TPS61041DRVTG4 [TI]

LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES; 低功耗DC / DC升压转换器采用SOT -23和儿子套餐
TPS61041DRVTG4
型号: TPS61041DRVTG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES
低功耗DC / DC升压转换器采用SOT -23和儿子套餐

转换器 稳压器 开关式稳压器或控制器 电源电路 开关式控制器 光电二极管 升压转换器
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TPS61040  
TPS61041  
www.ti.com  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
LOW-POWER DC/DC BOOST CONVERTER IN SOT-23 AND SON PACKAGES  
Check for Samples: TPS61040, TPS61041  
1
FEATURES  
DESCRIPTION  
1.8-V to 6-V Input Voltage Range  
The TPS61040/41 is  
a
high-frequency boost  
converter dedicated for small to medium LCD bias  
supply and white LED backlight supplies. The device  
is ideal to generate output voltages up to 28 V from a  
dual cell NiMH/NiCd or a single cell Li-Ion battery.  
The part can also be used to generate standard  
3.3-V/5-V to 12-V power conversions.  
Adjustable Output Voltage Range up to 28 V  
400-mA (TPS61040) and 250-mA (TPS61041)  
Internal Switch Current  
Up to 1-MHz Switching Frequency  
28-mA Typical No-Load Quiescent Current  
1-mA Typical Shutdown Current  
Internal Soft Start  
The TPS61040/41 operates with  
a
switching  
frequency up to 1 MHz. This allows the use of small  
external components using ceramic as well as  
tantalum output capacitors. Together with the thin  
SON package, the TPS61040/41 gives a very small  
overall solution size. The TPS61040 has an internal  
400 mA switch current limit, while the TPS61041 has  
a 250-mA switch current limit, offering lower output  
voltage ripple and allows the use of a smaller form  
factor inductor for lower power applications. The low  
quiescent current (typically 28 mA) together with an  
optimized control scheme, allows device operation at  
very high efficiencies over the entire load current  
range.  
Available in SOT23-5, TSOT23-5,  
and 2 × 2 × 0.8-mm SON Packages  
APPLICATIONS  
LCD Bias Supply  
White-LED Supply for LCD Backlights  
Digital Still Camera  
PDAs, Organizers, and Handheld PCs  
Cellular Phones  
Internet Audio Player  
Standard 3.3-V/5-V to 12-V Conversion  
DDC, DBV PACKAGE  
(Top View)  
DRV PACKAGE  
(Top View)  
1
2
3
5
4
1
2
3
6
5
4
GND  
SW  
NC  
FB  
V
SW  
IN  
V
IN  
GND  
EN  
EN  
FB  
TYPICAL APPLICATION  
EFFICIENCY  
vs  
OUTPUT CURRENT  
90  
88  
86  
84  
82  
80  
78  
76  
74  
72  
70  
L1  
10 µH  
V
= 18 V  
D1  
O
V = 5 V  
I
V
V
OUT  
V
IN  
to 28 V  
IN  
1.8 V to 6 V  
V = 3.6 V  
I
C
FF  
R1  
1
3
2
5
4
V
SW  
FB  
IN  
C
1 µF  
O
V = 2.4 V  
I
C
4.7 µF  
IN  
EN  
GND  
R2  
0.1  
1
10  
100  
I
− Output Current − mA  
O
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2002–2010, Texas Instruments Incorporated  
TPS61040  
TPS61041  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
(1)  
Table 1. ORDERING INFORMATION  
SWITCH CURRENT  
LIMIT, mA  
PACKAGE  
MARKING  
TA  
PART NUMBER(2)  
PACKAGE  
TPS61040DBV  
TPS61040DDC  
TPS61041DBV  
TPS61040DRV  
TPS61041DRV  
400  
400  
250  
400  
250  
SOT23-5  
TSOT23-5  
SOT23-5  
PHOI  
QXK  
PHPI  
CCL  
–40°C to  
85°C  
SON-6 2×2  
SON-6 2×2  
CAW  
(1) For the most current package and ordering information, see the Package Option Addendum at the end  
of this document, or see the TI website at www.ti.com.  
(2) The devices are available in tape and reel and in tubes. Add R suffix to the part number (e.g.,  
TPS61040DRVR) to order quantities of 3000 parts in tape and reel or add suffix T (e.g.,  
TPS61040DRVT) to order a tube with 250 pieces..  
FUNCTIONAL BLOCK DIAGRAM  
SW  
Under Voltage  
Lockout  
Bias Supply  
400 ns Min  
VIN  
FB  
Off Time  
Error Comparator  
-
S
Power MOSFET  
N-Channel  
+
RS Latch  
Logic  
Gate  
Driver  
V
REF  
= 1.233 V  
R
Current Limit  
R
SENSE  
+
_
6 µs Max  
On Time  
EN  
Soft  
Start  
GND  
2
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Copyright © 2002–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPS61040 TPS61041  
TPS61040  
TPS61041  
www.ti.com  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
Table 2. Terminal Functions  
TERMINAL  
I/O  
DESCRIPTION  
DDC,  
DBV NO.  
NAME  
EN  
DRV NO.  
This is the enable pin of the device. Pulling this pin to ground forces the device into shutdown  
mode reducing the supply current to less than 1 mA. This pin should not be left floating and needs  
to be terminated.  
4
3
4
I
I
This is the feedback pin of the device. Connect this pin to the external voltage divider to program  
the desired output voltage.  
FB  
3
GND  
NC  
2
1
5
Ground  
No connection  
Connect the inductor and the Schottky diode to this pin. This is the switch pin and is connected to  
the drain of the internal power MOSFET.  
SW  
VIN  
1
5
6
2
I
I
Supply voltage pin  
DETAILED DESCRIPTION  
OPERATION  
The TPS61040/41 operates with an input voltage range of 1.8 V to 6 V and can generate output voltages up to  
28 V. The device operates in a pulse-frequency-modulation (PFM) scheme with constant peak current control.  
This control scheme maintains high efficiency over the entire load current range, and with a switching frequency  
up to 1 MHz, the device enables the use of very small external components.  
The converter monitors the output voltage, and as soon as the feedback voltage falls below the reference voltage  
of typically 1.233 V, the internal switch turns on and the current ramps up. The switch turns off as soon as the  
inductor current reaches the internally set peak current of typically 400 mA (TPS61040) or 250 mA (TPS61041).  
See the Peak Current Control section for more information. The second criteria that turns off the switch is the  
maximum on-time of 6 ms (typical). This is just to limit the maximum on-time of the converter to cover for extreme  
conditions. As the switch is turned off the external Schottky diode is forward biased delivering the current to the  
output. The switch remains off for a minimum of 400 ns (typical), or until the feedback voltage drops below the  
reference voltage again. Using this PFM peak current control scheme the converter operates in discontinuous  
conduction mode (DCM) where the switching frequency depends on the output current, which results in very high  
efficiency over the entire load current range. This regulation scheme is inherently stable, allowing a wider  
selection range for the inductor and output capacitor.  
PEAK CURRENT CONTROL  
The internal switch turns on until the inductor current reaches the typical dc current limit (ILIM) of 400 mA  
(TPS61040) or 250 mA (TPS61041). Due to the internal propagation delay of typical 100 ns, the actual current  
exceeds the dc current limit threshold by a small amount. The typical peak current limit can be calculated:  
V
IN  
I
+ I  
)
  100 ns  
peak(typ)  
LIM  
L
V
IN  
I
I
+ 400 mA )  
+ 250 mA )  
  100 ns for the TPS61040  
peak(typ)  
peak(typ)  
L
V
IN  
  100 ns for the TPS61041  
L
(1)  
The higher the input voltage and the lower the inductor value, the greater the peak.  
By selecting the TPS61040 or TPS61041, it is possible to tailor the design to the specific application current limit  
requirements. A lower current limit supports applications requiring lower output power and allows the use of an  
inductor with a lower current rating and a smaller form factor. A lower current limit usually has a lower output  
voltage ripple as well.  
Copyright © 2002–2010, Texas Instruments Incorporated  
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Product Folder Link(s): TPS61040 TPS61041  
 
TPS61040  
TPS61041  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
www.ti.com  
SOFT START  
All inductive step-up converters exhibit high inrush current during start-up if no special precaution is made. This  
can cause voltage drops at the input rail during start up and may result in an unwanted or early system shut  
down.  
I
LIM  
4
The TPS61040/41 limits this inrush current by increasing the current limit in two steps starting from  
for 256  
I
LIM  
2
cycles to  
for the next 256 cycles, and then full current limit (see Figure 14).  
ENABLE  
Pulling the enable (EN) to ground shuts down the device reducing the shutdown current to 1 mA (typical).  
Because there is a conductive path from the input to the output through the inductor and Schottky diode, the  
output voltage is equal to the input voltage during shutdown. The enable pin needs to be terminated and should  
not be left floating. Using a small external transistor disconnects the input from the output during shutdown as  
shown in Figure 18.  
UNDERVOLTAGE LOCKOUT  
An undervoltage lockout prevents misoperation of the device at input voltages below typical 1.5 V. When the  
input voltage is below the undervoltage threshold, the main switch is turned off.  
THERMAL SHUTDOWN  
An internal thermal shutdown is implemented and turns off the internal MOSFETs when the typical junction  
temperature of 168°C is exceeded. The thermal shutdown has a hysteresis of typically 25°C. This data is based  
on statistical means and is not tested during the regular mass production of the IC.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature (unless otherwise noted)  
(1)  
UNIT  
(2)  
Supply voltages on pin VIN  
–0.3 V to 7 V  
–0.3 V to VIN + 0.3 V  
30 V  
(2)  
Voltages on pins EN, FB  
Switch voltage on pin SW  
(2)  
Continuous power dissipation  
Operating junction temperature  
Storage temperature  
See Dissipation Rating Table  
–40°C to 150°C  
TJ  
Tstg  
–65°C to 150°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to network ground terminal.  
DISSIPATION RATING TABLE  
DERATING  
T
A 25°C  
FACTOR  
ABOVE  
TA = 70°C  
POWER RATING POWER RATING  
TA = 85°C  
PACKAGE  
RqJA  
POWER RATING  
TA = 25°C  
DBV  
250°C/W  
76°C/W  
357 mW  
3.5 mW/°C  
13 mW/°C  
192 mW  
688 mW  
140 mW  
500 mW  
DDC, DRV  
1300 mW  
4
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Copyright © 2002–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPS61040 TPS61041  
TPS61040  
TPS61041  
www.ti.com  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
RECOMMENDED OPERATING CONDITIONS  
MIN  
TYP  
MAX UNIT  
VIN  
VOUT  
L
Input voltage range  
Output voltage range  
Inductor(1)  
1.8  
6
V
V
28  
2.2  
10  
mH  
MHz  
mF  
mF  
°C  
f
Switching frequency(1)  
1
(1)  
CIN  
COUT  
TA  
Input capacitor  
4.7  
(1)  
Output capacitor  
1
–40  
–40  
Operating ambient temperature  
Operating junction temperature  
85  
TJ  
125  
°C  
(1) See application section for further information.  
ELECTRICAL CHARACTERISTICS  
VIN = 2.4 V, EN = VIN, TA = –40°C to 85°C, typical values are at TA = 25°C (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
SUPPLY CURRENT  
VIN  
Input voltage range  
1.8  
6
50  
1
V
mA  
mA  
V
IQ  
Operating quiescent current  
Shutdown current  
IOUT = 0 mA, not switching, VFB = 1.3 V  
EN = GND  
28  
0.1  
1.5  
ISD  
VUVLO  
ENABLE  
VIH  
Under-voltage lockout threshold  
1.7  
EN high level input voltage  
EN low level input voltage  
EN input leakage current  
1.3  
V
V
VIL  
0.4  
1
II  
EN = GND or VIN  
0.1  
mA  
POWER SWITCH AND CURRENT LIMIT  
Vsw  
toff  
Maximum switch voltage  
Minimum off time  
30  
550  
7.5  
V
250  
4
400  
6
ns  
ton  
Maximum on time  
ms  
RDS(on)  
RDS(on)  
MOSFET on-resistance  
MOSFET on-resistance  
MOSFET leakage current  
MOSFET current limit  
MOSFET current limit  
VIN = 2.4 V; ISW = 200 mA; TPS61040  
VIN = 2.4 V; ISW = 200 mA; TPS61041  
VSW = 28 V  
600  
750  
1
1000  
1250  
10  
mΩ  
mΩ  
mA  
mA  
mA  
ILIM  
TPS61040  
350  
215  
400  
250  
450  
285  
ILIM  
TPS61041  
OUTPUT  
VOUT  
Vref  
Adjustable output voltage range  
Internal voltage reference  
Feedback input bias current  
Feedback trip point voltage  
VIN  
28  
1
V
V
1.233  
IFB  
VFB = 1.3 V  
mA  
V
VFB  
1.8 V VIN 6 V  
1.208 1.233 1.258  
1.8 V VIN 6 V; VOUT = 18 V; Iload = 10 mA;  
CFF = not connected  
(1)  
Line regulation  
0.05  
0.15  
%/V  
Load regulation(1)  
VIN = 2.4 V; VOUT = 18 V; 0 mA IOUT 30 mA  
%/mA  
(1) The line and load regulation depend on the external component selection. See the application section for further information.  
Copyright © 2002–2010, Texas Instruments Incorporated  
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Product Folder Link(s): TPS61040 TPS61041  
TPS61040  
TPS61041  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
www.ti.com  
TYPICAL CHARACTERISTICS  
Table 3. Table of Graphs  
FIGURE  
vs Load current  
1, 2, 3  
4
h
Efficiency  
vs Input voltage  
IQ  
Quiescent current  
Feedback voltage  
Switch current limit  
vs Input voltage and temperature  
vs Temperature  
5
VFB  
ISW  
6
vs Temperature  
7
vs Supply voltage, TPS61041  
vs Supply voltage, TPS61040  
vs Temperature  
8
ICL  
Switch current limit  
RDS(on)  
9
10  
11  
12  
13  
14  
RDS(on)  
vs Supply voltage  
Line transient response  
Load transient response  
Start-up behavior  
EFFICIENCY  
EFFICIENCY  
vs  
vs  
OUTPUT CURRENT  
LOAD CURRENT  
90  
88  
86  
84  
82  
80  
78  
76  
74  
72  
70  
90  
88  
86  
84  
82  
80  
78  
76  
74  
72  
70  
V
O
= 18 V  
L = 10 µH  
= 18 V  
V
O
V = 5 V  
I
TPS61040  
V = 3.6 V  
I
TPS61041  
V = 2.4 V  
I
0.1  
1
10  
100  
0.1  
1
10  
100  
I
O
− Output Current − mA  
I
L
− Load Current − mA  
Figure 1.  
Figure 2.  
6
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Copyright © 2002–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPS61040 TPS61041  
 
TPS61040  
TPS61041  
www.ti.com  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
EFFICIENCY  
vs  
EFFICIENCY  
vs  
LOAD CURRENT  
INPUT VOLTAGE  
90  
88  
90  
88  
86  
84  
82  
80  
78  
76  
74  
V
O
= 18 V  
L = 10 µH  
V
O
= 18 V  
I
O
= 10 mA  
86  
84  
82  
L = 10 µH  
I
O
= 5 mA  
L = 3.3 µH  
80  
78  
76  
74  
72  
70  
72  
70  
1
2
3
4
5
6
0.1  
1
10  
100  
I
L
− Load Current − mA  
V − Input Voltage − V  
I
Figure 3.  
Figure 4.  
TPS61040  
QUIESCENT CURRENT  
vs  
FEEDBACK VOLTAGE  
vs  
INPUT VOLTAGE  
FREE-AIR TEMPERATURE  
40  
1.24  
T
= 85°C  
= 27°C  
= −40°C  
A
35  
30  
25  
20  
15  
10  
1.238  
T
A
1.236  
1.234  
T
A
V
CC  
= 2.4 V  
1.232  
1.23  
5
0
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
6
−40 −20  
0
20  
40  
60  
80 100 120  
T
A
− Temperature − °C  
V − Input Voltage − V  
I
Figure 5.  
Figure 6.  
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Product Folder Link(s): TPS61040 TPS61041  
 
TPS61040  
TPS61041  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
www.ti.com  
TPS61040/41  
SWITCH CURRENT LIMIT  
vs  
TPS61041  
CURRENT LIMIT  
vs  
FREE-AIR TEMPERATURE  
SUPPLY VOLTAGE  
260  
258  
256  
254  
252  
430  
TPS61040  
410  
390  
370  
350  
330  
310  
290  
T
A
= 27°C  
250  
248  
246  
244  
270  
TPS61041  
250  
242  
240  
230  
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
6
−40302010 0 10 20 30 40 50 60 70 80 90  
T − Temperature − °C  
A
V
CC  
− Supply Voltage − V  
Figure 7.  
Figure 8.  
TPS61040  
CURRENT LIMIT  
vs  
TPS61040/41  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
vs  
SUPPLY VOLTAGE  
FREE-AIR TEMPERATURE  
420  
415  
410  
405  
400  
395  
390  
1200  
1000  
800  
600  
400  
TPS61041  
T
A
= 27°C  
TPS61040  
200  
0
385  
380  
−4030 −20 −10 0 10 20 30 40 50 60 70 80 90  
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
6
T − Temperature − °C  
A
V
CC  
− Supply Voltage − V  
Figure 9.  
Figure 10.  
8
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Copyright © 2002–2010, Texas Instruments Incorporated  
Product Folder Link(s): TPS61040 TPS61041  
TPS61040  
TPS61041  
www.ti.com  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
TPS61040/41  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
vs  
SUPPLY VOLTAGE  
1000  
V
O
= 18 V  
900  
800  
700  
600  
500  
400  
300  
200  
V
I
2.4 V to 3.4 V  
TPS61041  
TPS61040  
V
O
100 mV/div  
100  
0
1.8  
2.4  
3
3.6  
4.2  
4.8  
5.4  
6
200 µS/div  
V
CC  
− Supply Voltage − V  
Figure 11.  
Figure 12. Line Transient Response  
V
O
= 18 V  
V
O
= 18 V  
V
O
V
O
100 mA/div  
5 V/div  
EN  
1 V/div  
V
O
1 mA to 10 mA  
I
I
50 mA/div  
200 µS/div  
Figure 13. Load Transient Response  
Figure 14. Start-Up Behavior  
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TPS61040  
TPS61041  
SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
www.ti.com  
APPLICATION INFORMATION  
INDUCTOR SELECTION, MAXIMUM LOAD CURRENT  
Because the PFM peak current control scheme is inherently stable, the inductor value does not affect the stability  
of the regulator. The selection of the inductor together with the nominal load current, input and output voltage of  
the application determines the switching frequency of the converter. Depending on the application, inductor  
values between 2.2 mH and 47 mH are recommended. The maximum inductor value is determined by the  
maximum on time of the switch, typically 6 ms. The peak current limit of 400 mA/250 mA (typically) should be  
reached within this 6-ms period for proper operation.  
The inductor value determines the maximum switching frequency of the converter. Therefore, select the inductor  
value that ensures the maximum switching frequency at the converter maximum load current is not exceeded.  
The maximum switching frequency is calculated by the following formula:  
V
  (V  
* V  
IN(min)  
OUT  
  L   V  
IN)  
fS  
+
max  
I
P
OUT  
Where:  
IP = Peak current as described in the Peak Current Control section  
L = Selected inductor value  
VIN(min) = The highest switching frequency occurs at the minimum input voltage  
(2)  
If the selected inductor value does not exceed the maximum switching frequency of the converter, the next step  
is to calculate the switching frequency at the nominal load current using the following formula:  
2   I  
  (V  
* V ) Vd)  
load  
OUT  
IN  
fSǒIloadǓ+  
2
I
  L  
P
Where:  
IP = Peak current as described in the Peak Current Control section  
L = Selected inductor value  
Iload = Nominal load current  
Vd = Rectifier diode forward voltage (typically 0.3V)  
A smaller inductor value gives a higher converter switching frequency, but lowers the efficiency.  
(3)  
The inductor value has less effect on the maximum available load current and is only of secondary order. The  
best way to calculate the maximum available load current under certain operating conditions is to estimate the  
expected converter efficiency at the maximum load current. This number can be taken out of the efficiency  
graphs shown in Figure 1 through Figure 4. The maximum load current can then be estimated as follows:  
2
I
  L   fS  
max  
* V  
P
I
+ h  
load max  
2   (V  
OUT  
IN)  
Where:  
IP = Peak current as described in the Peak Current Control section  
L = Selected inductor value  
fSmax = Maximum switching frequency as calculated previously  
h = Expected converter efficiency. Typically 70% to 85%  
(4)  
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The maximum load current of the converter is the current at the operation point where the converter starts to  
enter the continuous conduction mode. Usually the converter should always operate in discontinuous conduction  
mode.  
Last, the selected inductor should have a saturation current that meets the maximum peak current of the  
converter (as calculated in the Peak Current Control section). Use the maximum value for ILIM for this calculation.  
Another important inductor parameter is the dc resistance. The lower the dc resistance, the higher the efficiency  
of the converter. See Table 4 and the typical applications for the inductor selection.  
Table 4. Recommended Inductor for Typical LCD Bias Supply (see Figure 15)  
DEVICE  
INDUCTOR VALUE  
10 mH  
COMPONENT SUPPLIER  
Sumida CR32-100  
COMMENTS  
High efficiency  
10 mH  
Sumida CDRH3D16-100  
Murata LQH4C100K04  
Sumida CDRH3D16-4R7  
Murata LQH3C4R7M24  
High efficiency  
TPS61040  
10 mH  
High efficiency  
4.7 mH  
Small solution size  
Small solution size  
4.7 mH  
High efficiency  
Small solution size  
TPS61041  
10 mH  
Murata LQH3C100K24  
SETTING THE OUTPUT VOLTAGE  
The output voltage is calculated as:  
R1  
R2  
ǒ Ǔ  
+ 1.233 V   1 )  
V
OUT  
(5)  
For battery-powered applications, a high-impedance voltage divider should be used with a typical value for R2 of  
200 kand a maximum value for R1 of 2.2 M. Smaller values might be used to reduce the noise sensitivity of  
the feedback pin.  
A feedforward capacitor across the upper feedback resistor R1 is required to provide sufficient overdrive for the  
error comparator. Without a feedforward capacitor, or one whose value is too small, the TPS61040/41 shows  
double pulses or a pulse burst instead of single pulses at the switch node (SW), causing higher output voltage  
ripple. If this higher output voltage ripple is acceptable, the feedforward capacitor can be left out.  
The lower the switching frequency of the converter, the larger the feedforward capacitor value required. A good  
starting point is to use a 10-pF feedforward capacitor. As a first estimation, the required value for the feedforward  
capacitor at the operation point can also be calculated using the following formula:  
1
C
+
FF  
fS  
20  
2   p   
  R1  
Where:  
R1 = Upper resistor of voltage divider  
fS = Switching frequency of the converter at the nominal load current (See the Inductor Selection, Maximum  
Load Current section for calculating the switching frequency)  
CFF = Choose a value that comes closest to the result of the calculation  
(6)  
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The larger the feedforward capacitor the worse the line regulation of the device. Therefore, when concern for line  
regulation is paramount, the selected feedforward capacitor should be as small as possible. See the following  
section for more information about line and load regulation.  
LINE AND LOAD REGULATION  
The line regulation of the TPS61040/41 depends on the voltage ripple on the feedback pin. Usually a 50 mV  
peak-to-peak voltage ripple on the feedback pin FB gives good results.  
Some applications require a very tight line regulation and can only allow a small change in output voltage over a  
certain input voltage range. If no feedforward capacitor CFF is used across the upper resistor of the voltage  
feedback divider, the device has the best line regulation. Without the feedforward capacitor the output voltage  
ripple is higher because the TPS61040/41 shows output voltage bursts instead of single pulses on the switch pin  
(SW), increasing the output voltage ripple. Increasing the output capacitor value reduces the output voltage  
ripple.  
If a larger output capacitor value is not an option, a feedforward capacitor CFF can be used as described in the  
previous section. The use of a feedforward capacitor increases the amount of voltage ripple present on the  
feedback pin (FB). The greater the voltage ripple on the feedback pin (50 mV), the worse the line regulation.  
There are two ways to improve the line regulation further:  
1. Use a smaller inductor value to increase the switching frequency which will lower the output voltage ripple,  
as well as the voltage ripple on the feedback pin.  
2. Add a small capacitor from the feedback pin (FB) to ground to reduce the voltage ripple on the feedback pin  
down to 50 mV again. As a starting point, the same capacitor value as selected for the feedforward capacitor  
CFF can be used.  
OUTPUT CAPACITOR SELECTION  
For best output voltage filtering, a low ESR output capacitor is recommended. Ceramic capacitors have a low  
ESR value but tantalum capacitors can be used as well, depending on the application.  
Assuming the converter does not show double pulses or pulse bursts on the switch node (SW), the output  
voltage ripple can be calculated as:  
I
  L  
ǒfS(Iout) Vout ) Vd–VinǓ  
I
out  
1
P
DV  
+
 
) I   ESR  
out  
P
C
out  
where:  
IP = Peak current as described in the Peak Current Control section  
L = Selected inductor value  
Iout = Nominal load current  
fS (Iout) = Switching frequency at the nominal load current as calculated previously  
Vd = Rectifier diode forward voltage (typically 0.3 V)  
Cout = Selected output capacitor  
ESR = Output capacitor ESR value  
(7)  
See Table 5 and the typical applications section for choosing the output capacitor.  
Table 5. Recommended Input and Output Capacitors  
DEVICE  
CAPACITOR  
4.7 mF/X5R/0805  
10 mF/X5R/0805  
1 mF/X7R/1206  
1 mF/X5R/1206  
4.7 mF/X5R/1210  
VOLTAGE RATING  
COMPONENT SUPPLIER  
Tayo Yuden JMK212BY475MG  
Tayo Yuden JMK212BJ106MG  
Tayo Yuden TMK316BJ105KL  
Tayo Yuden GMK316BJ105KL  
Tayo Yuden TMK325BJ475MG  
COMMENTS  
CIN/COUT  
CIN/COUT  
COUT  
6.3 V  
6.3 V  
25 V  
35 V  
25 V  
TPS61040/41  
COUT  
COUT  
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INPUT CAPACITOR SELECTION  
For good input voltage filtering, low ESR ceramic capacitors are recommended. A 4.7 mF ceramic input capacitor  
is sufficient for most of the applications. For better input voltage filtering this value can be increased. See Table 5  
and typical applications for input capacitor recommendations.  
DIODE SELECTION  
To achieve high efficiency a Schottky diode should be used. The current rating of the diode should meet the  
peak current rating of the converter as it is calculated in the Peak Current Control section. Use the maximum  
value for ILIM for this calculation. See Table 6 and the typical applications for the selection of the Schottky diode.  
Table 6. Recommended Schottky Diode for Typical LCD Bias Supply (see Figure 15)  
DEVICE  
REVERSE VOLTAGE  
COMPONENT SUPPLIER  
ON Semiconductor MBR0530  
ON Semiconductor MBR0520  
ON Semiconductor MBRM120L  
Toshiba CRS02  
COMMENTS  
30 V  
20 V  
20 V  
30 V  
TPS61040/41  
High efficiency  
LAYOUT CONSIDERATIONS  
Typical for all switching power supplies, the layout is an important step in the design; especially at high peak  
currents and switching frequencies. If the layout is not carefully done, the regulator might show noise problems  
and duty cycle jitter.  
The input capacitor should be placed as close as possible to the input pin for good input voltage filtering. The  
inductor and diode should be placed as close as possible to the switch pin to minimize the noise coupling into  
other circuits. Because the feedback pin and network is a high-impedance circuit, the feedback network should  
be routed away from the inductor. The feedback pin and feedback network should be shielded with a ground  
plane or trace to minimize noise coupling into this circuit.  
Wide traces should be used for connections in bold as shown in Figure 15. A star ground connection or ground  
plane minimizes ground shifts and noise.  
D1  
L1  
V
O
C
FF  
R1  
V
V
IN  
SW  
FB  
IN  
C
O
C
IN  
R2  
EN  
GND  
Figure 15. Layout Diagram  
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L1  
10 µH  
D1  
V
18 V  
OUT  
V
IN  
1.8 V to 6 V  
TPS61040  
C
22 pF  
FF  
R1  
2.2 MW  
V
IN  
SW  
FB  
C2  
1 µF  
C1  
4.7 µF  
L1:  
D1:  
C1:  
C2:  
Sumida CR32-100  
Motorola MBR0530  
Tayo Yuden JMK212BY475MG  
Tayo Yuden TMK316BJ105KL  
EN  
GND  
R2  
160 kW  
Figure 16. LCD Bias Supply  
L1  
10 µH  
D1  
V
O
18 V  
TPS61040  
C
FF  
R1  
2.2 MW  
22 pF  
V
V
IN  
SW  
FB  
IN  
C2  
1 µF  
1.8 V to 6 V  
C1  
4.7 µF  
DAC or Analog Voltage  
0 V = 25 V  
1.233 V = 18 V  
EN  
GND  
R2  
160 kW  
L1:  
Sumida CR32-100  
D1:  
C1:  
C2:  
Motorola MBR0530  
Tayo Yuden JMK212BY475MG  
Tayo Yuden GMK316BJ105KL  
Figure 17. LCD Bias Supply With Adjustable Output Voltage  
R3  
200 kW  
BC857C  
L1  
10 µH  
D1  
V
IN  
V
OUT  
1.8 V to 6 V  
18 V / 10 mA  
TPS61040  
R1  
C
FF  
2.2 MW  
22 pF  
V
IN  
SW  
FB  
C2  
1 µF  
C3  
0.1 µF  
(Optional)  
C1  
4.7 µF  
R2  
160 kW  
EN  
GND  
L1:  
D1:  
C1:  
C2:  
Sumida CR32-100  
Motorola MBR0530  
Tayo Yuden JMK212BY475MG  
Tayo Yuden TMK316BJ105KL  
Figure 18. LCD Bias Supply With Load Disconnect  
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TPS61041  
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SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
D3  
V2 = –10 V/15 mA  
D2  
C4  
4.7 µF  
C3  
1 µF  
L1  
D1  
6.8 µH  
V1 = 10 V/15 mA  
TPS61040  
C
FF  
22 pF  
R1  
1.5 MW  
V
SW  
FB  
IN  
V
IN  
= 2.7 V to 5 V  
C2  
1 µF  
C1  
4.7 µF  
L1:  
Murata LQH4C6R8M04  
D1, D2, D3: Motorola MBR0530  
EN  
GND  
R2  
C1:  
Tayo Yuden JMK212BY475MG  
210 kW  
C2, C3, C4: Tayo Yuden EMK316BJ105KF  
Figure 19. Positive and Negative Output LCD Bias Supply  
L1  
6.8 µH  
D1  
V
O =  
12 V/35 mA  
TPS61040  
C
4.7 pF  
FF  
R1  
1.8 MW  
V
IN  
3.3 V  
V
IN  
SW  
FB  
C2  
4.7 µF  
C1  
10 µF  
L1:  
Murata LQH4C6R8M04  
Motorola MBR0530  
Tayo Yuden JMK212BJ106MG  
Tayo Yuden EMK316BJ475ML  
EN  
GND  
R2  
205 kW  
D1:  
C1:  
C2:  
Figure 20. Standard 3.3-V to 12-V Supply  
D1  
3.3 µH  
TPS61040  
5 V/45 mA  
C
FF  
3.3 pF  
R1  
620 kW  
V
1.8 V to 4 V  
SW  
FB  
IN  
C2  
4.7 µF  
C1  
4.7 µF  
R2  
200 kW  
EN  
GND  
L1:  
D1:  
Murata LQH4C3R3M04  
Motorola MBR0530  
C1, C2: Tayo Yuden JMK212BY475MG  
Figure 21. Dual Battery Cell to 5-V/50-mA Conversion  
Efficiency Approx. Equals 84% at VIN = 2.4 V to Vo = 5 V/45 mA  
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SLVS413F OCTOBER 2002REVISED DECEMBER 2010  
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L1  
10 µH  
D1  
D2  
24 V  
V
CC  
= 2.7 V to 6 V  
V
IN  
SW  
(Optional)  
C1  
4.7 µF  
FB  
L1:  
D1:  
C1:  
C2:  
Murata LQ  
Motorola  
Tayo Yud  
Tayo Yud  
C2  
1 µF  
R
82 Ω  
EN  
PWM  
100 Hz to 500 Hz  
GND  
S
Figure 22. White LED Supply With Adjustable Brightness Control  
Using a PWM Signal on the Enable Pin, Efficiency Approx. Equals 86% at VIN = 3 V, ILED = 15 mA  
D1  
L1  
MBRM120L  
10 µH  
C2  
100 nF  
(See  
D2  
24 V  
(Optional)  
V
CC  
= 2.7 V to 6 V  
V
SW  
FB  
IN  
Note A)  
C1  
4.7 µF  
R1  
120 kΩ  
EN  
GND  
R
S
110 Ω  
L1:  
D1:  
C1:  
C2:  
Murata LQH4C3R3M04  
Motorola MBR0530  
Tayo Yuden JMK212BY475MG  
Standard Ceramic Capacitor  
Analog Brightness Control  
3.3 V Led Off  
R2  
160 kΩ  
0 V Iled = 20 mA  
A. A smaller output capacitor value for C2 causes a larger LED ripple.  
Figure 23. White LED Supply With Adjustable Brightness Control  
Using an Analog Signal on the Feedback Pin  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Oct-2013  
PACKAGING INFORMATION  
Orderable Device  
TPS61040DBVR  
TPS61040DBVRG4  
TPS61040DDCR  
TPS61040DDCT  
TPS61040DRVR  
TPS61040DRVRG4  
TPS61040DRVT  
TPS61040DRVTG4  
TPS61041DBVR  
TPS61041DBVRG4  
TPS61041DRVR  
TPS61041DRVRG4  
TPS61041DRVT  
TPS61041DRVTG4  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
ACTIVE  
SOT-23  
SOT-23  
SOT  
DBV  
5
5
5
5
6
6
6
6
5
5
6
6
6
6
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
PHOI  
PHOI  
QXK  
QXK  
CCL  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
DBV  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
DBV  
DBV  
DRV  
DRV  
DRV  
DRV  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
SOT  
Green (RoHS  
& no Sb/Br)  
SON  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
SON  
Green (RoHS  
& no Sb/Br)  
CCL  
SON  
Green (RoHS  
& no Sb/Br)  
CCL  
SON  
250  
Green (RoHS  
& no Sb/Br)  
CCL  
SOT-23  
SOT-23  
SON  
3000  
3000  
3000  
3000  
250  
Green (RoHS  
& no Sb/Br)  
PHPI  
PHPI  
CAW  
CAW  
CAW  
CAW  
Green (RoHS  
& no Sb/Br)  
Green (RoHS NIPDAU | CU NIPDAU Level-1-260C-UNLIM  
& no Sb/Br)  
SON  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
SON  
Green (RoHS NIPDAU | CU NIPDAU Level-1-260C-UNLIM  
& no Sb/Br)  
SON  
250  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Oct-2013  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS61040, TPS61041 :  
Automotive: TPS61040-Q1, TPS61041-Q1  
NOTE: Qualified Version Definitions:  
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Oct-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS61040DBVR  
TPS61040DBVR  
TPS61040DDCR  
TPS61040DDCT  
TPS61040DRVR  
TPS61040DRVT  
TPS61041DBVR  
TPS61041DBVR  
TPS61041DRVR  
SOT-23  
SOT-23  
SOT  
DBV  
DBV  
DDC  
DDC  
DRV  
DRV  
DBV  
DBV  
DRV  
5
5
5
5
6
6
5
5
6
3000  
3000  
3000  
250  
179.0  
178.0  
179.0  
179.0  
179.0  
179.0  
179.0  
178.0  
179.0  
8.4  
9.0  
8.4  
8.4  
8.4  
8.4  
8.4  
9.0  
8.4  
3.2  
3.23  
3.2  
3.2  
3.17  
3.2  
1.4  
1.37  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q2  
Q2  
Q3  
Q3  
Q2  
SOT  
3.2  
3.2  
1.4  
SON  
3000  
250  
2.2  
2.2  
1.2  
SON  
2.2  
2.2  
1.2  
SOT-23  
SOT-23  
SON  
3000  
3000  
3000  
3.2  
3.2  
1.4  
3.23  
2.2  
3.17  
2.2  
1.37  
1.2  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
9-Oct-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS61040DBVR  
TPS61040DBVR  
TPS61040DDCR  
TPS61040DDCT  
TPS61040DRVR  
TPS61040DRVT  
TPS61041DBVR  
TPS61041DBVR  
TPS61041DRVR  
SOT-23  
SOT-23  
SOT  
DBV  
DBV  
DDC  
DDC  
DRV  
DRV  
DBV  
DBV  
DRV  
5
5
5
5
6
6
5
5
6
3000  
3000  
3000  
250  
203.0  
180.0  
195.0  
195.0  
203.0  
203.0  
203.0  
180.0  
203.0  
203.0  
180.0  
200.0  
200.0  
203.0  
203.0  
203.0  
180.0  
203.0  
35.0  
18.0  
45.0  
45.0  
35.0  
35.0  
35.0  
18.0  
35.0  
SOT  
SON  
3000  
250  
SON  
SOT-23  
SOT-23  
SON  
3000  
3000  
3000  
Pack Materials-Page 2  
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