TPS65033000QRGERQ1 [TI]

TPS650330-Q1 Automotive Camera PMIC;


型号：	TPS65033000QRGERQ1
厂家：	TEXAS INSTRUMENTS
描述：	TPS650330-Q1 Automotive Camera PMIC 输入元件集成电源管理电路
文件：	总9页 (文件大小：1150K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TPS650330-Q1

SLVSF40 –APRIL 2019

TPS650330-Q1 Automotive Camera PMIC

1 Device Overview

1.1 Features

– Spread-Spectrum Clock (SSC) generation for

reduced EMI

– 2.3-MHz Forced fixed switching frequency PWM

operation

• Qualified for automotive applications

• AEC-Q100 grade 1 qualified

– -40°C to +125°C ambient operating temperature

range

• Three step-down converters:

• One low dropout (LDO) regulator:

– V_INrange from 3.0 V to 5.5 V

– Low noise

– BUCK1 V_INrange from 4 V to 18.3 V

– BUCK1 output current up to 1500-mA

– BUCK2 and BUCK3 V_INrange from 3.0 V to 5.5

– Adjustable output voltage via I²C

– Up to 300-mA output current

• 4.0-mm × 4.0-mm 24-Pin VQFN with wettable

flanks

– BUCK2 and BUCK3 output current up to 1200-

1.2 Applications

•

Automotive camera modules

–

Surround view camera modules

Rear view camera modules

Driver monitor camera modules

Power over coax (POC) camera modules

E-Mirror camera modules

1.3 Description

The TPS650330-Q1 device is a highly integrated power management IC for automotive camera modules.

This device combines three step down converters and one low-dropout (LDO) regulator. The BUCK1 step-

down converter has an input voltage range up to 18.3 V for connections to Power over Coax (PoC). All

converters operate in a forced fixed-frequency PWM mode. The LDO can supply 300 mA and operate with

an input voltage range from 3.0 V to 5.5 V. The step-down converters and the LDO have separate voltage

inputs that enable maximum design and sequencing flexibility.

The TPS650330-Q1 is available in a 24-pin VQFN package (4.0 mm × 4.0 mm).

Table 1-1. Device Information⁽¹⁾

PART NUMBER

TPS650330-Q1

PACKAGE

BODY SIZE (NOM)

4.0 mm × 4.0 mm

VQFN (24)

(1) For all available packages, see the orderable addendum at the end of the data sheet.

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of

development. Subject to change or discontinuance without notice.

TPS650330-Q1

SLVSF40 –APRIL 2019

www.ti.com

1.4 Application Circuit

VIN = 4V to 18.3V

BUCK1

(1.5 A)

3.3 V

MCU

(Optional)

BUCK2

1.8 V

Serializer

(1200 mA)

Camera PMIC

BUCK3

1.2 V

Camera

Sensor

Module

(1200 mA)

2.8 V

LDO

(300 mA)

I2C

SLAVE

Figure 1-1. TPS650330-Q1 Application Circuit

Device Overview

Submit Documentation Feedback

Product Folder Links: TPS650330-Q1

TPS650330-Q1

www.ti.com

SLVSF40 –APRIL 2019

Table of Contents

Device Overview ......................................... 1

Device and Documentation Support................. 5

1.1 Features .............................................. 1

1.2 Applications........................................... 1

1.3 Description............................................ 1

1.4 Application Circuit .................................... 2

Revision History ......................................... 4

3.1

Receiving Notification of Documentation Updates ... 5

3.2 Community Resources ............................... 5

3.3 Trademarks ........................................... 5

3.4 Electrostatic Discharge Caution ...................... 5

3.5 Glossary .............................................. 5

Table of Contents

Submit Documentation Feedback

Product Folder Links: TPS650330-Q1

TPS650330-Q1

SLVSF40 –APRIL 2019

www.ti.com

2 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

DATE

REVISION

NOTES

November 2017

Initial Release

Revision History

Submit Documentation Feedback

Product Folder Links: TPS650330-Q1

TPS650330-Q1

www.ti.com

SLVSF40 –APRIL 2019

3 Device and Documentation Support

3.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the

upper right corner, click on Alert me to register and receive a weekly digest of any product information that

has changed. For change details, review the revision history included in any revised document.

3.2 Community Resources

3.2.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES

NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR

SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR

SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

3.3 Trademarks

All trademarks are the property of their respective owners.

3.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

3.5 Glossary

TI Glossary This glossary lists and explains terms, acronyms, and definitions.

Device and Documentation Support

Submit Documentation Feedback

Product Folder Links: TPS650330-Q1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Aug-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

PTPS65033000RGERQ1

ACTIVE

VQFN

RGE

3000

TBD

Call TI

-40 to 125

TPS65033000QRGERQ1

TPS65033000QRGETQ1

PREVIEW

VQFN

RGE

3000

250

TBD

Call TI

-40 to 125

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

10-Aug-2020

Addendum-Page 2

GENERIC PACKAGE VIEW

RGE 24

VQFN - 1 mm max height

PLASTIC QUAD FLATPACK - NO LEAD

Images above are just a representation of the package family, actual package may vary.

Refer to the product data sheet for package details.

4204104/H

IMPORTANT NOTICE AND DISCLAIMER

TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE

DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”

AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY

IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD

PARTY INTELLECTUAL PROPERTY RIGHTS.

These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate

TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable

standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you

permission to use these resources only for development of an application that uses the TI products described in the resource. Other

reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third

party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,

damages, costs, losses, and liabilities arising out of your use of these resources.

TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on

ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable

warranties or warranty disclaimers for TI products.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

TPS65033000QRGERQ1 [TI]

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