TPS61222-EP [TI]
具有 5.5μA 静态电流的 0.7V 输入电压、5V 固定输出电压升压转换器;
| 型号： | TPS61222-EP |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 5.5μA 静态电流的 0.7V 输入电压、5V 固定输出电压升压转换器 升压转换器 |
| 文件： | 总18页 (文件大小：709K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS61222-EP
www.ti.com.cn
ZHCSAA0 –SEPTEMBER 2012
具有 5.5μA 静态电流的低输入电压，0.7V 升压转换器
查询样品: TPS61222-EP
1
特性
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在典型工作条件下效率高达 95%
应用范围
5.5μA 静态电流
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电池供电型应用
在输入电压为 0.7V 时启动进入负载
运行输入电压范围为 0.7V 至 5.5V
停机期间具有导通功能
最小开关电流为 200mA
保护特性：
–
1 至 3 节碱性电池、镍镉电池 (NiCd) 或者镍氢
电池 (NiMH)
–
1 节锂离子或者锂离子一次性电池
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太阳能或者燃料供电类应用
消费类及便携式医疗产品
个人护理产品
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–
–
输出过压
过热
白色或者状态发光二极管 (LED)
智能电话
输入欠压闭锁
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固定输出电压版本
支持国防、航空航天、和医疗应用
小型 6 引脚 SC-70 封装
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受控基线
一个组装和测试场所
一个制造场所
(1)
支持军用（-55°C 至 125°C）温度范围
延长的产品生命周期
延长的产品变更通知
产品可追溯性
(1) 可定制工作温度范围
说明
TLV61222 为通过单节、双节、或者三节碱性，NiCd 或者 NiMH，或单节锂离子或者锂聚合物电池供电的产品提供
电源解决方案。 可实现的输出电流取决于输入输出电压比。 升压转换器建立在采用同步整流的磁滞控制器拓扑基
础之上，能够以最少的静态电流实现最高的效率。 可通过一个外部电阻分压器对此可调版本的输出电压进行设定，
或者可将此电压内部设定为一个固定值。 此转换器可由一个特定的使能引脚关闭。 关闭时，电池消耗降至最低。
该器件采用 2mm x 2mm 6 引脚 SC-70 封装 (DCK) 以支持最小电路布局尺寸。
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
English Data Sheet: SLVSBI2
TPS61222-EP
ZHCSAA0 –SEPTEMBER 2012
www.ti.com.cn
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
AVAILABLE DEVICE OPTIONS(1)
PACKAGE
MARKING
TJ
PACKAGE(2)
PART NUMBER
VID NUMBER
–55°C to 125°C
SHL
6-Pin SC-70
TPS61222MDCKTEP
V62/12603-01XE
(1) Contact the factory to check availability of other fixed output voltage versions.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
UNIT
VIN
TJ
Input voltage range on VIN, L, VOUT, EN, FB
Operating junction temperature range
Storage temperature range
Human Body Model (HBM)(2)
Machine Model (MM)(2)
–0.3 to 7.5
–55 to 145
–65 to 150
2
V
°C
°C
kV
V
Tstg
ESD
200
Charged Device Model (CDM)(2)
1.5
kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) ESD testing is performed according to the respective JESD22 JEDEC standard.
THERMAL INFORMATION
TPS61222
THERMAL METRIC(1)
DCK
6 PINS
231.2
61.8
78.8
2.2
UNITS
θJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance(3)
Junction-to-board thermal resistance(4)
Junction-to-top characterization parameter(5)
Junction-to-board characterization parameter(6)
Junction-to-case (bottom) thermal resistance(7)
θJCtop
θJB
°C/W
ψJT
ψJB
78
θJCbot
N/A
(1) 有关传统和新的热 度量的更多信息，请参阅IC 封装热度量应用报告， SPRA953。
(2) 在 JESD51-2a 描述的环境中，按照 JESD51-7 的指定，在一个 JEDEC 标准高 K 电路板上进行仿真，从而获得自然 对流条件下的结至环
境热阻。
(3) 通过在封装顶部模拟一个冷板测试来获得结至芯片外壳（顶部）的热阻。 不存在特定的 JEDEC 标准测试，但 可在 ANSI SEMI 标准 G30-
88 中能找到内容接近的说明。
(4) 按照 JESD51-8 中的说明，通过 在配有用于控制 PCB 温度的环形冷板夹具的环境中进行仿真，以获得结板热阻。
(5) 结至顶部特征参数， ψJT，估算真实系统中器件的结温，并使用 JESD51-2a（第 6 章和第 7 章）中 描述的程序从仿真数据中 提取出该参
数以便获得 θJA
(6) 结至电路板特征参数， ψJB，估算真实系统中器件的结温，并使用 JESD51-2a（第 6 章和第 7 章）中 描述的程序从仿真数据中 提取出该
参数以便获得 θJA
。
。
(7) 通过在外露（电源）焊盘上进行冷板测试仿真来获得 结至芯片外壳（底部）热阻。 不存在特定的 JEDEC 标准 测试，但可在 ANSI SEMI
标准 G30-88 中能找到内容接近的说明。
空白
RECOMMENDED OPERATING CONDITIONS
MIN
0.7
NOM
MAX
5.5
UNIT
V
VIN
TJ
Supply voltage at VIN
Operating free air temperature range
–55
125
°C
2
Copyright © 2012, Texas Instruments Incorporated
TPS61222-EP
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ZHCSAA0 –SEPTEMBER 2012
ELECTRICAL CHARACTERISTICS
TJ = −55°C to 125°C, TJ = TA and over recommended input voltage range (typical at an ambient temperature range of 25°C)
(unless otherwise noted)
DC/DC STAGE
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
5.5
UNIT
V
VIN
Input voltage range
0.7
VIN
Minimum input voltage at startup
Output voltage (5 V)
Inductor current ripple
Switch current limit
R
Load ≥ 150 Ω
0.7
V
VOUT
ILH
VIN < VOUT
4.8
5
200
400
700
550
0.5
0.5
0.5
5
5.19
V
mA
mA
mΩ
mΩ
%
ISW
VOUT = 5 V, VIN = 1.2 V
VOUT = 5 V
200
RDSon_HSD
RDSon_LSD
Rectifying switch on resistance
Main switch on resistance
Line regulation
VOUT = 5 V
VIN < VOUT
Load regulation
VIN < VOUT
%
VIN
1.4
8.5
μA
μA
Quiescent
current
IQ
IO = 0 mA, VEN = VIN = 1.2 V, VOUT = 5 V
VOUT
Shutdown
current
ISD
VIN
VEN = 0 V, VIN = 1.2 V, VOUT ≥ VIN
0.2
0.96
μA
ILKG_L
IEN
Leakage current into L
EN input current
VEN = 0 V, VIN = 1.2 V, VL = 1.2 V, VOUT ≥ VIN
0.01
0.3
μA
μA
Clamped on GND or VIN (VIN < 1.5 V)
0.005
0.13
CONTROL STAGE
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
VIL
EN input low voltage
EN input high voltage
EN input low voltage
EN input high voltage
V
IN ≤ 1.5 V
IN ≤ 1.5 V
0.15 × VIN
VIH
V
0.8 × VIN
1.28
V
VIL
5 V > VIN > 1.5 V
5 V > VIN > 1.5 V
0.34
V
VIH
V
VUVLO
Undervoltage lockout threshold for turn off VIN decreasing
Overvoltage protection threshold
0.5
0.72
7.5
V
5.5
V
Overtemperature protection
140
20
°C
°C
Overtemperature hysteresis
Copyright © 2012, Texas Instruments Incorporated
3
TPS61222-EP
ZHCSAA0 –SEPTEMBER 2012
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10000.00
1000.00
100.00
10.00
Wirebond Voiding
Fail Mode
Electromigration Failure Mode
1.00
80
90
100
110
120
130
140
150
160
Continuous TJ (°C)
(1) See data sheet for absolute maximum and minimum recommended operating conditions.
(2) Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect
life).
(3) Enhanced plastic product disclaimer applies.
Figure 1. TPS61222-EP Operating Life Derating Chart
4
Copyright © 2012, Texas Instruments Incorporated
TPS61222-EP
www.ti.com.cn
ZHCSAA0 –SEPTEMBER 2012
PIN ASSIGNMENTS
DCK PACKAGE
(TOP VIEW)
VIN
FB
EN
L
GND
VOUT
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME
EN
NO.
6
I
I
Enable input (1: enabled, 0: disabled). Must be actively tied high or low.
FB
2
Voltage feedback of adjustable version. Must be connected to VOUT at fixed output voltage versions.
GND
L
3
Control / logic and power ground
Connection for Inductor
5
I
I
VIN
VOUT
1
Boost converter input voltage
Boost converter output voltage
4
O
FUNCTIONAL BLOCK DIAGRAM
L
VOUT
VOUT
VIN
Gate
Driver
Start Up
VIN
Current
Sensor
FB
Device
Control
EN
VREF
GND
Copyright © 2012, Texas Instruments Incorporated
5
TPS61222-EP
ZHCSAA0 –SEPTEMBER 2012
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PARAMETER MEASUREMENT INFORMATION
L1
L
VOUT
FB
V
OUT
R1
R2
V
VIN
EN
C2
IN
C1
GND
TPS6122x
Table 1. List of Components(1)
COMPONENT
REFERENCE
PART NUMBER
MANUFACTURER
VALUE
C1
C2
L1
GRM188R60J106ME84D
GRM188R60J106ME84D
EPL3015-472MLB
Murata
Murata
Coilcraft
10 μF, 6.3V. X5R Ceramic
10 μF, 6.3V. X5R Ceramic
4.7 μH
adjustable version: Values depending on the
programmed output voltage
R1, R2
fixed version: R1= 0 Ω, R2 not used
(1) Design was tested using these components at 25°C ambient temperature.
6
Copyright © 2012, Texas Instruments Incorporated
TPS61222-EP
www.ti.com.cn
ZHCSAA0 –SEPTEMBER 2012
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
Figure 2
Figure 3
Figure 4
Figure 5
Figure 6
Figure 7
Figure 8
Maximum Output Current
Efficiency
vs Input Voltage
vs Output Current, VIN = [0.7 V; 1.2 V; 2.4V; 3.6 V; 4.2 V]
vs Input Voltage, IOUT = [100 uA; 1 mA; 10 mA; 50 mA]
at No Output Load, Device Enabled
Input Current
Output Voltage
vs Output Current, VIN = [0.7 V; 1.2 V; 2.4 V; 3.6 V]
Load Transient Response, VIN = 2.4 V, IOUT = 14 mA to 126 mA
Line Transient Response, VIN = 2.8 V to 3.6 V, RLOAD = 100 Ω
Waveforms
MAXIMUM OUTPUT CURRENT
EFFICIENCY
vs
vs
INPUT VOLTAGE
OUTPUT CURRENT AND INPUT VOLTAGE
300
100
90
80
70
60
50
40
30
20
V
= 5 V
V
= 5 V
O
O
250
200
150
V = 4.2 V
I
V = 3.6 V
I
V = 2.4 V
I
V = 1.2 V
I
V = 0.7 V
I
100
50
0
10
0
0.7
1.2
1.7
2.2
2.7
3.2
3.7
4.2
4.7
0.01
0.1
1
10
100
I
- Output Current - mA
V - Input Voltage - V
I
O
Figure 2.
Figure 3.
EFFICIENCY
vs
NO LOAD INPUT CURRENT
vs
INPUT VOLTAGE AND OUTPUT CURRENT
INPUT VOLTAGE, DEVICE ENABLED
80
70
60
50
100
80
V
= 5 V
O
Device Enabled
V
= 5 V
O
I
= 50 mA
O
I
= 10 mA
O
I
= 1 mA
O
60
I
= 100 mA
O
40
30
20
40
20
0
10
0
1.7
2.7
0.7
4.7
3.7
0.7
1.7
2.7
3.7
4.7
V - Input Voltage - V
I
V - Input Voltage - V
I
Figure 4.
Figure 5.
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7
TPS61222-EP
ZHCSAA0 –SEPTEMBER 2012
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OUTPUT VOLTAGE
vs
OUTPUT CURRENT AND INPUT VOLTAGE
LOAD TRANSIENT RESPONSE
5.2
5.1
Offset: 0 A
V
= 5 V
O
I
L
200 mA/div
V = 3.6 V
I
I
O
Offset: 0 A
50 mA/div
5
4.9
4.8
V = 2.4 V
I
V
O
V = 1.2 V
I
50 mV/div
V = 0.7 V
I
Offset: 5 V
V = 2.4 V, I = 14 mA to 126 mA
I
O
200 ms/div
0.01
0.1
1
10
100
I
- Output Current - mA
O
Figure 6.
Figure 7.
LINE TRANSIENT RESPONSE
V
I
200 mV/div
Offset: 2.8 V
V
O
20 mV/div
Offset: 5 V
V 2.8 to 3.6 V, R
LOAD
= 100 W, t
= t = 20 ms
rise fall
I
200 ms/div
Figure 8.
8
Copyright © 2012, Texas Instruments Incorporated
TPS61222-EP
www.ti.com.cn
ZHCSAA0 –SEPTEMBER 2012
DETAILED DESCRIPTION
OPERATION
The TPS61222 is a high performance, high efficient switching boost converter. To achieve high efficiency the
power stage is realized as a synchronous boost topology. For the power switching two actively controlled low
RDSon power MOSFETs are implemented.
CONTROLLER CIRCUIT
The device is controlled by a hysteretic current mode controller. This controller regulates the output voltage by
keeping the inductor ripple current constant in the range of 200 mA and adjusting the offset of this inductor
current depending on the output load. In case the required average input current is lower than the average
inductor current defined by this constant ripple the inductor current gets discontinuous to keep the efficiency high
at low load conditions.
IL
Continuous Current Operation
Discontinuous Current Operation
200 mA
(typ.)
200 mA
(typ.)
t
Figure 9. Hysteretic Current Operation
The output voltage VOUT is monitored via the feedback network which is connected to the voltage error amplifier.
To regulate the output voltage, the voltage error amplifier compares this feedback voltage to the internal voltage
reference and adjusts the required offset of the inductor current accordingly. At fixed output voltage versions an
internal feedback network is used to program the output voltage, at adjustable versions an external resistor
divider needs to be connected.
The self oscillating hysteretic current mode architecture is inherently stable and allows fast response to load
variations. It also allows using inductors and capacitors over a wide value range.
Device Enable and Shutdown Mode
The device is enabled when EN is set high and shut down when EN is low. During shutdown, the converter stops
switching and all internal control circuitry is turned off. In this case the input voltage is connected to the output
through the back-gate diode of the rectifying MOSFET. This means that there always will be voltage at the output
which can be as high as the input voltage or lower depending on the load.
Startup
After the EN pin is tied high, the device starts to operate. In case the input voltage is not high enough to supply
the control circuit properly a startup oscillator starts to operate the switches. During this phase the switching
frequency is controlled by the oscillator and the maximum switch current is limited. As soon as the device has
built up the output voltage to about 1.8V, high enough for supplying the control circuit, the device switches to its
normal hysteretic current mode operation. The startup time depends on input voltage and load current.
Operation at Output Overload
If in normal boost operation the inductor current reaches the internal switch current limit threshold the main
switch is turned off to stop further increase of the input current.
In this case the output voltage will decrease since the device can not provide sufficient power to maintain the set
output voltage.
If the output voltage drops below the input voltage the backgate diode of the rectifying switch gets forward biased
and current starts flow through it. This diode cannot be turned off, so the current finally is only limited by the
remaining DC resistances. As soon as the overload condition is removed, the converter resumes providing the
set output voltage.
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ZHCSAA0 –SEPTEMBER 2012
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Undervoltage Lockout
An implemented undervoltage lockout function stops the operation of the converter if the input voltage drops
below the typical undervoltage lockout threshold. This function is implemented in order to prevent malfunctioning
of the converter.
Overvoltage Protection
If, for any reason, the output voltage is not fed back properly to the input of the voltage amplifier, control of the
output voltage will not work anymore. Therefore an overvoltage protection is implemented to avoid the output
voltage exceeding critical values for the device and possibly for the system it is supplying. For this protection the
TPS61222 output voltage is also monitored internally. In case it reaches the internally programmed threshold of
6.5 V typically the voltage amplifier regulates the output voltage to this value.
If the TPS61222 is used to drive LEDs, this feature protects the circuit if the LED fails.
Overtemperature Protection
The device has a built-in temperature sensor which monitors the internal IC junction temperature. If the
temperature exceeds the programmed threshold (see electrical characteristics table), the device stops operating.
As soon as the IC temperature has decreased below the programmed threshold, it starts operating again. To
prevent unstable operation close to the region of overtemperature threshold, a built-in hysteresis is implemented.
10
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ZHCSAA0 –SEPTEMBER 2012
APPLICATION INFORMATION
DESIGN PROCEDURE
The TPS61222 DC/DC converter is intended for systems powered by a single cell battery to up to three Alkaline,
NiCd or NiMH cells with a typical terminal voltage between 0.7 V and 5.5 V. It can also be used in systems
powered by one-cell Li-Ion or Li-Polymer batteries with a typical voltage between 2.5 V and 4.2 V. Additionally,
any other voltage source with a typical output voltage between 0.7 V and 5.5 V can be used with the TPS61222.
Programming the Output Voltage
Output voltage
The output voltage is set by a resistor divider internally. The FB pin is used to sense the output voltage. To
configure the fixed output devices properly, the FB pin needs to be connected directly to VOUT as shown in
Figure 10.
L1
L
VOUT
FB
V
OUT
V
VIN
EN
C2
IN
C1
GND
TPS61222
Figure 10. Typical Application Circuit
Inductor Selection
To make sure that the TPS61222 can operate, a suitable inductor must be connected between pin VIN and pin L.
Inductor values of 4.7 μH show good performance over the whole input and output voltage range .
Choosing other inductance values affects the switching frequency f proportional to 1/L as shown in Equation 1.
V ´(VOUT - V )
´
1
IN
IN
L =
f ´ 200 mA
VOUT
(1)
Choosing inductor values higher than 4.7 μH can improve efficiency due to reduced switching frequency and
therefore with reduced switching losses. Using inductor values below 2.2 μH is not recommended.
Having selected an inductance value, the peak current for the inductor in steady state operation can be
calculated. Equation 2 gives the peak current estimate.
V
´ IOUT
ì
ï
í
OUT
+ 100 mA; continous current operation
discontinuous current operation
0.8´ V
IL,MAX
=
IN
ï
200 mA;
î
(2)
For selecting the inductor this would be the suitable value for the current rating. It also needs to be taken into
account that load transients and error conditions may cause higher inductor currents.
Equation 3 provides an easy way to estimate whether the device will work in continuous or discontinuous
operation depending on the operating points. As long as the inequation is true, continuous operation is typically
established. If the inequation becomes false, discontinous operation is typically established.
VOUT ´IOUT
> 0.8´100 mA
V
IN
(3)
11
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ZHCSAA0 –SEPTEMBER 2012
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The following inductor series from different suppliers have been used with TPS61222 converters:
Table 2. List of Inductors(1)
VENDOR
INDUCTOR SERIES
EPL3015
Coilcraft
EPL2010
Murata
LQH3NP
Tajo Yuden
Wurth Elektronik
NR3015
WE-TPC Typ S
(1) Design was tested using these components at 25°C ambient
temperature.
Capacitor Selection
Input Capacitor
At least a 10-μF input capacitor is recommended to improve transient behavior of the regulator and EMI behavior
of the total power supply circuit. A ceramic capacitor placed as close as possible to the VIN and GND pins of the
IC is recommended.
Output Capacitor
For the output capacitor C2 , it is recommended to use small ceramic capacitors placed as close as possible to
the VOUT and GND pins of the IC. If, for any reason, the application requires the use of large capacitors which
can not be placed close to the IC, the use of a small ceramic capacitor with an capacitance value of around
2.2μF in parallel to the large one is recommended. This small capacitor should be placed as close as possible to
the VOUT and GND pins of the IC.
A minimum capacitance value of 4.7 μF should be used, 10 μF are recommended. If the inductor value exceeds
4.7 μH, the value of the output capacitance value needs to be half the inductance value or higher for stability
reasons, see Equation 4.
(4)
The TPS61222 is not sensitive to the ESR in terms of stability. Using low ESR capacitors, such as ceramic
capacitors, is recommended anyway to minimize output voltage ripple. If heavy load changes are expected, the
output capacitor value should be increased to avoid output voltage drops during fast load transients.
Layout Considerations
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator could show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitor, as well as the inductor should be placed as close as possible to the IC.
The feedback divider should be placed as close as possible to the control ground pin of the IC. To lay out the
ground, it is recommended to use short traces as well, separated from the power ground traces. This avoids
ground shift problems, which can occur due to superimposition of power ground current and control ground
current. Assure that the ground traces are connected close to the device GND pin.
THERMAL INFORMATION
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the power-
dissipation limits of a given component.
12
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ZHCSAA0 –SEPTEMBER 2012
Three basic approaches for enhancing thermal performance are listed below.
•
•
•
Improving the power-dissipation capability of the PCB design
Improving the thermal coupling of the component to the PCB
Introducing airflow in the system
For more details on how to use the thermal parameters in the dissipation ratings table please check the Thermal
Characteristics Application Note (SZZA017) and the IC Package Thermal Metrics Application Note (SPRA953).
Copyright © 2012, Texas Instruments Incorporated
13
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS61222MDCKTEP
V62/12603-01XE
ACTIVE
ACTIVE
SC70
SC70
DCK
DCK
6
6
250
250
RoHS & Green
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
SHL
SHL
NIPDAU
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
重要声明和免责声明
TI 均以“原样”提供技术性及可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资
源，不保证其中不含任何瑕疵，且不做任何明示或暗示的担保，包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任：(1) 针对您的应用选择合适的TI 产品；(2) 设计、
验证并测试您的应用；(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更，恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源，也不提供其它TI或任何第三方的知识产权授权
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束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
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