TPS65680 [TI]
用于 GOA/GIP 显示并具有 OCP 的 2 路输入、18 通道可配置电平转换器;
| 型号： | TPS65680 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 用于 GOA/GIP 显示并具有 OCP 的 2 路输入、18 通道可配置电平转换器 转换器 电平转换器 |
| 文件： | 总9页 (文件大小：375K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Support &
Community
Product
Folder
Order
Now
Tools &
Software
Technical
Documents
TPS65680
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
具有过流保护功能的 TPS65680 18 通道图形可编程电平位移器
1 特性
3 说明
1
•
可编程输出图形
TPS65680 器件是一款适用于 LCD 面板的完全可编程
高压电平位移器解决方案。此器件在共享充电或栅极电
压配置中支持多达 12 路高压时钟输出，而且还支持用
于生成启动信号、清除/复位信号、低频奇/偶信号和面
板放电的 6 路高压控制输出。输出时序基于用户可编
程的图形序列，由电平位移器自身生成。它仅需两个连
接至时序控制器的连接：一个线路时钟和一个指示新帧
开始的启动脉冲。这两个信号可以在多个 TPS65680
器件间共享，条件是 应用中 的输出通道数必须多于单
个器件可生成的数量。
–
–
–
同一硬件可支持不同的显示屏
非常适合非标准/小体积 应用
开发期间易于实施图形更改
•
电平位移器和 TCON 之间具有简单两线制接口
–
使用更少的 TCON I/O 资源/允许更小的 TCON
封装
–
–
简化了 PCB 布局
多个并行运行的电平位移器器件可共享同一个两
线制接口
•
•
•
12 路高压时钟输出
6 路高压控制输出
高级功能
客户定义的图形和配置设置可存储在的片上非易失性存
储器中，以用作上电后的默认设置。或者，上电后可使
用 I2C 接口向器件中写入该数据。TPS65680 器件的
可编程性可帮助您更改输出图形，无需重新编程或更改
TCON 。因此，一个 PCB 可以支持多种不同面板，从
而简化了系统设计、缩短了设计周期并实现了规模效
益。
–
–
–
–
–
–
栅极电压整形
电荷共享
低频奇/偶输出生成
关断期间面板放电
输出过流保护
过热保护
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
•
•
宽电源电压范围
TPS65680
WQFN (32)
4.0mm × 4.0mm
–
–
–
VIN电源电压范围为 2.7V 至 5.5V
VGH 电源电压范围为 9V 至 40V
(1) 要了解所有可用封装，请参见数据表末尾的可订购产品附录。
VGL 电源电压范围为 -4V 至 -18V
简化原理图
4mm × 4mm、32 引脚 QFN 封装
I2C
VCORE
VIO
RSTn
Data
Timing
Controller
2 应用
•
使用 GIP/GOA/ASG 技术的 LCD 面板
–
–
–
–
–
电视
监视器
笔记本电脑/平板电脑
工业设备
LCD Bias
PMIC
LCD
Panel
公共标牌
Clock
Control
VGH
VGL1
VGL2
12
6
TPS65680
VIN
VIN
Copyright © 2017, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SLVSE47
TPS65680
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
www.ti.com.cn
目录
5.1 Third-Party Products Disclaimer ............................... 3
5.2 商标........................................................................... 3
5.3 静电放电警告............................................................. 3
5.4 Glossary.................................................................... 3
机械、封装和可订购信息 ......................................... 3
1
2
3
4
5
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
Revision History..................................................... 2
器件和文档支持........................................................ 3
6
4 Revision History
DATE
REVISION
NOTES
November 2017
2018 年 1 月
*
预告信息发布。
生产数据发布
A
2
版权 © 2017–2018, Texas Instruments Incorporated
TPS65680
www.ti.com.cn
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
5 器件和文档支持
5.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
5.2 商标
All trademarks are the property of their respective owners.
5.3 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
5.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
6 机械、封装和可订购信息
以下页中包括机械封装、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。数据如有变更，恕不另
行通知和修订此文档。如欲获取此产品说明书的浏览器版本，请参阅左侧的导航。
Copyright © 2017–2018, Texas Instruments Incorporated
3
TPS65680
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
www.ti.com.cn
PACKAGE OUTLINE
RSN0032B
WQFN - 0.8 mm max height
S
C
A
L
E
3
.
0
0
0
PLASTIC QUAD FLATPACK - NO LEAD
B
4.1
3.9
A
0.45
0.25
PIN 1 INDEX AREA
4.1
3.9
0.25
0.15
DETAIL
OPTIONAL TERMINAL
TYPICAL
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
2.8 0.05
2X 2.8
(0.2) TYP
4X (0.45)
9
16
28X 0.4
8
17
EXPOSED
THERMAL PAD
2X
SYMM
33
2.8
24
0.25
32X
1
SEE TERMINAL
DETAIL
0.15
0.1
C A B
25
32
PIN 1 ID
(OPTIONAL)
0.05
SYMM
0.45
0.25
32X
4219109/A 11/2017
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
4
Copyright © 2017–2018, Texas Instruments Incorporated
TPS65680
www.ti.com.cn
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
EXAMPLE BOARD LAYOUT
RSN0032B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(
2.8)
SYMM
32
25
32X (0.55)
1
32X (0.2)
24
(
0.2) TYP
VIA
(1.15)
SYMM
33
(3.85)
28X (0.4)
17
8
(R0.05)
TYP
9
16
(1.15)
(3.85)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:20X
0.05 MIN
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
EXPOSED METAL
EXPOSED METAL
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4219109/A 11/2017
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
Copyright © 2017–2018, Texas Instruments Incorporated
5
TPS65680
ZHCSH99A –NOVEMBER 2017–REVISED JANUARY 2018
www.ti.com.cn
EXAMPLE STENCIL DESIGN
RSN0032B
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(0.715)
4X ( 1.23)
(R0.05) TYP
25
32
32X (0.55)
1
24
32X (0.2)
(0.715)
33
SYMM
(3.85)
28X (0.4)
17
8
METAL
TYP
16
9
SYMM
(3.85)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
EXPOSED PAD 33:
77% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
4219109/A 11/2017
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
6
版权 © 2017–2018, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
29-Sep-2021
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS65680RSNR
TPS65680RSNT
ACTIVE
QFN
QFN
RSN
32
32
3000 RoHS & Green
250 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
TPS
65680
ACTIVE
RSN
NIPDAU
TPS
65680
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Sep-2021
Addendum-Page 2
重要声明和免责声明
TI 提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，不保证没
有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。这些资源如有变更，恕不另行通知。TI 授权您仅可
将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。您无权使用任何其他 TI 知识产权或任何第三方知
识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款 (https:www.ti.com.cn/zh-cn/legal/termsofsale.html) 或 ti.com.cn 上其他适用条款/TI 产品随附的其他适用条款
的约束。TI 提供这些资源并不会扩展或以其他方式更改 TI 针对 TI 产品发布的适用的担保或担保免责声明。IMPORTANT NOTICE
邮寄地址：上海市浦东新区世纪大道 1568 号中建大厦 32 楼，邮政编码：200122
Copyright © 2021 德州仪器半导体技术（上海）有限公司
相关型号：
©2020 ICPDF网 联系我们和版权申明