TPS658610AZQZR [TI]

Advanced Power Management Unit;
TPS658610AZQZR
型号: TPS658610AZQZR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Advanced Power Management Unit

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中文:  中文翻译
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TPS658610A  
www.ti.com  
SLVSAH3AUGUST 2010  
Advanced Power Management Unit  
Check for Samples: TPS658610A  
1 Introduction  
1.1 Main Features  
1
• BATTERY CHARGER  
• SYSTEM MANAGEMENT  
– Dual Input Power Path  
– Complete Charge Management Solution for a  
Single Cell Li-Ion/Li-Pol Cell With Dynamic  
Power Management and Thermal Foldback.  
– Maximum 1.0A charge current  
– Programmable Adapter and USB Charge  
Operation  
USB Current Limiting  
Max 18V Over-Voltage Protection  
– Power Good Monitoring on all Supply  
Outputs  
– Software Reset Function  
– Hardware On/Off and Reboot Control  
– 11 Channel ADC With 3 Operating Modes  
• INTEGRATED POWER SUPPLIES  
– 3 Programmable Step-Down converters  
Software Controlled Enable/Forced PWM  
Mode  
Single Conversion  
Peak Detection  
Averaging  
Automatic Power Saving Mode  
Maximum 1.2A Outputs  
– 11 Programmable General Purpose LDOs  
1.2 Applications  
7 With Output Voltages of 1.25V to 3.3V  
2 With Output Voltages of 0.725V to 1.5V  
or 1.25V to 2.586V (factory configurable)  
Smart Phones  
Portable Navigation Devices  
Portable Media Players  
1 “Always On” With Output Voltages of  
1.25V to 3.3V  
1 With Output Voltage of 1.70V–2.475V  
• DISPLAY SUPPORT FUNCTIONS  
– 4 PWM Outputs With Programmable  
Frequency and Duty Cycle  
– Dual RGB LED Drivers  
– Constant Current WLED Driver  
26.5V (max) at 25mA  
Over-Voltage Protection  
Programmable Current Level and  
Brightness Control  
• HOST INTERFACE  
– Interrupt Controller With Maskable Interrupts  
– External ADC Triggering and Step-Down  
Converter Mode Control  
1.3 Overview  
The TPS658610A provides an easy to use, fully integrated solution for handheld devices, integrating  
charge management, multiple regulated power supplies, system management and display functions in a  
small 6x6 package. The I2C interface enables control of a wide range of subsystem parameters. Internal  
registers have a complete set of status information, enabling easy diagnostics and host-controlled  
handling of fault conditions.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010, Texas Instruments Incorporated  
To request a full data sheet, please send an email to:  
nvidia_contact@list.ti.com.  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Apr-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS658610AZQZR  
TPS658610AZQZT  
ACTIVE  
ACTIVE  
BGA  
MICROSTAR  
JUNIOR  
ZQZ  
120  
2500  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-3-260C-168 HR  
BGA  
MICROSTAR  
JUNIOR  
ZQZ  
120  
250  
Green (RoHS  
& no Sb/Br)  
SNAGCU Level-3-260C-168 HR  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Apr-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS658610AZQZR  
BGA MI  
CROSTA  
R JUNI  
OR  
ZQZ  
120  
2500  
330.0  
16.4  
6.3  
6.3  
1.5  
12.0  
16.0  
Q1  
TPS658610AZQZT  
BGA MI  
CROSTA  
R JUNI  
OR  
ZQZ  
120  
250  
330.0  
16.4  
6.3  
6.3  
1.5  
12.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Apr-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS658610AZQZR  
BGA MICROSTAR  
JUNIOR  
ZQZ  
120  
2500  
336.6  
336.6  
28.6  
TPS658610AZQZT  
BGA MICROSTAR  
JUNIOR  
ZQZ  
120  
250  
336.6  
336.6  
28.6  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TIs terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TIs standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
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or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
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Applications  
www.ti.com/audio  
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