TPS54201 [TI]
4.5V 至 28V 输入电压、同步降压型 LED 驱动器;
| 型号： | TPS54201 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 4.5V 至 28V 输入电压、同步降压型 LED 驱动器 驱动 驱动器 |
| 文件： | 总41页 (文件大小：2545K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
TPS54200、TPS54201 4.5V 至 28V 输入电压、1.5A 输出电流、
同步降压单色或 IR LED 驱动器
1 特性
3 说明
1
•
宽输入电压范围：4.5V 至 28V
TPS54200 和 TPS54201 器件为 1.5A 同步降压单色
或 IR最大输入电压为 28V 的驱动器。电流模式操作可
提供快速瞬态响应，并且方便实现环路稳定。
•
集成 150mΩ 和 70mΩ MOSFET，持续输出电流为
1.5A
•
•
•
•
关断电流低至 2μA
TPS54200 和 TPS54201 可用于驱动单串或多串、单
色或红外 (IR) LED 阵列，比如在夜视摄像机中。
600kHz 固定频率
具有内部补偿的峰值电流模式
通过集成 MOSFET 并采用 SOT-23 薄型封
装，TPS54200 和 TPS54201 器件实现了高功率密
度，并且仅需在 PCB 上占用较小的空间。
在模拟和 PWM 调光模式下，感应电压分别为
200mV 和 100mV
•
•
•
•
•
•
•
PWM 输入的精确模拟调光 (ADIM)
LED 开路和短路保护
在模拟调光模式下，TPS54200 和 TPS54201 器件通
过改变与 PWM 信号输入占空比成比例的内部基准电
压来实现模拟调光。此外，该器件还支持 PWM 调光
模式。该模式下的内部基准电压将被减半至 100mV，
从而可实现更高效率。
传感电阻器开路和短路保护
关断和锁存模式保护 (TPS54200)
自动重试模式保护 (TPS54201)
热关断
6 引脚 SOT-23 薄型封装
器件信息(1)
2 应用
器件型号
封装
封装尺寸（标称值）
1.6mm x 2.9mm
1.6mm x 2.9mm
SOT-23 薄型 (6)中
将封装说明从
SOT23 更改为 SOT-
23 薄型
•
可调节昼/夜视的 IR LED
TPS54200
–
–
–
–
IP 网络摄像机
模拟安防摄像机
可视门铃
TPS54201
SOT-23 薄型 (6)
(1) 要了解所有可用封装，请见产品说明书末尾的可订购产品附
录。
嵌入式摄像机系统
•
LED 显示和照明
–
–
–
–
冰箱和冷冻柜
电子智能锁
通用 LED 驱动器
建筑照明
ADIM 中的深度调光性能出色
简化电路原理图
LO
6%
5.5%
5%
CBOOT
CO
4.5%
4%
1
2
3
GND BOOT
6
5
4
PWM Input
CF
SW
VIN
PWM
FB
3.5%
Unit 1
RF
Unit 2
Unit 3
3%
VIN
RSENSE
CIN
2.5%
2%
Unit 4
Unit 5
Unit 6
Unit 7
Unit 8
1.5%
1%
Copyright © 2016, Texas Instruments Incorporated
1%
1.5%
2%
2.5%
3%
3.5%
4%
4.5%
5%
PWM duty cycle
D001
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLUSCO8
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
目录
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 17
Application and Implementation ........................ 20
9.1 Application Information............................................ 20
9.2 Typical Application ................................................. 20
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
说明 （续）.............................................................. 4
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Timing Requirements................................................ 7
7.7 Switching Characteristics.......................................... 7
7.8 Typical Characteristics.............................................. 8
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 12
9
10 Power Supply Recommendations ..................... 30
11 Layout................................................................... 30
11.1 Layout Guidelines ................................................. 30
11.2 Layout Example .................................................... 31
12 器件和文档支持 ..................................................... 32
12.1 器件支持................................................................ 32
12.2 文档支持 ............................................................... 32
12.3 接收文档更新通知 ................................................. 32
12.4 社区资源................................................................ 32
12.5 商标....................................................................... 32
12.6 静电放电警告......................................................... 32
12.7 术语表 ................................................................... 32
13 机械、封装和可订购信息....................................... 33
8
4 修订历史记录
Changes from Revision A (March 2017) to Revision B
Page
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已在“特性”部分和整个产品说明书内将“断续模式”更改为“自动重试模式” ................................................................................ 1
已更改封装 说明...................................................................................................................................................................... 1
已更改 “应用”部分 ................................................................................................................................................................... 1
已在“说明”部分的第一句中将“WLED”更改为“单色或 IR LED”................................................................................................. 1
已在器件信息表....................................................................................................................................................................... 1
Changed pinout diagram and associated text........................................................................................................................ 4
Changed "PWM duty input" to "PWM input duty cycle" in the Pin Functions table................................................................ 4
Changed "free-air" to "ambient" in the Absolute Maximum Ratings condition statement ...................................................... 5
Changed "free-air" to "ambient" in the Recommended Operating Conditions condition statement....................................... 5
Changed the package description in the Thermal Information table header.......................................................................... 5
Changed "Rising" and "Falling" to "Rising VPWM" and "Falling VPWM" for the VADIM, VPDIM, and VPWM Electrical
Characteristics table entries ................................................................................................................................................... 6
•
•
Changed "SW" to "VSW" in the Test Conditions column for the RHSD entry in the Electrical Characteristics table................. 6
Changed "dim mode" to "dimming mode" in the Test Conditions column for the ILIM_HS1 entry in the Electrical
Characteristics table ............................................................................................................................................................... 6
•
•
•
•
•
•
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Changed the symbol for switching frequency from FSW to fSW .............................................................................................. 7
Changed VIN to VVIN in the Typical Characteristics condition statement ................................................................................ 8
Changed "hiccup up mode" to "auto-retry mode" ................................................................................................................ 11
Changed "duty" to "duty cycle" in multiple locations throughout the data sheet .................................................................. 13
Changed "PWM duty" to "PWM duty cycle" in the 图 16 image........................................................................................... 13
Changed "floating driver" to "boot regulator" in the Bootstrap Voltage (BOOT) section ..................................................... 14
Changed VIN to VVIN in multiple locations throughout the data sheet................................................................................... 14
Changed various wording in the
已添加器件支持和文档支持 部分 section for clarity, and changed "512 switching cycles " to "tSHUTDOWN_DELAY" ....... 14
•
•
Changed "hiccup up" to "auto-retry mode" in the Fault Protection section .......................................................................... 15
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 15
2
版权 © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
修订历史记录 (接下页)
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•
•
•
•
•
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•
•
•
•
•
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•
•
•
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•
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Changed "will be clamped by low" to "is clamped at the low-"............................................................................................. 15
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 15
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 15
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 15
Changed "Recycle VIN can reset" to "Cycling VIN resets".................................................................................................... 16
Changed "once the device shuts down, it starts" to "a device shutdown starts".................................................................. 16
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 16
Changed "hiccup" to "auto-retry" or "shuddown -and-restart," and deleted "programmed for XXX switching cycles" text.. 16
Changed "Vin at" to "VVIN" .................................................................................................................................................... 17
Changed "VADIM" to "VADIM" and "VPDIM" to "VPDIM".......................................................................................................... 17
Changed "it's" to "the output is"............................................................................................................................................ 17
Changed "VIN" to "VIN" and "recycled" to "cycled" at the end of the Mode Detection ......................................................... 17
Changed "a little big" to "excessive" in the Analog Dimming Mode Operation section........................................................ 18
Changed "PWM duty cycle" to "PWM state" ........................................................................................................................ 19
Changed "12-VIN" to "12-V VVIN"........................................................................................................................................... 20
Changed "FSW" to "fSW" and "VIN(max)" to "VVIN(max)" in 公式 3 from F to f .............................................................................. 21
Changed "FSW" to "fSW" and "VIN(ripple)" to "VVIN(ripple)" in 公式 8 from F to f ........................................................................... 21
Changed the symbol for frequency in 公式 11 from F to f.................................................................................................... 22
Changed "RF" to "RF" and "CF" to "CF"................................................................................................................................ 22
Changed "VOUT" to "VOUT" in the conditions of multiple application curves........................................................................ 24
Changed the wording of the second and third paragraphs of the Inductor Selection section for clarity.............................. 27
Changed the symbol for frequency in 公式 14 from F to f.................................................................................................... 27
Changed "wide areas advantages" to "added width also".................................................................................................... 30
Changed "reduce the possibility" to "minimize".................................................................................................................... 30
已添加器件支持和文档支持 部分 .......................................................................................................................................... 32
Changes from Original (November 2016) to Revision A
Page
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•
•
•
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•
已添加 TPS54201 器件的初始发行版。.................................................................................................................................. 1
已将 说明 更改为包含保护模式。 ........................................................................................................................................... 4
Changed ILIM_HS1 and ILIM_HS2 CURRENT LIMIT. .................................................................................................................... 6
Changed the low-side source-current limit from (2.4/3.4/4.4) to (2.3/3.3/4.4), ...................................................................... 6
Added TPS54201 tHIC_THERMAL, tHIC_OV and tHIC_WAIT Timing Requirements. ........................................................................... 7
已添加 TPS54201 LED Short Protection image................................................................................................................... 25
已添加 TPS54201 LED Open Protection image. ................................................................................................................. 25
已添加 TPS54201 Sense Resistor Short Protection image. ................................................................................................ 25
版权 © 2016–2018, Texas Instruments Incorporated
3
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
5 说明 （续）
高侧 MOSFET 内的逐周期电流限制可在过载情况下保护转换器，并通过低侧 MOSFET 续流电流限制防止电流
失控，增强限制效果。提供低侧 MOSFET 灌电流限制，可防止反向电流过大。在安全和保护方面，TPS54200
和 TPS54201 器件具备 LED 开路和短路保护、感应电阻器开路和短路保护以及器件热保护功能。TPS54200
器件使用关断和锁存模式保护，而 TPS54201 器件则采用自动重试模式保护。
6 Pin Configuration and Functions
DDC Package
6-Pin SOT-23-THIN
Top View
GND
SW
1
2
3
6
5
4
BOOT
PWM
FB
VIN
Not to scale
Pin Functions
PIN
TYPE(1)
DESCRIPTION
NAME
BOOT
FB
NO.
6
O
I
A bootstrap capacitor is required between BOOT and SW.
LED current-detection feedback
Power ground
4
GND
1
G
Dimming input. Default low (internally pulled low). In analog dimming mode, the internal reference is
proportional to the PWM input duty cycle. In PWM dimming mode, LED current is ON during the PWM
high period in each PWM cycle.
PWM
5
I
SW
VIN
2
3
O
P
Switching node to the external inductor
Input supply voltage
(1) I = Input, O = Output, P = Supply, G = Ground
4
Copyright © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
7 Specifications
7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted)(1)
MIN
–0.3
–0.3
–0.3
–0.3
–0.3
–5
MAX UNIT
VIN
30
Input voltage range, VI
PWM
7
7
V
V
FB
BOOT–SW
SW
7
Output voltage range, VO
30
30
150
150
SW (20 ns transient)
Operating junction temperature, TJ
Storage temperature range, Tstg
–40
–65
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
±4000
±1500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN
4.5
MAX
UNIT
VIN
28
6
VI
Input voltage range
Output voltage range
PWM
FB
–0.1
–0.1
–0.1
–0.1
–40
V
6
BOOT-SW
SW
6.5
28
125
VO
TJ
V
Operating junction temperature
°C
7.4 Thermal Information
TPS5420x
THERMAL METRIC(1)
DDC (SOT-23-THIN)
UNIT
6 PINS
89.2
39.5
14.7
1.2
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-top characterization parameter
Junction-to-board characterization parameter
ψJB
14.7
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
Copyright © 2016–2018, Texas Instruments Incorporated
5
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
7.5 Electrical Characteristics
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. These
specifications are interpreted as conditions that do not degrade the device parametric or functional specifications for the life of
the product containing it. TJ = –40°C to 125°C, VVIN = 4.5 V to 28 V, (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
INPUT SUPPLY
VVIN
IOFF
Input voltage range
Shutdown current
4.5
28
8.6
V
PWM = GND
2
4.2
µA
Rising VVIN
Falling VVIN
3.83
3.4
4.47
3.95
VIN undervoltage lockout
Hysteresis
V
VVIN_UVLO
3.7
470
mV
DIMMING (PWM PIN)
Rising VPWM
Falling VPWM
Rising VPWM
Falling VPWM
Rising VPWM
Falling VPWM
1.97
0.9
2.07
1.8
1
2.17
1.1
VADIM
VPDIM
VPWM
Analog dimming-mode threshold
V
V
PWM dimming-mode threshold
0.8
1
0.91
0.5
1.12
0.72
Threshold to identify PWM duty cycle
V
V
0.63
0.55
VPWM_SHUTDOWN Shutdown threshold
0.35
FEEDBACK AND ERROR AMPLIFIER
Feedback voltage in analog dimming
mode
VFB1
PWM = 3.3 V, SW duty cycle > 90%
201
96
205
100
210
104
mV
mV
VFB2
Feedback voltage in PWM dimming mode PWM = 1.5 V, SW duty cycle > 90%
BOOT PIN
Rising
BOOT-SW UVLO threshold
Falling
2.1
2
2.33
2.2
VBOOT_UVLO
V
POWER STAGE
RHSD
High-side FET on-resistance
Low-side FET on-resistance
VBOOT – VSW= 6 V
VVIN > 6 V
150
70
259 mΩ
120 mΩ
RLSD
CURRENT LIMIT
Either one of the following conditions:
1. PWM dimming mode
2. Analog dimming mode and PWM duty
cycle >25%
ILIM_HS1
High-side current limit 1
High-side current limit 2
2.4
1
3
3.6
1.8
A
A
Analog dimming mode and PWM duty
cycle <25%
ILIM_HS2
1.4
ILIM_LS_SOURCE
ILIM_LS_SINK
FAULT PROTECTION
Low-side source current limit
VVIN > 6 V
VVIN > 6 V
2.3
3.3
1.7
4.4
2.2
A
A
Low-side sink current limit
1.25
Rising temperature
150
160
10
170
°C
°C
V
Thermal
shutdown(1)
Hysteresis
VOVP
VOCP
Overvoltage protection
Overcurrent protection
1
120%
(1) Not production tested
6
Copyright © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
7.6 Timing Requirements
MIN
TYP
32 768
32 768
MAX
UNIT
Cycles
Cycles
THERMAL SHUTDOWN
tHIC_THERMAL
TPS54200 and TPS54201 thermal shutdown auto-retry time
OVERVOLTAGE PROTECTION
tHIC_OV
TPS54201 auto-retry time for overvoltage protection
OVERCURRENT AND OPEN-LOOP PROTECTION
TPS54200 shutdown delay time for open-loop and overcurrent
protection
tSHUTDOWN_DELAY
tHIC_WAIT
512
Cycles
TPS54201 auto-retry wait time for open-loop and overcurrent
protection
512
Cycles
Cycles
tHIC_OC
TPS54201 auto-retry time for open-loop and overcurrent protection
16 384
SOFT START
tSS
Internal soft-start time
0.6
ms
7.7 Switching Characteristics
TJ = –40°C to 125°C, VVIN = 4.5 V to 28 V, (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
OSCILLATOR
fsw
Switching frequency
480
600
700
kHz
ON-TIME CONTROL
Measured at 90% to 90% and 1-A
loading
tMIN_ON
Minimum on-time
90
105
ns
版权 © 2016–2018, Texas Instruments Incorporated
7
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
7.8 Typical Characteristics
VVIN = 12 V, unless otherwise specified
240
220
200
180
160
140
120
100
3
2.5
2
1.5
1
0.5
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D001
D002
图 1. Shutdown Quiescent Current vs Junction Temperature
图 2. High-Side FET On-Resistance vs Junction Temperature
110
207
206.5
206
100
90
80
70
60
50
205.5
205
204.5
204
203.5
203
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D003
D004
图 3. Low-Side FET On-Resistance vs Junction Temperature
图 4. FB Voltage in ADIM vs Junction Temperature
610
605
600
595
590
585
580
101
100.5
100
99.5
99
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D005
D006
图 5. FB Voltage in PDIM vs Junction Temperature
图 6. Switching Frequency vs Junction Temperature
8
版权 © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
Typical Characteristics (接下页)
VVIN = 12 V, unless otherwise specified
3.3
1.65
1.6
3.25
3.2
3.15
3.1
1.55
1.5
3.05
3
1.45
2.95
2.9
1.4
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D007
D008
图 7. High-Side Source Current Limit 1 Threshold vs
图 8. High-Side Source Current Limit 2 Threshold vs
Junction Temperature
Junction Temperature
1.85
3.6
3.5
3.4
3.3
3.2
3.1
3
1.8
1.75
1.7
1.65
1.6
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D009
D010
图 9. Low-Side Source Current Limit Threshold vs Junction
图 10. Low-Side Sink Current Limit Threshold vs Junction
Temperature
Temperature
2.2
4.2
4.1
Rising
Falling
2.15
2.1
2.05
2
4
Rising
Falling
3.9
3.8
3.7
3.6
1.95
1.9
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D011
D012
图 11. BOOT-SW UVLO Threshold vs Junction Temperature
图 12. VIN UVLO Threshold vs Junction Temperature
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Typical Characteristics (接下页)
VVIN = 12 V, unless otherwise specified
2.1
1.1
1.05
1
2.05
2
0.95
0.9
Rising
Falling
Rising
Falling
1.95
1.9
0.85
0.8
1.85
1.8
0.75
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
Junction Temperature (°C)
D013
D014
图 13. Analog Dimming Mode Threshold vs Junction
图 14. PWM Dimming Mode Threshold vs Junction
Temperature
Temperature
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
-50
-25
0
25
50
75
100
125
Junction Temperature (°C)
D015
图 15. PWM Shutdown Threshold vs Junction Temperature
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8 Detailed Description
8.1 Overview
The TPS5420x device is a 1.5-A synchronous buck LED driver up to 28-V input. Current-mode operation
provides fast transient response. The optimized internal compensation network minimizes the external
component count and simplifies the control loop design.
The TPS5420x device has a fixed 600-kHz switching frequency for a good tradeoff between efficiency and size.
The integrated 150-mΩ high-side MOSFET and 70-mΩ low-side MOSFET allow for a high-efficiency LED driver
with continuous output current up to 1.5 A.
The TPS5420x device supports deep dimming in both analog and PWM dimming modes. In analog dimming
mode, the internal reference voltage is changed in proportion to the duty cycle of the PWM signal in the 1% to
100% range. In the PWM dimming mode, the LED turns on and off periodically according to the PWM duty cycle.
For higher efficiency, the internal reference is halved to 100 mV.
Cycle-by-cycle current limit in the high-side MOSFET protects the converter in overload conditions and is
enhanced by a low-side MOSFET freewheeling current limit which prevents current runaway. There is a low-side
MOSFET sinking-current limit to prevent excessive reverse current.
For safety and protection, the TPS5420x includes LED-open and -short protection, sense-resistor-open and -
short protection, and device thermal protection. The TPS54200 device implements shutdown-and-latch mode
protection, whereas the TPS54201 device implements auto-retry mode protection.
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8.2 Functional Block Diagram
PWM
VIN
5
3
Enable
Peak
Detector
Thermal
Shutdown
UVLO
Delay
+
VTH
PWM
Enable
DIM Mode
Selection
Timer
and Logic
Shutdown
Logic
Boot
Charge
OVP Shutdown
OCP Shutdown
Open Loop Shutdown
Mode
Maximum
Clamp
6
BOOT
VIN
VBGP
Boot
Bandgap
PWM
UVLO
HS MOSFET
Current
Comparator
Mode
Comp
Power Stage
and Deadtime
Control Logic
Dimming
Control and
Error Amp
SS
Slope
2
SW
Compensation
Mode
PWM
Oscillator
FB
4
OVP
Shutdown
+
VIN
Regulator
1 V
OCP
Shutdown
Current
Sense
LS MOSFET
Current Limit
+
VOCP
1
GND
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8.3 Feature Description
8.3.1 Fixed-Frequency PWM Control
The device uses a fixed-frequency and peak-current-mode control. The LED current is sensed by a resistor in
series with the LED string. The sensed voltage is fed to the FB pin through an RC filter, and then compared to an
internal voltage reference by an error amplifier. An internal oscillator initiates the turnon of the high-side power
switch. The error amplifier output is compared to the current of the high-side power switch. When the power-
switch current reaches the error-amplifier output-voltage level, the high-side power switch is turned off and the
low-side power switch is turned on. Thus, the error amplifier output voltage regulates inductor peak current, and
in turn the LED current, to a target value. The device implements a current limit by clamping the error amplifier
voltage to a maximum level and also implements a minimum clamp for improved transient-response
performance.
8.3.2 Error Amplifier
The device has a transconductance amplifier as the error amplifier. The error amplifier compares the FB voltage
to the lower of the internal soft-start voltage or the internal voltage reference. The transconductance of the error
amplifier is 240 μA/V typically. The frequency compensation components are placed internally between the
output of the error amplifier and ground.
8.3.3 Slope Compensation and Output Current
The device adds a compensating ramp to the signal of the switch current. This slope compensation prevents
subharmonic oscillations as the duty cycle increases. The available peak inductor current remains constant over
the full duty-cycle range.
8.3.4 Input Undervoltage Lockout
The device implements internal undervoltage-lockout (UVLO) circuitry on the VIN pin. The device is disabled
when the VIN pin voltage falls below the internal VIN UVLO threshold, which is 3.7 V typical. The internal VIN
UVLO threshold has a hysteresis of 470 mV.
8.3.5 Voltage Reference
The voltage reference system produces a precise ±2.5% voltage reference over temperature by scaling the
output of a temperature-stable band-gap circuit when the PWM duty cycle is 100%. In PWM dimming mode, the
voltage reference, VREF, is fixed at 100 mV. In analog dimming mode, VREF, is proportional to the duty cycle of
PWM as shown in 图 16.
VREF (mV)
200
PWM duty cycle (%)
100
图 16. VREF vs PWM Duty Cycle in Analog Dimming Mode
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Feature Description (接下页)
8.3.6 Setting LED Current
Once the voltage reference, VREF, is chosen, one can set the LED current by choosing the proper sensing
resistor according to 公式 1:
VREF
RSENSE
=
ILED
(1)
8.3.7 Internal Soft Start
The TPS5420x device uses an internal soft-start function. The internal soft-start time is set to 0.6 ms typically.
8.3.8 Bootstrap Voltage (BOOT)
The TPS5420x has an integrated boot regulator and requires a 0.1-μF ceramic capacitor between the BOOT and
SW pins to provide the gate drive voltage for the high-side MOSFET. A ceramic capacitor with an X7R or X5R
grade dielectric is recommended because of the stable characteristics over temperature and voltage. This boot
regulator has its own UVLO protection. This UVLO rising threshold is 2.1 V with a hysteresis of 100 mV. A 6-V
bootstrap voltage is maintained between BOOT and SW when VVIN > 6 V.
8.3.9 Overcurrent Protection
The device is protected from overcurrent conditions by cycle-by-cycle current limiting on both the high-side
MOSFET and the low-side MOSFET.
8.3.9.1 High-Side MOSFET Overcurrent Protection
The device implements current-mode control, which uses the internal COMP voltage to control the turnoff of the
high-side MOSFET and the turnon of the low-side MOSFET on a cycle-by-cycle basis. During each cycle, the
switch current and the current reference generated by the internal COMP voltage are compared. When the peak
switch current intersects the current reference, the high-side switch turns off. During overcurrent conditions, such
as when the sensing resistor is shorted, or an open circuit occurs in the feedback-filter RC network that drives FB
low, the error amplifier responds by driving the COMP pin high, increasing the switch current. The error amplifier
output is clamped internally. This clamp functions as a switch-current limit. This current limit is fixed at 3.1 A
typical in PWM dimming mode. In analog dimming mode with the PWM duty cycle >25%, this limit is also 3.1 A.
If the PWM duty cycle is below 25%, this limit is halved to 1.5 A typical. Furthermore, if an output overcurrent
condition occurs for more than the shutdown delay time, tSHUTDOWN_DELAY, the device shuts down and latches off
to protect the LED from overcurrent damage.
8.3.9.2 Low-Side MOSFET Overcurrent Protection
While the low-side MOSFET is turned on, the conduction current is monitored by the internal circuitry. During
normal operation, the low-side MOSFET sources current to the load. At the end of every clock cycle, the low-side
MOSFET sourcing current is compared to the internally set low-side sourcing current-limit. If the low-side
sourcing-current limit is exceeded, the high-side MOSFET does not turn on and the low-side MOSFET stays on
for the next cycle. The high-side MOSFET turns on again when the low-side current is below the low-side
sourcing current-limit at the start of a cycle.
8.3.9.3 Low-Side MOSFET Reverse Overcurrent Protection
The TPS5420x device implements low-side reverse-current protection by detecting the voltage across the low-
side MOSFET. When the converter sinks current through its low-side FET, the control circuit turns off the low-
side MOSFET if the reverse current is more than 1.7 A typical. By implementing this additional protection
scheme, the converter is able to protect itself from excessive sink current during fault conditions.
14
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Feature Description (接下页)
8.3.10 Fault Protection
The device is protected from several kinds of fault conditions, such as LED open and short, sense-resistor open
and short, and thermal shutdown. The only difference between the TPS54200 and TPS54201 devices is the
different protection mode used. The TPS54200 device implements shutdown-and-latch mode protection, whereas
the TPS54201 device implements auto-retry mode protection.
8.3.10.1 LED-Open Protection
When the LED load is open, the FB voltage is low, and the internal COMP voltage is driven high and clamped.
This action triggers a shutdown delay counter (TPS54200) or auto-retry wait counter (TPS54201). For the
TPS54200 device, once the shutdown delay time tSHUTDOWN_DELAY expires, the device shuts down and latches off.
Both FETs are kept off. This is a latched shutdown. The device can be reset by recycling VIN. For TPS54201,
once the auto-retry wait time tHIC_WAIT expires, the device shuts down and starts auto-retry timer tHIC_OC. During
the shutdown period, both FETs are kept off. Once the auto-retry timer expires, the TPS54201 device restarts
again. If the failure still exists, the TPS54201 device repeats the foregoing shutdown-and-restart process.
8.3.10.2 LED Short Protection
When the LED load is shorted, the FB voltage is higher than VREF, and the internal COMP voltage is driven low
and clamped, and the high-side MOSFET is commanded on for a minimum on-time each cycle. In this condition,
if the output voltage is too low, the inductor current may not be able to balance in a cycle, causing current
runaway. Finally, the inductor current is clamped at the low-side MOSFET sourcing-current limit, which is much
higher than target LED current. If the FB voltage is higher than the OCP threshold, which is 250 mV typical in
analog dimming mode, or 120 mV typical in PWM dimming mode, the shutdown delay counter (TPS54200) or
auto-retry wait counter (TPS54201) is triggered. For the TPS54200 device, once the shutdown delay time
tSHUTDOWN_DELAY expires, the device shuts down and latches off. Both FETs are kept off. This is a latched
shutdown. The device can be reset by recycling VIN. For the TPS54201 device, once the auto-retry wait time
tHIC_WAIT expires, the device shuts down and starts auto-retry timer tHIC_OC. During the shutdown period, both
FETs are kept off. Once the auto-retry timer expires, the TPS54201 device restarts again. If the failure still exists,
the TPS54201 device repeats the foregoing shutdown-and-restart process.
8.3.10.3 Sense-Resistor Short Protection
When the sense resistor is shorted, the FB voltage is low, and the internal COMP voltage is driven high and
clamped. This action triggers the shutdown delay counter (TPS54200) or auto-retry wait counter (TPS54201). For
the TPS54200 device, once the shutdown delay time tSHUTDOWN_DELAY expires, the device shuts down and latches
off. Both FETs are kept off. This is a latched shut-down. The device can be reset by recycling VIN. For the
TPS54201 device, once the auto-retry wait time tHIC_WAIT expires, the device shuts down and starts auto-retry
timer tHIC_OC. During the shutdown period, both FETs are kept off. Once the auto-retry timer expires, the
TPS54201 device restarts again. If the failure still exists, the TPS54201 device repeats the foregoing shutdown-
and-restart process.
8.3.10.4 Sense-Resistor Open Protection
When the sense resistor is open before the device powers on, the device charges the BOOT capacitor at the
power-on moment. The charging current flows through the inductor, the output capacitor, and the RC filter at the
FB pin to charge up the FB pin voltage. Once the device detects an FB voltage higher than the 1-V OVP
threshold, the device shuts down immediately. For the TPS54200 device, this is a latched shutdown, and the
device can be reset by cycling VIN. For the TPS54201 device, once the device shuts down, it starts the
overvoltage auto-retry timer tHIC_OV. During the shutdown period, both FETs are kept off. Once the overvoltage
auto-retry timer expires, the TPS54201 device restarts again. If the failure still exists, the TPS54201 device
repeats the foregoing auto-retry shutdown-and-restart process.
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Feature Description (接下页)
8.3.10.5 Overvoltage Protection
When the FB pin, for some reason, has a voltage higher than 1 V applied, the device shuts down immediately.
Both FETs are kept off. This is called overvoltage protection. For the TPS54200 device, this is a latched
shutdown. Cycling VIN resets the device. For the TPS54201 device, a device shutdown starts the overvoltage
auto-retry timer tHIC_OV. During the shutdown period, both FETs are kept off. Once the overvoltage auto-retry
timer expires, the TPS54201 device restarts again. If the failure still exists, the TPS54201 device repeats the
foregoing auto-retry shutdown-and-restart process.
8.3.10.6 Thermal Shutdown
The internal thermal-shutdown circuitry forces the device to stop switching if the junction temperature exceeds a
typical value of 160°C. When the junction temperature drops below a typical value of 150°C, the internal thermal-
auto-retry timer tHIC_THERMAL begins to count. The device reinitiates the power-up sequence once the thermal-
auto-retry timer expires.
16
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8.4 Device Functional Modes
8.4.1 Enable and Disable Device
The PWM pin performs not only the dimming function, but also the enable-and-disable function. When the VIN
voltage is above the UVLO threshold, the TPS5420x device can be enabled by driving the PWM pin higher than
the threshold voltage, 0.56 V typical. To disable the device, keep the PWM pin lower than the threshold voltage,
0.55 V typical, for 40 ms or longer. The PWM pin has an internal pulldown resistor, so floating this pin disables
the device.
The suggested power-on sequence is applying VVIN first, followed by the PWM signal.
8.4.2 Mode Detection
The magnitude of the PWM signal is used to determine which dimming mode the device enters. The internal
peak detector at the PWM pin holds the magnitude of the PWM signal. Once the device is enabled, after 300-µs
delay, the output of the peak detector is compared with two voltage thresholds, VADIM and VPDIM, which are 1 V
and 2.07 V, respectively. If the output of the peak detector is higher than 2.07 V, analog dimming mode is
chosen and locked. If the output is between 1 V and 2.07 V, PWM dimming mode is chosen and locked. If the
output is less than 1 V, the device waits another 300 µs and compares again, and this process repeats until at
least one mode is chosen and locked. See 图 17 and 表 1 for reference. After the mode is detected and locked,
soft start begins, the output voltage ramps up, and the LED current is regulated at the target value. The dimming
mode cannot be changed unless VIN or PWM is cycled. section
PWM
+
EN
VTH
PWM
Peak
Detector
+
+
A
B
VADIM
VPDIM
Internal
PWM
+
VPWM
图 17. Mode Detection Circuit
表 1. Mode Detection Condition
A
H
L
B
MODE
H
H
L
Enter analog dimming mode
Enter PWM dimming mode
L
Keep detecting until one dimming mode is locked
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8.4.3 Analog Dimming Mode Operation
Once the analog dimming mode is chosen, the internal voltage reference for the FB pin is approximately 200 mV
at full scale, and proportional to the PWM duty cycle as shown in 图 16. LED current is continuous in this mode,
and the current magnitude can be adjusted by changing PWM duty cycle, see 图 18. Because the internal
voltage reference is filtered from the PWM signal, a too-low PWM frequency may cause excessive ripple at the
voltage reference. To minimize this ripple, the suggested PWM signal frequency is 10 kHz or higher, such as 50
kHz.
200 mV/RSENSE
LED current
100 mV/RSENSE
t
50 kHz/50%
PWM 3 V
t
图 18. Analog Dimming Operation
A comparator with 400-mV hysteresis is used to generate the internal PWM signal, see 图 17. This internal PWM
duty cycle determines the voltage reference. To make sure the PWM pin signal is correctly identified, the high
level of the PWM signal should be higher than 1 V, and the low level should be lower than 0.6 V. 图 19 shows
the relationship between the external PWM and internal PWM signals.
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8.4.4 PWM Dimming-Mode Operation
Once the PWM dimming mode is chosen, the internal voltage reference for the FB pin is fixed at 100 mV. The
LED current is on or off corresponding to the PWM state, see 图 19. Due to the limited control-loop response, to
get a relatively linear dimming performance, the suggested PWM signal frequency should be less than 1 kHz.
1 V
0.6 V
PWM Pin Signal
Internal PWM
100 mV/RSENSE
0
LED Current
图 19. PWM Dimming Operation
In some application where dimming is not needed, one can just connect a resistor divider from VVIN to the PWM
pin as 图 20 shows.
LO
CBOOT
CO
1
2
3
GND BOOT
6
5
4
SW
VIN
PWM
FB
RF
VIN
CF
CIN
RTOP
RSENSE
RBOT
图 20. Application Without Dimming
RTOP and RBOT should be sized to make sure the PWM pin voltage is higher than 1 V when VVIN reaches its
steady voltage. It is best to make sure the PWM pin voltage is less than 2 V, thus one can have 100 mV at the
FB pin for better efficiency. Use 10 kΩ as a good starting point for RBOT, then choose RTOP according to 公式 2:
≈
∆
«
’
V
IN
RTOP
=
-1 ìR
÷
BOT
VPWM
◊
(2)
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9 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS5420x device is typically used as a buck converter to drive one or more LEDs from a 4.5-V to 28-V
input. The TPS5420x device supports both analog dimming mode and PWM dimming mode.
9.2 Typical Application
9.2.1 TPS5420x 12-V Input, 1.5-A, 3-Piece IR LED Driver With Analog Dimming
D1
SFH 4715A
Infrared
U1
VIN
L1
VIN = 10.8V ~ 13.2V
C1
R1
0
3
5
6
2
BOOT
SW
VIN
10µH
C2
10µF
C3
0.1µF
0.1µF
PWM
C4
10µF
D2
SFH 4715A
Infrared
GND
3.3V, 50kHz, 1% to 100% duty
4
1
FB
TP1
GND
PWM
R2
TPS54200DDCR
910
R3
0.033
GND
D3
SFH 4715A
Infrared
C5
0.082µF
R4
0.1
GND
Copyright © 2016, Texas Instruments Incorporated
GND
图 21. 12-V VVIN, 1.5-A, 3-Piece IR LED, Analog Dimming Reference Design
9.2.1.1 Design Requirements
For this design example, use the parameters in 表 2.
表 2. Design Parameters
PARAMETER
Input voltage range
VALUE
10.8 V to 13.2 V
5.4-V stack
LED string forward voltage
Output voltage
5.6 V
LED current at 100% PWM duty cycle
LED current ripple
1.5 A
30 mA or less
400 mV or less
1% to 100%, 3.3 V, 50 kHz
Input voltage ripple
PWM dimming range
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9.2.1.2 Detailed Design Procedure
9.2.1.2.1 Inductor Selection
Use 公式 3 to calculate the minimum value of the output inductor (LMIN).
V
OUT ´(VVIN(max) - VOUT
)
LMIN
=
VVIN(max)´KIND´ILED´ fSW
where
•
•
•
KIND is a coefficient that represents the amount of inductor ripple current relative to the maximum LED current.
ILED is the maximum LED current.
VOUT is the sum of the voltage across LED load and the voltage across the sense resistor.
(3)
In general, the suggested value of KIND is between 0.2 and 0.4. For an application that can tolerate higher LED
current ripple or use larger output capacitors, one can choose 0.4 for KIND. Otherwise, a smaller KIND like 0.2 can
be chosen to get low-enough LED current ripple.
With the chosen inductor value the user can calculate the actual inductor current ripple using 公式 4.
V
OUT ´(VVIN(max) - VOUT)
IL(ripple)
=
VVIN(max)´L ´ fSW
(4)
The inductor rms-current and saturation-current ratings must be greater than the rms current and saturation
current seen in the application. This ensures that the inductor does not overheat or saturate. During power up,
transient conditions, or fault conditions, the inductor current can exceed its normal operating current. For this
reason, the most conservative approach is to specify an inductor with a saturation current rating equal to or
greater than the converter current limit. This is not always possible due to application size limitations. The peak-
inductor-current and rms-current equations are shown in 公式 5 and 公式 6.
IL(ripple)
IL(peak) = ILED
+
2
(5)
2
IL(ripple)
2
IL(rms)
=
ILED
+
12
(6)
In this design, choose KIND = 0.3. According to the LED manufacturer’s data sheet, the IR LED has 1.75-V
forward voltage at 1.5-A current, so VOUT = 1.75 V × 3 + 0.2 V = 5.45 V and the calculated inductance is 11.9 µH.
A 10-µH inductor (part number is 744066100 from Wurth) is chosen. With this inductor, the ripple, peak, and rms
currents of the inductor are 0.53 A, 1.77 A, and 1.51 A, respectively. The chosen inductor has ample margin.
9.2.1.2.2 Input Capacitor Selection
The device requires an input capacitor to reduce the surge current drawn from the input supply and the switching
noise from the device. Ceramic capacitors with X5R or X7R dielectrics are highly recommended because of their
low ESR and small temperature coefficients. For most applications, a 10-μF capacitor is enough. An additional
0.1-μF capacitor from VIN to GND is optional to provide additional high-frequency filtering. The input capacitor
must have a voltage rating greater than the maximum input voltage and have a ripple-current rating greater than
the maximum input-current ripple of the converter. The rms input-ripple current is calculated in 公式 7, where D is
the duty cycle (output voltage divided by input voltage).
ICIN(rms) = ILED ì Dì 1-D
(7)
Use 公式 8 to calculate the input ripple voltage, where ESRCIN is the ESR of input capacitor. Ceramic
capacitance tends to decrease as the applied dc voltage increases. This depreciation must be accounted for
when calculating input ripple voltage.
I
LED´D´(1- D)
VVIN(ripple)
=
+ ILED´ESRCIN
CIN´ fSW
(8)
In this design, a 10-µF, 35-V X7R ceramic capacitor, part number GRM32ER7YA106KA12L from muRata, is
chosen. This yields around 70-mV input ripple voltage. The calculated rms input ripple current is 0.75 A, well
below the ripple-current rating of the capacitor.
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9.2.1.2.3 Output Capacitor Selection
The output capacitor reduces the high-frequency ripple current through the LED string. Various guidelines
disclose how much high-frequency ripple current is acceptable in the LED string. Excessive ripple current in the
LED string increases the rms current in the LED string, and therefore the LED temperature increases.
1. Look up the total dynamic resistance of the LED string (RLED) using the LED manufacturer’s data sheet.
2. Calculate the required impedance of the output capacitor (ZOUT), given the acceptable peak-to-peak ripple
current through the LED string, ILED(ripple). IL(ripple) is the peak-to-peak inductor ripple current as calculated
previously in the Inductor Selection section.
3. Calculate the minimum effective output capacitance required.
4. Increase the output capacitance appropriately due to the derating effect of applied dc voltage.
See 公式 9, 公式 10 and 公式 11.
DVF
RLED
=
ì # of LEDs
DIF
(9)
RLED ìILED(ripple)
ZCOUT
=
IL(ripple) -ILED(ripple)
(10)
(11)
1
COUT
=
2p´ fSW ´ ZCOUT
Once the output capacitor is chosen, 公式 12 can be used to estimate the peak-to-peak ripple current through
the LED string.
ZCOUT ìIL(ripple)
ILED(ripple)
=
ZCOUT + RLED
(12)
An OSRAM IR LED, SFH4715A, is used here. The dynamic resistance of this LED is 0.25 Ω at 1.5-A forward
current. In this design, 10-µF, 35-V X7R ceramic capacitor is chosen, the part number is
a
GRM32ER7YA106KA12L, from muRata. The calculated ripple current of the LED is about 20 mA.
9.2.1.2.4 FB Pin RC Filter Selection
The RC filter comprising RF and CF and connected between the sense resistor and the FB pin is used to
generate a pole for loop stability purposes. Moving this pole can adjust loop bandwidth. The suggested frequency
of the pole is 2 kHz in analog dimming mode and 4 kHz in PWM dimming mode. Use 公式 13 to choose RF and
CF. Due to the dc offset current of the internal amplifier, the suggested value of RF is less than 1 kΩ to minimize
the effect on LED current-regulation accuracy.
1
CF =
2p ìRF ì fPOLE
(13)
Analog dimming mode is implemented in this design. Choose the pole at around 2 kHz, with 910 Ω as the filter
resistor; then the calculated filter capacitance is 87 nF. An 82 nF capacitor is chosen for this filter.
9.2.1.2.5 Sense Resistor Selection
The maximum target LED current at 100% PWM duty is 1.5 A, and the corresponding VREF is 200 mV. Using 公
式 1, calculate the needed sense resistance at 133 mΩ. Pay close attention to the power consumption of the
sense resistor in this design at 300 mW, and make sure the chosen resistor has enough margin in its power
rating.
22
版权 © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
9.2.1.3 Application Curves
100%
95%
90%
85%
80%
75%
70%
65%
60%
55%
50%
CH2
CH3
CH4
Efficiency_LED
Efficiency_Vout
0
10
20
30
40
50
60
70
80
90 100
PWM duty %
D001
CH2: SW
CH3: LED current
(AC-coupled)
CH4: Inductor current
图 22. Efficiency
图 23. LED Current Ripple at 1% PWM Duty Cycle
CH2
CH1
CH3
CH4
CH2
CH4
CH2: SW
CH3: LED current
(AC-coupled)
CH4: Inductor
current
CH1: VVIN
(AC-coupled)
CH2: SW
CH4: Inductor
current
图 24. LED Current Ripple at 100% PWM Duty Cycle
图 25. Input Voltage Ripple at 100% PWM Duty Cycle
CH1
CH1
CH3
CH4
CH3
CH4
CH1: PWM
CH3: Inductor
current
CH4: LED current
CH1: PWM
CH3: Inductor
current
CH4: LED current
图 26. LED Current Transient as PWM Duty Cycle
图 27. LED Current Transient as PWM Duty Cycle
Changes From 1% to 99%
Changes From 50% to 99%
版权 © 2016–2018, Texas Instruments Incorporated
23
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
1600
1400
1200
1000
800
600
400
200
0
CH1
CH3
CH4
0
20%
40%
PWM duty %
60%
80%
100%
D002
CH1: PWM
CH3: Inductor
current
CH4: LED current
图 29. LED Current vs PWM Duty Cycle
图 28. LED Current Transient as PWM Duty Cycle
Changes From 99% to 1%
CH1
CH2
CH1
CH2
CH3
CH4
CH3
CH4
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current;
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current;
图 30. Start-Up at 1% PWM Duty Cycle and 50 kHz
图 31. Shutdown at 1% PWM Duty Cycle and 50 kHz
CH1
CH2
CH1
CH2
CH3
CH4
CH3
CH4
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current
图 32. Start-Up at 100% PWM Duty Cycle
图 33. Shutdown at 100% PWM Duty Cycle
24
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TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
CH1
CH2
CH3
CH4
CH1: VOUT
CH2: SW
CH3: FB CH4: Inductor
current
CH1: VOUT
CH2: SW
CH3: FB
CH4: Inductor
current
图 34. LED Short Protection (100% PWM Duty Cycle) of
图 35. LED Short Protection (100% PWM Duty Cycle) of
TPS54200
TPS54201
CH1
CH2
CH3
CH4
CH1: VOUT
CH2: SW
CH3: FB CH4: Inductor
current
CH1: VOUT
CH2: SW
CH3: FB
CH4: Inductor
current
图 36. LED Open Protection (100% PWM Duty Cycle) of
图 37. LED Open Protection (100% PWM Duty Cycle) of
TPS54200
TPS54201
CH1
CH2
CH3
CH4
CH1: VOUT
CH2: SW
CH3: FB
CH4:Inductor
current
CH1: VOUT
CH2: SW
CH3: FB
CH4: Inductor
current
图 38. Sense Resistor Short Protection (100% PWM Duty
图 39. Sense-Resistor Short Protection (100% PWM Duty
Cycle) of TPS54200
Cycle) of TPS54201
版权 © 2016–2018, Texas Instruments Incorporated
25
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
9.2.2 TPS5420x 24-V Input, 1-A, 4-Piece WLED Driver With PWM Dimming
D1
Cool White
U1
L1
VIN = 21.6V ~ 26.4V
C1
R1
0
3
5
6
2
VIN
BOOT
SW
VIN
GND
10µH
C2
10µF
C3
0.1µF
0.1µF
PWM
D2
Cool White
C4
10µF
GND
1.5V, 250Hz, 1% to 100% duty
4
1
FB
GND
TP1
GND
PWM
R2
D3
Cool White
TPS54200DDCR
200
GND
C5
0.082µF
GND
R3
0.1
D4
Cool White
GND
GND
GND
Copyright © 2016, Texas Instruments Incorporated
图 40. 24-V Input, 1-A, 4-Piece WLED Driver With PWM Dimming Reference Design
9.2.2.1 Design Requirements
For this design example, use the parameters in 表 3.
表 3. Design Parameters
PARAMETER
Input voltage range
VALUE
21.6 V to 26.4 V
11.6-V stack
LED string forward voltage
Output voltage
11.7 V
LED current at 100% PWM duty cycle
LED current ripple
1 A
30 mA or less
400 mV or less
1% to 100%, 1.5 V, 250 Hz
Input voltage ripple
PWM dimming range
26
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TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
9.2.2.2 Detailed Design Procedure
The detailed design process in this example is basically the same with that shown in the previous design
example. Following are the design results.
9.2.2.2.1 Inductor Selection
A Cree white LED XLampXML is used. According to the LED manufacturer’s data sheet, this LED has 2.9-V
forward voltage at 1-A current, so VOUT = 2.9 V × 4 + 0.1 V = 11.7 V. Choose KIND = 0.3, which gives a 36-µH
inductance. With this inductance, the ripple current on the inductor is only 0.3-A peak-to-peak, which is too
conservative and increases total system cost and size.
For this application, with concerns about system cost and size taken into account, decide the inductance by
choosing a larger peak-to-peak inductor ripple current. To choose a proper peak-to-peak inductor ripple, the low-
side FET sink current limit should not be exceeded when the converter works in a no-load condition. To meet this
requirement, half of the peak-to-peak inductor ripple must be lower than that limit. Another consideration with this
larger peak-to-peak ripple current is the increased core loss and copper loss in the inductor, which is also
acceptable. Once this peak-to-peak inductor ripple current is chosen, 公式 14 can be used to calculate the
required inductance.
V
OUT ´ (VIN(max) - VOUT)
LMIN
=
V
IN(max)´ IL(ripple)´ fSW
where
•
IL(RIPPLE) is the peak-to-peak inductor ripple current.
(14)
Choose 1-A peak-to-peak inductor ripple current, and half of the current is 0.5 A, much lower than the minimum
low-side sink current limit of 1.25 A. The calculated inductance is 10.9 µH. Choose a 10-µH inductor with part
number 744066100 from Wurth. The ripple, peak, and rms currents of the inductor are 1.09 A, 1.54 A, and 1.05
A, respectively. The chosen inductor has ample margin in this design.
9.2.2.2.2 Input Capacitor Selection
In this design, a 10-µF, 35-V X7R ceramic capacitor, part number GRM32ER7YA106KA12L from muRata, is
chosen. This yields around 70-mV input-ripple voltage. The calculated rms input ripple current is 0.5 A, well
below the ripple-current rating of the capacitor.
9.2.2.2.3 Output Capacitor Selection
The dynamic resistance of this LED is 0.184 Ω at 1-A forward current. In this design, choose a 10-µF, 35-V X7R
ceramic capacitor, part number GRM32ER7YA106KA12L from muRata. The calculated ripple current of the LED
is about 40 mA.
9.2.2.2.4 FB Pin RC Filter Selection
PWM dimming mode is implemented in this design. Choose the pole at around 4 kHz, and choose 475 Ω as the
filter resistor. With those values, an 82 nF capacitor should be chosen for this filter. To get a faster loop
response, choose a smaller filter resistor. In this design, 200 Ω was chosen to get a pole at approximately 10
kHz.
9.2.2.2.5 Sense Resistor Selection
The maximum target LED current at 100% PWM duty cycle is 1 A, and the corresponding VREF is 100 mV. By
using 公式 1, one can calculate the needed sense resistance of 100 mΩ. Pay close attention to the power
consumption of the sense resistor in this design at 100 mW. Make sure the chosen resistor has enough margin
in the power rating.
版权 © 2016–2018, Texas Instruments Incorporated
27
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
9.2.2.3 Application Curves
CH1
CH2
CH1
CH2
CH3
CH4
CH3
CH4
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current
图 41. Start-Up at 1% PWM Duty Cycle and 250 Hz
图 42. Shutdown at 1% PWM Duty Cycle and 250 Hz
CH1
CH2
CH1
CH2
CH3
CH4
CH3
CH4
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
Current
CH1: PWM
CH2: SW
CH3: VOUT
CH4: LED
current
图 43. Start-Up at 100% PWM Duty Cycle
图 44. Shutdown at 100% PWM Duty Cycle
CH1
CH4
CH1
CH4
CH1 PWM
CH4: LED
current
CH1: PWM
CH4: LED
current
图 45. PWM Dimming With 2% Duty Cycle and 250 Hz
图 46. PWM Dimming With 50% Duty Cycle and 250 Hz
28
版权 © 2016–2018, Texas Instruments Incorporated
TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
CH2
CH1
CH4
CH3
CH4
CH1: PWM
CH4: LED
current
CH2: SW
CH3: LED CH4: Inductor
current
current
(AC-coupled)
图 47. PWM Dimming With 99% Duty Cycle and 250 Hz
图 48. LED Current Ripple at 100% PWM Duty Cycle
CH1
CH2
CH4
CH1: VVIN
CH2: SW
CH4: Inductor current
(AC-coupled)
图 49. Input Voltage Ripple at 100% PWM Duty Cycle
版权 © 2016–2018, Texas Instruments Incorporated
29
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
10 Power Supply Recommendations
The devices are designed to operate from an input voltage supply range between 4.5 V and 28 V. This input
supply must be well regulated. If the input supply is located more than a few inches from the device or converter,
additional bulk capacitance may be required in addition to the ceramic bypass capacitors.
11 Layout
The TPS5420x requires a proper layout for optimal performance. The following section gives some guidelines to
help ensure a proper layout.
11.1 Layout Guidelines
An example of a proper layout for the TPS5420x is shown in 图 50.
•
•
Creating a large GND plane for good electrical and thermal performance is important.
The VIN and GND traces should be as wide as possible to reduce trace impedance. The added width also
provides excellent heat dissipation.
•
Thermal vias can be used to connect the topside GND plane to additional printed-circuit board (PCB) layers
for heat dissipation and grounding.
•
•
•
•
The input capacitors must be located as close as possible to the VIN pin and the GND pin.
The SW trace must be kept as short as possible to minimize radiated noise and EMI.
Do not allow switching current to flow under the device.
The FB trace should be kept as short as possible and placed away from the high-voltage switching trace and
the ground shield.
•
In higher-current applications, routing the load current of the current-sense resistor to the junction of the input
capacitor and GND node may be necessary.
30
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TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
11.2 Layout Example
LED LOAD
VSENSE
SENSE RESISTOR
GND
OUTPUT
CAPACITOR
VOUT
CONNECTED TO
POWER GND ON
INTERNAL OR
BOOT
CAPACITOR
BOTTOM LAYER
OUTPUT
INDUCTOR
GND
SW
BOOT
PWM
TO PWM
CONTROL
SW
FB
VIN
RC FILTER
GND
INPUT
CAPACITOR
VIN
CONNECTED TO
POWER GND ON
INTERNAL OR
BOTTOM LAYER
VIA to Ground Plane
图 50. Layout Example
版权 © 2016–2018, Texas Instruments Incorporated
31
TPS54200, TPS54201
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
www.ti.com.cn
12 器件和文档支持
12.1 器件支持
12.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.2 文档支持
12.2.1 相关链接
下表列出了快速访问链接。类别包括技术文档、支持和社区资源、工具和软件，以及立即订购快速访问。
表 4. 相关链接
器件
产品文件夹
请单击此处
请单击此处
立即订购
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具和软件
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
TPS54200
TPS54201
12.3 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.4 社区资源
下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，
并且不一定反映 TI 的观点；请参阅 TI 的 《使用条款》。
TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在
e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。
设计支持
TI 参考设计支持 可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。
12.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
12.7 术语表
SLYZ022 — TI 术语表。
这份术语表列出并解释术语、缩写和定义。
32
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TPS54200, TPS54201
www.ti.com.cn
ZHCSFQ9B –NOVEMBER 2016–REVISED JUNE 2018
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此产品说明书的浏览器版本，请查看左侧的导航面板。
版权 © 2016–2018, Texas Instruments Incorporated
33
PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS54200DDCR
TPS54200DDCT
TPS54201DDCR
TPS54201DDCT
ACTIVE SOT-23-THIN
ACTIVE SOT-23-THIN
ACTIVE SOT-23-THIN
ACTIVE SOT-23-THIN
DDC
DDC
DDC
DDC
6
6
6
6
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 125
-40 to 125
4200
4200
4201
4201
Samples
Samples
Samples
Samples
SN
SN
SN
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
23-Dec-2022
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Feb-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS54200DDCR
TPS54200DDCT
TPS54201DDCR
TPS54201DDCT
SOT-23-
THIN
DDC
DDC
DDC
DDC
6
6
6
6
3000
250
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
SOT-23-
THIN
SOT-23-
THIN
3000
250
SOT-23-
THIN
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Feb-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS54200DDCR
TPS54200DDCT
TPS54201DDCR
TPS54201DDCT
SOT-23-THIN
SOT-23-THIN
SOT-23-THIN
SOT-23-THIN
DDC
DDC
DDC
DDC
6
6
6
6
3000
250
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
3000
250
Pack Materials-Page 2
PACKAGE OUTLINE
DDC0006A
SOT-23 - 1.1 max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
3.05
2.55
1.1
0.7
1.75
1.45
0.1 C
B
A
PIN 1
INDEX AREA
1
6
4X 0.95
1.9
3.05
2.75
4
3
0.5
0.3
0.1
6X
TYP
0.0
0.2
C A B
C
0 -8 TYP
0.25
GAGE PLANE
SEATING PLANE
0.20
0.12
TYP
0.6
0.3
TYP
4214841/C 04/2022
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC MO-193.
www.ti.com
EXAMPLE BOARD LAYOUT
DDC0006A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
6X (1.1)
1
6
6X (0.6)
SYMM
4X (0.95)
4
3
(R0.05) TYP
(2.7)
LAND PATTERN EXAMPLE
EXPLOSED METAL SHOWN
SCALE:15X
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
SOLDERMASK DETAILS
4214841/C 04/2022
NOTES: (continued)
4. Publication IPC-7351 may have alternate designs.
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
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EXAMPLE STENCIL DESIGN
DDC0006A
SOT-23 - 1.1 max height
SMALL OUTLINE TRANSISTOR
SYMM
6X (1.1)
1
6
6X (0.6)
SYMM
4X(0.95)
4
3
(R0.05) TYP
(2.7)
SOLDER PASTE EXAMPLE
BASED ON 0.125 THICK STENCIL
SCALE:15X
4214841/C 04/2022
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
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