TPS61299 [TI]
具有输入电流限制和快速瞬态性能的 95nA 低 IQ 5.5V 升压转换器;
| 型号： | TPS61299 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有输入电流限制和快速瞬态性能的 95nA 低 IQ 5.5V 升压转换器 升压转换器 |
| 文件： | 总28页 (文件大小：3323K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS61299
ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
TPS61299 具有输入电流限制和快速瞬态性能的
95nA 静态电流、5.5V 升压转换器
1 特性
3 说明
• 输入电压范围：0.5V 至5.5V
• 启动时的最小输入电压为0.7V
• 输入工作电压低至150mV，信号VIN > 0.7V
• 输出电压范围：VSEL 引脚选择输出电压为1.8V 至
5.5V
TPS61299 是一款同步升压转换器，具有 95nA 超低静
态电流和平均输入电流限制。该器件为具有碱性电池和
纽扣电池的便携式设备提供电源解决方案。该器件在轻
负载条件下具有高效率，可实现较长的工作时间，平均
输入电流限制可避免电池以高电流放电。
• 平均输入电流限制：5mA；25mA；50mA；
100mA；250mA、500mA、1.2A、1.5A（不同版
本）
• VOUT 静态电流典型值为95nA
• VIN 和SW 关断电流典型值为60nA
• VIN = 3.6V、VOUT = 5V 且IOUT = 10μA 时效率高
达91%
TPS61299 具有 0.5V 至 5.5V 的宽输入电压范围和
1.8V 至5.5V 的输出电压范围。该器件具有不同版本，
可提供 5mA 至 1.5A 的平均输入电流限制。具有 1.2A
电流限制的 TPS61299 可在 3V 至5V 转换过程中支持
高达 500mA 的输出电流，在 200mA 负载条件下可实
现大约94% 的效率。
TPS61299 在输出电压为 4.5V、5V 或 5.5V 时具有可
选的快速负载瞬态性能。在快速负载瞬态中，当输出电
流瞬态为0A 至200mA 时，典型稳定时间为8μs。
• VIN = 3.6V、VOUT = 5V 且IOUT = 200mA 时效率高
达94%
• 快速瞬态性能：VIN = 3.6V、VOUT = 5V、IOUT = 0A
-> 200mA 时，稳定时间约为8μs
• EN 为低电平时真正断开
• 自动PFM/PWM 模式转换
• VIN > VOUT 时自动直通
• 输出SCP 和热关断保护
• 6 引脚WCSP (1.2 x 0.8) / SOT563 封装(1.6 x 1.6)
TPS61299 在禁用时支持可选强制直通或真正关断功
能，这对于常开型系统非常灵活。
TPS61299 采用 6 焊球 1.2mm x 0.8mm WCSP 封装
和6 引脚 1.6mm x 0.6mm SOT563 封装，提供非常小
的解决方案尺寸。
器件信息
封装(1)
2 应用
封装尺寸（标称值）
1.2mm x 0.8mm
1.6mm x 1.6mm
器件型号
• 智能手表、智能手环
• 便携式医疗设备
• TWS
TPS61299YBHR
TPS61299DRLR
WCSP
SOT563
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
L
VOUT
VIN
SW
VOUT
C2
C1
VIN
VSEL
R1
ON
EN
GND
OFF
典型应用
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSGS9
TPS61299
www.ti.com.cn
ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
Table of Contents
7.4 Device Functional Modes..........................................15
8 Application and Implementation..................................16
8.1 Application Information............................................. 16
8.2 Typical Application-Li-ion Battery to 5-V Boost
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings........................................ 4
6.2 ESD Ratings............................................................... 4
6.3 Recommended Operating Conditions.........................4
6.4 Thermal Information....................................................4
6.5 Electrical Characteristics.............................................5
6.6 Typical Characteristics................................................7
7 Detailed Description........................................................9
7.1 Overview.....................................................................9
7.2 Functional Block Diagram...........................................9
7.3 Feature Description.....................................................9
Converter under Fast Mode........................................ 16
9 Thermal Information......................................................21
10 Device and Documentation Support..........................22
10.1 Device Support....................................................... 22
10.2 Documentation Support.......................................... 22
10.3 接收文档更新通知................................................... 22
10.4 支持资源..................................................................22
10.5 Trademarks.............................................................22
10.6 静电放电警告.......................................................... 22
10.7 术语表..................................................................... 22
11 Mechanical, Packaging, and Orderable
Information.................................................................... 23
4 Revision History
Changes from Revision * (March 2023) to Revision A (June 2023)
Page
• Updated Electrical Characteristics Iq from 100 nA to 95 nA ..............................................................................4
Copyright © 2023 Texas Instruments Incorporated
English Data Sheet: SLVSGS9
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ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
5 Pin Configuration and Functions
图5-2. DRV 6-Pin Package Top View
图5-1. YFF 6-Pin Package Top View
表5-1. Pin Functions
TERMINAL
YBH
I/O
DESCRIPTION
NAME
DRL
IC power supply input
VIN
A1
1
PWR
I
The switch pin of the converter. It is connected to the drain of the internal low-side
power MOSFET and source of the internal high-side power MOSFET.
SW
EN
B1
C1
C2
2
3
4
Enable logic input. Logic high voltage enables the device. Logic low voltage disables
the device.
I
I
Boost output voltage selection pin. Connect a resistor between this pin and ground to
select one of 21 output voltages.
VSEL
VOUT
GND
B2
A2
5
6
PWR
PWR
Boost converter output
Ground
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English Data Sheet: SLVSGS9
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ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
-0.7
MAX
6.5
8
UNIT
V
VIN, VOUT, SW, EN, VSEL
Voltage
SW spike at 10 ns
V
SW spike at 1 ns
-0.7
10
V
TJ
Operating Junction Temperature
Storage temperature
125
150
°C
°C
–40
–65
Tstg
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If
used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/
JEDEC JS-001, all pins(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specificationJESD22-C101, all pins(2)
±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. [Following
sentence optional; see the wiki.] Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. [Following
sentence optional; see the wiki.] Manufacturing with less than 250-V CDM is possible with the necessary precautions.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
0.5
NOM
MAX
5.5
UNIT
V
VIN
VOUT
TJ
Input voltage
Boost output voltage
1.8
5.5
V
Junction temperature
125
°C
µH
µF
µF
–40
0.47*0.7
5*0.8
2.2
L
Effective Inductance
1.0
10
1.0*1.3
COUT
CIN
Effective Output Capacitance at the OUT pin
Effective Input Capacitance at the VIN pin
6.4 Thermal Information
TPS61299
YFF 6-BALLS
Standard
TPS61299
YFF 6-BALLS
EVM
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
130.0
0.9
107.1
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
N/A
N/A
4.1
39.4
0.2
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ΨJT
39.4
N/A
62.7
N/A
ΨJB
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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English Data Sheet: SLVSGS9
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6.5 Electrical Characteristics
TJ = -40°C to 125°C, VIN = 3.6V and VOUT = 5.0V. Typical values are at TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX UNIT
POWER SUPPLY
VIN
Input voltage range
All
0.5
5.5
0.7
V
V
Under-voltage lockout
threshold
TPS61299,
TPS61299X
VIN_UVLO
VIN rising
Under-voltage lockout
threshold
VIN_UVLO
All
VIN falling
0.5
V
IC enabled, No load, No
switching, TJ up to 85°C
IQ
Quiescent current into VIN pin All
1
95
60
60
nA
Quiescent current into VOUT
pin
IC enabled, No load, No
switching, TJ up to 85°C
IQ
All
300 nA
nA
TPS61299,
TPS61299X
EN = LOW, VIN = 3.6 V,
VOUT = 0 V
ISD
IBY
Shutdown current into VIN pin
Quiescent current into VIN pin TPS61299A,
EN = LOW
nA
at force pass through mode
TPS61299XA
All
TJ = 25°C
1
1
1
1
4
nA
Leakage current into SW pin
(from SW pin to VOUT pin)
TJ up to 85°C
TJ = 25°C
20 nA
15 nA
200 nA
ILKG_SW
Leakage current into SW pin
(from SW pin to GND pin)
TJ up to 85°C
OUTPUT
VOUT
Output voltage setting range All
1.8
-2
5.5
2
V
VOUT_PWM_ACY Output voltage accuracy
All
PWM, PFM mode
normal mode
%
VOUT_PWM_
ACY+37.5m
V
V
V
VOUT_SNOOZE_
Output voltage accuracy
All
ACY
VOUT_PWM_
ACY+15mV
fast mode
POWER SWITCH
High-side MOSFET on
resistance
TPS61299X,
TPS61299XA
mOh
m
RDS(on)
VOUT = 5.0 V
150
88
1.2
5
Low-side MOSFET on
resistance
TPS61299X,
TPS61299XA
mOh
m
RDS(on)
VOUT = 5.0 V
TPS61299,
TPS61299A
ILIM
ILIM
ILIM
ILIM
ILIM
Input current limit
Input current limit
Input current limit
Input current limit
VIN = 3.6 V, VOUT = 5.0 V
VIN = 3.6 V, VOUT = 5.0 V
VIN = 3.6 V, VOUT = 5.0 V
VIN = 3.6 V, VOUT = 5.0 V
0.96
3
1.44
7
A
TPS612991,
TPS612991A
mA
TPS612992,
TPS612992A
20
40
80
25
50
30 mA
60 mA
TPS612993,
TPS612993A
TPS612994,
TPS612994A
Input current limit
VIN = 3.6 V, VOUT = 5.0 V
PWM
100
350
120 mA
mA
ILH
Inductor current ripple
All
APPLICATION
LOGIC INTERFACE
VEN_H
VEN_L
VEN_H
VEN_L
IEN_LKG
EN logic high threshold
All
All
All
All
All
VIN >= 1.05 V
VIN >= 1.05 V
VIN < 1.05 V
VIN < 1.05 V
VEN=5V
0.84
V
V
V
V
EN logic low threshold
EN logic high threshold
EN logic low threshold
Leakage current into EN pin
0.36
0.8*VIN
0.2*VIN
1
50 nA
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ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
TJ = -40°C to 125°C, VIN = 3.6V and VOUT = 5.0V. Typical values are at TJ = 25°C, unless otherwise noted.
PARAMETER
Version
TEST CONDITIONS
MIN
TYP
MAX UNIT
REN
EN pin pulldown resistor
All
EN=low
800
kOhm
PROTECTION
TSD
Thermal shutdown threshold
Thermal shutdown hysteresis
TJ rising
150
20
°C
°C
TSD_HYS
TJ falling below TSD
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6.6 Typical Characteristics
VIN = 3.6 V, VOUT = 5 V, Normal Mode, TJ = 25°C, unless otherwise noted
100
80
5.1
5.05
5
60
VIN=0.7V
VIN=1.8 V
VIN=2.7 V
VIN=3.6 V
VIN=4.3 V
VIN=5.0 V
VIN=0.7V
VIN=1.8V
VIN=2.7V
VIN=3.6V
VIN=4.3V
VIN=5.0V
40
20
0.0001
4.95
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Output Current (A)
1
0.001
0.010.02 0.05 0.1 0.2 0.5
Output Current (A)
1
VIN = 0.7V, 1.8V, 2.7V, 3.6V, 4.3V, 5.0V ； VOUT = 5.0 V
VIN = 0.7V, 1.8V, 2.7V, 3.6V, 4.3V, 5.0V
VOUT = 5.0 V
图6-1. 5.0-V VOUT Efficiency with Different Inputs
图6-2. 5.0-V VOUT Load Regulation under Normal
under Normal Mode
Mode
100
95
3.35
90
3.3
85
80
VIN=0.7V
VIN=1.9V
VIN=3.0V
VIN=0.7V
VIN=1.9 V
VIN=3.0 V
3.25
1E-5
75
1E-5
0.0001
0.001
Output Current (A)
0.01
0.1 0.2 0.5 1
VOUT= 3.3 V
0.0001
0.001
Output Current (A)
0.01
0.1 0.2 0.5 1
VOUT = 3.3 V
VIN =0.7 V, 1.9 V, 3.0V
VIN = 0.7 V, 1.9 V, 3.0 V
图6-4. 3.3-V VOUT Load Regulation under Normal
图6-3. 3.3-V VOUT Efficiency with Different Inputs
Mode
under Normal Mode
97.5
95
5.1
5.05
5
92.5
90
87.5
4.95
VIN=3.0 V
VIN=3.6 V
VIN=4.3 V
VIN=3.0V
VIN=3.6V
VIN=4.3V
85
82.5
4.9
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Output Current (A)
1
0.0001
0.001
0.010.02 0.05 0.1 0.2 0.5
Output Current (A)
1
VIN = 3.0 V, 3.6 V, 4.3 V
VOUT = 3.3 V
VIN =3.0 V, 3.6 V, 4.3 V
VOUT= 5 V
图6-5. 5.0-V VOUT Efficiency with Different Inputs 图6-6. 5-V VOUT Load Regulation under Fast Mode
under Fast Mode
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ZHCSPX6A –MARCH 2023 –REVISED JUNE 2023
50
0
2500
2250
2000
1750
1500
1250
1000
750
-50
-100
-150
-200
-250
-300
500
VIN=4.3V
VIN=3.6V
VIN=0.7V
VIN=0.7V
VIN=3.6V
VIN=4.3V
-350
250
0
-400
-40 -20
0
20
40
60
80 100 120 140 160
-40 -20
0
20
40
60
80 100 120 140 160
Temperature (C)
Temperature (C)
VIN = 0.7 V, 3.6 V 4.3 V; VOUT = 5 V, TJ = –40°C to +150 °C,
VIN = 0.7 V, 3.6 V 4.3 V; VOUT = 5 V, TJ = –40°C to +150 °C,
No switching
No switching
图6-8. Quiescent Current into VOUT vs
图6-7. Quiescent Current into VIN vs Temperature
Temperature
1400
VIN=0.7V
VIN=3.6V
1200
VIN=4.3V
1000
800
600
400
200
0
-40 -20
0
20
40
60
80 100 120 140 160
Temperature (C)
VIN = 0.7 V, 3.6 V 4.3 V; VOUT = 0 V, TJ = –40°C to +150 °C
图6-9. Shutdown Current vs Temperature
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7 Detailed Description
7.1 Overview
The TPS61299 is a synchronous step-up converter and operates in a hysteretic control scheme. The TPS61299
has a wide input voltage supply range between 0.5 V and 5.5 V ( 0.7V rising voltage for start-up). It only
consumes 95 nA quiescent current and can achieve up high efficiency under light load condition.
The TPS61299 family provide wide input current limit from 5 mA to 1.5 A and support optional true shutdown
function or force pass through function at EN is low.
TPS61299 provides a fast transient performance mode and accurate load regulation mode for different system.
7.2 Functional Block Diagram
图7-1. Functional Block Diagram
7.3 Feature Description
7.3.1 Boost Control Operation
The TPS61299 boost converter is controlled by a hysteretic current mode controller. This controller regulates the
output voltage by keeping the inductor ripple current constant in the range of 350 mA and adjusting the valley
current of this inductor depending on the output load. Since the input voltage, output voltage and inductor value
all affect the rising and falling slopes of inductor ripple current, the switching frequency is not fixed and is
determined by the operation condition. If the required average input current is lower than the average inductor
current defined by this constant ripple, the inductor current goes discontinuously to keep the efficiency high
under light load condition. If the load current is reduced further, the boost converter enters into Burst mode. In
Burst mode, the boost converter ramps up the output voltage with several switching cycles. Once the output
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voltage exceeds a setting threshold (Vout_target + 50 mV in normal mode and Vout_target + 25 mV in fast load
transient mode), the device stops switching and goes into a sleep status. In sleep status, the device consumes
less quiescent current, 95 nA. The boost converter resumes switching when the output voltage is below the
setting threshold ( Vout_target + 25 mV). The device exits the Burst mode when the output current can no longer
be supported in this mode.
图7-2. Control Modes under Different Load
7.3.2 Version Detection
The TPS61299 supports 21 internal output voltage setting options by connecting a resistor between the VSEL
pin and ground.
During start-up, when output voltage reaches close to 1.8V, the device starts to detect the configuration
conditions of the VSEL pin. The TPS61299 checks the VSEL pin by lowering resistance setting options to higher
setting options until the user finds the setting configuration by a 10-μs clock. After detecting the configuration,
the TPS61299 latches the setting output regulation voltage.
The TPS61299 does not detect the VSEL pins during operation, so changing the resistor during operation does
not change the VSEL setting. Toggling the EN pin during operation is one way to refresh the it.
For proper operation, TI suggests that the setting resistance accuracy must be 1% and the parasitic capacity of
the VSEL pin be less than 10 pF.
表7-1. VSEL Pin Configuration
VOUT_REG (V)
VOUT_REG (V)
VOUT_REG (V)
VOUT_REG (V)
Resistance (kΩ)
0(GND)
3.01
Resistance (kΩ)
Resistance (kΩ)
Resistance (kΩ)
3.3
12.1
14.7
18.2
22.6
28.7
4.5
49.9
75
3.6
3.5
3.2
3
191
237
294
365
2.5
2.2
2
5.5
4.5(fast)
4.3
4.75
5.5(fast)
5.2
100
124
154
6.19
4
1.8
5(fast)
7.87
5
3.8
2.8
442/
Vout pin
9.76
4.8
7.3.3 Under-voltage Lockout
The TPS61299 has a built-in under-voltage lockout (UVLO) circuit to ensure the device working properly. When
the input voltage is above the UVLO rising threshold of 0.7 V, the TPS61299 can be enabled to boost the output
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voltage. After the TPS61299 starts up and the output voltage is above 1.8 V, the TPS61299 can work with the
input voltage as low as 0.5 V.
7.3.4 Switching Frequency
The TPS61299 boost converter does not have fixed frequency and it keeps the inductor ripple current constant
in the range of 350 mA, so the frequency is determined by the operation condition. E.g. the frequency is
approximately 3MHz for the input is 3.6V, output is 5V, inductor is 1uH.
7.3.5 Input Current Limit
The TPS61299 employs the input average current protection (OCP) function. If the inductor average current
reaches the current limit threshold ILIM, the control loop can limit the inductor average current. In this case the
output voltage decreases until the power balance between input and output is achieved. If the output drops
below the input voltage, the TPS61299 enters into Down Mode. If the output drops below 1.6 V, the TPS61299
enters into startup process again. In Pass-Through operation, input current limit function is not enabled.
7.3.6 Enable and Disable
When the input voltage is above UVLO rising threshold and the EN pin is pulled to high voltage, the TPS61299
is enabled. When the EN pin is pulled to low voltage, the TPS61299 goes into shutdown mode. In shutdown
mode, TPS61299 has two versions, true shutdown version and force pass through version. In true shutdown
version, the device stops switching and the high-side MOSFET fully turns off, providing the completed
disconnection between input and output. And in force pass through version, the high-side MOSFET turns on and
output connects with input. Less than 60-nA input current is consumed in shutdown mode.
7.3.7 Soft Start
After the EN pin is tied to high voltage, the TPS61299 begins to startup.
For the high input current limit is 250 mA, 500 mA, 1.2 A and 1.5 A version, at the beginning, when output
voltage is lower than 0.5V, device limits the output power for the short protection. As output voltage is higher
than 0.5V, the device operates at the boundary of Discontinuous Conduction Mode (DCM) and Continuous
Conduction Mode (CCM), and the inductor peak current is limited to around 350 mA during this stage. After the
output voltage reaches close to 1.8 V, the TPS61299 starts to detect the output voltage configuration of the
VSEL pins, then latches the configuration. The version detection time depends on the resistance at VSEL pin,
the higher resistance, the longer version detection time. Eg. for 5V normal version, the TPS61299 needs
approximately 170 us for version detection. After version detection, TPS61299 continues switching and output
ramps up further. The internal soft-start time is approximately 1.3ms, and the output soft start time varies with the
different output capacitance, load condition, and configuration conditions. The TPS61299 limits the inductor
average current lower than 500mA, (input current limit to 250mA for 250mA version) when output voltage is
lower than 2.5V. In this way, the soft start function reduces the inrush current during startup.
For the low input current limit 5 mA, 25 mA, 50 mA and 100 mA version, the device limits the input current limit to
25 mA during the soft start. The device works at DCM during start up.
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图7-3. Soft Start Procedure
7.3.8 Down Mode
During the start-up, when the input voltage is higher than the output voltage, the TPS61299 works at the down
mode to keep the switching. In the Down Mode, the behavior of the rectifying PMOS by pulling its gate to input
voltage instead of to ground. In this way, the voltage drop across the PMOS is increasing as high as to regulate
the output voltage. The power loss also increases in this mode, which needs to be taken into account for thermal
consideration.
7.3.9 Pass-Through Operation
The TPS61299 features down mode and pass-through operation when input voltage is close to or higher than
output voltage.
In the down mode, output is regulated at target voltage even when input voltage is higher than output voltage.
The control circuit changes the behavior of the rectifying PMOS by pulling its gate to input voltage instead of to
ground. In this way, the voltage drop across the PMOS is increasing as high as to regulate the output voltage.
In pass through mode, the TPS61299 stops switching and turns on the high side PMOS FET. The output voltage
is the input voltage minus the voltage drop across the DCR of the inductor and the Rdson of the PMOS FET. In
pass though operation, the input current limit function, reverse current protection and thermal shutdown are not
enable.
For the input current limit is equal or higher than 250mA version, TPS61299, TPS612995, TPS612996 and
TPS612997. With input voltage ramping up, the TPS61299 goes into down mode when Vin >Vout-35mV. The
device stays in down mode until Vin >Vout+100mV and then goes automatically into pass through operation. In
the pass through operation, output voltage follows input voltage. The TPS61299 exits pass though operation and
goes back to boost mode when the output voltage drops below the setting target voltage minus 75mV.
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图7-4. Mode Transition for 250mA and Higher Input Current Limit Version
For the input current limit is equal or lower than 100mA version, TPS612991, TPS612992, TPS612993 and
TPS612994. With input voltage ramping up, the TPS61299 goes into down mode when Vin
>Vout-35mV(Vboost_down). It stays in down mode until Vin >Vout+23mV(Vdown_pass) and then goes automatically
into pass through operation. In the pass through operation, output voltage follows input voltage. The TPS61299
exits pass though operation and goes back to boost mode when the output voltage drops below the setting
target voltage minus 75mV(Vpass_boost).
图7-5. Mode Transition for 100mA and Lower Input Current Limit Version
7.3.10 Output Short-to-ground Protection
When the VOUT pin is short to ground and the output voltage becomes less than 0.5 V, the TPS61299 starts to
limit the inductor current, the same with soft start operation. The TPS61299 works at the boundary of
Discontinuous Conduction Mode (DCM) and Continuous Conduction Mode (CCM) when the input voltage is
lower than 1.8V and works at DCM at input voltage is higher than 1.8V.
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Once the short circuit is released, the TPS61299 goes through the soft startup again to the regulated output
voltage.
7.3.11 Thermal Shutdown
The TPS61299 goes into thermal shutdown once the junction temperature exceeds 150°C. When the junction
temperature drops below the thermal shutdown temperature threshold less the hysteresis, typically 130°C, the
device starts operating again.
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7.4 Device Functional Modes
7.4.1 Fast Load transient Mode and Normal Mode
The TPS61299 has two modes, fast load transient mode and normal mode, which is selected by VSEL pin.
In the fast load transient mode, the loop response speed is fast. Eg the load transient settling time is about 8 us
when output current transient from 0A to 200mA at 3.6V to 5V condition. But the trade-off is the load regulation.
Normal mode has the better load regulation.
图7-6. Transient performance comparison under Fast Mode and Normal Mode
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8 Application and Implementation
备注
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
8.1 Application Information
The TPS61299 is a synchronous step-up converter and operates in a hysteretic control scheme. The TPS61299
has a wide input voltage supply range between 0.5 V and 5.5 V(0.7V rising voltage for start up). The device only
consumes 95 nA quiescent current and can achieve up high efficiency under light load condition.
The TPS61299 family provide wide input current limit from 5mA to 1.5A and support optional true shutdown
function or force pass through function at EN is low.
TPS61299 provides a fast transient performance mode and accurate load regulation mode for different system.
8.2 Typical Application-Li-ion Battery to 5-V Boost Converter under Fast Mode
The TPS61299 can operate under fast transient mode with 8-μs settling time under 0 to 200-mA load step. Set
the VSEL according to table 8-1 to select different target VOUT under fast mode.
图8-1. 3.6-V Input Source to 5-V Boost Converter under Fast Mode
8.2.1 Design Requirements
The design parameters are listed in 表8-1.
表8-1. Design Requirements
PARAMETERS
VALUES
2.7 V ~ 4.3 V
5 V ( fast mode )
500 mA
Input Voltage
Output Voltage
Output Current
Output Voltage Ripple
± 50 mV
8.2.2 Detailed Design Procedure
8.2.2.1 Maximum Output Current
The maximum output capability of the TPS61299 is determined by the input-to-output ratio and the current limit
of the boost converter. The maximum output current can be estimated by 方程式1.
V I
IOUT (max )
=
IN LIM η
VOUT
(1)
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where
• ηis the conversion efficiency, use 85% for estimation.
• ILIM is the average switch current limit.
Minimum input voltage, maximum boost output voltage, and minimum current limit ILIM are used as the worst
case condition for the estimation.
8.2.2.2 Inductor Selection
The TPS61299 boost converter does not have fixed frequency and it keeps the inductor ripple current constant
in the range of 350 mA, so the frequency is determined by the inductance and working voltage.
The TPS61299 is designed to work with inductor value of 1 uH.
表8-2. Recommended Inductors for the TPS61299
DCR MAX
(mΩ)
SATURATION CURRENT
(A)
(1)
PART NUMBER
L (µH)
SIZE (LxWxH)
VENDOR
HTTH16080H-1R0MSR-99
WIP252010P-1R0ML
WPN252010H1R0MT
1
1
1
110
54
2.3
3.5
3.5
1.6 × 0.8 × 0.8
2.5 x 2.0 x 1.0
2.5 x 2.0 x 1.0
Cyntec
INPAQ
Sunlord
76
(1) See the Third-Party Products disclaimer
8.2.2.3 Output Capacitor Selection
The output capacitor is mainly selected to meet the requirements for output ripple and loop stability. The ripple
voltage is related to capacitor capacitance and its equivalent series resistance (ESR). Assuming a ceramic
capacitor with zero ESR, the minimum capacitance needed for a given ripple voltage can be calculated by 方程
式2.
IOUT ìDMAX
fSW ì VRIPPLE
COUT
=
(2)
where
• DMAX is the maximum switching duty cycle.
• VRIPPLE is the peak-to-peak output ripple voltage.
• IOUT is the maximum output current.
• fSW is the switching frequency.
The ESR impact on the output ripple must be considered if tantalum or aluminum electrolytic capacitors are
used. The output peak-to-peak ripple voltage caused by the ESR of the output capacitors can be calculated by
方程式3.
VRIPPLE(ESR) = IL(P) ìRESR
(3)
Take care when evaluating the derating of a ceramic capacitor under DC bias voltage, aging, and AC signal. For
example, the DC bias voltage can significantly reduce capacitance. A ceramic capacitor can lose more than 50%
of its capacitance at its rated voltage. Therefore, always leave margin on the voltage rating to make sure there is
adequate capacitance at the required output voltage. Increasing the output capacitor makes the output ripple
voltage smaller in PWM mode.
TI recommends using the X5R or X7R ceramic output capacitor in the range of 4-μF to 1000-μF effective
capacitance. The output capacitor affects the small signal control loop stability of the boost regulator. If the
output capacitor is below the range, the boost regulator can potentially become unstable. Increasing the output
capacitor makes the output ripple voltage smaller in PWM mode.
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8.2.2.4 Input Capacitor Selection
Multilayer X5R or X7R ceramic capacitors are excellent choices for the input decoupling of the step-up converter
as they have extremely low ESR and are available in small footprints. Input capacitors must be located as close
as possible to the device. While a 10-μF input capacitor is sufficient for most applications, larger values can be
used to reduce input current ripple without limitations. Take care when using only ceramic input capacitors.
When a ceramic capacitor is used at the input and the power is being supplied through long wires, a load step at
the output can induce ringing at the VIN pin. This ringing can couple to the output and be mistaken as loop
instability or can even damage the part. In this circumstance, place additional bulk capacitance (tantalum or
aluminum electrolytic capacitor) between ceramic input capacitor and the power source to reduce ringing that
can occur between the inductance of the power source leads and ceramic input capacitor.
8.2.3 Application Curves
Vout(5V o set)
20mV/div
Vout(5V o set)
10mV/div
SW
SW
5V/div
5V/div
Inductor Current
200mA/div
Inductor Current
200mA/div
Time scale: 20ms/div
Time scale: 10us/div
VIN = 3.6 V
IOUT = 0A
VIN = 3.6 V
IOUT = 1 mA
图8-2. Switching Waveform at Open Load
图8-3. Switching Waveform at Light Load
Vout (5V o set)
20mV/div
Vout(5V o set)
10mV/div
SW
5V/div
SW
5V/div
Inductor Current
200mA/div
Inductor current
200mA /div
Time scale: 200ns/div
Time scale: 200ns/div
VIN = 3.6 V
IOUT = 300 mA
VIN = 3.6 V
IOUT = 50mA
图8-5. Switching Waveform at Heavy Load
图8-4. Switching Waveform at Medium Load
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EN
2V/div
EN
2V/div
Vout
2V/div
Vout
2V/div
Inductor Current
200mA/div
Inductor Current
200mA/div
Time scale: 2ms/div
Time scale: 500us/div
VIN = 3.6 V
VOUT =5 V
Rload = 500 Ω
VIN = 3.6 V
VOUT =5 V
Rload = 500 Ω
图8-7. Shutdown by EN
图8-6. Start-Up by EN
Vout (5V o set)
100mV/div
Vout (5V o set)
100mV/div
Vin
2V /div
Output Current
100mA/div
Time scale: 50us/div
Time scale: 200us/div
VIN = 3.6V, VOUT =5V, IOUT = 0 to 200mA with 20-μs slew rate
VIN= 2.0V to 4.5V with 20-μs slew rate,VOUT =5V,Rload = 25
Ω
图8-8. Load Transient
图8-9. Line Transient
Vout (5V o set)
100mV/div
Vout (5V o set)
200mV/div
Vin
1V /div
Output current
100mA /div
Inductor current
500mA /div
Time scale: 200us/div
Time scale: 10ms/div
VIN = 2 V to 4.5 V Sweep, VOUT = 5 V, 25-Ωresistance load
VIN = 3.6 V, VOUT = 5 V, IOUT = 0 A to 400 mA Sweep
图8-10. Load Sweep
图8-11. Line Sweep
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8.2.4 Power Supply Recommendations
The device is designed to operate from an input voltage supply range between 0.7 V to 5.5 V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional bulk
capacitance can be required in addition to the ceramic bypass capacitors. A typical choice is a tantalum or
aluminum electrolytic capacitor with a value of 100 µF. Output current of the input power supply must be rated
according to the supply voltage, output voltage, and output current of the TPS61299.
8.2.5 Layout
8.2.5.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design, especially at high peak currents
and high switching frequencies. If the layout is not carefully done, the regulator can show stability problems as
well as EMI problems. Therefore, use wide and short traces for the main current path and for the power ground
paths. The input and output capacitors , as well as the inductor are placed as close as possible to the IC.
8.2.5.2 Layout Example
The bottom layer is a large GND plane connected by vias.
图8-12. Layout Example
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9 Thermal Information
The maximum IC junction temperature is restricted to 125°C under normal operating conditions. Calculate the
maximum allowable dissipation, PD(max) , and keep the actual power dissipation less than or equal to
PD(max) . The maximum-power-dissipation limit is determined using equation (10)节8.2.5.
125 - TA
RqJA
PD max
=
(
)
(4)
Where
• TA is the maximum ambient temperature for the application
JA is the junction-to-ambient thermal resistance given in the Thermal Information table.
•
Ɵ
The TPS61299 comes in a WCSP or SOT583 package. The real junction-to-ambient thermal resistance of the
package greatly depends on the PCB type and layout. Using thick PCB copper and soldering GND pin to a large
ground plate enhances the thermal performance. Using more vias connects the ground plate on the top layer
and bottom layer around the IC without solder mask also improves the thermal capability.
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10 Device and Documentation Support
10.1 Device Support
10.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
10.2 Documentation Support
10.2.1 Related Documentation
For related documentation see the following:
• Texas Instruments, Performing Accurate PFM Mode Efficiency Measurements Application Report
• Texas Instruments, Accurately Measuring Efficiency of Ultra-low-IQ Devices Technical Brief
• Texas Instruments, IQ: What it is, What it isn’t, and How to Use it Techanical Brief
10.3 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
10.4 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
10.5 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
10.6 静电放电警告
静电放电(ESD) 会损坏这个集成电路。德州仪器(TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理
和安装程序，可能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级，大至整个器件故障。精密的集成电路可能更容易受到损坏，这是因为非常细微的参
数更改都可能会导致器件与其发布的规格不相符。
10.7 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
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11 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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5-Jun-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
XTPS61299YBHR
ACTIVE
DSBGA
YBH
6
6000
TBD
Call TI
Call TI
-40 to 125
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
YBH0006
DSBGA - 0.4 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
C
0.4 MAX
SEATING PLANE
0.05 C
0.16
0.10
BALL TYP
0.4
TYP
C
SYMM
D: Max = 1.258 mm, Min =1.198 mm
E: Max = 0.87 mm, Min = 0.81 mm
0.8
TYP
B
A
0.4
TYP
1
2
0.225
0.185
C A B
6X
0.015
SYMM
4224514/A 08/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
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EXAMPLE BOARD LAYOUT
YBH0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
6X ( 0.2)
2
1
A
(0.4) TYP
SYMM
B
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 50X
0.05 MIN
0.05 MAX
METAL UNDER
SOLDER MASK
(
0.2)
METAL
(
0.2)
EXPOSED
METAL
SOLDER MASK
OPENING
EXPOSED
METAL
SOLDER MASK
OPENING
SOLDER MASK
DEFINED
(PREFERRED)
NON-SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4224514/A 08/2018
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YBH0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
6X ( 0.21)
1
2
A
B
(0.4) TYP
SYMM
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm THICK STENCIL
SCALE: 50X
4224514/A 08/2018
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
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