TPS60400-Q1 [TI]
UNREGULATED 60-mA CHARGE PUMP VOLTAGE INVERTER; 非稳压60毫安电荷泵电压逆变器型号: | TPS60400-Q1 |
厂家: | TEXAS INSTRUMENTS |
描述: | UNREGULATED 60-mA CHARGE PUMP VOLTAGE INVERTER |
文件: | 总25页 (文件大小:577K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢄ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢅꢄ ꢋꢆ ꢇ ꢈ
ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
D
Small 5-Pin SOT23 Package
features
D
Evaluation Module Available
TPS60400EVM−178
D
Qualification in Accordance With
AEC-Q100
†
D
Qualified for Automotive Applications
applications
D
Customer-Specific Configuration Control
Can Be Supported Along With
Major-Change Approval
D
LCD Bias
GaAs Bias for RF Power Amps
D
D
D
D
D
D
Inverts Input Supply Voltage
Up to 60-mA Output Current
Sensor Supply in Portable Instruments
Bipolar Amplifier Supply
Only Three Small 1-µF Ceramic Capacitors
Needed
DBV PACKAGE
(TOP VIEW)
D
Input Voltage Range From 1.6 V to 5.5 V
D
PowerSave-Mode for Improved Efficiency
at Low Output Currents (TPS60400)
1
2
3
5
C
FLY+
OUT
IN
D
D
Device Quiescent Current Typical 100 µA
Integrated Active Schottky-Diode for
Start-Up Into Load
4
GND
C
FLY−
†
Contact Texas Instruments for details. Q100 qualification data
available on request.
description
The TPS6040x is a family of devices that generate an unregulated negative output voltage from an input voltage
ranging from 1.6 V to 5.5 V. The devices are typically supplied by a preregulated supply rail of 5 V or 3.3 V. Due
to its wide input voltage range, two or three NiCd, NiMH, or alkaline battery cells, as well as one Li-Ion cell can
also power them.
Only three external 1-µF capacitors are required to build a complete dc/dc charge pump inverter. Assembled
2
in a 5-pin SOT23 package, the complete converter can be built on a 50-mm board area. Additional board area
and component count reduction is achieved by replacing the Schottky diode that is typically needed for start-up
into load by integrated circuitry.
The TPS6040x can deliver a maximum output current of 60 mA with a typical conversion efficiency of greater
than 90% over a wide output current range. Three device options with 20-kHz, 50-kHz, and 250-kHz fixed
frequency operation are available. One device comes with a variable switching frequency to reduce operating
current in applications with a wide load range and enables the design with low-value capacitors.
AVAILABLE OPTIONS
MARKING DBV
PACKAGE
TYPICAL FLYING CAPACITOR
PART NUMBER
FEATURE
[mF]
Variable switching frequency
50 kHz−250 kHz
TPS60400QDBVRQ1
AWP
1
TPS60401QDBVRQ1
TPS60402QDBVRQ1
TPS60403QDBVRQ1
AWQ
AWR
AWS
10
3.3
1
Fixed frequency 20 kHz
Fixed frequency 50 kHz
Fixed frequency 250 kHz
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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ꢡ ꢥ ꢢ ꢡꢛ ꢜꢯ ꢞꢝ ꢠ ꢨꢨ ꢦꢠ ꢟ ꢠ ꢔ ꢥ ꢡ ꢥ ꢟ ꢢ ꢪ
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range
from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage
because very small parametric changes could cause the device not to meet its published specifications. These devices have limited
built-in ESD protection.
typical application circuit
TPS60400
OUTPUT VOLTAGE
vs
INPUT VOLTAGE
C
1 µF
(fly)
0
−1
−2
−3
−4
−5
I
O
= 60 mA
3
5
I
O
= 30 mA
C
C
FLY+
FLY−
I
O
= 1 mA
TPS60400
Output
−1.6 V to −5 V,
Max 60 mA
2
1
Input
IN
OUT
1.6 V to 5.5 V
C
1 µF
C
O
1 µF
I
GND
4
T
A
= 25°C
0
1
2
3
4
5
V − Input Voltage − V
I
TPS60400 functional block diagram
V
I
V − VCFLY+ < 0.5 V
I
R
S
V
I
Q
Start
FF
MEAS
DC_ Startup
V < 1 V
V
I
I
V
O
> V
be
V
O
Q1
Q
Q
+
OSC
CHG
V
O
Q4
V
Phase
Generator
O
C
(fly)
OSC
50 kHz
MEAS
B
Q2
Q3
Q5
V
O
> −1 V
GND
V
I
V
O
DC_ Startup
VCO_CONT
V / V
MEAS
I
O
V
O
< −V − V
be
I
2
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ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
Terminal Functions
TERMINAL
NAME NO.
I/O
DESCRIPTION
C
C
5
3
4
2
Positive terminal of the flying capacitor C
(fly)
FLY+
FLY−
Negative terminal of the flying capacitor C
Ground
(fly)
GND
IN
I
Supply input. Connect to an input supply in the 1.6-V to 5.5-V range. Bypass IN to GND with a capacitor that has the
same value as the flying capacitor.
OUT
1
O
Power output with V = −V
O I
Bypass OUT to GND with the output filter capacitor C .
O
detailed description
operating principle
The TPS60400, TPS60401 charge pumps invert the voltage applied to their input. For the highest performance,
use low equivalent series resistance (ESR) capacitors (e.g., ceramic). During the first half-cycle, switches S2
and S4 open, switches S1 and S3 close, and capacitor (C ) charges to the voltage at V . During the second
(fly)
I
half-cycle, S1 and S3 open, S2 and S4 close. This connects the positive terminal of C
to GND and the
(fly)
negative to V By connecting C
in parallel, C is charged negative. The actual voltage at the output is more
positive than −V , since switches S1–S4 have resistance and the load drains charge from C .
O.
(fly)
O
I
O
V
I
S1
S2
C
(fly)
S4
V
O
(−V )
I
1 µF
C
1 µF
O
S3
GND
GND
Figure 1. Operating Principle
charge-pump output resistance
The TPS6040x devices are not voltage regulators. The charge pumps output source resistance is
approximately 15 Ω at room temperature (with V = 5 V), and V approaches –5 V when lightly loaded. V will
I
O
O
droop toward GND as load current increases.
V = −(V – R × I )
O
I
O
O
(1)
1
) 4ǒ2R
CFLYǓ) ESR
CO
R
[
) ESR
O
SWITCH
ƒosc C
(fly)
R
= output resistance of the converter
O
3
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ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
detailed description (continued)
efficiency considerations
The power efficiency of a switched-capacitor voltage converter is affected by three factors: the internal losses
in the converter IC, the resistive losses of the capacitors, and the conversion losses during charge transfer
between the capacitors. The internal losses are associated with the IC’s internal functions, such as driving the
switches, oscillator, etc. These losses are affected by operating conditions such as input voltage, temperature,
and frequency. The next two losses are associated with the voltage converter circuit’s output resistance. Switch
losses occur because of the on-resistance of the MOSFET switches in the IC. Charge-pump capacitor losses
occur because of their ESR. The relationship between these losses and the output resistance is as follows:
2
P
R
+ P
= I × R
CAPACITOR LOSSES
CONVERSION LOSSES
O
O
= resistance of a single MOSFET-switch inside the converter
= oscillator frequency
SWITCH
f
OSC
The first term is the effective resistance from an ideal switched-capacitor circuit. Conversion losses occur during
the charge transfer between C
and C when there is a voltage difference between them. The power loss is:
(fly)
O
(2)
1
2
1
2
I
2
2
(fly)ǒV
Ǔ) C ǒV
RIPPLE
Ǔ
ƫ
O RIPPLE
+ ƪ
P
C
* V
* 2V V
ƒ
osc
CONV.LOSS
O
2
O
The efficiency of the TPS6040x devices is dominated by their quiescent supply current at low output current and
by their output impedance at higher current.
I
I
R
O
O
O
h ^
ǒ
1 *
Ǔ
I
) I
V
I
O
Q
Where, I = quiescent current.
Q
capacitor selection
To maintain the lowest output resistance, use capacitors with low ESR (see Table 1). The charge-pump output
resistance is a function of C ’s and C ’s ESR. Therefore, minimizing the charge-pump capacitor’s ESR
(fly)
O
minimizes the total output resistance. The capacitor values are closely linked to the required output current and
the output noise and ripple requirements. It is possible to only use 1-µF capacitors of the same type.
input capacitor (C )
I
Bypass the incoming supply to reduce its ac impedance and the impact of the TPS6040x switching noise. The
recommended bypassing depends on the circuit configuration and where the load is connected. When the
inverter is loaded from OUT to GND, current from the supply switches between 2 x I and zero. Therefore, use
O
a large bypass capacitor (e.g., equal to the value of C ) if the supply has high ac impedance. When the inverter
(fly)
is loaded from IN to OUT, the circuit draws 2 × I constantly, except for short switching spikes. A 0.1-µF bypass
O
capacitor is sufficient.
flying capacitor (C
)
(fly)
Increasing the flying capacitor’s size reduces the output resistance. Small values increases the output
resistance. Above a certain point, increasing C ’s capacitance has a negligible effect, because the output
(fly)
resistance becomes dominated by the internal switch resistance and capacitor ESR.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
detailed description (continued)
output capacitor (C )
O
Increasing the output capacitor’s size reduces the output ripple voltage. Decreasing its ESR reduces both output
resistance and ripple. Smaller capacitance values can be used with light loads if higher output ripple can be
tolerated. Use the following equation to calculate the peak-to-peak ripple.
I
O
C
V
+
) 2 I ESR
O(ripple)
O
CO
f
osc
o
Table 1. Recommended Capacitor Values
V
I
C
C
C
O
[µF]
I
O
(fly)
I
DEVICE
[V]
[mA]
[µF]
[µF]
1
TPS60400
TPS60401
TPS60402
TPS60403
1.8…5.5
1.8…5.5
1.8…5.5
1.8…5.5
60
1
1
60
10
3.3
1
10
3.3
1
10
3.3
1
60
60
Table 2. Recommended Capacitors
MANUFACTURER
PART NUMBER
SIZE
CAPACITANCE
TYPE
Taiyo Yuden
EMK212BJ474MG
LMK212BJ105KG
LMK212BJ225MG
EMK316BJ225KL
LMK316BJ475KL
JMK316BJ106KL
0805
0805
0805
1206
1206
1206
0.47 µF
1 µF
2.2 µF
2.2 µF
4.7 µF
10 µF
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
Ceramic
TDK
C2012X5R1C105M
C2012X5R1A225M
C2012X5R1A335M
0805
0805
0805
1 µF
2.2 µF
3.3 µF
Ceramic
Ceramic
Ceramic
Table 3 contains a list of manufacturers of the recommended capacitors. Ceramic capacitors will provide the
lowest output voltage ripple because they typically have the lowest ESR-rating.
Table 3. Recommended Capacitor Manufacturers
MANUFACTURER
Taiyo Yuden
TDK
CAPACITOR TYPE
X7R/X5R ceramic
X7R/X5R ceramic
X7R/X5R ceramic
X7R/X5R ceramic
INTERNET
www.t-yuden.com
www.component.tdk.com
www.vishay.com
Vishay
Kemet
www.kemet.com
5
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ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Voltage range: IN to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 5.5 V
OUT to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −5 V to 0.3 V
C
C
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to (V − 0.3 V)
FLY−
FLY+
O
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to (V + 0.3 V)
I
Continuous power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Continuous output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 mA
Electrostatic Discharge (Machine Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . passed 50 V
(Human Body Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . passed 2 kV
(Charged Device Model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . passed 1 kV
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
stg
Maximum junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
DISSIPATION RATING TABLE
T
< 25°C
DERATING FACTOR
T
= 70°C
T = 85°C
A
POWER RATING
A
A
PACKAGE
POWER RATING
ABOVE T = 25°C
POWER RATING
A
DBV
437 mW
3.5 mW/°C
280 mW
227 mW
recommended operating conditions
MIN NOM
MAX
UNIT
V
Input voltage range, V
1.8
5.25
60
I
Output current range at OUT, I
mA
µF
O
Input capacitor, C
0
C
I
(fly)
1
Flying capacitor, C
(fly)
µF
Output capacitor, C
1
100
125
µF
O
Operating junction temperature, T
−40
°C
J
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ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
electrical characteristics at C = C
recommended operating free-air temperature range (unless otherwise noted)
= C (according to Table 1), T = −40°C to 125°C, V = 5 V over
I
(fly)
O
J
I
PARAMETER
TEST CONDITIONS
MIN
1.8
1.6
60
TYP
MAX
UNIT
At T = −40°C to 125°C,
R
L
= 5 kΩ
= 5 kΩ
5.25
J
V
I
Supply voltage range
V
At T ≥ 0°C,
R
L
C
I
O
Maximum output current at V
Output voltage
mA
V
O
V
O
−V
I
TPS60400
TPS60401
TPS60402
TPS60403
TPS60400
TPS60401
TPS60402
TPS60403
TPS60400
TPS60401
TPS60402
TPS60403
C
C
C
C
= 1 µF, C = 2.2 µF
35
20
(fly)
(fly)
(fly)
(fly)
O
= C = 10 µF
O
V
Output voltage ripple
I
= 5 mA
mV
P−P
P−P
O
= C = 3.3 µF
20
O
= C = 1 µF
15
O
125
65
270
190
270
700
210
135
210
640
375
30
At V = 5 V
µA
µA
kHz
Ω
I
120
425
Quiescent current (no-load input
current)
I
Q
At T ≤ 60°C,
V = 5 V
I
J
TPS60400 VCO version
TPS60401
25 50−250
10
25
20
f
OSC
Internal switching frequency
TPS60402
TPS60403
50
250
12
75
325
15
115
TPS60400 C = C
= C = 1 µF
O
I
(fly)
(fly)
(fly)
(fly)
TPS60401 C = C
= C = 10 µF
12
15
I
O
Impedance at 25°C, V = 5 V
I
TPS60402 C = C
= C = 3.3 µF
12
15
I
O
TPS60403 C = C
= C = 1 µF
12
15
I
O
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ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
η
Efficiency
vs Output current at 3.3 V, 5 V
2, 3
TPS60400, TPS60401, TPS60402, TPS60403
I
Input current
vs Output current
4, 5
6, 7
I
TPS60400, TPS60401, TPS60402, TPS60403
I
S
Supply current
vs Input voltage
TPS60400, TPS60401, TPS60402, TPS60403
Output resistance
Output voltage
vs Input voltage at −40°C, 0°C, 25°C, 85°C
8, 9, 10,
11
TPS60400, C = C
= C = 1 µF
I
(fly)
(fly)
O
TPS60401, C = C
= C = 10 µF
O
I
TPS60402 , C = C
= C = 3.3 µF
I
I
(fly)
(fly)
O
TPS60403, C = C
= C = 1 µF
O
V
O
vs Output current at 25°C, V = 1.8 V, 2.5 V, 3.3 V, 5 V
IN
12, 13,
14, 15
TPS60400, C = C
= C = 1 µF
I
(fly)
(fly)
O
TPS60401, C = C
= C = 10 µF
O
I
TPS60402 , C = C
= C = 3.3 µF
I
I
(fly)
(fly)
O
TPS60403, C = C
= C = 1 µF
O
f
f
Oscillator frequency
Oscillator frequency
vs Temperature at V = 1.8 V, 2.5 V, 3.3 V, 5 V
I
16, 17,
18, 19
OSC
TPS60400, TPS60401, TPS60402, TPS60403
vs Output current TPS60400 at 2 V, 3.3 V, 5.0 V
20
OSC
Output ripple and noise
V = 5 V, I = 30 mA, C = C
= C = 1 µF (TPS60400)
21, 22
I
O
I
(fly)
(fly)
(fly)
(fly)
O
V = 5 V, I = 30 mA, C = C
= C = 10 µF (TPS60401)
I
I
O
O
O
I
I
I
O
V = 5 V, I = 30 mA, C = C
= C = 3.3 µF (TPS60402)
O
V = 5 V, I = 30 mA, C = C
= C = 1 µF (TPS60403)
I
O
TPS60400, TPS60401
EFFICIENCY
vs
TPS60402, TPS60403
EFFICIENCY
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
60
TPS60403
V = 5 V
I
TPS60400
V = 5 V
I
TPS60401
V = 5 V
I
TPS60402
V = 5 V
I
TPS60401
V = 3.3 V
I
TPS60403
V = 3.3 V
I
TPS60400
V = 3.3 V
TPS60402
V = 3.3 V
I
I
T
A
= 25°C
T = 25°C
A
0
10 20 30 40 50 60 70 80 90 100
0
10 20 30 40 50 60 70 80 90 100
I
O
− Output Current − mA
I
O
− Output Current − mA
Figure 2
Figure 3
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ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
TPS60400, TPS60401
INPUT CURRENT
vs
TPS60402, TPS60403
INPUT CURRENT
vs
OUTPUT CURRENT
OUTPUT CURRENT
100
10
1
100
10
1
T
A
= 25°C
T
= 25°C
A
TPS60400
V = 5 V
I
TPS60403
V = 5 V
I
TPS60401
V = 5 V
I
TPS60403
V = 2 V
I
TPS60401
V = 2 V
I
TPS60402
V = 5 V
I
TPS60400
TPS60402
V = 2 V
I
V = 2 V
I
0.1
0.1
0.1
0.1
1
10
100
1
10
100
I
O
− Output Current − mA
I
O
− Output Current − mA
Figure 4
Figure 5
TPS60400, TPS60401
SUPPLY CURRENT
vs
TPS60402, TPS60403
SUPPLY CURRENT
vs
INPUT VOLTAGE
INPUT VOLTAGE
0.6
0.4
0.2
0
0.6
0.4
I
T
= 0 mA
= 25°C
I
T
= 0 mA
= 25°C
O
A
O
A
TPS60403
0.2
TPS60400
TPS60402
4
TPS60401
4
0
0
1
2
3
5
0
1
2
3
5
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 6
Figure 7
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ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
TPS60401
OUTPUT RESISTANCE
vs
TPS60400
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
INPUT VOLTAGE
40
35
30
25
20
15
10
5
40
35
30
25
20
15
10
I
= 30 mA
O
I
I
= 30 mA
O
C = C
(fly)
= C = 10 µF
O
C = C
I
= C = 1 µF
(fly)
O
T
A
= 85°C
T
A
= 25°C
T
A
= 25°C
T
A
= 85°C
5
T
A
= −40°C
T
A
= −40°C
0
0
1
1
2
3
4
5
6
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 8
Figure 9
TPS60402
OUTPUT RESISTANCE
vs
TPS60403
OUTPUT RESISTANCE
vs
INPUT VOLTAGE
INPUT VOLTAGE
40
35
30
25
20
15
10
40
35
30
25
20
15
10
I
= 30 mA
I
= 30 mA
O
I
O
I
C = C
(fly)
= C = 3.3 µF
C = C
(fly)
= C = 1 µF
O
O
T
A
= 25°C
T
A
= 25°C
T
= 85°C
A
T
= 85°C
A
T
A
= −40°C
5
0
5
0
T
A
= −40°C
1
2
3
4
5
6
1
2
3
4
5
6
V − Input Voltage − V
I
V − Input Voltage − V
I
Figure 10
Figure 11
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢄ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢅꢄ ꢋꢆ ꢇ ꢈ
ꢙ
ꢌ
ꢍ
ꢎ
ꢏ
ꢐ
ꢌ
ꢑ
ꢒꢀ
ꢏ
ꢓ
ꢃ
ꢄ
ꢆ
ꢔ
ꢒ
ꢕ
ꢖ
ꢒ
ꢎ
ꢐ
ꢏ
ꢁ
ꢌ
ꢗ
ꢁ
ꢘ
ꢑ
ꢀ
ꢒ
ꢐ
ꢏ
ꢚ
ꢍ
ꢘꢏ
ꢎ
ꢀ
ꢏ
ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
TPS60400
TPS60401
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT CURRENT
0
0
T
A
= 25°C
T
A
= 25°C
−1
−1
V = 1.8 V
I
V = 1.8 V
I
V = 2.5 V
V = 2.5 V
I
I
−2
−3
−4
−5
−6
−2
−3
−4
−5
−6
V = 3.3 V
I
V = 3.3 V
I
V = 5 V
I
V = 5 V
I
0
10
I
20
30
40
50
60
0
10
20
30
40
50
60
− Output Current − mA
I
O
− Output Current − mA
O
Figure 12
Figure 13
TPS60403
TPS60402
OUTPUT VOLTAGE
vs
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
OUTPUT CURRENT
0
0
T
A
= 25°C
T
A
= 25°C
−1
−1
V = 1.8 V
I
V = 1.8 V
I
V = 2.5 V
V = 2.5 V
I
I
−2
−3
−4
−5
−6
−2
−3
−4
−5
−6
V = 3.3 V
V = 3.3 V
I
I
V = 5 V
I
V = 5 V
I
0
10
20
30
40
50
60
0
10
20
30
40
50
60
I
O
− Output Current − mA
I
O
− Output Current − mA
Figure 14
Figure 15
11
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ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
TPS60401
OSCILLATOR FREQUENCY
vs
TPS60400
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
24
23.8
23.6
23.4
23.2
23
250
I
O
= 10 mA
I
O
= 10 mA
V = 1.8 V
I
200
150
100
V = 3.3 V
I
V = 5 V
I
V = 2.5 V
I
V = 3.3 V
I
V = 2.5 V
I
22.8
22.6
22.4
V = 5 V
I
V = 1.8 V
I
50
0
22.2
22
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
Figure 16
Figure 17
TPS60403
TPS60402
OSCILLATOR FREQUENCY
vs
OSCILLATOR FREQUENCY
vs
FREE-AIR TEMPERATURE
FREE-AIR TEMPERATURE
250
240
230
220
210
200
190
180
170
57
56
55
54
53
52
51
V = 5 V
I
I
O
= 10 mA
V = 3.3 V
I
V = 5 V
I
V = 2.5 V
I
V = 3.3 V
I
V = 1.8 V
I
V = 2.5 V
I
V = 1.8 V
I
50
49
I
= 10 mA
160
150
O
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
T
A
− Free-Air Temperature − °C
T
A
− Free-Air Temperature − °C
Figure 18
Figure 19
12
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ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
TYPICAL CHARACTERISTICS
TPS60400
TPS60401, TPS60402
OSCILLATOR FREQUENCY
vs
OUTPUT VOLTAGE
vs
OUTPUT CURRENT
TIME
300
250
200
150
100
V = 5 V
I
T
= 25°C
A
I
O
= 30 mA
TPS60401
V = 3.3 V
I
V = 1.8 V
I
V = 5 V
I
50 mV/DIV
TPS60402
50
0
50 mV/DIV
0
10 20 30 40 50 60 70 80 90 100
20 µs/DIV
t − Time − µs
Figure 21
I
O
− Output Current − mA
Figure 20
TPS60400, TPS60403
OUTPUT VOLTAGE
vs
TIME
V = 5 V
I
O
I
= 30 mA
TPS60400
100 mV/DIV
TPS60403
50 mV/DIV
4 µs/DIV
t − Time − µs
Figure 22
13
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ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
voltage inverter
The most common application for these devices is a charge-pump voltage inverter (see Figure 23). This
application requires only two external components; capacitors C and C , plus a bypass capacitor, if
(fly)
O
necessary. See the capacitor selection section for suggested capacitor types.
C
1 µF
(fly)
3
5
C1−
C1+
TPS60400
2
1
−5 V,
Max 60 mA
Input 5 V
IN
OUT
C
C
O
1 µF
I
GND
4
1 µF
Figure 23. Typical Operating Circuit
For the maximum output current and best performance, three ceramic capacitors of 1 µF (TPS60400,
TPS60403) are recommended. For lower currents or higher allowed output voltage ripple, other capacitors can
also be used. It is recommended that the output capacitors has a minimum value of 1 µF. With flying capacitors
lower than 1 µF, the maximum output power will decrease.
14
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ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢄ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢅꢄ ꢋꢆ ꢇ ꢈ
ꢙ
ꢌ
ꢍ
ꢎ
ꢏ
ꢐ
ꢌ
ꢑ
ꢒꢀ
ꢏ
ꢓ
ꢃ
ꢄ
ꢆ
ꢔ
ꢒ
ꢕ
ꢖ
ꢒ
ꢎ
ꢐ
ꢏ
ꢁ
ꢌ
ꢗ
ꢁ
ꢘ
ꢑ
ꢀ
ꢒ
ꢐ
ꢏ
ꢚ
ꢍ
ꢘꢏ
ꢎ
ꢀ
ꢏ
ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
RC-post filter
V
I
C
1 µF
(fly)
1
2
5
4
OUT
C1+
TPS60400
IN
R
P
3
V
O
(−V )
I
C1−
GND
C
1 µF
C
1 µF
C
P
I
O
GND
GND
Figure 24. TPS60400 and TPS60401 With RC-Post Filter
An output filter can easily be formed with a resistor (R ) and a capacitor (C ). Cutoff frequency is given by:
P
P
1
ƒ +
(1)
c
2pR C
P P
and ratio V /V
is:
O
OUT
V
O
1
Ť Ť
(2)
+ Ǹ
V
1 ) ǒ2pƒRPCPǓ2
OUT
V
O
with R = 50 Ω, C = 0.1 µF and f = 250 kHz: Ť Ť+ 0.125
P
P
V
OUT
The formula refers only to the relation between output and input of the ac ripple voltages of the filter.
LC-post filter
V
I
C
1 µF
(fly)
1
2
5
4
OUT
C1+
V
OUT
TPS60400
IN
L
P
3
V
O
(−V )
I
C1−
GND
C
1 µF
C
1 µF
C
P
I
O
GND
GND
Figure 25. LC-Post Filter
Figure 25 shows a configuration with a LC-post filter to further reduce output ripple and noise.
15
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ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
Table 4. Measurement Results on the TPS60400 (Typical)
C
[µF]
C
C
[µF]
C
P
I
(fly)
[µF]
O
BW = 500 MHz BW = 20 MHz
V
[V]
I
L
[µH]
V
POUT
I
O(2)
P
[µF]
V
V
POUT
[mV]
POUT
[mV]
[mA]
VACeff [mV]
V
V
P−P
240
CERAMIC CERAMIC CERAMIC
CERAMIC
P−P
320
5
5
5
5
5
5
60
60
60
60
60
60
1
1
1
1
1
1
1
1
1
1
1
1
1
2.2
1
65
32
58
60
30
8
120
260
220
120
50
240
200
200
100
28
0.1 (X7R)
0.1 (X7R)
0.1 (X7R)
0.1 (X7R)
1
0.1
0.1
0.1
2.2
10
rail splitter
V
I
C
1 µF
(fly)
C3
1 µF
1
2
5
4
OUT
C1+
TPS60400
IN
C1−
V
O
(−V )
I
3
GND
C
1 µF
I
C
1 µF
O
GND
GND
Figure 26. TPS60400 as a High-Efficiency Rail Splitter
A switched-capacitor voltage inverter can be configured as a high efficiency rail-splitter. This circuit provides a
bipolar power supply that is useful in battery powered systems to supply dual-rail ICs, like operational amplifiers.
Moreover, the SOT23-5 package and associated components require very little board space.
After power is applied, the flying capacitor (C ) connects alternately across the output capacitors C and C .
(fly)
3
O
This equalizes the voltage on those capacitors and draws current from V to V as required to maintain the
I
O
output at 1/2 V .
I
The maximum input voltage between V and GND in the schematic (or between IN and OUT at the device itself)
I
must not exceed 6.5 V.
16
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢄ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢅꢄ ꢋꢆ ꢇ ꢈ
ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
combined doubler/inverter
In the circuit of Figure 27, capacitors C , C , and C form the inverter, while C1 and C2 form the doubler. C1
I
(fly)
O
and C
are the flying capacitors; C and C2 are the output capacitors. Because both the inverter and doubler
(fly)
O
use part of the charge-pump circuit, loading either output causes both outputs to decline toward GND. Make
sure the sum of the currents drawn from the two outputs does not exceed 60 mA. The maximum output current at
V
must not exceed 30 mA. If the negative output is loaded, this current must be further reduced.
(pos)
I ≈ −I + 2 × I
I
O
O(POS)
V
I
C
1 µF
+
(fly)
C
D
2
1
1
2
5
4
OUT
C1+
V
(pos)
+
TPS60400
IN
C1−
−V
I
3
GND
+
+
C
1 µF
C
1 µF
I
O
C
2
+
GND
GND
Figure 27. TPS60400 as Doubler/Inverter
cascading devices
Two devices can be cascaded to produce an even larger negative voltage (see Figure 28). The unloaded output
voltage is normally −2 × V , but this is reduced slightly by the output resistance of the first device multiplied by the
I
quiescent current of the second. When cascading more than two devices, the output resistance rises
dramatically.
V
I
V
O
(−2 V )
I
C
1 µF
C
1 µF
(fly)
(fly)
1
2
1
2
5
4
5
4
OUT
C1+
OUT
C1+
TPS60400
TPS60400
IN
C1−
IN
C1−
3
3
GND
GND
+
C
1 µF
O
C
1 µF
C
O
1 µF
I
+
+
GND
GND
GND
Figure 28. Doubling Inverter
17
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ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
paralleling devices
Paralleling multiple TPS6040xs reduces the output resistance. Each device requires its own flying capacitor
(C ), but the output capacitor (C ) serves all devices (see Figure 29). Increase C ’s value by a factor of n,
(fly)
O
O
where n is the number of parallel devices. Equation 1 shows the equation for calculating output resistance.
V
I
C
1 µF
C
1 µF
(fly)
(fly)
1
2
1
2
5
4
5
4
OUT
C1+
OUT
C1+
TPS60400
TPS60400
V
O
(−V )
I
IN
IN
3
3
C1−
GND
C1−
GND
C
2.2 µF
O
C
1 µF
I
+
GND
GND
Figure 29. Paralleling Devices
active-Schottky diode
For a short period of time, when the input voltage is applied, but the inverter is not yet working, the output
capacitor is charged positive by the load. To prevent the output being pulled above GND, a Schottky diode must
be added in parallel to the output. The function of this diode is integrated into the TPS6040x devices, which gives
a defined startup performance and saves board space.
A current sink and a diode in series can approximate the behavior of a typical, modern operational amplifier.
Figure 30 shows the current into this typical load at a given voltage. The TPS6040x devices are optimized to
start into these loads.
V
I
C
1 µF
(fly)
+V
−V
Load Current
Typical
Load
5
3
C1+
C1−
60 mA
TPS60400
V
O
(−V )
I
2
OUT
0.4 V
IN
1
25 mA
I
O
C
1 µF
I
C
O
1 µF
GND
4
Voltage at the Load
0.4 V 1.25 V
5 V
GND
Figure 30. Typical Load
Figure 31. Maximum Start-Up Current
18
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢄ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈ ꢉ ꢀ ꢁꢂ ꢃꢄ ꢅꢄ ꢋꢆ ꢇ ꢈ
ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
shutting down the TPS6040x
If shutdown is necessary, use the circuit in Figure 32. The output resistance of the TPS6040x will typically be
15 Ω plus two times the output resistance of the buffer.
Connecting multiple buffers in parallel can reduce the output resistance of the buffer driving the IN pin.
V
I
V
O
(−V )
I
C
1 µF
(fly)
1
2
5
4
OUT
C1+
TPS60400
C
1 µF
O
IN
SDN
GND
3
C1−
GND
C
1 µF
I
GND
Figure 32. Shutdown Control
GaAs supply
A solution for a –2.7-V/3-mA GaAs bias supply is proposed in Figure 33. The input voltage of 3.3 V is first
inverted with a TPS60403 and stabilized using a TLV431 low-voltage shunt regulator. Resistor R with capacitor
P
C is used for filtering the output voltage.
P
R
P
V (3.3 V)
I
V
O
(−2.7 V/3 mA)
C
0.1 µF
(fly)
R2
R1
1
2
5
4
OUT
C1+
C
1 µF
C
P
O
TPS60400
IN
TLV431
3
C1−
GND
C
I
0.1 µF
GND
GND
Figure 33. GaAs Supply
R1
R2
+ * ǒ1 )
Ǔ
V
V * R1 I
ref
O
I(ref)
A 0.1-µF capacitor was selected for C
. By this, the output resistance of the inverter is about 52 Ω.
(fly)
19
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
GaAs supply (continued)
R
can be calculated using the following equation:
PMAX
V
* V
CO
O
R
+
ǒ
* R
Ǔ
PMAX
O
I
O
With: V
= −3.3 V; V = −2.7 V; I = −3 mA
O O
CO
R
= 200 Ω − 52 Ω = 148 Ω
PMAX
A 100-Ω resistor was selected for R .
P
The reference voltage across R2 is 1.24 V typical. With 5-µA current for the voltage divider, R2 gets:
1.24 V
5 mA
R2 +
R1 +
[ 250 kW
2.7 * 1.24 V
5 mA
[ 300 kW
With C = 1 µF the ratio V /V of the RC post filter is:
P
O
I
V
O
1
Ť Ť+
[ 0.01
V
2
I
Ǹ1 ) 2p125000Hz 100W 1 mF
(
)
step-down charge pump
By exchanging GND with OUT (connecting the GND pin with OUT and the OUT pin with GND), a step-down
charge pump can easily be formed. In the first cycle S1 and S3 are closed, and C with C in series are
(fly)
O
charged. Assuming the same capacitance, the voltage across C
and C is split equally between the
(fly)
O
capacitors. In the second cycle, S2 and S4 close and both capacitors with V /2 across are connected in parallel.
I
C
1 µF
(fly)
V
I
V
I
S1
1
2
5
4
C
+
OUT
C1+
(fly)
S4
TPS60400
GND
IN
1 µF
C
O
1 µF
3
S2
)
S3
V
O
(V )
I/2
C1−
GND
C
1 µF
I
C
O
1 µF
GND
V
O
(V )
I/2
V
O
(V
I/2
GND
Figure 35. Step-Down Charge Pump Connection
Figure 34. Step-Down Principle
The maximum input voltage between V and GND in the schematic (or between IN and OUT at the device itself)
I
must not exceed 6.5 V. For input voltages in the range of 6.5 V to 11 V, an additional Zener-diode is
recommended (see Figure 36).
20
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢄ
ꢄ
ꢆ
ꢇ
ꢈ
ꢉ
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢄ
ꢈ
ꢆ
ꢇ
ꢈ
ꢉ
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢄ
ꢊ
ꢌꢍ ꢎ ꢏꢐ ꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖꢒ ꢎꢐ ꢏ ꢁꢌꢗ ꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏ ꢎ ꢀꢏ ꢎ
ꢆ
ꢇ
ꢈ
ꢉ
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢄ
ꢋ
ꢆ
ꢇ
ꢈ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
5V6
V
I
C
1 µF
(fly)
1
2
5
4
OUT
C1+
TPS60400
IN
3
C1−
GND
V
O
− V
I
C
1 µF
C
O
1 µF
I
GND
GND
Figure 36. Step-Down Charge Pump Connection With Additional Zener Diode
power dissipation
As given in this data sheet, the thermal resistance of the unsoldered package is R
= 347°C/W. Soldered on
θJA
the EVM, a typical thermal resistance of R
= 180°C/W was measured.
θJA(EVM)
The terminal resistance can be calculated using the following equation:
T * T
J
A
R
+
qJA
P
D
Where:
T is the junction temperature.
J
T is the ambient temperature.
A
P is the power that needs to be dissipated by the device.
D
T * T
J
A
R
+
qJA
P
D
The maximum power dissipation can be calculated using the following equation:
P = V × I − V × I = V × (I + I ) − V × I
D
I
I
O
O
I(max)
O
(SUPPLY)
O
O
The maximum power dissipation happens with maximum input voltage and maximum output current.
At maximum load the supply current is 0.7 mA maximum.
P = 5 V × (60 mA + 0.7 mA) − 4.4 V × 60 mA = 40 mW
D
With this maximum rating and the thermal resistance of the device on the EVM, the maximum temperature rise
above ambient temperature can be calculated using the following equation:
∆T = R
× P = 180°C/W × 40 mW = 7.2°C
D
J
θJA
This means that the internal dissipation increases T by <10°C.
J
The junction temperature of the device shall not exceed 125°C.
This means the IC can easily be used at ambient temperatures up to:
T = T
− ∆T = 125°C/W − 10°C = 115°C
J
A
J(max)
21
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢄ ꢄ ꢆꢇꢈ ꢉ ꢀ ꢁ ꢂꢃ ꢄ ꢅ ꢄ ꢈ ꢆꢇ ꢈꢉ ꢀꢁ ꢂ ꢃ ꢄ ꢅ ꢄ ꢊ ꢆꢇ ꢈꢉ ꢀ ꢁꢂꢃ ꢄ ꢅ ꢄ ꢋ ꢆꢇ ꢈ
ꢌ ꢍꢎꢏ ꢐꢌꢑ ꢒꢀ ꢏꢓ ꢃ ꢄ ꢆꢔꢒ ꢕꢖ ꢒꢎꢐ ꢏ ꢁ ꢌꢗꢁ ꢘꢙ ꢑꢀꢒꢐ ꢏ ꢚꢍ ꢘꢏꢎ ꢀꢏ ꢎ
SGLS246 − JUNE 2004
APPLICATION INFORMATION
layout and board space
All capacitors should be soldered as close as possible to the IC. A PCB layout proposal for a single-layer board
is shown in Figure 37. Care has been taken to connect all capacitors as close as possible to the circuit to achieve
optimized output voltage ripple performance.
CFLY
IN
OUT
GND
U1
TPS60400
Figure 37. Recommended PCB Layout for TPS6040x (Top Layer)
device family products
Other inverting dc-dc converters from Texas Instruments are listed in Table 5.
Table 5. Product Identification
PART NUMBER
TPS6735
DESCRIPTION
Fixed negative 5-V, 200-mA inverting dc-dc converter
Adjustable 1-W inverting dc-dc converter
TPS6755
22
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
TPS60400QDBVRQ1
TPS60401QDBVRQ1
TPS60402QDBVRQ1
TPS60403QDBVRQ1
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
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