TPS63050RMWT [TI]
具有 1A 开关电流和可调节软启动功能的 TPS6305x 单电感器降压/升压转换器 | RMW | 12 | -40 to 125;
| 型号： | TPS63050RMWT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 1A 开关电流和可调节软启动功能的 TPS6305x 单电感器降压/升压转换器 | RMW | 12 | -40 to 125 升压转换器 开关 软启动 电感器 |
| 文件： | 总36页 (文件大小：3681K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TPS63050, TPS63051
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
TPS6305x 开关电流为 1A、具备可调节软启动功能的单电感降压-升压转换
器
1 特性
3 说明
1
•
实时降压或升压，支持在降压和升压模式之间无缝
转换
TPS6305x 系列器件是一款静态电流较低的高效降压/
升压转换器 ， 适用于输入电压高于或低于输出电压的
应用。
•
•
输入电压范围为 2.5V 至 5.5V
0.5A 持续输出电流：VIN ≥ 2.5V、
在升压模式下，持续输出电流最高可达 500mA；在降
压模式下，持续输出最高可达 1A。最大平均开关电流
限制为 1A（典型值）。TPS6305x 系列器件在整个输
入电压范围内针对输出电压进行稳压操作，可根据输入
电压自动切换为降压或升压模式，从而在两种模式之间
实现无缝转换。
VOUT = 3.3V
•
•
具有可调节输出电压和固定输出电压两个版本可选
在升压模式中效率大于 90%，在降压模式中效率大
于 95%
•
•
•
•
•
•
•
•
开关频率典型值为 2.5MHz
平均输入电流限制可调节
软启动时间可调节
该降压/升压转换器基于使用同步整流的固定频率
PWM 控制器，可实现最高效率。在负载电流较低的情
况下，该转换器进入节能模式，从而在整个负载电流范
围内保持高效率。
器件静态电流小于 60μA
具有自动节电模式或强制 PWM 模式
关断期间负载断开
提供过热保护
用户可以通过脉频调制 (PFM)/PWM 引脚选择自动
PFM/PWM 工作模式或强制 PWM 工作模式。在 PWM
模式下通常使用 2.5MHz 固定频率。使用一个外部电
阻分压器可对输出电压进行编程，或者在芯片上对输出
电压进行内部固定。转换器可被禁用以最大限度地减少
电池消耗。在关断期间，负载从电池上断开。该器件采
用 12 引脚芯片尺寸球状引脚栅格阵列 (DSBGA) 封装
和 12 引脚 HotRod 封装。
采用 1.6mm x 1.2mm、12 引脚 WCSP 小型封装
和 2.5mm x 2.5mm、12 引脚、HotRod™ QFN 封
装
•
借助以下工具创建定制设计方案：
–
–
TPS63050，使用 WEBENCH® 电源设计器
TPS63051，使用 WEBENCH® 电源设计器
2 应用
•
•
•
•
•
手机和智能电话
器件信息(1)
平板电脑
器件型号
封装
DSBGA (12)
VQFN (12)
封装尺寸（标称值）
1.56mm x 1.16mm
2.50mm x 2.50mm
PC 和智能手机附件
通过电池供电的 应用
智能电网/智能仪表
TPS63050
TPS63051
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
简化原理图 (WCSP)
效率与输出电流间的关系
L1 1.5 µH
TPS63051
L1
L2
2.5 V to 5.5 V
3.3 V/ 500mA
VIN
EN
VOUT
FB
R2
VOUT
VIN
C1
10µF
C2
C3
1MΩ
10µF
10µF
ILIM0
PG
VIH or VIL
PFM/
PWM
ILIM1
SS
VIH or VIL
GND
C3
1nF
VIN = 2.8V, VOUT = 3.3V
V
IN = 3.6V, VOUT = 3.3V
TPS63051
Output Current (mA)
1
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。 有关适用的官方英文版本的最新信息，请访问 www.ti.com，其内容始终优先。 TI 不保证翻译的准确
性和有效性。 在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSAM8
TPS63050, TPS63051
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
www.ti.com.cn
目录
1
2
3
4
5
6
7
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings ............................................................ 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information ................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Switching Characteristics.......................................... 7
7.7 Typical Characteristics.............................................. 8
Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagrams ....................................... 9
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 12
9
Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application ................................................. 15
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
11.2 Layout Example (WCSP) ...................................... 23
11.3 Layout Example (HotRod)..................................... 23
11.4 Thermal Considerations........................................ 24
12 器件和文档支持 ..................................................... 24
12.1 使用 WEBENCH® 工具创建定制设计 ................... 24
12.2 器件支持 ............................................................... 24
12.3 相关链接................................................................ 24
12.4 接收文档更新通知 ................................................. 25
12.5 社区资源................................................................ 25
12.6 商标....................................................................... 25
12.7 静电放电警告......................................................... 25
12.8 Glossary................................................................ 25
13 机械、封装和可订购信息....................................... 25
8
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision C (July 2015) to Revision D
Page
•
•
•
•
在数据表中添加了 Webench 链接........................................................................................................................................... 1
Changed the Pin Configurations............................................................................................................................................. 4
Changed the quiescent current VIN max value From: 60 µA To: 65 µA in the Electrical Characteristics ............................. 6
Added Note: Conditions: TJ = –40°C to 85°C To the quiescent current and shutdown current in the Electrical
Characteristics........................................................................................................................................................................ 6
Changes from Revision B (April 2015) to Revision C
Page
•
•
•
•
已添加 新封装选项至 项目符号............................................................................................................................................... 1
已添加 VQFN 封装至器件信息表 ............................................................................................................................................ 1
Added HotRod Pin Configuration and Functions ................................................................................................................... 4
Added Parameter Measurement Circuit for HotRod package option ................................................................................... 15
Changes from Revision A (February 2014) to Revision B
Page
•
•
•
•
•
已更改 说明 部分的第四段 ..................................................................................................................................................... 1
已更改 图形图像 .................................................................................................................................................................... 1
Changed Ordering Information table To:Device Comparison Table ..................................................................................... 4
Changed "Handling Ratings" table to "ESD Rating" table and moved Tstg spec to the Absolute Maximum Ratings table.... 5
Moved some Typical Characteristics graphs to the Application Curves section ................................................................... 8
2
版权 © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
Changes from Original (July 2013) to Revision A
Page
•
已添加 器件信息表，ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部
分，器件和文档支持部分以及机械、封装和可订购信息部分 .................................................................................................. 1
•
•
•
已添加 TPS63050 器件规范和 说明 至整篇数据手册 ............................................................................................................. 1
Changed Figure 34, PCB Layout ........................................................................................................................................ 23
Changed Figure 35, PCB Layout ........................................................................................................................................ 23
Copyright © 2013–2019, Texas Instruments Incorporated
3
TPS63050, TPS63051
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
www.ti.com.cn
5 Device Comparison Table
(1)
PART NUMBER
VOUT
Adjustable
3.3 V
TPS63050
TPS63051
(1) For all available packages, see the orderable addendum at the end of the datasheet
6 Pin Configuration and Functions
YFF Package
12-Pin DSBGA
Top View
RMW Package
12-Pin HotRod
Top View
1
2
3
A
B
C
D
L1
VIN
EN
L1
1
2
10
9
ILIM0
GND
GND
GND
ILIM0
PFM/PWM
FB
ILIM1
8
7
PG
SS
L2
3
4
VOUT
L2
PG
Not to scale
VOUT
SS
Not to scale
Pin Functions
PIN
I/O
DESCRIPTION
NAME
EN
WCSP
A3
HotRod
11
5
I
I
Enable input. (1 enabled, 0 disabled). It must not be left floating
FB
D2
Voltage feedback of adjustable versions, must be connected to VOUT on fixed output
voltage versions1
GND
B1
B2
2,9
10
Ground for Power stage and Control stage
Programmable inrush current limit input works together with lLIM1. See table on page 1.
It must not be left floating
ILIM0
I
I
Programmable inrush current limit input works together with lLIM0
See 效率与输出电流间的关系 on page 1. Do not leave floating
.
(1)
ILIM1
B3
See
L1
L2
A1
C1
C2
C3
D3
A2
D1
1
3
Connection for Inductor
Connection for Inductor
PFM/PWM
PG
6
I
O
I
0 for PFM mode 1 for forced PWM mode. It must not be left floating
Power good open drain output
8
SS
7
Adjustable Soft-Start. If left floating default soft-start time is set
Supply voltage for power stage and control stage
Buck-boost converter output
VIN
12
4
I
VOUT
O
(1) Only available with DSBGA package, for VQFN package ILIM1 is internally connected to voltage level > VIH
4
Copyright © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
7 Specifications
7.1 Absolute Maximum Ratings
over junction temperature range (unless otherwise noted)
(1)
MIN
–0.3
–0.3
–0.3
–40
–40
–65
MAX
7
UNIT
VIN, L1, EN, VOUT, FB, VINA, PFM/PWM
Voltage(2)
L2(3)
L2(4)
7
V
9.5
150
85
Operating junction temperature, TJ
Operating ambient temperature, TA
Storage temperature, Tstg
°C
°C
°C
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground pin.
(3) DC voltage rating.
(4) AC voltage rating.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±1500
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101(2)
±700
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
(1)
See
VIN
IOUT
L
MIN
NOM MAX UNIT
Input voltage
2.5
5.5
0.5
2.2
V
A
Output current
Inductance(2)
Output capacitance(3)
Operating ambient temperature
Operating virtual junction temperature
1
10
1.5
µH
µF
°C
°C
COUT
TA
–40
–40
85
TJ
125
(1) Refer to the Application Information section for further information
(2) Effective inductance value at operating condition. The nominal value given matches a typical inductor to be chosen to meet the
inductance required.
(3) Due to the DC bias effect of ceramic capacitors, the effective capacitance is lower then the nominal value when a voltage is applied.
This is why the capacitance is specified to allow the selection of the nominal capacitor required with the DC bias effect for this type of
capacitor. The nominal value given matches a typical capacitor to be chosen to meet the minimum capacitance required.
7.4 Thermal Information
TPS6305x
THERMAL METRIC(1)
WCSP
12 PINS
89.9
RMW
12 PINS
37.3
30.4
8.0
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
0.7
43.9
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.9
0.4
ψJB
43.7
7.8
RθJC(bot)
n/a
2.5
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
Copyright © 2013–2019, Texas Instruments Incorporated
5
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ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
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7.5 Electrical Characteristics
VIN = 3.6 V, TJ = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
SUPPLY
VIN
Input voltage range
2.5
5.5
V
V
VIN_Min
IOUT
Minimum input voltage to turn on in full load
Output current(1)
IOUT = 500 mA
ILIM0 = VIH, ILIM1 = VIH
2.7
,
500
mA
IOUT = 0 mA, EN = VIN = 3.6 V,
VOUT = 3.3 V
VIN
43
65
10
(2)
IQ
Quiescent current
μA
IOUT = 0 mA, EN = VIN = 3.6 V,
VOUT = 3.3 V
VOUT
(2)
Isd
Shutdown current
EN = 0 V
VIN falling
0.1
1.7
200
140
20
1
μA
V
UVLOTH
UVLOhys
TSD
Undervoltage lockout threshold
Undervoltage lockout hysteresis
Thermal shutdown
1.6
1.2
1.8
mV
°C
°C
Temperature rising
TSD(hys)
Thermal shutdown hysteresis
LOGIC SIGNALS EN, ILIM0, ILIM1
VIH
VIL
High level input voltage
VIN = 2.5 V to 5.5 V
VIN = 2.5 V to 5.5 V
V
V
Low level voltage Input Voltage
0.3
0.1
PFM / PWM, EN, ILIM0, ILIM1 = GND or
VIN
Ilkg
Input leakage current
0.01
μA
POWER GOOD
VOL
Low level voltage
PG sinking current
Input leakage current
Isink = 100 μA
V = 0.3 V
0.3
0.1
0.1
V
IPG
mA
μA
Ilkg
VPG = 3.6 V
0.01
0.8
OUTPUT
VOUT
VFB
Output voltage range
2.5
5.5
V
V
TPS63050 feedback regulation voltage
TPS63050 feedback voltage accuracy
TPS63050 feedback voltage accuracy(3)
TPS63051 output voltage accuracy
TPS63051 output voltage accuracy(3)
Minimum output current to enter PFM mode
TPS63050 feedback input bias current
Input high-side FET on-resistance
Output high-side FET on-resistance
Input low-side FET on-resistance
Output low-side FET on-resistance
VFB
PWM mode
–1.1%
–1%
3.27
1.1%
3%
VFB
PFM mode
VOUT
VOUT
IPWM->PFM
IFB
PWM mode
3.3 3.34
3.3 3.39
150
V
PFM mode
3.27
V
VIN = 3 V; VOUT = 3.3 V
VFB = 0.8 V
mA
nA
10
145
95
100
ISW = 500 mA
ISW = 500 mA
ISW = 500 mA
ISW = 500 mA
mΩ
mΩ
mΩ
mΩ
RDS(on)
170
115
ILIM0 = VIH, ILIM1 = VIH,VIN = 2.7 V to 3
V, VOUT = 3 V
480
550
630
1240
1400
1950
mA
mA
mA
ILIM0 = VIH, ILIM1 = VIH,VIN = 2.7 V to
3.3 V, VOUT = 3.3 V,
IIN_MAX
Input current-limit boost mode
ILIM0 = VIH, ILIM1 = VIH,VIN = 2.7 V to
4.5 V, VOUT = 4.5 V,
(1) For minimum and maximum output current in a specific working point see Figure 1 and Figure 2; and Equation 1 through Equation 4.
(2) Conditions: TJ = –40°C to 85°C
(3) Conditions: f = 2.5 MHz, L = 1.5 µH, COUT = 10 µF
6
Copyright © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
Electrical Characteristics (continued)
VIN = 3.6 V, TJ = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP MAX UNIT
ILIM0 = VIL, ILIM1 = VIL,
VIN = 3 V,VOUT = 3.3 V, (Available for
DBGA only)
0.4×IIN_MAX
ILIM0 = VIH, ILIM1 = VIL,
VIN = 3 V,VOUT = 3.3 V, (Available for
DBGA only)
0.5×IIN_MAX
ISS_IN
Programmable inrush current limit(4)
mA
ILIM0 = VIL, ILIM1 = VIH
VIN = 3 V,VOUT = 3.3 V
,
0.65×IIN_MAX
IIN_MAX
ILIM0 = VIH, ILIM1 = VIH
VIN = 3 V,VOUT = 3.3 V
,
ISS
ISS
Soft-start current TPS63051
Soft-start current TPS63050
1
μA
μA
3.2
VIN = 2.5 V to 5.5 V, IOUT = 500 mA,
PWM mode
Line regulation
Load regulation
0.963
4
mV/V
mV/A
VIN = 3.6 V, IOUT = 0 mA to 500 mA,
PWM mode
(4) For variation of this parameter with Input voltage see Figure 3.
7.6 Switching Characteristics
VIN = 3.6 V, TJ = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
OUTPUT
fs
Switching frequency
2.5
MHz
VOUT = EN = low to high, SS = floating, Buck mode
VIN = 3.6 V, VOUT = 3.3 V, IOUT = 500 mA(1)
280
600
100
tSS
Softstart time
µs
µs
VOUT = EN = low to high, SS = floating, Boost mode
VIN = 2.5 V, VOUT = 3.3 V, IOUT = 500 mA(1)
Time from when EN = high to when device starts
switching
td
Start up delay
(1) For variation of this parameter with Input voltage see Figure 3.
Copyright © 2013–2019, Texas Instruments Incorporated
7
TPS63050, TPS63051
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
www.ti.com.cn
7.7 Typical Characteristics
TPS63051
TPS63051
TA
TA
TA
= -40 °C
= 25 °C
= 85 °C
TA
= -40 °C
= 25 °C
= 85 °C
TA
TA
Input Voltage (V)
Input Voltage (V)
VOUT = 3.3 V
VOUT = 3.3 V
Figure 2. Minimum Average Input Current vs Input Voltage
Figure 1. Maximum Average Input Current vs Input Voltage
TPS63051
ILM0
ILM0
ILM0
= VIL, ILM1 = VIL
= VIH, ILM1 = VIL
= VIL, ILM1 = VIH
Input Voltage (V)
Figure 3. Programmable Average Input Current vs Input Voltage(1)
(1) All options only available with the DSBGA package. For VQFN package ILIM1 is internally connected to voltage level > VIH
8
Copyright © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
8 Detailed Description
8.1 Overview
The TPS6305x devices use 4 internal N-channel MOSFETs to maintain synchronous power conversion at all
possible operating conditions. This enables the device to keep high efficiency over the complete input voltage
and output power range. To regulate the output voltage at all possible input voltage conditions, the device
automatically switches from buck operation to boost operation and back as required by the configuration. It
always uses one active switch, one rectifying switch, one switch held on, and one switch held off. Therefore, it
operates as a buck converter when the input voltage is higher than the output voltage, and as a boost converter
when the input voltage is lower than the output voltage. There is no mode of operation in which all 4 switches are
switching at the same time. Keeping one switch on and one switch off eliminates their switching losses. The
RMS current through the switches and the inductor is kept at a minimum, to minimize switching and conduction
losses. Controlling the switches this way allows the converter to always keep higher efficiency.
The device provides a seamless transition from buck to boost or from boost to buck operation.
8.2 Functional Block Diagrams
L1
L2
VIN
VOUT
Current
Sensor
GND
GND
VIN
Gate
Control
VOUT
_
_
+
SS
Modulator
Oscillator
FB
+
ILIM1
ILIM0
PG
+
-
VREF
Device
Control
PFM/PWM
EN
Temperature
Control
GND
GND
GND
Figure 4. TPS63050 Block Diagram
Copyright © 2013–2019, Texas Instruments Incorporated
9
TPS63050, TPS63051
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
www.ti.com.cn
Functional Block Diagrams (continued)
L1
L2
VIN
VOUT
Current
Sensor
GND
GND
VIN
Gate
Control
VOUT
FB
_
_
+
SS
Modulator
Oscillator
+
ILIM1
ILIM0
PG
+
-
Device
Control
VREF
PFM/PWM
EN
Temperature
Control
GND
GND
GND
Figure 5. TPS63051 Block Diagram
10
Copyright © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
8.3 Feature Description
8.3.1 Power Good
The TPS6305x devices have a PG output. The power good goes high impedance once the output is above 95%
of the nominal voltage, and is driven low once the output voltage falls below typically 90% of the nominal voltage.
The PG pin is an open drain output and is specified to sink up to 0.1 mA. The power good output requires a
pullup resistor connecting to any voltage rail less than 5.5 V. The power good is valid as long as the converter is
enabled and VIN is present. The power good goes low when the device is in undervoltage lockout, in thermal
shutdown or in current limit.
If EN is pulled low and one of the pins ILIM0 or ILIM1 is high, then the PG pin is low. If both pins, ILIM0 and ILIM1 are
low, the PG is open drain. In this case the PG pin, follows its pullup voltage. If this is not desired, one of the two
pins ILIM0 or ILIM1, must be set high. Table 1 lists the PG pin functionality.
Table 1. Power Good Settings
EN
0
ILIM1
ILIM0
PG
1
1
0
0
1
0
1
0
0
0
0
0
0
0
Open Drain
8.3.2 Overvoltage Protection
Overvoltage protection is implemented to limit the maximum output voltage. In case of overvoltage condition, the
voltage amplifier regulates the output voltage to typically 6.7 V.
8.3.3 Undervoltage Lockout (UVLO)
To avoid mis-operation of the device at low input voltages, an undervoltage lockout is included. UVLO shuts
down the device at input voltages lower than typically 1.7 V with a 200-mV hysteresis.
8.3.4 Thermal Shutdown
The device goes into thermal shutdown once the junction temperature exceeds typically 140°C with a 20°C
hysteresis.
8.3.5 Soft Start
To minimize inrush current and output voltage overshoot during start up, the device has a soft start. At turn on,
the input current raises monotonically until the output voltage reaches regulation. The TPS6305x devices charge
the soft start capacitor, at the SS pin, with a constant current of typically 1 µA. The input current follows the
current used to charge the capacitor at the SS pin. The soft start operation is completed once the voltage at the
SS pin has reached typically 1.3 V. Figure 3 shows the value of the soft start capacitor in respect to the soft-start
time.
The soft-start time is the time from when the EN pin is asserted to when the output voltage has reached 90% of
its nominal value. There is typically a 100-µs delay time from EN pin assertion to the start of the switching
activity. The soft-start time depends on the load current, the input voltage, and the output capacitor. The soft-start
time in boost mode is longer then the time in buck mode and it also depends on the load current, input voltage
and output capacitor.
The soft-start time in Figure 3 is referred to typical application with 10-µF effective output capacitance.
The inductor current is able to increase and always assure a soft start unless a real short circuit is applied at the
output.
8.3.6 Short Circuit Protection
The TPS6305x devices provide short circuit protection. When the output voltage does not increase above 1.2 V,
a short circuit is detected and the output current is limited to 1.5 A.
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8.4 Device Functional Modes
8.4.1 Control Loop Description
0.8V
Ramp and Clock
Generator
Figure 6. Average Current Mode Control
The controller circuit of the device is based on an average current mode topology. The average inductor current
is regulated by a fast current regulator loop which is controlled by a voltage control loop. Figure 6 shows the
control loop.
The noninverting input of the transconductance amplifier, gmv, is assumed to be constant. The output of gmv
defines the average inductor current. The inductor current is reconstructed by measuring the current through the
high side buck MOSFET. This current corresponds exactly to the inductor current in boost mode. In buck mode
the current is measured during the on time of the same MOSFET. During the off time, the current is
reconstructed internally starting from the peak value at the end of the on time cycle. The average current and the
feedback from the error amplifier gmv forms the correction signal gmc. This correction signal is compared to the
buck and the boost sawtooth ramp giving the PWM signal. Depending on which of the two ramps the gmc output
crosses either the Buck or the Boost stage is initiated. When the input voltage is close to the output voltage, one
buck cycle is always followed by a boost cycle. In this condition, no more than three cycles in a row of the same
mode are allowed. This control method in the buck-boost region ensures a robust control and the highest
efficiency.
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Device Functional Modes (continued)
8.4.2 Power Save Mode Operation
Heavy Load transient step
PFM mode at light load
current
Comparator High
Vo+1.3%*Vo
Vo
30mV ripple
Comparator low
PWM mode
Absolute Voltage drop
with positioning
Figure 7. Power Save Mode Operation
Depending on the load current, the device works in PWM mode at load currents of approximately 350 mA or
higher to provide the best efficiency over the complete load range. At lighter loads, the device switches
automatically into Power Save Mode to reduce power consumption and extend battery life. The PFM/PWM pin is
used to select between the two different operation modes. To enable Power Save Mode, the PFM/PWM pin must
be set low.
During Power Save Mode, the part operates with a reduced switching frequency and lowest supply current to
maintain high efficiency. The output voltage is monitored with a comparator at every clock cycle by the thresholds
comp low and comp high. When the device enters Power Save Mode, the converter stops operating and the
output voltage drops. The slope of the output voltage depends on the load and the output capacitance. When the
output voltage reaches the comp low threshold, at the next clock cycle the device ramps up the output voltage
again, by starting operation. Operation can last for one or several pulses until the comp high threshold is
reached. At the next clock cycle, if the load is still lower than 150 mA, the device switches off again and the
same operation is repeated. If at the next clock cycle the load is above 150 mA, the device automatically
switches to PWM mode.
To keep high efficiency in PFM mode, there is only one comparator active to keep the output voltage regulated.
The AC ripple in this condition is increased, compared to the PWM mode. The amplitude of this voltage ripple in
the worst case scenario is 50 mV peak to peak, (typically 30 mV peak-to-peak), with 10 µF of effective output
capacitance. To avoid a critical voltage drop when switching from 0 A to full load, the output voltage in PFM
mode is typically 1.5% above the nominal value in PWM mode. This is called Dynamic Voltage Positioning and
allows the converter to operate with a small output capacitor and still have a low absolute voltage drop during
heavy load transients.
Power Save Mode is disabled by setting the PFM/PWM pin high.
8.4.3 Adjustable Current Limit
The TPS6305x devices have an internal user programmable current limit that monitors the input current during
start-up. This prevents high inrush current protecting the device and the application. During start-up the input
current does not exceed the current limit that is set by ILIM0 pin and ILIM1 pin. Depending on the logic level applied
at these two pins, switching between four different current limit-levels is possible. The variation of those values
over input voltage and temperature is shown in Figure 1 through Figure 2. Adjusting the soft-start time further
using the soft-start capacitor is possible.
ILIM0 and ILIM1 set the current limit as listed in Table 2.
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Device Functional Modes (continued)
Table 2. Adjustable Current Limit
ILIM1
Low
ILIM0
Low
CURRENT LIMIT SET (WCSP)
0.4 × IIN_MAX
CURRENT LIMIT SET (HotRod)
Not Available
Low
High
Low
High
0.5 × IIN_MAX
0.65 × IIN_MAX
IIN_MAX
Not Available
High
High
0.65 × IIN_MAX
IIN_MAX
The ILIM0, ILIM1 pins can be changed during operation.
Given the curves provided in Figure 1 through Figure 2, calculating the output current in the different condition in
boost mode is possible using Equation 1 and Equation 2 and in buck mode using Equation 3 and Equation 4.
V
- V
OUT
V
IN
Duty Cycle Boost
D =
OUT
IOUT = 0 x IIN (1-D)
(1)
Output Current Boost
where
•
•
η = Estimated converter efficiency (use the number from the efficiency curves or 0.9 as an assumption)
IIN = Minimum average input current (Figure 2 to Figure 2)
(2)
(3)
V
OUT
V
Duty Cycle Buck
D =
IN
IOUT = ( 0 x IIN ) / D
Output Current Buck
where
•
For η, use the number from the efficiency curves or 0.9 as an assumption.
(4)
8.4.4 Device Enable
The device starts operation when the EN pin is set high. The device enters shutdown mode when the EN pin is
set low. In shutdown mode, the regulator stops switching, all internal control circuitry is switched off, and the load
is disconnected from the input.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers must
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TPS6305x is a high efficiency, low quiescent current buck-boost converter suitable for applications where
the input voltage is higher or lower than the output voltage. Continuous output current can go as high as 500 mA
in boost mode and as high as 1 A in buck mode. The maximum average current in the switches is limited to a
typical value of 1 A.
The efficiency measurements
9.2 Typical Application
L1
1.5 µH
TPS63051
L1
L2
2.5 V to
VIN
5.5 V
3.3 V/ 500mA
VIN
EN
VOUT
FB
R2
VOUT
C1
10µF
C2
C3
1MΩ
10µF
10µF
ILIM0
PG
VIH or VIL
PFM/
PWM
ILIM1
SS
VIH or VIL
GND
C4
1nF
Figure 8. Parameter Measurement Circuit (WCSP)
L1
1.5 µH
TPS63050
L1
L2
2.5 V to
5.5 V
3.3 V/ 500mA
VIN
EN
VOUT
R1
560kΩ
VOUT
VIN
C1
10µF
C2
C3
R3
10µF
10µF
FB
ILIM0
R2
180kΩ
C5
10pF
1MΩ
VIH or VIL
PFM/
PWM
PG
SS
GND
C4
1nF
Figure 9. Parameter Measurement Circuit (HotRod)
9.2.1 Design Requirements
The design guidelines provide a component selection to operate the device within the recommended operating
conditions.
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Typical Application (continued)
9.2.2 Detailed Design Procedure
9.2.2.1 Custom Design With WEBENCH® Tools
Click here to create a custom design using the TPS63050 device with the WEBENCH® Power Designer.
Click here to create a custom design using the TPS63051 device with the WEBENCH® Power Designer.
1. Start by entering the input voltage (VIN), output voltage (VOUT), and output current (IOUT) requirements.
2. Optimize the design for key parameters such as efficiency, footprint, and cost using the optimizer dial.
3. Compare the generated design with other possible solutions from Texas Instruments.
The WEBENCH Power Designer provides a customized schematic along with a list of materials with real-time
pricing and component availability.
In most cases, these actions are available:
•
•
•
•
Run electrical simulations to see important waveforms and circuit performance
Run thermal simulations to understand board thermal performance
Export customized schematic and layout into popular CAD formats
Print PDF reports for the design, and share the design with colleagues
Get more information about WEBENCH tools at www.ti.com/WEBENCH.
The first step is the selection of the output filter components, listed in Table 3. To simplify this process, Table 4
outlines possible inductor and capacitor value combinations.
Table 3. Components for Application Characteristic Curves
REFERENCE
DESCRIPTION
MANUFACTURER
TPS6305x
Texas Instruments
L1
1.5 µH, 2.1 A, 108 mΩ
10 μF, 6.3 V, 0603, X5R ceramic
CSS
1269AS-H-1R5M, TOKO
GRM188R60J106ME84D, Murata
C1, C2, C3
C4
C5
R1
R2
R3
10pF, only needed for the HotRod package version to filter ground noise when using external resistor divider
Depending on the output voltage of TPS6305x, 0 Ω with TPS63051
Depending on the output voltage of TPS6305x, not used withTPS63051
1 MΩ
9.2.2.2 Output Filter Design
Table 4. Matrix of Output Capacitor and Inductor Combinations
NOMINAL
INDUCTOR
NOMINAL OUTPUT CAPACITOR VALUE [µF](2)
VALUE [µH](1)
10
20
44
66
100
1
+
+
+
+
+
+
+
+
+
(3)
1.5
2.2
+
+
(1) Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20% and –30%.
(2) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by 20% and –50%.
(3) Typical application. Other check mark indicates recommended filter combinations
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9.2.2.3 Inductor Selection
The inductor selection is affected by several parameter like inductor ripple current, output voltage ripple,
transition point into power save mode, and efficiency. See Table 5 for typical inductors.
Table 5. List of Recommended Inductors
INDUCTOR VALUE
1 µH
COMPONENT SUPPLIER(1)
TOKO 1286AS-H-1R0M
TOKO, 1286AS-H-1R5M
TOKO, 1269AS-H-1R5M
TOKO 1286AS-H-2R2M
SIZE (L × W × H mm)
2 × 1.6 × 1.2
Isat / DCR
2.1 A / 68 mΩ
2.5 A / 95 mΩ
2.1 A / 90 mΩ
2 A / 160 mΩ
1.5 µH
2 × 1.6 × 1.2
1.5 µH
2.5 × 2 × 1
2.2 µH
2 × 1.6 × 1.2
(1) See the Third Party Product Disclaimer section.
For high efficiencies, the inductor must have a low dc resistance to minimize conduction losses. Especially at
high-switching frequencies, the core material has a high impact on efficiency. When using small chip inductors,
the efficiency is reduced mainly due to higher inductor core losses. This needs to be considered when selecting
the appropriate inductor. The inductor value determines the inductor ripple current. The larger the inductor value,
the smaller the inductor ripple current and the lower the conduction losses of the converter. Conversely, larger
inductor values cause a slower load transient response. To avoid saturation of the inductor, the peak current for
the inductor in steady state operation is calculated using Equation 6. Only the equation which defines the switch
current in boost mode is shown, because this provides the highest value of current and represents the critical
current value for selecting inductor.
V
- V
OUT
V
IN
Duty Cycle Boost
D =
OUT
where
•
D = Duty Cycle in Boost mode
(5)
(6)
Iout
Vin ´ D
IPEAK
=
+
η ´ (1 - D)
2 ´ f ´ L
where
•
η = Estimated converter efficiency (use the number from the efficiency curves or 0.80 as an assumption)
f = Converter switching frequency (typical 2.5MHz)
L = Inductor value
NOTE
The calculation must be done for the minimum input voltage that is possible to have in
boost mode.
Calculating the maximum inductor current using the actual operating conditions gives the minimum saturation
current of the inductor needed. It's recommended to choose an inductor with a saturation current 20% higher
than the value calculated using Equation 6. Possible inductors are listed in Table 5.
9.2.2.4 Capacitor selection
9.2.2.4.1 Input Capacitor
At least a 10-μF input capacitor is recommended to improve line transient behavior of the regulator and EMI
behavior of the total power supply circuit. An X5R or X7R ceramic capacitor placed as close as possible to the
VIN and GND pins of the IC is recommended. This capacitance can be increased without limit.
9.2.2.4.2 Output Capacitor
Use of small ceramic capacitors placed as close as possible to the VOUT and PGND pins of the IC, is
recommended for the output capacitor. The recommended nominal output capacitance value is 10 µF with a
variance as outlined in Table 4.
There is also no upper limit for the output capacitance value. Larger capacitors causes lower output voltage
ripple as well as lower output voltage drop during load transients.
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9.2.2.5 Setting the Output Voltage
When the adjustable output voltage version TPS63050 is used, the output voltage is set by the external resistor
divider. The resistor divider must be connected between VOUT, FB and GND. When the output voltage is
regulated properly, the typical value of the voltage at the FB pin is 800 mV. The current through the resistive
divider must be 100 times greater than the current into the FB pin. The typical current into the FB pin is 0.1 μA,
and the voltage across the resistor between FB and GND, R2, is typically 800 mV. Based on these two values,
the recommended value for R2 must be lower than 200 kΩ, in order to set the divider current at 3 μA or higher. It
is recommended to keep the value for this resistor in the range of 200 kΩ. The value of the resistor connected
between VOUT and FB, R1, depending on the needed output voltage (VOUT), can be calculated using
Equation 7:
æ
ç
è
ö
VOUT
VFB
R1 = R2 ×
- 1
÷
ø
(7)
When using the HotRod package version of the TPS63050, it is recommended to add capacitor C5, as shown in
Figure 9. The capacitor on the feedback node is required to help filtering ground noise and matching the
efficiency result shown in the Application Curves paragraph.
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9.2.3 Application Curves
VIN = 2.8V, VOUT = 3.3V
V
VIN = 2.8V, VOUT = 3.3V
V
IN = 3.6V, VOUT = 3.3V
IN = 3.6V, VOUT = 3.3V
TPS63051
TPS63051
Output Current (mA)
Output Current (mA)
PFM/PWM = Low
VOUT = 3.3 V
PFM/PWM = High
VOUT = 3.3 V
Figure 10. Efficiency vs Output Current
Figure 11. Efficiency vs Output Current
VIN = 2.5V, VOUT = 2.5V
VIN = 2.5V, VOUT = 2.5V
V
IN = 4.8V, VOUT = 2.5V
VIN = 2.5V, VOUT = 4.5V
V
IN = 4.8V, VOUT = 2.5V
VIN = 2.5V, VOUT = 4.5V
V
IN = 4.8V, VOUT = 4.5V
V
IN = 4.8V, VOUT = 4.5V
TPS63050
TPS63050
Output Current (mA)
Output Current (mA)
PFM/PWM = Low
VOUT = 2.5 V, 4.5 V
PFM/PWM = High
VOUT = 2.5 V, 4.5 V
Figure 12. Efficiency vs Output Current
Figure 13. Efficiency vs Output Current
IOUT = 10mA
IOUT = 10mA
= 500mA
IOUT
IOUT = 620mA
= 500mA
IOUT
IOUT = 620mA
TPS63051
TPS63051
Input Voltage (V)
Input Voltage (V)
PFM/PWM = High
VOUT= 3.3 V
PFM/PWM = Low
VOUT= 3.3 V
Figure 15. Efficiency vs Input Voltage
Figure 14. Efficiency vs Input Voltage
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IOUT = 10mA
= 500mA
IOUT = 10mA
= 500mA
IOUT
IOUT = 620mA
IOUT
IOUT = 620mA
TPS63050
TPS63050
Input Voltage (V)
Input Voltage (V)
PFM/PWM = High
VOUT = 2.5 V
PFM/PWM = Low
VOUT = 2.5 V
Figure 17. Efficiency vs Input Voltage
Figure 16. Efficiency vs Input Voltage
IOUT = 10mA
IOUT = 10mA
= 500mA
IOUT
IOUT = 620mA
= 500mA
IOUT
IOUT = 620mA
TPS63050
TPS63050
Input Voltage (V)
Input Voltage (V)
PFM/PWM = Low
VOUT = 4.5 V
PFM/PWM =High
VOUT= 4.5 V
Figure 18. Efficiency vs Input Voltage
Figure 19. Efficiency vs Input Voltage
Power Save enabled
Power Save disabled
Power Save enabled
Power Save disabled
TPS63051
TPS63050
Output Current (A)
Output Current (A)
VIN = 2.5 V
VIN = 3.3 V
Figure 20. Output Voltage vs Output Current
Figure 21. Output Voltage vs Output Current
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Power Save enabled
Power Save disabled
L2
L1
V
OUT_Ripple
50mV/div
TPS63050
Output Current (A)
TPS63051
Time 2µs/div
VIN = 4.5 V
VIN = 3.3 V
IOUT = 145 mA
Figure 22. Output Voltage vs Output Current
Figure 23. Output Voltage ripple in Buck-Boost mode and
PFM to PWM transition
L2
L1
L2
L1
V
50mV/div
OUT_Ripple
V
50mV/div
TPS63051
OUT_Ripple
Time 2µs/div
TPS63051
Time 2µs/div
VIN = 2.8 V
IOUT = 16 mA
VIN = 4.2 V
IOUT = 16 mA
Figure 24. Output Voltage Ripple in Boost Mode and PFM
to PWM Transition
Figure 25. Output Voltage Ripple in Buck Mode and PFM
to PWM Transition
L2 2V/div
L2 2V/div
L1 2V/div
L1 2V/div
V
20mV/div
OUT
V
20mV/div
OUT
Iinductor 500mA/div
Iinductor 500mA/div
TPS63051
TPS63051
Time 400ns/div
Time 400ns/div
VIN = 2.5 V
IOUT = 300 mA
VIN = 4.5 V
IOUT = 300 mA
Figure 26. Switching Waveform in Boost Mode and PWM
Figure 27. Switching Waveform in Buck Mode and PWM
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L2 2V/div
Output Current
200 mA/div, DC
Output Voltage
50 mV/div, AC
L1 2V/div
V
20mV/div
OUT
Iinductor 500mA/div
TPS63051
TPS63051
Time 1 ms/div
Time 400ns/div
VIN = 3.4 V
IOUT = 300 mA
VIN = 2.8 V
Load change from 0 mA to 300 mA
Figure 28. Switching Waveform in Buck-Boost Mode and
PWM
Figure 29. Load Transient Response
Output Current
200 mA/div, DC
Input Voltage
200 mV/div,
Offset 3V
Output Voltage
50 mV/div, AC
Output Voltage
20 mV/div
TPS63051
Time 1 ms/div
Time 1 ms/div
TPS63051
VIN = 3.6 V
Load change from 0 mA to 300 mA
VOUT = 3.3 V
IOUT = 500 mA
Figure 30. Load Transient Response
Figure 31. Line Transient Response
Enable
5 V/div, DC
Enable
5 V/div, DC
Output Voltage
2V/div, DC
Output Voltage
2V/div, DC
Inductor Current
500 mA/div, DC
Inductor Current
500 mA/div, DC
TPS63051
Time 400 ms/div
TPS63051
Time 400 ms/div
VOUT = 3.3 V
VIN = 2.5 V
IOUT = 0 mA
VOUT = 3.3 V
VIN = 4.2 V
IOUT = 0 mA
Figure 32. Start Up After Enable
Figure 33. Start Up After Enable
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10 Power Supply Recommendations
The TPS6305x device family has no special requirements for its input power supply. The input power supply
output current needs to be rated according to the supply voltage, output voltage and output current of the
TPS6305x devices.
11 Layout
11.1 Layout Guidelines
The PCB layout is an important step to maintain the high performance of the TPS6305x devices.
•
Place input and output capacitors as close as possible to the IC. Traces need to be kept short. Routing wide
and direct traces to the input and output capacitor results in low-trace resistance and low parasitic inductance.
•
•
•
Use a common-power GND.
The sense trace connected to FB is signal trace. Keep these traces away from L1 and L2 nodes.
For the HotRod package option it is important to add a capacitor between FB node and ground to filter ground
noise and to match efficiency results documented in these datasheet.
11.2 Layout Example (WCSP)
C4
R1
R2
VIN
VOUT
C2
C1
C3
GND
L1
Figure 34. TPS6305x Layout (WCSP)
11.3 Layout Example (HotRod)
AGND
PAC802
C4
PA
R2
R1
P
VOUT
COR1
P
COU1
VIN
C3
PAC401
PAC402
PAC101
PAC202
C1
C2
COC2
COGC4ND
GND
PAL102
L1
Figure 35. TPS6305x Layout (HotRod)
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11.4 Thermal Considerations
Implementation of integrated circuits in low-profile and fine-pitch surface-mount packages typically requires
special attention to power dissipation. Many system-dependent issues such as thermal coupling, airflow, added
heat sinks and convection surfaces, and the presence of other heat-generating components affect the
powerdissipation limits of a given component.
Two basic approaches for enhancing thermal performance are listed below:
•
•
Improving the power dissipation capability of the PCB design
Introducing airflow in the system
For more details on how to use the thermal parameters, see the application notes: Thermal Characteristics
(SZZA017), and Semiconductor and IC Package Thermal Metrics (SPRA953)
12 器件和文档支持
12.1 使用 WEBENCH® 工具创建定制设计
单击此处，使用 TPS63050 器件并借助 WEBENCH® 电源设计器创建定制设计方案。
单击此处，使用 TPS63051 器件并借助 WEBENCH® 电源设计器创建定制设计方案。
1. 首先输入输入电压 (VIN)、输出电压 (VOUT) 和输出电流 (IOUT) 要求。
2. 使用优化器拨盘优化该设计的关键参数，如效率、尺寸和成本。
3. 将生成的设计与德州仪器 (TI) 的其他可行的解决方案进行比较。
WEBENCH 电源设计器可提供定制原理图以及罗列实时价格和组件供货情况的物料清单。
在多数情况下，可执行以下操作：
•
•
•
•
运行电气仿真，观察重要波形以及电路性能
运行热性能仿真，了解电路板热性能
将定制原理图和布局方案以常用 CAD 格式导出
打印设计方案的 PDF 报告并与同事共享
有关 WEBENCH 工具的详细信息，请访问 www.ti.com.cn/WEBENCH。
12.2 器件支持
12.2.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此类
产品或服务单独或与任何 TI 产品或服务一起的表示或认可。
12.3 相关链接
下表列出了快速访问链接。类别包括技术文档、支持与社区资源、工具和软件，以及申请样片或购买产品的快速链
接。
表 6. 相关链接
器件
产品文件夹
请单击此处
请单击此处
样片与购买
请单击此处
请单击此处
技术文档
请单击此处
请单击此处
工具与软件
请单击此处
请单击此处
支持和社区
请单击此处
请单击此处
TPS63050
TPS63051
24
版权 © 2013–2019, Texas Instruments Incorporated
TPS63050, TPS63051
www.ti.com.cn
ZHCSBD3D –JULY 2013–REVISED AUGUST 2019
12.4 接收文档更新通知
要接收文档更新通知，请导航至 TI.com.cn 上的器件产品文件夹。单击右上角的通知我 进行注册，即可每周接收产
品信息更改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
12.5 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.6 商标
E2E is a trademark of Texas Instruments.
WEBENCH is a registered trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.7 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
12.8 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页面包含机械、封装和可订购信息。这些信息是指定器件的最新可用数据。数据如有变更，恕不另行通知，且
不会对此文档进行修订。如需获取此数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2013–2019, Texas Instruments Incorporated
25
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS63050RMWR
TPS63050RMWT
TPS63050YFFR
TPS63050YFFT
TPS63051RMWR
TPS63051RMWT
TPS63051YFFR
TPS63051YFFT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
VQFN-HR
VQFN-HR
DSBGA
RMW
RMW
YFF
12
12
12
12
12
12
12
12
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
F630
NIPDAU
SNAGCU
SNAGCU
NIPDAU
NIPDAU
SNAGCU
SNAGCU
F630
63050
63050
F631
DSBGA
YFF
VQFN-HR
VQFN-HR
DSBGA
RMW
RMW
YFF
F631
63051
63051
DSBGA
YFF
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2019
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS63050RMWR
TPS63050RMWT
VQFN-
HR
RMW
RMW
12
12
3000
250
180.0
8.4
2.8
2.8
1.0
4.0
8.0
Q2
VQFN-
HR
180.0
8.4
2.8
2.8
1.0
4.0
8.0
Q2
TPS63050YFFR
TPS63050YFFT
TPS63051RMWR
DSBGA
DSBGA
YFF
YFF
12
12
12
3000
250
180.0
180.0
180.0
8.4
8.4
8.4
1.39
1.39
2.8
1.79
1.79
2.8
0.7
0.7
1.0
4.0
4.0
4.0
8.0
8.0
8.0
Q1
Q1
Q2
VQFN-
HR
RMW
3000
TPS63051RMWT
VQFN-
HR
RMW
12
250
180.0
8.4
2.8
2.8
1.0
4.0
8.0
Q2
TPS63051YFFR
TPS63051YFFT
DSBGA
DSBGA
YFF
YFF
12
12
3000
250
180.0
180.0
8.4
8.4
1.39
1.39
1.79
1.79
0.7
0.7
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Aug-2019
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS63050RMWR
TPS63050RMWT
TPS63050YFFR
TPS63050YFFT
TPS63051RMWR
TPS63051RMWT
TPS63051YFFR
TPS63051YFFT
VQFN-HR
VQFN-HR
DSBGA
RMW
RMW
YFF
12
12
12
12
12
12
12
12
3000
250
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
182.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
20.0
3000
250
DSBGA
YFF
VQFN-HR
VQFN-HR
DSBGA
RMW
RMW
YFF
3000
250
3000
250
DSBGA
YFF
Pack Materials-Page 2
PACKAGE OUTLINE
YFF0012
DSBGA - 0.625 mm max height
SCALE 8.000
DIE SIZE BALL GRID ARRAY
A
B
E
BALL A1
CORNER
D
0.625 MAX
C
SEATING PLANE
0.05 C
BALL TYP
0.30
0.12
0.8 TYP
0.4 TYP
D
C
B
SYMM
1.2
TYP
D: Max = 1.716 mm, Min =1.656 mm
E: Max = 1.316 mm, Min =1.256 mm
A
0.4 TYP
1
2
3
0.3
12X
0.015
0.2
SYMM
C A
B
4222191/A 07/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
YFF0012
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
3
12X ( 0.23)
(0.4) TYP
1
2
A
B
C
SYMM
D
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
0.05 MAX
0.05 MIN
METAL UNDER
SOLDER MASK
(
0.23)
METAL
(
0.23)
SOLDER MASK
OPENING
SOLDER MASK
OPENING
NON-SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
4222191/A 07/2015
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information,
see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).
www.ti.com
EXAMPLE STENCIL DESIGN
YFF0012
DSBGA - 0.625 mm max height
DIE SIZE BALL GRID ARRAY
(0.4) TYP
(R0.05) TYP
12X ( 0.25)
1
2
3
A
(0.4) TYP
B
SYMM
METAL
TYP
C
D
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
4222191/A 07/2015
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
www.ti.com
PACKAGE OUTLINE
RMW0012A
VQFN - 1 mm max height
SCALE 4.500
PLASTIC QUAD FLAT PACK - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
2.6
2.4
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
(0.2)
TYP
2X 0.5
5
6
7
4
6X 0.5
SYMM
2X
1.5
1
10
0.3
0.2
12X
12
SYMM
11
0.1
0.05
C B
C
A
0.5
0.3
0.5
0.3
11X
4221400/A 07/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RMW0012A
VQFN - 1 mm max height
PLASTIC QUAD FLAT PACK - NO LEAD
SYMM
12
11
12X (0.6)
12X (0.25)
1
10
SYMM
(2.3)
8X (0.5)
4
7
5
6
(2.3)
LAND PATTERN EXAMPLE
SCALE:20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
SOLDER MASK
OPENING
METAL
UNDER SOLDER MASK
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4221400/A 07/2014
NOTES: (continued)
3. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271).
www.ti.com
EXAMPLE STENCIL DESIGN
RMW0012A
VQFN - 1 mm max height
PLASTIC QUAD FLAT PACK - NO LEAD
SYMM
12
11
12X (0.6)
12X (0.25)
1
10
SYMM
(2.3)
8X (0.5)
4
7
5
6
(2.3)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:20X
4221400/A 07/2014
NOTES: (continued)
4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
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TI 针对 TI 产品发布的适用的担保或担保免责声明。
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