TPS62806YKAT [TI]
1.75-V to 5.5-V input, 600-mA ultra-low IQ step-down converter in 0.7-mm x 1.05-mm WCSP | YKA | 6 | -40 to 125;
| 型号： | TPS62806YKAT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1.75-V to 5.5-V input, 600-mA ultra-low IQ step-down converter in 0.7-mm x 1.05-mm WCSP | YKA | 6 | -40 to 125 开关 |
| 文件： | 总38页 (文件大小：5285K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
TPS6280x 1.75-V to 5.5-V, 0.6-A/1-A, 2.3-µA IQ Step Down Converter
6-Pin, 0.35-mm Pitch WCSP Package
1 Features
3 Description
•
•
•
•
•
•
•
•
1.75-V to 5.5-V input voltage range
2.3-µA operating quiescent current
Up to 4-MHz switching frequency
0.6-A or 1-A output current
1% output voltage accuracy
Selectable power save and forced PWM mode
R2D converter for flexible VOUT setting
16 selectable and one fixed output voltages
– TPS62800 (4 MHz): 0.4 V to 0.775 V
– TPS62801 (4 MHz): 0.8 V to 1.55 V
– TPS62802 (4 MHz): 1.8 V to 3.3 V
– TPS62806 (1.5 MHz): 0.4 V to 0.775 V
– TPS62807 (1.5 MHz): 0.8 V to 1.55 V
– TPS62808 (1.5 MHz): 1.8 V to 3.3 V
Smart enable pin
The TPS6280x device family is a step-down converter
with 2.3-µA typical quiescent current featuring the
highest efficiency and smallest solution size. TI's
DCS-Control™ topology enables the device to operate
with tiny inductors and capacitors with a switching
frequency up to 4 MHz. At light load conditions, the
device seamlessly enters power save mode to reduce
switching cycles and maintain high efficiency.
Connecting the VSEL/MODE pin to GND selects a
fixed output voltage. With only one external resistor
connected to VSEL/MODE pin, 16 internally set
output voltages can be selected. An integrated R2D
(resistor-to-digital) converter reads out the external
resistor and sets the output voltage. The same device
part number can be used for different applications
and voltage rails just by changing a single resistor.
Furthermore, the internally set output voltage provides
better accuracy compared to a traditional external
resistor divider network. Once the device has started
up, the DC/DC converter enters forced PWM mode by
applying a high level at the VSEL/MODE pin. In this
operating mode, the device runs at a typical 4-MHz or
1.5-MHz switching frequency, enabling lowest output
voltage ripple and highest efficiency. The TPS6280x
device series comes in a tiny 6-pin WCSP package
with 0.35-mm pitch.
•
•
•
•
•
•
•
•
•
Optimized pinout to support 0201 components
DCS-Control topology
Output discharge
100% duty cycle operation
Tiny 6-pin, 0.35-mm pitch WCSP package
Supports < 0.6-mm solution height
Supports < 5-mm2 solution size
Create a custom design using the:
– TPS62800 WEBENCH® Power Designer
– TPS62801 WEBENCH® Power Designer
– TPS62802 WEBENCH® Power Designer
– TPS62806 WEBENCH® Power Designer
– TPS62807 WEBENCH® Power Designer
– TPS62808 WEBENCH® Power Designer
Device Information
Part Number
TPS62800
TPS62801
TPS62802
TPS62806
TPS62807
Package(1)
Body Size (NOM)
2 Applications
1.05 mm × 0.70 mm ×
0.4 mm
•
•
•
Wearable electronics, IoT applications
2× AA battery-powered applications
Smartphones
DSBGA (6)
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
TPS62801
95
90
85
80
75
70
65
16 selectable VOUT
VIN
L = 0.47 µH
1.75V – 5.5V
0.8 V – 1.55 V
VIN
SW
COUT
CIN
4.7
10
F
GND
VOS
F
PWM
ON
OFF
VSEL/
MODE
PFM
EN
RVSEL
TPS62801
VIN
1.75 V–5.5 V
1.2-V VOUT fixed
COUT
60
55
50
45
40
L = 0.47 µH
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN
SW
CIN
4.7
10
F
GND
VOS
F
ON
OFF
VSEL/
MODE
EN
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
SLVS
Typical Application
Efficiency Versus IOUT at 1.2 VOUT
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS62800, TPS62801, TPS62802, TPS62806, TPS62807, TPS62808
SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
www.ti.com
Table of Contents
1 Features............................................................................1
2 Applications.....................................................................1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Device Comparison Table...............................................3
6 Pin Configuration and Functions...................................3
7 Specifications.................................................................. 5
7.1 Absolute Maximum Ratings........................................ 5
7.2 ESD Ratings............................................................... 5
7.3 Recommended Operating Conditions.........................5
7.4 Thermal Information....................................................6
7.5 Electrical Characteristics.............................................6
7.6 Typical Characteristics................................................8
8 Detailed Description......................................................10
8.1 Overview...................................................................10
8.2 Functional Block Diagram.........................................10
8.3 Feature Description...................................................10
8.4 Device Functional Modes..........................................13
9 Application and Implementation..................................15
9.1 Application Information............................................. 15
9.2 Typical Application.................................................... 15
9.3 System Examples..................................................... 26
10 Power Supply Recommendations..............................28
11 Layout...........................................................................28
11.1 Layout Guidelines................................................... 28
11.2 Layout Example...................................................... 28
12 Device and Documentation Support..........................29
12.1 Device Support....................................................... 29
12.2 Receiving Notification of Documentation Updates..29
12.3 Support Resources................................................. 29
12.4 Trademarks.............................................................29
12.5 Electrostatic Discharge Caution..............................30
12.6 Glossary..................................................................30
13 Mechanical, Packaging, and Orderable
Information.................................................................... 30
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision E (July 2018) to Revision F (June 2022)
Page
•
•
•
Updated the numbering format for tables, figures, and cross-references throughout the document. ................1
Updated the minimum input voltage to 1.75 V....................................................................................................1
Updated max rising UVLO spec......................................................................................................................... 6
Changes from Revision D (July 2018) to Revision E (January 2019)
Page
•
Added devices TPS62807 and TPS62808 throughout data sheet..................................................................... 1
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
5 Device Comparison Table
Selectable
Function
Device
Output
Voltages
with RVSEL
fSW
[MHz]
IOUT
[A]
Soft
Start, tSS
Output
Discharge
Fixed VOUT
VSEL/MODE
0.4 V–0.775 V
in 25-mV steps
TPS62800
TPS62801
TPS62802
TPS62806
TPS62807
TPS62808
VSEL + MODE
VSEL + MODE
VSEL + MODE
VSEL + MODE
VSEL + MODE
VSEL + MODE
0.7 V (VSEL / MODE = GND)
1.20 V (VSEL / MODE = GND)
1.8 V (VSEL / MODE = GND)
0.7 V (VSEL / MODE = GND)
1.20 V (VSEL / MODE = GND)
1.8 V (VSEL / MODE = GND)
4
4
1
1
125 µs
125 µs
400 µs
125 µs
125 µs
125 µs
Yes
Yes
Yes
Yes
Yes
Yes
0.8 V–1.55 V
in 50-mV steps
1.8 V–3.3 V
in 100-mV steps
4
1
0.4 V–0.775 V
in 25-mV steps
1.5
1.5
1.5
0.6
0.6
0.6
0.8 V–1.55 V
in 50-mV steps
1.8 V–3.3 V
in 100-mV steps
6 Pin Configuration and Functions
1
2
GND
VOS
A
B
C
VIN
SW
VSEL/MODE
EN
Not to scale
Figure 6-1. 6-Pin DSBGA YKA Package (Top View)
Table 6-1. Pin Functions
Pin
I/O
Description
Name
NO.
GND supply pin. Connect this pin close to the GND terminal of the input and output
capacitor.
GND
A1
PWR
PWR
VIN power supply pin. Connect the input capacitor close to this pin for best noise and voltage
spike suppression. A ceramic capacitor is required.
VIN
B1
C1
Connecting a resistor to GND selects a pre-defined output voltage. Once the device has
started up, the R2D converter is disabled and the pin operates as an input. Applying a high
level selects forced PWM mode operation and a low level power save mode operation.
VSEL/MODE
VOS
IN
IN
Output voltage sense pin for the internal feedback divider network and regulation loop. This
pin also discharges VOUT by an internal MOSFET when the converter is disabled. Connect
this pin directly to the output capacitor with a short trace.
A2
The switch pin is connected to the internal MOSFET switches. Connect the inductor to this
terminal.
SW
EN
B2
C2
OUT
IN
A high level enables the devices, and a low level turns the device off. The pin features an
internal pulldown resistor, which is disabled once the device has started up.
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
www.ti.com
Table 6-2. Output Voltage Setting (VSEL/MODE Pin)
Output Voltage Setting VOUT [V]
RVSELResistance [kΩ], E96 Resistor Series,
VSEL
1% Accuracy, Temperature Coefficient Better or Equal
than ±200 ppm/°C
TPS62800
TPS62806
TPS62801
TPS62807
TPS62802
TPS62808
0
1
0.700
0.400
0.425
0.450
0.475
0.500
0.525
0.550
0.575
0.600
0.625
0.650
0.675
0.700
0.725
0.750
0.775
1.2
0.8
1.8
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
Connected to GND (no resistor needed)
10.0
12.1
2
0.85
0.9
3
15.4
4
0.95
1.0
18.7
5
23.7
6
1.05
1.1
28.7
7
36.5
8
1.15
1.2
44.2
9
56.2
10
11
12
13
14
15
16
1.25
1.3
68.1
86.6
1.35
1.4
105.0
133.0
162.0
205.0
249.0 or larger
1.45
1.5
1.55
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
7 Specifications
7.1 Absolute Maximum Ratings
MIN(1)
–0.3
–0.3
–2.5
–0.3
–0.3
–40
MAX(1)
UNIT
V
VIN
SW
6
VIN + 0.3 V
V
Pin voltage(2)
SW (AC), less than 10 ns while switching
9
6
V
EN, VSEL/MODE
VOS
V
5
V
Operating junction temperature, TJ
Storage temperature, Tstg
150
150
°C
°C
–65
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.
7.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)
Electrostatic
discharge
V(ESD)
V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body
model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
MIN
NOM
MAX
5.5
1
UNIT
V
VIN
Supply voltage, VIN
1.75
IOUT
IOUT
IOUT
L
Output current, VIN ≥ 2.3 V, TPS62800, TPS62801, TPS62802
Output current, VIN < 2.3 V, TPS62800, TPS62801, TPS62802
Output current, TPS62806, TPS62807, TPS62808
Effective inductance, TPS62800, TPS62801, TPS62802
Effective output capacitance, TPS62800, TPS62801, TPS62802
Effective inductance, TPS62806, TPS62807, TPS62808
Effective output capacitance, TPS62806, TPS62807, TPS62808
Effective input capacitance
A
0.7
0.6
0.82
26
A
A
0.33
2
0.47
1.0
µH
µF
µH
µF
µF
pF
COUT
L
0.7
3
1.2
26
COUT
CIN
0.5
4.7
CVSEL/MODE
External parasitic capacitance at the VSEL/MODE pin
30
Resistance range for external resistor at VSEL/MODE pin (E96 1%
resistor values)
10
249
kΩ
RVSEL
External resistor tolerance E96 series at VSEL/MODE pin
E96 resistor series temperature coefficient (TCR)
Operating junction temperature range
1%
+200
125
–200
–40
ppm/°C
°C
TJ
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UNIT
SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
7.4 Thermal Information
YKA (DSBGA)
THERMAL METRIC(1)
6 PINS
147.7
1.7
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
47.5
0.5
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
47.6
—
RθJC(bot)
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Electrical Characteristics
VIN = 3.6 V, TJ = –40°C to 125°C typical values are at TJ = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
EN = VIN, IOUT = 0 µA, VOUT = 1.2 V,
device not switching, TJ = –40°C to +85°C
2.3
2.5
8
4
µA
µA
Operating quiescent current
(power save mode)
IQ
EN = VIN, IOUT = 0 µA, VOUT = 1.2 V, device switching
Operating quiescent current EN = VIN, VSEL/MODE = VIN (after power up),
mA
(PWM mode)
device switching, IOUT = 0 mA, VOUT = 1.2 V
EN = GND, shutdown current into VIN
VSEL/MODE = GND, TJ = –40°C to +85°C
,
ISD
Shutdown current
120
250
nA
VTH_ UVLO+
VTH_UVLO–
INPUT EN
VIH TH
Rising VIN
Falling VIN
1.65
1.56
1.75
1.7
V
V
Undervoltage lockout
threshold
High level input voltage
Low level input voltage
Input bias current
0.8
0.8
V
V
VIL TH
0.4
25
IIN
TJ = –40°C to +85°C, EN = high
10
nA
kΩ
RPD
Internal pulldown resistance EN = low
500
INPUT VSEL/MODE
High level input voltage
(digital input)
VIH TH
V
Low level input voltage
(digital input)
VIL TH
IIN
0.4
25
V
Input bias current
EN = high
10
nA
POWER
SWITCHES
Leakage current into the SW
pin
ILKG_SW
VSW = 1.2 V, TJ = –40°C to +85°C
IOUT = 500 mA
10
120
80
25
170
115
1.2
nA
mΩ
mΩ
A
High side MOSFET
on-resistance
RDS(ON)
Low side MOSFET
on-resistance
IOUT = 500 mA
High-side MOSFET switch
current limit
ILIMF
ILIMF
TPS62806, TPS62807, TPS62808
TPS62806, TPS62807, TPS62808
0.95
0.85
1.1
1
Low-side MOSFET switch
current limit
1.1
A
TPS62800, TPS62801
TPS62802
1.3
1.4
1.2
1.3
1.45
1.55
1.35
1.45
1.55
1.65
1.45
1.55
A
A
A
A
High-side MOSFET switch
current limit
ILIMF
TPS62800, TPS62801
TPS62802
Low-side MOSFET switch
current limit
ILIMF
OUTPUT VOLTAGE DISCHARGE
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
VIN = 3.6 V, TJ = –40°C to 125°C typical values are at TJ = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
EN = GND, IVOS = –10 mA into the VOS pin
TJ = –40°C to +85°C
RDSCH_VOS
IIN_VOS
MOSFET on-resistance
7
11
Ω
Bias current into the VOS
pin
EN = VIN, VOUT = 1.2 V (internal 12-MΩ resistor
divider), TJ = –40°C to +85°C
100
400
nA
THERMAL PROTECTION
Thermal shutdown
temperature
Rising junction temperature, PWM mode
160
20
°C
°C
TSD
Thermal shutdown
hysteresis
OUTPUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
fSW
Output voltage range
Output voltage range
Output voltage range
Output voltage accuracy
Output voltage accuracy
Output voltage accuracy
Switching frequency
TPS62800, TPS62806, 25-mV steps
TPS62801, TPS62807, 50-mV steps
TPS62802, TPS62808, 100-mV steps
Power save mode
0.4
0.8
1.8
0.775
1.55
3.3
V
V
V
0%
0%
0%
4
PWM mode, IOUT = 0 mA, TJ = 25°C to +85°C
PWM mode, IOUT = 0 mA, TJ = –40°C to +125°C
VIN = 3.6 V, VOUT = 1.2 V, PWM operation
–1%
–2%
1%
1.7%
MHz
MHz
TPS62806
VIN = 3.6 V, VOUT = 0.7 V, PWM operation
fSW
Switching frequency
Switching frequency
Switching frequency
1.5
1.5
TPS62807
VIN = 3.6 V, VOUT = 1.2 V, PWM operation
fSW
MHz
MHz
µs
TPS62808
VIN = 3.6 V, VOUT = 1.8 V, PWM operation
fSW
1.5
Regulator start-up delay
time
From transition EN = low to high until device starts
switching, VSEL = 16
tStartup_delay
500
125
125
400
1100
170
210
500
TPS62801, from VOUT = 0 V to 0.95% of VOUT
nominal
tSS
tSS
tSS
Soft-start time
Soft-start time
Soft-start time
µs
TPS62800, TPS62806, TPS62807, TPS62808
from VOUT = 0 V to 0.95% of VOUT nominal
µs
TPS62802, from VOUT = 0 V to 0.95% of VOUT
nominal
µs
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7.6 Typical Characteristics
0.5
5
4.5
4
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
0.45
0.4
0.35
0.3
3.5
3
0.25
0.2
2.5
2
0.15
0.1
1.5
1
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
0.05
0
0.5
0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
EN = GND
Device not switching
Figure 7-1. Shutdown Current, ISD
Figure 7-2. Quiescent Current, IQ
14
13
12
11
10
9
1000
100
10
TJ = -40°C
TJ = 25°C
TJ = 85°C
TJ = -40°C
TJ = 25°C
TJ = 85°C
8
7
6
5
4
1
3
2
1
0
0.1
0
0.5
1
1.5
2
2.5 3
VIN [V]
3.5
4
4.5
5
5.5
0
0.5
1
1.5
2
2.5 3
VIN [V]
3.5
4
4.5
5
5.5
VIN falling
EN = VIN
Device switching, no load, VOUT = 1.2 V
VSEL/MODE = GND
VIN rising
EN = VIN
Device switching, no load, VOUT = 1.2 V
VSEL/MODE = GND
Figure 7-3. Operating Quiescent Current, IQ
Figure 7-4. Operating Quiescent Current, IQ
350
200
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
TJ = -40°C
325
300
275
250
225
200
175
150
125
100
75
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
175
150
125
100
75
50
50
25
25
0
0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
Figure 7-5. High-Side Switch Drain Source
Resistance, RDS(ON)
Figure 7-6. Low-Side Switch Drain Source
Resistance, RDS(ON)
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20
18
16
14
12
10
8
TJ = -40°C
TJ = -10°C
TJ = 30°C
TJ = 85°C
TJ = 125°C
6
4
2
0
1.5
2
2.5
3
3.5
VIN [V]
4
4.5
5
5.5
Figure 7-7. VOS Discharge Switch Drain Source Resistance, RDSCH_VOS
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8 Detailed Description
8.1 Overview
The TPS6280x is a high frequency synchronous step-down converter with ultra-low quiescent current
consumption. Using TI's DCS-Control topology, the device extends the high efficiency operation area down
to microamperes of load current during power save mode operation. TI's DCS-Control (Direct Control with
Seamless Transition into power save mode) is an advanced regulation topology, which combines the advantages
of hysteretic and voltage mode control. Characteristics of DCS-Control are excellent AC load regulation and
transient response, low output ripple voltage, and a seamless transition between PFM and PWM mode
operation. DCS-Control includes an AC loop, which senses the output voltage (VOS pin) and directly feeds
the information to a fast comparator stage. This comparator sets the switching frequency, which is constant
for steady state operating conditions, and provides immediate response to dynamic load changes. In order to
achieve accurate DC load regulation, a voltage feedback loop is used. The internally compensated regulation
network achieves fast and stable operation with small external components and low-ESR capacitors.
8.2 Functional Block Diagram
EN
Smart Enable
Ultra Low Power
0.4V VREF
UVLO
Pulldown Control
Input Buffer
500kW
VOS
Thermal Shutdown
Control Logic
VOS
R2D converter
UVLO
VOUT
Discharge
VSEL/
MODE
Internal
VFB feedback
divider
EN
Resistor to
Digital
Converter
network
Power Stage
Current
Limit Comparator
VIN
SW
Power Save /
Forced PWM
Mode operation
Limit
High Side
PMOS
VIN
TON
Timer
DCS Control
VOS
Ramp
VOS
Gate Driver
Direct Control
Startup Delay
VFB
VREF
NMOS
Softstart Timing
Limit
Low Side
Error
amplifier
Main
Comparator
GND
Current
Limit Comparator
Figure 8-1. Functional Block Diagram
8.3 Feature Description
8.3.1 Smart Enable and Shutdown (EN)
An internal 500-kΩ resistor pulls the EN pin to GND and avoids the pin to be floating, which prevents an
uncontrolled start-up of the device in case the EN pin cannot be driven to low level safely. With EN low, the
device is in shutdown mode. The device is turned on with EN set to a high level. The pulldown control circuit
disconnects the pulldown resistor on the EN pin once the internal control logic and the reference have been
powered up. With EN set to a low level, the device enters shutdown mode and the pulldown resistor is activated
again.
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8.3.2 Soft Start
Once the device has been enabled with EN high, it initializes and powers up its internal circuits, which occurs
during the regulator start-up delay time, tStartup_delay. Once tStartup_delay expires, the internal soft-start circuitry
ramps up the output voltage within the soft-start time, tss. See Figure 8-2.
The start-up delay time, tStartup_delay, varies depending on the selected VSEL value. tStartup_delay is shortest with
VSEL = 0 and longest with VSEL = 16. See Figure 9-42 to Figure 9-46.
EN
Device starts switching
and ramps VOUT
VOUT
tStartup_delay
tSS
Figure 8-2. Device Start-Up
8.3.3 VSEL/MODE Pin
This pin has two functions: output voltage selection during start-up of the converter and operating mode
selection. See Section 5.
8.3.3.1 Output Voltage Selection (R2D Converter)
The output voltage is set with a single external resistor connected between the VSEL/MODE pin and GND. Once
the device has been enabled and the control logic as well as the internal reference have been powered up, a
R2D (resistor-to-digital) conversion is started to detect the external resistor RVSEL within the regulator start-up
delay time, tStartup_delay. An internal current source applies current through the external resistor and an internal
ADC reads back the resulting voltage level. Depending on the level, an internal feedback divider network is
selected to set the correct output voltage. Once this R2D conversion is finished, the current source is turned off
to avoid current flow through the external resistor.
After power up, the pin is configured as an input for mode selection. Therefore, the output voltage is set only
once. If the mode selection function is used in combination with the VSEL function, ensure that there is no
additional current path or capacitance greater than 30 pF total to GND during R2D conversion. Otherwise, the
additional current to GND is interpreted as a lower resistor value and a false output voltage is set. Table 6-2
lists the correct resistor values for RVSEL to set the appropriate output voltages. The R2D converter is designed
to operate with resistor values out of the E96 table and requires 1% resistor value accuracy. The external
resistor, RVSEL, is not a part of the regulator feedback loop and has therefore no impact on the output voltage
accuracy. Ensure that there is no other leakage path than the RVSEL resistor at the VSEL/MODE pin during an
undervoltage lockout event. Otherwise, a false output voltage will be set.
Connecting VSEL/MODE to GND selects a pre-defined output voltage.
•
•
•
•
•
•
TPS62800 = 0.7 V
TPS62801 = 1.2 V
TPS62802 = 1.8 V
TPS62806 = 0.7 V
TPS62807 = 1.2 V
TPS62808 = 1.8 V
In this case, no external resistor is needed, which enables a smaller solution size.
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8.3.3.2 Mode Selection — Power Save Mode and Forced PWM Operation
A low level at this pin selects power save mode operation, and a high level selects forced PWM operation. The
mode can be changed during operation after the device has been powered up. The mode selection function is
only available after the R2D converter has read out the external resistor.
8.3.4 Undervoltage Lockout (UVLO)
To avoid misoperation of the device at low input voltages, an undervoltage lockout (UVLO) comparator monitors
the supply voltage. The UVLO comparator shuts down the device at an input voltage of 1.7 V (maximum) with
falling VIN. The device starts at an input voltage of 1.75 V (maximum) rising VIN. Once the device re-enters
operation out of an undervoltage lockout condition, it behaves like being enabled. The internal control logic is
powered up and the external resistor at the VSEL/MODE pin is read out.
8.3.5 Switch Current Limit and Short Circuit Protection
The TPS6280x integrates a current limit on the high-side and low-side MOSFETs to protect the device against
overload or short circuit conditions. The current in the switches is monitored cycle by cycle. If the high-side
MOSFET current limit, ILIMF, trips, the high-side MOSFET is turned off and the low-side MOSFET is turned on
to ramp down the inductor current. Once the inductor current through the low-side switch decreases below the
low-side MOSFET current limit, ILIMF, the low-side MOSFET is turned off and the high-side MOSFET turns on
again.
8.3.6 Thermal Shutdown
The junction temperature (TJ) of the device is monitored by an internal temperature sensor. If TJ exceeds the
thermal shutdown temperature, TSD, of 160°C (typical), the device enters thermal shutdown. Both the high-side
and low-side power FETs are turned off. When TJ decreases below the hysteresis amount of typically 20°C, the
converter resumes operation, beginning with a soft start to the originally set VOUT (there is no R2D conversion of
RVSEL). The thermal shutdown is not active in power save mode.
8.3.7 Output Voltage Discharge
The purpose of the output discharge function is to ensure a defined down-ramp of the output voltage when the
device is disabled and to keep the output voltage close to 0 V. The output discharge feature is only active once
the device has been enabled at least once since the supply voltage was applied. The output discharge function
is not active if the device is disabled and the supply voltage is applied the first time.
The internal discharge resistor is connected to the VOS pin. The discharge function is enabled as soon as
the device is disabled. The minimum supply voltage required to keep the discharge function active is VIN
VTH_UVLO-
>
.
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8.4 Device Functional Modes
8.4.1 Power Save Mode Operation
The DCS-Control topology supports power save mode operation. At light loads, the device operates in PFM
(pulse frequency modulation) mode that generates a single switching pulse to ramp up the inductor current and
recharge the output capacitor, followed by a sleep period where most of the internal circuits are shut down
to achieve lowest operating quiescent current. During this time, the load current is supported by the output
capacitor. The duration of the sleep period depends on the load current and the inductor peak current. During the
sleep periods, the current consumption is reduced to typically 2.3 µA. This low quiescent current consumption is
achieved by an ultra-low power voltage reference, an integrated high impedance feedback divider network, and
an optimized power save mode operation.
In PFM mode, the switching frequency varies linearly with the load current. At medium and high load conditions,
the device automatically enters PWM (pulse width modulation) mode and operates in continuous conduction
mode with a nominal switch frequency, fsw, of typically 4 MHz or 1.5 MHz. The switching frequency in PWM
mode is controlled and depends on VIN and VOUT. The boundary between PWM and PFM mode is when the
inductor current becomes discontinuous.
If the load current decreases, the converter seamlessly enters PFM mode to maintain high efficiency down
to very light loads. Since DCS-Control supports both operation modes within one single building block, the
transition from PWM to PFM ,mode is seamless with minimum output voltage ripple.
8.4.2 Forced PWM Mode Operation
After the device has powered up and ramped up VOUT, the VSEL/MODE pin acts as an input. With a high level
on VSEL/MODE pin, the device enters forced PWM mode and operates with a constant switching frequency
over the entire load range, even at very light loads. This action reduces or eliminates interference with RF and
noise sensitive circuits, but lowers efficiency at light loads.
8.4.3 100% Mode Operation
The duty cycle of the buck converter operating in PWM mode is given as D = VOUT / VIN. The duty cycle
increases as the input voltage comes close to the output voltage. In 100% duty cycle mode, the device keeps the
high-side switch on continuously. The high-side switch stays turned on as long as the output voltage is below the
internal set point, which allows the conversion of small input to output voltage differences.
8.4.4 Optimized Transient Performance from PWM-to-PFM Mode Operation
For most converters, the load transient response in PWM mode is improved compared to PFM mode, since the
converter reacts faster on the load step and actively sinks energy on the load release. Compare Figure 9-33
to Figure 9-32. As an additional feature, the TPS6280x automatically enters PWM mode for 16 cycles after
a heavy load release to bring the output voltage back to the regulation level faster. After 16 cycles of PWM
mode, the device automatically returns to PFM mode (if VSEL/MODE is driven low). See Figure 8-3. Without this
optimization, the output voltage overshoot would be higher and would look like the VOUT' trace. This feature is
only active once the load is high enough and the converter operates in PWM mode.
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VOUT
‘
VOUT
16 PWM
Cycles
PWM
Mode
PFM Mode
Figure 8-3. Optimized Transient Performance from PWM-to-PFM Mode
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9 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.
9.1 Application Information
The following section discusses the design of the external components to complete the power supply design for
several input and output voltage options by using typical applications as a reference.
9.2 Typical Application
TPS62801
VIN
16 selectable VOUT
0.8 V–1.55 V
L = 0.47 µH
1.75 V–5.5 V
VIN
SW
COUT
CIN
4.7
10
F
F
GND
VOS
PWM
ON
OFF
VSEL/
MODE
PFM
RVSEL
EN
Figure 9-1. TPS62801 Adjustable VOUT Application Circuit
Additional circuits are shown in Section 9.3.
9.2.1 Design Requirements
Table 9-1 shows the list of components for the application circuit and the characteristic application curves
Table 9-1. Components for Application Characteristic Curves
Reference
Description
Value
Size [L × W × T]
Manufacturer(1)
TPS62801 / 2
Step down converter
1.05 mm × 0.70 mm × 0.4 mm maximum
Texas Instruments
Ceramic capacitor,
GRM155R60J475ME47D
0402 (1 mm × 0.5 mm × 0.6 mm
maximum)
CIN
COUT
L
4.7 µF
10 µF
Murata
Murata
Murata
Ceramic capacitor,
GRM155R60J106ME15D
0402 (1 mm × 0.5 mm × 0.65 mm
maximum)
0603 (1.6 mm × 0.8 mm × 1.0 mm
maximum)
Inductor DFE18SANR47MG0L
0.47 µH
(1) See the Third-party Products Disclaimer.
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9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62800 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62801 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62802 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62806 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62807 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62808 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
9.2.2.2 Inductor Selection
The inductor value affects the peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple, and the efficiency. The selected inductor has to be rated for its DC resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or VOUT and can be
estimated according to Equation 1.
Equation 2 calculates the maximum inductor current under static load conditions. The saturation current of
the inductor must be rated higher than the maximum inductor current, as calculated with Equation 2, which is
recommended because during a heavy load transient the inductor current rises above the calculated value. A
more conservative way is to select the inductor saturation current according to the high-side MOSFET switch
current limit, ILIMF
.
Vout
Vin
1-
DIL = Vout ´
L ´ ¦
(1)
(2)
DI
L
I
= I
+
Lmax
outmax
2
where
•
•
•
•
f = switching frequency
L = inductor value
ΔIL = peak-to-peak inductor ripple current
ILmax = maximum inductor current
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Table 9-2 shows a list of possible inductors.
Table 9-2. List of Possible Inductors
Size Imperial
(Metric)
Inductance [µH]
Inductor Series
Dimensions L × W × T
Supplier(1)
0.47
0.47
0.47
0.47
1.0
DFE18SAN_G0
HTEB16080F
HTET1005FE
TFM160808ALC
DFE201610E
0603 (1608)
0603 (1608)
0402 (1005)
0603 (1608)
0806 (201610)
1.6 mm × 0.8 mm × 1.0 mm maximum
1.6 mm × 0.8 mm × 0.6 mm maximum
1.0 mm × 0.5 mm × 0.65 mm maximum
1.6 mm × 0.8 mm × 0.8 mm maximum
2.0 mm × 1.6 mm × 1.0 mm maximum
Murata
Cyntec
Cyntec
TDK
Murata
(1) See the Third-party Products Disclaimer.
9.2.2.3 Output Capacitor Selection
The DCS-Control scheme of the TPS6280x allows the use of tiny ceramic capacitors. Ceramic capacitors with
low-ESR values have the lowest output voltage ripple and are recommended. The output capacitor requires
either an X7R or X5R dielectric. At light load currents, the converter operates in power save mode and the output
voltage ripple is dependent on the output capacitor value. A larger output capacitors can be used reducing the
output voltage ripple.
The inductor and output capacitor together provide a low-pass filter. To simplify this process, Table 9-3 outlines
possible inductor and capacitor value combinations.
Table 9-3. Recommended LC Output Filter Combinations
Nominal Output Capacitor Value [µF]
Device
Nominal Inductor Value [µH]
4.7 µF
10 µF
2 × 10 µF
22 µF
TPS62800,
TPS62801
0.47(1)
0.47(1)
√
√
√
√
√
√
(3)
(3)
TPS62802
√
TPS62806,
TPS62807,
TPS62808
1.0(2)
√
√
√
√
(3)
(1) An effective inductance range of 0.33 µH to 0.82 µH is recommended. An effective capacitance range of 2 µF to 26 µF is
recommended.
(2) An effective inductance range of 0.7 µH to 1.2 µH is recommended. An effective capacitance range of 3 µF to 26 µF is recommended.
(3) Typical application configuration. Other check marks indicate alternative filter combinations.
9.2.2.4 Input Capacitor Selection
Because the buck converter has a pulsating input current, a low-ESR ceramic input capacitor is required for
best input voltage filtering to minimize input voltage spikes. For most applications, a 4.7-µF input capacitor is
sufficient. When operating from a high impedance source, like a coin cell, a larger input buffer capacitor ≥ 10 μF
is recommended to avoid voltage drops during start-up and load transients. The input capacitor can be increased
without any limit for better input voltage filtering. The leakage current of the input capacitor adds to the overall
current consumption.
Table 9-4 shows a selection of input and output capacitors.
Table 9-4. List of Possible Capacitors
Size Imperial
Capacitance [μF]
Capacitor Part Number
GRM155R60J475ME47D
GRM035R60J475ME15
GRM155R60J106ME15D
Dimensions L × W × T
Supplier(1)
Murata
(Metric)
1.0 mm × 0.5 mm × 0.6 mm
maximum
4.7
4.7
10
0402 (1005)
0.6 mm × 0.3 mm × 0.55 mm
maximum
0201 (0603)
0402 (1005)
Murata
1.0 mm × 0.5 mm × 0.65 mm
maximum
Murata
(1) See the Third-party Products Disclaimer.
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9.2.3 Application Curves
The conditions for the below application curves are VIN = 3.6 V, VOUT = 1.2 V, and the components listed in Table
9-1, unless otherwise noted.
85
80
75
70
65
60
55
50
45
40
35
30
25
20
85
80
75
70
65
60
55
50
45
40
35
30
25
20
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0.01
0.1
1
10
IOUT [mA ]
100
1000
0.01
0.1
1
10
IOUT [mA ]
100
1000
SLVS
SLVS
TPS62800
RVSEL = 10 kΩ to GND
TPS62800
VSEL/MODE = GND
Figure 9-2. Efficiency Power Save Mode
VOUT = 0.4 V
Figure 9-3. Efficiency Power Save Mode
VOUT = 0.7 V
95
90
85
80
75
70
65
60
95
90
85
80
75
70
65
60
VIN = 1.8V
VIN = 2.6V
VIN = 2.3V
VIN = 2.7V
55
55
50
45
40
50
45
40
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 3.7V
VIN = 4.2V
VIN = 5.0V
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
0.001
0.01
0.1
1
IOUT [mA]
10
100
1000
SLVS
SLVS
TPS62801
RVSEL = 10 kΩ to GND
TPS62801
RVSEL = 15.4 kΩ to GND
Figure 9-4. Efficiency Power Save Mode
VOUT = 0.8 V
Figure 9-5. Efficiency Power Save Mode
VOUT = 0.9 V
95
90
85
80
75
70
65
90
80
70
60
50
40
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
60
55
50
45
40
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
30
20
10
0
1
10
100
1000
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
IOUT [mA ]
SLVS
SLVS
TPS62801
RVSEL = 56.2 kΩ
TPS62801
VSEL/MODE = GND
VSEL/MODE pin = high after start-up
Figure 9-7. Efficiency Power Save Mode
VOUT = 1.2 V
Figure 9-6. Efficiency Forced PWM Mode
VOUT = 1.2 V
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90
100
95
90
85
80
75
70
65
85
80
75
70
65
60
55
50
45
40
DFE18SAN_G0 R47 (1.6 x 1.6 x 1.0 mm)
HTEB16080F R47 (1.6 x 1.6 x 0.6 mm)
HTET1005FE R47 (1.0 x 0.5 x 0.65 mm)
TFM160808ALC R47 (1.6 x 1.6 x 0.8 mm)
60
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
55
50
45
40
0.01
0.1
1
10
100
1000
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
IOUT [mA ]
SLPVloSt
SLVS
TPS62801
VSEL/MODE = GND, VOUT = 1.2 V
TPS62802
VSEL/MODE = GND
Figure 9-8. Inductor Comparison
Figure 9-9. Efficiency Power Save Mode
VOUT = 1.8 V
95
90
85
80
75
70
65
100
95
90
85
80
75
70
65
60
55
50
45
40
60
55
50
45
40
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.8V
VIN = 4.5V
VIN = 5.0V
VIN = 3.6V
VIN = 3.8V
VIN = 4.2V
VIN = 5.0V
0.01
0.1
1
10
100
600
IOUT [mA ]
SLVS
0.001
0.01
0.1
1
IOUT [mA ]
10
100
1000
TPS62806
VOUT = 0.7 V, VSEL/MODE = GND
L = 1-µH DFE201610E
SLVS
TPS62802
3.3 V VOUT, VSEL/MODE = 249 k
Figure 9-11. Efficiency Power Save Mode
VOUT = 0.7 V
Figure 9-10. Efficiency Power Save Mode
VOUT = 3.3 V
100
100
95
90
85
80
75
70
65
60
55
50
45
40
95
90
85
80
75
70
65
60
55
50
45
40
VIN=1.8V
VIN=2.7V
VIN=3.3V
VIN=3.6V
VIN=4.2V
VIN=4.8V
VIN=2.1V
VIN=2.7V
VIN=3.3V
VIN=3.6V
VIN=4.2V
VIN=4.8V
10m
100m
1m 10m
Load Current [A]
100m
1
10m
100m
1m 10m
Load Current [A]
100m
1
Effi
Effi
TPS62807
VOUT = 1.2 V, VSEL/MODE = GND
L = 1-µH DFE201610E
TPS62808
VOUT = 1.8 V, VSEL/MODE = GND
L = 1-µH DFE201610E
Figure 9-12. Efficiency Power Save Mode
VOUT = 1.2 V
Figure 9-13. Efficiency Power Save Mode
VOUT = 1.8 V
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1.248
1.248
1.236
1.224
1.212
1.200
1.188
1.176
1.164
TJ = 25°C
TJ = -40°C
1.236
1.224
1.212
1.200
1.188
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1.176
1.164
0.01
0.1
1
10
IOUT [mA ]
100
1000
0.01
0.1
1
10
IOUT [mA ]
100
1000
SLVS
SLVS
TPS62801
VSEL/MODE = GND
PFM/PWM mode TJ = 25°C
TPS62801
VSEL/MODE = GND
PFM/PWM mode TJ = –40°C
VOUT = 1.2 V
VOUT = 1.2 V
Figure 9-14. Output Voltage vs Output Current
Figure 9-15. Output Voltage vs Output Current
1.248
1.212
TJ = 85°C
TJ = 25°C
1.236
1.224
1.212
1.200
1.188
1.200
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1.176
1.164
1.188
0.01
0.01
0.1
1
10
IOUT [mA ]
100
1000
0.1
1
10
IOUT [mA ]
100
1000
SLVS
SLVS
TPS62801
VSEL/MODE = GND
PFM/PWM mode TJ = 85°C
TPS62801
VSEL/MODE = high after start-up
Forced PWM mode TJ = 25°C
VOUT = 1.2 V
VOUT = 1.2 V
Figure 9-16. Output Voltage vs Output Current
Figure 9-17. Output Voltage vs Output Current
1.212
1.212
TJ = 85°C
TJ = -40°C
1.200
1.200
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1.188
0.01
0.1
1
10
IOUT [mA ]
100
1000
1.188
0.01
0.1
1
10
IOUT [mA ]
100
1000
SLVS
SLVS
TPS62801
VSEL/MODE = high after start-up
Forced PWM mode TJ = 85°C
TPS62801
VSEL/MODE = high after start-up
Forced PWM mode TJ = –40°C
VOUT = 1.2 V
VOUT = 1.2 V
Figure 9-19. Output Voltage vs Output Current
Figure 9-18. Output Voltage vs Output Current
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5000
100
90
80
70
60
50
4500
4000
3500
3000
2500
2000
1500
1000
500
40
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
30
20
10
0
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0
0
100 200 300 400 500 600 700 800 900 1000
IOUT [mA]
0
1
2
3
4
5
IOUT [mA]
6
7
8
9
10
SLVS
SLVS
TPS62801
VSEL/MODE = GND
PFM/PWM mode TJ = 25°C
TPS62801
VOUT = 1.2 V
VSEL/MODE = GND
VOUT = 1.2 V
PFM/PWM mode
TJ = 25°C
Figure 9-20. Switching Frequency vs Output
Current
Figure 9-21. Switching Frequency (Zoom In)
5000
4500
4000
3500
3000
2500
4500
4000
3500
3000
2500
2000
1500
2000
VIN = 1.8V
1500
1000
500
0
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
VIN = 1.8V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
1000
500
0
0
100 200 300 400 500 600 700 800 900 1000
IOUT [mA]
SLVS
0
100 200 300 400 500 600 700 800 900 1000
IOUT [mA]
TPS62801
VSEL/MODE = high after start-up
Forced PWM Mode TJ = 25°C
SLVS
VOUT = 1.2 V
TPS62801
VOUT = 0.8 V
VSEL/MODE = 10 kΩ to GND
PFM/PWM mode TJ = 25°C
Figure 9-22. Switching Frequency vs Output
Current
Figure 9-23. Switching Frequency vs Output
Current
2000
1800
1600
1400
1200
1000
800
VIN = 1.8V
600
400
200
0
VIN = 2.5V
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0
60 120 180 240 300 360 420 480 540 600
IOUT [mA]
SLVS
TPS62801
VOUT = 1.2 V
IOUT = 25 µA
VSEL/MODE = GND
PFM mode
TPS62806
VOUT = 0.7 V
VSEL/MODE = GND
PFM/PWM mode
L = 1 µH
TJ = 25°C
Figure 9-25. Typical Operation Power Save Mode
Figure 9-24. Switching Frequency vs Output
Current
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TPS62801
VOUT = 1.2 V
IOUT = 10 mA
VSEL/MODE = GND
PFM mode
VOUT = 0.7 V
VIN = 3.8 V
IOUT = 10 mA
VSEL/MODE = GND
PFM Mode, L = 1-µH DFE201610E
Figure 9-26. Typical Operation Power Save Mode
Figure 9-27. TPS62806 Typical Operation Power
Save Mode
VOUT = 0.7 V
VIN = 3.8 V
IOUT = 0 mA
VSEL/MODE = VIN
(after start-up)
PWM mode
VOUT = 1.2 V
VSEL/MODE = GND
IOUT = 500 mA
PFM Mode, L = 1-µH DFE201610E
Figure 9-29. TPS62801 Typical Operation PWM
Mode
Figure 9-28. TPS62806 Typical Forced PWM Mode
Operation (1.5 MHz)
Forced PWM
VOUT = 1.2 V
IOUT = 0 mA
TPS62801
rise / fall time < 1
µs
VOUT = 1.2 V
VSEL/MODE = GND
mode
IOUT = 0 mA to 50 mA, PFM Mode
VSEL/MODE = VIN (after start-up)
Figure 9-30. TPS62801 Typical Operation Forced
PWM Mode
Figure 9-31. Load Transient Power Save Mode
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TPS62801
VOUT = 1.2 V
VSEL/MODE = GND
PFM / PWM mode
Forced
VOUT = 1.2 V
VSEL/MODE = VIN
(after start-up)
rise / fall time < 1 µs
PWM mode
IOUT = 5 mA to 500 mA
rise / fall time < 1 µs
IOUT = 5 mA to 500 mA
Figure 9-32. Load Transient Power Save Mode
Figure 9-33. TPS62801 Load Transient Forced
PWM Mode
TPS62801
VOUT = 1.2 V
VSEL/MODE = GND
PFM/PWM mode
TPS62801
VOUT = 1.2 V
VSEL/MODE = VIN
(after start-up)
IOUT = 1 mA to 1 A 1 kHz
IOUT = 1 mA to 1 A, 1 kHz
Forced PWM mode
Figure 9-34. AC Load Sweep Power Save Mode
Figure 9-35. AC Load Sweep Forced PWM Mode
TPS62801
VOUT = 1.2 V
VIN = 3.6 V to 4.2 V
IOUT = 50 mA
TPS62801
VOUT = 1.2 V
VIN = 3.6 V to 4.2 V
IOUT = 500 mA
rise / fall time = 10 µs
rise / fall time = 10 µs
Figure 9-36. Line Transient PFM Mode
Figure 9-37. Line Transient PWM Mode
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VOUT = 0.8 V
VSEL/MODE = Low (through RVSEL
)
TPS62801
VOUT = 1.2 V
VSEL/MODE = GND
RLoad = 220 Ω
RVSEL = 10 kΩ
RLoad = 220 Ω
Figure 9-38. TPS62801 Start-Up, VOUT = 0.8 V
Figure 9-39. Start-Up, VOUT = 1.2 V
VOUT = 1.55 V
RLoad = 220 Ω
VSEL/MODE = Low (through RVSEL
)
TPS62801
VOUT = 1.2 V
VSEL/MODE = VIN
No load
RVSEL = 249 kΩ
EN = high to low
Figure 9-40. TPS62801 Start-Up, VOUT = 1.55 V
Figure 9-41. Output Discharge
tStartup_delay = 290ms
tStartup_delay = 300ms
VSEL/MODE = GND
RVSEL = 10 kΩ
Figure 9-42. Start-Up Delay Time, VSEL = 0
Figure 9-43. Start-Up Delay Time, VSEL = 1
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
tStartup_delay = 427ms
tStartup_delay = 363ms
RVSEL = 36.5 kΩ
RVSEL = 44.2 kΩ
Figure 9-44. Start-Up Delay Time, VSEL = 7
Figure 9-45. Start-Up Delay Time, VSEL = 8
tStartup_delay = 500ms
RVSEL = 249 kΩ
Figure 9-46. Start-Up Delay Time, VSEL = 16
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9.3 System Examples
This section shows additional circuits for various output voltages.
TPS62801
VIN
L = 0.47 µH
1.75 V–5.5 V
1.2-V VOUT fixed
COUT
VIN
SW
CIN
4.7
10
F
GND
VOS
F
ON
OFF
VSEL/
MODE
EN
Figure 9-47. TPS62801 VSEL Connected to GND for 1.2-V Fixed VOUT
TPS62801
VIN
16 selectable VOUT
0.8 V–1.55 V
L = 0.47 µH
1.75 V–5.5 V
VIN
SW
COUT
CIN
4.7
10
F
F
GND
VOS
PWM
ON
OFF
VSEL/
MODE
PFM
RVSEL
EN
Figure 9-48. TPS62801 Adjustable VOUT Application Circuit
TPS62802
L = 0.47 µH
VIN
1.75 V–5.5 V
VOUT = 3.3 V
VIN
SW
CIN
4.7
COUT
2 × 10
=
F
F
GND
VOS
PWM
ON
OFF
VSEL/
MODE
EN
PFM
R
VSEL
=
249 k
Figure 9-49. TPS62802 Adjustable 3.3-V VOUT Application Circuit
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
TPS62802
VIN
1.8 V fixed
L = 0.47 µH
1.75 V–5.5 V
VIN
SW
COUT
10 F
CIN
4.7 F
GND
VOS
ON
OFF
VSEL/
MODE
EN
Figure 9-50. TPS62802 VSEL Connected to GND for 1.8-V Fixed VOUT
16 selectable VOUT
0.4 V–0.775 V
IOUT up to 600 mA
TPS62806
VIN
L = 1 µH
1.75 V–5.5 V
VIN
SW
COUT
CIN
4.7
10
F
GND
EN
VOS
F
PWM
ON
OFF
VSEL/
MODE
PSM
RVSEL
Figure 9-51. TPS62806 Adjustable VOUT Application Circuit
TPS62806
0.7 V fixed VOUT
IOUT up to 600 mA
VIN
L = 1 µH
1.75 V–5.5 V
VIN
SW
COUT
CIN
4.7
10
F
GND
VOS
F
ON
OFF
VSEL/
MODE
EN
Figure 9-52. TPS62806 VSEL Connected to GND for 0.7-V Fixed VOUT
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10 Power Supply Recommendations
The power supply must provide a current rating according to the supply voltage, output voltage, and output
current of the TPS6280x.
11 Layout
11.1 Layout Guidelines
The pinout of TPS6280x has been optimized to enable a single top layer PCB routing of the IC and its
critical passive components such as CIN, COUT, and L. Furthermore, this pinout allows the user to connect tiny
components such as 0201 (0603) size capacitors and a 0402 (1005) size inductor. A solution size smaller than 5
mm2 can be achieved with a fixed output voltage.
•
•
•
•
As for all switching power supplies, the layout is an important step in the design. Take care in board layout to
get the specified performance.
It is critical to provide a low inductance, low impedance ground path. Therefore, use wide and short traces for
the main current paths.
The input capacitor should be placed as close as possible to the VIN and GND pins of the IC. This is the
most critical component placement.
The VOS line is a sensitive, high impedance line and should be connected to the output capacitor and routed
away from noisy components and traces (for example, SW line) or other noise sources.
11.2 Layout Example
VOUT
GND
COUT
GND
VIN
VOS
SW
EN
CIN
L
VSEL/
MODE
RVSEL
VIN
GND
Figure 11-1. PCB Layout Example
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SLVSDD1F – DECEMBER 2017 – REVISED JUNE 2022
12 Device and Documentation Support
12.1 Device Support
12.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
12.1.2 Development Support
12.1.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS62800 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62801 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62802 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62806 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62807 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS62808 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Subscribe to updates to register and receive a weekly digest of any product information that has changed. For
change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
DCS-Control™ and TI E2E™ are trademarks of Texas Instruments.
WEBENCH® is a registered trademark of Texas Instruments.
All trademarks are the property of their respective owners.
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12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
12.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
www.ti.com
13-Oct-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS62800YKAR
TPS62801YKAR
TPS62801YKAT
TPS62802YKAR
TPS62802YKAT
TPS62806YKAR
TPS62806YKAT
TPS62807YKAR
TPS62807YKAT
TPS62808YKAR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
6
6
6
6
6
6
6
6
6
6
3000 RoHS & Green SAC396 | SNAGCU
3000 RoHS & Green SAC396 | SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-
+
+
X
X
J
250
3000 RoHS & Green SAC396 | SNAGCU
250 RoHS & Green SAC396 | SNAGCU
3000 RoHS & Green SAC396 | SNAGCU
250 RoHS & Green SAC396 | SNAGCU
3000 RoHS & Green SAC396 | SNAGCU
250 RoHS & Green SAC396 | SNAGCU
3000 RoHS & Green SAC396 | SNAGCU
RoHS & Green SAC396 | SNAGCU
J
L
L
V
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Oct-2021
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Jul-2023
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS62800YKAR
TPS62801YKAR
TPS62801YKAR
TPS62801YKAT
TPS62801YKAT
TPS62802YKAR
TPS62802YKAR
TPS62802YKAT
TPS62806YKAR
TPS62806YKAT
TPS62806YKAT
TPS62807YKAR
TPS62807YKAR
TPS62807YKAT
TPS62807YKAT
TPS62808YKAR
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
3000
3000
250
180.0
180.0
178.0
178.0
180.0
180.0
178.0
180.0
180.0
180.0
178.0
180.0
178.0
178.0
180.0
180.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
0.81
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
1.16
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
0.46
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
250
3000
3000
250
3000
250
250
3000
3000
250
250
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
7-Jul-2023
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS62800YKAR
TPS62801YKAR
TPS62801YKAR
TPS62801YKAT
TPS62801YKAT
TPS62802YKAR
TPS62802YKAR
TPS62802YKAT
TPS62806YKAR
TPS62806YKAT
TPS62806YKAT
TPS62807YKAR
TPS62807YKAR
TPS62807YKAT
TPS62807YKAT
TPS62808YKAR
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
DSBGA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
YKA
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000
3000
3000
250
182.0
182.0
220.0
220.0
182.0
182.0
220.0
182.0
182.0
182.0
220.0
182.0
220.0
220.0
182.0
182.0
182.0
182.0
220.0
220.0
182.0
182.0
220.0
182.0
182.0
182.0
220.0
182.0
220.0
220.0
182.0
182.0
20.0
20.0
35.0
35.0
20.0
20.0
35.0
20.0
20.0
20.0
35.0
20.0
35.0
35.0
20.0
20.0
250
3000
3000
250
3000
250
250
3000
3000
250
250
3000
Pack Materials-Page 2
PACKAGE OUTLINE
YKA0006
DSBGA - 0.4 mm max height
SCALE 12.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
INDEX AREA
D
0.4 MAX
C
SEATING PLANE
0.05 C
0.18
0.13
BALL
TYP
0.35 TYP
C
B
A
0.7
TYP
SYMM
D: Max = 1.084 mm, Min =1.024 mm
E: Max = 0.734 mm, Min =0.674 mm
0.35
TYP
1
2
0.24
6X
0.19
SYMM
0.015
C A B
4223607/A 03/2017
NanoFree Is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
www.ti.com
EXAMPLE BOARD LAYOUT
YKA0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
6X ( 0.2)
(0.35) TYP
1
2
A
B
SYMM
C
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:50X
(
0.2)
0.0325 MAX
0.0325 MIN
METAL
UNDER
METAL
SOLDER MASK
EXSPOSED
EXPOSED
METAL
SOLDER MASK
OPENING
(
0.2)
METAL
SOLDER MASK
OPENING
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223607/A 03/2017
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YKA0006
DSBGA - 0.4 mm max height
DIE SIZE BALL GRID ARRAY
(0.35) TYP
6X ( 0.21)
(R0.05) TYP
1
2
A
(0.35) TYP
SYMM
B
METAL
TYP
C
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.075 mm - 0.1 mm THICK STENCIL
SCALE:50X
4223607/A 03/2017
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
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