TPS51397ARJER [TI]
4.5V 至 24V 输入、10A 同步降压稳压器 | RJE | 20 | -40 to 125;型号: | TPS51397ARJER |
厂家: | TEXAS INSTRUMENTS |
描述: | 4.5V 至 24V 输入、10A 同步降压稳压器 | RJE | 20 | -40 to 125 稳压器 |
文件: | 总31页 (文件大小:3524K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS51397A
ZHCSLU8A –SEPTEMBER 2020 –REVISED OCTOBER 2020
ULQ™ 运行的TPS51397A 4.5V 至24V、10A 同步降压转换器
1 特性
3 说明
• 输入电压范围:4.5V 至24V
• 输出电压范围:0.6V 至5.5V
• 支持10A 的连续输出电流
该器件是单片 10A 同步降压转换器, 集成了
MOSFET,简单易用且高效,只需极少的外部组件,
适合空间受限的电源系统。
• D-CAP3™ 架构控制,可实现快速瞬态响应
• 0.6V ± 1% 反馈电压精度(25°C)
• 集成17mΩ和5.9mΩFET
• ULQ™ 运行(110μA),能够在系统待机期间延长电
池寿命
• 可通过MODE 引脚选择Eco-mode™ 和无声™
• 500kHz 和800kHz 可选开关频率
• 可调内部软启动时间,默认为1.2ms
• 大占空比运行
• 集成式电源正常状态指示器
• 内置输出放电功能
• 逐周期过流保护
• 锁存输出OV 和UV 保护
• 非锁存UVLO 和OT 保护
TPS51397A 采用了 D-CAP3™ 控制,此控制方式只需
内部补偿即可实现快速瞬态响应以及出色的线路和负载
调整。ULQ™(超低静态电流)特性则非常有益于在低
功耗运行时延长电池寿命。输入电压较低时,大负荷运
行可显著改善负载瞬态性能。
可使用 MODE 引脚来设置 Eco-mode™ 或无声™
(OOA) 模式,以实现轻负载运行以及 500kHz 或
800kHz 的开关频率。Eco-mode™ 可在轻负载运行期
间维持高效率。OOA 模式可将开关频率保持在可闻频
率以上,同时将对效率的影响降至最低。
此器件同时支持内部和外部软启动选项。它具有1.2ms
的内部固定软启动时间。如果应用需要更长的软启动时
间,可将外部SS 引脚连接至外部电容器。
• -40°C 至125°C 的工作结温范围
• 20 引脚3.0mm × 3.0mm HotRod™ VQFN 封装
• 与12A TPS56C230 引脚对引脚兼容
• 利用TPS51397A 并借助WEBENCH® Power
Designer 创建定制设计方案
TPS51397A 集成了电源正常状态指示器并具备输出放
电功能。它提供包括 OVP、UVP、OCP、OTP 和
UVLO 在内的全面保护。该器件可采用20 引脚3.0mm
× 3.0mm HotRod™ 封装,额定结温范围为 –40°C 至
125°C。
2 应用
器件信息
封装(1)
• 笔记本电脑和台式机
• 超极本、手持平板电脑
• 工业PC、单板计算机
封装尺寸(标称值)
器件型号
TPS51397A
VQFN (20)
3.00mm × 3.00mm
• 非军用无人机
• 分布式电源系统
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附
录。
L
100
95
90
85
80
75
70
65
VIN
VOUT
R1
VIN
EN
SW
CIN
VCC
EN
CBST
COUT
RM_H
BST
FB
TPS51397A
MODE
PGOOD
VCC
PGOOD
RM_L
R2
VCC
SS
60
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
Css
AGND
PGND
55
50
0.01
0.1
1
10
I-Load (A)
Eff5
简化版原理图
效率与输出电流,500kHz,Eco-mode
本文档旨在为方便起见,提供有关TI 产品中文版本的信息,以确认产品的概要。有关适用的官方英文版本的最新信息,请访问
www.ti.com,其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前,请务必参考最新版本的英文版本。
English Data Sheet: SLUSDX7
TPS51397A
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ZHCSLU8A –SEPTEMBER 2020 –REVISED OCTOBER 2020
Table of Contents
7.4 Device Functional Modes..........................................14
8 Application and Implementation..................................16
8.1 Application Information............................................. 16
8.2 Typical Application.................................................... 16
9 Power Supply Recommendations................................22
10 Layout...........................................................................23
10.1 Layout Guidelines................................................... 23
10.2 Layout Example...................................................... 23
11 Device and Documentation Support..........................24
11.1 Receiving Notification of Documentation Updates..24
11.2 支持资源..................................................................24
11.3 Trademarks............................................................. 24
11.4 静电放电警告...........................................................24
11.5 术语表..................................................................... 24
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................7
7 Detailed Description......................................................11
7.1 Overview................................................................... 11
7.2 Functional Block Diagram......................................... 11
7.3 Feature Description...................................................12
Information.................................................................... 25
4 Revision History
注:以前版本的页码可能与当前版本的页码不同
Changes from Revision * (September 2020) to Revision A (September 2020)
Page
• 将器件状态从“预告信息”更改为“量产数据”。.............................................................................................1
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5 Pin Configuration and Functions
SW
SW
PGND VCC
NC
18
17
20
16
19
MODE
FB
1
15
BST
VIN
VIN
VIN
VIN
3
3
14
2
4
3
4
13
PGND
AGND
EN
4
5
12
11
SS
8
6
10
7
9
NC
PGOOD
PGND PGND
SW
图5-1. 20-Pin VQFN RJE Package (Top View)
表5-1. Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
Supply input for the gate drive voltage of the high-side MOSFET. Connect the bootstrap capacitor
between BST and SW. 0.1 μF is recommended.
BST
1
O
P
Input voltage supply pin for the control circuitry. Connect the input decoupling capacitors between VIN
and PGND.
VIN
2,3,4,5
Switching node connection to the inductor and bootstrap capacitor for buck. This pin voltage swings
from a diode voltage below the ground up to input voltage of buck.
SW
6,19,20
7,8,18,
O
G
O
O
PGND
PGOOD
SS
Power GND terminal for the controller circuit and the internal circuitry
Thermal Pad
Open-drain power-good indicator. It is asserted low if output voltage is out of PG threshold, over
voltage, or if the device is under thermal shutdown, EN shutdown, or during soft start.
9
Soft-Start time selection pin. Connecting an external capacitor sets the soft-start time and if no external
capacitor is connected, the soft-start time is about 1.2 ms.
11
NC
10,16
12
Not connect. Can be connected to GND plane for better thermal achieved.
Enable input of buck converter
EN
I
AGND
13
G
Ground of internal analog circuitry. Connect AGND to GND plane with a short trace.
Feedback sensing pin for Buck output voltage. Connect this pin to the resistor divider between output
voltage and AGND.
FB
14
15
17
I
I
Switching frequency and light load operation mode selection pin. Connect this pin to a resistor divider
from VCC and AGND for different MODE options shown in 表7-1.
MODE
VCC
The driver and control circuits are powered from this voltage. Decouple with a minimum 1-μF ceramic
capacitor as close to VCC as possible.
O
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–1
MAX
26
31
6
UNIT
V
VIN
VBST
V
Input voltage
VBST-SW
V
EN, MODE, FB, SS, VCC
PGND, AGND
SW
6
V
0.3
26
29
6
V
V
Output voltage
SW (10-ns transient)
PGOOD
V
–3
V
–0.3
–40
–55
TJ
Operating junction temperature
Storage temperature
150
150
°C
°C
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
6.2 ESD Ratings
VALUE
±2000
±500
UNIT
V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Electrostatic
discharge
V(ESD)
Charged-device model (CDM), per JEDEC specification JESD22- V C101(2)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
4.5
MAX
UNIT
V
VIN
24
29.5
5.5
5.5
0.3
24
VBST
V
–0.3
–0.3
–0.3
–0.3
–1
VBST-SW
V
Input voltage
EN, MODE, FB, SS, VCC
PGND, AGND
SW
V
V
V
Output voltage
PGOOD
5.5
10
V
–0.3
IOUT
TJ
Output current
A
Operating junction temperature
125
°C
–40
6.4 Thermal Information
TPS51397A
THERMAL METRIC(1)
RJE (VQFN)
20 PINS
49.7
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
RθJA_effective
RθJC(top)
RθJB
Junction-to-ambient thermal resistance (4-layer custom board)(2)
39.6
Junction-to-case (top) thermal resistance
26.2
Junction-to-board thermal resistance
14.4
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TPS51397A
THERMAL METRIC(1)
RJE (VQFN)
20 PINS
0.9
UNIT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
°C/W
°C/W
°C/W
ψJT
14.3
ψJB
RθJC(bot)
13.0
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) 70 mm x 70 mm, 4 layers, thickness: 1.5 mm. 2 oz. copper traces located on the top and bottom of the PCB. 4 thermal vias in the
PowerPAD area under the device package.
6.5 Electrical Characteristics
TJ = -40°C to 125°C, VIN = 12 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
TYP
MAX
UNIT
SUPPLY CURRENT
VIN
IVIN
Input voltage range
Non-switching supply current No load, VEN = 5V
4.5
90
1
24
150
4
V
110
2
μA
μA
IVINSDN
Shutdown supply current
No load, VEN = 0V
VCC OUTPUT
VIN > 5.0V
VIN = 4.5V
4.85
20
5
5.15
V
VCC
VCC output voltage
VCC current limit
4.5
ICC
mA
FEEDBACK VOLTAGE
VFB FB voltage
DUTY CYCLE and FREQUENCY CONTROL
TJ = 25°C
594
591
600
600
606
609
mV
mV
TJ = -40°C to 125°C
FSW
Switching frequency
SW minumum on time
SW minimum off time
VOUT = 2.5V
VFB = 0.5V
450
30
500
60
550
100
180
kHz
ns
tON(MIN)
tOFF(MIN)
130
ns
OOA Function
TOOA
Mode Operation Period
22
30
42
us
MOSFET and DRIVERS
RDS(ON)H High side switch resistance
RDS(ON)L Low side switch resistance
OUTPUT DISCHARGE and SOFT START
TJ = 25°C
TJ = 25°C
17
mΩ
mΩ
5.9
RDIS
tSS
Discharge resistance
Soft start time
VEN = 0V
300
0.5
350
1.2
5
400
2.5
Ω
ms
μA
Internal soft-start time, SS pin
floating
ISS
Soft start charge current
POWER GOOD
tPGDLY
PG start-up delay
PG from low to high
VFB falling (fault)
VFB rising (good)
VFB rising (fault)
VFB falling (good)
IOL = 4mA
1
ms
%
85
90
%
VPGTH
PG threshold
115
110
%
%
VPG_L
IPGLK
PG sink current capability
PG leak current
0.4
1
V
VPGOOD = 5.5V
μA
CURRENT LIMIT
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TJ = -40°C to 125°C, VIN = 12 V, unless otherwise noted.
PARAMETER
TEST CONDITION
MIN
11
TYP
12
MAX
13
UNIT
A
TJ = 25°C
Over current threshold
(valley)
IOCL
TJ = -40°C to 125°C
10.5
12
14
A
Negative over current
threshold
INOCL
3.2
A
LOGIC THRESHOLD
VENH
VENL
EN high-level input voltage
1.2
0.9
1.3
1.1
1.4
1.2
V
V
EN low-level input voltage
Enable internal pull down
current
IEN
VEN = 0.8V
2
µA
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION
VOVP
OVP trip threshold
OVP prop deglitch
UVP trip threshold
UVP prop deglitch
125
120
60
%
us
%
tOVPDLY
VUVP
tUVPDLY
UVLO
256
us
Wake up
4.1
3.6
4.2
4.4
3.9
V
VUVLO
VIN UVLO threshold
Shutdown
Hysteresis
3.7
0.5
V
V
OVER TEMPERATURE PROTECTION
TOTP
OTP trip threshold(1)
OTP hysteresis(1)
Shutdown temperature
Hysteresis
150
20
°C
°C
TOTPHSY
(1) Not production tested.
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6.6 Typical Characteristics
TJ = -40°C to 125°C, VIN = 12 V, unless otherwise noted.
130
125
120
115
110
105
100
4
3.5
3
2.5
2
1.5
1
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
IQ
Ishu
图6-2. Shutdown Current vs Junction Temperature
图6-1. Supply Current vs Junction Temperature
615
1.45
610
605
600
595
590
585
1.4
1.35
1.3
1.25
1.2
1.15
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
VFB
ENon
图6-3. Feedback Voltage vs Junction Temperature 图6-4. Enable On Voltage vs Junction Temperature
1.24
32
28
24
20
16
12
8
1.2
1.16
1.12
1.08
1.04
1
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
ENof
Rdsh
图6-5. Enable Off Voltage vs Junction Temperature 图6-6. High-Side RDS(on) vs Junction Temperature
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12
10
8
128
127
126
125
124
123
122
6
4
2
0
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
Rdsl
OVPt
图6-7. Low-Side RDS(on) vs Junction Temperature
图6-8. OVP Threshold vs Junction Temperature
64
380
63
62
61
60
59
58
370
360
350
340
330
320
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
UVPt
Rdis
图6-9. UVP Threshold vs Junction Temperature
图6-10. Discharge Resistor vs Junction
Temperature
15
14
13
12
11
10
9
4.5
4
3.5
3
2.5
2
1.5
-50
-20
10
Junction Temperature (°C)
40
70
100
130
-50
-20
10
Junction Temperature (°C)
40
70
100
130
OCli
NOC
图6-11. Valley Current Limit vs Junction
图6-12. Negative Current Limit vs Junction
Temperature
Temperature
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1.5
45
40
35
30
25
20
15
1.4
1.3
1.2
1.1
1
0.9
-50
-20
10
40
Junction Temperature (°C)
70
100
130
-50
-20
10
40
Junction Temperature (°C)
70
100
130
Tss
TOOA
图6-13. Soft-Start Time vs Junction Temperature
图6-14. OOA Period vs Junction Temperature
100
95
90
85
80
75
70
65
100
95
90
85
80
75
70
65
60
60
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
55
50
55
50
0.01
0.1
1
10
0.01
0.1
1
10
I-Load (A)
I-Load (A)
Eff5
Eff8
图6-15. Efficiency vs Load Current,
图6-16. Efficiency vs Load Current,
FSW = 500 kHz, Eco-mode
FSW = 800 kHz, Eco-mode
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
0.01
0.1
1
10
0.01
0.1
1
10
I-Load (A)
I-Load (A)
Eff5
Eff8
图6-17. Efficiency vs Load Current,
图6-18. Efficiency vs Load Current, FSW = 800 kHz,
FSW = 500 kHz, OOA
OOA
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700
600
500
400
300
200
1000
800
600
400
200
0
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
100
0
0
1
2
3
4
5
I-Load (A)
6
7
8
9
10
0
1
2
3
4
5
I-Load (A)
6
7
8
9
10
Fsw5
Fsw8
图6-19. Switching Frequency vs Load Current,
图6-20. Switching Frequency vs Load Current, FSW
FSW = 500 kHz, Eco-mode
= 800 kHz, Eco-mode
700
600
500
400
300
1000
800
600
400
200
200
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
VIN=12V, VOUT=1.2V
VIN=12V, VOUT=2.5V
VIN=12V, VOUT=5V
100
0
0
0
1
2
3
4
5
I-Load (A)
6
7
8
9
10
0
1
2
3
4
5
I-Load (A)
6
7
8
9
10
Fsw5
Fsw8
图6-21. Switching Frequency vs Load Current, FSW 图6-22. Switching Frequency vs Load Current, FSW
= 500 kHz, OOA
= 800k Hz, OOA
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7 Detailed Description
7.1 Overview
TheTPS51397A is a high density synchronous buck converter that operates from 4.5-V to 24-V input voltage,
and 0.6-V to 5.5-V output voltage range. It has 17-mΩ and 5.9-mΩ integrated MOSFETs that enable high
efficiency up to 10 A. The ULQ™ (Ultra Low Quiescent) feature is extremely beneficial for long battery life in low
power operation. The large duty operation greatly improves the load transient performance when input voltage is
low. The device employs DCAP3™ mode control that enables low external component count, ease of design,
optimization of the power design for cost, size, and efficiency, and provides fast transient response with no
external compensation components and an accurate feedback voltage. The control topology supports seamless
transition between CCM mode at heavy load conditions and DCM operation at light load conditions. Eco-mode™
allows the TPS51397A to maintain high efficiency at light load and OOA mode makes switching frequency above
audible frequency (20 kHz), even there is no loading at output side. The TPS51397A is able to adapt to both low
equivalent series resistance (ESR) output capacitors such as POSCAP or SP-CAP, and ultra-low ESR ceramic
capacitors.
7.2 Functional Block Diagram
PG high
threshold
PGOOD
+
+
UV threshold
+
UV
OV
Delay
PG low
threshold
+
VIN
OV threshold
FB
+
LDO
VCC
0.6 V
VREGOK
4.2 V /
3.7 V
+
+
PWM
+
+
Control Logic
BST
VIN
SS
Ripple injection
SW
ñ
ñ
ñ
ñ
ñ
ñ
ñ
On/Off time
Minimum On/Off
TON Extension
OVP/UVP/TSD
Eco-mode/OOA
Soft-Start
VCC
SW
XCON
Internal SS
PGOOD
SS
PGND
One shot
+
OCL
EN threshold
+
+
+
EN
ZC
NOCL
+
THOK
150°C / 20°C
AGND
Light load operation
/Switching frequency selection
Discharge control
MODE
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7.3 Feature Description
7.3.1 PWM Operation and DCAP3™ Control
The main control loop of the buck is an adaptive on-time pulse width modulation (PWM) controller that supports
a proprietary DCAP3™ mode control. The DCAP3™ mode control combines adaptive on-time control with an
internal compensation circuit for pseudo-fixed frequency and low external component count configuration with
both low-ESR and ceramic output capacitors. It is stable even with virtually no ripple at the output. The
TPS51397A also includes an error amplifier that makes the output voltage high accurate.
At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is turned off after an internal
one-shot timer expires. This one-shot duration is set proportional to the converter input voltage, VIN, and is
inversely proportional to the output voltage, VOUT, to maintain a pseudo-fixed frequency over the input voltage
range, hence it is called adaptive on-time control. The one-shot timer is reset and the high-side MOSFET is
turned on again when the feedback voltage falls below the reference voltage. An internal ripple generation circuit
is added to the reference voltage to emulate the output ripple. This enables the use of very low-ESR output
capacitors such as multi-layered ceramic caps (MLCC). No external current sense network or loop compensation
is required for DCAP3™ control topology.
For any control topology that is compensated internally, there is a range of the output filter it can support. The
output filter used with the TPS51397A is a low-pass L-C circuit. This L-C filter has a double-pole frequency
described in 方程式1.
1
¦
=
P
2´ p´ LOUT ´ COUT
(1)
At low frequencies, the overall loop gain is set by the external output set-point resistor divider network and the
internal gain of the TPS51397A. The low-frequency L-C double pole has a 180 degree lag in-phase. At the
output filter frequency, the gain rolls off at a –40 dB per decade rate and the phase drops rapidly. The internal
ripple generation network introduces a mid-frequency zero that reduces the gain roll off from –40 dB to –20 dB
per decade and increases the phase to 90 degree one decade above the zero frequency. The inductor and
capacitor selected for the output filter must be such that the double pole is placed close enough to the mid-
frequency zero so that the phase boost provided by this mid-frequency zero provides adequate phase margin for
the stability requirement. The crossover frequency of the overall system should usually be targeted to be less
than one-third of the switching frequency (FSW).
7.3.2 Soft Start
The TPS51397A has an internal 1.2-ms soft start. An external SS pin is provided for setting higher soft-start time
if needed. When the EN pin becomes high, the soft-start function begins ramping up the reference voltage to the
PWM comparator.
If the application needs a higher soft-start time, it can be set by connecting a capacitor on SS pin. When the EN
pin becomes high, the soft-start charge current (ISS) begins charging the external capacitor (CSS) connected
between SS and AGND. The devices tracks the lower of the internal soft-start voltage or the external soft-start
voltage as the reference. The equation for the soft-start time (TSS) is shown in 方程式2:
%OO (J() × 84'( (8)
6 (IO) =
OO
:
;
Q#
+
OO
(2)
where
• VREF is 0.6 V and ISS is 5 μA
7.3.3 Large Duty Operation
The TPS51397A can support large duty operation by its internal TON extension function. When VIN/VOUT < 1.6
and the VFB keeps lower than internal VREF, TON is extended to implement the large duty operation which greatly
improves the load transient performance.
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7.3.4 Power Good
The Power Good (PGOOD) pin is an open-drain output. A pullup resistor of 100 kΩ is recommended to pull the
voltage up to VCC. Once VFB is between 90% and 110% of the target output voltage, the PGOOD is pulled high
after a 1-ms de-glitch time. The PGOOD pin is pulled low when:
• FB pin voltage is lower than 85% or greater than 115% of the target output voltage,
• In OVP, UVP, or thermal shutdown event, or
• During the soft-start period.
7.3.5 Overcurrent Protection and Undervoltage Protection
The TPS51397A has overcurrent protection and undervoltage protection. The output overcurrent limit (OCL) is
implemented using a cycle-by-cycle valley detect control circuit. The switch current is monitored during the OFF
state by measuring the low-side FET drain-to-source voltage. This voltage is proportional to the switch current.
To improve accuracy, the voltage sensing is temperature compensated.
During the on-time of the high-side FET switch, the switch current increases at a linear rate determined by Vin,
Vout, the on-time, and the output inductor value. During the on-time of the low-side FET switch, this current
decreases linearly. The average value of the switch current is the load current IOUT. If the monitored current is
above the OCL level, the converter maintains low-side FET on and delays the creation of a new pulse, even the
voltage feedback loop requires one, until the current level becomes OCL level or lower. In subsequent switching
cycles, the on-time is set to a fixed value and the current is monitored in the same manner.
There are some important considerations for this type of overcurrent protection. When the load current is higher
than the overcurrent threshold by one half of the peak-to-peak inductor ripple current, the OCL is triggered and
the output current is being limited, the output voltage tends to drop because the load demand is higher than what
the converter can support. When the output voltage falls below 60% of the target voltage, the UVP comparator
detects it, and the device is shut off after a wait time of 256 μs. This protection is a latched function. The fault
latching can be reset by EN going low or VCC power cycling.
The TPS51397A also implements negative overcurrent protection, which can prevent inductor current runaway
when IC works in OOA mode. When the inductor valley current hits the negative overcurrent threshold (NOCL =
–3.2 A typical), the low-side FET turns off, then high-side FET turns on.
7.3.6 Overvoltage Protection
The TPS51397A has an overvoltage protection feature, which has the same implementation. When the output
voltage becomes higher than 125% of the target voltage, the OVP comparator output goes high, and the output
will be discharged and latched after a wait time of 120 µs. This function is a latching operation, so it needs to
reset by EN going low or VCC power cycling.
7.3.7 UVLO Protection
The VIN undervoltage lockout (UVLO) protection monitors the VCC pin voltage to protect the internal circuitry
from low input voltage. When the VCC voltage is lower than the UVLO threshold voltage, the device shuts off
and outputs are discharged to prevent mis-operation of the device. The converter begins operation again when
the input voltage exceeds the threshold by a hysteresis of 500 mV (typical). This is a non-latch protection.
7.3.8 Output Voltage Discharge
The TPS51397A has a discharge function by using internal MOSFET about 350 Ω, which is connected to the
output terminal SW. The discharge is slow due to the lower current capability of the MOSFET.
7.3.9 Thermal Shutdown
The TPS51397A monitors the internal die temperature. If the temperature exceeds the threshold value (typically
150°C), the device is shut off and the output is discharged. This is a non-latch protection. The device restarts
operation when the temperature goes below the thermal shutdown threshold.
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7.4 Device Functional Modes
7.4.1 Light Load Operation
The TPS51397A has a MODE pin that can control two different states of operation at light load. The light load
operation includes advanced Eco-mode and OOA mode.
7.4.2 Advanced Eco-mode Control
The advanced Eco-mode control schemes to maintain high light load efficiency. As the output current decreases
from heavy load conditions, the inductor current is also reduced and eventually comes to a point where the
rippled valley touches zero level, which is the boundary between continuous conduction and discontinuous
conduction modes. The rectifying MOSFET is turned off when the zero inductor current is detected. As the load
current further decreases, the converter runs into discontinuous conduction mode. The on-time is kept almost
the same as it was in continuous conduction mode so that it takes longer to discharge the output capacitor with
smaller load current to the level of the reference voltage. This makes the switching frequency lower, proportional
to the load current, and keeps the light load efficiency high. The light load current where the transition to Eco-
mode operation happens (IOUT(LL)) can be calculated from 方程式3.
(V -VOUT ) × VOUT
1
IN
IOUT(LL)
=
×
2 × LOUT × FSW
V
IN
(3)
After identifying the application requirements, design the output inductance (LOUT) so that the inductor peak-to-
peak ripple current is approximately between 20% and 40% of IOUT(ma×) (peak current in the application). It is
also important to size the inductor properly so that the valley current does not hit the negative low-side current
limit.
7.4.3 Out-of-Audio
Out-of-Audio (OOA) light-load mode is a unique control feature that keeps the switching frequency above
audible frequency with minimum reduction in efficiency. It prevents audio noise generation from the output
capacitors and inductor. During Out-of-Audio operation, the OOA control circuit monitors the states of both high-
side and low-side MOSFETs and forces them to switch. When both high-side and low-side MOSFETs are off for
more than 30 μs during a light-load condition, the low-side FET will discharge until output voltage drops to
trigger the high-side FET on or inductor current hits negative OC limit.
If the MODE pin is selected to operate in OOA mode, when the device works at light load, the minimum
switching frequency is above 20 kHz which avoids the audible noise in the system. When the device works in
OOA mode, TI recommends setting the peak value of inductor current above –1 A by choosing appropriate
inductor.
7.4.4 Mode Selection
The device detects the voltage on the MODE pin during start-up and latches onto one of the MODE options
listed in 表 7-1. The voltage on the MODE pin is recommended to be set by connecting this pin to the center tap
of a resistor divider connected between VCC and AGND. A guideline for the top resistor (RM_H) and the bottom
resistor (RM_L) as 1% resistors is shown in 表 7-1. It is recommended to choose the resistor to set the voltage at
around the middle value of each range. It is important that the voltage for the MODE pin is derived from the VCC
rail only since internally this voltage is referenced to detect the MODE option, and not to leave the mode pin
floating. The MODE pin setting can be reset only by a VIN power cycling or EN toggle.
表7-1. MODE Pin Resistor Settings
VOLTAGE ON MODE
(0~10%)*VCC
LIGHT LOAD OPERATION
FREQUENCY (kHz)
RM_H(kΩ)
RM_L (kΩ)
330
15
Eco-mode
500
500
800
800
(10%~20%)*VCC
180
160
75
33
51
51
OOA
Eco-mode
OOA
(20%~30%)*VCC
(30%~50%)*VCC
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图 7-1 shows the typical start-up sequence of the device once the enable signal crosses the EN turnon
threshold. After the voltage on VCC crosses the rising UVLO threshold, it takes about 500 μs to finish the
working mode and frequency selection. The output voltage starts ramping after about 0.2*TSS delay time.
EN threshold
1.3V
EN
VCC UVLO
4.2V
VCC
500us
MODE/FSW
Selection
MODE
VOUT
TSS
0.2*TSS
1ms
PGOOD
图7-1. Power-Up Sequence
7.4.5 Standby Operation
The TPS51397A can be placed in standby mode by pulling the EN pin low. The device operates with a shutdown
current of 2 µA when in standby condition. EN pin is pulled low internally. When floating, the part is disabled by
default.
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8 Application and Implementation
Note
以下应用部分的信息不属于TI 组件规范,TI 不担保其准确性和完整性。客户应负责确定 TI 组件是否适
用于其应用。客户应验证并测试其设计,以确保系统功能。
8.1 Application Information
The schematic in 图 8-1 shows a typical application for TPS51397A with 5-V output. This design converts an
input voltage range of 5.5 V to 24 V down to 5 V with a maximum output current of 10 A.
8.2 Typical Application
C1
U1
VCC
C2
0.1uF
R1
0
17
1
VCC
BST
1uF
L1
VIN = 5.5V t 24V
VOUT = 5V/10A
VOUT
GND
SW
2
3
4
5
6
19
20
VIN
VIN
VIN
VIN
SW
SW
SW
VIN
1.8uH
C3
22uF
C4
22uF
C5
0.1uF
R2
51.1
C6
0.1uF
C7
47µF
C8
47µF
C9
47µF
C10
47µF
TP6
14
FB
C11
R3
SS
EN
11
12
15
9
10
16
SS
NC
NC
0
100pF
R4
110k
GND
EN
13
7
8
18
21
GND
AGND
PGND
PGND
PGND
PGND
MODE
MODE
PGOOD
R6
100k
R8
VCC
R5
15.0k
R7
330k
TPS51397A
15k
GND
GND
GND
图8-1. 5-V, 10-A Reference Design
8.2.1 Design Requirements
表8-1 lists the design parameters for this example.
表8-1. Design Parameters
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
VOUT
IOUT
Output voltage
5
10
V
A
Output current
Transient response
Input voltage
±5% x VOUT
12
ΔVOUT
VIN
1-A —9-A load step, 2.5 A/μs
0-A —10-A loading
5.5
24
V
VOUT(ripple)
FSW
Output voltage ripple
Switching frequency
Light load operating mode
Ambient temperature
2% x VOUT
500
kHz
°C
Eco-mode
25
TA
8.2.2 Detailed Design Procedure
8.2.2.1 External Component Selection
8.2.2.1.1 Output Voltage Set Point
To change the output voltage of the application, it is necessary to change the value of the upper feedback
resistor. By changing this resistor, you can change the output voltage above 0.6 V. See 方程式4.
4722'4
4.19'4
8
176
= 0.6 × (1 +
)
(4)
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8.2.2.1.2 MODE Selection
The light load operation mode (Eco-mode or OOA) and switching frequency are set by a voltage divider from
VCC to GND connected to the MODE pin. See 表 7-1 for possible MODE pin configurations. For this design
example, the switching frequency is about 500 KHz, the light load operation mode is Eco-mode, and the output
current is 10 A.
8.2.2.1.3 Inductor Selection
The inductor ripple current is filtered by the output capacitor. A higher inductor ripple current means the output
capacitor should have a ripple current rating higher than the inductor ripple current. See 表8-2 for recommended
inductor values.
The RMS and peak currents through the inductor can be calculated using 方程式 5 and 方程式 6. It is important
that the inductor is rated to handle these currents.
æ
2 ö
÷
÷
÷
ø
æ
ç
ö
÷
VOUT × V
- VOUT
(
× LOUT × FSW
IN(max)
)
1
IN(max)
ç 2
I
IL(rms)=
+
×
OUT
ç
ç
è
÷
ø
12
V
ç
è
(5)
(6)
IOUT(ripple)
I
= IOUT
+
L(peak)
2
Under transient and short-circuit conditions, the inductor current can increase up to the current limit of the
device, so it is safe to choose an inductor with a saturation current higher than the peak current under current
limit condition.
8.2.2.1.4 Output Capacitor Selection
After selecting the inductor, the output capacitor needs to be optimized. In D-CAP3, the regulator reacts within
one cycle to the change in the duty cycle, so good transient performance can be achieved without needing large
amounts of output capacitance. The recommended output capacitance range is given in 表 8-2. Ceramic
capacitors have very low ESR, otherwise the maximum ESR of the capacitor should be less than VOUT(ripple)
/
IOUT(ripple)
.
表8-2. Recommended Component Values
VOUT (V)
Fsw (kHz)
LOUT (µH)
0.33
0.22
0.68
0.47
1.2
COUT(min) (µF)
COUT(max) (µF)
CFF (pF)
RLOWER (kΩ) RUPPER (kΩ)
500
66
66
66
66
66
66
66
66
66
66
330
330
330
330
330
330
330
330
330
330
-
0.6
10
10
15
20
15
0
800
-
500
-
1.2
2.5
3.3
5.0
10
800
-
500
-
47.5
90
800
1.0
-
500
1.5
22-110
22-110
22-110
22-110
800
1.2
500
1.8
110
800
1.5
8.2.2.1.5 Input Capacitor Selection
The TPS51397A requires input decoupling capacitors on power supply input pin VIN, and the bulk capacitors are
needed depending on the application. The minimum input capacitance required is given in 方程式7.
IOUT×VOUT
CIN(min)
=
V
INripple×V ×FSW
IN
(7)
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TI recommends using a high-quality X5R or X7R input decoupling capacitors of nominal 44 µF/35 V on the input
voltage pin VIN. The voltage rating on the input capacitor must be greater than the maximum input voltage. The
capacitor must also have a ripple current rating greater than the maximum input current ripple of the application.
The input ripple current is calculated by 方程式8:
VIN(min)-VOUT
(
)
VOUT
ICIN(rms) = IOUT ×
×
VIN(min)
VIN(min)
(8)
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8.2.3 Application Curves
图8-2 through 图8-17 apply to the circuit of 图8-1. VIN = 12 V, TA = 25°C, unless otherwise specified.
100
90
80
70
60
50
1
0.6
0.2
-0.2
-0.6
-1
VIN=7.4V, VOUT=5V
VIN=12V, VOUT=5V
VIN=18V, VOUT=5V
VIN=24V, VOUT=5V
VIN=7.4V, VOUT=5V
VIN=12V, VOUT=5V
VIN=18V, VOUT=5V
VIN=24V, VOUT=5V
0.01
0.1
1
10
0.001
0.01
0.1
I-Load (A)
1
10
I-Load (A)
EffV
load
图8-2. Efficiency Curve
图8-3. Load Regulation
800
700
600
500
400
300
200
700
600
500
400
300
200
100
0
VIN=7.4V, VOUT=5V
VIN=12V, VOUT=5V
VIN=18V, VOUT=5V
VIN=24V, VOUT=5V
6
8
10
12
14
VIN (V)
16
18
20
22
24
0
1
2
3
4
5
I-Load (A)
6
7
8
9
10
Fswv
Fswl
图8-4. Switching Frequency vs Input Voltage, IOUT
图8-5. Switching Frequency vs Output Load
= 5 A
0.2
0.15
0.1
0.2
0.15
0.1
0.05
0
0.05
0
-0.05
-0.1
-0.15
-0.2
-0.05
-0.1
-0.15
-0.2
6
8
10
12
14
16
18
20
22
24
6
8
10
12
14
16
18
20
22
24
VIN (V)
VIN (V)
line
line
图8-6. Line Regulation, IOUT = 0.1 A
图8-7. Line Regulation, IOUT = 5 A
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EN = 5V/div
EN = 5V/div
Vout = 5V/div
IL = 5A/div
Vout = 5V/div
IL = 5A/div
1ms/div
1ms/div
图8-8. Start-Up Through EN, IOUT = 5 A
图8-9. Shut-down Through EN, IOUT = 5 A
Vin = 10V/div
Vin = 10V/div
Vout = 5V/div
Vout = 5V/div
IL = 5A/div
IL = 5A/div
1ms/div
1ms/div
图8-10. Start-up Relative to VIN Rising,
图8-11. Shut Down Relative to VIN Falling,
IOUT = 5 A
IOUT = 5 A
Vout = 50mV/div (AC coupled)
Vout = 50mV/div (AC coupled)
SW = 10V/div
SW = 10V/div
20us/div
2us/div
图8-12. Output Voltage Ripple, IOUT = 0.1 A
图8-13. Output Voltage Ripple, IOUT = 5 A
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Vout = 200mV/div (AC coupled)
Vout = 50mV/div (AC coupled)
SW = 10V/div
Iout = 10A/div
400us/div
2us/div
图8-15. Transient Response, 1 A to 9 A,
Slew Rate = 2.5 A/μs
图8-14. Output Voltage Ripple, IOUT = 10 A
Vout = 200mV/div (AC coupled)
Vout = 5V/div
SW = 10V/div
Iout = 10A/div
IL = 10A/div
400us/div
80us/div
图8-16. Transient Response, 0 A to 10 A,
Slew Rate = 2.5 A/μs
图8-17. Normal Operation to Output Hard Short
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9 Power Supply Recommendations
The TPS51397A is intended to be powered by a well-regulated DC voltage. The input voltage range is 4.5 V to
24 V. The TPS51397A is a buck converter. The input supply voltage must be greater than the desired output
voltage for proper operation. Input supply current must be appropriate for the desired output current. If the input
voltage supply is located far away from the TPS51397A circuit, some additional input bulk capacitance is
recommended. Typical values are 100 μF to 470 μF.
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10 Layout
10.1 Layout Guidelines
• A four-layer PCB is recommended for good thermal performance and with maximum ground plane. 3-inch ×
2.75-inch, top and bottom layer PCB with 2-oz copper is used as example.
• Place the decoupling capacitors right across VIN and VCC as close as possible.
• Place output inductors and capacitors with IC at the same layer. SW routing should be as short as possible to
minimize EMI, and should be a width plane to carry big current, enough vias should be added to the PGND
connection of output capacitors and also as close to the output pin as possible.
• Place BST resistor and capacitor with IC at the same layer, close to BST and SW plane. >10-mil width trace
is recommended to reduce line parasitic inductance.
• Feedback can be 10 mil and must be routed away from the switching node, BST node, or other high speed
digital signal.
• VIN trace must be wide to reduce the trace impedance and provide enough current capability.
• Place multiple vias under the device near VIN and PGND and near input capacitors to reduce parasitic
inductance and improve thermal performance.
10.2 Layout Example
图 10-1 shows the recommended top-side layout. Component reference designators are the same as the circuit
shown in 图8-1.
Trace on the top layer
C
C
VIN
Trace on the bottom layer
Close to VIN pin
R
C
Vias to GND plane
SW
SW
SW
Trace on the bottom layer
SW
PGND
PGND
PGND
PGND
L
VCC
PGOOD
R
C
Vias to GND plane
PGND
NC
NC
R
R
VOUT
C
Vias to
GND plane
R
R
Vias to GND plane
Vias to GND plane
0Ω
AGND
PGND
图10-1. Top-Side Layout
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TPS51397A
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ZHCSLU8A –SEPTEMBER 2020 –REVISED OCTOBER 2020
11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料,可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范,并且不一定反映 TI 的观点;请参阅
TI 的《使用条款》。
11.3 Trademarks
ULQ™, DCAP3™, D-CAP3™, Eco-mode™, 无声™, HotRod™, TI E2E™ are trademarks of Texas Instruments.
所有商标均为其各自所有者的财产。
11.4 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序,可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级,大至整个器件故障。精密的集成电路可能更容易受到损坏,这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
11.5 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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ZHCSLU8A –SEPTEMBER 2020 –REVISED OCTOBER 2020
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS51397ARJER
ACTIVE
VQFN-HR
RJE
20
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
51397A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
GENERIC PACKAGE VIEW
RJE 20
3 x 3, 0.45 mm pitch
VQFN-HR - 1 mm max height
QUAD FLATPACK- NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224683/A
www.ti.com
PACKAGE OUTLINE
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RJE0020B
3.1
2.9
A
B
(45°X0.08) TYP
(0.25)
DETAIL A
CHAMFERS ARE OPTIONAL
TYPICAL
3.1
2.9
PIN 1 INDEX AREA
0.5
0.3
0.25
0.15
DETAIL B
OPTIONAL PIN 1
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
2X 1.8
PKG
(0.1) TYP
SEE TERMINAL
DETAIL A
10
6
16X 0.45
11
5
(0.007)
PKG
2X
1.8
0.975±0.1
21
0.25
0.15
20X
0.1
C B A
1
15
0.05
C
16
20
(0.123)
PIN 1 ID
DETAIL B
0.5
0.3
20X
0.926±0.1
4224338 / B 10/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RJE0020B
(0.926)
(0.123)
20
16
20X (0.6)
20X (0.2)
1
15
(0.007)
16X (0.45)
21
PKG
(2.8)
(0.975)
11
5
(R0.05) TYP
6
10
PKG
(2.8)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 20X
SOLDER MASK
OPENING
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
EXPOSED METAL
EXPOSED METAL
NON- SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4224338 / B 07/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK- NO LEAD
RJE0020B
(0.926)
(0.123)
20
16
20X (0.6)
20X (0.2)
1
15
(0.007)
(0.975)
16X (0.45)
21
PKG
(2.8)
5
11
(R0.05) TYP
10
6
PKG
(2.8)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE: 20X
4224338 / B 07/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations..
www.ti.com
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Copyright © 2021,德州仪器 (TI) 公司
相关型号:
TPS5140PAGG4
1.5A SWITCHING CONTROLLER, 300kHz SWITCHING FREQ-MAX, PQFP64, GREEN, PLASTIC, TQFP-64
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