TPS61041DRVTG4 [TI]
LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES; 低功耗DC / DC升压转换器采用SOT -23和儿子套餐型号: | TPS61041DRVTG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES |
文件: | 总27页 (文件大小:977K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS61040
TPS61041
www.ti.com
SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES
Check for Samples: TPS61040, TPS61041
1
FEATURES
DESCRIPTION
•
•
•
1.8-V to 6-V Input Voltage Range
The TPS61040/41 is
a
high-frequency boost
converter dedicated for small to medium LCD bias
supply and white LED backlight supplies. The device
is ideal to generate output voltages up to 28 V from a
dual cell NiMH/NiCd or a single cell Li-Ion battery.
The part can also be used to generate standard
3.3-V/5-V to 12-V power conversions.
Adjustable Output Voltage Range up to 28 V
400-mA (TPS61040) and 250-mA (TPS61041)
Internal Switch Current
•
•
•
•
•
Up to 1-MHz Switching Frequency
28-mA Typical No-Load Quiescent Current
1-mA Typical Shutdown Current
Internal Soft Start
The TPS61040/41 operates with
a
switching
frequency up to 1 MHz. This allows the use of small
external components using ceramic as well as
tantalum output capacitors. Together with the thin
SON package, the TPS61040/41 gives a very small
overall solution size. The TPS61040 has an internal
400 mA switch current limit, while the TPS61041 has
a 250-mA switch current limit, offering lower output
voltage ripple and allows the use of a smaller form
factor inductor for lower power applications. The low
quiescent current (typically 28 mA) together with an
optimized control scheme, allows device operation at
very high efficiencies over the entire load current
range.
Available in SOT23-5, TSOT23-5,
and 2 × 2 × 0.8-mm SON Packages
APPLICATIONS
•
•
•
•
•
•
•
LCD Bias Supply
White-LED Supply for LCD Backlights
Digital Still Camera
PDAs, Organizers, and Handheld PCs
Cellular Phones
Internet Audio Player
Standard 3.3-V/5-V to 12-V Conversion
DDC, DBV PACKAGE
(Top View)
DRV PACKAGE
(Top View)
1
2
3
5
4
1
2
3
6
5
4
GND
SW
NC
FB
V
SW
IN
V
IN
GND
EN
EN
FB
TYPICAL APPLICATION
EFFICIENCY
vs
OUTPUT CURRENT
90
88
86
84
82
80
78
76
74
72
70
L1
10 µH
V
= 18 V
D1
O
V = 5 V
I
V
V
OUT
V
IN
to 28 V
IN
1.8 V to 6 V
V = 3.6 V
I
C
FF
R1
1
3
2
5
4
V
SW
FB
IN
C
1 µF
O
V = 2.4 V
I
C
4.7 µF
IN
EN
GND
R2
0.1
1
10
100
I
− Output Current − mA
O
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2002–2010, Texas Instruments Incorporated
TPS61040
TPS61041
SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
(1)
Table 1. ORDERING INFORMATION
SWITCH CURRENT
LIMIT, mA
PACKAGE
MARKING
TA
PART NUMBER(2)
PACKAGE
TPS61040DBV
TPS61040DDC
TPS61041DBV
TPS61040DRV
TPS61041DRV
400
400
250
400
250
SOT23-5
TSOT23-5
SOT23-5
PHOI
QXK
PHPI
CCL
–40°C to
85°C
SON-6 2×2
SON-6 2×2
CAW
(1) For the most current package and ordering information, see the Package Option Addendum at the end
of this document, or see the TI website at www.ti.com.
(2) The devices are available in tape and reel and in tubes. Add R suffix to the part number (e.g.,
TPS61040DRVR) to order quantities of 3000 parts in tape and reel or add suffix T (e.g.,
TPS61040DRVT) to order a tube with 250 pieces..
FUNCTIONAL BLOCK DIAGRAM
SW
Under Voltage
Lockout
Bias Supply
400 ns Min
VIN
FB
Off Time
Error Comparator
-
S
Power MOSFET
N-Channel
+
RS Latch
Logic
Gate
Driver
V
REF
= 1.233 V
R
Current Limit
R
SENSE
+
_
6 µs Max
On Time
EN
Soft
Start
GND
2
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Product Folder Link(s): TPS61040 TPS61041
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
Table 2. Terminal Functions
TERMINAL
I/O
DESCRIPTION
DDC,
DBV NO.
NAME
EN
DRV NO.
This is the enable pin of the device. Pulling this pin to ground forces the device into shutdown
mode reducing the supply current to less than 1 mA. This pin should not be left floating and needs
to be terminated.
4
3
4
I
I
This is the feedback pin of the device. Connect this pin to the external voltage divider to program
the desired output voltage.
FB
3
GND
NC
2
–
1
5
–
–
Ground
No connection
Connect the inductor and the Schottky diode to this pin. This is the switch pin and is connected to
the drain of the internal power MOSFET.
SW
VIN
1
5
6
2
I
I
Supply voltage pin
DETAILED DESCRIPTION
OPERATION
The TPS61040/41 operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to
28 V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control.
This control scheme maintains high efficiency over the entire load current range, and with a switching frequency
up to 1 MHz, the device enables the use of very small external components.
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage
of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the
inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA (TPS61041).
See the Peak Current Control section for more information. The second criteria that turns off the switch is the
maximum on-time of 6 ms (typical). This is just to limit the maximum on-time of the converter to cover for extreme
conditions. As the switch is turned off the external Schottky diode is forward biased delivering the current to the
output. The switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the
reference voltage again. Using this PFM peak current control scheme the converter operates in discontinuous
conduction mode (DCM) where the switching frequency depends on the output current, which results in very high
efficiency over the entire load current range. This regulation scheme is inherently stable, allowing a wider
selection range for the inductor and output capacitor.
PEAK CURRENT CONTROL
The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA
(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current
exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:
V
IN
I
+ I
)
100 ns
peak(typ)
LIM
L
V
IN
I
I
+ 400 mA )
+ 250 mA )
100 ns for the TPS61040
peak(typ)
peak(typ)
L
V
IN
100 ns for the TPS61041
L
(1)
The higher the input voltage and the lower the inductor value, the greater the peak.
By selecting the TPS61040 or TPS61041, it is possible to tailor the design to the specific application current limit
requirements. A lower current limit supports applications requiring lower output power and allows the use of an
inductor with a lower current rating and a smaller form factor. A lower current limit usually has a lower output
voltage ripple as well.
Copyright © 2002–2010, Texas Instruments Incorporated
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
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SOFT START
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This
can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut
down.
I
LIM
4
The TPS61040/41 limits this inrush current by increasing the current limit in two steps starting from
for 256
I
LIM
2
cycles to
for the next 256 cycles, and then full current limit (see Figure 14).
ENABLE
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 mA (typical).
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the
output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should
not be left floating. Using a small external transistor disconnects the input from the output during shutdown as
shown in Figure 18.
UNDERVOLTAGE LOCKOUT
An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the
input voltage is below the undervoltage threshold, the main switch is turned off.
THERMAL SHUTDOWN
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based
on statistical means and is not tested during the regular mass production of the IC.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature (unless otherwise noted)
(1)
UNIT
(2)
Supply voltages on pin VIN
–0.3 V to 7 V
–0.3 V to VIN + 0.3 V
30 V
(2)
Voltages on pins EN, FB
Switch voltage on pin SW
(2)
Continuous power dissipation
Operating junction temperature
Storage temperature
See Dissipation Rating Table
–40°C to 150°C
TJ
Tstg
–65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
DISSIPATION RATING TABLE
DERATING
T
A ≤ 25°C
FACTOR
ABOVE
TA = 70°C
POWER RATING POWER RATING
TA = 85°C
PACKAGE
RqJA
POWER RATING
TA = 25°C
DBV
250°C/W
76°C/W
357 mW
3.5 mW/°C
13 mW/°C
192 mW
688 mW
140 mW
500 mW
DDC, DRV
1300 mW
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
RECOMMENDED OPERATING CONDITIONS
MIN
TYP
MAX UNIT
VIN
VOUT
L
Input voltage range
Output voltage range
Inductor(1)
1.8
6
V
V
28
2.2
10
mH
MHz
mF
mF
°C
f
Switching frequency(1)
1
(1)
CIN
COUT
TA
Input capacitor
4.7
(1)
Output capacitor
1
–40
–40
Operating ambient temperature
Operating junction temperature
85
TJ
125
°C
(1) See application section for further information.
ELECTRICAL CHARACTERISTICS
VIN = 2.4 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY CURRENT
VIN
Input voltage range
1.8
6
50
1
V
mA
mA
V
IQ
Operating quiescent current
Shutdown current
IOUT = 0 mA, not switching, VFB = 1.3 V
EN = GND
28
0.1
1.5
ISD
VUVLO
ENABLE
VIH
Under-voltage lockout threshold
1.7
EN high level input voltage
EN low level input voltage
EN input leakage current
1.3
V
V
VIL
0.4
1
II
EN = GND or VIN
0.1
mA
POWER SWITCH AND CURRENT LIMIT
Vsw
toff
Maximum switch voltage
Minimum off time
30
550
7.5
V
250
4
400
6
ns
ton
Maximum on time
ms
RDS(on)
RDS(on)
MOSFET on-resistance
MOSFET on-resistance
MOSFET leakage current
MOSFET current limit
MOSFET current limit
VIN = 2.4 V; ISW = 200 mA; TPS61040
VIN = 2.4 V; ISW = 200 mA; TPS61041
VSW = 28 V
600
750
1
1000
1250
10
mΩ
mΩ
mA
mA
mA
ILIM
TPS61040
350
215
400
250
450
285
ILIM
TPS61041
OUTPUT
VOUT
Vref
Adjustable output voltage range
Internal voltage reference
Feedback input bias current
Feedback trip point voltage
VIN
28
1
V
V
1.233
IFB
VFB = 1.3 V
mA
V
VFB
1.8 V ≤ VIN ≤ 6 V
1.208 1.233 1.258
1.8 V ≤ VIN ≤ 6 V; VOUT = 18 V; Iload = 10 mA;
CFF = not connected
(1)
Line regulation
0.05
0.15
%/V
Load regulation(1)
VIN = 2.4 V; VOUT = 18 V; 0 mA ≤ IOUT ≤ 30 mA
%/mA
(1) The line and load regulation depend on the external component selection. See the application section for further information.
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
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TYPICAL CHARACTERISTICS
Table 3. Table of Graphs
FIGURE
vs Load current
1, 2, 3
4
h
Efficiency
vs Input voltage
IQ
Quiescent current
Feedback voltage
Switch current limit
vs Input voltage and temperature
vs Temperature
5
VFB
ISW
6
vs Temperature
7
vs Supply voltage, TPS61041
vs Supply voltage, TPS61040
vs Temperature
8
ICL
Switch current limit
RDS(on)
9
10
11
12
13
14
RDS(on)
vs Supply voltage
Line transient response
Load transient response
Start-up behavior
EFFICIENCY
EFFICIENCY
vs
vs
OUTPUT CURRENT
LOAD CURRENT
90
88
86
84
82
80
78
76
74
72
70
90
88
86
84
82
80
78
76
74
72
70
V
O
= 18 V
L = 10 µH
= 18 V
V
O
V = 5 V
I
TPS61040
V = 3.6 V
I
TPS61041
V = 2.4 V
I
0.1
1
10
100
0.1
1
10
100
I
O
− Output Current − mA
I
L
− Load Current − mA
Figure 1.
Figure 2.
6
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
EFFICIENCY
vs
EFFICIENCY
vs
LOAD CURRENT
INPUT VOLTAGE
90
88
90
88
86
84
82
80
78
76
74
V
O
= 18 V
L = 10 µH
V
O
= 18 V
I
O
= 10 mA
86
84
82
L = 10 µH
I
O
= 5 mA
L = 3.3 µH
80
78
76
74
72
70
72
70
1
2
3
4
5
6
0.1
1
10
100
I
L
− Load Current − mA
V − Input Voltage − V
I
Figure 3.
Figure 4.
TPS61040
QUIESCENT CURRENT
vs
FEEDBACK VOLTAGE
vs
INPUT VOLTAGE
FREE-AIR TEMPERATURE
40
1.24
T
= 85°C
= 27°C
= −40°C
A
35
30
25
20
15
10
1.238
T
A
1.236
1.234
T
A
V
CC
= 2.4 V
1.232
1.23
5
0
1.8
2.4
3
3.6
4.2
4.8
5.4
6
−40 −20
0
20
40
60
80 100 120
T
A
− Temperature − °C
V − Input Voltage − V
I
Figure 5.
Figure 6.
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TPS61040/41
SWITCH CURRENT LIMIT
vs
TPS61041
CURRENT LIMIT
vs
FREE-AIR TEMPERATURE
SUPPLY VOLTAGE
260
258
256
254
252
430
TPS61040
410
390
370
350
330
310
290
T
A
= 27°C
250
248
246
244
270
TPS61041
250
242
240
230
1.8
2.4
3
3.6
4.2
4.8
5.4
6
−40−30−20−10 0 10 20 30 40 50 60 70 80 90
T − Temperature − °C
A
V
CC
− Supply Voltage − V
Figure 7.
Figure 8.
TPS61040
CURRENT LIMIT
vs
TPS61040/41
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
SUPPLY VOLTAGE
FREE-AIR TEMPERATURE
420
415
410
405
400
395
390
1200
1000
800
600
400
TPS61041
T
A
= 27°C
TPS61040
200
0
385
380
−40−30 −20 −10 0 10 20 30 40 50 60 70 80 90
1.8
2.4
3
3.6
4.2
4.8
5.4
6
T − Temperature − °C
A
V
CC
− Supply Voltage − V
Figure 9.
Figure 10.
8
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
TPS61040/41
STATIC DRAIN-SOURCE ON-STATE RESISTANCE
vs
SUPPLY VOLTAGE
1000
V
O
= 18 V
900
800
700
600
500
400
300
200
V
I
2.4 V to 3.4 V
TPS61041
TPS61040
V
O
100 mV/div
100
0
1.8
2.4
3
3.6
4.2
4.8
5.4
6
200 µS/div
V
CC
− Supply Voltage − V
Figure 11.
Figure 12. Line Transient Response
V
O
= 18 V
V
O
= 18 V
V
O
V
O
100 mA/div
5 V/div
EN
1 V/div
V
O
1 mA to 10 mA
I
I
50 mA/div
200 µS/div
Figure 13. Load Transient Response
Figure 14. Start-Up Behavior
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APPLICATION INFORMATION
INDUCTOR SELECTION, MAXIMUM LOAD CURRENT
Because the PFM peak current control scheme is inherently stable, the inductor value does not affect the stability
of the regulator. The selection of the inductor together with the nominal load current, input and output voltage of
the application determines the switching frequency of the converter. Depending on the application, inductor
values between 2.2 mH and 47 mH are recommended. The maximum inductor value is determined by the
maximum on time of the switch, typically 6 ms. The peak current limit of 400 mA/250 mA (typically) should be
reached within this 6-ms period for proper operation.
The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor
value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.
The maximum switching frequency is calculated by the following formula:
V
(V
* V
IN(min)
OUT
L V
IN)
fS
+
max
I
P
OUT
Where:
IP = Peak current as described in the Peak Current Control section
L = Selected inductor value
VIN(min) = The highest switching frequency occurs at the minimum input voltage
(2)
If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step
is to calculate the switching frequency at the nominal load current using the following formula:
2 I
(V
* V ) Vd)
load
OUT
IN
fSǒIloadǓ+
2
I
L
P
Where:
IP = Peak current as described in the Peak Current Control section
L = Selected inductor value
Iload = Nominal load current
Vd = Rectifier diode forward voltage (typically 0.3V)
A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.
(3)
The inductor value has less effect on the maximum available load current and is only of secondary order. The
best way to calculate the maximum available load current under certain operating conditions is to estimate the
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency
graphs shown in Figure 1 through Figure 4. The maximum load current can then be estimated as follows:
2
I
L fS
max
* V
P
I
+ h
load max
2 (V
OUT
IN)
Where:
IP = Peak current as described in the Peak Current Control section
L = Selected inductor value
fSmax = Maximum switching frequency as calculated previously
h = Expected converter efficiency. Typically 70% to 85%
(4)
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The maximum load current of the converter is the current at the operation point where the converter starts to
enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction
mode.
Last, the selected inductor should have a saturation current that meets the maximum peak current of the
converter (as calculated in the Peak Current Control section). Use the maximum value for ILIM for this calculation.
Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency
of the converter. See Table 4 and the typical applications for the inductor selection.
Table 4. Recommended Inductor for Typical LCD Bias Supply (see Figure 15)
DEVICE
INDUCTOR VALUE
10 mH
COMPONENT SUPPLIER
Sumida CR32-100
COMMENTS
High efficiency
10 mH
Sumida CDRH3D16-100
Murata LQH4C100K04
Sumida CDRH3D16-4R7
Murata LQH3C4R7M24
High efficiency
TPS61040
10 mH
High efficiency
4.7 mH
Small solution size
Small solution size
4.7 mH
High efficiency
Small solution size
TPS61041
10 mH
Murata LQH3C100K24
SETTING THE OUTPUT VOLTAGE
The output voltage is calculated as:
R1
R2
ǒ Ǔ
+ 1.233 V 1 )
V
OUT
(5)
For battery-powered applications, a high-impedance voltage divider should be used with a typical value for R2 of
≤200 kΩ and a maximum value for R1 of 2.2 MΩ. Smaller values might be used to reduce the noise sensitivity of
the feedback pin.
A feedforward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the
error comparator. Without a feedforward capacitor, or one whose value is too small, the TPS61040/41 shows
double pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage
ripple. If this higher output voltage ripple is acceptable, the feedforward capacitor can be left out.
The lower the switching frequency of the converter, the larger the feedforward capacitor value required. A good
starting point is to use a 10-pF feedforward capacitor. As a first estimation, the required value for the feedforward
capacitor at the operation point can also be calculated using the following formula:
1
C
+
FF
fS
20
2 p
R1
Where:
R1 = Upper resistor of voltage divider
fS = Switching frequency of the converter at the nominal load current (See the Inductor Selection, Maximum
Load Current section for calculating the switching frequency)
CFF = Choose a value that comes closest to the result of the calculation
(6)
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The larger the feedforward capacitor the worse the line regulation of the device. Therefore, when concern for line
regulation is paramount, the selected feedforward capacitor should be as small as possible. See the following
section for more information about line and load regulation.
LINE AND LOAD REGULATION
The line regulation of the TPS61040/41 depends on the voltage ripple on the feedback pin. Usually a 50 mV
peak-to-peak voltage ripple on the feedback pin FB gives good results.
Some applications require a very tight line regulation and can only allow a small change in output voltage over a
certain input voltage range. If no feedforward capacitor CFF is used across the upper resistor of the voltage
feedback divider, the device has the best line regulation. Without the feedforward capacitor the output voltage
ripple is higher because the TPS61040/41 shows output voltage bursts instead of single pulses on the switch pin
(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage
ripple.
If a larger output capacitor value is not an option, a feedforward capacitor CFF can be used as described in the
previous section. The use of a feedforward capacitor increases the amount of voltage ripple present on the
feedback pin (FB). The greater the voltage ripple on the feedback pin (≥50 mV), the worse the line regulation.
There are two ways to improve the line regulation further:
1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,
as well as the voltage ripple on the feedback pin.
2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin
down to 50 mV again. As a starting point, the same capacitor value as selected for the feedforward capacitor
CFF can be used.
OUTPUT CAPACITOR SELECTION
For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low
ESR value but tantalum capacitors can be used as well, depending on the application.
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output
voltage ripple can be calculated as:
I
L
ǒfS(Iout) Vout ) Vd–VinǓ
I
out
1
P
DV
+
–
) I ESR
out
P
C
out
where:
IP = Peak current as described in the Peak Current Control section
L = Selected inductor value
Iout = Nominal load current
fS (Iout) = Switching frequency at the nominal load current as calculated previously
Vd = Rectifier diode forward voltage (typically 0.3 V)
Cout = Selected output capacitor
ESR = Output capacitor ESR value
(7)
See Table 5 and the typical applications section for choosing the output capacitor.
Table 5. Recommended Input and Output Capacitors
DEVICE
CAPACITOR
4.7 mF/X5R/0805
10 mF/X5R/0805
1 mF/X7R/1206
1 mF/X5R/1206
4.7 mF/X5R/1210
VOLTAGE RATING
COMPONENT SUPPLIER
Tayo Yuden JMK212BY475MG
Tayo Yuden JMK212BJ106MG
Tayo Yuden TMK316BJ105KL
Tayo Yuden GMK316BJ105KL
Tayo Yuden TMK325BJ475MG
COMMENTS
CIN/COUT
CIN/COUT
COUT
6.3 V
6.3 V
25 V
35 V
25 V
TPS61040/41
COUT
COUT
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Product Folder Link(s): TPS61040 TPS61041
TPS61040
TPS61041
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
INPUT CAPACITOR SELECTION
For good input voltage filtering, low ESR ceramic capacitors are recommended. A 4.7 mF ceramic input capacitor
is sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table 5
and typical applications for input capacitor recommendations.
DIODE SELECTION
To achieve high efficiency a Schottky diode should be used. The current rating of the diode should meet the
peak current rating of the converter as it is calculated in the Peak Current Control section. Use the maximum
value for ILIM for this calculation. See Table 6 and the typical applications for the selection of the Schottky diode.
Table 6. Recommended Schottky Diode for Typical LCD Bias Supply (see Figure 15)
DEVICE
REVERSE VOLTAGE
COMPONENT SUPPLIER
ON Semiconductor MBR0530
ON Semiconductor MBR0520
ON Semiconductor MBRM120L
Toshiba CRS02
COMMENTS
30 V
20 V
20 V
30 V
TPS61040/41
High efficiency
LAYOUT CONSIDERATIONS
Typical for all switching power supplies, the layout is an important step in the design; especially at high peak
currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems
and duty cycle jitter.
The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The
inductor and diode should be placed as close as possible to the switch pin to minimize the noise coupling into
other circuits. Because the feedback pin and network is a high-impedance circuit, the feedback network should
be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground
plane or trace to minimize noise coupling into this circuit.
Wide traces should be used for connections in bold as shown in Figure 15. A star ground connection or ground
plane minimizes ground shifts and noise.
D1
L1
V
O
C
FF
R1
V
V
IN
SW
FB
IN
C
O
C
IN
R2
EN
GND
Figure 15. Layout Diagram
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TPS61040
TPS61041
SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
www.ti.com
L1
10 µH
D1
V
18 V
OUT
V
IN
1.8 V to 6 V
TPS61040
C
22 pF
FF
R1
2.2 MW
V
IN
SW
FB
C2
1 µF
C1
4.7 µF
L1:
D1:
C1:
C2:
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
EN
GND
R2
160 kW
Figure 16. LCD Bias Supply
L1
10 µH
D1
V
O
18 V
TPS61040
C
FF
R1
2.2 MW
22 pF
V
V
IN
SW
FB
IN
C2
1 µF
1.8 V to 6 V
C1
4.7 µF
DAC or Analog Voltage
0 V = 25 V
1.233 V = 18 V
EN
GND
R2
160 kW
L1:
Sumida CR32-100
D1:
C1:
C2:
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden GMK316BJ105KL
Figure 17. LCD Bias Supply With Adjustable Output Voltage
R3
200 kW
BC857C
L1
10 µH
D1
V
IN
V
OUT
1.8 V to 6 V
18 V / 10 mA
TPS61040
R1
C
FF
2.2 MW
22 pF
V
IN
SW
FB
C2
1 µF
C3
0.1 µF
(Optional)
C1
4.7 µF
R2
160 kW
EN
GND
L1:
D1:
C1:
C2:
Sumida CR32-100
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Tayo Yuden TMK316BJ105KL
Figure 18. LCD Bias Supply With Load Disconnect
14
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Product Folder Link(s): TPS61040 TPS61041
TPS61040
TPS61041
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SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
D3
V2 = –10 V/15 mA
D2
C4
4.7 µF
C3
1 µF
L1
D1
6.8 µH
V1 = 10 V/15 mA
TPS61040
C
FF
22 pF
R1
1.5 MW
V
SW
FB
IN
V
IN
= 2.7 V to 5 V
C2
1 µF
C1
4.7 µF
L1:
Murata LQH4C6R8M04
D1, D2, D3: Motorola MBR0530
EN
GND
R2
C1:
Tayo Yuden JMK212BY475MG
210 kW
C2, C3, C4: Tayo Yuden EMK316BJ105KF
Figure 19. Positive and Negative Output LCD Bias Supply
L1
6.8 µH
D1
V
O =
12 V/35 mA
TPS61040
C
4.7 pF
FF
R1
1.8 MW
V
IN
3.3 V
V
IN
SW
FB
C2
4.7 µF
C1
10 µF
L1:
Murata LQH4C6R8M04
Motorola MBR0530
Tayo Yuden JMK212BJ106MG
Tayo Yuden EMK316BJ475ML
EN
GND
R2
205 kW
D1:
C1:
C2:
Figure 20. Standard 3.3-V to 12-V Supply
D1
3.3 µH
TPS61040
5 V/45 mA
C
FF
3.3 pF
R1
620 kW
V
1.8 V to 4 V
SW
FB
IN
C2
4.7 µF
C1
4.7 µF
R2
200 kW
EN
GND
L1:
D1:
Murata LQH4C3R3M04
Motorola MBR0530
C1, C2: Tayo Yuden JMK212BY475MG
Figure 21. Dual Battery Cell to 5-V/50-mA Conversion
Efficiency Approx. Equals 84% at VIN = 2.4 V to Vo = 5 V/45 mA
Copyright © 2002–2010, Texas Instruments Incorporated
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TPS61040
TPS61041
SLVS413F –OCTOBER 2002–REVISED DECEMBER 2010
www.ti.com
L1
10 µH
D1
D2
24 V
V
CC
= 2.7 V to 6 V
V
IN
SW
(Optional)
C1
4.7 µF
FB
L1:
D1:
C1:
C2:
Murata LQ
Motorola
Tayo Yud
Tayo Yud
C2
1 µF
R
82 Ω
EN
PWM
100 Hz to 500 Hz
GND
S
Figure 22. White LED Supply With Adjustable Brightness Control
Using a PWM Signal on the Enable Pin, Efficiency Approx. Equals 86% at VIN = 3 V, ILED = 15 mA
D1
L1
MBRM120L
10 µH
C2
100 nF
(See
D2
24 V
(Optional)
V
CC
= 2.7 V to 6 V
V
SW
FB
IN
Note A)
C1
4.7 µF
R1
120 kΩ
EN
GND
R
S
110 Ω
L1:
D1:
C1:
C2:
Murata LQH4C3R3M04
Motorola MBR0530
Tayo Yuden JMK212BY475MG
Standard Ceramic Capacitor
Analog Brightness Control
3.3 V Led Off
R2
160 kΩ
0 V Iled = 20 mA
A. A smaller output capacitor value for C2 causes a larger LED ripple.
Figure 23. White LED Supply With Adjustable Brightness Control
Using an Analog Signal on the Feedback Pin
16
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Product Folder Link(s): TPS61040 TPS61041
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
PACKAGING INFORMATION
Orderable Device
TPS61040DBVR
TPS61040DBVRG4
TPS61040DDCR
TPS61040DDCT
TPS61040DRVR
TPS61040DRVRG4
TPS61040DRVT
TPS61040DRVTG4
TPS61041DBVR
TPS61041DBVRG4
TPS61041DRVR
TPS61041DRVRG4
TPS61041DRVT
TPS61041DRVTG4
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOT-23
SOT-23
SOT
DBV
5
5
5
5
6
6
6
6
5
5
6
6
6
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
PHOI
PHOI
QXK
QXK
CCL
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DBV
DDC
DDC
DRV
DRV
DRV
DRV
DBV
DBV
DRV
DRV
DRV
DRV
3000
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SOT
Green (RoHS
& no Sb/Br)
SON
3000
3000
250
Green (RoHS
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
CCL
SON
Green (RoHS
& no Sb/Br)
CCL
SON
250
Green (RoHS
& no Sb/Br)
CCL
SOT-23
SOT-23
SON
3000
3000
3000
3000
250
Green (RoHS
& no Sb/Br)
PHPI
PHPI
CAW
CAW
CAW
CAW
Green (RoHS
& no Sb/Br)
Green (RoHS NIPDAU | CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
SON
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SON
Green (RoHS NIPDAU | CU NIPDAU Level-1-260C-UNLIM
& no Sb/Br)
SON
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Oct-2013
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS61040, TPS61041 :
Automotive: TPS61040-Q1, TPS61041-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS61040DBVR
TPS61040DBVR
TPS61040DDCR
TPS61040DDCT
TPS61040DRVR
TPS61040DRVT
TPS61041DBVR
TPS61041DBVR
TPS61041DRVR
SOT-23
SOT-23
SOT
DBV
DBV
DDC
DDC
DRV
DRV
DBV
DBV
DRV
5
5
5
5
6
6
5
5
6
3000
3000
3000
250
179.0
178.0
179.0
179.0
179.0
179.0
179.0
178.0
179.0
8.4
9.0
8.4
8.4
8.4
8.4
8.4
9.0
8.4
3.2
3.23
3.2
3.2
3.17
3.2
1.4
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q2
Q2
Q3
Q3
Q2
SOT
3.2
3.2
1.4
SON
3000
250
2.2
2.2
1.2
SON
2.2
2.2
1.2
SOT-23
SOT-23
SON
3000
3000
3000
3.2
3.2
1.4
3.23
2.2
3.17
2.2
1.37
1.2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS61040DBVR
TPS61040DBVR
TPS61040DDCR
TPS61040DDCT
TPS61040DRVR
TPS61040DRVT
TPS61041DBVR
TPS61041DBVR
TPS61041DRVR
SOT-23
SOT-23
SOT
DBV
DBV
DDC
DDC
DRV
DRV
DBV
DBV
DRV
5
5
5
5
6
6
5
5
6
3000
3000
3000
250
203.0
180.0
195.0
195.0
203.0
203.0
203.0
180.0
203.0
203.0
180.0
200.0
200.0
203.0
203.0
203.0
180.0
203.0
35.0
18.0
45.0
45.0
35.0
35.0
35.0
18.0
35.0
SOT
SON
3000
250
SON
SOT-23
SOT-23
SON
3000
3000
3000
Pack Materials-Page 2
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