TPS63027 [TI]
高效 4.5A 开关单电感器降压/升压转换器;
| 型号： | TPS63027 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 高效 4.5A 开关单电感器降压/升压转换器 升压转换器 开关 电感器 |
| 文件： | 总25页 (文件大小：1191K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPS63027
ZHCSFX4 –DECEMBER 2016
TPS63027 高电流、高效单电感器降压-升压转换器
1 特性
3 说明
1
•
真正的降压或升压运行，可在降压与升压运行状态
之间自动无缝切换
TPS63027 是一款具有低静态电流的高效降压-升压转
换器，适用于输入电压可能高于或低于输出电压的应
用。在升压模式下，输出电流可高达 2A，而在降压模
式下，输出电流可高达 4A。开关的最大平均电流限制
为 4.5A（典型值）。TPS63027 能够根据输入电压在
降压与升压模式之间自动切换，确保在两种模式之间无
缝切换，从而在整个输入电压范围内调节输出电压。此
降压-升压转换器基于一个使用同步整流的固定频率、
脉宽调制 (PWM) 控制器以获得最高效率。在低负载电
流情况下，此转换器进入省电模式，以便在整个负载电
流范围内保持高效率。有一个使用户能够在自动
PFM/PWM 模式运行和强制 PWM 运行之间进行选择
的 PFM/PWM 引脚。在 PWM 模式下通常使用
2.5MHz 固定频率。使用一个外部电阻器分压器可对输
出电压进行编程，或者在芯片上对输出电压进行内部固
定。转换器可被禁用以大大减少电池消耗。在关机期
间，负载从电池上断开。此器件采用 25 引脚 2.1mm x
2.1 mm WCSP 封装。
•
•
•
•
•
•
•
•
•
•
•
•
•
2.3V 至 5.5V 输入电压范围
1.0V 至 5.5V 输出电压范围
2A 持续输出电流：VIN ≥ 2.5V，VOUT = 3.5V
效率高达 96%
2.5MHz 典型开关频率
35μA 静态工作电流
集成软启动
节能模式
真正实现关断
输出电容器放电功能
过热保护以及过流保护
宽泛的电容选择
小型 2.1mm x 2.1mm，25 引脚晶圆级芯片
(WCSP) 封装
2 应用范围
•
•
•
•
•
手机、智能电话
平板个人电脑
器件信息(1)
器件型号
TPS63027
封装
封装尺寸（标称值）
个人电脑和智能手机配件
负载点稳压
DSBGA (25)
2.1mm x 2.1mm
(1) 要了解所有可用封装，请见数据表末尾的可订购产品附录。
电池供电类 应用
4 典型应用
sp
效率与输出电流间的关系
1uH
L1
L2
VIN
VOUT
2.3V - 5.5V
up to 5.5V / 2A
VIN
AVIN
EN
VOUT
10µF
FB
2x
22µF
MODE
GND
AGND
TPS63027
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSDK8
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
目录
9.3 Feature Description................................................... 7
9.4 Device Functional Modes.......................................... 9
10 Application and Implementation........................ 12
10.1 Application Information.......................................... 12
10.2 Typical Applications ............................................. 12
11 Power Supply Recommendations ..................... 18
12 Layout................................................................... 18
12.1 Layout Guidelines ................................................. 18
12.2 Layout Example .................................................... 18
13 器件和文档支持 ..................................................... 19
13.1 器件支持 ............................................................... 19
13.2 文档支持 ............................................................... 19
13.3 接收文档更新通知 ................................................. 19
13.4 社区资源................................................................ 19
13.5 商标....................................................................... 19
13.6 静电放电警告......................................................... 19
13.7 Glossary................................................................ 19
14 机械、封装和可订购信息....................................... 19
1
2
3
4
5
6
7
8
特性.......................................................................... 1
应用范围................................................................... 1
说明.......................................................................... 1
典型应用................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 3
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
8.1 Absolute Maximum Ratings ...................................... 4
8.2 ESD Ratings ............................................................ 4
8.3 Recommended Operating Conditions....................... 4
8.4 Thermal Information.................................................. 4
8.5 Electrical Characteristics........................................... 5
8.6 Timing Requirements................................................ 6
8.7 Typical Characteristics.............................................. 6
Detailed Description .............................................. 7
9.1 Overview ................................................................... 7
9.2 Functional Block Diagram ......................................... 7
9
5 修订历史记录
日期
修订版本
注释
2016 年 12 月
*
最初发布版本
2
Copyright © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
6
Device Comparison Table
PART NUMBER
VOUT
TPS63027
Adjustable
7 Pin Configuration and Functions
YFF Package
DSBGA 25-Pin
Top View
1
2
VIN
L1
3
VIN
L1
4
VIN
L1
5
VIN
AVIN
A
L1
EN
B
GND
GND
GND
MODE
AGND
AGND
FB
C
L2
L2
L2
L2
D
VOUT
VOUT
VOUT
VOUT
E
Pin Functions
PIN
DESCRIPTION
NAME
NO
VIN
A1, A2, A3, Supply voltage for power stage
A4
AVIN
L1
A5
Supply voltage for control stage
B1, B2, B3, Connection for Inductor
B4
EN
B5
Enable input. Set high to enable and low to disable. It must not be left floating
GND
MODE
C1,C2,C3 Power Ground
C4
PFM/PWM Mode selection. Set HIGH for PFM mode, set LOW for forced PWM mode. It must not be left
floating
AGND
L2
C5, D5
Analog Ground
D1, D2, D3, Connection for Inductor
D4
VOUT
FB
E1, E2, E3, Buck-Boost converter output
E4
E5
Voltage feedback of adjustable version, must be connected to VOUT on fixed output voltage versions
Copyright © 2016, Texas Instruments Incorporated
3
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
8 Specifications
D/S
8.1 Absolute Maximum Ratings
over junction temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
V
Voltage(2)
VIN, L1, L2, EN, VINA, PFM/PWM, VOUT, FB
Continuos average current into L1(3)
–0.3
7
Input current
2.7
125
150
A
Operating junction temperature, TJ
Storage temperature, Tstg
–40
–65
°C
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
(3) Maximum continuos average input current 3.5 A, under those condition do not exceed 105°C for more than 25% operating time.
8.2 ESD Ratings
VALUE
±2000
±500
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
Electrostatic
discharge
V(ESD)
V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
8.3 Recommended Operating Conditions
(1)
See
MIN
2.3
1
NOM
MAX
5.5
UNIT
V
VIN
VOUT
TA
Input voltage
Output voltage
5.5
V
Operating ambient temperature
Operating virtual junction temperature
–40
–40
85
°C
°C
TJ
125
(1) Refer to the Application and Implementation section for further information
8.4 Thermal Information
TPS63027
YFF (DSBGA)
25 PINS
62.1
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
0.4
10.4
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
0.2
ψJB
10.5
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
Copyright © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
8.5 Electrical Characteristics
VIN= 2.3 V to 5.5 V, TJ= –40°C to +125°C, typical values are at TA= 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range
Minimum input voltage to turn on into full load IOUT = 2 A
2.3
5.5
V
V
A
VIN;LOAD
IOUT
2.8
2
Continuous output current(1)
VIN ≥ 2.5 V, VOUT = 3.3 V
IOUT = 0 mA, EN = VIN = 3.6 V,
VOUT = 3.3 V TJ = –40°C to +85°C,
not switching (PFM Mode)
Quiescent current, VIN
35
70
12
μA
μA
IQ
IOUT = 0 mA, EN = VIN = 3.6 V,
VOUT = 3.3 V TJ = –40°C to +85°C,
not switching (PFM Mode)
Quiescent current, VOUT
ISD
Shutdown current
EN = low, TJ = –40°C to +85°C
VIN falling
0.1
1.7
60
2
2
μA
V
Undervoltage lockout threshold
Undervoltage lockout hysteresis
Thermal shutdown
1.6
UVLO
mV
°C
°C
Temperature rising
140
20
Thermal shutdown hysteresis
LOGIC SIGNALS EN, PFM/PWM
VIH
High-level input voltage
Low-level input voltage
Input leakage current
VIN = 2.3 V to 5.5 V
VIN = 2.3 V to 5.5 V
EN = GND or VIN
1.2
1
V
V
VIL
0.4
0.2
Ilkg
0.01
0.8
μA
OUTPUT
VOUT
VFB
Output voltage range
VIN = 3.6 V, IOUT = 100 mA
5.5
V
V
Feedback regulation voltage
Feedback voltage accuracy
Feedback voltage accuracy(2)
Output current to enter PFM mode
Feedback input bias current
High-side FET on-resistance
Low-side FET on-resistance
High-side FET on-resistance
Low-side FET on-resistance
VFB
PWM mode
–1%
–1%
1%
3%
VFB
PFM mode
1.3%
350
10
IPWM/PFM
IFB
VIN = 3 V; VOUT = 3.3 V
VFB = 0.8 V
mA
nA
100
VIN = 3 V, VOUT = 3.3 V
VIN = 3 V, VOUT = 3.3 V
VIN = 3 V, VOUT = 3.3 V
VIN = 3 V, VOUT = 3.3 V
48
mΩ
mΩ
mΩ
mΩ
RDS;ON(Buc
k)
56
33
RDS;ON(Boo
st)
56
VIN = 3 V, VOUT = 3.3 V TJ = 65°C to
125°C
IIN
Average input current limit(3)
3.5
4.5
5
A
fSW
Switching frequency
Discharge ON-resistance
Line regulation
2.5
120
7.4
5
MHz
Ω
RON_DISC
EN = low
VIN = 2.8 V to 5.5 V, IOUT = 2 A
VIN= 3.6 V, IOUT = 0 A to 2 A
mV/V
mV/A
Load regulation
(1) For minimum output current in a specific working point see 图 6 and 公式 1 trough 公式 4.
(2) Conditions: L = 1 µH, COUT = 2 × 22 µF.
(3) For variation of this parameter with Input voltage and temperature see 图 6.
Copyright © 2016, Texas Instruments Incorporated
5
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
8.6 Timing Requirements
VIN= 2.3 V to 5.5 V, TJ= –40°C to +125°C, typical values are at TA= 25°C (unless otherwise noted)
MIN
NOM
MAX
UNIT
OUTPUT
VOUT = EN = low to high, Buck mode VIN = 3.6 V,
VOUT = 3.3 V, IOUT = 2 A
450
700
100
µs
µs
µs
tSS
Soft-start time
Start up delay
VOUT = EN = low to high, Boost mode VIN = 2.8 V,
VOUT = 3.3 V, IOUT = 2 A
Time from when EN = high to when device starts
switching
td
8.7 Typical Characteristics
100
90
80
70
60
50
40
30
20
10
0
50
47,5
45
42,5
40
37,5
35
32,5
30
27,5
25
22,5
20
17,5
15
12,5
TPS63027 VOUT = 3.3V
TPS63027 VOUT = 3.3V
10
7,5
-40°C
25 °C
85°C
-40°C
25 °C
85°C
5
2,5
0
2,5
2,75
3
3,25
3,5
3,75
4
4,25
4,5
4,75
5
5,25
5,5
2,5
2,75
3
3,25
3,5
3,75
4
4,25
4,5
4,75
5
5,25
5,5
Input Voltage [V]
Input Voltage [V]
图 1. High Side FET On-Resistance vs Input Voltage
图 2. Quiescent Current vs Input Voltage
6
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
9 Detailed Description
9.1 Overview
The TPS63027 use 4 internal N-channel MOSFETs to maintain synchronous power conversion at all possible
operating conditions. This enables the device to keep high efficiency over the complete input voltage and output
power range. To regulate the output voltage at all possible input voltage conditions, the device automatically
switches from buck operation to boost operation and back as required by the configuration. It always uses one
active switch, one rectifying switch, one switch is held on, and one switch held off. Therefore, it operates as a
buck converter when the input voltage is higher than the output voltage, and as a boost converter when the input
voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are switching at
the same time. Keeping one switch on and one switch off eliminates their switching losses. The RMS current
through the switches and the inductor is kept at a minimum, to minimize switching and conduction losses.
Controlling the switches this way allows the converter to always keep higher efficiency.
The device provides a seamless transition from buck to boost or from boost to buck operation.
9.2 Functional Block Diagram
L1
L2
VIN
VOUT
Current
Sensor
EN
PGND
PGND
PGND
VIN
Gate
Control
VOUT
_
+
_
+
VINA
Modulator
Oscillator
FB
+
-
VREF
Device
Control
PFM/PWM
EN
Temperature
Control
PGND
GND
PGND
Copyright © 2016, Texas Instruments Incorporated
9.3 Feature Description
9.3.1 Undervoltage Lockout (UVLO)
To avoid mis-operation of the device at low input voltages, an undervoltage lockout is included. UVLO shuts
down the device at low input voltages to ensure proper operation. See eletrical characteristics table for the
dedicated values.
版权 © 2016, Texas Instruments Incorporated
7
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
Feature Description (接下页)
9.3.2 Output Discharge Function
When the device is disabled by pulling enable low and the supply voltage is still applied, the internal transistor
use to discharge the output capacitor is turned on, and the output capacitor is discharged until UVLO is reached.
This means, if there is no supply voltage applied the output discharge function is also disabled. The transistor
which is responsible of the discharge function, when turned on, operates like an equivalent 120-Ω resistor,
ensuring typically less than 10ms discharge time for 20-µF output capacitance and a 3.3 V output.
9.3.3 Thermal Shutdown
The device goes into thermal shutdown once the junction temperature exceeds typically 140°C with a 20°C
hysteresis.
9.3.4 Softstart
To minimize inrush current and output voltage overshoot during start up, the device has a Softstart. At turn on,
the input current raises monotonic until the output voltage reaches regulation. During Softstart, the input current
follows the current ramp charging the internal Softstart capacitor. The device smoothly ramps up the input current
bringing the output voltage to its regulated value even if a large capacitor is connected at the output.
The Softstart time is measured as the time from when the EN pin is asserted to when the output voltage has
reached 90% of its nominal value. There is a delay time from when the EN pin is asserted to when the device
starts the switching activity. The Softstart time depends on the load current, the input voltage, and the output
capacitor. The Softstart time in boost mode is longer then the time in buck mode.
The inductor current is able to increase and always assure a soft start unless a real short circuit is applied at the
output.
9.3.5 Short Circuit Protection
The TPS63027 provides short circuit protection to protect itself and the application. When the output voltage
does not increase above 1.2V, the device assumes a short circuit at the output and limits the input current to 4 A.
8
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
9.4 Device Functional Modes
9.4.1 Control Loop Description
0.8V
Ramp and Clock
Generator
图 3. Average Current Mode Control
The controller circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. 图 3 shows the control
loop.
The non inverting input of the transconductance amplifier, gmv, is assumed to be constant. The output of gmv
defines the average inductor current. The inductor current is reconstructed by measuring the current through the
high side buck MOSFET. This current corresponds exactly to the inductor current in boost mode. In buck mode
the current is measured during the on time of the same MOSFET. During the off time, the current is
reconstructed internally starting from the peak value at the end of the on time cycle. The average current and the
feedback from the error amplifier gmv forms the correction signal gmc. This correction signal is compared to the
buck and the boost sawtooth ramp giving the PWM signal. Depending on which of the two ramps the gmc output
crosses either the Buck or the Boost stage is initiated. When the input voltage is close to the output voltage, one
buck cycle is always followed by a boost cycle. In this condition, no more than three cycles in a row of the same
mode are allowed. This control method in the buck-boost region ensures a robust control and the highest
efficiency.
版权 © 2016, Texas Instruments Incorporated
9
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
Device Functional Modes (接下页)
9.4.2 Power Save Mode Operation
Heavy Load transient step
PFM mode at light load
current
Comparator High
Vo+1.3%*Vo
Vo
30mV ripple
Comparator low
PWM mode
Absolute Voltage drop
with positioning
图 4. Power Save Mode Operation
Depending on the load current, in order to provide the best efficiency over the complete load range, the device
works in PWM mode at load currents of typically 350mA or higher. At lighter loads, the device switches
automatically into Power Save Mode to reduce power consumption and extend battery life. The MODE pin is
used to select between the two different operation modes. To enable Power Save Mode, the MODE pin must be
set HIGH.
During Power Save Mode, the part operates with a reduced switching frequency and lowest supply current to
maintain high efficiency. The output voltage is monitored with a comparator at every clock cycle by the thresholds
comp low and comp high. When the device enters Power Save Mode, the converter stops operating and the
output voltage drops. The slope of the output voltage depends on the load and the output capacitance. When the
output voltage reaches the comp low threshold, at the next clock cycle the device ramps up the output voltage
again, by starting operation. Operation can last for one or several pulses until the comp high threshold is
reached. At the next clock cycle, if the load is still lower than about 350mA, the device switches off again and the
same operation is repeated. Instead, if at the next clock cycle, the load is above 350mA, the device automatically
switches to PWM mode.
In order to keep high efficiency in PFM mode, there is only one comparator active to keep the output voltage
regulated. The AC ripple in this condition is increased, compared to the PWM mode. The amplitude of this
voltage ripple is typically 30 mV pk-pk, with 2-µF effective output capacitance. In order to avoid a critical voltage
drop when switching from 0A to full load, the output voltage in PFM mode is typically 1.3% above the nominal
value in PWM mode. This is called Dynamic Voltage Positioning and allows the converter to operate with a small
output capacitor and still have a low absolute voltage drop during heavy load transients.
Power Save Mode is disabled by setting the MODE pin LOW.
10
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
Device Functional Modes (接下页)
9.4.3 Current Limit
The current limit variation depends on the difference between the input and output voltage. The maximum current
limit value is at the highest difference.
Given the curves provided in 图 6, it is possible to calculate the output current reached in boost mode, using 公式
1 and 公式 2 and in buck mode using 公式 3 and 公式 4.
V
- V
IN
OUT
V
Duty Cycle Boost
D =
OUT
(1)
(2)
Output Current Boost
IOUT = 0 x IIN (1-D)
V
OUT
V
Duty Cycle Buck
D =
IN
(3)
(4)
Output Current Buck
IOUT = ( 0 x IIN ) / D
where
•
•
η = Estimated converter efficiency (use the number from the efficiency curves or 0.90 as an assumption)
IIN= Minimum average input current (图 6)
9.4.4 Supply and Ground
The TPS63027 provides two input pins (VIN and AVIN) and two ground pins (GND and AGND).
The VIN pin supplies the input power, while the AVIN pin provides voltage for the control circuits. A similar
approach is used for the ground pins. AGND and GND are used to avoid ground shift problems due to the high
currents in the switches. The reference for all control functions is the AGND pin. The power switches are
connected to GND. Both grounds must be connected on the PCB at only one point, ideally, close to the AGND
pin.
9.4.5 Device Enable
The device starts operation when the EN pin is set high. The device enters shutdown mode when the EN pin is
set low. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load
is disconnected from the input.
版权 © 2016, Texas Instruments Incorporated
11
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
10 Application and Implementation
注
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPS63027 are high efficiency, low quiescent current buck-boost converters suitable for application where the
input voltage is higher, lower or equal to the output. Output currents can go as high as 2A in boost mode and as
high as 5A in buck mode. The maximum average current in the switches is limited to a typical value of 4.5 A.
10.2 Typical Applications
L1
1uH
L1
L2
VOUT
VIN
3.5V
2.3V - 5.5V
VIN
AVIN
EN
VOUT
R1
510kΩ
C1
10µF
FB
C3
22µF
C2
22µF
R2
150kΩ
MODE
GND
AGND
TPS63027
图 5. 3.3-V Output Voltage
10.2.1 Design Requirements
The design guideline provides a component selection to operate the device within the recommended operating
conditions.
表 1 shows the list of components for the Application Characteristic Curves.
(1)
表 1. Components for Application Characteristic Curves
REFERENCE
DESCRIPTION
MANUFACTURER
Texas Instruments
XAL4020-102MEB, Coilcraft
Standard
TPS63027
L1
1 μH, 8.75A, 13mΩ, SMD
10 μF 6.3V, 0603, X5R ceramic
47 μF 6.3V, 0603, X5R ceramic
510kΩ
C1
C2
R1
R2
Standard
Standard
150kΩ
Standard
(1) See Third-Party Products Discalimer
12
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
10.2.2 Detailed Design Procedure
The first step is the selection of the output filter components. To simplify this process 表 2 outlines possible
inductor and capacitor value combinations.
10.2.2.1 Output Filter Design
表 2. Matrix of Output Capacitor and Inductor Combinations
NOMINAL
INDUCTOR
NOMINAL OUTPUT CAPACITOR VALUE [µF](2)
VALUE [µH](1)
2x22
47
66
88
100
0.680
1.0
+
+
+
+
+
+
+
+
+
+
+
+
(3)
+
1.5
(1) Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20% and –30%.
(2) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by 20% and –50%.
(3) Typical application. Other check mark indicates recommended filter combinations
10.2.2.2 Inductor Selection
The inductor selection is affected by several parameter like inductor ripple current, output voltage ripple,
transition point into Power Save Mode, and efficiency. See 表 3 for typical inductors.
(1)
表 3. List of Recommended Inductors
INDUCTOR VALUE
COMPONENT SUPPLIER
Coilcraft XAL4020-102ME
Toko, DFE322512C
SIZE (LxWxH mm)
4 X 4 X 2.10
3.2 X 2.5 X 1.2
4.4 X 4.1 X 1.2
3 X 3 X 1.2
Isat/DCR
4.5A/10mΩ
4.7A/34mΩ
4.1A/38mΩ
6.6A/42.10mΩ
5A/17.40mΩ
7.7A/36mΩ
1 µH
1 µH
1 µH
TDK, SPM4012
1 µH
Wuerth, 74438334010
Coilcraft XFL4012-601ME
Wuerth,744383340068
0.6 µH
0.68µH
4 X 4 X 1.2
3 X 3 X 1.2
(1) See Third-Party Products Desclaimer
For high efficiencies, the inductor should have a low dc resistance to minimize conduction losses. Especially at
high-switching frequencies, the core material has a high impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, the peak current for
the inductor in steady state operation is calculated using Equation 6. Only the equation which defines the switch
current in boost mode is shown, because this provides the highest value of current and represents the critical
current value for selecting the right inductor.
V
- V
OUT
V
IN
Duty Cycle Boost
D =
OUT
(5)
Iout
η ´ (1 - D)
Vin ´ D
IPEAK
=
+
2 ´ f ´ L
where
•
•
•
•
D =Duty Cycle in Boost mode
f = Converter switching frequency (typical 2.5MHz)
L = Inductor value
η = Estimated converter efficiency (use the number from the efficiency curves or 0.90 as an assumption)
(6)
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. It's recommended to choose an inductor with a saturation current 20% higher
than the value calculated using 公式 6. Possible inductors are listed in 表 3.
版权 © 2016, Texas Instruments Incorporated
13
TPS63027
ZHCSFX4 –DECEMBER 2016
10.2.2.3 Capacitor Selection
10.2.2.3.1 Input Capacitor
www.ti.com.cn
At least a 10μF input capacitor is recommended to improve line transient behavior of the regulator and EMI
behavior of the total power supply circuit. An X5R or X7R ceramic capacitor placed as close as possible to the
VIN and PGND pins of the IC is recommended. This capacitance can be increased without limit. If the input
supply is located more than a few inches from the TPS63027 converter additional bulk capacitance may be
required in addition to the ceramic bypass capacitors. An electrolytic or tantalum capacitor with a value of 47 μF
is a typical choice.
10.2.2.3.2 Output Capacitor
For the output capacitor, use of a small ceramic capacitors placed as close as possible to the VOUT and PGND
pins of the IC is recommended. The recommended effective output capacitance value is 20 µF with a variance as
outlined in 表 2 . This translates into a 44uF nominal cpacitor (6.3V rated) for output voltages up to 3.5V.
There is also no upper limit for the output capacitance value. Larger capacitors causes lower output voltage
ripple as well as lower output voltage drop during load transients.
10.2.2.4 Setting The Output Voltage
When the adjustable output voltage version TPS63027 is used, the output voltage is set by an external resistor
divider. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is
regulated properly, the typical value of the voltage at the FB pin is 800 mV. The current through the resistive
divider should be about 10 times greater than the current into the FB pin. The typical current into the FB pin is
0.1 μA, and the voltage across the resistor between FB and GND, R2, is typically 800 mV. Based on these two
values, the recommended value for R2 should be lower than 180 kΩ, in order to set the divider current at 4μA or
higher. It is recommended to keep the value for this resistor in the range of 180kΩ. From that, the value of the
resistor connected between VOUT and FB, R1, depending on the needed output voltage (VOUT), can be
calculated using 公式 7:
æ
ç
è
ö
VOUT
VFB
R1 = R2 ×
- 1
÷
ø
(7)
14
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
10.2.3 Application Curves
7
6
5
4
3
2
1
0
5
4,5
4
3,5
3
2,5
2
1,5
TPS63027 VOUT = 3.3V
1
3.3 VOUT
3.5 VOUT
4A Load
-40°C
25 °C
85°C
0,5
0
2,5
2,75
3
3,25
3,5
3,75
4
4,25
4,5
4,75
5
5,25
5,5
2,5
3
3,5
4
4,5
5
5,5
Input Voltage [V]
Input Voltage [V]
图 6. Average Input Current vs Input Voltage
图 7. Maximum Output Current for a 4A Load
3,6
3,5
3,4
3,3
3,2
3,1
3
TPS63027 VOUT = 3.3V
2.5VIN
3.0VIN
3.3VIN
3.7VIN
4.3VIN
1m
10m
100m
Current [A]
1
图 8. Efficiency vs Output Current
图 9. Output Voltage vs Output Current
L1 (5V/DIV)
L2 (5V/DIV)
L1 (5V/DIV)
L2 (5V/DIV)
0V
0V
0V
0V
VOUT (50mV/DIV)
VOUT (50mV/DIV)
3.5V
3.5V
ICOIL (500mA/DIV)
ICOIL (500mA/DIV)
0A
0A
Timebase 1us/DIV
Timebase 400ns/DIV
图 10. Output Voltage Ripple in Buck-Boost Mode, VIN =
图 11. Switching Waveforms in Boost Mode, VIN = 3.0 V,
3.6 V, VOUT = 3.5 V, no Load
VOUT = 3.5 V, 1-A Load
版权 © 2016, Texas Instruments Incorporated
15
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
L1 (5V/DIV)
L1 (5V/DIV)
0V
0V
0V
L2 (5V/DIV)
L2 (5V/DIV)
0V
VOUT (50mV/DIV)
VOUT (50mV/DIV)
3.5V
3.5V
ICOIL (500mA/DIV)
ICOIL (500mA/DIV)
0A
0A
Timebase 400ns/DIV
Timebase 400ns/DIV
图 12. Switching Waveforms in Buck Mode, VIN = 4.3 V,
图 13. Switching Waveforms in Buck-Boost Mode, VIN =
VOUT = 3.5 V, 1-A Load
3.55 V, VOUT = 3.5 V, 1-A Load
VOUT (200mV/DIV)
VOUT (200mV/DIV)
3.5V
3.5V
Load Current (1A/DIV)
Load Current (1A/DIV)
0A
0A
Timebase 200us/DIV
Timebase 200us/DIV
图 15. Load Transient Response Buck Mode, VIN = 4.3 V,
图 14. Load Transient Response Boost Mode, VIN = 3.0 V,
VOUT = 3.5 V
VOUT = 3.5 V
VIN (500mV/DIV)
VOUT (100mV/DIV)
3.5V
VOUT (100mV/DIV)
3.5V
Load Current (500mA/DIV)
0A
Timebase 200us/DIV
Timebase 1ms/DIV
图 16. Load Transient Response, VIN = 3.5 V, VOUT = 3.5
图 17. Line Sweep Response, VOUT = 3.5 V, 2-A Load
V, PFM Mode
16
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
EN (5V/DIV)
VIN (500mV/DIV)
VOUT (1V/DIV)
3.5V
VOUT (50mV/DIV)
ICOIL (500mA/DIV)
0V
Timebase 1ms/DIV
Timebase 100µs/DIV
图 19. Start Up After Enable, VIN = 3.7 V, VOUT = 3.5 V, no
图 18. Line Transient Response,
Load
VOUT = 3.5 V, 1-A Load
EN (5V/DIV)
VOUT (1V/DIV)
ICOIL (500mA/DIV)
Timebase 100µs/DIV
图 20. Start Up After Enable, VIN = 3.7 V, VOUT = 3.5 V, 1-A Load
版权 © 2016, Texas Instruments Incorporated
17
TPS63027
ZHCSFX4 –DECEMBER 2016
www.ti.com.cn
11 Power Supply Recommendations
The TPS63027 device family has no special requirements for its input power supply. The input power supply’s
output current needs to be rated according to the supply voltage, output voltage and output current of the
TPS63027.
12 Layout
12.1 Layout Guidelines
The PCB layout is an important step to maintain the high performance of the TPS63027 devices.
•
Place input and output capacitors as close as possible to the IC. Traces need to be kept short. Routing wide
and direct traces to the input and output capacitor results in low trace resistance and low parasitic inductance.
•
•
•
Use a common-power GND
Use separate traces for the supply voltage of the power stage; and, the supply voltage of the analog stage.
The sense trace connected to FB is signal trace. Keep these traces away from L1 and L2 nodes.
12.2 Layout Example
R2
GND
AVIN
FB
VIN
VOUT
CIN
COUT
COUT
CIN
L
GND
图 21. TPS63027 Layout
18
版权 © 2016, Texas Instruments Incorporated
TPS63027
www.ti.com.cn
ZHCSFX4 –DECEMBER 2016
13 器件和文档支持
13.1 器件支持
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 文档支持
13.2.1 相关文档ꢀ
相关文档如下：
•
《TPS63027EVM-813 用户指南，TPS63027 高电流、高效率单电感器降压-升压转换器》，SLVUA24
13.3 接收文档更新通知
如需接收文档更新通知，请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后，即可每周定期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。
13.4 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
13.6 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
13.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2016, Texas Instruments Incorporated
19
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS63027YFFR
TPS63027YFFT
ACTIVE
DSBGA
DSBGA
YFF
25
25
3000 RoHS & Green
250 RoHS & Green
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
TPS
63027
ACTIVE
YFF
SNAGCU
TPS
63027
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Addendum-Page 2
PACKAGE OUTLINE
YFF0025
DSBGA - 0.625 mm max height
S
C
A
L
E
6
.
0
0
0
DIE SIZE BALL GRID ARRAY
B
E
A
BUMP A1
CORNER
D
C
0.625 MAX
SEATING PLANE
0.05 C
BALL TYP
0.30
0.12
1.6 TYP
SYMM
E
D
D: Max = 2.116 mm, Min =2.056 mm
E: Max = 2.098 mm, Min =2.038 mm
SYMM
1.6
C
B
A
TYP
0.4 TYP
3
4
5
1
2
0.3
0.2
25X
0.4 TYP
0.015
C A B
4223786/A 06/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFF0025
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
25X ( 0.23)
(0.4) TYP
1
2
4
5
A
B
SYMM
C
D
E
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:25X
0.05 MAX
(
0.23)
0.05 MIN
(
0.23)
METAL
SOLDER MASK
OPENING
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
EXPOSED METAL
NON-SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4223786/A 06/2017
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0025
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
25X ( 0.25)
(R0.05) TYP
3
1
2
4
5
A
B
C
(0.4) TYP
METAL
TYP
SYMM
D
E
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4223786/A 06/2017
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023，德州仪器 (TI) 公司
相关型号：
©2020 ICPDF网 联系我们和版权申明