TPS61029QDPNRQ1 [TI]

符合 AEC-Q100 标准的 0.9V 至 5.5V 输入范围、1.8A 升压转换器 | DPN | 10 | -40 to 125;
TPS61029QDPNRQ1
型号: TPS61029QDPNRQ1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

符合 AEC-Q100 标准的 0.9V 至 5.5V 输入范围、1.8A 升压转换器 | DPN | 10 | -40 to 125

升压转换器
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TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
96% EFFICIENT SYNCHRONOUS BOOST CONVERTERS  
Check for Samples :TPS61029-Q1  
1
FEATURES  
DESCRIPTION  
2
Qualified for Automotive Applications  
96% Efficient Synchronous Boost Converter  
The TPS6102x devices provide a power supply  
solution for products powered by either a one-cell,  
two-cell, or three-cell alkaline, NiCd or NiMH, or  
one-cell Li-Ion or Li-polymer battery. Output currents  
can go as high as 200 mA while using a single-cell  
alkaline, and discharge it down to 0.9 V. It can also  
be used for generating 5 V at 500 mA from a 3.3-V  
rail or a Li-Ion battery. The boost converter is based  
on a fixed frequency, pulse-width-modulation (PWM)  
controller using a synchronous rectifier to obtain  
maximum efficiency. At low load currents the  
converter enters the Power Save mode to maintain a  
high efficiency over a wide load current range. The  
Power Save mode can be disabled, forcing the  
converter to operate at a fixed switching frequency.  
The maximum peak current in the boost switch is  
limited to a value of 800 mA, 1500 mA or 1800mA  
depending on the device version.  
Output Voltage Remains Regulated When  
Input Voltage Exceeds Nominal Output Voltage  
Device Quiescent Current: 25 µA (Typ)  
Input Voltage Range: 0.9 V to 6.5 V  
Fixed and Adjustable Output Voltage Options  
Up to 5.5 V  
Power Save Mode for Improved Efficiency at  
Low Output Power  
Low Battery Comparator  
Low EMI-Converter (Integrated Antiringing  
Switch)  
Load Disconnect During Shutdown  
Over-Temperature Protection  
Small 3-mm × 3-mm QFN-10 Package  
The TPS6102x devices keep the output voltage  
regulated even when the input voltage exceeds the  
nominal output voltage. The output voltage can be  
programmed by an external resistor divider, or is  
fixed internally on the chip. The converter can be  
disabled to minimize battery drain. During shutdown,  
the load is completely disconnected from the battery.  
A low-EMI mode is implemented to reduce ringing  
and, in effect, lower radiated electromagnetic energy  
when the converter enters the discontinuous  
conduction mode. The device is packaged in a 10-pin  
QFN PowerPAD™ package measuring 3 mm x 3 mm  
(DRC).  
APPLICATIONS  
All One-Cell, Two-Cell and Three-Cell Alkaline,  
NiCd or NiMH or Single-Cell Li Battery  
Powered Products  
Portable Audio Players  
PDAs  
Cellular Phones  
Personal Medical Products  
Camera White LED Flash Light  
L1  
V
O
VOUT  
FB  
SW  
6.8 µH  
3.3 V Up To  
200 mA  
C2  
2.2 µF  
C3  
47 µF  
VBAT  
R3  
R4  
R1  
R2  
C1  
10 µF  
EN  
0.9-V To  
6.5-V Input  
R5  
LBI  
PS  
LBO  
Low Battery  
Output  
GND  
PGND  
TPS61020  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
UNLESS OTHERWISE NOTED this document contains  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1) (2)  
NOMINAL  
OUTPUT  
VOLTAGE  
DC/DC  
SWITCH  
CURRENT  
LIMIT  
ORDERABLE PART  
NUMBER  
TOP-SIDE  
MARKING  
TJ  
PACKAGE  
3.3 V  
5 V  
1500 mA  
1500 mA  
1800 mA  
TPS61025QDRCRQ1  
TPS61027QDRCRQ1  
TPS61029QDRCRQ1  
PREVIEW  
–40°C to 125°C  
QFN – DRC  
Reel of 3000  
PREVIEW  
OES  
Adjustable  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)(1)  
Input voltage range on SW, VOUT, LBO, VBAT, PS, EN, FB, LBI  
Operating virtual junction temperature range, TJ  
Storage temperature range, Tstg  
–0.3 V to 7 V  
–40°C to 150°C  
–65°C to 150°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliabilitiy.  
DISSIPATION RATINGS TABLE  
THERMAL RESISTANCE  
POWER RATING  
A 25°C  
DERATING FACTOR ABOVE  
TA = 25°C  
PACKAGE  
θJA  
T
DRC  
48.7°C/W  
2054 mW  
21 mW/°C  
RECOMMENDED OPERATING CONDITIONS  
MIN  
0.9  
MAX  
6.5  
UNIT  
V
Supply voltage at VBAT, VI (TPS61025, TPS61027)  
Supply voltage at VBAT, VI (TPS61029)  
0.9  
5.5  
V
Operating virtual junction temperature range, TJ  
–40  
125  
°C  
2
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
ELECTRICAL CHARACTERISTICS  
over recommended junction temperature range and over recommended input voltage range (typical at an ambient  
temperature range of 25°C) (unless otherwise noted)  
DC/DC STAGE  
PARAMETER  
TEST CONDITIONS  
RL = 120  
MIN  
TYP  
MAX  
UNIT  
Minimum input voltage for start-up  
0.9  
1.2  
V
Input voltage range, after start-up (TPS61025,  
TPS61027)  
VI  
0.9  
6.5  
V
Input voltage range, after start-up (TPS61029)  
Output voltage range (TPS61029)  
Feedback voltage (TPS61025, TPS61027)  
Oscillator frequency  
0.9  
1.8  
5.5  
5.5  
V
VO  
VFB  
f
V
490  
500  
600  
510  
mV  
kHz  
mA  
mA  
mA  
mΩ  
mΩ  
480  
720  
ISW  
ISW  
Switch current limit (TPS61025, TPS61027)  
Switch current limit (TPS61029)  
Start-up current limit  
VOUT= 3.3 V  
VOUT= 3.3 V  
1200  
1500  
1500  
1800  
2100  
1800  
0.4 x ISW  
260  
SWN switch on resistance  
VOUT= 3.3 V  
VOUT= 3.3 V  
SWP switch on resistance  
290  
Total accuracy (including line and load regulation)  
Line regulation  
±3%  
0.6%  
0.6%  
3
Load regulation  
VBAT  
Quiescent current  
VOUT  
1
µA  
µA  
IO = 0 mA, VEN = VBAT = 1.2 V,  
VOUT = 3.3 V, TA = 25°C  
25  
45  
VEN = 0 V, VBAT = 1.2 V,  
TA = 25°C  
Shutdown current  
0.1  
1
µA  
CONTROL STAGE  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
VUVLO  
VIL  
Undervoltage lockout threshold  
LBI voltage threshold  
VLBI voltage decreasing  
0.8  
500  
10  
V
VLBI voltage decreasing  
490  
510  
mV  
mV  
µA  
V
LBI input hysteresis  
LBI input current  
EN = VBAT or GND  
VO = 3.3 V, IOI = 100 µA  
VLBO = 7 V  
0.01  
0.04  
0.01  
0.1  
0.4  
VOL  
Vlkg  
VIL  
LBO output low voltage  
LBO output leakage current  
EN, PS input low voltage  
EN, PS input high voltage  
EN, PS input current  
0.1  
µA  
V
0.2 × VBAT  
VIH  
0.8 × VBAT  
V
Clamped on GND or VBAT  
0.01  
140  
20  
0.1  
µA  
°C  
°C  
Overtemperature protection  
Overtemperature hysteresis  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
PIN ASSIGNMENTS  
DRC PACKAGE  
(TOP VIEW)  
EN  
VOUT  
FB  
PGND  
SW  
PS  
LBO  
LBI  
GND  
VBAT  
Terminal Functions  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
EN  
NO.  
1
I
I
Enable input (1/VBAT enabled, 0/GND disabled)  
Voltage feedback of adjustable versions  
Control / logic ground  
FB  
3
GND  
LBI  
5
7
I
Low battery comparator input (comparator enabled with EN), may not be left floating, should be connected to  
GND or VBAT if comparator is not used  
LBO  
4
8
O
I
Low battery comparator output (open drain)  
PS  
Enable/disable power save mode (1/VBAT disabled, 0/GND enabled)  
SW  
9
I
Boost and rectifying switch input  
PGND  
VBAT  
VOUT  
PowerPAD™  
10  
6
Power ground  
I
Supply voltage  
2
O
Boost converter output  
Must be soldered to achieve appropriate power dissipation. Should be connected to PGND.  
4
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
FUNCTIONAL BLOCK DIAGRAM (TPS61029)  
SW  
Backgate  
Control  
Anti-  
Ringing  
VBAT  
VOUT  
10 k  
20 pF  
VOUT  
V
max  
Control  
Gate  
Control  
PGND  
PGND  
PGND  
Error  
Amplifier  
_
+
Regulator  
FB  
+
_
V
ref  
= 0.5 V  
GND  
Control Logic  
Oscillator  
Temperature  
Control  
EN  
PS  
GND  
LBI  
LBO  
Low Battery  
Comparator  
_
+
+
_
V
ref  
= 0.5 V  
GND  
Copyright © 2009, Texas Instruments Incorporated  
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5
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
L1  
VOUT  
FB  
V
SW  
CC  
6.8 µH  
Boost Output  
C2  
2.2 µF  
C3  
47 µF  
VBAT  
R3  
R4  
R1  
R2  
C1  
10 µF  
Power  
Supply  
EN  
R5  
LBI  
PS  
LBO  
Control Output  
GND  
PGND  
List of Components:  
U1 = TPS6102xDRC  
TPS6102x  
L1 = EPCOS B82462−G4682  
C1, C2 = X7R/X5R Ceramic  
C3 = Low ESR Tantalum  
TYPICAL CHARACTERISTICS  
Table 1. Table of Graphs  
FIGURE  
Figure 1  
Figure 2  
Figure 3  
Figure 4  
Figure 5  
Figure 6  
Figure 7  
Figure 8  
Figure 9  
Figure 10  
Figure 11  
Figure 12  
Figure 13  
Figure 14  
Figure 15  
Figure 16  
Figure 17  
Figure 18  
Figure 19  
Maximum output current  
Efficiency  
vs Input voltage  
vs Output current (TPS61025)  
vs Output current (TPS61027)  
vs Input voltage (TPS61025)  
vs Input voltage (TPS61027)  
vs Output current (TPS61025)  
Output voltage  
vs Output current (TPS61027)  
No load supply current into VBAT  
No load supply current into VOUT  
vs Input voltage  
vs Input voltage  
Output voltage in continuous mode (TPS61025)  
Output voltage in continuous mode (TPS61027)  
Output voltage in power save mode (TPS61025)  
Output voltage in power save mode (TPS61027)  
Load transient response (TPS61025)  
Load transient response (TPS61027)  
Line transient response (TPS61025)  
Line transient response (TPS61027)  
Start-up after enable (TPS61025)  
Start-up after enable (TPS61027)  
Waveforms  
6
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
TPS61025  
EFFICIENCY  
vs  
MAXIMUM OUTPUT CURRENT  
vs  
INPUT VOLTAGE  
OUTPUT CURRENT  
1400  
1200  
1000  
800  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 3.3 V  
V
= 5 V  
O
O
VBAT = 2.4 V  
VBAT = 1.8 V  
VBAT = 0.9 V  
600  
400  
200  
0
V
= 1.8 V  
O
V
O
= 3.3 V  
0.9  
1.7  
2.5  
3.3  
4.1  
4.9  
5.7  
6.5  
1
10  
100  
1000  
V - Input Voltage - V  
I
I
O
- Output Current - mA  
Figure 1.  
Figure 2.  
TPS61027  
EFFICIENCY  
vs  
TPS61025  
EFFICIENCY  
vs  
OUTPUT CURRENT  
INPUT VOLTAGE  
100  
95  
100  
90  
80  
70  
60  
50  
40  
30  
20  
V
= 3.3 V  
O
I
= 100 mA  
O
90  
VBAT = 1.2 V  
85  
VBAT = 2.4 V  
VBAT = 3.6 V  
I
O
= 10 mA  
VBAT = 1.8 V  
80  
75  
I
= 250 mA  
O
70  
65  
60  
55  
50  
V
O
= 5 V  
10  
0
0.9  
1.4  
1.9  
2.4  
2.9  
3.4  
3.9  
4.4 4.9  
1
10  
100  
1000  
V - Input Voltage - V  
I
I
O
- Output Current - mA  
Figure 3.  
Figure 4.  
Copyright © 2009, Texas Instruments Incorporated  
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7
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
TPS61027  
EFFICIENCY  
vs  
TPS61025  
OUTPUT VOLTAGE  
vs  
INPUT VOLTAGE  
OUTPUT CURRENT  
100  
3.35  
3.30  
V
O
= 3.3 V  
I
O
= 100 mA  
95  
90  
85  
80  
75  
70  
65  
60  
55  
50  
I
O
= 10 mA  
VBAT = 2.4 V  
I
O
= 250 mA  
3.25  
3.20  
V
O
= 5 V  
1
10  
100  
1000  
0.9 1.4 1.9 2.4 2.9 3.4 3.9 4.4 4.9 5.4 5.9 6.4  
I
O
- Output Current - mA  
V - Input Voltage - V  
I
Figure 5.  
Figure 6.  
TPS61027  
OUTPUT VOLTAGE  
vs  
NO LOAD SUPPLY CURRENT INTO VBAT  
vs  
OUTPUT CURRENT  
INPUT VOLTAGE  
1.6  
1.4  
1.2  
1
5.10  
5.05  
5
T
A
= 85°C  
V
O
= 5 V  
VBAT = 3.6 V  
0.8  
4.95  
4.90  
T
A
= -40°C  
T
A
= 25°C  
0.6  
0.4  
4.85  
4.80  
0.2  
0
1
10  
100  
1000  
0.9 1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
I
O
- Output Current - mA  
V - Input Voltage - V  
I
Figure 7.  
Figure 8.  
8
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
NO LOAD SUPPLY CURRENT INTO VOUT  
vs  
TPS61025  
OUTPUT VOLTAGE IN CONTINUOUS MODE  
INPUT VOLTAGE  
34.8  
29.8  
V = 1.2 V,  
I
T
= 85°C  
= 25°C  
A
R
L
= 33 ,  
V
O
= 3.3 V  
24.8  
19.8  
14.8  
9.8  
T
A
= -40°C  
T
A
4.8  
-0.2  
0.9 1.5  
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
6.5  
t - Time - 1 µs/div  
V - Input Voltage - V  
I
Figure 9.  
Figure 10.  
TPS61025  
TPS61027  
OUTPUT VOLTAGE IN CONTINUOUS MODE  
OUTPUT VOLTAGE IN POWER SAVE MODE  
V = 1.2 V,  
I
R = 330 ,  
L
V
O
= 3.3 V  
V = 3.6 V,  
I
R
L
= 25 ,  
V
O
= 5 V  
t - Time - 50 µs/div  
t - Time - 1 µs/div  
Figure 11.  
Figure 12.  
Copyright © 2009, Texas Instruments Incorporated  
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Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
TPS61027  
OUTPUT VOLTAGE IN POWER SAVE MODE  
TPS61025  
LOAD TRANSIENT RESPONSE  
V = 3.6 V,  
I
R = 250 ,  
L
V
O
= 5 V  
V = 1.2 V,  
I
I = 100 mA to 200 mA,  
L
V
O
= 3.3 V  
t - Time - 50 µs/div  
t - Time - 2 ms/div  
Figure 13.  
Figure 14.  
TPS61027  
TPS61025  
LOAD TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
V = 1.8 V to 2.4 V,  
I
R
L
= 33 ,  
V
O
= 3.3 V  
V = 3.6 V,  
I
I = 100 mA to 200 mA,  
L
V
O
= 5 V  
t - Time - 2 ms/div  
t - Time - 2 ms/div  
Figure 15.  
Figure 16.  
10  
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Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
www.ti.com  
SLVSA31 NOVEMBER 2009  
TPS61027  
LINE TRANSIENT RESPONSE  
TPS61025  
START-UP AFTER ENABLE  
V = 3 V to 3.6 V,  
I
R = 25 ,  
L
V
O
= 5 V  
V = 2.4V,  
I
R = 33 ,  
L
O
V
= 3.3 V  
t - Time - 2 ms/div  
t - Time - 1 ms/div  
Figure 17.  
Figure 18.  
TPS61027  
START-UP AFTER ENABLE  
V = 3.6 V,  
I
R
= 50 W,  
= 5 V  
L
V
O
t - Time - 500 ms/div  
Figure 19.  
Copyright © 2009, Texas Instruments Incorporated  
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Product Folder Link(s) :TPS61029-Q1  
TPS61025-Q1  
TPS61027-Q1  
TPS61029-Q1  
SLVSA31 NOVEMBER 2009  
www.ti.com  
DETAILED DESCRIPTION  
CONTROLLER CIRCUIT  
The controller circuit of the device is based on a fixed frequency multiple feedforward controller topology. Input  
voltage, output voltage, and voltage drop on the NMOS switch are monitored and forwarded to the regulator. So  
changes in the operating conditions of the converter directly affect the duty cycle and must not take the indirect  
and slow way through the control loop and the error amplifier. The control loop, determined by the error amplifier,  
only has to handle small signal errors. The input for it is the feedback voltage on the FB pin or, at fixed output  
voltage versions, the voltage on the internal resistor divider. It is compared with the internal reference voltage to  
generate an accurate and stable output voltage.  
The peak current of the NMOS switch is also sensed to limit the maximum current flowing through the switch and  
the inductor. The typical peak current limit is set to 1500 mA. An internal temperature sensor prevents the device  
from getting overheated in case of excessive power dissipation.  
Synchronous Rectifier  
The device integrates an N-channel and a P-channel MOSFET transistor to realize a synchronous rectifier.  
Because the commonly used discrete Schottky rectifier is replaced with a low RDS(ON) PMOS switch, the power  
conversion efficiency reaches 96%. To avoid ground shift due to the high currents in the NMOS switch, two  
separate ground pins are used. The reference for all control functions is the GND pin. The source of the NMOS  
switch is connected to PGND. Both grounds must be connected on the PCB at only one point close to the GND  
pin. A special circuit is applied to disconnect the load from the input during shutdown of the converter. In  
conventional synchronous rectifier circuits, the backgate diode of the high-side PMOS is forward biased in  
shutdown and allows current flowing from the battery to the output. This device however uses a special circuit  
which takes the cathode of the backgate diode of the high-side PMOS and disconnects it from the source when  
the regulator is not enabled (EN = low).  
The benefit of this feature for the system design engineer is that the battery is not depleted during shutdown of  
the converter. No additional components have to be added to the design to make sure that the battery is  
disconnected from the output of the converter.  
Down Regulation  
In general, a boost converter only regulates output voltages which are higher than the input voltage. This device  
operates differently. For example, it is able to regulate 3.0 V at the output with two fresh alkaline cells at the input  
having a total cell voltage of 3.2 V. Another example is powering white LEDs with a forward voltage of 3.6 V from  
a fully charged Li-Ion cell with an output voltage of 4.2 V. To control these applications properly, a down  
conversion mode is implemented.  
If the input voltage reaches or exceeds the output voltage, the converter changes to the conversion mode. In this  
mode, the control circuit changes the behavior of the rectifying PMOS. It sets the voltage drop across the PMOS  
as high as needed to regulate the output voltage. This means the power losses in the converter increase. This  
has to be taken into account for thermal consideration. The down conversion mode is automatically turned off as  
soon as the input voltage falls about 50 mV below the output voltage. For proper operation in down conversion  
mode the output voltage should not be programmed below 50% of the maximum input voltage which can be  
applied.  
Device Enable  
The device is put into operation when EN is set high. It is put into a shutdown mode when EN is set to GND. In  
shutdown mode, the regulator stops switching, all internal control circuitry including the low-battery comparator is  
switched off, and the load is isolated from the input (as described in the Synchronous Rectifier Section). This  
also means that the output voltage can drop below the input voltage during shutdown. During start-up of the  
converter, the duty cycle and the peak current are limited in order to avoid high peak currents drawn from the  
battery.  
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Undervoltage Lockout  
An undervoltage lockout function prevents device start-up if the supply voltage on VBAT is lower than  
approximately 0.8 V. When in operation and the battery is being discharged, the device automatically enters the  
shutdown mode if the voltage on VBAT drops below approximately 0.8 V. This undervoltage lockout function is  
implemented in order to prevent the malfunctioning of the converter.  
Softstart and Short Circuit Protection  
When the device enables, the internal startup cycle starts with the first step, the precharge phase. During  
precharge, the rectifying switch is turned on until the output capacitor is charged to a value close to the input  
voltage. The rectifying switch is current limited during that phase. The current limit increases with the output  
voltage. This circuit also limits the output current under short circuit conditions at the output. Figure 20 shows the  
typical precharge current vs output voltage for specific input voltages:  
0.35  
VBAT = 5 V  
0.3  
0.25  
0.2  
VBAT = 3.6 V  
0.15  
VBAT = 2.4 V  
0.1  
VBAT = 1.8 V  
0.05  
VBAT = 1.2 V  
0
0
1.5  
0.5  
2.5  
3.5  
4.5  
1
2
3
4
5
V
O
− Output Voltage − V  
Figure 20. Precharge and Short Circuit Current  
After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below  
1.4 V the device works with a fixed duty cycle of 50% until the output voltage reaches 1.4 V. After that the duty  
cycle is set depending on the input output voltage ratio. Until the output voltage reaches its nominal value, the  
boost switch current limit is set to 40% of its nominal value to avoid high peak currents at the battery during  
startup. As soon as the output voltage is reached, the regulator takes control and the switch current limit is set  
back to 100%.  
Power Save Mode  
The PS pin can be used to select different operation modes. To enable power save, PS must be set low. Power  
save mode is used to improve efficiency at light load. In power save mode the converter only operates when the  
output voltage trips below a set threshold voltage. It ramps up the output voltage with one or several pulses and  
goes again into power save mode once the output voltage exceeds the set threshold voltage. This power save  
mode can be disabled by setting the PS to VBAT. In down conversion mode, power save mode is always active  
and the device cannot be forced into fixed frequency operation at light loads.  
Low Battery Detector Circuit—LBI/LBO  
The low-battery detector circuit is typically used to supervise the battery voltage and to generate an error flag  
when the battery voltage drops below a user-set threshold voltage. The function is active only when the device is  
enabled. When the device is disabled, the LBO pin is high-impedance. The switching threshold is 500 mV at LBI.  
During normal operation, LBO stays at high impedance when the voltage, applied at LBI, is above the threshold.  
It is active low when the voltage at LBI goes below 500 mV.  
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The battery voltage, at which the detection circuit switches, can be programmed with a resistive divider  
connected to the LBI pin. The resistive divider scales down the battery voltage to a voltage level of 500 mV,  
which is then compared to the LBI threshold voltage. The LBI pin has a built-in hysteresis of 10 mV. See the  
application section for more details about the programming of the LBI threshold. If the low-battery detection  
circuit is not used, the LBI pin should be connected to GND (or to VBAT) and the LBO pin can be left  
unconnected. Do not let the LBI pin float.  
Low-EMI Switch  
The device integrates a circuit that removes the ringing that typically appears on the SW node when the  
converter enters discontinuous current mode. In this case, the current through the inductor ramps to zero and the  
rectifying PMOS switch is turned off to prevent a reverse current flowing from the output capacitors back to the  
battery. Due to the remaining energy that is stored in parasitic components of the semiconductor and the  
inductor, a ringing on the SW pin is induced. The integrated antiringing switch clamps this voltage to VBAT and  
therefore dampens ringing.  
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APPLICATION INFORMATION  
DESIGN PROCEDURE  
The TPS6102x dc/dc converters are intended for systems powered by a single up to triple cell Alkaline, NiCd,  
NiMH battery with a typical terminal voltage between 0.9 V and 6.5 V. They can also be used in systems  
powered by one-cell Li-Ion or Li-Polymer with a typical voltage between 2.5 V and 4.2 V. Additionally, any other  
voltage source with a typical output voltage between 0.9 V and 6.5 V can power systems where the TPS6102x is  
used.  
PROGRAMMING THE OUTPUT VOLTAGE  
The output voltage of the TPS61020 dc/dc converter can be adjusted with an external resistor divider. The typical  
value of the voltage at the FB pin is 500 mV. The maximum recommended value for the output voltage is 5.5 V.  
The current through the resistive divider should be about 100 times greater than the current into the FB pin. The  
typical current into the FB pin is 0.01 µA, and the voltage across R4 is typically 500 mV. Based on those two  
values, the recommended value for R4 should be lower than 500 k, in order to set the divider current at 1 µA or  
higher. Because of internal compensation circuitry the value for this resistor should be in the range of 200 k.  
From that, the value of resistor R3, depending on the needed output voltage (VO), can be calculated using  
Equation 1:  
V
V
O
O
R3 + R4   
* 1 + 180 kW   
* 1  
ǒ Ǔ ǒ Ǔ  
V
500 mV  
FB  
(1)  
If as an example, an output voltage of 3.3 V is needed, a 1.0-Mresistor should be chosen for R3. If for any  
reason the value for R4 is chosen significantly lower than 200 kadditional capacitance in parallel to R3 is  
recommended, in case the device shows instable regulation of the output voltage. The required capacitance  
value can be easily calculated using Equation 2:  
200 kW  
R4  
ǒ
* 1Ǔ  
C
+ 20 pF   
parR3  
(2)  
L1  
V
CC  
VOUT  
FB  
SW  
Boost Output  
C2  
C3  
VBAT  
R3  
R4  
R1  
R2  
Power  
C1  
EN  
Supply  
R5  
LBI  
PS  
LBO  
Control Output  
GND  
PGND  
TPS61020  
Figure 21. Typical Application Circuit for Adjustable Output Voltage Option  
PROGRAMMING THE LBI/LBO THRESHOLD VOLTAGE  
The current through the resistive divider should be about 100 times greater than the current into the LBI pin. The  
typical current into the LBI pin is 0.01 µA, and the voltage across R2 is equal to the LBI voltage threshold that is  
generated on-chip, which has a value of 500 mV. The recommended value for R2 is therefore in the range of 500  
k. From that, the value of resistor R1, depending on the desired minimum battery voltage VBAT, can be  
calculated using Equation 3.  
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V
V
BAT  
LBI*threshold  
BAT  
R1 + R2   
* 1 + 390 kW   
* 1  
ǒ
Ǔ ǒ Ǔ  
V
500 mV  
(3)  
The output of the low battery supervisor is a simple open-drain output that goes active low if the dedicated  
battery voltage drops below the programmed threshold voltage on LBI. The output requires a pullup resistor with  
a recommended value of 1 M. If not used, the LBO pin can be left floating or tied to GND.  
INDUCTOR SELECTION  
A boost converter normally requires two main passive components for storing energy during the conversion. A  
boost inductor and a storage capacitor at the output are required. To select the boost inductor, it is  
recommended to keep the possible peak inductor current below the current limit threshold of the power switch in  
the chosen configuration. For example, the current limit threshold of the TPS6102xs switch is 1800 mA at an  
output voltage of 5 V. The highest peak current through the inductor and the switch depends on the output load,  
the input (VBAT), and the output voltage (VOUT). Estimation of the maximum average inductor current can be done  
using Equation 4:  
V
OUT  
  0.8  
I + I  
 
L
OUT  
V
BAT  
(4)  
For example, for an output current of 200 mA at 3.3 V, at least 920 mA of average current flows through the  
inductor at a minimum input voltage of 0.9 V.  
The second parameter for choosing the inductor is the desired current ripple in the inductor. Normally, it is  
advisable to work with a ripple of less than 20% of the average inductor current. A smaller ripple reduces the  
magnetic hysteresis losses in the inductor, as well as output voltage ripple and EMI. But in the same way,  
regulation time at load changes rises. In addition, a larger inductor increases the total system costs. With those  
parameters, it is possible to calculate the value for the inductor by using Equation 5:  
  ǒVOUT BATǓ  
V
–V  
BAT  
L +  
DI   ƒ   V  
L
OUT  
(5)  
Parameter f is the switching frequency and ΔIL is the ripple current in the inductor, i.e., 20% × IL. In this example,  
the desired inductor has the value of 5.5 µH. With this calculated value and the calculated currents, it is possible  
to choose a suitable inductor. In typical applications a 6.8 µH inductance is recommended. The device has been  
optimized to operate with inductance values between 2.2 µH and 22 µH. Nevertheless operation with higher  
inductance values may be possible in some applications. Detailed stability analysis is then recommended. Care  
has to be taken that load transients and losses in the circuit can lead to higher currents as estimated in  
Equation 5. Also, the losses in the inductor caused by magnetic hysteresis losses and copper losses are a major  
parameter for total circuit efficiency.  
The following inductor series from different suppliers have been used with the TPS6102x converters:  
Table 2. List of Inductors  
VENDOR  
INDUCTOR SERIES  
CDRH4D28  
CDRH5D28  
7447789  
Sumida  
Wurth Elektronik  
744042  
EPCOS  
B82462-G4  
SD25  
Cooper Electronics Technologies  
SD20  
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CAPACITOR SELECTION  
Input Capacitor  
At least a 10-µF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior  
of the total power supply circuit. A ceramic capacitor or a tantalum capacitor with a 100-nF ceramic capacitor in  
parallel, placed close to the IC, is recommended.  
Output Capacitor  
The major parameter necessary to define the output capacitor is the maximum allowed output voltage ripple of  
the converter. This ripple is determined by two parameters of the capacitor, the capacitance and the ESR. It is  
possible to calculate the minimum capacitance needed for the defined ripple, supposing that the ESR is zero, by  
using Equation 6:  
  ǒVOUT BATǓ  
I
* V  
OUT  
C
+
min  
ƒ   DV   V  
OUT  
(6)  
Parameter f is the switching frequency and ΔV is the maximum allowed ripple.  
With a chosen ripple voltage of 10 mV, a minimum capacitance of 24 µF is needed. The total ripple is larger due  
to the ESR of the output capacitor. This additional component of the ripple can be calculated using Equation 7:  
DV  
+ I  
  R  
ESR  
OUT  
ESR  
(7)  
An additional ripple of 16 mV is the result of using a tantalum capacitor with a low ESR of 80 m. The total ripple  
is the sum of the ripple caused by the capacitance and the ripple caused by the ESR of the capacitor. In this  
example, the total ripple is 26 mV. Additional ripple is caused by load transients. This means that the output  
capacitor has to completely supply the load during the charging phase of the inductor. A reasonable value of the  
output capacitance depends on the speed of the load transients and the load current during the load change.  
With the calculated minimum value of 24 µF and load transient considerations the recommended output  
capacitance value is in a 47 to 100 µF range. For economical reasons, this is usually a tantalum capacitor.  
Therefore, the control loop has been optimized for using output capacitors with an ESR of above 30 m. The  
minimum value for the output capacitor is 10 µF.  
SMALL SIGNAL STABILITY  
When using output capacitors with lower ESR, like ceramics, the adjustable voltage version is recommended.  
The missing ESR can be compensated in the feedback divider. Typically a capacitor in the range of 4.7 pF in  
parallel to R3 helps to obtain small signal stability with lowest ESR output capacitors. For more detailed analysis,  
the small signal transfer function of the error amplifier and the regulator, which is given in Equation 8, can be  
used:  
4   (R3 ) R4)  
R4   (1 ) i   w   0.9 ms)  
d
A
+
+
REG  
V
FB  
(8)  
LAYOUT CONSIDERATIONS  
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents  
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as  
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground  
tracks. The input capacitor, output capacitor, and the inductor should be placed as close as possible to the IC.  
Use a common ground node for power ground and a different one for control ground to minimize the effects of  
ground noise. Connect these ground nodes at any place close to one of the ground pins of the IC.  
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the  
control ground, it is recommended to use short traces as well, separated from the power ground traces. This  
avoids ground shift problems, which can occur due to superimposition of power ground current and control  
ground current.  
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APPLICATION EXAMPLES  
L1  
6.8 µH  
V
5 V  
CC  
VOUT  
FB  
SW  
Boost Output  
C2  
2.2 µF  
C3  
100 µF  
VBAT  
Battery  
Input  
R1  
C1  
EN  
10 µF  
R5  
LBI  
R2  
PS  
LBO  
LBO  
GND  
PGND  
TPS61027  
List of Components:  
U1 = TPS61027DRC  
L1 = EPCOS B82462-G4682  
C1, C2 = X7R,X5R Ceramic  
C3 = Low ESR Tantalum  
Figure 22. Power Supply Solution for Maximum Output Power Operating From a Single Alkaline Cell  
L1  
V
5 V  
CC  
VOUT  
FB  
SW  
6.8 µH  
Boost Output  
C2  
2.2 µF  
C3  
47 µF  
VBAT  
Battery  
Input  
R1  
C1  
EN  
10 µF  
R5  
LBI  
R2  
PS  
LBO  
LBO  
GND  
PGND  
TPS61027  
List of Components:  
U1 = TPS61027DRC  
L1 = EPCOS B82462-G4682  
C1, C2 = X7R,X5R Ceramic  
C3 = Low ESR Tantalum  
Figure 23. Power Supply Solution for Maximum Output Power Operating From a Dual/Triple Alkaline Cell  
or Single Li-Ion Cell  
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V
10 V  
CC2  
C5  
Unregulated  
Auxiliary Output  
DS1  
C6  
1 µF  
0.1 µF  
L1  
V
5 V  
SW  
CC1  
VOUT  
6.8 µH  
Boost Main Output  
C2  
2.2 µF  
C3  
47 µF  
VBAT  
EN  
Battery  
Input  
R1  
C1  
10 µF  
R5  
FB  
LBI  
R2  
PS  
LBO  
LBO  
GND  
PGND  
List of Components:  
U1 = TPS61027DRC1  
TPS61027  
L1 = EPCOS B82462-G4682  
C3, C5, C6, = X7R,X5R Ceramic  
C3 = Low ESR Tantalum  
DS1 = BAT54S  
Figure 24. Power Supply Solution With Auxiliary Positive Output Voltage  
V
-5 V  
CC2  
C5  
Unregulated  
Auxiliary Output  
DS1  
C6  
1 µF  
0.1 µF  
L1  
V
5 V  
SW  
CC1  
VOUT  
6.8 µH  
Boost Main Output  
C2  
2.2 µF  
C3  
47 µF  
VBAT  
EN  
Battery  
Input  
R1  
C1  
10 µF  
R5  
FB  
LBI  
R2  
PS  
LBO  
LBO  
GND  
PGND  
TPS61027  
List of Components:  
U1 = TPS61027DRC  
L1 = EPCOS B82462-G4682  
C1, C2, C5, C6 = X7R,X5R Ceramic  
C3 = Low ESR Tantalum  
DS1 = BAT54S  
Figure 25. Power Supply Solution With Auxiliary Negative Output Voltage  
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THERMAL INFORMATION  
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires  
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added  
heat sinks and convection surfaces, and the presence of other heat-generating components affect the  
power-dissipation limits of a given component.  
Three basic approaches for enhancing thermal performance are listed below.  
Improving the power dissipation capability of the PCB design  
Improving the thermal coupling of the component to the PCB  
Introducing airflow in the system  
The maximum recommended junction temperature (TJ) of the TPS6102x devices is 125°C. The thermal  
resistance of the 10-pin QFN 3 × 3 package (DRC) is RΘJA = 48.7°C/W, if the PowerPAD is soldered. Specified  
regulator operation is assured to a maximum ambient temperature TA of 85°C. Therefore, the maximum power  
dissipation is about 820 mW. More power can be dissipated if the maximum ambient temperature of the  
application is lower.  
T
* T  
J(MAX)  
R
A
125°C * 85°C  
48.7 °CńW  
P
+
+
+ 820 mW  
D(MAX)  
qJA  
(9)  
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PACKAGE OPTION ADDENDUM  
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16-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TPS61029QDRCRQ1  
ACTIVE  
SON  
DRC  
10  
3000 Green (RoHS & CU NIPDAU Level-3-260C-168 HR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS61029-Q1 :  
Catalog: TPS61029  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS61029QDRCRQ1  
SON  
DRC  
10  
3000  
330.0  
12.4  
3.3  
3.3  
1.1  
8.0  
12.0  
Q2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SON DRC 10  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 35.0  
TPS61029QDRCRQ1  
3000  
Pack Materials-Page 2  
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