TPS53640 [TI]

用于 VR12/VR12.5、具有 PMBus 接口的三相 D-CAP+™ 降压控制器;


型号：	TPS53640
厂家：	TEXAS INSTRUMENTS
描述：	用于 VR12/VR12.5、具有 PMBus 接口的三相 D-CAP+™ 降压控制器控制器
文件：	总14页 (文件大小：674K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ThisꢀdeviceꢀisꢀdesignedꢀspecificallyꢀtoꢀpowerꢀIntelꢀprocessorsꢀunderꢀaꢀstrictꢀdisclosureꢀagreementꢀ

withꢀIntelꢀCorporation.ꢀTheꢀendꢀuserꢀmustꢀhaveꢀaꢀcurrentꢀCNDAꢀinꢀplaceꢀwithꢀIntelꢀCorporationꢀtoꢀ

accessꢀthisꢀinformation.ꢀ

ꢀ

Forꢀaꢀdetailedꢀdatasheetꢀandꢀotherꢀdesignꢀsupportꢀtools,ꢀpleaseꢀcontactꢀꢀVR@list.ti.com.ꢀ

ꢀ

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS53640RSBR

TPS53640RSBT

ACTIVE

WQFN

RSB

3000 RoHS & Green

250 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-10 to 105

TPS

53640

ACTIVE

RSB

NIPDAU

TPS

53640

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

3-Jun-2022

TAPE AND REEL INFORMATION

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS53640RSBR

TPS53640RSBT

WQFN

RSB

3000

250

330.0

180.0

12.4

5.3

1.1

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

3-Jun-2022

TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS53640RSBR

TPS53640RSBT

WQFN

RSB

3000

250

367.0

210.0

367.0

185.0

35.0

Pack Materials-Page 2

PACKAGE OUTLINE

RSB0040E

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

5.1

4.9

PIN 1 INDEX AREA

5.1

4.9

0.8 MAX

SEATING PLANE

0.08 C

0.05

0.00

2X 3.6

(0.2) TYP

EXPOSED

THERMAL PAD

36X 0.4

SYMM

3.6

3.15 0.1

0.25

0.15

40X

PIN 1 ID

(OPTIONAL)

0.1

C A B

SYMM

0.5

0.3

0.05

40X

4219096/A 11/2017

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

RSB0040E

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

3.15)

SYMM

40X (0.6)

40X (0.2)

36X (0.4)

SYMM

(4.8)

(1.325)

(

0.2) TYP

VIA

(R0.05)

TYP

(1.325)

(4.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:15X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

SOLDER MASK

OPENING

METAL

EXPOSED

METAL

EXPOSED

METAL

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4219096/A 11/2017

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

RSB0040E

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(0.785)

4X ( 1.37)

40X (0.6)

40X (0.2)

36X (0.4)

SYMM

(0.785)

(4.8)

(R0.05) TYP

METAL

TYP

SYMM

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

EXPOSED PAD 41

75% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

SCALE:20X

4219096/A 11/2017

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

PACKAGE OUTLINE

RSB0040B

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

5.15

4.85

PIN 1 INDEX AREA

5.15

4.85

0.8

0.7

SEATING PLANE

0.08 C

0.05

0.00

2X 3.6

SYMM

(0.2) TYP

EXPOSED

THERMAL PAD

SYMM

2X 3.6

3.5 0.1

36X 0.4

0.25

40X

0.15

PIN 1 ID

0.1

C A B

0.5

0.3

40X

0.05

4219094/A 11/2018

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

www.ti.com

EXAMPLE BOARD LAYOUT

RSB0040B

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(

3.5)

SYMM

SEE SOLDER MASK

DETAIL

40X (0.6)

40X (0.2)

36X (0.4)

(0.9) TYP

(R0.05) TYP

SYMM

(0.6) TYP

(4.8)

(

0.2) TYP

VIA

(0.6) TYP

(0.9) TYP

(4.8)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE: 20X

0.05 MIN

ALL AROUND

0.05 MAX

ALL AROUND

METAL UNDER

SOLDER MASK

METAL EDGE

EXPOSED METAL

SOLDER MASK

OPENING

EXPOSED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

DEFINED

SOLDER MASK DEFINED

(PREFERRED)

SOLDER MASK DETAILS

4219094/A 11/2018

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown

on this view. It is recommended that vias under paste be filled, plugged or tented.

www.ti.com

EXAMPLE STENCIL DESIGN

RSB0040B

WQFN - 0.8 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

(1.2) TYP

40X (0.6)

40X (0.2)

36X (0.4)

(1.2) TYP

(R0.05) TYP

SYMM

(4.8)

METAL

TYP

SYMM

9X (1)

(4.8)

SOLDER PASTE EXAMPLE

BASED ON 0.125 MM THICK STENCIL

SCALE: 20X

EXPOSED PAD 41

73% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE

4219094/A 11/2018

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

www.ti.com

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

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standards, and any other safety, security, regulatory or other requirements.

These resources are subject to change without notice. TI grants you permission to use these resources only for development of an

application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license

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resources.

TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with

such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for

TI products.

TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS53640 [TI]

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