TPS62244QDDCRQ1 [TI]

采用 TSOT23 封装的 2.25MHz 300mA 降压转换器 | DDC | 5 | -40 to 125;


型号：	TPS62244QDDCRQ1
厂家：	TEXAS INSTRUMENTS
描述：	采用 TSOT23 封装的 2.25MHz 300mA 降压转换器 \| DDC \| 5 \| -40 to 125 转换器
文件：	总27页 (文件大小：2618K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

采用 TSOT23 封装的 TPS6224X-Q1 汽车类 2.25MHz 300mA 降压转换器

1 特性

3 说明

•

符合 AEC-Q100 标准，具有以下特性：

TPS6224x-Q1 系列器件是高效同步直流/直流降压转换

器，提供固定输出电压和高达 300mA 的输出电流。这

些器件为电池供电的/永远在线的汽车应用（如遥控免

钥匙进入 (RKE) 或被动进入被动启动 (PEPS) 钥匙和

基站）提供了低功耗优势。借助 2V-6V 的输入电压范

围，这些器件支持由锂二氧化锰 (Li-MnO2) 纽扣电

池、锂离子电池、两节 (2S) 和三节 (3S) 碱性电池、

3.3V 和 5V 输入电压轨进行供电的应用。TPS6224x-

Q1 在高负载电流情况下以 2.25MHz 的固定开关频率

运行，在轻负载电流情况下会进入省电模式，以便在整

个负载电流范围内保持高效率和低功耗。此省电模式针

对低输出电压纹波进行了优化。在关断模式下，电流消

耗减少至 1μA 以下。TPS6224x-Q1 允许使用小型电感

器和电容器来实现较小的解决方案尺寸，并采用 5 引

脚 TSOT23 封装。

–

器件温度 1 级：-40°C 至 125°C 的工作结温范

围

•

输出电流高达 300mA

V_IN范围从 2V 至 6V

在 PWM 模式下以 2.25MHz 固定频率运行

轻负载电流上的省电模式

脉宽调制 (PWM) 模式中的输出电压精度为 ±1.5%

固定输出电压

–

1.80V TPS62243-Q1

1.25V TPS62244-Q1

•

15μA 典型静态电流

可实现 100% 占空比，以确保最低压降

采用 TSOT 23 (5) 2.90mm × 1.60mm 封装

2 应用

器件信息⁽¹⁾

•

遥控免钥匙进入 (RKE)

器件型号

封装

TSOT (5)

封装尺寸（标称值）

被动进入被动启动 (PEPS)

高级驾驶员辅助系统 (ADAS)

TPS6224X-Q1

2.90mm x 1.60mm

(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附

录。

–

前置摄像头、环视和停车辅助

典型应用原理图

效率与输出电流间的关系

L₁

2.2µH

TPS62244-Q1

V_IN2.0V to 6.0V

OFF

V_OUT1.25V

V_OUT= 1.25V

V_IN

Up to 300mA

C_OUT

10µF

C_IN

4.7µF

GND

V_IN= 2.3V

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5.0V

0.01

0.1

I_OUT[mA ]

100 300

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SLVSEK3

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

8.4 Device Functional Modes.......................................... 8

Application and Implementation ........................ 10

9.1 Application Information............................................ 10

9.2 Typical Application .................................................. 10

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Device Comparison Table..................................... 3

Pin Configuration and Functions......................... 3

Specifications......................................................... 3

7.1 Absolute Maximum Ratings ...................................... 3

7.2 ESD Ratings.............................................................. 4

7.3 Recommended Operating Conditions....................... 4

7.4 Thermal Information.................................................. 4

7.5 Electrical Characteristics........................................... 5

7.6 Typical Characteristics.............................................. 6

Detailed Description .............................................. 7

8.1 Overview ................................................................... 7

8.2 Functional Block Diagram ......................................... 7

8.3 Feature Description................................................... 8

10 Power Supply Recommendations ..................... 14

11 Layout................................................................... 15

11.1 Layout Guidelines ................................................. 15

11.2 Layout Example .................................................... 15

12 器件和文档支持 ..................................................... 16

12.1 第三方产品免责声明.............................................. 16

12.2 接收文档更新通知 ................................................. 16

12.3 社区资源................................................................ 16

12.4 商标....................................................................... 16

12.5 静电放电警告......................................................... 16

12.6 Glossary................................................................ 16

13 机械、封装和可订购信息....................................... 16

13.1 Package Option Addendum .................................. 17

4 修订历史记录

日期

修订版本

说明

2018 年 3 月

初始发行版。

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

5 Device Comparison Table

PART NUMBER⁽¹⁾

TPS62243-Q1

FIXED OUTPUT VOLTAGES [V]

OPERATING MODE

1.80 V

1.25 V

PFM/PWM with automatic transition

TPS62244-Q1

(1) For all available packages, see the orderable addendum at the end of the data sheet.

6 Pin Configuration and Functions

DDC Package

5-Pin SOT

Top View

V_IN

GND

Not to scale

Pin Functions

I/O

DESCRIPTION

NAME

NO.

This is the enable pin of the device. Pulling this pin to low forces the device into shutdown mode. Pulling

this pin to high enables the device. This pin must be terminated.

Feedback Pin for the internal regulation loop. Connect the external resistor divider to this pin. In case of

fixed output voltage option, connect this pin directly to the output capacitor.

GND

V_IN

PWR

GND supply pin.

This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this

terminal.

PWR

V_INpower supply pin.

7 Specifications

7.1 Absolute Maximum Ratings⁽¹⁾

MIN

–0.3

MAX

UNIT

V_I

Input voltage⁽²⁾

Voltage at EN

V_IN+ 0.3, ≤7

Voltage on SW

Peak output current

Maximum operating junction temperature

Storage temperature

Internally limited

T_J

–40

–65

150

°C

T_stg

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltage values are with respect to network ground terminal.

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

7.2 ESD Ratings

VALUE

±2000

±750

UNIT

Human-body model (HBM), per AEC Q100-002⁽¹⁾

Charged-device model (CDM), per AEC Q100-011

Electrostatic

V_(ESD)

discharge

(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V_I

Supply voltage, VIN

300

150

4.7

Output current, 2.3V < VIN < 6V

Output current, 2V ≤ VIN ≤ 2.3V

Inductance

µH

µF

I_OUT

1.5

4.7

C_OUTOutput capacitance

T_J

Operating junction temperature

–40

125

°C

7.4 Thermal Information

TPS6224X-Q1

THERMAL METRIC⁽¹⁾

DDC (TSOT 23)

UNIT

5 PINS

193.7

40.7

R_θJA

Junction-to-ambient thermal resistance

°C/W

R_θJC(top)

R_θJB

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

0.9

ψ_JB

34.7

N/A

R_θJC(bot)

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

7.5 Electrical Characteristics

T_J= -40°C to 125°C, typical values are at T_J= 25°C, unless otherwise noted. Specifications apply for condition V_IN= 3.6 V.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX UNIT

SUPPLY

I_OUT= 0 mA. Pulse frequency modulation (PFM)

mode enabled, device not switching

I_Q

Operating quiescent current

μA

I_OUT= 0 mA. PFM mode enabled, device switching,

V_OUT= 1.25 V

18.5

0.1

EN = GND, T_J= 25°C

EN = GND

Falling

μA

I_SD

Shutdown current

1.85

1.95

UVLO

Undervoltage lockout threshold

Rising

ENABLE, MODE

V_IH

V_IL

I_IN

High-level input voltage, EN

2 V ≤ V_IN≤ 6 V

V_IN

0.35

Low-level input voltage, EN

Input bias current, EN

2 V ≤ V_IN≤ 6 V,

EN, MODE = GND or V_IN

0.01

μA

POWER SWITCH

High-side MOSFET ON-resistance

240

180

480

380

R_DS(on)

V_IN= V_GS= 3.6 V, T_J= 25°C

V_IN= V_GS= 3.6 V,

mΩ

Low-side MOSFET ON-resistance

Forward current limit MOSFET high-

side and low-side

I_LIMF

0.54

0.95

2.5

Thermal shutdown

Increasing junction temperature

Decreasing junction temperature

140

°C

TSD

Thermal shutdown hysteresis

OSCILLATOR

ƒ_SW

Oscillator frequency

2 V ≤ V_IN≤ 6 V, PWM Mode

2.25

MHz

OUTPUT

V_OUT

Output voltage

TPS62244 Q1 (fixed V_OUT

)

1.25

1.80

600

TPS62243 Q1 (fixed V_OUT

V_REF

Internal reference voltage

PWM operation, 2 V ≤ V_IN≤ 6 V, in fixed output

–1.5%

0% 1.5%

voltage versions V_FB= V_OUT, See ⁽¹⁾,T_J= 25°C

Feedback voltage

PWM operation, 2 V ≤ V_IN≤ 6 V, in fixed output

2.5%

(1)

V_FB

voltage versions V_FB= V_OUT, See

Feedback voltage PFM mode

Load regulation

Device in PFM mode

PWM mode

–0.5

%/A

μs

t_{Start up}

t_Ramp

Start-up time

Time from active EN to reach 95% of V_OUTnominal

Time to ramp from 5% to 95% of V_OUT

500

250

V_OUTramp UP time

μs

V_IN= 3.6 V, V_IN= V_OUT= V_SW, EN = GND, T_J=

25°C⁽²⁾

0.1

I_lkg

Leakage current into SW pin

μA

(2)

V_IN= 3.6 V, V_IN= V_OUT= V_SW, EN = GND,

(1) For V_IN= V_O+ 0.6

(2) The internal resistor divider network is disconnected from FB pin.

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

7.6 Typical Characteristics

表 1. Table of Graphs

FIGURE

图 1

Shutdown Current into VIN

Quiescent Current

vs Input Voltage

图 2

图 3

Static Drain-Source On-State Resistance vs Input Voltage

图 4

T_J= -40°C

T_J= 0°C

T_J= 25°C

T_J= 85°C

T_J= 115°C

T_J= 125°C

MODE = GND,

EN = VIN,

Device Not Switching

T_J= 85^oC

0.1

T_J= 25^oC

0.01

0.001

T_J= -40^oC

2.5

3.5

4.5

5.5

V_IN[V]

SLVS

2.5

3.5

4.5

5.5

− Input Voltage − V

图 1. Shutdown Current vs Input Voltage

图 2. Quiescent Current vs Input Voltage

500

450

400

350

300

250

200

150

100

400

350

300

250

200

150

100

T_J= -40°C

T_J

25°C

85°C

T_J

25°C

85°C

T_J= 125°C

2.5

3.5

V_IN[V]

4.5

5.5

2.5

3.5

V_IN[V]

4.5

5.5

图 3. High Side Switch Static Drain-Source

图 4. Low Side Switch Static Drain-Source

On-State Resistance vs Input Voltage

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

8 Detailed Description

8.1 Overview

The TPS6224X-Q1 step-down converter typically operates with 2.25-MHz fixed-frequency pulse width modulation

(PWM) at moderate to heavy load currents. At light load currents, the converter can automatically enter power

save mode and then operates in PFM mode.

During PWM operation, the converter uses a unique fast-response voltage-mode control scheme with input

voltage feed-forward to achieve good line and load regulation, allowing the use of small ceramic input and output

capacitors. At the beginning of each clock cycle initiated by the clock signal, the high-side MOSFET switch is

turned on. The current then flows from the input capacitor through the high-side MOSFET switch through the

inductor to the output capacitor and load. During this phase, the current ramps up until the PWM comparator trips

and the control logic turns off the switch. The current limit comparator also turns off the switch if the current limit

of the high-side MOSFET switch is exceeded. After a dead time preventing shoot-through current, the low-side

MOSFET rectifier is turned on and the inductor current ramps down. The current then flows from the inductor to

the output capacitor and to the load. It returns back to the inductor through the low-side MOSFET rectifier.

The next cycle is initiated by the clock signal again turning off the low-side MOSFET rectifier and turning on the

high-side MOSFET switch.

8.2 Functional Block Diagram

VIN

Current

Limit Comparator

VIN

Thermal

Shutdown

Undervoltage

Lockout 1.8 V

Limit

High Side

PFM Comparator

Reference

0.6 V VREF

VREF

Gate Driver

Anti-Shoot-Through

Control

Stage

Error Amplifier

Integrator

SW1

Softstart

VOUT RAMP

CONTROL

VREF

PWM

Comp.

Zero-Pole

AMP.

Limit

RI 1

GND

Low Side

RI..N

Current

Limit Comparator

2.25 MHz

Oscillator

Sawtooth

Generator

Internal Resistor

Network

GND

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

8.3 Feature Description

8.3.1 Undervoltage Lockout

The undervoltage lockout circuit prevents the device from malfunctioning at low input voltages and from

excessive discharge of the battery and disables the output stage of the converter. The undervoltage lockout

threshold is typically 1.85 V with falling V_IN.

8.3.2 Enable

The device is enabled by setting the EN pin to high. During the start-up time (t_{Start up}), the internal circuits are

settled and the soft-start circuit is activated. The EN input can be used to control power sequencing in a system

with various DC-DC converters. The EN pin can be connected to the output of another converter, to drive the EN

pin high and sequence supply rails. With EN pin = GND, the device enters shutdown mode in which all circuits

are disabled. In fixed-output voltage versions, the internal resistor divider network is then disconnected from FB

pin.

8.3.3 Thermal Shutdown

As soon as the junction temperature, T_J, exceeds 140°C (typical) the device goes into thermal shutdown. In this

mode, the high-side and low-side MOSFETs are turned off. The device continues its operation when the junction

temperature falls below the thermal shutdown hysteresis.

8.4 Device Functional Modes

8.4.1 Soft Start

The TPS6224X-Q1 device has an internal soft-start circuit that controls the ramp up of the output voltage. The

output voltage ramps up from 5% to 95% of its nominal value within typical 250 μs. This limits the inrush current

in the converter during ramp up and prevents possible input voltage drops when using a battery or high

impedance power source. The soft-start circuit is enabled within the start-up time, t_{Start up}

8.4.2 Power Save Mode

The power save mode is enabled. If the load current decreases, the converter enters power save mode operation

automatically. During power save mode, the converter skips switching and operates with reduced frequency in

PFM mode with a minimum-quiescent current to maintain high efficiency.

The transition from PWM mode to PFM mode occurs once the inductor current in the low-side MOSFET switch

becomes zero, which indicates discontinuous conduction mode.

During the power save mode, a PFM comparator monitors the output voltage. As the output voltage falls below

the PFM comparator threshold of V_OUTnominal, the device starts a PFM current pulse. The high-side MOSFET

switch turns on, and the inductor current ramps up. After the on-time expires, the switch turns off and the low-

side MOSFET switch turns on until the inductor current becomes zero.

The converter effectively delivers a current to the output capacitor and the load. If the load is below the delivered

current, the output voltage rises. If the output voltage is equal to or greater than the PFM comparator threshold,

the device stops switching and enters a sleep mode with typical 15-μA current consumption.

If the output voltage is still below the PFM comparator threshold, a sequence of further PFM current pulses are

generated until the PFM comparator threshold is reached. The converter starts switching again once the output

voltage drops below the PFM comparator threshold.

With a fast single-threshold comparator, the output-voltage ripple during PFM mode operation can be kept to a

minimum. The PFM pulse is time controlled, allowing the user to modify the charge transferred to the output

capacitor by the value of the inductor. The resulting PFM output voltage ripple and PFM frequency both depend

on the size of the output capacitor and the inductor value. Increasing output capacitor values and inductor values

minimize the output ripple. The PFM frequency decreases with smaller inductor values and increases with larger

values.

If the output current cannot be supported in PFM mode, the device exits PFM mode and enters PWM mode.

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

Device Functional Modes (接下页)

Output voltage

V_OUTnominal

PWM + PFM

moderate to heavy load

PWM Mode

Light load

PFM Mode

图 5. Power Save Mode

8.4.2.1 100% Duty Cycle Low Dropout Operation

The device starts to enter 100% duty-cycle mode once the input voltage comes close to the nominal output

voltage. To maintain the output voltage, the high-side MOSFET switch is turned on 100% for one or more cycles.

With further decreasing V_INthe high-side MOSFET switch is turned on completely. In this case, the converter

offers a low input-to-output voltage difference. This is particularly useful in battery-powered applications to

achieve longest operation time by taking full advantage of the entire battery voltage range.

The minimum input voltage to maintain regulation depends on the load current and output voltage, and can be

calculated as:

V_INmin = V_Omax + I_Omax (R_DS(on)max + R_L)

where

•

I_Omax = maximum output current plus inductor ripple current

R_DS(on)max = maximum P-channel switch R_DS(on)

R_L= DC resistance of the inductor

V_Omax = nominal output voltage plus maximum output voltage tolerance

(1)

8.4.3 Short-Circuit Protection

The high-side and low-side MOSFET switches are short-circuit protected with maximum switch current equal to

I_LIMF. The current in the switches is monitored by current limit comparators. Once the current in the high-side

MOSFET switch exceeds the threshold of its current limit comparator, it turns off and the low-side MOSFET

switch is activated to ramp down the current in the inductor and high-side MOSFET switch. The high-side

MOSFET switch can only turn on again once the current in the low-side MOSFET switch has decreased below

the threshold of its current limit comparator.

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

9 Application and Implementation

注

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

The following section discusses the design of the external components to complete the power supply design by

using typical applications as a reference.

9.2 Typical Application

L₁

2.2µH

TPS62244-Q1

V_IN2.0V to 6.0V

V_OUT1.25V

V_IN

Up to 300mA

C_OUT

10µF

C_IN

4.7µF

OFF

GND

图 6. TPS62244Q1, Fixed 1.25 V V_OUT

L₁

2.2µH

TPS62243-Q1

V_IN2.0V to 6.0V

OFF

V_OUT1.80V

Up to 300mA

C_OUT

10µF

V_IN

C_IN

4.7µF

GND

图 7. TPS62243Q1, Fixed 1.80 V V_OUT

9.2.1 Design Requirements

The device operates over an input voltage range from 2 V to 6 V. The output voltage setting is fixed.

9.2.2 Detailed Design Procedure

表 2 shows the list of components for the Application Curves. Users must verify and validate these components

for suitability with their application before using the components.

表 2. List of Components

VALUE

COMPONENT REFERENCE

PART NUMBER

GRM188R60J475K

GRM188R60J106M

LPS3015

MANUFACTURER⁽¹⁾

Murata

4.7 μF, 6.3 V. X5R Ceramic

10 μF, 6.3 V. X5R Ceramic

2.2 μH, 110 mΩ

C_IN

C_OUT

L₁

Murata

Coilcraft

(1) See Third-party Products Disclaimer

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

9.2.2.1 Output Filter Design (Inductor and Output Capacitor)

The TPS6224X-Q1 device is designed to operate with inductors in the range of 1.5 μH to 4.7 μH and with output

capacitors in the range of 4.7 μF to 22 μF. The device is optimized for operation with a 2.2-μH inductor and

10‑μF output capacitor.

Larger or smaller inductor values can be used to optimize the performance of the device for specific operation

conditions. For stable operation, the L and C values of the output filter may not fall below 1-μH effective

Inductance and 3.5-μF effective capacitance.

9.2.2.1.1 Inductor Selection

The inductor value has a direct effect on the ripple current. The selected inductor must be rated for its DC

resistance and saturation current (表 3). The inductor ripple current (ΔI_L) decreases with higher inductance and

increases with higher V_Ior V_O.

The inductor selection also has an impact on the output voltage ripple in the PFM mode. Higher inductor values

lead to lower-output voltage ripple and higher PFM frequency, and lower inductor values lead to a higher-output

voltage ripple with lower PFM frequency.

公式 2 calculates the maximum inductor current in PWM mode under static load conditions. The saturation

current of the inductor should be rated higher than the maximum inductor current as calculated with 公式 3. This

is the recommendation because during heavy-load transients the inductor current rises above the calculated

value.

V_OUT

DI_L= V_OUT

L ´ ƒ

(2)

DI_L

I_Lmax= I_OUTmax

where

•

ƒ = Switching frequency (2.25-MHz typical)

L = Inductor value

ΔI_L= Peak-to-Peak inductor ripple current

I_Lmax= Maximum inductor current

(3)

A more conservative approach is to select the inductor current rating just for the maximum switch current limit

I_LIMFof the converter.

Accepting larger values of ripple current allows the use of low inductance values, but results in higher output

voltage ripple, greater core losses, and lower output current capability.

The total losses of the coil strongly impact the efficiency of the DC-DC conversion and consist of both the losses

in the DC resistance (R_(DC)) and the following frequency-dependent components:

•

The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)

Additional losses in the conductor from the skin effect (current displacement at high frequencies)

Magnetic field losses of the neighboring windings (proximity effect)

Radiation losses

表 3. List of Inductors

INDUCTANCE (μH)

DIMENSIONS (mm)

2.5 × 2 × 1

PART NUMBER

MIPS2520D2R2

MANUFACTURER⁽¹⁾

FDK

2.5 × 2 × 1.2

2.5 × 2 × 1

MIPSA2520D2R2

KSLI-252010AG2R2

LQM2HPN2R2MJ0L

LPS3015

FDK

2.2

Hitachi Metals

Murata

2.5 × 2 × 1.2

3 × 3 × 1.4

Coilcraft

(1) See Third-party Products Disclaimer

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

9.2.2.1.2 Output Capacitor Selection

The advanced fast-response voltage-mode control scheme of the TPS6224X-Q1 device allows the use of tiny

ceramic capacitors. Ceramic capacitors with low-ESR values have the lowest-output voltage ripple and are

recommended. The output capacitor requires either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors,

aside from their wide variation in capacitance over temperature, become resistive at high frequencies.

At nominal load current, the device operates in PWM mode and the RMS ripple current is calculated as in 公式 4:

V_OUT

I_RMSC

= V_OUT

OUT

L ´ ƒ

2´ 3

(4)

At nominal load current, the device operates in PWM mode and the overall output voltage ripple is the sum of the

voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the

output capacitor as in 公式 5:

V_OUT

D V_OUT= V_OUT

+ ESR

L ´ ƒ

8´ C_OUT´ ƒ

(5)

At light load currents, the converter operates in power save mode and the output voltage ripple depends on the

output capacitor and inductor value. Larger output capacitor and inductor values minimize the voltage ripple in

PFM mode and tighten DC output accuracy in PFM mode.

9.2.2.1.3 Input Capacitor Selection

The buck converter has a natural pulsating input current; therefore, a low-ESR input capacitor is required for best

input voltage filtering and minimizing the interference with other circuits caused by high-input voltage spikes. For

most applications, a 4.7-μF to 10-μF ceramic capacitor is recommended (表 4). Because ceramic capacitors lose

up to 80% of their initial capacitance at 5 V, TI recommends using a 10-μF input capacitor for input voltages

greater than 4.5 V. The input capacitor can be increased without any limit for better input voltage filtering.

Take care when using only small ceramic input capacitors. When a ceramic capacitor is used at the input, and

the power is being supplied through long wires, such as from a wall adapter, a load step at the output, or V_INstep

on the input, can induce ringing at the VIN pin. The ringing can couple to the output and be mistaken as loop

instability, or could even damage the part by exceeding the maximum ratings.

表 4. List of Capacitors

CAPACITANCE (µF)

DIMENSIONS (mm)

0603: 1.6 × 0.8 × 0.8

PART NUMBER

MANUFACTURER⁽¹⁾

Murata

4.7

GRM188R60J475K

GRM188R60J106M69D Murata

(1) See Third-party Products Disclaimer

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

9.2.3 Application Curves

The conditions for below application curves are VIN = 3.0V, VOUT= 1.25V and the components listed in 表 2,

unless otherwise noted.

1.312

1.300

1.288

1.275

1.262

1.250

1.238

1.225

1.212

1.200

1.188

V_OUT= 1.25V

V_IN= 2.3V

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5.0V

V_IN= 2.3V

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5.0V

0.01

0.1

I_OUT[mA ]

100 300

0.001

0.01

0.1

I_OUT[mA ]

100 300

图 8. Efficiency vs Output Current, V_OUT= 1.25V

图 9. Output Voltage vs Output Current 1.25V V_OUT

1.890

1.872

1.854

1.836

1.818

1.800

1.782

1.764

1.746

1.728

1.710

V_IN= 2.3V

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5.0V

V_IN= 2.3V

V_IN= 2.7V

V_IN= 3.0V

V_IN= 3.6V

V_IN= 4.2V

V_IN= 5.0V

0.01

0.1

IOUT [mA ]

100 300

0.001

0.01

0.1

I_OUT[mA ]

100 300

图 10. Efficiency vs Output Current, V_OUT= 1.8V

图 11. Output Voltage vs Output Current, V_OUT= 1.8V

V_IN= 3V

R_Load= 100Ω

V_OUT= 1.25V

V_IN= 3V

I_OUT= 150mA

V_OUT= 1.25V

图 12. Start-Up Timing

图 13. Typical PWM Mode Operation

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

V_IN= 3V

I_OUT= 25mA

V_OUT= 1.25V

V_IN= 3V

I_OUT= 1mA to 25mA to 1mA

Rise / Fall Time 1µs

V_OUT= 1.25V

图 14. Typical PFM Mode Operation

图 15. Load Transient PFM Mode

V_IN= 3V

I_OUT= 5mA to 150mA to 5mA

Rise / Fall Time 1µs

V_OUT= 1.25V

V_IN= 2.3V to 2.7V to 2.3V

Rise / Fall Time 10µs

I_OUT= 25mA

V_OUT= 1.25V

图 16. Load Transient PFM / PWM Mode

图 17. Line Transient PFM Mode

10 Power Supply Recommendations

The TPS6224X-Q1 device has no special requirements for its input power supply. The input power supply output

current must be rated according to the supply voltage, output voltage, and output current of the TPS6224X-Q1.

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

11 Layout

11.1 Layout Guidelines

As for all switching power supplies, the layout is an important step in the design. Proper function of the device

demands careful attention to PCB layout. To get the specified performance, the board layout must be carefully

done. If not carefully done, the regulator could show poor line or load regulation, and additional stability issues as

well as EMI problems. 图 18 shows an example of layout design with the TLV62242-Q1 device.

•

Providing a low-inductance, low-impedance ground path is critical. Therefore, use wide and short traces for

the main current paths. The input capacitor as well as the inductor and output capacitor must be placed as

close as possible to the IC pins.

•

The FB line must be connected directly to the output capacitor and the FB line must be routed away from

noisy components and traces (for example, the SW line).

Because of the small package of this converter and the overall small solution size, the thermal performance of

the PCB layout is important. For good thermal performance, PCB design of at least four layers is

recommended.

11.2 Layout Example

VIN

GND

VOUT

图 18. Suggested Layout for Fixed Output Voltage

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

12 器件和文档支持

12.1 第三方产品免责声明

TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类

产品或服务单独或与任何 TI 产品或服务一起的表示或认可。

12.2 接收文档更新通知

要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。请单击右上角的提醒我进行注册，即可每周接收

产品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。

12.3 社区资源

下列链接提供到 TI 社区资源的连接。链接的内容由各个分销商“按照原样”提供。这些内容并不构成 TI 技术规范，

并且不一定反映 TI 的观点；请参阅 TI 的《使用条款》。

TI E2E™ 在线社区 TI 的工程师对工程师 (E2E) 社区。此社区的创建目的在于促进工程师之间的协作。在

e2e.ti.com 中，您可以咨询问题、分享知识、拓展思路并与同行工程师一道帮助解决问题。

设计支持

TI 参考设计支持可帮助您快速查找有帮助的 E2E 论坛、设计支持工具以及技术支持的联系信息。

12.4 商标

E2E is a trademark of Texas Instruments.

12.5 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 机械、封装和可订购信息

以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，也

不会对此文档进行修订。如欲获取此数据表的浏览器版本，请参阅左侧的导航。

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

13.1 Package Option Addendum

13.1.1 Packaging Information

Package

Type

Package

Drawing

Package

Qty

Lead/Ball

Finish⁽³⁾

(1)

(2)

(4)

Orderable Device

TPS62243QDDCRQ1

TPS62244QDDCRQ1

Status

Pins

Eco Plan

MSL Peak Temp

Op Temp (°C)

Device Marking⁽⁵⁾⁽⁶⁾

SOT-23-

THIN

Green (RoHS & no

Sb/Br)

PREVIEW

DDC

3000

CU NIPDAU

Level-1-260C-UNLIM

–40 to 115

1I3Z

1I2Z

SOT-23-

THIN

Green (RoHS & no

Sb/Br)

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

space

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest

availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the

requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified

lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used

between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by

weight in homogeneous material)

space

(3) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the

finish value exceeds the maximum column width.

space

(4) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

space

(5) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device

space

(6) Multiple Device markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a

continuation of the previous line and the two combined represent the entire Device Marking for that device.

Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief

on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third

parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for

release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TPS62243-Q1, TPS62244-Q1

ZHCSHS4 –MARCH 2018

www.ti.com.cn

13.1.2 Tape and Reel Information

REEL DIMENSIONS

TAPE DIMENSIONS

Reel

Diameter

Cavity

A0 Dimension designed to accommodate the component width

B0 Dimension designed to accommodate the component length

K0 Dimension designed to accommodate the component thickness

Overall width of the carrier tape

P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2

Q3 Q4

Q1 Q2

Q3 Q4

User Direction of Feed

Pocket Quadrants

Reel

Diameter

(mm)

Reel

Width W1

(mm)

Package

Type

Package

Drawing

(mm)

Pin1

Quadrant

Device

Pins

SPQ

SOT-23-

THIN

TPS62243QDDCRQ1

TPS62244QDDCRQ1

DDC

3000

179.0

8.4

3.2

1.4

4.0

8.0

SOT-23-

THIN

TPS62243-Q1, TPS62244-Q1

www.ti.com.cn

ZHCSHS4 –MARCH 2018

TAPE AND REEL BOX DIMENSIONS

Width (mm)

Device

Package Type

Package Drawing Pins

SPQ

3000

Length (mm) Width (mm)

Height (mm)

35.0

TPS62243QDDCRQ1

TPS62244QDDCRQ1

SOT-23-THIN

DDC

203.0

2.3.0

35.0

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TPS62243QDDCRQ1

TPS62244QDDCRQ1

ACTIVE SOT-23-THIN

DDC

3000 RoHS & Green

NIPDAU

Level-2-260C-1 YEAR

-40 to 125

1I3Z

1I2Z

NIPDAU

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

Addendum-Page 2

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Dec-2020

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TPS62243QDDCRQ1

TPS62244QDDCRQ1

SOT-

23-THIN

DDC

3000

180.0

8.4

3.2

1.4

4.0

8.0

SOT-

180.0

8.4

3.2

1.4

4.0

8.0

23-THIN

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

26-Dec-2020

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

TPS62243QDDCRQ1

TPS62244QDDCRQ1

SOT-23-THIN

DDC

3000

213.0

191.0

35.0

Pack Materials-Page 2

PACKAGE OUTLINE

DDC0005A

SOT-23 - 1.1 max height

SMALL OUTLINE TRANSISTOR

3.05

2.55

1.1

0.7

1.75

1.45

0.1 C

PIN 1

INDEX AREA

NOTE 4

(0.15)

0.95

3.05

2.75

1.9

(0.2)

0.1

TYP

0.0

0.5

0.3

0.2

C A B

0.25

GAGE PLANE

0.20

0.12

TYP

0 -8 TYP

SEATING PLANE

0.6

0.3

TYP

4220752/A 03/2023

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. Reference JEDEC MO-193.

4. Support pin may differ or may not be present.

www.ti.com

EXAMPLE BOARD LAYOUT

DDC0005A

SOT-23 - 1.1 max height

SMALL OUTLINE TRANSISTOR

SYMM

5X (1.1)

5X (0.6)

SYMM

4X (0.95)

(R0.05) TYP

(2.7)

LAND PATTERN EXAMPLE

EXPLOSED METAL SHOWN

SCALE:15X

METAL UNDER

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL

EXPOSED METAL

0.07 MIN

ARROUND

0.07 MAX

ARROUND

NON SOLDER MASK

DEFINED

SOLDER MASK

DEFINED

SOLDERMASK DETAILS

4220752/A 03/2023

NOTES: (continued)

4. Publication IPC-7351 may have alternate designs.

5. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

DDC0005A

SOT-23 - 1.1 max height

SMALL OUTLINE TRANSISTOR

SYMM

5X (1.1)

5X (0.6)

SYMM

4X(0.95)

(R0.05) TYP

(2.7)

SOLDER PASTE EXAMPLE

BASED ON 0.125 THICK STENCIL

SCALE:15X

4220752/A 03/2023

NOTES: (continued)

6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

7. Board assembly site may have different recommendations for stencil design.

www.ti.com

重要声明和免责声明

TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，

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这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验

证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。

这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。

您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成

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TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改

TI 针对 TI 产品发布的适用的担保或担保免责声明。

TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE

邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS62244QDDCRQ1 [TI]

相关型号：

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TPS62250DRV

TPS62250DRVR

TPS62250DRVRG4

TPS62250DRVT

TPS62250DRVTG4

TPS62250_13

TPS62260

TPS62260-Q1

TPS62260DDC

TPS62260DDCR

TPS62260DDCRG4