. A 15-µA current sink at
the pin establishes a voltage drop across the external resistor that represents the drain-to-source voltage across the
top side N-channel MOSFET during an over current condition. The ILIM over current comparator is blanked for the
first 100 ns to allow full enhancement of the top
ILIM
1
6
I
MOSFET. Set the ILIM voltage level such that it is within 800 mV of V ; that is, (V
− 0.8) ≤ I
≤ V .
DD
DD
ILIM
DD
LDRV
O
Gate drive output for the low-side synchronous rectifier N-channel MOSFET
Soft-start and overcurrent fault shutdown times are set by charging and discharging a capacitor connected to this pin.
A closed loop soft-start occurs when the internal 3-µA current source charges the external capacitor from 0.17 V to
0.70 V. During the soft-start period, the current sink capability of the TPS40001 and TPS40003 is disabled. When the
SS/SD voltage is less than 0.12 V, the device is shutdown and the HDRV and LDRV are driven low. In normal opera-
tion, the capacitor is charged to 1.5 V. When a fault condition is asserted, the HDRV is driven low, and the LDRV is
driven high. The soft-start capacitor goes through six charge/discharge cycles, restarting the converter on the seventh
cycle.
SS/SD
4
I
Connect to the switched node on the converter. This pin is used for overcurrent sensing in the topside N-channel
MOSFET, zero current sensing in synchronous rectifier N-channel MOSFET, and level sensing for predictive delay
circuit. Overcurrent is determined, when the topside N-channel MOSFET is on, by comparing the voltage on SW with
respect to VDD and the voltage on the ILIM with respect to VDD. Zero current is sensed, when the rectifier N-channel
MOSFET is on, by measuring the voltage on SW with respect to ground. Zero current sensing applies to the
TPS40000/2 devices only.
SW
8
7
O
I
VDD
Power input for the chip, 5.5-V maximum. Decouple close to the pin with a low-ESR capacitor, 1-µF or larger.
6
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
functional block diagram
VDD
VDD
FB
7
2
VDD
THERMAL
SHUTDOWN
LDRV
UVLO
2 V
ERROR AMPLIFIER
PWM COMP
10 BOOT
+
+
HI
0.7 V
REF
UVLO
9
HDRV
PREDICTIVE
GATE
OSC
CLK
PWM
DRIVE
PWM
LOGIC
COMP
SS/SD
3
4
UVLO
(VDD−1.2 V)
SS ACTIVE
FAULT
OC
8
6
1
SW
3 µA
SOFT
START
FAULT
COUNTER
VDD
DISCHARGE
LO
LDRV
ILIM
100 ns DELAY
EN
0.12 V
SHUT DOWN
GND
5
CURRENT
LIMIT COMP
15 µA
LDRV
75 ns
DELAY
EN
RECTIFIER
ZERO−CURRENT
COMPARATOR
UDG−01142
7
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
The TPS4000x series of synchronous buck controller devices is optimized for high-efficiency dc-to-dc
conversion in non-isolated distributed power systems. A typical application circuit is shown in Figure 1.
The TPS40004 and TPS40005 are the controllers of choice for most general purpose synchronous buck
designs. Each operates in two quadrant mode (i.e. source or sink current) full time. This choice provides the
best performance for output voltage load transient response over the widest load current range.
The TPS40001 and TPS40003 add an additional feature: They operate in single quadrant mode (i.e. source
current only) during converter startup, and then when the converter has reached the regulation point, the
controllers change to operate in two quadrant mode. This is useful for applications that have outputs pre-biased
at some voltage before the controller is enabled. When the TPS40001 or TPS40003 is enabled, it does not sink
current during startup and therefore does not pull current from the pre-biased voltage supply.
The TPS40000 and TPS40002 operate in single quadrant mode (source current only) full time, allowing the
paralleling of converters. Single quadrant operation ensures one converter does pull current from a paralleled
converter. A converter using one of these controllers emulates a non-synchronous buck converter at light loads.
When current in the output inductor attempts to reverse, an internal zero-current detection circuit turns OFF the
synchronous rectifier and causes the current flow in the inductor to become discontinuous. At average load
currents greater than the peak amplitude of the inductor ripple current, the converter returns to operation as a
synchronous buck converter to maximize efficiency.
V
DD
3.0 V to 5.5 V
100 µF
10 µF
20 kW
TPS40001
ILIM BOOT
1
2
3
4
5
10
9
Si4836DY
V
1.8 V
OUT
10 A
IHLP5050CE−01
1.0 µH
FB
HDRV
SW
7.68 kΩ
3.6 nF
3.3 Ω
100 nF
COMP
SS/SD
GND
8
243 Ω
15.7 kΩ
470 µF
10 µF
100 pF
7
Si4836DY
VDD
LDRV
3.3 nF
4.7 nF
6
10 kΩ
UDG−02013
Figure 1. Typical Application Circuit
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
error amplifier
The error amplifier has a bandwidth of greater than 5 MHz, with open loop gain of at least 55 dB. The COMP
output voltage is clamped to a level above the oscillator ramp in order to improve large-scale transient response.
oscillator
The oscillator uses an internal resistor and capacitor to set the oscillation frequency. The ramp waveform is a
triangle at the PWM frequency with a peak voltage of 1.25 V, and a valley of 0.25 V. The PWM duty cycle is limited
to a maximum of 95%, allowing the bootstrap capacitor to charge during every cycle.
bootstrap/charge pump
There is an internal switch between VDD and BOOT. This switch charges the external bootstrap capacitor for
the floating supply. If the resistance of this switch is too high for the application, an external schottky diode
between VDD and BOOT can be used. The peak voltage on the bootstrap capacitor is approximately equal to
VDD.
driver
The HDRV and LDRV MOSFET drivers are capable of driving gate-to-source voltages up to 5.5 V. At V , = 5 V
IN
and using appropriate MOSFETs, a 20-A converter can be achieved. The LDRV driver switches between VDD
and ground, while the HDRV driver is referenced to SW and switches between BOOT and SW. The maximum
voltage between BOOT and SW is 5.5 V.
synchronous rectification and predictive delay
In a normal buck converter, when the main switch turns off, current is flowing to the load in the inductor. This
current cannot be stopped immediately without using infinite voltage. For the current path to flow and maintain
voltage levels at a safe level, a rectifier or catch device is used. This device can be either a conventional diode,
or it can be a controlled active device if a control signal is available to drive it. The TPS4000x provides a signal
to drive an N-channel MOSFET as a rectifier. This control signal is carefully coordinated with the drive signal
for the main switch so that there is minimum delay from the time that the rectifier MOSFET turns off and the main
switch turns on, and minimum delay from when the main switch turns off and the rectifier MOSFET turns on.
This scheme, Predictive Gate Drivet delay, uses information from the current switching cycle to adjust the
delays that are to be used in the next cycle. Figure 2 shows the switch-node voltage waveform for a
synchronously rectified buck converter. Illustrated are the relative effects of a fixed-delay drive scheme
(constant, pre-set delays for the turn-off to turn-on intervals), an adaptive delay drive scheme (variable delays
based upon voltages sensed on the current switching cycle) and the predictive delay drive scheme.
Note that the longer the time spent in diode conduction during the rectifier conduction period, the lower the
efficiency. Also, not described in Figure 2 is the fact that the predictive delay circuit can prevent the body diode
from becoming forward biased at all while at the same time avoiding cross conduction or shoot through. This
results in a significant power savings when the main MOSFET turns on, and minimizes reverse recovery loss
in the body diode of the rectifier MOSFET.
9
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
GND
Channel Conduction
Body Diode Conduction
Fixed Delay
Adaptive Delay
Predictive Delay
UDG−01144
Figure 2. Switch Node Waveforms for Synchronous Buck Converter
overcurrent
Overcurrent conditions in the TPS4000x are sensed by detecting the voltage across the main MOSFET while
it is on.
basic description
If the voltage exceeds a pre-set threshold, the current pulse is terminated, and a counter inside the device is
incremented. If this counter fills up, a fault condition is declared and the device disables switching for a period
of time and then attempts to restart the converter with a full soft-start cycle.
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
detailed description
During each switching cycle, a comparator looks at the voltage across the top side MOSFET while it is on. This
comparator is enabled after the SW node reaches a voltage greater than (V −1.2 V) followed by a 100-ns
DD
blanking time. If the voltage across that MOSFET exceeds a programmable threshold voltage, the
current-switching pulse is terminated and a 3-bit counter is incremented by one count. If, during the switching
cycle, the topside MOSFET voltage does not exceed a preset threshold, then this counter is decremented by
one count. (The counter does not wrap around from 7 to 0 or from 0 to 7). If the counter reaches a full count
of 7, the device declares that a fault condition exists at the output of the converter. In this fault state, HDRV is
turned off and LDRV is turned on and the soft-start capacitor is discharged. The counter is decremented by one
by the soft start capacitor (C ) discharge. When the soft-start capacitor is fully discharged, the discharging
SS
circuit is turned off and the capacitor is allowed to charge up at the nominal charging rate. When the soft-start
capacitor reaches about 700 mV, it is discharged again and the overcurrent counter is decremented by one
count. The capacitor is charged and discharged, and the counter decremented until the count reaches zero (a
total of six times). When this happens, the outputs are again enabled as the soft-start capacitor generates a
reference ramp for the converter to follow while attempting to restart.
During this soft-start interval (whether or not the controller is attempting to do a fault recovery or starting for the
first time), pulse-by-pulse current limiting is in effect, but overcurrent pulses are not counted to declare a fault
until the soft-start cycle has been completed. It is possible to have a supply attempt to bring up a short circuit
for the duration of the soft start period plus seven switching cycles. Power stage designs should take this into
account if it makes a difference thermally. Figure 3 shows the details of the overcurrent operation.
(+)
V
TS
(−)
Overcurrent
Threshold
Voltage
Internal PWM
V
TS
0V
External
Main Drive
Normal
Cycle
Overcurrent
Cycle
UDG−01145
Figure 3. Switch Node Waveforms for Synchronous Buck Converter
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
Figure 4 shows the behavior of key signals during initial startup, during a fault and a successfully fault recovery.
At time t0, power is applied to the converter. The voltage on the soft-start capacitor (V ) begins to ramp up
CSS
and acts as the reference until it passes the internal reference voltage at t1. At this point the soft-start period
is over and the converter is regulating its output at the desired voltage level. From t0 to t1, pulse-by-pulse current
limiting is in effect, and from t1 onward, overcurrent pulses are counted for purposes of determining a possible
fault condition. At t2, a heavy overload is applied to the converter. This overload is in excess of the overcurrent
threshold. The converter starts limiting current and the output voltage falls to some level depending on the
overload applied. During the period from t2 to t3, the counter is counting overcurrent pulses, and at time t3
reaches a full count of 7. The soft-start capacitor is then discharged, the counter is decremented, and a fault
condition is declared.
0.7 V
V
CSS
FAULT
I
LOAD
V
OUT
t
t4
t0
t1
t2 t3
t5
t6
t7
t8
t9
t10
0
6
5
4
3
2
1
0
1
2 3 4 5 6 7
UDG−01144
Figure 4. Switch Node Waveforms for Synchronous Buck Converter
When the soft start capacitor is fully discharged, it begins charging again at the same rate that it does on startup,
with a nominal 3-µA current source. As the capacitor voltage reaches full charge, it is discharged again and the
counter is decremented by one count. These transitions occur at t3 through t9. At t9, the counter has been
decremented to 0. The fault logic is then cleared, the outputs are enabled, and the converter attempts to restart
with a full soft-start cycle. The converter comes into regulation at t10.
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
setting the current limit
Connecting a resistor from VDD to ILIM sets the current limit. A 15-µA current sink internal to the device causes
a voltage drop at ILIM that is equal to the overcurrent threshold voltage. Ensure that (V −0.8 V) ≤ V ≤ V
.
DD
DD
ILIM
The tolerance of the current sink is too loose to do an accurate current limit. The main purpose is for hard fault
protection of the power switches. Given the tolerance of the ILIM sink current, and the R range for a
DS(on)
MOSFET, it is generally possible to apply a load that thermally damages the converter. This device is intended
for embedded converters where load characteristics are defined and can be controlled.
soft-start and shutdown
These two functions are common to the SS/SD pin. The voltage at this pin is the controlling voltage of the error
amplifier during startup. This reduces the transient current required to charge the output capacitor at startup,
and allows for a smooth startup with no overshoot of the output voltage if done properly. A shutdown feature
can be implemented as shown in Figure 5.
TPS40000
3 µA
4
SS/SD
C
SS
SHUTDOWN
UDG−01143
Figure 5. Shutdown Implementation
The device shuts down when the voltage at the SS/SD pin falls below 120 mV. Because of this limitation, it is
recommended that a MOSFET be used as the controlling device, as in Figure 5. An open-drain CMOS logic
output would work equally well.
rectifier zero-current
Both the TPS40000 and TPS40002 parts are source-only, thus preventing reverse current in the synchronous
rectifier. Synchronous rectification is terminated by sensing the voltage, SW with respect to ground, across the
low-side MOSFET. When SW node is greater than −7 mV, rectification is terminated and stays off until the next
PWM cycle. In order to filter out undesired noise on the SW node, the zero-current comparator is blanked for
75 ns from the time the rectifier is turned on.
The TPS40001 and TPS40003 parts enable the zero-current comparator, (and therefore prevent reverse
current), while soft-start is active. However, when the output reaches regulation; that is, at the end of the
soft-start time, this comparator is disabled to allow the synchronous rectifier to sink current.
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
The following pages include design ideas for a few applications. For more ideas, detailed design information,
and helpful hints, visit the TPS40000 resources at http://power.ti.com.
V
DD
3.3 V
22 µF
22 µF
TPS40002/3/5
15 kΩ
FDS6894A
1
2
3
4
5
10
9
ILIM
BOOT
HDRV
SW
1.0 µH
FB
V
OUT
1 nF
8.66 kΩ
3.3 Ω
1 µF
1.2 V
5 A
COMP
SS/SD
GND
8
2.2 Ω
.0033 µF
22 µF
22 µF
7
VDD
68 pF
FDS6894A
4.7 nF
6
LDRV
PWP
1 µF
470 pF
12.1 kΩ
1 kΩ
16.9 kΩ
UDG−02081
Figure 6. Small-Form Factor Converter for 3.3 V to 1.2 V at 5 A.
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
Figure 7. High-Current Converter for 3.3 V to 1.2 V at 10 A.
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
22 µF
22 µF
V
DD
2.5 V
BAT54
15 kΩ
TPS40002/3/5
ILIM BOOT
1 µF
FDS6894A
1
2
3
4
5
10
9
1.8 Ω
3.3 Ω
V
1.2 V
5 A
1.0 µH
L1
FB
OUT
HDRV
1500 pF 5.62 kΩ
COMP
8
SW
2.2 Ω
7
SS/SD VDD
100 pF
22 µF
22 µF
4.7 nF
1.8 Ω
1 µF
FDS6894A
6
GND LDRV
PWP
3.3 nF
6.19 kΩ
536 Ω
1000 pF
8.66 kΩ
UDG−02083
Figure 8. Ultra-Low-Input Voltage Converter for 2.5 V to 1.2 V at 5 A
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
APPLICATION INFORMATION
330 µF
330 µF
22 µF
22 µF
22 µF
+
+
VDD
3.3 V
Q1
Si4866DY
TPS40000/1/4
ILIM BOOT
1 µF
11 kΩ
1
2
3
4
5
10
9
1.8 Ω
3.3 Ω
VOUT
2.5 V
10 A
1.0 µH
L2
FB
HDRV
2.2 nF
12.7 kΩ
COMP
8
SW
2.2 Ω
470 pF
+
22 µF
7
SS/SD VDD
Q2
Si4866DY
0.01 µF
470 µF
1.8 Ω
22 µF
4.7 nF
6
GND LDRV
PWP
1 µF
24.9 kΩ
820 pF
1.27 kΩ
9.76 kΩ
UDG−02084
Figure 9. Ultra-High-Efficiency Converter for 3.3 V to 2.5 V at 10 A
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
TYPICAL CHARACTERISTICS
OSCILLATOR FREQUENCY PERCENT CHANGE
OSCILLATOR FREQUENCY PERCENT CHANGE
vs
vs
INPUT VOLTAGE
TEMPERATURE
6
5
4
3
2
1
0
1
0
−1
−2
−3
−4
−5
−6
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
−50
−25
0
25
50
75
100 125
V
IN
− Input Voltage − V
Temperature − °C
Figure 10
Figure 11
FEEDBACK VOLTAGE
vs
FEEDBACK VOLTAGE
vs
INPUT VOLTAGE
TEMPERATURE
0.707
0.705
0.7010
0.7005
0.7000
0.703
0.701
0.699
0.697
0.6995
0.6990
0.695
0.693
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
−50
−25
0
25
50
75
100
125
Temperature − °C
V
IN
− Input Voltage − V
Figure 12
Figure 13
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SLUS507D − JANUARY 2002 − REVISED NOVEMBER 2005
TYPICAL CHARACTERISTICS
CURRENT LIMIT SINK CURRENT
CURRENT LIMIT SINK CURRENT
vs
vs
INPUT VOLTAGE
TEMPERATURE
16.0
15.5
15.5
15.0
14.5
14.0
13.5
13.0
15.0
14.5
14.0
12.5
−50
−25
0
25
50
75
100
125
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
Temperature − °C
V
IN
− Input Voltage − V
Figure 14
Figure 15
TYPICAL PREDICTIVE
DELAY SWITCHING
OVERCURRENT
SS/SD Node
(1 V/div)
LDRV
(2 V/div)
SW Node
(2 V/ div)
SW Node
(2 V/ div)
t − Time − 1 ms/div
t − Time − 400 ns/div
Figure 16
Figure 17
19
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
PACKAGING INFORMATION
Orderable Device
TPS40000DGQ
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
MSOP-
PowerPAD
DGQ
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
40000
40000
40000
40000
40001
40001
40001
40001
40002
40002
40002
40002
40003
40003
40003
40003
40004
TPS40000DGQG4
TPS40000DGQR
TPS40000DGQRG4
TPS40001DGQ
ACTIVE
ACTIVE
ACTIVE
NRND
MSOP-
PowerPAD
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
80
2500
2500
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
TPS40001DGQG4
TPS40001DGQR
TPS40001DGQRG4
TPS40002DGQ
NRND
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
NRND
MSOP-
PowerPAD
2500
2500
80
Green (RoHS
& no Sb/Br)
NRND
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
TPS40002DGQG4
TPS40002DGQR
TPS40002DGQRG4
TPS40003DGQ
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
2500
2500
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
TPS40003DGQG4
TPS40003DGQR
TPS40003DGQRG4
TPS40004DGQ
NRND
MSOP-
PowerPAD
80
Green (RoHS
& no Sb/Br)
NRND
MSOP-
PowerPAD
2500
2500
80
Green (RoHS
& no Sb/Br)
NRND
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
NRND
MSOP-
Green (RoHS
& no Sb/Br)
PowerPAD
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
TPS40004DGQG4
TPS40004DGQR
TPS40004DGQRG4
TPS40005DGQG4
TPS40005DGQR
TPS40005DGQRG4
NRND
MSOP-
PowerPAD
DGQ
10
10
10
10
10
10
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Call TI
40004
40004
40004
40005
40005
40005
NRND
NRND
NRND
NRND
NRND
MSOP-
PowerPAD
DGQ
DGQ
DGQ
DGQ
DGQ
2500
2500
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
TBD
MSOP-
PowerPAD
2500
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
MSOP-
Green (RoHS
& no Sb/Br)
PowerPAD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
2500
2500
2500
2500
2500
2500
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS40000DGQR
TPS40001DGQR
TPS40002DGQR
TPS40003DGQR
TPS40004DGQR
TPS40005DGQR
MSOP-
Power
PAD
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
10
10
10
10
10
10
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
5.3
5.3
5.3
5.3
5.3
5.3
3.3
3.3
3.3
3.3
3.3
3.3
1.3
1.3
1.3
1.3
1.3
1.3
8.0
8.0
8.0
8.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
MSOP-
Power
PAD
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS40000DGQR
TPS40001DGQR
TPS40002DGQR
TPS40003DGQR
TPS40004DGQR
TPS40005DGQR
MSOP-PowerPAD
MSOP-PowerPAD
MSOP-PowerPAD
MSOP-PowerPAD
MSOP-PowerPAD
MSOP-PowerPAD
DGQ
DGQ
DGQ
DGQ
DGQ
DGQ
10
10
10
10
10
10
2500
2500
2500
2500
2500
2500
346.0
370.0
346.0
370.0
346.0
346.0
346.0
355.0
346.0
355.0
346.0
346.0
35.0
55.0
35.0
55.0
35.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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相关型号:
TPS40001DGQR
2.25 to 5.5V input, 300kHz, synchronous buck controller with Predictive Gate Drive™ Technology 10-HVSSOP -40 to 85
TI
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