TPS70848PWPRG4 [TI]

IC VREG DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO20, GREEN, PLASTIC, HTSSOP-20, Fixed Positive Multiple Output LDO Regulator;
TPS70848PWPRG4
型号: TPS70848PWPRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

IC VREG DUAL OUTPUT, FIXED POSITIVE LDO REGULATOR, PDSO20, GREEN, PLASTIC, HTSSOP-20, Fixed Positive Multiple Output LDO Regulator

光电二极管 输出元件 调节器
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
DUAL-OUTPUT, LOW DROPOUT VOLTAGE REGULATORS  
WITH INTEGRATED SVS FOR SPLIT VOLTAGE SYSTEMS  
1
FEATURES  
DESCRIPTION  
23  
Dual Output Voltages for Split-Supply  
The TPS708xx is a low dropout voltage regulator with  
integrated SVS (RESET, POR, or power on reset)  
and power good (PG) functions. These devices are  
capable of supplying 250 mA and 125 mA by  
regulator 1 and regulator 2 respectively. Quiescent  
current is typically 190 µA at full load. Differentiated  
features, such as accuracy, fast transient response,  
SVS supervisory circuit (power on reset), manual  
reset input, and independent enable functions provide  
a complete system solution.  
Applications  
Independent Enable Functions (See Part  
Number TPS707xx for Sequenced Outputs)  
Output Current Range of 250 mA on Regulator  
1 and 125 mA on Regulator 2  
Voltage Options: 3.3-V/2.5-V, 3.3-V/1.8-V,  
3.3-V/1.5-V, 3.3-V/1.2-V, and Dual Adjustable  
Outputs  
Open Drain Power-On Reset with 120-ms Delay  
PWP PACKAGE  
(TOP VIEW)  
Open Drain Power Good for Regulator 1 and  
Regulator 2  
NC  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
NC  
V
Ultralow 190-µA (typ) Quiescent Current  
1-µA Input Current During Standby  
V
2
IN1  
IN1  
OUT1  
V
V
V
3
OUT1  
/FB1  
/FB2  
4
MR  
SENSE1  
Low Noise: 65 µVRMS Without Bypass  
Capacitor  
5
PG1  
EN1  
EN2  
6
PG2  
V
Quick Output Capacitor Discharge Feature  
One Manual Reset Input  
7
RESET  
GND  
SENSE2  
V
V
8
OUT2  
V
9
OUT2  
IN2  
2% Accuracy Over Load and Temperature  
Undervoltage Lockout (UVLO) Feature  
20-Pin PowerPAD™ TSSOP Package  
Thermal Shutdown Protection  
V
10  
NC  
IN2  
NC: No internal connection  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
PowerPAD is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
TPS70851PWP  
I/O  
3.3 V  
V
V
OUT1  
5V  
IN1  
10 mF  
0.1 mF  
V
SENSE1  
250 kW  
PG1  
250 kW  
250 kW  
PG1  
MR  
MR  
>2 V  
V
IN2  
<0.7 V  
0.1 mF  
RESET  
PG2  
RESET  
PG2  
EN1  
>2 V  
>2 V  
EN1  
EN2  
<0.7 V  
<0.7 V  
EN2  
V
SENSE2  
1.8 V  
V
Core  
OUT2  
10 mF  
DESCRIPTION (CONTINUED)  
The TPS708xx family of voltage regulators offers very low dropout voltage and dual outputs. These devices have  
extremely low noise output performance without using any added filter bypass capacitors and are designed to  
have a fast transient response and be stable with 10-µF low ESR capacitors.  
These devices have fixed 3.3-V/2.5-V, 3.3-V/1.8-V, 3.3-V/1.5-V, 3.3-V/1.2-V, and adjustable voltage options.  
Regulator 1 can support up to 250 mA, and regulator 2 can support up to 125 mA. Separate voltage inputs allow  
the designer to configure the source power.  
Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 170 mV on  
regulator 1) and is directly proportional to the output current. Additionally, since the PMOS pass element is a  
voltage-driven device, the quiescent current is very low and independent of output loading (maximum of 230 µA  
over the full range of output current and full range of temperature). This LDO family also features a sleep mode;  
applying a high signal to EN1 or EN2 (enable) shuts down regulator 1 or regulator 2, respectively. When a high  
signal is applied to both EN1 and EN2, both regulators enter sleep mode, thereby reducing the input current to 2  
µA at TJ = +25°C.  
For each regulator, there is an internal discharge transistor to discharge the output capacitor when the regulator  
is turned off (disabled).  
The PG1 pin reports the voltage condition at VOUT1. The PG1 pin can be used to implement a SVS (RESET,  
POR, or power on reset) for the circuitry supplied by regulator 1. The PG2 pin reports the voltage conditions at  
VOUT2. The PG2 pin can be used to implement a SVS (power on reset) for the circuitry supplied by regulator 2.  
The TPS708xx features a RESET (SVS, POR, or power on reset). RESET output initiates a reset in the event of  
an undervoltage condition. RESET also indicates the status of the manual reset pin (MR). When MR is in the  
logic high state, RESET goes to a high impedance state after a 120-ms delay. To monitor VOUT1, the PG1 output  
pin can be connected to MR. To monitor VOUT2, the PG2 output pin can be connected to MR.  
The device has an undervoltage lockout UVLO circuit that prevents the internal regulators from turning on until  
VIN1 reaches 2.5V.  
2
Submit Documentation Feedback  
Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)  
VOLTAGE (V)(2)  
PACKAGE-  
LEAD  
(DESIGNATOR)  
SPECIFIED  
TEMPERATURE  
RANGE (TJ)  
ORDERING  
NUMBER  
TRANSPORT  
MEDIA, QUANTITY  
PRODUCT  
VOUT1  
VOUT2  
TPS70802PWP  
TPS70802PWPR  
TPS70845PWP  
TPS70845PWPR  
TPS70848PWP  
TPS70848PWPR  
TPS70851PWP  
TPS70851PWPR  
TPS70858PWP  
TPS70858PWPR  
Tube, 70  
Tape and Reel, 2000  
Tube, 70  
TPS70802  
Adjustable  
Adjustable HTSSOP-20 (PWP)  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
–40°C to +125°C  
TPS70845  
TPS70848  
TPS70851  
TPS70858  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
1.2 V  
1.5 V  
1.8 V  
2.5 V  
HTSSOP-20 (PWP)  
HTSSOP-20 (PWP)  
HTSSOP-20 (PWP)  
HTSSOP-20 (PWP)  
Tape and Reel, 2000  
Tube, 70  
Tape and Reel, 2000  
Tube, 70  
Tape and Reel, 2000  
Tube, 70  
Tape and Reel, 2000  
(1) For the most current package and ordering information see the Package Option Addendum located at the end of this document, or see  
the TI web site at www.ti.com.  
(2) For fixed 1.20 V operation, tie FB to OUT.  
ABSOLUTE MAXIMUM RATINGS(1)  
Over operating free-air temperature range (unless otherwise noted).  
TPS708xx  
UNIT  
V
(2)  
Input voltage range: VIN1, VIN2  
Voltage range at EN1, EN2  
–0.3 to +7  
–0.3 to +7  
V
Output voltage range (VOUT1, VSENSE1  
Output voltage range (VOUT2, VSENSE2  
Maximum RESET, PG1, PG2 voltage  
Maximum MR voltage  
)
5.5  
V
)
5.5  
V
7
V
VIN1  
Internally limited  
See Dissipation Ratings Table  
–40 to +150  
V
Peak output current  
°C  
°C  
kV  
Continuous total power dissipation  
Operating virtual junction temperature range, TJ  
Storage temperature range, Tstg  
ESD rating, HBM  
–65 to +150  
2
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are tied to network ground.  
Copyright © 2000–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
DISSIPATION RATINGS  
DERATING  
FACTOR  
PACKAGE  
AIR FLOW (CFM)  
TA +25°C  
TA = +70°C  
TA = +85°C  
0
3.067 W  
4.115 W  
30.67 mW/°C  
41.15 mW/°C  
1.687 W  
2.265 W  
1.227 W  
1.646 W  
PWP(1)  
250  
(1) This parameter is measured with the recommended copper heat sink pattern on a 4-layer PCB, 1 oz. copper on a 4-in by 4-in ground  
layer. Simultaneous and continuous operation of both regulator outputs at full load may exceed the power dissipation rating of the PWP  
package. For more information, refer to TI technical brief SLMA002.  
RECOMMENDED OPERATING CONDITIONS  
Over operating temperature range (unless otherwise noted).  
MIN  
2.7  
0
MAX  
6
UNIT  
V
Input voltage, VI(1) (regulator 1 and 2)  
Output current, IO (regulator 1)  
500  
250  
5.5  
mA  
mA  
V
Output current, IO (regulator 2)  
0
Output voltage range (for adjustable option)  
Operating virtual junction temperature, TJ  
1.22  
–40  
+125  
°C  
(1) To calculate the minimum input voltage for maximum output current, use the following equation: VI(min) = VO(max) + VDO(max load)  
.
4
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Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
ELECTRICAL CHARACTERISTICS  
Over recommended operating junction temperature range (TJ = –40°C to +125°C), VIN1 or VIN2 = VOUT(nom) + 1 V, IO = 1 mA,  
EN = 0 V, and COUT = 33 µF (unless otherwise noted).  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
2.7 V < VIN < 6 V,  
TJ = +25°C  
FB connected to VO  
1.22  
Reference  
voltage  
2.7 V < VIN < 6 V,  
2.7 V < VIN < 6 V,  
2.7 V < VIN < 6 V,  
2.7 V < VIN < 6 V,  
2.7 V < VIN < 6 V,  
2.8 V < VIN < 6 V,  
2.8 V < VIN < 6 V,  
3.5 V < VIN < 6 V,  
3.5 V < VIN < 6 V,  
4.3 V < VIN < 6 V,  
4.3 V < VIN < 6 V,  
FB connected to VO  
1.196  
1.176  
1.47  
1.244  
1.224  
TJ = +25°C  
1.2  
1.5  
1.8  
2.5  
3.3  
190  
1.2 V Output  
1.5 V Output  
1.8 V Output  
2.5 V Output  
3.3 V Output  
TJ = +25°C  
TJ = +25°C  
TJ = +25°C  
TJ = +25°C  
TJ = +25°C  
Output  
voltage  
1.53  
1.836  
2.55  
VO  
V
(1),(2)  
1.764  
2.45  
3.234  
3.366  
(2)  
Quiescent current (GND current) for  
regulator 1 and regulator 2, EN1 = EN2  
= 0 V(1)  
See  
µA  
(2)  
See  
230  
0.1  
VO + 1 V < VIN 6 V,  
VO + 1 V < VIN 6 V  
TJ = +25°C  
TJ = +25°C(1)  
(1)  
0.01  
Output voltage line regulation (VO/VO)  
for regulator 1 and regulator 2  
%V  
mV  
(3)  
Load regulation for VOUT 1 and VOUT2  
1
65  
Regulator 1  
Regulator 2  
Regulator 1  
Regulator 2  
Output noise  
voltage  
Vn  
BW = 300 Hz to 50 kHz,  
VOUT = 0 V  
CO = 33 µF, TJ = +25°C  
µVRMS  
65  
1.6  
1.9  
1
Output current limit  
A
0.750  
+150  
Thermal shutdown junction temperature  
°C  
µA  
Regulator 1  
Regulator 2  
EN1 = VIN, EN2 = VIN  
EN1 = VIN, EN2 = VIN  
TJ = +25°C  
2
6
II  
Standby  
(standby) current  
f = 1 kHz, COUT = 33 µF,  
IOUT1 = 250 mA  
Regulator 1  
Regulator 2  
TJ = +25°C(1)  
TJ = +25°C(1)  
60  
50  
Power-  
supply ripple  
rejection  
PSRR  
dB  
V
f = 1 kHz, COUT = 33 µF,  
IOUT2 = 125 mA  
UVLO threshold  
2.4  
80  
2.65  
RESET Terminal  
Minimum input voltage for valid RESET I(RESET) = 300 µA,  
V
(RESET) 0.8 V  
1.0  
120  
1.3  
160  
0.4  
1
V
ms  
V
t(RESET)  
RESET pulse duration  
VIN = 3.5 V,  
Output low voltage  
Leakage current  
I(RESET) = 1 mA  
0.15  
V(RESET) = 6 V  
µA  
(1) Minimum input operating voltage is 2.7 V or VO(typ) + 1 V, whichever is greater. Maximum input voltage = 6 V, minimum output  
current = 1 mA.  
(2) IO = 1 mA to 250 mA for Regulator 1 and 1 mA to 125 mA for Regulator 2.  
(VImax - 2.7)  
Line regulation (mV) = (%/V) x Vo  
x 1000  
100  
[VImax - (Vo + 1)]  
(3) If VO < 1.8 V then VImax = 6 V, VImin = 2.7 V:  
Line regulation (mV) = (%/V) x Vo  
x 1000  
100  
If VO > 2.5 V then VImax = 6 V, VImin = VO + 1 V:  
Copyright © 2000–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
ELECTRICAL CHARACTERISTICS (continued)  
Over recommended operating junction temperature range (TJ = –40°C to +125°C), VIN1 or VIN2 = VOUT(nom) + 1 V, IO = 1 mA,  
EN = 0 V, and COUT = 33 µF (unless otherwise noted).  
PARAMETER  
PG1/PG2 Terminal  
TEST CONDITIONS  
MIN  
TYP  
MAX UNIT  
Minimum input voltage for valid PGx  
Trip threshold voltage  
Hysteresis voltage  
I(PGx) = 300 µA,  
VO decreasing  
Measured at VO  
Rising edge deglitch  
VIN = 2.7V,  
V
(PGx) 0.8 V  
1.0  
95  
1.3  
V
92  
98 %VOUT  
%VOUT  
µs  
0.5  
30  
tr(PGx)  
Output low voltage  
Leakage current  
I(PGx) = 1 mA  
0.15  
0.4  
1
V
V(PGx) = 6V  
µA  
EN1/EN2 Terminal  
High-level ENx input voltage  
Low-level ENx input voltage  
Input current (ENx)  
MR Terminal  
2
–1  
2
V
V
0.7  
1
µA  
High-level input voltage  
Low-level input voltage  
Falling edge delay  
V
V
0.7  
Measured at VO  
140  
6
µs  
µA  
Pull-up current source  
VOUT1 Terminal  
IO = 250 mA, VIN1 = 3.2 V  
IO = 250 mA, VIN1 = 3.2 V  
2 ms pulse width  
TJ = +25°C  
83  
Dropout voltage(4)  
mV  
140  
Peak output current  
Discharge transistor current  
VOUT2 Terminal  
750  
7.5  
mA  
mA  
VOUT1 = 1.5 V  
Peak output current  
Discharge transistor current  
FB Terminal  
2 ms pulse width  
VOUT2 = 1.5 V  
375  
7.5  
mA  
mA  
Input current: TPS70802  
FB = 1.8 V  
1
µA  
(4) Input voltage (VIN1 or VIN2) = VO(typ) – 100 mV. For 1.5-V, 1.8-V, and 2.5-V regulators, the dropout voltage is limited by input voltage  
range. The 3.3-V regulator input is set to 3.2 V to perform this test.  
6
Submit Documentation Feedback  
Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
DEVICE INFORMATION  
Fixed Voltage Version  
V
(2 Pins)  
IN1  
V
V
(2 Pins)  
OUT1  
UVLO  
Comp  
10 kW  
Current  
Sense  
-
ENA_1  
SENSE1  
+
2.5 V  
(see Note A)  
-
+
ENA_1  
Reference  
V
ref  
FB1  
GND  
Thermal  
V
ref  
Shutdown  
PG1  
-
V
SENSE1  
Rising Edge  
Deglitch  
+
0.95 x Vref  
V
IN1  
PG1  
Comp  
MR  
RESET  
Falling Edge  
Delay  
ENA_1  
EN1  
PG2  
PG2  
Comp  
-
V
SENSE2  
Rising Edge  
Deglitch  
0.95 x V  
ref  
+
ENA_2  
V
ref  
FB2  
EN2  
-
+
ENA_2  
V
SENSE2  
Current  
Sense  
ENA_2  
(see Note A)  
10 kW  
V
(2 Pins)  
OUT2  
V
(2 Pins)  
IN2  
A. For most applications, VSENSE1 and VSENSE2 should be externally connected to VOUT1 and VOUT2, respectively, as  
close as possible to the device. For other implementations, refer to SENSE terminal connection discussion in the  
Application Information section.  
Copyright © 2000–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
Adjustable Voltage Version  
V
(2 Pins)  
IN1  
V
(2 Pins)  
OUT1  
UVLO  
Comp  
Current  
Sense  
-
FB1  
ENA_1  
+
2.5 V  
(see Note A)  
-
+
ENA_1  
Reference  
V
ref  
GND  
Thermal  
V
ref  
Shutdown  
PG1  
-
FB1  
0.95 x V  
Rising Edge  
Deglitch  
+
V
ref  
IN1  
PG1  
Comp  
MR  
RESET  
Falling Edge  
Delay  
ENA_1  
EN1  
PG2  
PG2  
Comp  
-
FB2  
0.95 x V  
Rising Edge  
Deglitch  
+
ref  
ENA_2  
V
ref  
FB2  
EN2  
-
+
ENA_2  
FB2  
Current  
Sense  
ENA_2  
(see Note A)  
V (2 Pins)  
OUT2  
V
(2 Pins)  
IN2  
A. For most applications, FB1 and FB2 should be externally connected to resistor dividers as close as possible to the  
device. For other implementations, refer to FB terminals connection discussion in the Application Information  
section.  
8
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Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
RESET Timing Diagram  
V
IN1  
V
UVLO  
V
UVLO  
V
V
RES  
RES  
(see Note A)  
t
MR Input  
t
RESET Output  
120 ms  
Delay  
120 ms  
Delay  
Output  
Output  
Undefined  
Undefined  
t
NOTE A: VRES is the minimum input voltage for a valid RESET. The symbol VRES is not currently listed within EIA or JEDEC  
standards for semiconductor symbology.  
PG1 Timing Diagram  
V
IN1  
V
UVLO  
V
UVLO  
V
PG1  
V
PG  
(see Note A)  
t
V
OUT1  
V
IT+  
(see Note B)  
Threshold  
Voltage  
V
IT-  
(see Note B)  
t
PG1 Output  
Output  
PG1  
Output  
Undefined  
Undefined  
t
NOTES A: VPG1 is the minimum input voltage for a valid PG. The symbol VPG1 is not currently listed within EIA or JEDEC  
standards for semiconductor symbology.  
NOTES B: VIT- trip voltage is typically 5% lower than the output voltage (95%VO). VIT- to VIT+ is the hysteresis voltage.  
Copyright © 2000–2007, Texas Instruments Incorporated  
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9
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
PG2 Timing Diagram (assuming VIN1 already powered up)  
V
IN2  
t
V
OUT2  
V
IT+  
(see Note A)  
Threshold  
Voltage  
V
IT-  
(see Note A)  
t
PG2  
Output  
t
NOTE A: VIT- trip voltage is typically 5% lower than the output voltage (95%VO). VIT- to VIT+ is the hysteresis voltage.  
TERMINAL FUNCTIONS  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
EN1  
NO.  
5
6
I
I
Active low enable for VOUT1  
EN2  
Active low enable for VOUT2  
GND  
8
I
Ground  
MR  
4
Manual reset input, active low, pulled up internally  
No connection  
NC  
1, 11, 20  
16  
O
O
I
PG1  
Open drain output, low when VOUT1 voltage is less than 95% of the nominal regulated voltage  
Open drain output, low when VOUT2 voltage is less than 95% of the nominal regulated voltage  
Open drain output, SVS (power-on reset) signal, active low  
Input voltage of regulator 1  
PG2  
15  
RESET  
VIN1  
7
2, 3  
9, 10  
18, 19  
12, 13  
14  
I
VIN2  
I
Input voltage of regulator 2  
VOUT1  
VOUT2  
VSENSE2/FB2  
VSENSE1/FB1  
O
O
I
Output voltage of regulator 1  
Output voltage of regulator 2  
Regulator 2 output voltage sense/regulator 2 feedback for adjustable  
Regulator 1 output voltage sense/regulator 1 feedback for adjustable  
17  
I
10  
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Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
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SLVS301DJUNE 2000REVISED DECEMBER 2007  
Detailed Description  
The TPS708xx low dropout regulator family provides dual regulated output voltages with independent enable  
functions. These devices provide fast transient response and high accuracy with small output capacitors, while  
drawing low quiescent current. Other features are integrated SVS (power-on reset, RESET) and power good  
(PG1, PG2) that monitor output voltages and provide logic output to the system. These differentiated features  
provide a complete power solution.  
The TPS708xx, unlike many other LDOs, features very low quiescent current that remains virtually constant even  
with varying loads. Conventional LDO regulators use a PNP pass element, the base current of which is directly  
proportional to the load current through the regulator (IB = IC/β). The TPS708xx uses a PMOS transistor to pass  
current; because the gate of the PMOS is voltage-driven, operating current is low and stable over the full load  
range.  
Pin Functions  
Enable (EN1, EN2)  
The EN terminals are inputs that enable or shut down each respective regulator. If EN is at a voltage high signal,  
the respective regulator is in shutdown mode. When EN goes to voltage low, the respective regulator is enabled.  
Power-Good (PG1, PG2)  
The PG terminals are open drain, active high output terminals that indicate the status of each respective  
regulator. When VOUT1 reaches 95% of its regulated voltage, PG1 goes to a high impedance state. When VOUT2  
reaches 95% of its regulated voltage, PG2 goes to a high impedance state. Each PG goes to a low impedance  
state when its respective output voltage is pulled below 95% (that is, goes to an overload condition) of its  
regulated voltage. The open drain outputs of the PG terminals require a pull-up resistor.  
Manual Reset Pin  
MR is an active low input terminal used to trigger a reset condition. When MR is pulled to logic low, a POR  
(RESET) occurs. The terminal has a 6-µA pull-up current to VIN1  
.
Sense (VSENSE1, VSENSE2  
)
The sense terminals of fixed-output options must be connected to the regulator outputs, and the connection  
should be as short as possible. Internally, the sense terminal connects to high-impedance, wide-bandwidth  
amplifiers through a resistor-divider network and noise pickup feeds through to the regulator output. It is essential  
to route the sense connection in such a way as to minimize or avoid noise pickup. Adding RC networks between  
sense terminals and VOUT terminals to filter noise is not recommended because these networks can cause the  
regulators to oscillate.  
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FB1 and FB2  
FB1 and FB2 are input terminals used for adjustable-output devices and must be connected to the external  
feedback resistor divider. FB1 and FB2 connections should be as short as possible. It is essential to route them  
in such a way as to minimize or avoid noise pickup. Adding RC networks between FB terminals and VOUT  
terminals to filter noise is not recommended because these networks can cause the regulators to oscillate.  
RESET Indicator  
The TPS708xx features a RESET (SVS, POR, or power on reset). RESET can be used to drive power on reset  
circuitry or a low-battery indicator. RESET is an active low, open drain output that indicates the status of the  
manual reset pin (MR). When MR is in a high-impedance state, RESET goes to a high impedance state after a  
120-ms delay. To monitor VOUT1, the PG1 output pin can be connected to MR. To monitor VOUT2, the PG2 output  
pin can be connected to MR. The open drain output of the RESET terminal requires a pull-up resistor. If RESET  
is not used, it can be left floating.  
VIN1 and VIN2  
VIN1 and VIN2 are inputs to each regulator. Internal bias voltages are powered by VIN1  
.
VOUT1 and VOUT2  
VOUT1 and VOUT2 are output terminals of each regulator.  
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SLVS301DJUNE 2000REVISED DECEMBER 2007  
TYPICAL CHARACTERISTICS  
Table of Graphs  
FIGURE  
vs Output current  
vs Junction temperature  
vs Junction temperature  
vs Frequency  
Figure 1 to Figure 3  
Figure 4 to Figure 5  
Figure 6  
VO  
Output voltage  
Ground current  
PSRR  
ZO  
Power-supply rejection ratio  
Output spectral noise density  
Output impedance  
Figure 7 to Figure 10  
Figure 11 to Figure 14  
Figure 15 to Figure 18  
Figure 19 and Figure 20  
Figure 21 and Figure 22  
Figure 23 and Figure 24  
Figure 25  
vs Frequency  
vs Frequency  
vs Temperature  
vs Input voltage  
Dropout voltage  
Load transient response  
Line transient response (VOUT1  
Line transient response (VOUT2  
Output voltage  
)
)
Figure 26  
VO  
vs Time (start-up)  
vs Output current  
Figure 27 and Figure 28  
Figure 30 to Figure 33  
Equivalent series resistance (ESR)  
TPS70851  
OUTPUT VOLTAGE  
vs  
TPS70851  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
3.303  
3.302  
3.301  
3.3  
1.802  
1.801  
1.800  
1.799  
1.798  
1.797  
V
T
= 4.3 V  
IN1  
V
T
= 2.8 V  
IN2  
= +25°C  
J
= +25°C  
J
V
OUT1  
V
OUT2  
3.299  
3.298  
3.297  
1.796  
1.795  
3.296  
3.295  
0
0.05  
0.1  
0.15  
0.2  
0.25  
0
0.025  
0.05  
0.075  
0.1  
0.125  
I
- Output Current - A  
I
- Output Current - A  
O
O
Figure 1.  
Figure 2.  
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TPS70845  
OUTPUT VOLTAGE  
vs  
TPS70851  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
JUNCTION TEMPERATURE  
1.201  
1.200  
3.35  
3.33  
V
V
= 4.3 V  
V
T
= 2.7 V  
IN1  
IN2  
= +25°C  
OUT1  
J
V
OUT2  
I
O
= 250 mA  
1.199  
1.198  
1.197  
3.31  
3.29  
I
O
= 1 mA  
3.27  
3.25  
3.23  
1.196  
1.195  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
0
0.025  
0.05  
0.075  
0.1  
0.125  
T
- Junction Temperature - °C  
J
I
- Output Current - A  
O
Figure 3.  
Figure 4.  
TPS70851  
TPS70851  
GROUND CURRENT  
vs  
OUTPUT VOLTAGE  
vs  
JUNCTION TEMPERATURE  
JUNCTION TEMPERATURE  
210  
1.85  
1.83  
1.81  
1.79  
1.77  
1.75  
1.73  
V
V
= 2.8 V  
IN2  
Regulator 1 and Regulator 2  
OUT2  
200  
190  
I
= 1 mA  
OUT1  
I
= 1 mA  
I
O
= 1 mA  
OUT2  
180  
170  
I
O
= 250 mA  
I
I
= 250 mA  
= 125 mA  
OUT1  
OUT2  
160  
150  
40 25 10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
T
- Junction Temperature - °C  
T
- Junction Temperature - °C  
J
J
Figure 5.  
Figure 6.  
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TPS70851  
TPS70851  
POWER-SUPPLY REJECTION RATIO  
POWER-SUPPLY REJECTION RATIO  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
0
-10  
I = 250 mA  
O
I
= 10 mA  
O
C
V
= 22 mF  
O
-20  
-30  
-40  
C
= 22 mF  
O
V
OUT1  
-10  
-20  
OUT1  
-30  
-40  
-50  
-60  
-70  
-50  
-60  
-70  
-80  
-90  
-80  
-90  
10  
100  
1 k  
10 k  
100 k  
1 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 7.  
Figure 8.  
TPS70851  
TPS70851  
POWER-SUPPLY REJECTION RATIO  
POWER-SUPPLY REJECTION RATIO  
vs  
vs  
FREQUENCY  
FREQUENCY  
-10  
-20  
10  
0
I
= 10 mA  
O
I
= 150 mA  
O
C
V
= 22 mF  
O
C
V
= 22 mF  
O
OUT2  
-10  
-20  
OUT2  
-30  
-40  
-30  
-40  
-50  
-50  
-60  
-70  
-60  
-70  
-80  
-90  
-80  
-90  
10  
100  
1 k  
10 k  
100 k  
1 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 9.  
Figure 10.  
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OUTPUT SPECTRAL NOISE DENSITY  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
V
I
= 4.3 V  
V
V
I
= 4.3 V  
IN1  
IN1  
= 3.3 V  
= 250 mA  
= 3.3 V  
= 10 mA  
OUT1  
OUT1  
O
O
1
1
0.1  
0.1  
0.01  
0.01  
100  
100  
1 k  
10 k  
100 k  
1 k  
10 k  
100 k  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 11.  
Figure 12.  
OUTPUT SPECTRAL NOISE DENSITY  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
vs  
FREQUENCY  
FREQUENCY  
10  
10  
V
V
I
= 2.8 V  
V
V
I
= 2.8 V  
IN2  
IN2  
= 1.8 V  
= 1.8 V  
OUT2  
OUT2  
= 125 mA  
= 10 mA  
O
O
1
1
0.1  
0.1  
0.01  
100  
0.01  
100  
1 k  
10 k  
100  
1 k  
10 k  
100 k  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 13.  
Figure 14.  
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SLVS301DJUNE 2000REVISED DECEMBER 2007  
OUTPUT IMPEDANCE  
vs  
OUTPUT IMPEDANCE  
vs  
FREQUENCY  
FREQUENCY  
100  
10  
C
C
I
= 33 mF  
O
= 33 mF  
O
= 10 mA  
I
= 250 mA  
O
O
V
T
= 3.3 V  
V
T
= 3.3 V  
OUT1  
= +25°C  
OUT1  
= +25°C  
J
10  
1
J
1
0.1  
0.1  
0.01  
0.01  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 15.  
Figure 16.  
OUTPUT IMPEDANCE  
vs  
OUTPUT IMPEDANCE  
vs  
FREQUENCY  
FREQUENCY  
10  
100  
C
= 33 mF  
O
C
I
= 33 mF  
O
I
= 10 mA  
O
= 125 mA  
O
V
T
= 1.8 V  
OUT2  
V
T
= 1.8 V  
OUT2  
= +25°C  
= +25°C  
J
10  
1
J
1
0.1  
0.01  
0.1  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
10  
100  
1 k  
10 k  
100 k  
1 M  
10 M  
f - Frequency - Hz  
f - Frequency - Hz  
Figure 17.  
Figure 18.  
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SLVS301DJUNE 2000REVISED DECEMBER 2007  
TPS70851  
DROPOUT VOLTAGE  
vs  
TPS70851  
DROPOUT VOLTAGE  
vs  
TEMPERATURE  
TEMPERATURE  
120  
6
5
C
V
= 33 mF  
C
V
= 33 mF  
O
O
= 3.2 V  
= 3.2 V  
IN1  
IN1  
100  
I
O
= 10 mA  
I
O
= 250 mA  
80  
60  
40  
4
3
2
20  
0
1
0
I
O
= 0 mA  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
T
- Junction Temperature - °C  
T
- Junction Temperature - °C  
J
J
Figure 19.  
Figure 20.  
TPS70802  
DROPOUT VOLTAGE  
vs  
TPS70802  
DROPOUT VOLTAGE  
vs  
INPUT VOLTAGE  
INPUT VOLTAGE  
140  
250  
I
= 250 mA  
O
I
= 125 mA  
O
V
OUT1  
V
120  
100  
80  
OUT2  
T
= +125°C  
200  
J
T
= +125°C  
J
T
J
= +25°C  
J
150  
100  
T
= +25°C  
J
60  
T
= -40°C  
40  
T
= -40°C  
J
50  
0
20  
0
2.5  
3
3.5  
4
4.5  
5
2.5  
3
3.5  
4
4.5  
5
V - Input Voltage - V  
V - Input Voltage - V  
I
I
Figure 21.  
Figure 22.  
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LOAD TRANSIENT RESPONSE  
LOAD TRANSIENT RESPONSE  
C
T
= 33 mF  
C
T
= 33 mF  
O
O
= +25°C  
= +25°C  
250  
0
125  
0
J
J
V
= 3.3 V  
V
= 1.8 V  
OUT1  
OUT2  
20  
0
20  
0
-20  
-40  
-20  
-40  
-60  
-80  
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
0
0.2 0.4 0.6 0.8  
1
1.2 1.4 1.6 1.8  
2
T - Time - ms  
T - Time - ms  
Figure 23.  
Figure 24.  
LINE TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
3.8  
2.8  
5.3  
4.3  
50  
0
10  
0
I
= 125 mA  
I
= 250 mA  
O
O
C
V
= 33 mF  
C
V
= 33 mF  
O
O
-50  
-10  
OUT2  
OUT1  
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
T - Time - ms  
T - Time - ms  
Figure 25.  
Figure 26.  
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OUTPUT VOLTAGE AND ENABLE VOLTAGE  
OUTPUT VOLTAGE AND ENABLE VOLTAGE  
vs  
vs  
TIME (START-UP)  
TIME (START-UP)  
V = 1.5 V  
O
V
= 3.3 V  
O
C
I
= 33 mF  
O
3
2
1
0
3
2
1
0
C
I
= 33 mF  
O
= 125 mA  
= 250 mA  
O
O
V = Standby  
OUT1  
V
= Standby  
OUT2  
5
0
5
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
T - Time - ms  
T - Time - ms  
Figure 27.  
Figure 28.  
To Load  
VIN  
IN  
OUT  
+
COUT  
RL  
EN  
GND  
ESR  
Figure 29. Test Circuit for Typical Regions of Stability  
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TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE(1)  
vs  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE(1)  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
V
= 3.3 V  
O
V
= 3.3 V  
O
C
T
= 10 mF  
O
C
T
= 6.8 mF  
O
= +25°C  
J
= +25°C  
J
1
1
0.1  
50 mW  
250 mW  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
0.1  
0.01  
0
50  
100  
150  
200  
250  
0
50  
I
100  
150  
200  
250  
I
- Output Current - mA  
- Output Current - mA  
O
O
Figure 30.  
Figure 31.  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE(1)  
vs  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE(1)  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
V
= 1.8 V  
O
V
= 1.8 V  
O
C
T
= 6,8 mF  
O
C
T
= 10 mF  
O
= +25°C  
J
= +25°C  
1
J
1
0.1  
50 mW  
250 mW  
REGION OF INSTABILITY  
REGION OF INSTABILITY  
0.1  
0.01  
0
25  
50  
75  
100  
125  
0
25  
50  
75  
100  
125  
I
- Output Current - mA  
I
- Output Current - mA  
O
O
Figure 32.  
Figure 33.  
(1) Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any  
series resistance added externally, and PWB trace resistance to CO.  
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APPLICATION INFORMATION  
TPS708xxPWP  
(Fixed Output Option)  
Sequencing Timing Diagrams  
V
OUT1  
V
IN  
This section provides a number of timing diagrams  
showing how this device functions in different  
configurations.  
V
V
IN1  
OUT1  
10 mF  
0.1 mF  
V
SENSE1  
Application condition: VIN1 and VIN2 are tied to the  
same fixed input voltage greater than VUVLO. PG2 is  
tied to MR.  
250 kW  
250 kW  
PG1  
MR  
MR  
V
IN2  
EN1 and EN2 are initially high; therefore, both  
regulators are off, and PG1 and PG2 (tied to MR) are  
at logic low. Since MR is at logic low, RESET is also  
at logic low. When EN1 is taken to logic low, VOUT1  
turns on. Later, when EN2 is taken to logic low, VOUT2  
turns on. When VOUT1 reaches 95% of its regulated  
output voltage, PG1 goes to logic high. When VOUT2  
reaches 95% of its regulated output voltage, PG2  
(tied to MR) goes to logic high. When VIN1 is greater  
than VUVLO and MR (tied to PG2) is at logic high,  
RESET is pulled to logic high after a 120-ms delay.  
When EN1 and EN2 return to logic high, both devices  
power down and both PG1, PG2 (tied to MR2), and  
RESET return to logic low.  
RESET  
0.1 mF  
RESET  
PG2  
PG2  
EN1  
EN1  
EN2  
>2 V  
>2 V  
<0.7 V  
EN2  
V
SENSE2  
V
OUT2  
V
OUT2  
<0.7 V  
10 mF  
EN2  
EN1  
95%  
V
OUT2  
95%  
V
OUT1  
PG2  
PG1  
MR  
(PG2 tied to MR)  
RESET  
t1  
120 ms  
NOTES: A. t1: Time at which VIN is greater than VUVLO and MR is logic high.  
B. The timing diagram is not drawn to scale.  
Figure 34. Timing When VOUT1 Is Enabled Before VOUT2  
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Application condition: VIN1 and VIN2 are tied to the  
same fixed input voltage greater than VUVLO. MR is  
initially logic high but is eventually toggled.  
TPS708xxPWP  
(Fixed Output Option)  
V
IN  
V
OUT1  
V
OUT1  
V
IN1  
EN1 and EN2 are initially high; therefore, both  
regulators are off, and PG1 and PG2 are at logic low.  
Since VIN1 is greater than VUVLO and MR is at logic  
high, RESET is also at logic high. When EN2 is taken  
to logic low, VOUT2 turns on. Later, when EN1 is taken  
to logic low, VOUT1 turns on. When VOUT2 reaches  
95% of its regulated output voltage, PG2 goes to  
logic high. When VOUT1 reaches 95% of its regulated  
output voltage, PG1 goes to logic high. When MR is  
taken to logic low, RESET is taken low. When MR  
returns to logic high, RESET returns to logic high  
after a 120-ms delay.  
250 kW  
0.1 mF  
V
SENSE1  
10 mF  
250 kW  
PG1  
V
IN2  
250 kW  
0.1 mF  
RESET  
RESET  
PG2  
PG2  
MR  
EN1  
EN1  
EN2  
>2 V  
>2 V  
MR  
2 V  
V
0.7 V  
OUT2  
10 mF  
<0.7 V  
EN2  
SENSE2  
V
V
OUT2  
<0.7 V  
EN2  
EN1  
95%  
V
OUT2  
95%  
V
OUT1  
PG2  
PG1  
MR  
RESET  
t1  
120 ms  
NOTES: A. t1: Time at which VIN is greater than VUVLO and MR is logic high.  
B. The timing diagram is not drawn to scale.  
Figure 35. Timing When MR is Toggled  
Copyright © 2000–2007, Texas Instruments Incorporated  
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
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SLVS301DJUNE 2000REVISED DECEMBER 2007  
Application condition: VIN1 and VIN2 are tied to  
same fixed input voltage greater than VUVLO. PG1 is  
tied to MR.  
TPS708xxPWP  
(Fixed Output Option)  
V
OUT1  
V
IN  
V
OUT1  
V
IN1  
EN1 and EN2 are initially high; therefore, both  
regulators are off, and PG1 (tied to MR) and PG2 are  
at logic low. Since MR is at logic low, RESET is also  
at logic low. When EN2 is taken to logic low, VOUT2  
turns on. Later, when EN1 is taken to logic low, VOUT1  
turns on. When VOUT2 reaches 95% of its regulated  
output voltage, PG2 goes to logic high. When VOUT1  
reaches 95% of its regulated output voltage, PG1  
goes to logic high. When VIN1 is greater than VUVLO  
and MR (tied to PG2) is at logic high, RESET is  
pulled to logic high after a 120-ms delay. When a  
fault on VOUT1 causes it to fall below 95% of its  
regulated output voltage, PG1 (tied to MR) goes to  
logic low. Since MR is logic low, RESET goes to logic  
low. VOUT2 is unaffected.  
0.1 mF  
10 mF  
V
SENSE1  
250 kW  
PG1  
MR  
V
IN2  
250 kW  
RESET  
0.1 mF  
RESET  
PG2  
PG2  
EN1  
EN1  
EN2  
>2 V  
>2 V  
V
SENSE2  
<0.7 V  
EN2  
V
OUT2  
V
OUT2  
<0.7 V  
10 mF  
EN2  
EN1  
95%  
V
OUT2  
95%  
V
OUT1  
FAULT ON VOUT1  
PG2  
PG1  
MR  
(PG1 tied to MR)  
RESET  
t1  
120 ms  
NOTES: A. t1: Time at which VIN is greater than VUVLO and MR is logic high.  
B. The timing diagram is not drawn to scale.  
Figure 36. Timing When There is a Fault on VOUT1  
24  
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Copyright © 2000–2007, Texas Instruments Incorporated  
TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
APPLICATION INFORMATION  
Input Capacitor  
For a typical application, an input bypass capacitor (0.1 µF to 1 µF) is recommended. This capacitor will filter any  
high frequency noise generated in the line. For fast transient conditions where droop at the input of the LDO may  
occur because of high inrush current, it is recommended to place a larger capacitor at the input as well. The size  
of this capacitor depends on the output current and response time of the main power supply, as well as the  
distance to the VI pins of the LDO.  
Output Capacitor  
As with most LDO regulators, the TPS708xx requires an output capacitor connected between OUT and GND to  
stabilize the internal control loop. The minimum recommended capacitance values are 10-µF ceramic capacitors  
with an ESR (equivalent series resistance) between 50-mand 2.5-or 6.8-µF tantalum capacitors with ESR  
between 250 mand 4 . Solid tantalum electrolytic, aluminum electrolytic, and multilayer ceramic capacitors  
with capacitance values greater than 10 µF are all suitable, provided they meet the requirements described  
above. Larger capacitors provide a wider range of stability and better load transient response. Table 1 gives a  
partial listing of surface-mount capacitors suitable for use with the TPS708xx for fast transient response  
application.  
This information, along with the ESR graphs, is included to assist in selection of suitable capacitance for user  
applications. When necessary to achieve low height requirements along with high output current and/or high load  
capacitance, several higher ESR capacitors can be used in parallel to meet the guidelines above.  
Table 1. Partial Listing of TPS708xx-Compatible Surface-Mount Capacitors  
VALUE  
22 µF  
33 µF  
47 µF  
68 µF  
MANUFACTURER  
Kemet  
MAX ESR  
345 mΩ  
100 mΩ  
100 mΩ  
45 mΩ  
MFR PART NO.  
7495C226K0010AS  
10TPA33M  
Sanyo  
Sanyo  
6TPA47M  
Sanyo  
10TPC68M  
Copyright © 2000–2007, Texas Instruments Incorporated  
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
ESR and Transient Response  
LDOs typically require an external output capacitor for stability. In fast transient response applications, capacitors  
are used to support the load current while the LDO amplifier is responding. In most applications, one capacitor is  
used to support both functions.  
Besides its capacitance, every capacitor also contains parasitic impedances. These parasitic impedances are  
resistive as well as inductive. The resistive impedance is called equivalent series resistance (ESR), and the  
inductive impedance is called equivalent series inductance (ESL). The equivalent schematic diagram of any  
capacitor can therefore be drawn as shown in Figure 37.  
RSER  
LESL  
C
Figure 37. ESR and ESL  
In most cases one can neglect the effect of inductive impedance ESL. Therefore, the following application  
focuses mainly on the parasitic resistance ESR.  
Figure 38 shows the output capacitor and its parasitic resistances in a typical LDO output stage.  
I
OUT  
LDO  
-
ESR  
R
ESR  
V
+
+
V
I
V
OUT  
R
LOAD  
-
C
OUT  
Figure 38. LDO Output Stage with Parasitic Resistances ESR  
In steady state (dc state condition), the load current is supplied by the LDO (solid arrow) and the voltage across  
the capacitor is the same as the output voltage (V(CO) = VOUT). This condition means no current is flowing into the  
CO branch. If IOUT suddenly increases (a transient condition), the following results occur:  
The LDO is not able to supply the sudden current need because of its response time. Therefore, capacitor CO  
provides the current for the new load condition (dashed arrow). CO now acts like a battery with an internal  
resistance, ESR. Depending on the current demand at the output, a voltage drop occurs at RESR. This voltage  
is shown as VESR in Figure 38.  
When CO is conducting current to the load, initial voltage at the load will be VO = V(CO) – VESR. As a result of  
the discharge of CO, the output voltage VO drops continuously until the response time t1 of the LDO is  
reached and the LDO resumes supplying the load. From this point, the output voltage starts rising again until  
it reaches the regulated voltage. This period is shown as t2 in Figure 39.  
26  
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
IOUT  
VOUT  
1
2
3
ESR 1  
ESR 2  
ESR 3  
t1  
t2  
Figure 39. Correlation of Different ESRs and Their Influence on the Regulation of VO at a Load Step from  
Low-to-High Output Current  
Figure 39 also shows the impact of different ESRs on the output voltage. The left brackets show different levels  
of ESRs where number 1 displays the lowest and number 3 displays the highest ESR.  
From above, the following conclusions can be drawn:  
The higher the ESR, the larger the droop at the beginning of load transient.  
The smaller the output capacitor, the faster the discharge time and the greater the voltage droop during the  
LDO response period.  
Copyright © 2000–2007, Texas Instruments Incorporated  
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
Programming the TPS70802 Adjustable LDO Regulator  
The output voltage of the TPS70802 adjustable regulators is programmed using external resistor dividers as  
shown in Figure 40.  
Resistors R1 and R2 should be chosen for approximately a 50-µA divider current. Lower value resistors can be  
used, but offer no inherent advantage and waste more power. Higher values should be avoided as leakage  
currents at the sense terminal increase the output voltage error. The recommended design procedure is to  
choose R2 = 30.1 kto set the divider current at approximately 50 µA, and then calculate R1 using Equation 1:  
VOUT  
R1 =  
- 1 ´ R2  
(
(
VREF  
(1)  
where:  
VREF = 1.224 V typ (the internal reference voltage)  
OUTPUT VOLTAGE  
PROGRAMMING GUIDE  
TPS70802  
OUTPUT  
VOLTAGE  
V
I
R1  
R2  
UNIT  
IN  
0.1 mF  
2.5 V  
3.3 V  
3.6 V  
31.6  
51.1  
59.0  
30.1  
30.1  
30.1  
kW  
kW  
kW  
>2.0 V  
EN  
OUT  
FB  
V
O
<0.7 V  
+
R1  
GND  
R2  
Figure 40. TPS70802 Adjustable LDO Regulator Programming  
Regulator Protection  
Both TPS708xx PMOS-pass transistors have built-in back diodes that conduct reverse currents when the input  
voltage drops below the output voltage (for example, during power-down). Current is conducted from the output  
to the input and is not internally limited. When extended reverse voltage is anticipated, external limiting may be  
appropriate.  
The TPS708xx also features internal current limiting and thermal protection. During normal operation, the  
TPS708xx regulator 1 limits output current to approximately 1.6 A (typ) and regulator 2 limits output current to  
approximately 750 mA (typ). When current limiting engages, the output voltage scales back linearly until the  
overcurrent condition ends. While current limiting is designed to prevent gross device failure, care should be  
taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds  
+150°C (typ), thermal-protection circuitry shuts it down. Once the device has cooled below +130°C (typ),  
regulator operation resumes.  
28  
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TPS70845, TPS70848  
TPS70851, TPS70858  
TPS70802  
www.ti.com  
SLVS301DJUNE 2000REVISED DECEMBER 2007  
Power Dissipation and Junction Temperature  
Specified regulator operation is assured to a junction temperature of +125°C; the maximum junction temperature  
should be restricted to +125°C under normal operating conditions. This restriction limits the power dissipation the  
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,  
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or  
equal to PD(max)  
.
The maximum-power-dissipation limit is determined using the following equation:  
TJ max *TA  
PD(max)  
+
RqJA  
(2)  
where:  
TJmax is the maximum allowable junction temperature  
RθJA is the thermal resistance junction-to-ambient for the package, that is, 32.6°C/W for the 20-terminal PWP with no  
airflow.  
TA is the ambient temperature  
The regulator dissipation is calculated using:  
ǒ
Ǔ
PD + VI*VO   IO  
(3)  
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal  
protection circuit.  
Copyright © 2000–2007, Texas Instruments Incorporated  
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29  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Jul-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TPS70802PWP  
TPS70802PWPG4  
TPS70845PWP  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
PWP  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
70  
70  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
CU NIPDAU Level-2-260C-1 YEAR  
70  
Green (RoHS  
& no Sb/Br)  
TPS70845PWPG4  
TPS70848PWP  
70  
Green (RoHS  
& no Sb/Br)  
70  
Green (RoHS  
& no Sb/Br)  
TPS70848PWPG4  
TPS70851PWP  
70  
Green (RoHS  
& no Sb/Br)  
70  
Green (RoHS  
& no Sb/Br)  
TPS70851PWPG4  
TPS70851PWPR  
TPS70851PWPRG4  
TPS70858PWP  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
70  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS70858PWPG4  
70  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
30-Jul-2011  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS70851PWPR  
HTSSOP PWP  
20  
2000  
330.0  
16.4  
6.95  
7.1  
1.6  
8.0  
16.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
HTSSOP PWP 20  
SPQ  
Length (mm) Width (mm) Height (mm)  
367.0 367.0 38.0  
TPS70851PWPR  
2000  
Pack Materials-Page 2  
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