TPS562210A [TI]

采用 SOT-23 封装且具有高级 Eco-mode™、PG 和软启动功能的 17V 输入、2A 同步降压稳压器;
TPS562210A
型号: TPS562210A
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

采用 SOT-23 封装且具有高级 Eco-mode™、PG 和软启动功能的 17V 输入、2A 同步降压稳压器

软启动 稳压器
文件: 总29页 (文件大小:1241K)
中文:  中文翻译
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TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
TPS56x210A 采用 8 引脚 SOT-23 封装的  
4.5V 17V 输入、2A/3A 同步降压稳压器  
1 特性  
3 说明  
1
TPS562210A:集成有  
133mΩ 80mΩ 场效应晶体管 (FET) 2A 转换  
TPS562210A TPS563210A 是采用 8 引脚 SOT-23  
封装的简单易用型 2A/3A 同步降压转换器。  
两款器件均经过优化,最大限度地减少了运行所需的外  
部组件并且可以实现低待机电流。  
TPS563210A:集成有  
68mΩ 39mΩ FET 3A 转换器  
D-CAP2™针对快速瞬态响应的模式控制  
高级 Eco-mode™脉冲跳跃  
输入电压范围:4.5V 17V  
输出电压范围:0.76V 7V  
650kHz 开关频率  
这些开关模式电源 (SMPS) 器件采用 D-CAP2™ 模式  
控制,从而提供快速瞬态响应,并且在无需外部补偿组  
件的情况下支持诸如高分子聚合物等低等效串联电阻  
(ESR) 输出电容器以及超低 ESR 陶瓷电容器。  
该器件可在高级 Eco-mode™ 下运行,从而能在轻载  
运行期间保持高效率。TPS562210A TPS563210A  
采用 8 引脚 1.6mm × 2.9mm SOT (DDF) 封装,额定  
环境温度范围为 –40°C 85°C。  
低关断电流(低于 10µA)  
1% 反馈电压精度 (25°C)  
从预偏置输出电压中启动  
逐周期过流限制  
器件信息(1)  
断续模式欠压保护  
非锁存过压保护 (OVP),欠压闭锁 (UVLO) 和热关  
(TSD) 保护  
订货编号  
TPS562210A  
TPS563210A  
封装  
封装尺寸(标称值)  
DDF(8)  
1.60mm x 2.90mm  
可调软启动  
电源正常输出  
(1) 要了解所有可用封装,请参见数据表末尾的可订购产品附录。  
2 应用  
数字电视电源  
高清 蓝光 (Blu-ray) 碟片播放器  
网络家庭终端设备  
数字机顶盒(STB)  
空白  
空白  
简化电路原理图  
效率  
TPS562210A  
TPS563210A  
100  
90  
80  
70  
60  
50  
40  
1
8
GND  
VBST  
2
7
6
5
VOUT  
EN  
VFB  
SS  
EN  
SW  
3
4
VIN  
VIN  
PG  
VOUT  
30  
Vout = 5V  
Copyright  
©
2016, Texas Instruments Incorporated  
20  
Vout = 3.3V  
10  
Vout = 1.8V  
0
0.001  
0.01  
0.1  
1
10  
Output Current (A)  
C015  
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,  
intellectual property matters and other important disclaimers. PRODUCTION DATA.  
English Data Sheet: SLVSDP9  
 
 
 
TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
www.ti.com.cn  
目录  
7.4 Device Functional Modes........................................ 12  
Application and Implementation ........................ 13  
8.1 Application Information............................................ 13  
8.2 Typical Application ................................................. 13  
Power Supply Recommendations...................... 21  
1
2
3
4
5
6
特性.......................................................................... 1  
应用.......................................................................... 1  
说明.......................................................................... 1  
修订历史记录 ........................................................... 2  
Pin Configuration and Functions......................... 3  
Specifications......................................................... 4  
6.1 Absolute Maximum Ratings ...................................... 4  
6.2 ESD Ratings ............................................................ 4  
6.3 Recommended Operating Conditions....................... 4  
6.4 Thermal Information.................................................. 4  
6.5 Electrical Characteristics........................................... 5  
6.6 Timing Requirements................................................ 5  
6.7 Typical Characteristics.............................................. 6  
Detailed Description ............................................ 10  
7.1 Overview ................................................................. 10  
7.2 Functional Block Diagram ...................................... 10  
7.3 Feature Description................................................. 11  
8
9
10 Layout................................................................... 22  
10.1 Layout Guidelines ................................................. 22  
10.2 Layout Example .................................................... 22  
11 器件和文档支持 ..................................................... 23  
11.1 器件支持 ............................................................... 23  
11.2 相关链接................................................................ 23  
11.3 接收文档更新通知 ................................................. 23  
11.4 社区资源................................................................ 23  
11.5 ....................................................................... 23  
11.6 静电放电警告......................................................... 23  
11.7 Glossary................................................................ 23  
12 机械、封装和可订购信息....................................... 23  
7
4 修订历史记录  
日期  
修订版本  
注释  
2016 11 月  
*
最初发布版本。  
2
版权 © 2016, Texas Instruments Incorporated  
 
TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
5 Pin Configuration and Functions  
DDF Package  
8 Pin  
Top View  
GND  
SW  
1
8
VBST  
2
3
7
6
5
EN  
VFB  
SS  
VIN  
PG  
4
Pin Functions  
PIN  
DESCRIPTION  
NAME  
NO.  
Ground pin Source terminal of low-side power NFET as well as the ground terminal for controller circuit. Connect  
sensitive VFB to this GND at a single point.  
GND  
1
SW  
VIN  
PG  
2
3
4
5
6
7
8
Switch node connection between high-side NFET and low-side NFET.  
Input voltage supply pin. The drain terminal of high-side power NFET.  
Power good open drain output  
SS  
Soft-start control. An external capacitor should be connected to GND.  
Converter feedback input. Connect to output voltage with feedback resistor divider.  
Enable input control. Active high and must be pulled up to enable the device.  
Supply input for the high-side NFET gate drive circuit. Connect 0.1 µF capacitor between VBST and SW pins.  
VFB  
EN  
VBST  
Copyright © 2016, Texas Instruments Incorporated  
3
TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
www.ti.com.cn  
6 Specifications  
6.1 Absolute Maximum Ratings  
TJ = -40°C to 150°C (unless otherwise noted)  
(1)  
MIN  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–0.3  
–2  
MAX  
19  
UNIT  
V
VIN, EN  
VBST  
25  
V
VBST (10 ns transient)  
27.5  
6.5  
6.5  
5.5  
19  
V
VBST (vs SW)  
Input voltage range  
V
VFB, PG  
V
SS  
SW  
V
V
SW (10 ns transient)  
Operating junction temperature, TJ  
Storage temperature, Tstg  
–3.5  
–40  
–55  
21  
V
150  
150  
°C  
°C  
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings  
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended  
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
6.2 ESD Ratings  
VALUE  
±2000  
±500  
UNIT  
V
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)  
Charged device model (CDM), per JEDEC specification JESD22-C101(2)  
V(ESD)  
Electrostatic discharge  
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.  
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.  
6.3 Recommended Operating Conditions  
TJ = –40°C to 150°C (unless otherwise noted)  
MIN  
MAX  
17  
23  
26  
6
UNIT  
V
VIN  
Supply input voltage range  
VBST  
4.5  
–0.1  
–0.1  
–0.1  
–0.1  
–0.1  
–0.1  
–1.8  
–3.5  
–40  
V
VBST (10 ns transient)  
V
VBST(vs SW)  
V
EN  
17  
5.5  
5
V
VI  
Input voltage range  
VFB, pg  
V
SS  
V
SW  
17  
20  
85  
V
SW (10 ns transient)  
V
TA  
Operating free-air temperature  
°C  
6.4 Thermal Information  
TPS562210A  
TPS563210A  
DDF (8 PINS)  
THERMAL METRIC(1)  
UNIT  
RθJA  
RθJC(top)  
RθJB  
ψJT  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
106.1  
49.1  
10.9  
8.6  
87.0  
41.6  
14.6  
4.7  
°C/W  
°C/W  
°C/W  
°C/W  
°C/W  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
ψJB  
10.8  
14.6  
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application  
report.  
4
Copyright © 2016, Texas Instruments Incorporated  
TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
6.5 Electrical Characteristics  
over operating free-air temperature range, VIN = 12 V (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
SUPPLY CURRENT  
IVIN  
Operating – non-switching supply current  
Shutdown supply current  
VIN current, TA = 25°C, EN = 5V, VFB = 0.8 V  
VIN current, TA = 25°C, EN = 0 V  
190  
3.0  
290  
10  
µA  
µA  
IVINSDN  
LOGIC THRESHOLD  
VENH  
VENL  
REN  
EN high-level input voltage  
EN  
1.6  
V
V
EN low-level input voltage  
EN pin resistance to GND  
EN  
0.6  
VEN = 12 V  
225  
450  
900  
kΩ  
VFB VOLTAGE AND DISCHARGE RESISTANCE  
TA = 25°C, VO = 1.05 V, IO = 10 mA, Eco-mode™  
operation  
VFB threshold voltage TPS562210A  
772  
765  
mV  
TA = 25°C, VO = 1.05 V  
758  
753  
751  
772  
777  
779  
±0.1  
VFBTH  
VFB threshold voltage TPS562210A and  
TPS563210A  
TA = 0°C to 85°C, VO = 1.05 V(1)  
TA = -40°C to 85°C, VO = 1.05 V(1)  
VFB = 0.8 V, TA = 25°C  
mV  
µA  
IVFB  
VFB input current  
0
MOSFET  
TA = 25°C, VBST – SW = 5.5 V, TPS562210A  
TA = 25°C, VBST – SW = 5.5 V, TPS563210A  
TA = 25°C, TPS562210A  
133  
68  
RDS(on)h  
High side switch resistance  
Low side switch resistance  
mΩ  
mΩ  
80  
RDS(on)l  
CURRENT LIMIT  
TA = 25°C, TPS563210A  
39  
DC current, VOUT = 1.05 V , L1 = 2.2 µH, TPS562210A  
DC current, VOUT = 1.05 V , L1 = 1.5 µH, TPS563210A  
2.5  
3.5  
3.2  
4.2  
4.3  
5.3  
IOCL  
Current limit(1)  
A
THERMAL SHUTDOWN  
Shutdown temperature  
Hysteresis  
155  
35  
TSDN  
Thermal shutdown threshold(1)  
°C  
SOFT START  
ISS  
SS charge current  
VSS = 1.2 V  
4.2  
85%  
0.5  
6
7.8  
µA  
POWER GOOD  
VFB rising (Good)  
VFB falling (Fault)  
PG = 0.5 V  
90%  
85%  
1
95%  
VTHPG  
PG threshold  
IPG  
PG sink current  
mA  
OUTPUT UNDERVOLTAGE AND OVERVOLTAGE PROTECTION  
125%x  
Vfbth  
VOVP  
VUVP  
Output OVP threshold  
Output UVP threshold  
OVP Detect  
65%x  
Vfbth  
Hiccup detect  
tHiccupOn  
tHiccupOff  
UVLO  
Hiccup Power On Time  
Hiccup Power Off Time  
Relative to soft start time  
Relative to soft start time  
1
7
cycle  
cycles  
Wake up VIN voltage  
Hysteresis VIN voltage  
3.45  
0.13  
3.75  
0.32  
4.05  
0.55  
UVLO  
UVLO threshold  
V
(1) Not production tested.  
6.6 Timing Requirements  
MIN  
TYP  
MAX  
UNIT  
ON-TIME TIMER CONTROL  
tON  
On time  
VIN = 12 V, VO = 1.05 V  
TA = 25°C, VFB = 0.5 V  
150  
260  
ns  
ns  
tOFF(MIN)  
Minimum off time  
310  
Copyright © 2016, Texas Instruments Incorporated  
5
TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
www.ti.com.cn  
6.7 Typical Characteristics  
6.7.1 TPS562210A Characteristics  
VIN = 12 V (unless otherwise noted)  
300  
250  
200  
150  
100  
50  
6
5
4
3
2
1
0
0
0
50  
100  
150  
0
50  
100  
150  
œ50  
œ50  
Junction Temperature (°C)  
Junction Temperature (°C)  
C011  
C012  
1. Supply Current vs Junction Temperature  
2. VIN Shutdown Current vs Junction Temperature  
0.780  
0.775  
0.770  
0.765  
0.760  
0.755  
0.750  
60  
50  
40  
30  
20  
10  
0
-10  
0
50  
100  
150  
0
3
6
9
12  
15  
18  
œ50  
Junction Temperature (°C)  
EN Input Voltage (V)  
C013  
C014  
3. VFB Voltage vs Junction Temperature  
4. EN Current vs EN Voltage  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Vout = 5V  
Vout = 3.3V  
Vout = 1.8V  
Vout = 3.3V  
Vout = 1.8V  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
Output Current(A)  
Output Current (A)  
C016  
C015  
VI = 5 V  
6. Efficiency vs Output Current  
5. Efficiency vs Output Current  
6
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TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
TPS562210A Characteristics (接下页)  
800  
800  
700  
600  
500  
400  
300  
200  
100  
0
Vo = 0.76V  
Vo = 1.05V  
Vo = 6.5V  
Vo = 0.75V  
750  
Vo = 1.05V  
700  
Vo = 6.5V  
650  
600  
550  
500  
450  
400  
4
6
8
10  
12  
14  
16  
18  
0.01  
0.1  
Output Current (A)  
1
10  
Input Voltage (V)  
C017  
C018  
7. Switching Frequency vs Input Voltage  
8. Switching Frequency vs Output Current  
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7
TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
www.ti.com.cn  
6.7.2 TPS563210A Characteristics  
VIN = 12V (unless otherwise noted)  
300  
250  
200  
150  
100  
50  
6
5
4
3
2
1
0
0
0
50  
100  
150  
0
50  
100  
150  
œ50  
œ50  
Junction Temperature (°C)  
Junction Temperature (°C)  
C019  
C020  
9. Supply Current vs Junction Temperature  
10. VIN Shutdown Current vs Junction Temperature  
0.780  
0.775  
0.770  
0.765  
0.760  
0.755  
0.750  
60  
50  
40  
30  
20  
10  
0
œ10  
0
50  
100  
150  
0
3
6
9
12  
15  
18  
œ50  
Junction Temperature (°C)  
EN Input Voltage (V)  
C021  
C022  
11. VFB Voltage vs Junction Temperature  
12. EN Current vs EN Voltage  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Vout = 5V  
Vout = 3.3V  
Vout = 1.8V  
Vout = 3.3V  
Vout = 1.8V  
0.001  
0.01  
0.1  
1
10  
0.001  
0.01  
0.1  
1
10  
Output Current (A)  
Output Current (A)  
C023  
C024  
VI = 5 V  
13. Efficiency vs Output Current  
14. Efficiency vs Output Current  
8
版权 © 2016, Texas Instruments Incorporated  
TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
TPS563210A Characteristics (接下页)  
800  
800  
700  
600  
500  
400  
300  
200  
100  
0
Vo = 0.76V  
Vo = 0.76V  
Vo = 1.05V  
Vo = 6.5V  
750  
Vo = 1.05V  
700  
Vo = 6.5V  
650  
600  
550  
500  
450  
400  
4
6
8
10  
12  
14  
16  
18  
0.01  
0.1  
Output Current (A)  
1
10  
Input Voltage (V)  
C025  
C026  
15. Switching Frequency vs Input Voltage  
16. Switching Frequency vs Output Current  
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TPS562210A, TPS563210A  
ZHCSFR5 NOVEMBER 2016  
www.ti.com.cn  
7 Detailed Description  
7.1 Overview  
The TPS562210A and TPS563210A are 2-A, 3-A synchronous step-down converters. The proprietary D-CAP2™  
mode control supports low ESR output capacitors such as specialty polymer capacitors and multi-layer ceramic  
capacitors without complex external compensation circuits. The fast transient response of D-CAP2™ mode  
control can reduce the output capacitance required to meet a specific level of performance.  
7.2 Functional Block Diagram  
EN  
7
3
VIN  
VUVP  
+
Hiccup  
VREG5  
Control Logic  
UVP  
Regulator  
UVLO  
+
OVP  
VOVP  
VFB  
SS  
6
5
8
2
VBST  
SW  
PWM  
Voltage  
Ref  
+
Reference  
+
HS  
SS  
Soft Start  
Ton  
One-Shot  
XCON  
VREG 5  
LS  
TSD  
OCL  
threshold  
PG  
4
OCL  
+
1
GND  
+
+
VTHPG  
ZC  
Copyright © 2016, Texas Instruments Incorporated  
10  
版权 © 2016, Texas Instruments Incorporated  
TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
7.3 Feature Description  
7.3.1 The Adaptive On-Time Control and PWM Operation  
The main control loop of the TPS562210A and TPS563210A are adaptive on-time pulse width modulation (PWM)  
controller that supports a proprietary D-CAP2™ mode control. The D-CAP2™ mode control combines adaptive  
on-time control with an internal compensation circuit for pseudo-fixed frequency and low external component  
count configuration with both low ESR and ceramic output capacitors. It is stable even with virtually no ripple at  
the output.  
At the beginning of each cycle, the high-side MOSFET is turned on. This MOSFET is turned off after internal one  
shot timer expires. This one shot duration is set proportional to the converter input voltage, VIN, and inversely  
proportional to the output voltage, VO, to maintain a pseudo-fixed frequency over the input voltage range, hence  
it is called adaptive on-time control. The one-shot timer is reset and the high-side MOSFET is turned on again  
when the feedback voltage falls below the reference voltage. An internal ramp is added to reference voltage to  
simulate output ripple, eliminating the need for ESR induced output ripple from D-CAP2™ mode control.  
7.3.2 Soft Start and Pre-Biased Soft Start  
The TPS562210A and TPS563210A have adjustable soft-start. When the EN pin becomes high, the SS charge  
current (ISS) begins charging the capacitor which is connected from the SS pin to GND (CSS). Smooth control of  
the output voltage is maintained during start up. The equation for the soft start time, Tss is shown in 公式 1.  
Css´ VFBTH ´ 0.86  
Tss(ms) =  
Iss  
(1)  
where VFBTH is 0.765 V and Iss is 6 µA.  
If the output capacitor is pre-biased at startup, the devices initiate switching and start ramping up only after the  
internal reference voltage becomes greater than the feedback voltage VFB. This scheme ensures that the  
converters ramp up smoothly into regulation point.  
7.3.3 Power Good  
The power good output, PG is an open drain output. The power good function becomes active after 1.7 times  
soft-start time. When the output voltage becomes within –10% of the target value, internal comparators detect  
power good state and the power good signal becomes high. If the feedback voltage goes under 15% of the target  
value, the power good signal becomes low.  
7.3.4 Current Protection  
The output over-current limit (OCL) is implemented using a cycle-by-cycle valley detect control circuit. The switch  
current is monitored during the OFF state by measuring the low-side FET drain to source voltage. This voltage is  
proportional to the switch current. To improve accuracy, the voltage sensing is temperature compensated.  
During the on time of the high-side FET switch, the switch current increases at a linear rate determined by VIN,  
VOUT, the on-time and the output inductor value. During the on time of the low-side FET switch, this current  
decreases linearly. The average value of the switch current is the load current IOUT. If the monitored current is  
above the OCL level, the converter maintains low-side FET on and delays the creation of a new set pulse, even  
the voltage feedback loop requires one, until the current level becomes OCL level or lower. In subsequent  
switching cycles, the on-time is set to a fixed value and the current is monitored in the same manner. If the over  
current condition exists consecutive switching cycles, the internal OCL threshold is set to a lower level, reducing  
the available output current. When a switching cycle occurs where the switch current is not above the lower OCL  
threshold, the counter is reset and the OCL threshold is returned to the higher value.  
There are some important considerations for this type of over-current protection. The load current is higher than  
the over-current threshold by one half of the peak-to-peak inductor ripple current. Also, when the current is being  
limited, the output voltage tends to fall as the demanded load current may be higher than the current available  
from the converter. This may cause the output voltage to fall. When the VFB voltage falls below the UVP  
threshold voltage, the UVP comparator detects it. And then, the device will shut down after the UVP delay time  
(typically 14 µs) and re-start after the hiccup time.  
When the over current condition is removed, the output voltage returns to the regulated value.  
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Feature Description (接下页)  
7.3.5 Over Voltage Protection  
TPS562210A and TPS563210A detect over voltage condition by monitoring the feedback voltage (VFB). When  
the feedback voltage becomes higher than 125% of the target voltage, the OVP comparator output goes high  
and the high-side MOSFET is turns off. This function is non-latch operation.  
7.3.6 UVLO Protection  
Under voltage lock out protection (UVLO) monitors the internal regulator voltage. When the voltage is lower than  
UVLO threshold voltage, the device is shut off. This protection is non-latching.  
7.3.7 Thermal Shutdown  
The device monitors the temperature of itself. If the temperature exceeds the threshold value (typically 155°C),  
the device is shut off. This is a non-latch protection.  
7.4 Device Functional Modes  
7.4.1 Advanced Eco-Mode™ Control  
The TPS562210A and TPS563210A are designed with Advanced Eco-mode™ to maintain high light load  
efficiency. As the output current decreases from heavy load condition, the inductor current is also reduced and  
eventually comes to point that its rippled valley touches zero level, which is the boundary between continuous  
conduction and discontinuous conduction modes. The rectifying MOSFET is turned off when the zero inductor  
current is detected. As the load current further decreases the converter runs into discontinuous conduction mode.  
The on-time is kept almost the same as it was in the continuous conduction mode so that it takes longer time to  
discharge the output capacitor with smaller load current to the level of the reference voltage. This makes the  
switching frequency lower, proportional to the load current, and keeps the light load efficiency high. The transition  
point to the light load operation IOUT(LL) current can be calculated in 公式 2.  
V
IN - VOUT ´ V  
)
(
1
OUT  
IOUT(LL)  
=
´
2´L ´ fSW  
V
IN  
(2)  
12  
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8 Application and Implementation  
Information in the following applications sections is not part of the TI component  
specification, and TI does not warrant its accuracy or completeness. TI’s customers are  
responsible for determining suitability of components for their purposes. Customers should  
validate and test their design implementation to confirm system functionality.  
8.1 Application Information  
The TPS562210A and TPS563210A are typically used as step down converters, which convert a voltage from  
4.5 V to 17 V to a lower voltage. Webench software is available to aid in the design and analysis of circuits.  
8.2 Typical Application  
8.2.1 Typical Application, TPS562210A  
4.5-V to 17-V Input, 1.05-V Output Converter.  
U1  
TPS562210A  
L1 2.2uH  
VIN = 4.5 - 17 V  
C5  
VOUT = 1.05 V, 2 A  
3
7
8
VIN  
VIN  
EN  
VBST  
VOUT  
0.1µF  
R4  
100k  
R3 10.0k  
C1  
0.1µF  
C2  
10µF  
C3  
10µF  
C6  
22µF  
C7  
22µF  
C8  
22µF  
2
4
6
1
EN  
SW  
PG  
R1  
3.74k  
PG  
5
SS  
VFB  
GND  
C4  
8200pF  
R2  
10.0k  
17. TPS562210A 1.05V/2A Reference Design  
8.2.1.1 Design Requirements  
For this design example, use the parameters shown in 1.  
1. Design Parameters  
PARAMETER  
Input voltage range  
VALUES  
4.5 V to 17 V  
1.05 V  
Output voltage  
Output current  
2 A  
Output voltage ripple  
20 mVp-p  
8.2.1.2 Detailed Design Procedure  
8.2.1.2.1 Output Voltage Resistors Selection  
The output voltage is set with a resistor divider from the output node to the VFB pin. It is recommended to use  
1% tolerance or better divider resistors. Start by using 公式 3 to calculate VOUT  
.
To improve efficiency at light loads consider using larger value resistors, too high of resistance are more  
susceptible to noise and voltage errors from the VFB input current are more noticeable.  
R1  
æ
ö
VOUT = 0.765´ 1+  
ç
÷
R2  
è
ø
(3)  
8.2.1.2.2 Output Filter Selection  
The LC filter used as the output filter has double pole at:  
1
F =  
P
2p LOUT ´ COUT  
(4)  
13  
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At low frequencies, the overall loop gain is set by the output set-point resistor divider network and the internal  
gain of the device. The low frequency phase is 180 degrees. At the output filter pole frequency, the gain rolls off  
at a –40 dB per decade rate and the phase drops rapidly. D-CAP2™ introduces a high frequency zero that  
reduces the gain roll off to –20 dB per decade and increases the phase to 90 degrees one decade above the  
zero frequency. The inductor and capacitor for the output filter must be selected so that the double pole of 公式 4  
is located below the high frequency zero but close enough that the phase boost provided be the high frequency  
zero provides adequate phase margin for a stable circuit. To meet this requirement use the values recommended  
in 2.  
2. TPS562210A Recommended Component Values  
L1 (µH)  
Output Voltage (V)  
R2 (kΩ)  
R3 (kΩ)  
C6 + C7 + C8 (µF)  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
2.2  
2.2  
3.3  
3.3  
TYP  
2.2  
2.2  
2.2  
2.2  
2.2  
3.3  
3.3  
4.7  
4.7  
MAX  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
1
1.05  
1.2  
1.5  
1.8  
2.5  
3.3  
5
3.09  
3.74  
5.76  
9.53  
13.7  
22.6  
33.2  
54.9  
75  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
6.5  
The inductor peak-to-peak ripple current, peak current and RMS current are calculated using 公式 5, 公式 6 and  
公式 7. The inductor saturation current rating must be greater than the calculated peak current and the RMS or  
heating current rating must be greater than the calculated RMS current.  
Use 650 kHz for fSW. Make sure the chosen inductor is rated for the peak current of 公式 6 and the RMS current  
of 公式 7.  
V
- VOUT  
VOUT  
´
IN(MAX)  
IlP-P  
=
V
LO ´ ƒSW  
IN(MAX)  
(5)  
(6)  
IlP-P  
IlPEAK = IO +  
2
1
2
2
ILO(RMS)  
=
IO  
+
IlP-P  
12  
(7)  
For this design example, the calculated peak current is 2.34 A and the calculated RMS current is 2.01 A. The  
inductor used is a TDK CLF7045T-2R2N with a peak current rating of 5.5 A and an RMS current rating of 4.3 A.  
The capacitor value and ESR determines the amount of output voltage ripple. The TPS562210A and  
TPS563210A are intended for use with ceramic or other low ESR capacitors. Recommended values range from  
20µF to 68µF. Use 公式 8 to determine the required RMS current rating for the output capacitor.  
VOUT ´ VIN - VOUT  
(
12 ´ V ´LO ´ ƒSW  
)
ICO(RMS)  
=
IN  
(8)  
For this design, two TDK C3216X5R0J226M 22 µF output capacitors are used. The typical ESR is 2 mΩ each.  
The calculated RMS current is 0.286A and each output capacitor is rated for 4A.  
8.2.1.2.3 Input Capacitor Selection  
The TPS562210A and TPS563210A require an input decoupling capacitor and a bulk capacitor is needed  
depending on the application. A ceramic capacitor over 10 µF is recommended for the decoupling capacitor. An  
additional 0.1 µF capacitor (C3) from pin 3 to ground is optional to provide additional high frequency filtering. The  
capacitor voltage rating needs to be greater than the maximum input voltage.  
14  
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8.2.1.2.4 Bootstrap capacitor Selection  
A 0.1µF ceramic capacitor must be connected between the VBST to SW pin for proper operation. It is  
recommended to use a ceramic capacitor.  
8.2.1.3 Application Curves  
The following application curves were generated using the application circuit of 17.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN = 5V  
VIN = 12V  
VIN = 5V  
VIN = 12V  
0
0
4
0.5  
1
1.5  
2
0.001  
0.01 0.02 0.05 0.1 0.2  
Output Current (A)  
0.5  
1
2 3 45  
Output Current (A)  
D006  
D007  
18. TPS562210A Efficiency  
19. TPS562210A Light Load Efficiency  
1
0.8  
0.6  
0.4  
0.2  
0
1
0.8  
0.6  
0.4  
0.2  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1  
-0.2  
-0.4  
-0.6  
-0.8  
-1  
0.5  
1
1.5  
2
0
0.5  
1
1.5  
2
Output Current (A)  
Output Current (A)  
D008  
D009  
20. TPS562210A Load Regulation, VI = 5 V  
21. TPS562210A Load Regulation, VI = 12 V  
0.5  
0.4  
0.3  
0.2  
0.1  
0
IO = 2 A  
VI = 50 mV / div (ac coupled)  
SW = 5 V / div  
-0.1  
-0.2  
-0.3  
-0.4  
-0.5  
6
8
10  
12  
14  
16  
18  
Time = 1 µsec / div  
23. TPS562210A Input Voltage Ripple  
Input Voltage (V)  
D010  
22. TPS562210A Line Regulation  
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IO = 200 mA  
IO = 0 A  
VO = 20 mV / div (ac coupled)  
VO = 20 mV / div (ac coupled)  
SW = 5 V / div  
SW = 5 V / div  
Time = 1 µsec / div  
Time = 5 msec / div  
24. TPS562210A Output Voltage Ripple  
25. TPS562210A Output Voltage Ripple  
IO = 2 A  
VO = 20 mV / div (ac coupled)  
VO = 50 mV / div (ac coupled)  
IO = 500 mA / div  
SW = 5 V / div  
Load step = 0.5 A - 1.5 A  
Slew rate = 500 mA / µsec  
Time = 200 µsec / div  
Time = 1 µsec / div  
27. TPS562210A Transient Response  
26. TPS562210A Output Voltage Ripple  
VI = 10V/ div  
SS = 5V/ div  
EN = 10V/ div  
SS = 5V/ div  
VO = 500mV/ div  
PG = 1V/ div  
VO = 500mV/ div  
PG = 1V/ div  
Time = 1 msec / div  
Time = 1 msec / div  
28. TPS562210A Start Up Relative To VI  
29. TPS562210A Start Up Relative To En  
16  
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VI = 10V/ div  
EN = 10V/ div  
SS = 5V/ div  
SS = 5V/ div  
VO = 500mV/ div  
VO = 500mV/ div  
PG = 1V/ div  
PG = 1V/ div  
Time = 5 msec / div  
30. TPS562210A Shut Down Relative To VI  
Time = 5 msec / div  
31. TPS562210A Shut Down Relative To EN  
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8.2.2 Typical Application, TPS563210A  
4.5-V To 17-V Input, 1.05-V Output Converter.  
U1  
TPS563210A  
L1 1.5uH  
VIN = 4.5 - 17 V  
C5  
VOUT = 1.05 V, 3 A  
3
7
8
VIN  
VIN  
EN  
VBST  
VOUT  
0.1µF  
R4  
100k  
R3 10.0k  
C1  
0.1µF  
C2  
10µF  
C3  
10µF  
C6  
22µF  
C7  
22µF  
C8  
22µF  
2
4
6
1
EN  
SW  
PG  
R1  
3.74k  
PG  
5
SS  
VFB  
GND  
C4  
8200pF  
R2  
10.0k  
32. TPS563210A 1.05 V / 3A Reference Design  
8.2.2.1 Design Requirements  
For this design example, use the parameters shown in 3.  
3. Design Parameters  
PARAMETER  
Input voltage range  
Output voltage  
VALUE  
4.5 V to 17 V  
1.05 V  
Output current  
3 A  
Output voltage ripple  
20 mVpp  
8.2.2.2 Detailed Design Procedures  
The detailed design procedure for TPS563210A is the same as for TPS562210A except for inductor selection.  
8.2.2.2.1 Output Filter Selection  
4. TPS563210A Recommended Component Values  
L1 (µH)  
Output Voltage (V)  
R2 (kΩ)  
R3 (kΩ)  
C6 + C7 + C8 (µF)  
MIN  
1.0  
1.0  
1.0  
1.0  
1.5  
1.5  
1.5  
2.2  
2.2  
TYP  
1.5  
1.5  
1.5  
1.5  
2.2  
2.2  
2.2  
3.3  
3.3  
MAX  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
4.7  
1
1.05  
1.2  
1.5  
1.8  
2.5  
3.3  
5
3.09  
3.74  
5.76  
9.53  
13.7  
22.6  
33.2  
54.9  
75  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
10.0  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
20 - 68  
6.5  
The inductor peak-to-peak ripple current, peak current and RMS current are calculated using 公式 9, 公式 10 and  
公式 11. The inductor saturation current rating must be greater than the calculated peak current and the RMS or  
heating current rating must be greater than the calculated RMS current. Use 650 kHz for ƒSW  
.
Use 650 kHz for ƒSW. Make sure the chosen inductor is rated for the peak current of 公式 10 and the RMS  
current of 公式 11.  
V
- VOUT  
VOUT  
´
IN(MAX)  
IlP-P  
=
V
LO ´ ƒSW  
IN(MAX)  
(9)  
18  
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IlP-P  
IlPEAK = IO +  
2
(10)  
(11)  
1
2
2
ILO(RMS)  
=
IO  
+
IlP-P  
12  
For this design example, the calculated peak current is 3.505 A and the calculated RMS current is 3.014 A. The  
inductor used is a TDK CLF7045T-1R5N with a peak current rating of 7.3-A and an RMS current rating of 4.9-A.  
The capacitor value and ESR determines the amount of output voltage ripple. The TPS563209 is intended for  
use with ceramic or other low ESR capacitors. Recommended values range from 20 μF to 68 μF. Use 公式 7 to  
determine the required RMS current rating for the output capacitor. For this design three TDK C3216X5R0J226M  
22 μF output capacitors are used. The typical ESR is 2 mΩ each. The calculated RMS current is 0.292A and  
each output capacitor is rated for 4 A.  
8.2.2.3 Application Curves  
The following application curves were generated using the application circuit of 32.  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN = 5V  
VIN = 12V  
VIN = 5V  
VIN = 12V  
0
0.5  
1
1.5  
2
2.5  
3
0.001  
0.01 0.02 0.05 0.1 0.2  
Output Current (A)  
0.5  
1
2 3 45  
Output Current (A)  
D001  
D002  
33. TPS563210A Efficiency  
34. TPS563210A Light Load Efficiency  
1
0.8  
0.6  
0.4  
0.2  
0
1
0.8  
0.6  
0.4  
0.2  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1  
-0.2  
-0.4  
-0.6  
-0.8  
-1  
0
0.5  
1
1.5  
2
2.5  
3
0
0.5  
1
1.5  
2
2.5  
3
Output Current (A)  
Output Current (A)  
D003  
D004  
35. TPS563210A Load Regulation, VI = 5 V  
36. TPS563210A Load Regulation, VI = 12 V  
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0.5  
0.4  
0.3  
0.2  
0.1  
0
IO = 3 A  
VI = 50 mV / div (ac coupled)  
SW = 5 V / div  
-0.1  
-0.2  
-0.3  
-0.4  
-0.5  
4
6
8
10  
12  
14  
16  
18  
Time = 1 µsec / div  
Input Voltage (V)  
D005  
38. TPS563210A Input Voltage Ripple  
37. TPS563210A Line Regulation  
IO = 0 A  
IO = 300 mA  
VO = 20 mV / div (ac coupled)  
VO = 20 mV / div (ac coupled)  
SW = 5 V / div  
SW = 5 V / div  
Time = 1 µsec / div  
Time = 5 msec / div  
39. TPS563210A Output Voltage Ripple  
40. TPS563210A Output Voltage Ripple  
IO = 3 A  
VO = 20 mV / div (ac coupled)  
VO = 50 mV / div (ac coupled)  
SW = 5 V / div  
IO = 1 A / div  
Load step = 0.75 A - 2.25 A  
Slew rate = 500 mA / µsec  
Time = 200 µsec / div  
Time = 1 µsec / div  
42. TPS563210A Transient Response  
41. TPS563210A Output Voltage Ripple  
20  
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VI = 10V/ div  
EN = 10V/ div  
SS = 5V/ div  
SS = 5V/ div  
VO = 500mV/ div  
PG = 1V/ div  
VO = 500mV/ div  
PG = 1V/ div  
Time = 1 msec / div  
43. TPS563210A Start Up Relative To VI  
Time = 1 msec / div  
44. TPS563210A Start Up Relative To EN  
EN = 10V/ div  
VI = 10V/ div  
SS = 5V/ div  
SS = 5V/ div  
VO = 500mV/ div  
VO = 500mV/ div  
PG = 1V/ div  
PG = 1V/ div  
Time = 5 msec / div  
46. TPS563210A Shut Down Relative To EN  
Time = 5 msec / div  
45. TPS563210A Shut Down Relative To VI  
9 Power Supply Recommendations  
The TPS562210A and TPS563210A are designed to operate from input supply voltage in the range of 4.5 V to  
17 V. Buck converters require the input voltage to be higher than the output voltage for proper operation. The  
maximum recommended operating duty cycle is 65%. Using that criteria, the minimum recommended input  
voltage is VO / 0.65.  
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10 Layout  
10.1 Layout Guidelines  
1. VIN and GND traces should be as wide as possible to reduce trace impedance. The wide areas are also of  
advantage from the view point of heat dissipation.  
2. The input capacitor and output capacitor should be placed as close to the device as possible to minimize  
trace impedance.  
3. Provide sufficient vias for the input capacitor and output capacitor.  
4. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.  
5. Do not allow switching current to flow under the device.  
6. A separate VOUT path should be connected to the upper feedback resistor.  
7. Make a Kelvin connection to the GND pin for the feedback path.  
8. Voltage feedback loop should be placed away from the high-voltage switching trace, and preferably has  
ground shield.  
9. The trace of the VFB node should be as small as possible to avoid noise coupling.  
10. The GND trace between the output capacitor and the GND pin should be as wide as possible to minimize its  
trace impedance.  
10.2 Layout Example  
GND  
VOUT  
Additional  
Vias to the  
GND plane  
OUTPUT  
CAPACITOR  
Vias to the  
internal SW  
node copper  
BOOST  
CAPACITOR  
OUTPUT  
INDUCTOR  
FEEDBACK  
RESISTORS  
GND  
SW  
VIN  
SS  
VBST  
EN  
TO ENABLE  
CONTROL  
TPS56x10A  
VFB  
PG  
VIN  
Vias to the  
internal SW  
node copper  
HIGH FREQUENCY  
INPUT BYPASS  
CAPACITOR  
POWER GOOD  
SW node copper  
pour area on internal  
or bottom layer  
INPUT BYPASS  
CAPACITOR  
PG PULL UP  
RESISTOR  
SLOW START  
CAPACITOR  
VIA TO INTERNAL  
GROUND PLANE  
TO PG PULL  
UP VOLTAGE  
22  
版权 © 2016, Texas Instruments Incorporated  
TPS562210A, TPS563210A  
www.ti.com.cn  
ZHCSFR5 NOVEMBER 2016  
11 器件和文档支持  
11.1 器件支持  
11.2 相关链接  
下面的表格列出了快速访问链接。范围包括技术文档、支持和社区资源、工具和软件,以及样片或购买的快速访  
问。  
5. 相关链接  
器件  
产品文件夹  
请单击此处  
请单击此处  
样片与购买  
请单击此处  
请单击此处  
技术文档  
请单击此处  
请单击此处  
工具与软件  
请单击此处  
请单击此处  
支持与社区  
请单击此处  
请单击此处  
TPS562210A  
TPS563210A  
11.3 接收文档更新通知  
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册  
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。  
11.4 社区资源  
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective  
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of  
Use.  
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration  
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help  
solve problems with fellow engineers.  
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and  
contact information for technical support.  
11.5 商标  
D-CAP2, Eco-mode, E2E are trademarks of Texas Instruments.  
蓝光 (Blu-ray) 碟片 is a trademark of Blu-ray Disc Association.  
11.6 静电放电警告  
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可  
能会损坏集成电路。  
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可  
能会导致器件与其发布的规格不相符。  
11.7 Glossary  
SLYZ022 TI Glossary.  
This glossary lists and explains terms, acronyms, and definitions.  
12 机械、封装和可订购信息  
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对  
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。  
版权 © 2016, Texas Instruments Incorporated  
23  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan  
Lead finish/  
Ball material  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
(6)  
TPS562210ADDFR  
TPS562210ADDFT  
TPS563210ADDFR  
TPS563210ADDFT  
ACTIVE SOT-23-THIN  
ACTIVE SOT-23-THIN  
ACTIVE SOT-23-THIN  
ACTIVE SOT-23-THIN  
DDF  
DDF  
DDF  
DDF  
8
8
8
8
3000 RoHS & Green  
250 RoHS & Green  
3000 RoHS & Green  
250 RoHS & Green  
SN  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
2210A  
SN  
SN  
SN  
2210A  
3210A  
3210A  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance  
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may  
reference these types of products as "Pb-Free".  
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.  
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based  
flame retardants must also meet the <=1000ppm threshold requirement.  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6)  
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two  
lines if the finish value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
10-Dec-2020  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE OUTLINE  
DDF0008A  
SOT-23 - 1.1 mm max height  
S
C
A
L
E
4
.
0
0
0
PLASTIC SMALL OUTLINE  
C
2.95  
2.65  
SEATING PLANE  
TYP  
PIN 1 ID  
AREA  
0.1 C  
A
6X 0.65  
8
1
2.95  
2.85  
NOTE 3  
2X  
1.95  
4
5
0.38  
0.22  
8X  
0.1  
C A B  
1.65  
1.55  
B
1.1 MAX  
0.20  
0.08  
TYP  
SEE DETAIL A  
0.25  
GAGE PLANE  
0.1  
0.0  
0 - 8  
0.6  
0.3  
DETAIL A  
TYPICAL  
4222047/C 10/2022  
NOTES:  
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing  
per ASME Y14.5M.  
2. This drawing is subject to change without notice.  
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not  
exceed 0.15 mm per side.  
www.ti.com  
EXAMPLE BOARD LAYOUT  
DDF0008A  
SOT-23 - 1.1 mm max height  
PLASTIC SMALL OUTLINE  
8X (1.05)  
SYMM  
1
8
8X (0.45)  
SYMM  
6X (0.65)  
5
4
(R0.05)  
TYP  
(2.6)  
LAND PATTERN EXAMPLE  
SCALE:15X  
SOLDER MASK  
OPENING  
SOLDER MASK  
OPENING  
METAL UNDER  
SOLDER MASK  
METAL  
SOLDER MASK  
DEFINED  
NON SOLDER MASK  
DEFINED  
SOLDER MASK DETAILS  
4222047/C 10/2022  
NOTES: (continued)  
4. Publication IPC-7351 may have alternate designs.  
5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.  
www.ti.com  
EXAMPLE STENCIL DESIGN  
DDF0008A  
SOT-23 - 1.1 mm max height  
PLASTIC SMALL OUTLINE  
8X (1.05)  
SYMM  
(R0.05) TYP  
8
1
8X (0.45)  
SYMM  
6X (0.65)  
5
4
(2.6)  
SOLDER PASTE EXAMPLE  
BASED ON 0.125 mm THICK STENCIL  
SCALE:15X  
4222047/C 10/2022  
NOTES: (continued)  
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate  
design recommendations.  
7. Board assembly site may have different recommendations for stencil design.  
www.ti.com  
重要声明和免责声明  
TI“按原样提供技术和可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资源,  
不保证没有瑕疵且不做出任何明示或暗示的担保,包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担  
保。  
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任:(1) 针对您的应用选择合适的 TI 产品,(2) 设计、验  
证并测试您的应用,(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。  
这些资源如有变更,恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。  
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成  
本、损失和债务,TI 对此概不负责。  
TI 提供的产品受 TI 的销售条款ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改  
TI 针对 TI 产品发布的适用的担保或担保免责声明。  
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE  
邮寄地址:Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2022,德州仪器 (TI) 公司  

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