TPS610994YFFR [TI]
具有 800nA 超低静态电流的 0.7V 输入电压同步升压转换器 | YFF | 6 | -40 to 85;
| 型号： | TPS610994YFFR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 800nA 超低静态电流的 0.7V 输入电压同步升压转换器 | YFF | 6 | -40 to 85 升压转换器 |
| 文件： | 总35页 (文件大小：4067K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS61099
SLVSD88K –JULY 2016–REVISED MAY 2018
TPS61099x Synchronous Boost Converter with Ultra-Low Quiescent Current
The TPS61099x boost converter uses a hysteretic
control topology to obtain maximal efficiency at
minimal quiescent current. It only consumes 1-µA
quiescent current under light load condition and can
achieve up to 75% efficiency at 10-µA load with fixed
output voltage version. It can also support up to 300-
mA output current from 3.3 V to 5 V conversion, and
achieve up to 93% at 200-mA load.
1 Features
1
•
•
•
•
•
•
•
•
•
600 nA Ultra-Low IQ into VOUT Pin
400 nA Ultra-Low IQ into VIN Pin
Operating Input Voltage from 0.7 V to 5.5 V
Adjustable Output Voltage from 1.8 V to 5.5 V
Fixed Output Voltage Versions Available
Minimum 0.8 A Switch Peak Current Limit
Regulated Output Voltage in Down Mode
True Disconnection During Shutdown
The TPS61099x also offers both Down Mode and
Pass-Through operations for different applications. In
Down Mode, the output voltage can still be regulated
at target value even when input voltage is higher than
output voltage. In Pass-Through Mode, the output
voltage follows input voltage. The TPS61099x exits
Down Mode and enters into Pass-Through Mode
when VIN > VOUT + 0.5 V.
Up to 75% Efficiency at 10 µA Load with Fixed
Output Voltage Versions
•
•
Up to 93% Efficiency from 10 mA to 300 mA Load
6-Ball 1.23 mm x 0.88 mm WCSP package and 2-
mm x 2-mm WSON package
The TPS61099x supports true shutdown function
when it is disabled, which disconnects the load from
the input supply to reduce the current consumption.
•
Create a Custom Design Using the TPS61099x
With the WEBENCH® Power Designer
The TPS61099x offers both adjustable output voltage
version and fixed output voltage versions. It is
2 Applications
available in 6-ball 1.23-mm
Package and 6-pin 2-mm x 2-mm WSON package .
x 0.88-mm WCSP
•
•
•
•
•
•
Memory LCD Bias
Optical Heart Rate Monitor LED Bias
Wearable Applications
Device Information(1)
Low Power Wireless Applications
Portable Products
PART NUMBER
TPS61099
PACKAGE
BODY SIZE (NOM)
WCSP (6)
1.23 mm x 0.88 mm
Battery Powered Systems
TPS61099x
TPS61099
WSON(6)
2 mm x 2 mm
3 Description
TPS61099x
The TPS61099x device is a synchronous boost
converter with 1-µA ultra-low quiescent current. The
device is designed for products powered by an
alkaline battery, NiMH rechargeable battery, Li-Mn
battery or rechargeable Li-Ion battery, for which high
efficiency under light load condition is critical to
achieve long battery life operation.
(1) For all available packages, see the orderable addendum at
the end of this document.
Typical Application Circuit
1.8 V to 5.5 V
VOUT
L1
SW
VOUT
FB
2.2 µH
C2
C3
R1
R2
VIN
VIN TPS61099
10 µF 10 µF
0.7 V to 5.5 V
C1
10 µF
EN
GND
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS61099
SLVSD88K –JULY 2016–REVISED MAY 2018
www.ti.com
Table of Contents
8.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application - 5 V Output Boost Converter .. 15
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Typical Characteristics.............................................. 8
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 11
9
10 Power Supply Recommendations ..................... 19
11 Layout................................................................... 20
11.1 Layout Guidelines ................................................. 20
11.2 Layout Example .................................................... 20
12 Device and Documentation Support ................. 22
12.1 Device Support...................................................... 22
12.2 Documentation Support ........................................ 22
12.3 Receiving Notification of Documentation Updates 22
12.4 Community Resources.......................................... 22
12.5 Trademarks........................................................... 23
12.6 Electrostatic Discharge Caution............................ 23
12.7 Glossary................................................................ 23
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision J (October 2017) to Revision K
Page
•
Added Load Efficiency graph for TPS610995 device ............................................................................................................ 8
Changes from Revision I (September 2017) to Revision J
Page
•
•
•
•
Changed from +0.3 V to +0.5 V in Description section .......................................................................................................... 1
Changed graph image for Figure 7 ........................................................................................................................................ 8
Changed from +0.3 V to +0.5 V in fourth paragraph of Down Mode Regulation and Pass-Through Operation section ..... 13
Changed Image for Figure 20 ............................................................................................................................................. 14
Changes from Revision H (July 2017) to Revision I
Page
•
Added devices to the Device Comparison Table and added graphs to Typical Characteristics section. .............................. 4
Changes from Revision G (July 2017) to Revision H
Page
•
•
Changed TPS610994 Output accuracy typical value from 3.33 to 3.4 for "VIN < VOUT, PFM mode" in the Electrical
Characteristics table. .............................................................................................................................................................. 6
Changed TPS610993 Output accuracy typical value from 3.03 to 3.1 for "VIN < VOUT, PFM mode" in the Electrical
Characteristics table. .............................................................................................................................................................. 6
Changes from Revision F (June 2017) to Revision G
Page
•
Added TPS610993 device Output accuracy specs. to Electrical Characteristics table ........................................................ 6
2
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SLVSD88K –JULY 2016–REVISED MAY 2018
Changes from Revision E (April 2017) to Revision F
Page
•
•
•
Deleted voltage-variant devices from Data Sheet Header .................................................................................................... 1
Added TPS610993 Load Efficiency with Different Inputs....................................................................................................... 8
Changed Functional Block Diagram .................................................................................................................................... 11
Changes from Revision D (March 2017) to Revision E
Page
•
Changed figures 1 and 2: Load Efficiency with Different Inputs, figure 3:TPS610994 Load Efficiency with Different
Inputs, and figure 4:Load Efficiency with Different Outputs with new graph data.................................................................. 8
Changes from Revision C (January 2017) to Revision D
Page
•
Changed text string in the Programming the Output Voltage section, 2nd para From "....the FB pin should be
connected to the VOUT pin directly" To ".....the FB pin should be connected to the GND" .................................................. 16
Changes from Revision B (December 2016) to Revision C
Page
•
•
•
•
•
Added WEBENCH® Model ..................................................................................................................................................... 1
Added devices to the Device Comparison Table .................................................................................................................. 4
Added TPS610994 device Output accuracy specs. to Electrical Characteristics table ........................................................ 6
Added Figure 5 ...................................................................................................................................................................... 8
Added Figure 15 .................................................................................................................................................................... 9
Changes from Revision A (September 2016) to Revision B
Page
•
•
Added device TPS610997; global change ............................................................................................................................ 1
Changed From: "Connect to VOUT pin...." To: " Connect to GND pin...." for C2 pin description in the Pin
Configuration and Functions table, . ...................................................................................................................................... 4
•
•
Added Output accuracy spec for TPS610997 device in the Output section of the Electrical Characteristics table .............. 6
Added Figure 2 and Figure 14................................................................................................................................................ 9
Changes from Original (June 2016) to Revision A
Page
•
Added full data sheet specs - global change ........................................................................................................................ 1
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SLVSD88K –JULY 2016–REVISED MAY 2018
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5 Device Comparison Table
PART NUMBER
TPS61099
OUTPUT VOLTAGE
Adjustable
5.0 V
TPS610997
TPS610996
TPS610995
TPS610994
TPS610993
TPS610992
TPS610991(1)
4.5 V
3.6 V
3.3 V
3.0 V
2.5 V
1.8 V
(1) Product Preview. Contact TI factory for more information.
6 Pin Configuration and Functions
YFF Package
6-Pin YFF
Top View
DRV Package
6-Pin DRV
Top View
VIN
SW
EN
A1
B1
C1
A2
B2
C2
GND
VOUT
FB
1
2
3
6
5
4
Pin Functions
PIN
YFF
TYPE
DESCRIPTION
NAME
VIN
DRV
A1
B1
6
5
I
IC power supply input
SW
PWR Switch pin of the converter. It is connected to the inductor
Enable logic input. Logic high voltage enables the device; logic low voltage disables the device.
Do not leave it floating.
EN
C1
4
I
GND
A2
B2
1
2
PWR Ground
VOUT
PWR Boost converter output
Voltage feedback of adjustable output voltage. Connect to the center tap of a resistor divider to
program the output voltage. Connect to GND pin for fixed output voltage versions.
FB
C2
3
7
I
PowerPad
Connect to GND
4
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SLVSD88K –JULY 2016–REVISED MAY 2018
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
-0.3
–40
–65
MAX
6.0
UNIT
V
Voltage range at terminals(2)
VIN, SW, VOUT, FB, EN
Operating junction temperature, TJ
Storage temperature range, Tstg
150
150
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
7.2 ESD Ratings
VALUE
UNIT
Human Body Model (HBM), per ANSI/ESDA/JEDEC JS-001, all
pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged Device Model (CDM), per JEDEC specification JESD22-
C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500V HBM rating allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM rating allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
0.7
1.8
0.7
1.0
10
NOM
MAX
5.5
UNIT
VIN
VOUT
L
Input voltage range
Output voltage range
Inductor
V
V
5.5
2.2
10
20
2.86
µH
µF
µF
°C
CIN
COUT
TJ
Input capacitor
Output capacitor
100
125
Operating virtual junction temperature
–40
7.4 Thermal Information
TPS61099
THERMAL METRIC(1)
UNIT
YFF (6 BALLS,
WCSP)
DRV(6 PINS,
WSON)
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
134.4
0.9
71.7
83.0
33.9
2.7
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJCtop
RθJB
36.1
0.1
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
36.2
N/A
33.4
14.4
RθJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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7.5 Electrical Characteristics
TJ = -40°C to 125°C and VIN = 0.7 V to 5.5 V. Typical values are at VIN = 3.7 V, TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX
UNIT
POWER SUPPLY
VIN
Input voltage range
TPS61099x
TPS61099x
TPS61099x
0.7
5.5
0.7
V
V
VUVLO
Input under voltage lockout threshold
UVLO hysteresis
VIN rising
0.6
200
mV
IC enabled, no Load, no Switching
TJ = -40 °C to 85 °C
Quiescent current into VIN pin
Quiescent current into VOUT pin
Shutdown current into VIN pin
TPS61099x
TPS61099x
TPS61099x
0.4
0.6
0.5
1.1
1.5
1.6
µA
µA
µA
IQ
IC enabled, no Load, no Switching,
Boost or Down Mode
TJ = -40 °C to 85 °C
IC disabled, VIN = 3.7 V, VOUT = 0 V
TJ = -40 °C to 85 °C
ISD
OUTPUT
VOUT
Output voltage range
TPS61099
1.8
5.5
V
V
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
VIN < VOUT, PWM mode
VIN < VOUT, PFM mode
4.90
5.00
5.15
3.30
3.4
5.10
TPS610997
3.23
2.94
4.4
3.37
3.06
4.6
V
TPS610994
TPS610993
TPS610996
TPS610992
TPS610995
3.0
V
V
V
V
3.1
Output accuracy
4.5
4.63
2.5
2.45
3.53
0.98
2.55
3.67
1.02
2.58
3.6
3.71
1.00
1.03
VREF
Feedback reference voltage
TPS61099
TPS61099
V
V
Output overvoltage protection
threshold
VOVP
TPS61099x
VOUT rising
5.6
5.8
6.0
V
OVP hysteresis
TPS61099x
TPS61099x
100
10
200
50
mV
nA
IFB_LKG
Leakage current into FB pin
VFB = 1.0 V
POWER SWITCH
VOUT = 5.0 V
VOUT = 3.3 V
VOUT = 1.8 V
VOUT = 5.0 V
VOUT = 3.3 V
VOUT = 1.8 V
VOUT = 5.0 V
VOUT = 3.3 V
VOUT = 1.8 V
250
300
400
300
350
500
350
300
250
1
mΩ
mΩ
mΩ
mΩ
mΩ
mΩ
mA
mA
mA
A
RDS(on)_LS
Low side switch on resistance
TPS61099x
TPS61099x
TPS61099x
350
450
750
RDS(on)_HS Rectifier on resistance
ILH
Inductor current ripple
Current limit threshold
VOUT ≥ 2.5 V, boost operation
0.8
0.5
1.25
200
ILIM
TPS61099x
TPS61099x
VOUT < 2.5 V, boost operation
0.75
A
Leakage current into SW pin (from SW
pin to GND)
ISW_LKG
VSW = 5.0 V, no switch, TJ = -40 °C to 85 °C
nA
6
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SLVSD88K –JULY 2016–REVISED MAY 2018
Electrical Characteristics (continued)
TJ = -40°C to 125°C and VIN = 0.7 V to 5.5 V. Typical values are at VIN = 3.7 V, TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX
UNIT
CONTROL LOGIC
0.2 x
VIN
VIL
VIH
EN input low voltage threshold
EN input high voltage threshold
TPS61099x
TPS61099x
VIN ≤ 1.5 V
VIN ≤ 1.5 V
V
V
0.8 x
VIN
VIL
EN input low voltage threshold
EN input high voltage threshold
Leakage current into EN pin
Overtemperature protection
Overtemperature hysteresis
TPS61099x
TPS61099x
TPS61099x
TPS61099x
TPS61099x
VIN > 1.5 V
VIN > 1.5 V
VEN = 5.0 V
0.4
V
V
VIH
1.2
50
IEN_LKG
nA
°C
°C
150
25
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7.6 Typical Characteristics
100
95
90
85
80
75
70
65
60
55
50
45
100
95
90
85
80
75
70
65
60
55
VIN = 0.7 V
VIN = 1.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
VIN = 0.7 V
VIN = 1.5 V
VIN = 3.0 V
VIN = 3.6 V
VIN = 4.2 V
0.005
0.1
1
10
100
1000
0.005
0.1
1
10
100
1000
IOUT (mA)
IOUT (mA)
D001
D002
TPS61099, VIN = 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 5.0 V
TPS610997, VIN= 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V
Figure 1. TPS61099 Load Efficiency with Different Inputs
Figure 2. TPS610997 Load Efficiency with Different Inputs
100
95
90
85
80
75
70
65
60
100
95
90
85
80
75
70
65
VIN = 0.7V
VIN = 1.5V
VIN = 2.5V
VIN = 3.0V
60
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.7 V
VIN = 3.3 V
VIN = 4.2 V
55
55
50
VIN = 3.3V
50
0.01
0.1 0.2 0.5
1
2 3 5 710 20 50 100
Iout (mA)
1000
0.01
0.1
1
10
100
1000
Output Current (mA)
TPS6
D016
TPS610996, VIN= 0.7 V, 1.5 V, 2.7, 3.3 V, 4.2 V
TPS610995, VIN= 0.7 V, 1.5 V, 2.0, 3.0 V, 3.3 V
Figure 4. TPS610995 Load Efficiency with Different Inputs
Figure 3. TPS610996 Load Efficiency with Different Inputs
100
95
90
85
80
75
70
65
60
VIN = 0.7 V
VIN = 1.5 V
VIN = 2.5 V
VIN = 3.0 V
10
IOUT (mA)
0.1
1
100
1000
0.005
0.1
1
10
100
1000
IOUT (mA)
D003
TPS610993, VIN= 0.7 V, 1.5 V, 2.2 V, 2.5 V
TPS610994, VIN= 0.7 V, 1.5 V, 2.5 V, 3.0 V
Figure 6. TPS610993 Load Efficiency with Different Inputs
Figure 5. TPS610994 Load Efficiency with Different Inputs
8
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Typical Characteristics (continued)
100
95
90
85
80
75
70
65
60
55
50
95
90
85
80
75
70
65
60
55
50
VIN = 0.7 V
VIN = 1.2 V
VIN = 1.5 V
VIN = 2.2 V
VOUT = 3.0 V
VOUT = 3.6 V
VOUT = 4.5 V
VOUT = 5.0 V
0.01
0.1
1
10
100
1000
0.005
0.1
1
10
100
1000
Output Current (mA)
IOUT (mA)
D014
D004
TPS610992, VIN= 0.7 V, 1.2 V, 1.5 V, 2.2 V
TPS61099, VIN = 2.4 V, VOUT = 3.0 V, 3.6 V, 4.5 V, 5.0 V
Figure 7. TPS610992 Load Efficiency with Different Inputs
Figure 8. Load Efficiency with Different Outputs
5.4
5.3
5.2
5.1
5
1.2
Vin = 0.7 V
Vin = 1.5 V
Vin = 3.0 V
Vin = 3.6 V
Vin = 4.2 V
VIN = 3.7 V
1
0.8
0.6
0.4
0.2
0
4.9
4.8
4.7
10 µ
100 µ
1 m
10 m
100 m
600 m
D003a
-40
-20
0
20 40
Temperature (°C)
60
80
100
Output Current (A)
D004
TPS61099, VIN = 0.7 V, 1.5 V, 3.0 V, 3.6 V, 4.2 V, VOUT = 5.0 V
VIN = 3.7 V
No Switching
Figure 9. Load Regulation
Figure 10. Quiescent Current into VOUT vs Temperature
0.7
1.2
VIN = 3.7 V
0.6
0.5
0.4
0.3
0.2
1
0.8
0.6
0.4
0.2
0
VIN = 3.7 V
80 100
0.1
-40
-20
0
20 40
Temperature (°C)
60
-40
-20
0
20 40
Temperature (°C)
60
80
100
D005
D006
VIN = 3.7 V
No Switching
VIN = 3.7 V, Into VIN and SW
Figure 11. Quiescent Current into VIN vs Temperature
Figure 12. Shutdown Current vs Temperature
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Typical Characteristics (continued)
1.009
5.02
5.018
5.016
5.014
5.012
5.01
VIN = 3.7 V
1.007
1.005
1.003
1.001
0.999
0.997
0.995
5.008
5.006
5.004
5.002
5
-40
-20
0
20
40
Temperature (°C)
TPS61099, VIN = 3.7 V
60
80
100 120 140
-40
-20
0
20
40
60
80
100 120 140
Temperature (èC)
D010
TJ = –40°C to 125°C
TPS610997, VIN= 3.7 V, TJ = –40°C to 125°C
Figure 13. Reference Voltage vs Temperature
Figure 14. Output Voltage vs Temperature
1.1
1.05
1
3.324
VIN = 3.7 V
3.322
3.32
3.318
3.316
3.314
3.312
3.31
0.95
3.308
3.306
3.304
0.9
-40
-20
0
20
40
60
80
100 120 140
–40
10
60
125
Temperature (èC)
D012
Temperature (°C)
D001
VIN = 3.7 V
TJ = –40°C to 125°C
TPS610994, VIN= 2.5 V, TJ = –40°C to 125°C
Figure 16. Current Limit vs Temperature
Figure 15. TPS610994 Output Voltage vs Temperature
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8 Detailed Description
8.1 Overview
The TPS61099x synchronous step-up converter is designed for alkaline battery, coin-cell battery, Li-ion or Li-
polymer battery powered systems, which requires long battery running time and tiny solution size. The
TPS61099x can operate with a wide input voltage from 0.7 V to 5.5 V. It only consumes 1 µA quiescent current
and can achieve high efficiency under light load condition.
The TPS61099x operates in a hysteretic control scheme with typical 1-A peak switch current limit. The
TPS61099x provides the true shutdown function and the load is completely disconnected from the input so as to
minimize the leakage current. It also adopts Down Mode and Pass-Through operation when input voltage is
close to or higher than the regulated output voltage. The TPS61099x family is available in both adjustable and
fixed output voltage versions. Adjustable version offers programmable output voltage for flexible applications
while fixed versions offer minimal solution size and achieve up to 75% high efficiency under 10-µA load.
8.2 Functional Block Diagram
B1
B2 VOUT
SW
(1)
Current
Sense
Protection
(OCP, OVP)
Boost
Gate Driver
Startup
UVLO
Pulse
Modulator
REF
TPS61099x
TPS61099
OCP
OVP
C2
FB
VDOWN
Down Mode
Logic
Control
VIN
A1
Thermal
Shutdown
Pass-Through
VPSTH
A2
GND
EN C1
Copyright © 2017, Texas Instruments Incorporated
(1) Internal FB resistor divider is implemented in fixed output voltage versions.
Figure 17. Functional Block Diagram
8.3 Feature Description
8.3.1 Boost Controller Operation
The TPS61099x boost converter is controlled by a hysteretic current mode controller. This controller regulates
the output voltage by keeping the inductor ripple current constant in the range of 300 mA and adjusting the offset
of this inductor current depending on the output load. Since the input voltage, output voltage and inductor value
all affect the rising and falling slopes of inductor ripple current, the switching frequency is not fixed and is
determined by the operation condition. If the required average input current is lower than the average inductor
current defined by this constant ripple, the inductor current goes discontinuously to keep the efficiency high under
light load condition. Figure 18 illustrates the hysteretic current operation. If the load current is reduced further, the
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Feature Description (continued)
boost converter enters into Burst mode. In Burst mode, the boost converter ramps up the output voltage with
several switching cycles. Once the output voltage exceeds a setting threshold, the device stops switching and
goes into a sleep status. In sleep status, the device consumes less quiescent current. It resumes switching when
the output voltage is below the setting threshold. It exits the Burst mode when the output current can no longer
be supported in this mode. Refer to Figure 19 for Burst mode operation details.
To achieve high efficiency, the power stage is realized as a synchronous boost topology. The output voltage
VOUT is monitored via an external or internal feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly.
IL
Continuous Current Operation
Discontinuous Current Operation
300 mA
(typ.)
300 mA
(typ.)
t
Figure 18. Hysteretic Current Operation
Output Voltage of
Boost Converter
Burst Mode Operation at
Light Load
VOUT_BST
Continuous Current Operation at
Heavy Load
VOUT_NOM
t
Figure 19. Burst Mode Operation
8.3.2 Under-Voltage Lockout
An under-voltage lockout (UVLO) circuit stops the operation of the converter when the input voltage drops below
the typical UVLO threshold of 0.4 V. A hysteresis of 200 mV is added so that the device cannot be enabled again
until the input voltage goes up to 0.6 V. This function is implemented in order to prevent malfunctioning of the
device when the input voltage is between 0.4 V and 0.6 V.
8.3.3 Enable and Disable
When the input voltage is above UVLO rising threshold and the EN pin is pulled to high voltage, the TPS61099x
is enabled. When the EN pin is pulled to low voltage, the TPS61099x goes into shutdown mode. In shutdown
mode, the device stops switching and the rectifying PMOS fully turns off, providing the completed disconnection
between input and output. Less than 0.5-µA input current is consumed in shutdown mode.
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Feature Description (continued)
8.3.4 Soft Start
After the EN pin is tied to high voltage, the TPS61099x begins to startup. At the beginning, the device operates
at the boundary of Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM), and the
inductor peak current is limited to around 200 mA during this stage. When the output voltage is charged above
approximately 1.6 V, the device starts the hysteretic current mode operation. The current limit threshold is
gradually increasing to 0.7× ILIM within 500 µs. In this way, the soft start function reduces the inrush current
during startup. After VOUT reaches the target value, soft start stage ends and the peak current is now determined
by the output of an internal error amplifier which compares the feedback of the output voltage and the internal
reference voltage.
The TPS61099x is able to start up with 0.7-V input voltage with larger than 3-kΩ load. However, if the load during
startup is so heavy that the TPS61099x fails to charge the output voltage above 1.6 V, the TPS61099x can't start
up successfully until the input voltage is increased or the load current is reduced. The startup time depends on
input voltage and load current.
8.3.5 Current Limit Operation
The TPS61099x employs cycle-by-cycle over-current protection (OCP) function. If the inductor peak current
reaches the current limit threshold ILIM, the main switch turns off so as to stop further increase of the input
current. In this case the output voltage will decrease until the power balance between input and output is
achieved. If the output drops below the input voltage, the TPS61099x enters into Down Mode. The peak current
is still limited by ILIM cycle-by-cycle in Down Mode. If the output drops below 1.6 V, the TPS61099 enters into
startup process again. In Pass-Through operation, current limit function is not enabled.
8.3.6 Output Short-to-Ground Protection
The TPS61099x starts to limit the switch current to 200 mA when the output voltage is below 1.6 V. If short-to-
ground condition occurs, switch current is limited at 200 mA. Once the short circuit is released, the TPS61099x
goes back to soft start again and regulates the output voltage.
8.3.7 Over Voltage Protection
TPS61099x has an output over-voltage protection (OVP) to protect the device in case that the external feedback
resistor divider is wrongly populated. When the output voltage of the TPS61099 exceeds the OVP threshold of
5.8 V, the device stops switching. Once the output voltage falls 0.1 V below the OVP threshold, the device starts
operating again.
8.3.8 Down Mode Regulation and Pass-Through Operation
The TPS61099x features Down Mode and Pass-Through operation when input voltage is close to or higher than
output voltage.
In the Down Mode, output voltage is regulated at target value even when VIN > VOUT. The control circuit changes
the behavior of the rectifying PMOS by pulling its gate to input voltage instead of to ground. In this way, the
voltage drop across the PMOS is increasing as high as to regulate the output voltage. The power loss also
increases in this mode, which needs to be taken into account for thermal consideration.
In the Pass-Through operation, the boost converter stops switching. The rectifying PMOS constantly turns on
and low side switch constantly turns off. The output voltage is the input voltage minus the voltage drop across
the dc resistance (DCR) of the inductor and the on-resistance of the rectifying PMOS.
With VIN ramping up, the TPS61099x goes into Down Mode first when VIN > VOUT – 50mV. It stays in Down Mode
until VIN > VOUT + 0.5 V and then goes automatically into Pass-Through operation. In the Pass-Through
operation, output voltage follows input voltage. The TPS61099x exits Pass-Through Mode and goes back to
Down Mode when VIN ramps down to 103% of the target output voltage. It stays in Down Mode until input voltage
falls 100mV below the output voltage, returning to Boost operation.
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Feature Description (continued)
3 1
2
1 3
Voltage
1:Down Mode
2:Pass-through Mode
3:Boost Mode
500mV
VIN
3%*VOUT
VOUT
50mV
100mV
Figure 20. Down Mode and Pass-Through Operation
8.3.9 Thermal Shutdown
The TPS61099x has a built-in temperature sensor which monitors the internal junction temperature in boost
mode operation. If the junction temperature exceeds the threshold 150°C, the device stops operating. As soon as
the junction temperature drops below the shutdown temperature minus the hysteresis, typically 125°C, it starts
operating again.
8.4 Device Functional Modes
8.4.1 Burst Mode Operation under Light Load Condition
The boost converter of TPS61099x enters into Burst Mode operation under light load condition. Refer to Boost
Controller Operation for details.
8.4.2 Down Mode Regulation and Pass-Through Mode Operation
The boost converter of TPS61099x automatically enters into Down Mode or pass-through mode operation when
input voltage is higher than the target output voltage. Refer to Down Mode Regulation and Pass-Through
Operation for details.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS61099x is a synchronous boost converter designed to operate at a wide input voltage from 0.7 V to 5.5
V with 1-A peak switch current limit. The device adopts a hysteretic control scheme so the operating frequency is
not a constant value, which varies with different input/output voltages and inductor values. It only consumes 1-µA
quiescent current under light load condition. It also supports true shutdown to disconnect the load from the input
in order to minimize the leakage current. Therefore, it is very suitable for alkaline battery, coin-cell battery, Li-ion
or Li-polymer battery powered systems to extend the battery running time.
9.2 Typical Application - 5 V Output Boost Converter
L1
VOUT
5 V
SW
VOUT
FB
2.2 µH
C3
C2
R1
R2
VIN
VIN TPS61099
10 µF
10 µF
2.7 V to 4.2 V
C1
10 µF
EN
GND
Copyright © 2016, Texas Instruments Incorporated
9.2.1 Design Requirements
A typical application example is the memory LCD, which normally requires 5-V output as its bias voltage and only
consumes less than 1 mA current. The following design procedure can be used to select external component
values for the TPS61099x.
Table 1. Design Requirements
PARAMETERS
Input Voltage
VALUES
2.7 V ~ 4.2 V
5 V
Output Voltage
Output Current
1 mA
Output Voltage Ripple
± 50 mV
9.2.1.1 Detailed Design Procedure
9.2.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61099 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
Run electrical simulations to see important waveforms and circuit performance
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•
•
•
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.1.1.2 Programming the Output Voltage
There are two ways to set the output voltage of the TPS61099x. For adjustable output voltage version, select the
external resistor divider R1 and R2, as shown in Equation 1, the output voltage is programmed to the desired
value. When the output voltage is regulated, the typical voltage at the FB pin is VREF of 1.0 V.
R1+ R2
VOUT = VREF
∂
R2
(1)
For fixed output voltage versions, the FB pin should be connected to the GND. The TPS61099x offers diverse
fixed voltage versions, refer to Device Comparison Table for version details.
In this example, 5-V output is required to bias the memory LCD. For the best accuracy, the current following
through R2 should be 100 times larger than FB pin leakage current. Changing R2 towards a lower value
increases the robustness against noise injection. Changing R2 towards higher values reduces the FB divider
current for achieving the highest efficiency at low load currents. 1-MΩ and 249-kΩ resistors are selected for R1
and R2 in this example. High accuracy resistors are recommended for better output voltage accuracy.
9.2.1.1.3 Maximum Output Current
The maximum output capability of the TPS61099x is determined by the input to output ratio and the current limit
of the boost converter. It can be estimated by Equation 2.
I
VIN ∂(ILIM
-
LH )∂ h
2
IOUT(max)
=
VOUT
where
•
•
•
η is the conversion efficiency, use 85% for estimation
ILH is the current ripple value
ILIM is the switch current limit
(2)
Minimum input voltage, maximum boost output voltage and minimum current limit ILIM should be used as the
worst case condition for the estimation.
9.2.1.1.4 Inductor Selection
Because the selection of the inductor affects steady state operation, transient behavior, and loop stability, the
inductor is the most important component in power regulator design. There are three important inductor
specifications, inductor value, saturation current, and dc resistance (DCR).
The TPS61099x is optimized to work with inductor values between 1 µH and 2.2 µH. For best stability
consideration, a 2.2-µH inductor is recommended under Vout > 3.0V condition while choosing a 1-µH inductor for
applications under Vout ≤ 3.0V condition. Follow Equation 3 and Equation 4 to calculate the inductor's peak
current for the application. Depending on different load conditions, the TPS61099x works in continuous current
mode or discontinuous mode. In different modes, the peak currents of the inductor are also different. Equation 3
provides an easy way to estimate whether the device works in CCM or DCM. As long as the Equation 3 is true,
continuous current mode is typically established. Otherwise, discontinuous current mode is typically established.
VOUT ∂IOUT ILH
>
VIN ì h
2
(3)
The inductor current ripple ILH is fixed by design. Therefore, the peak inductor current is calculated with
Equation 4.
VOUT ∂IOUT
I
IL,peak
=
+
LH ; continuous currentmode operation
V ì h
2
IN
IL,peak = ILH;
discontinuous currentmode operation
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where
•
IL,peak is the peak inductor current.
(4)
The inductor's saturation current must be higher than the calculated peak inductor current. Table 2 lists the
recommended inductors for TPS61099x device.
After choosing the inductor, the estimated switching frequency ƒ in continuous current mode can be calculated
by Equation 5. The switching frequency is not a constant value, which is determined by L, VIN and VOUT
.
V
IN ∂(VOUT - VIN ∂ h)
f =
L ∂ILH ∂ VOUT
(5)
(1)
Table 2. List of Inductors
INDUCTANCE
[µH]
SATURATION
CURRENT [A]
DC RESISTANCE
VOUT [V]
SIZE (LxWxH)
PART NUMBER
MANUFACTURER
[mΩ]
2.2
2.2
2.2
1.0
1.0
1.0
1.95
1.7
80
2.5 x 2.0 x 1.2
2.5 x 2.0 x 1.1
74404024022
Würth Elektronik
muRata
> 3.0
92
LQH2HPN2R2MJR
1.45
2.6
163
37
2.0 x 1.6 x 1.0 VLS201610CX-2R2M
2.5 x 2.0 x 1.2 74404024010
2.5 x 2.0 x 1.0 MLP2520W1R0MT0S1
2.0 x 1.2 x 1.0 LQM21PN1R0MGH
TDK
Würth Elektronik
TDK
≤ 3.0
2.3
48
1.5
80
muRata
(1) See Third-Party Products disclaimer
9.2.1.1.5 Capacitor Selection
For best output and input voltage filtering, low ESR X5R or X7R ceramic capacitors are recommended.
The input capacitor minimizes input voltage ripple, suppresses input voltage spikes and provides a stable system
rail for the device. An input capacitor value of 10 μF is normally recommended to improve transient behavior of
the regulator and EMI behavior of the total power supply circuit. A ceramic capacitor placed as close as possible
to the VIN and GND pins of the IC is recommended.
For the output capacitor of VOUT pin, small ceramic capacitors are recommended, placed as close as possible
to the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors
which cannot be placed close to the IC, the use of a small ceramic capacitor with a capacitance value of 1 μF in
parallel to the large one is recommended. This small capacitor should be placed as close as possible to the
VOUT and GND pins of the IC.
From the power stage point of view, the output capacitor sets the corner frequency of the converter while the
inductor creates a Right-Half-Plane-Zero. Consequently, with a larger inductor, a larger output capacitor must be
used. The TPS61099x is optimized to work with the inductor from 1 µH to 2.2 µH, so the minimal output
capacitor value is 20 μF (nominal value). Increasing the output capacitor makes the output ripple smaller in PWM
mode.
When selecting capacitors, ceramic capacitor’s derating effect under bias should be considered. Choose the right
nominal capacitance by checking capacitor's DC bias characteristics. In this example, GRM188R60J106ME84D,
which is a 10-µF ceramic capacitor with high effective capacitance value at DC biased condition, is selected for
VOUT rail. The performance of TPS61099x is shown in Application Curves section.
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9.2.1.2 Application Curves
VIN = 3.7 V
VOUT = 5 V
IOUT = 10 mA
VIN = 3.7 V
VOUT = 5 V
IOUT = 200 mA
Figure 22. Switching Waveform at Light Load
Figure 21. Switching Waveform at Heavy Load
VIN = 3.7 V
VOUT = 5 V
IOUT = 100 mA
VIN = 3.7 V
VOUT = 5 V
IOUT = 50 mA
Figure 24. Startup by EN
Figure 23. Startup by VIN
VIN = 2.4 V to 3.7 V
VOUT = 5 V
IOUT = 200 mA
VIN = 3.7 V
VOUT = 5 V
IOUT = 50 mA to 200 mA
Figure 25. Line Transient
Figure 26. Load Transient
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VIN = 3.7 V
VOUT = 5 V
IOUT = 0 mA to 250 mA
VIN = 2.4 to 5.5 V
VOUT = 5 V
IOUT = 200 mA
Figure 27. Load Regulation
Figure 28. Line Regulation
10 Power Supply Recommendations
The TPS61099x family is designed to operate from an input voltage supply range between 0.7 V to 5.5 V. The
power supply can be alkaline battery, NiMH rechargeable battery, Li-Mn battery or rechargeable Li-Ion battery.
The input supply should be well regulated with the rating of TPS61099x.
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11 Layout
11.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
11.2 Layout Example
The bottom layer is a large GND plane connected by vias.
GROUND
INPUT
Top Layer
VIA
VIN
SW
EN
GND
VOUT
FB
OUTPUT
GROUND
EN
Figure 29. Layout -YFF
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Layout Example (continued)
VIN
GND
GND
VOUT
FB
VIN
SW
EN
VOUT
EN
Figure 30. Layout - DRV
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12 Device and Documentation Support
12.1 Device Support
12.1.1 Development Support
12.1.1.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS61099x device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.1.2 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.2 Documentation Support
12.2.1 Related Documentation
For related documentation see the following:
•
•
•
Performing Accurate PFM Mode Efficiency Measurements, SLVA236
Accurately measuring efficiency of ultralow-IQ devices, SLYT558
IQ: What it is, what it isn’t, and how to use it, SLYT412
12.3 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.4 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
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12.5 Trademarks
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
12.6 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
YFF
YFF
YFF
YFF
YFF
YFF
DRV
DRV
YFF
YFF
YFF
YFF
YFF
YFF
DRV
YFF
Qty
3000
250
(1)
(2)
(3)
(4/5)
(6)
TPS610992YFFR
TPS610992YFFT
TPS610993YFFR
TPS610993YFFT
TPS610994YFFR
TPS610994YFFT
TPS610995DRVR
TPS610995DRVT
TPS610995YFFR
TPS610995YFFT
TPS610996YFFR
TPS610996YFFT
TPS610997YFFR
TPS610997YFFT
TPS61099DRVR
TPS61099YFFR
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
WSON
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 125
-40 to 125
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 150
-40 to 85
19J
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
NIPDAU
19J
3000
250
Green (RoHS
& no Sb/Br)
17X
17X
17N
17N
1NDU
1NDU
19K
19K
19I
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
WSON
Green (RoHS
& no Sb/Br)
NIPDAU
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
WSON
3000
250
Green (RoHS
& no Sb/Br)
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
NIPDAU
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
19I
3000
250
Green (RoHS
& no Sb/Br)
14K
14K
1I8U
12G
Green (RoHS
& no Sb/Br)
3000
3000
Green (RoHS
& no Sb/Br)
DSBGA
Green (RoHS
& no Sb/Br)
SNAGCU
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jul-2020
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS61099YFFT
ACTIVE
DSBGA
YFF
6
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
-40 to 85
12G
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-May-2018
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS610992YFFR
TPS610992YFFT
TPS610993YFFR
TPS610993YFFT
TPS610994YFFR
TPS610994YFFT
TPS610995DRVR
TPS610995DRVT
TPS610995YFFR
TPS610995YFFT
TPS610996YFFR
TPS610996YFFT
TPS610997YFFR
TPS610997YFFT
TPS61099YFFR
TPS61099YFFT
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
WSON
YFF
YFF
YFF
YFF
YFF
YFF
DRV
DRV
YFF
YFF
YFF
YFF
YFF
YFF
YFF
YFF
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
0.96
0.96
0.96
0.96
0.96
0.96
2.3
1.36
1.36
1.36
1.36
1.36
1.36
2.3
0.69
0.69
0.69
0.69
0.69
0.69
1.15
1.15
0.69
0.69
0.69
0.69
0.69
0.69
0.69
0.69
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q2
Q2
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
3000
250
3000
250
3000
250
WSON
2.3
2.3
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
3000
250
0.96
0.96
0.96
0.96
0.96
0.96
0.96
0.96
1.36
1.36
1.36
1.36
1.36
1.36
1.36
1.36
3000
250
3000
250
3000
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-May-2018
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS610992YFFR
TPS610992YFFT
TPS610993YFFR
TPS610993YFFT
TPS610994YFFR
TPS610994YFFT
TPS610995DRVR
TPS610995DRVT
TPS610995YFFR
TPS610995YFFT
TPS610996YFFR
TPS610996YFFT
TPS610997YFFR
TPS610997YFFT
TPS61099YFFR
TPS61099YFFT
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
WSON
YFF
YFF
YFF
YFF
YFF
YFF
DRV
DRV
YFF
YFF
YFF
YFF
YFF
YFF
YFF
YFF
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
210.0
210.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
185.0
185.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
20.0
20.0
35.0
35.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
3000
250
3000
250
3000
250
WSON
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
DRV 6
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4206925/F
PACKAGE OUTLINE
DRV0006A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
0.00
1
0.1
EXPOSED
THERMAL PAD
3
4
6
2X
7
1.3
1.6 0.1
1
4X 0.65
0.35
0.25
6X
PIN 1 ID
(OPTIONAL)
0.3
0.2
6X
0.1
C A
C
B
0.05
4222173/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
6X (0.3)
(1)
1
7
6
SYMM
(1.6)
(1.1)
4X (0.65)
4
3
SYMM
(1.95)
(R0.05) TYP
(
0.2) VIA
TYP
LAND PATTERN EXAMPLE
SCALE:25X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222173/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com
EXAMPLE STENCIL DESIGN
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
7
6X (0.45)
METAL
1
6
6X (0.3)
(0.45)
SYMM
4X (0.65)
(0.7)
4
3
(R0.05) TYP
(1)
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
PACKAGE OUTLINE
YFF0006
DSBGA - 0.625 mm max height
SCALE 10.500
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.05 C
0.30
0.12
BALL TYP
0.4 TYP
C
B
SYMM
0.8
D: Max = 1.256 mm, Min =1.196 mm
E: Max = 0.914 mm, Min =0.854 mm
TYP
0.4 TYP
A
0.3
6X
2
1
0.2
SYMM
0.015
C A B
4223785/A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFF0006
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.23)
(0.4) TYP
1
2
A
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:30X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
(
0.23)
METAL
EXPOSED
METAL
EXPOSED
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223785/A 06/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,
see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0006
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
2
6X ( 0.25)
(0.4) TYP
(R0.05) TYP
1
A
B
SYMM
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:35X
4223785/A 06/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
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