TPS62242-Q1 [TI]

2.25-MHz 300-mA Step-Down Converter in DDC/TSOT23 Package; 2.25 - MHz的300 - mA的降压转换器的DDC / TSOT23套餐
TPS62242-Q1
型号: TPS62242-Q1
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.25-MHz 300-mA Step-Down Converter in DDC/TSOT23 Package
2.25 - MHz的300 - mA的降压转换器的DDC / TSOT23套餐

转换器
文件: 总21页 (文件大小:700K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
2.25-MHz 300-mA Step-Down Converter in DDC/TSOT23 Package  
Check for Samples: TPS62242-Q1  
1
FEATURES  
DESCRIPTION  
The TPS62242-Q1 device is  
synchronous step-down dc-dc converter optimized for  
battery-powered portable applications. It provides up  
to 300 mA of output current from a single Li-Ion cell  
and is ideal to power portable applications like mobile  
phones and other portable equipment.  
23  
Qualified for Automotive Applications  
a
high-efficiency  
AEC-Q100 Qualified With the Following  
Results:  
Device Temperature Grade 2  
Device HBM ESD Classification Level H2  
Device CDM ESD Classification Level C3B  
With an input voltage range of 2 V to 6 V, the device  
supports applications powered by Li-Ion batteries with  
extended voltage range, two- and three-cell alkaline,  
3.3-V and 5-V input voltage rails.  
High Efficiency – Greater than 94%  
Output Current up to 300 mA  
VIN Range From 2 V to 6 V  
2.25-MHz Fixed-Frequency Operation  
Power-Save Mode at Light Load Currents  
Output Voltage Accuracy in PWM Mode ±1.5%  
Adjustable Output Voltage from 0.6 V to VIN  
Typical 15 μA Quiescent Current  
100% Duty Cycle for Lowest Dropout  
Available in a TSOT23 Package  
The TPS62242-Q1 operates at 2.25-MHz fixed  
switching frequency and enters the power-save mode  
of operation at light load currents to maintain high  
efficiency over the entire load current range.  
The power-save mode is optimized for low output-  
voltage ripple. In the shutdown mode, the current  
consumption is reduced to less than  
1
μA.  
TPS62242-Q1 allows the use of small inductors and  
capacitors to achieve a small solution size.  
Allows < 1-mm Solution Height  
The TPS62242-Q1 is available in a 5-pin TSOT23  
package.  
APPLICATIONS  
Automotive Applications  
Bluetooth™ Headset  
Cell Phones, Smart-Phones  
WLAN  
Low-Power DSP Supply  
Portable Media Players  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
Bluetooth is a trademark of Bluetooth SIG, Inc..  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2011–2012, Texas Instruments Incorporated  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
L1  
2.2 µH  
100  
TPS62242-Q1  
VIN 2.0V to 6.3V  
V = 2 V  
I
VOUT 1.2V  
V = 2 V  
I
V = 2.7  
90  
80  
70  
VIN  
SW  
Up to 300mA  
I
V = 4.5  
I
CIN  
47. µF  
EN  
V = 3 V  
I
COUT  
10 µF  
FB  
GND  
V = 3.6  
60  
50  
40  
I
V = 4.5  
I
30  
20  
10  
0
VO = 1.8 V,  
MODE = GND,  
L = 2.2 mH,  
DCR 110 mΩ  
0.01  
0.1  
1
10  
100 1000  
I
- Output Current - mA  
O
2
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
TA  
PACKAGE  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–40°C to 115°C  
TSOT23-5 – DDC  
Reel of 3000  
TPS62242QDDCRQ1  
SAW  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range (unless otherwise noted)(1)  
VALUE  
–0.3 to 7  
UNIT  
VI  
Input voltage range(2)  
Voltage range at EN  
Voltage on SW  
V
V
V
A
–0.3 to VIN +0.3, 7  
–0.3 to 7  
Peak output current  
Internally limited  
2
Human Body Model (HBM) AEC-Q100  
Classification Level H2  
kV  
V
ESD rating(3)  
Charged Device Model (CDM) AEC-Q100  
Classification Level C3B  
750  
TJ  
Maximum operating junction temperature  
Storage temperature range  
–40 to 150  
-65 to 150  
°C  
°C  
Tstg  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.  
(2) All voltage values are with respect to network ground terminal.  
(3) The human body model is a 100-pF capacitor discharged through a 1.5 kresistor into each pin. The machine model is a 200-pF  
capacitor discharged directly into each pin.  
DISSIPATION RATINGS  
POWER RATING  
FOR TA 25°C  
DERATING FACTOR  
ABOVE TA = 25°C  
PACKAGE  
RθJA  
DDC  
250°C/W  
400 mW  
4 mW/°C  
RECOMMENDED OPERATING CONDITIONS  
over operating free-air temperature range (unless otherwise noted)  
MIN  
2
NOM  
MAX  
6
UNIT  
V
VI  
Supply voltage, VIN  
Output voltage range for adjustable voltage  
Operating ambient temperature  
Operating junction temperature  
0.6  
–40  
–40  
VIN  
115  
125  
V
TA  
TJ  
°C  
°C  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
Over full operating ambient temperature range, typical values are at TA = 25°C. Unless otherwise noted, specifications apply  
for condition VIN = EN = 3.6V. External components CIN = 4,7μF 0603, COUT = 10μF 0603, L = 2.2μH, refer to parameter  
measurement information.  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
SUPPLY  
VIN  
Input voltage range  
Output current  
2
6
300  
150  
V
2.3 V VIN 6 V  
IOUT  
mA  
2 V VIN 2.3 V  
IOUT = 0 mA. PFM mode enabled, device not  
switching  
15  
μA  
IOUT = 0 mA. PFM mode enabled, device switching,  
IQ  
Operating quiescent current  
18.5  
(1)  
VOUT = 1.8 V,  
IOUT = 0 mA, switching with no load , PWM  
operation , VOUT = 1.8 V, VIN = 3 V  
3.8  
0.1  
mA  
EN = GND  
TA = 115°C  
Falling  
1
5
μA  
ISD  
Shutdown current  
µA  
1.85  
1.95  
UVLO  
Undervoltage lockout threshold  
V
Rising  
ENABLE, MODE  
VIH  
VIL  
IIN  
High level input voltage, EN  
2 V VIN 6 V  
2 V VIN 6 V  
TA = 115°C  
EN  
1
0
VIN  
0.4  
0.35  
1
V
V
Low level input voltage, EN  
Input bias current, EN  
V
0.01  
μA  
POWER SWITCH  
High side MOSFET on-resistance  
240  
180  
0.7  
480  
380  
0.84  
0.95  
165  
16  
RDS(on)  
VIN = VGS = 3.6 V, TA = 25°C  
mΩ  
Low side MOSFET on-resistance  
VIN = VGS = 3.6 V, TA= 25°C  
TA = –40°C to 115°C  
0.56  
0.54  
135  
12  
Forward current limit MOSFET high-  
side and low side  
ILIMF  
TSD  
A
Thermal shutdown  
Increasing junction temperature  
Decreasing junction temperature  
150  
14  
°C  
°C  
Thermal shutdown hysteresis  
OSCILLATOR  
fSW  
Oscillator frequency  
2 V VIN 6 V  
2
2.25  
2.5  
MHz  
OUTPUT  
VOUT  
Vref  
Output voltage  
1.2  
V
Reference voltage  
TA = 25°C  
0.594  
–1.5%  
–1.5%  
600 0.606  
0% 1.5%  
mV  
PWM operation, 2 V VIN 6 V, in fixed output  
voltage versions VFB = VOUT, See  
(2)  
Feedback voltage  
TA = 115°C  
2.5%  
0%  
VFB  
Feedback voltage PFM mode  
Load regulation  
Device in PFM mode  
-0.5  
%/A  
μs  
tStart Up  
tRamp  
Start-up Time  
Time from active EN to reach 95% of VOUT nominal  
Time to ramp from 5% to 95% of VOUT  
VIN = 3.6 V, VIN = VOUT = VSW, EN = GND,(3)  
TA = 115°C  
500  
VOUT ramp UP time  
250  
μs  
0.1  
1
Ilkg  
Leakage current into SW pin  
μA  
10  
(1) See the parameter measurement information.  
(2) for VIN = VO + 0.6  
(3) In fixed output voltage versions, the internal resistor divider network is disconnected from FB pin.  
4
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
PIN ASSIGNMENTS  
DDC PACKAGE  
(TOP VIEW)  
VIN  
GND  
EN  
5
SW  
FB  
1
2
3
4
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
VIN  
NO.  
1
PWR VIN power supply pin.  
PWR GND supply pin  
GND  
2
This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling  
this pin to high enables the device. This pin must be terminated.  
EN  
SW  
FB  
3
5
4
I
OUT  
I
This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this  
terminal.  
Feedback Pin for the internal regulation loop. Connect the external resistor divider to this pin. In case of  
fixed output voltage option, connect this pin directly to the output capacitor.  
FUNCTIONAL BLOCK DIAGRAM  
VIN  
Current  
Limit Comparator  
VIN  
Thermal  
Shutdown  
Undervoltage  
Lockout1.8V  
Limit  
EN  
High Side  
PFM Comparator  
Reference  
0.6V VREF  
FB  
VREF  
Gate Driver  
Anti-  
Shoot-Through  
Control  
Stage  
Error Amp .  
SW1  
Softstart  
VOUT RAMP  
CONTROL  
VREF  
Integrator  
FB  
PWM  
Comp.  
FB  
Zero-Pole  
AMP.  
Limit  
RI 1  
GND  
Low Side  
RI..N  
Current  
Limit Comparator  
Sawtooth  
Generator  
2.25 MHz  
Oscillator  
Int. Resistor  
Network  
GND  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
L1  
2.2 µH  
TPS62242-Q1  
VIN 2.0V to 6.3V  
VOUT 1.2V  
VIN  
SW  
Up to 300mA  
CIN  
47. µF  
EN  
COUT  
10 µF  
FB  
GND  
TYPICAL CHARACTERISTICS  
Table 1. Table of Graphs  
FIGURE  
vs Output current, Power Save Mode  
vs Output current, Forced PWM Mode  
vs Output current  
Figure 1  
Efficiency  
vs Output current  
vs Output current, TA = 25°C  
vs Output current, TA = –40°C  
vs Output current, TA = 85°C  
vs Output current, TA = 25°C  
vs Output current, TA = 85°C  
vs Output current, TA = –40°C  
Figure 3  
Figure 4  
Figure 5  
Output voltage accuracy  
Startup timing  
Figure 6  
Figure 7  
Figure 8  
Figure 9  
Figure 10  
Figure 11  
PWM Mode with VO = 1.8V  
PFM Mode with VO = 1.8V  
PFM Mode Ripple  
Typical operation  
1 mA to 50 mA with VO = 1.8V  
20 mA to 200 mA with VO = 1.8V  
50 mA to 200 mA with VO = 1.8V  
IO = 50 mA, 3.6V to 4.2V  
IO= 250 mA, 3.6V to 4.2V  
PFM to PWM  
PFM load transient  
Figure 12  
Figure 13  
Figure 14  
Figure 15  
Figure 16  
Figure 17  
Figure 18  
Figure 19  
PFM line transient  
Mode transition  
PWM to PFM  
Shutdown Current into VIN  
Quiescent Current  
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)  
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)  
Static Drain-Source On-State  
Resistance  
vs Input Voltage, (TA = 85°C, TA = 25°C, TA = -40°C)  
6
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
EFFICIENCY (Power Save Mode)  
EFFICIENCY  
vs  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
100  
90  
100  
V = 2 V  
I
V
= 2.3 V  
V = 2 V  
90  
80  
70  
I
I
V = 2.7 V  
I
80  
V = 4.5 V  
I
V
= 4.5 V  
V = 3 V  
I
I
70  
V
= 3.6 V  
I
V = 3.6 V  
I
60  
50  
40  
60  
50  
40  
V
= 2.7 V  
I
V = 4.5 V  
I
30  
20  
10  
0
30  
V
= 1.2 V,  
O
VO = 1.8 V,  
MODE = GND,  
L = 2 mH,  
MIPSA2520  
MODE = GND,  
L = 2.2 mH,  
DCR 110 mΩ  
20  
10  
0
C
= 10 mF 0603  
O
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
1000  
I
- Output Current - mA  
O
I
− Output Current − mA  
O
Figure 1.  
Figure 2.  
OUTPUT VOLTAGE ACCURACY  
OUTPUT VOLTAGE ACCURACY  
vs  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
1.88  
1.88  
1.86  
T
= -40°C,  
T
= 25°C,  
A
A
V
= 1.8 V,  
V
= 1.8 V,  
O
MODE = GND,  
O
MODE = GND,  
1.86  
1.84  
1.82  
1.80  
1.78  
L = 2.2 mH,  
= 10 mF  
L = 2.2 mH,  
= 10 mF  
C
C
O
O
1.84  
1.82  
1.8  
PFM  
PFM  
PWM  
PWM  
V = 2.3 V  
I
V = 2.3 V  
I
V = 2.7 V  
I
V = 3 V  
I
V = 3.6 V  
I
V = 2.7 V  
I
V = 3 V  
I
1.78  
V = 3.6 V  
I
1.76  
1.74  
V = 4.5 V  
I
1.76  
1.74  
V = 4.5 V  
I
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
1000  
I
- Output Current - mA  
O
I
- Output Current - mA  
O
Figure 3.  
Figure 4.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
OUTPUT VOLTAGE ACCURACY  
vs  
OUTPUT CURRENT  
STARTUP TIMING  
1.88  
1.86  
T
= 85°C,  
= 1.8 V,  
A
VIN = 3.6V  
RLoad = 10R  
VOUT = 1.8V  
IIN into CIN  
EN 2V/Div  
V
O
MODE = GND,  
L = 2.2 mH,  
= 10 mF  
C
MODE = GND  
1.84  
1.82  
1.8  
O
SW 2V/Div  
VOUT 2V/Div  
IIN 100mA/Div  
PFM  
PWM  
V = 2.3 V  
I
V = 2.7 V  
I
1.78  
V = 3 V  
I
V = 3.6 V  
I
1.76  
1.74  
V = 4.5 V  
I
0.01  
0.1  
I
1
10  
100  
1000  
Time Base - 100ms/Div  
- Output Current - mA  
O
Figure 5.  
Figure 6.  
TYPICAL OPERATION  
TYPICAL OPERATION  
vs  
vs  
PWM MODE  
PFM MODE  
VIN 3.6V  
VOUT 20mV/Div  
VOUT 1.8V, IOUT 150mA  
L 2.2mH, COUT 10mF 0603  
VOUT 10mV/Div  
SW 2V/Div  
VIN 3.6V  
VOUT 1.8V, IOUT 10mA  
L 2.2mH, COUT 10mF 0603  
SW 2V/Div  
Icoil 200mA/Div  
Icoil 200mA/Div  
Time Base - 10ms/Div  
Time Base - 10ms/Div  
Figure 7.  
Figure 8.  
8
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
PFM MODE RIPPLE  
VIN 3.6V; VOUT 1.8V, IOUT 10mA;  
PFM LOAD TRANSIENT  
L = 4.7mH, COUT = 10mF 0603,  
VOUT 20mV/Div  
MODE = GND  
VOUT 50mV/Div  
VIN 3.6V  
VOUT 1.8V  
SW 2V/Div  
IOUT 1mA to 50mA  
MODE = GND  
50mA  
IOUT 50mA/Div  
1mA  
Icoil 200mA/Div  
Icoil 200mA/Div  
Time Base - 2ms/Div  
Time Base - 100ms/Div  
Figure 9.  
Figure 10.  
PFM LOAD TRANSIENT  
PFM LINE TRANSIENT  
VIN 3.6V to 4.2V  
500mV/Div  
VOUT 50mV/Div  
VIN 3.6V  
VOUT 1.8V  
IOUT 20mA to 200mA  
MODE = GND  
IOUT 200mA/Div  
20mA  
200mA  
VOUT = 1.8V  
50mV/Div  
IOUT = 50mA  
MODE = GND  
Icoil 200mA/Div  
Time base - 40ms/Div  
Time Base - 100ms/Div  
Figure 11.  
Figure 12.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
MODE TRANSITION  
PFM to PWM  
PFM LINE TRANSIENT  
VIN 3.6V to 4.2V  
500mV/Div  
VIN = 3.6  
VOUT = 1.8V  
IOUT = 10mA  
MODE  
2V/Div  
SW  
2V/Div  
PFM Mode  
Forced PWM Mode  
VOUT = 1.8V  
50mV/Div  
IOUT = 250mA  
MODE = GND  
Icoil  
200mA/Div  
Time Base - 100ms/Div  
Time Base - 1ms/Div  
Figure 13.  
Figure 14.  
SHUTDOWN CURRENT INTO VIN  
MODE TRANSITION  
PWM to PFM  
vs  
INPUT VOLTAGE  
0.8  
EN = GND  
MODE  
2V/Div  
VIN = 3.6  
0.7  
0.6  
VOUT = 1.8V  
IOUT = 10mA  
T
= 85oC  
A
SW  
0.5  
0.4  
0.3  
0.2  
0.1  
2V/Div  
PFM Mode  
Forced PWM Mode  
Icoil  
200mA/Div  
T
= 25oC  
T
= -40oC  
A
A
0
2
2.5  
3
3.5  
4
4.5  
5
5.5  
6
V
− Input Voltage − V  
IN  
Time Base - 2.5ms/Div  
Figure 15.  
Figure 16.  
10  
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
                     
2
2
                         
.5  
                          
                           
                               
3
3
                                   
.5  
                                    
                                    
44  
44..55  
55  
55..55  
2
2.5  
3
3.5  
4
4.5  
5
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
QUIESCENT CURRENT  
vs  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
0.8  
20  
18  
16  
14  
12  
10  
MODE = GND  
MODE = GND,  
EN = VIN  
EN = VIN,  
Device Not Switching  
Device Not Switching  
High Side Switching  
0.7  
o
= 85°C  
T
T A = 85  
A
0.6  
0.5  
T
= 85oC  
A
= 25o°C  
T
= 25oC  
T
T
C
A
A
A
0.4  
0.3  
0.2  
0.1  
0
T
T A = -  
= –40o°C  
C
T
= -40oC  
A
A
8
82  
6
6
V
− Input Voltage − V  
V
– Input Voltage – V  
− Input Voltage − V  
V
IN  
IN  
IN  
Figure 17.  
Figure 18.  
STATIC DRAIN-SOURCE ON-STATE RESISTANCE  
vs  
INPUT VOLTAGE  
0.4  
Low Side Switching  
0.35  
0.3  
T
= 85oC  
A
0.25  
T
= 25oC  
A
0.2  
0.15  
0.1  
0.05  
0
T
= -40oC  
A
2
2.5  
3
3.5  
4
4.5  
5
V
− Input Voltage − V  
IN  
Figure 19.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
DETAILED DESCRIPTION  
OPERATION  
The TPS62242-Q1 step down converter operates with typically 2.25MHz fixed frequency pulse width modulation  
(PWM) at moderate to heavy load currents. At light load currents, the converter can automatically enter Power  
Save Mode and operates then in PFM mode.  
During PWM operation, the converter uses a unique fast response voltage mode control scheme with input  
voltage feed-forward to achieve good line and load regulation, allowing the use of small ceramic input and output  
capacitors. At the beginning of each clock cycle initiated by the clock signal, the High Side MOSFET switch is  
turned on. The current then flows from the input capacitor via the High Side MOSFET switch through the inductor  
to the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips and the  
control logic turns off the switch. The current limit comparator also turns off the switch if the current limit of the  
High Side MOSFET switch is exceeded. After a dead time preventing shoot through current, the Low Side  
MOSFET rectifier is turned on and the inductor current ramps down. The current then flows from the inductor to  
the output capacitor and to the load. It returns back to the inductor through the Low Side MOSFET rectifier.  
The next cycle is initiated by the clock signal again turning off the Low Side MOSFET rectifier and turning on the  
High Side MOSFET switch.  
POWER SAVE MODE  
The Power Save Mode is enabled. If the load current decreases, the converter will enter Power Save Mode  
operation automatically. During Power Save Mode, the converter skips switching and operates with reduced  
frequency in PFM mode with a minimum quiescent current to maintain high efficiency.  
The transition from PWM mode to PFM mode occurs once the inductor current in the Low Side MOSFET switch  
becomes zero, which indicates discontinuous conduction mode.  
During the Power Save Mode, the output voltage is monitored with a PFM comparator. As the output voltage falls  
below the PFM comparator threshold of VOUT nominal, the device starts a PFM current pulse. The High Side  
MOSFET switch will turn on, and the inductor current ramps up. After the On-time expires, the switch is turned  
off and the Low Side MOSFET switch is turned on until the inductor current becomes zero.  
The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered  
current, the output voltage will rise. If the output voltage is equal to or greater than the PFM comparator  
threshold, the device stops switching and enters a sleep mode with typical 15-μA current consumption.  
If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are  
generated until the PFM comparator threshold is reached. The converter starts switching again once the output  
voltage drops below the PFM comparator threshold.  
With a fast single-threshold comparator, the output voltage ripple during PFM mode operation can be kept to a  
minimum. The PFM Pulse is time controlled, allowing the user to modify the charge transferred to the output  
capacitor by the value of the inductor. The resulting PFM output voltage ripple and PFM frequency both depend  
on the size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values  
will minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with  
larger values.  
If the output current cannot be supported in PFM mode, the device exits PFM mode and enters PWM mode.  
Output voltage  
VOUT nominal  
PWM + PFM  
moderate to heavy load  
PWM Mode  
Light load  
PFM Mode  
Figure 20. Power Save Mode  
12  
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
100% Duty Cycle Low Dropout Operation  
The device starts to enter 100% duty cycle mode once the input voltage comes close to the nominal output  
voltage. In order to maintain the output voltage, the High Side MOSFET switch is turned on 100% for one or  
more cycles.  
With further decreasing VIN the High Side MOSFET switch is turned on completely. In this case the converter  
offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to  
achieve longest operation time by taking full advantage of the entire battery voltage range.  
The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be  
calculated as:  
VINmin = VOmax + IOmax × ®DSo(n)max + RL)  
With:  
IOmax = maximum output current plus inductor ripple current  
RDS(on)max = maximum P-channel switch RDS(on)  
RL = DC resistance of the inductor  
.
VOmax = nominal output voltage plus maximum output voltage tolerance  
UNDERVOLTAGE LOCKOUT  
The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from  
excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout  
threshold is typically 1.85V with falling VIN.  
ENABLE  
The device is enabled by setting the EN pin to high. During the start up time t Start Up, the internal circuits are  
settled and the soft start circuit is activated. The EN input can be used to control power sequencing in a system  
with various dc/dc converters. The EN pin can be connected to the output of another converter, to drive the EN  
pin high and getting a sequencing of supply rails. With EN pin = GND, the device enters shutdown mode in which  
all circuits are disabled. In fixed output voltage versions, the internal resistor divider network is then disconnected  
from FB pin.  
SOFT START  
The TPS62242-Q1 has an internal soft start circuit that controls the ramp up of the output voltage. The output  
voltage ramps up from 5% to 95% of its nominal value within typical 250μs. This limits the inrush current in the  
converter during ramp up and prevents possible input voltage drops when a battery or high impedance power  
source is used. The soft start circuit is enabled within the start up time, tStart up  
.
SHORT-CIRCUIT PROTECTION  
The High Side and Low Side MOSFET switches are short-circuit protected with maximum switch current equal to  
ILIMF. The current in the switches is monitored by current limit comparators. Once the current in the High Side  
MOSFET switch exceeds the threshold of it's current limit comparator, it turns off and the Low Side MOSFET  
switch is activated to ramp down the current in the inductor and High Side MOSFET switch. The High Side  
MOSFET switch can only turn on again, once the current in the Low Side MOSFET switch has decreased below  
the threshold of its current limit comparator.  
THERMAL SHUTDOWN  
As soon as the junction temperature, TJ, exceeds TBD( typical) the device goes into thermal shutdown. In this  
mode, the High Side and Low Side MOSFETs are turned off. The device continues its operation when the  
junctiontemperature falls below the thermal shutdown hysteresis.  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
13  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
APPLICATION INFORMATION  
L1  
2.2 µH  
TPS62242-Q1  
VIN 2.0V to 6.3V  
VOUT 1.2V  
VIN  
SW  
Up to 300mA  
CIN  
47. µF  
EN  
COUT  
10 µF  
FB  
GND  
Figure 21. Fixed 1.2 V  
OUTPUT FILTER DESIGN (INDUCTOR AND OUTPUT CAPACITOR)  
The TPS62242-Q1 is designed to operate with inductors in the range of 1.5μH to 4.7μH and with output  
capacitors in the range of 4.7μF to 22μF. The part is optimized for operation with a 2.2μH inductor and 10μF  
output capacitor.  
Larger or smaller inductor values can be used to optimize the performance of the device for specific operation  
conditions. For stable operation, the L and C values of the output filter may not fall below 1μH effective  
Inductance and 3.5μF effective capacitance. Selecting larger capacitors is less critical because the corner  
frequency of the L-C filter moves to lower frequencies with fewer stability problems.  
Inductor Selection  
The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its dc  
resistance and saturation current. The inductor ripple current (ΔIL) decreases with higher inductance and  
increases with higher VI or VO.  
The inductor selection also has an impact on the output voltage ripple in the PFM mode. Higher inductor values  
will lead to lower output voltage ripple and higher PFM frequency, and lower inductor values will lead to a higher  
output voltage ripple but lower PFM frequency.  
Equation 1 calculates the maximum inductor current in PWM mode under static load conditions. The saturation  
current of the inductor should be rated higher than the maximum inductor current as calculated with Equation 2.  
This is recommended because during heavy load transients the inductor current will rise above the calculated  
value.  
Vout  
Vin  
1 *  
DI + Vout   
L
L   ƒ  
(1)  
DI  
L
I
+ I  
)
outmax  
Lmax  
2
(2)  
With:  
f = Switching Frequency (2.25 MHz typical)  
L = Inductor Value  
ΔIL = Peak to Peak inductor ripple current  
ILmax = Maximum Inductor current  
A more conservative approach is to select the inductor current rating just for the maximum switch current limit  
ILIMF of the converter.  
Accepting larger values of ripple current allows the use of low inductance values, but results in higher output  
voltage ripple, greater core losses, and lower output current capability.  
14  
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
 
 
TPS62242-Q1  
www.ti.com  
SLVSB38A MARCH 2011REVISED MARCH 2012  
The total losses of the coil have a strong impact on the efficiency of the dc/dc conversion and consist of both the  
losses in the dc resistance (R(DC)) and the following frequency-dependent components:  
The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)  
Additional losses in the conductor from the skin effect (current displacement at high frequencies)  
Magnetic field losses of the neighboring windings (proximity effect)  
Radiation losses  
Table 2. List of Inductors  
DIMENSIONS [mm3]  
2.5 × 2.0 × 1.0  
2.5 × 2.0 × 1.2  
2.5x2.0x1.0  
INDUCTANCE μH  
INDUCTOR TYPE  
MIPS2520D2R2  
MIPSA2520D2R2  
KSLI-252010AG2R2  
LQM2HPN2R2MJ0L  
LPS3015  
SUPPLIER  
FDK  
2.0  
2.0  
2.2  
2.2  
2.2  
FDK  
Hitachi Metals  
Murata  
2.5x2.0x1.2  
3 × 3 × 1.4  
Coilcraft  
Output Capacitor Selection  
The advanced fast-response voltage mode control scheme of the TPS62242-Q1 allows the use of tiny ceramic  
capacitors. Ceramic capacitors with low ESR values have the lowest output voltage ripple and are  
recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,  
aside from their wide variation in capacitance over temperature, become resistive at high frequencies.  
At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as:  
Vout  
Vin  
L   ƒ  
1 *  
1
I
+ Vout   
 
RMSCout  
Ǹ
2
 
 
3  
(3)  
At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the  
voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the  
output capacitor:  
Vout  
Vin  
L   ƒ  
1 *  
1
ǒ
) ESRǓ  
DVout + Vout   
 
8   Cout   ƒ  
(4)  
At light load currents, the converter operates in Power Save Mode and the output voltage ripple depends on the  
output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple in  
PFM mode and tighten dc output accuracy in PFM mode.  
Input Capacitor Selection  
The buck converter has a natural pulsating input current; therefore, a low ESR input capacitor is required for best  
input voltage filtering, and minimizing the interference with other circuits caused by high input voltage spikes. For  
most applications, a 4.7-μF to 10-μF ceramic capacitor is recommended. Because ceramic capacitors lose up to  
80% of their initial capacitance at 5V, it is recommended that a 10-μF input capacitor be used for input voltages  
greater than 4.5V. The input capacitor can be increased without any limit for better input voltage filtering.  
Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input, and  
the power is being supplied through long wires, such as from a wall adapter, a load step at the output, or VIN  
step on the input, can induce ringing at the VIN pin. The ringing can couple to the output and be mistaken as  
loop instability, or could even damage the part by exceeding the maximum ratings  
Table 3. List of Capacitors  
CAPACITANCE  
4.7μF  
TYPE  
SIZE  
SUPPLIER  
Murata  
GRM188R60J475K  
GRM188R60J106M69D  
0603: 1.6x0.8x0.8mm3  
0603: 1.6x0.8x0.8mm3  
10μF  
Murata  
Copyright © 2011–2012, Texas Instruments Incorporated  
Submit Documentation Feedback  
15  
Product Folder Link(s): TPS62242-Q1  
TPS62242-Q1  
SLVSB38A MARCH 2011REVISED MARCH 2012  
www.ti.com  
LAYOUT CONSIDERATIONS  
As for all switching power supplies, the layout is an important step in the design. Proper function of the device  
demands careful attention to PCB layout. Care must be taken in board layout to get the specified performance. If  
the layout is not carefully done, the regulator could show poor line and/or load regulation, and additional stability  
issues as well as EMI problems. It is critical to provide a low inductance, impedance ground path. Therefore, use  
wide and short traces for the main current paths. The input capacitor should be placed as close as possible to  
the IC pins as well as the inductor and output capacitor.  
Connect the GND pin of the device to the PowerPAD™ land of the PCB and use this pad as a star point. Use a  
common Power GND node and a different node for the Signal GND to minimize the effects of ground noise.  
Connect these ground nodes together to the PowerPAD land (star point) underneath the IC. Keep the common  
path to the GND pin, which returns the small signal components, and the high current of the output capacitors as  
short as possible to avoid ground noise. The FB line should be connected right to the output capacitor and routed  
away from noisy components and traces (for example, the SW line).  
16  
Submit Documentation Feedback  
Copyright © 2011–2012, Texas Instruments Incorporated  
Product Folder Link(s): TPS62242-Q1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Apr-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS62242QDDCRQ1  
ACTIVE  
SOT  
DDC  
5
3000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS62242-Q1 :  
Catalog: TPS62242  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Apr-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS62242QDDCRQ1  
SOT  
DDC  
5
3000  
179.0  
8.4  
3.2  
3.2  
1.4  
4.0  
8.0  
Q3  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Apr-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SOT DDC  
SPQ  
Length (mm) Width (mm) Height (mm)  
203.0 203.0 35.0  
TPS62242QDDCRQ1  
5
3000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Audio  
Applications  
www.ti.com/audio  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
Automotive and Transportation www.ti.com/automotive  
Communications and Telecom www.ti.com/communications  
Amplifiers  
Data Converters  
DLP® Products  
DSP  
Computers and Peripherals  
Consumer Electronics  
Energy and Lighting  
Industrial  
www.ti.com/computers  
www.ti.com/consumer-apps  
www.ti.com/energy  
dsp.ti.com  
Clocks and Timers  
Interface  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
www.ti.com/industrial  
www.ti.com/medical  
www.ti.com/security  
Medical  
Logic  
Security  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Space, Avionics and Defense www.ti.com/space-avionics-defense  
microcontroller.ti.com  
www.ti-rfid.com  
Video and Imaging  
www.ti.com/video  
OMAP Mobile Processors www.ti.com/omap  
Wireless Connectivity www.ti.com/wirelessconnectivity  
TI E2E Community Home Page  
e2e.ti.com  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2012, Texas Instruments Incorporated  

相关型号:

TPS62242DRV

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62242DRVR

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62242DRVRG4

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62242DRVT

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62242DRVTG4

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62242QDDCRQ1

2.25-MHz 300-mA Step-Down Converter in DDC/TSOT23 Package
TI

TPS62243

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62243-Q1

DDC / 薄型小外形尺寸晶体管 (TSOT)23 封装内的 2.25MHz 300mA 降压转换器
TI

TPS62243DRV

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62243DRVR

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62243DRVRG4

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI

TPS62243DRVT

2.25 MHz 300 mA Step Down Converter in 2x2SON/TSOT23 Package
TI