TPS720285QDRVRQ1 [TI]
具有使能功能的汽车类、350mA、低输入电压 (1.1V)、高 PSRR、低 IQ、低压降稳压器 | DRV | 6 | -40 to 125;型号: | TPS720285QDRVRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 具有使能功能的汽车类、350mA、低输入电压 (1.1V)、高 PSRR、低 IQ、低压降稳压器 | DRV | 6 | -40 to 125 信息通信管理 光电二极管 输出元件 稳压器 调节器 |
文件: | 总27页 (文件大小:1362K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TPS720-Q1
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
TPS720-Q1
具有偏置引脚的 350mA、超低 VIN、RF 低压降线性稳压器
1 特性
3 说明
1
•
适用于汽车电子 应用
具有符合 AEC-Q100 标准的下列结果:
TPS720-Q1 系列双轨、低压降线性稳压器 (LDO) 具有
出色的交流性能(PSRR,负载和线路瞬态响应),静
态流耗非常低,低至 38μA。
•
–
–
–
器件温度 1 级:-40℃ 至 +125℃ 的环境运行温
度范围
为 LDO 控制电路供电的 VBIAS 轨消耗极低的电流(与
LDO 静态电流差不多),并且可以连接至任何超过输
出电压 1.4V 及以上的电源。主要电源路径为 VIN,且
可低于 VBIAS;此路径可低至 VOUT + VDO,有助于提高
许多功耗敏感型 应用解决方案的效率。例如,VIN 可作
为高效的直流 - 直流降压稳压器的输出。
器件人体放电模式 (HBM) 静电放电 (ESD) 分类
等级 H2
器件组件充电模式 (CDM) ESD 分类等级 C6
•
•
•
•
•
输入电压范围:1.1V 至 4.5V
输出电压范围:0.9V 至 3.6V
高性能 LDO:350mA
TPS720-Q1 支持一种新特性,当 IN 引脚保持悬空
时,LDO 的输出稳定在轻负载以下。这种情况下的轻
负载驱动电流来源于 VBIAS。此特性对于 节能应用特别
有效, 在这些应用中,禁止直流-直流转换器连接至 IN
引脚,但仍需要 LDO 将电压稳定至轻负载。
低静态电流:38μA
绝佳的负载瞬态响应:
±15mV(当 1μs 内 ILOAD = 0mA 跳至 350 mA 时)
•
•
•
•
•
低噪声:48μVRMS(10Hz 至 100kHz)
80dB VIN PSRR(10Hz 至 10kHz)
70dB VBIAS PSRR (10Hz 至 10kHz)
快速启动时间:140μs
TPS720-Q1 与陶瓷电容器搭配使用时可保持稳定,并
且该器件使用先进的 BICMOS 制造工艺,能够在
350mA 输出负载电流时产生仅 110mV 的压降。
TPS720-Q1 搭配 2.2μF 输出电容时,可实现 VOUT 单
调升高(过冲限制为 3%)的同时 VIN 浪涌电流限制为
内置软启动,单调 VOUT 升高并且启动电流限制在
100mA + ILOAD
•
•
•
•
过流和热保护
低压降:110mV(当 ILOAD = 350mA 时)
与 2.2μF 输出电容一起工作时保持稳定
封装:2.00mm × 2.00mm、6 引脚 WSON
100mA + ILOAD
。
TPS720-Q1 使用一个高精度电压基准和反馈环路来实
现负载、线路、过程和温度变化范围上 2% 的总精
度。TPS720-Q1 采用 6 引脚 WSON 封装。该系列器
件的额定工作温度范围为 TJ = –40°C 至 +125°C。
2 应用
•
•
•
•
摄像机模块
平板显示 (FPD) 链路电源
车用信息娱乐系统
器件信息(1)
器件型号
TPS720-Q1
封装
WSON (6)
封装尺寸(标称值)
USB 网络集线器 (HUB) 电源
2.00mm x 2.00mm
简化电路原理图
(1) 要了解所有可用封装,请见数据表末尾的可订购产品附录。
VBATT
CBIAS
BIAS
2.3 V
1.8 V
Standalone
VCORE
IN
OUT
DC-DC
Converter
or PMU
TPS720-Q1
CIN
COUT
EN
GND
VEN
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SBVS278
TPS720-Q1
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
www.ti.com.cn
目录
1
2
3
4
5
6
特性.......................................................................... 1
应用.......................................................................... 1
说明.......................................................................... 1
修订历史记录 ........................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 3
6.1 Absolute Maximum Ratings ...................................... 3
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements................................................ 6
6.7 Typical Characteristics.............................................. 7
Detailed Description ............................................ 11
7.1 Overview ................................................................. 11
7.2 Functional Block Diagram ....................................... 11
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 12
8
9
Application and Implementation ........................ 13
8.1 Application Information............................................ 13
8.2 Typical Application .................................................. 14
Power Supply Recommendations...................... 16
10 Layout................................................................... 16
10.1 Layout Guidelines ................................................. 16
10.2 Layout Example .................................................... 16
10.3 Thermal Considerations........................................ 17
10.4 Power Dissipation ................................................. 17
11 器件和文档支持 ..................................................... 18
11.1 器件支持................................................................ 18
11.2 文档支持................................................................ 18
11.3 接收文档更新通知 ................................................. 18
11.4 社区资源................................................................ 18
11.5 商标....................................................................... 18
11.6 静电放电警告......................................................... 19
11.7 Glossary................................................................ 19
12 机械、封装和可订购信息....................................... 19
7
4 修订历史记录
Changes from Original (February 2016) to Revision A
Page
•
•
已更改 特性部分中的输出电压范围要点从“0.9V 至 3.0V”更改为“0.9V 至 3.6V” ..................................................................... 1
Changed maximum value of "output voltage" parameter from 3.0 V to 3.6 V in Recommended Operating Conditions
table........................................................................................................................................................................................ 4
•
•
•
•
•
Reformatted Thermal Information table note ......................................................................................................................... 4
Changed maximum value of output voltage parameter from 3.0 V to 3.6 V in Electrical Characteristics table .................... 5
已更改 器件命名规则部分 ..................................................................................................................................................... 18
已更改 相关文档部分的格式.................................................................................................................................................. 18
已添加 接收文档更新通知部分 ............................................................................................................................................. 18
2
Copyright © 2016, Texas Instruments Incorporated
TPS720-Q1
www.ti.com.cn
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
5 Pin Configuration and Functions
DRV Package
6-Pin WSON With Exposed Thermal Pad
Top View
OUT
NC
1
2
3
6
5
4
IN
Thermal
(1)
Pad
GND
BIAS
EN
(1) TI recommends connecting the WSON (DRV) package thermal pad to ground.
Pin Functions
PIN
I/O
DESCRIPTION
NAME
OUT
NC
NO.
1
Output pin. A 2.2-μF ceramic capacitor is connected from this pin to ground for stability and to provide load
transients; see Input and Output Capacitor Requirements
O
—
I
2
No connection.
Enable pin. A logic high signal on this pin turns the device on and regulates the voltage from IN to OUT.
A logic low on this pin turns the device off.
EN
3
Bias supply pin. For better transient performance, TI recommends bypassing this input with a ceramic
capacitor to ground; see Input and Output Capacitor Requirements
BIAS
GND
IN
4
5
6
I
—
I
Ground pin.
Input pin. This pin can be a maximum of 4.5 V; VIN must not exceed VBIAS. Bypass this input with a ceramic
capacitor to ground; see Input and Output Capacitor Requirements.
6 Specifications
6.1 Absolute Maximum Ratings
at TJ = –40°C to +125°C (unless otherwise noted); all voltages are with respect to GND(1)
MIN
MAX
UNIT
(2)
VIN
Input voltage (steady-state)
Peak transient input
–0.3
VBIAS or 5(3)
V
V
V
V
V
(4)
VIN_PEAK
VBIAS
VEN
5.5
6
Bias voltage
–0.3
–0.3
–0.3
Enable voltage
6
VOUT
IOUT
Output voltage
5
Peak output current
Internally limited
Output short-circuit duration
Total continuous power dissipation
Operating junction temperature
Storage temperature
Indefinite
PDISS
TJ
See Thermal Information
–55
–55
125
150
°C
°C
Tstg
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) To ensure proper device operation, VIN must be less than or equal to VBIAS under all conditions.
(3) Whichever is less.
(4) For durations no longer than 1 ms each, for a total of no more than 1000 occurrences over the lifetime of the device.
Copyright © 2016, Texas Instruments Incorporated
3
TPS720-Q1
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
www.ti.com.cn
6.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±2000
±500
±100
V(ESD)
Electrostatic discharge
V
Machine model (MM)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating junction temperature range (unless otherwise noted).
MIN
NOM
MAX
VBIAS or 4.5(1)
UNIT
V
VIN
Input voltage (steady-state)
Bias voltage
1.1
VBIAS
VOUT
IOUT
VEN
2.6 or VOUT + 1.4(2)
5.5
3.6
350
5.5
V
Output voltage
0.9
0
V
Peak output current
Enable voltage
mA
V
0
CIN
Input capacitance
Bias capacitance
Output capacitance
1
µF
µF
µF
CBIAS
COUT
0.1
(3)
2.2
(1) Whichever is less.
(2) Whichever is greater.
(3) Maximum ESR must be less than 250 mΩ.
6.4 Thermal Information
TPS720-Q1
THERMAL METRIC(1)
DRV (WSON)
6 PINS
66.5
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
86.2
36.1
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
1.7
ψJB
36.6
RθJC(bot)
7.4
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).
4
Copyright © 2016, Texas Instruments Incorporated
TPS720-Q1
www.ti.com.cn
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
6.5 Electrical Characteristics
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V ) or 2.6 V (whichever is greater), VIN ≥ VOUT
+ 0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VBIAS or
4.5(2)
VIN
Input voltage
1.1(1)
V
VBIAS
Bias voltage
Output voltage(4)
2.6
0.9
5.5
3.6
V
V
VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V,
VOUT + 0.5 V ≤ VIN ≤ 4.5 V,
0 mA ≤ IOUT ≤ 350 mA
Over VBIAS, VIN, IOUT
TJ = –40°C to +125°C
,
–2%
–25
2%
25
(3)
VOUT
Output
accuracy
VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V,
VOUT + 0.5 V ≤ VIN ≤ 4.5 V,
0 mA ≤ IOUT ≤ 350 mA, VOUT < 1.2 V
Over VBIAS, VIN, IOUT
,
mV
TJ = –40°C to +125°C
VOUT + 1.4 V ≤ VBIAS ≤ 5.5 V,
0 μA ≤ IOUT ≤ 500 μA
VIN floating
±1%
16
ΔVOUT/ΔVIN
VIN line regulation
VIN = (VOUT + 0.5 V) to 4.5 V, IOUT = 1 mA
μV/V
μV/V
VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is
greater) to 5.5 V, IOUT = 1 mA
ΔVOUT/ΔVBIAS VBIAS line regulation
16
VIN line transient
VBIAS line transient
ΔVIN = 400 mV, tRISE = tFALL = 1 μs
±200
±0.8
–15
μV
mV
ΔVBIAS = 600 mV, tRISE = tFALL = 1 μs
0 mA ≤ IOUT ≤ 350 mA (no load to full load)
0 mA ≤ IOUT ≤ 350 mA, tRISE = tFALL = 1 μs
ΔVOUT/ΔIOUT Load regulation
Load transient
μV/mA
mV
±15
VIN = VOUT(NOM) – 0.1 V,
(VBIAS – VOUT(NOM)) = 1.4 V,
IOUT = 350 mA
VDO_IN
VIN dropout voltage(5)
110
200
mV
VDO_BIAS
ICL
VBIAS dropout voltage(6)
Output current limit
VIN = VOUT(NOM) + 0.3 V, IOUT = 350 mA
VOUT = 0.9 × VOUT(NOM)
IOUT = 100 μA
1.09
600
38
54
0.5
85
85
85
80
70
50
80
80
75
65
55
35
1.4
V
420
800
mA
IGND
Ground pin current
μA
μA
IOUT = 0 mA to 350 mA
VEN ≤ 0.4 V
80
ISHDN
Shutdown current (IGND
)
2.5
f = 10 Hz
f = 100 Hz
VIN – VOUT ≥ 0.5 V,
VBIAS = VOUT + 1.4 V,
IOUT = 350 mA
f = 1 kHz
PSRR
PSRR
VIN power-supply rejection ratio
dB
dB
f = 10 kHz
f = 100 kHz
f = 1 MHz
f = 10 Hz
f = 100 Hz
VIN – VOUT ≥ 0.5 V,
f = 1 kHz
VBIAS power-supply rejection ratio VBIAS = VOUT + 1.4 V,
IOUT = 350 mA
f = 10 kHz
f = 100 kHz
f = 1 MHz
Bandwidth = 10 Hz to 100 kHz, VBIAS ≥ 2.6 V,
VIN = VOUT + 0.5 V
VN
Output noise voltage
Inrush current on VIN
48
μVRMS
VBIAS = (VOUT +1.4 V) or 2.6 V (whichever is
greater), VIN = VOUT + 0.5 V
IVIN_INRUSH
100 + ILOAD
1.1
mA
VEN(HI)
VEN(LO)
Enable pin high (enabled)
Enable pin low (disabled)
V
V
0
0.4
(1) Performance specifications are ensured to a minimum VIN = VOUT + 0.5 V.
(2) Whichever is less.
(3) Minimum VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is greater) and VIN = VOUT + 0.5 V.
(4) VO nominal value is factory programmable through the on-chip EEPROM.
(5) Measured for devices with VOUT(NOM) ≥ 1.2 V.
(6) VBIAS – VOUT with VOUT = VOUT(NOM) – 0.1 V. Measured for devices with VOUT(NOM) ≥ 1.8 V.
Copyright © 2016, Texas Instruments Incorporated
5
TPS720-Q1
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
www.ti.com.cn
Electrical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V ) or 2.6 V (whichever is greater), VIN ≥ VOUT
+ 0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
PARAMETER
TEST CONDITIONS
VEN = 5.5 V, VIN = 4.5 V, VBIAS = 5.5 V
VBIAS rising
MIN
TYP
MAX
1
UNIT
µA
IEN
Enable pin current
Undervoltage lockout
UVLO hysteresis
2.35
2.45
150
160
140
2.59
V
UVLO
VBIAS falling
mV
Shutdown, temperature increasing
Reset, temperature decreasing
TSD
TJ
Thermal shutdown temperature
Operating junction temperature
°C
°C
–40
125
6.6 Timing Requirements
MIN
NOM
MAX
UNIT
tSTR
Start-up time
VOUT = 95%, VOUT (NOM), IOUT = 350 mA, COUT = 2.2 μF
140
µs
6
Copyright © 2016, Texas Instruments Incorporated
TPS720-Q1
www.ti.com.cn
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
6.7 Typical Characteristics
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is greater), VIN = VOUT
0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
+
1.83
1.82
1.81
1.8
1.83
1.82
1.81
1.8
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
1.79
1.79
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
4
4.1 4.2 4.3 4.4 4.5
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
4
4.1 4.2 4.3 4.4 4.5
Input Voltage (V)
Input Voltage (V)
IOUT = 0 mA
IOUT = 350 mA
Figure 1. VIN Line Regulation (No Load)
Figure 2. VIN Line Regulation (350 mA)
1.83
1.82
1.81
1.8
1.83
1.82
1.81
1.8
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
1.79
1.79
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
4
4.1 4.2 4.3 4.4 4.5
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
4
4.1 4.2 4.3 4.4 4.5
Bias Voltage (V)
Input Voltage (V)
IOUT = 0 mA
IOUT = 350 mA
Figure 3. VBIAS Line Regulation (No Load)
Figure 4. VBIAS Line Regulation (350 mA)
1.83
1.82
1.81
1.8
1.83
1.82
1.81
1.8
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
1.79
1.79
0
1
2
3
4
5
6
7
8
9
10
0
50
100
150
200
250
300
350
Output Current (mA)
Output Current (mA)
Figure 5. Load Regulation Under Light Loads
Figure 6. Load Regulation
Copyright © 2016, Texas Instruments Incorporated
7
TPS720-Q1
ZHCSEN1A –FEBRUARY 2016–REVISED OCTOBER 2016
www.ti.com.cn
Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is greater), VIN = VOUT
+
0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
2
1.96
1.92
1.88
1.84
1.8
2
1.96
1.92
1.88
1.84
1.8
VBIAS = 3.2 V
VBIAS = 3.5 V
VBIAS = 4 V
VBIAS = 4.5 V
VBIAS = 5 V
TJ = 125èC
TJ = 105èC
TJ = 85èC
TJ = 25èC
TJ = 0èC
VBIAS = 5.5 V
TJ = -40èC
1.76
1.72
1.68
1.64
1.6
1.76
1.72
1.68
1.64
1.6
0
0.5
1
1.5
2
2.5
3
3.5
0
0.25
0.5
0.75
1
Output Current (mA)
Output Current (mA)
VBIAS = 3.2 V
Figure 7. Load Regulation With VIN Floating
Figure 8. Load Regulation With VIN Floating
1.15
1.14
1.13
1.12
1.11
1.1
160
140
120
100
80
125°C
105°C
1.09
1.08
1.07
1.06
1.05
1.04
60
-40°C
-10°C
25°C
40
85°C
20
0
350
5
20 35 50 65 80 95 110 125
0
50
100
150
200
250
300
-40 -25 -10
Output Current (mA)
Junction Temperature (°C)
IOUT = 350 mA
VOUT = VOUT(NOM) – 0.1 V
Figure 9. VIN Dropout Voltage vs Output Current
Figure 10. VBIAS Dropout Voltage vs Junction Temperature
1.83
50
45
40
35
30
25
IOUT = 0 mA
IOUT = 1 mA
IOUT = 350 mA
1.82
1.81
1.8
125°C
105°C
85°C
25°C
-10°C
-40°C
20
15
10
5
0
1.79
4.5
5.5
2.5
3
3.5
4
5
-40 -25 -10
5
20 35 50 65 80 95 110 125
Junction Temperature (èC)
VBIAS (V)
IOUT = 1 mA
Figure 11. Output Voltage vs Junction Temperature
Figure 12. Ground Pin Current vs VBIAS Voltage
8
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Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is greater), VIN = VOUT
0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
+
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
105°C
25°C
125°C
85°C
-40°C
-10°C
350
5
20 35 50 65 80 95 110 125
0
50
100
150
200
250
300
-40 -25 -10
Output Current (mA)
Junction Temperature (°C)
IOUT = 350 mA
Figure 13. Ground Pin Current vs Output Current
Figure 14. Ground Pin Current vs Junction Temperature
3
675
2.5
2
650
-10°C
-40°C
25°C
625
600
575
550
-40°C
-10°C
25°C
85°C
1.5
1
125°C
105°C
85°C
105°C
125°C
0.5
0
4.5
5.5
4.5
5.5
2.5
3
3.5
4
5
2.5
3
3.5
4
5
VBIAS (V)
VBIAS (V)
Figure 15. Shutdown Current vs VBIAS Voltage
Figure 16. Current Limit vs VBIAS Voltage
675
650
625
600
575
550
120
100
80
60
40
20
0
IOUT = 0 mA
-10°C
-40°C
25°C
IOUT = 50 mA
IOUT = 350 mA
85°C
105°C
125°C
4.5
10M
2.5
3
3.5
Input Voltage (V)
4
10
100
1k
10k
100k
1M
Frequency (Hz)
VIN – VOUT = 0.5 V, VBIAS – VOUT = 1.4 V
Figure 18. VIN Power-Supply Rejection Ratio vs Frequency
Figure 17. Current Limit vs Input Voltage
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Typical Characteristics (continued)
over operating temperature range (TJ = –40°C to +125°C), VBIAS = (VOUT + 1.4 V) or 2.6 V (whichever is greater), VIN = VOUT
+
0.5 V, IOUT = 1 mA, VEN = 1.1 V, and COUT = 2.2 μF (unless otherwise noted); typical values are at TJ = 25°C
100
80
60
40
20
0
100
80
60
40
20
0
(VIN - VOUT) = 350 mV
IOUT = 1 mA
(VIN - VOUT) = 300 mV
(VIN - VOUT) = 250 mV
IOUT = 350 mA
10M
10M
10
100
1k
10k
100k
1M
10
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
IOUT = 350 mA
VIN – VOUT = 0.5 V
VBIAS – VOUT = 1.4 V
Figure 19. VIN Power-Supply Rejection Ratio vs Frequency
Figure 20. VBIAS Power-Supply Rejection Ratio vs Frequency
10
VOUT
1 mV/div
1
0.1
VIN
200 mV/div
0.01
100k
100
1k
10k
100 ms/div
Frequency (Hz)
VIN = 2.1 to 2.5 V
VOUT = 1.8 V
VBIAS = 3.2 V
VIN slew rate = 1 V/μs
IOUT = 350 mA
Figure 22. VIN Line Transient Response
Figure 21. Output Spectral Noise Density vs Frequency
VOUT
VOUT
10 mV/div
1 mV/div
300 mA
IOUT
VBIAS
0 mA
200 mV/div
100 mA/div
100 ms/div
100 ms/div
VIN = 2.3 V
VOUT = 1.8 V
VBIAS = 3.2 V to 3.8 V
IOUT = 350 mA
VOUT = 1.8 V
VIN = 2.3 V
VBIAS = 3.2 V
tRISE = 1 μs
VBIAS slew rate = 600 m/μs
Figure 23. VBIAS Line Transient Response
Figure 24. Load Transient Response
10
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7 Detailed Description
7.1 Overview
The TPS720-Q1 family of LDO regulators uses innovative circuitry to achieve ultra-wide bandwidth and high loop
gain, resulting in extremely high PSRR (up to 1 MHz) at very low headroom (VIN – VOUT). The implementation of
the BIAS pin on the TPS720-Q1 vastly improves efficiency of low VOUT applications by allowing the use of a pre-
regulated, low-voltage input supply. The TPS720-Q1 supports a novel feature where the output of the LDO
regulates under light loads (< 500 μA) when the IN pin is left floating. The light-load drive current is sourced from
VBIAS under this condition. This feature is particularly useful in power-saving applications where the dc-dc
converter connected to the IN pin is disabled but the LDO is still required to regulate the voltage to a light load.
These features, combined with low noise, low ground pin current, and ultra-small packaging, make this device
ideal for portable applications. This family of regulators offers sub-band-gap output voltages, current limit, and
thermal protection, and is fully specified from –40°C to +125°C.
7.2 Functional Block Diagram
IN
OUT
Current
Limit
Thermal
Shutdown
BIAS
UVLO
Band Gap
EN
7.3 Feature Description
7.3.1 Internal Current Limit
The TPS720-Q1 internal current limits help protect the regulator during fault conditions. During current limit, the
output sources a fixed amount of current that is largely independent of output voltage. In such a case, the output
voltage is not regulated, and is VOUT = ILIMIT × RLOAD. The NMOS pass transistor dissipates (VIN – VOUT) × IOUT
until thermal shutdown is triggered and the device is turned off. When the device cools down, the internal thermal
shutdown circuit turns the device back on. If the fault condition continues, the device cycles between current limit
and thermal shutdown; see Thermal Considerations for more details.
The NMOS pass element in the TPS720-Q1 has a built-in body diode that conducts current when the voltage at
OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is
anticipated, TI recommends external limiting to 5% of rated output current.
7.3.2 Inrush Current Limit
The TPS720-Q1 family of LDO regulators implements a novel inrush current limit circuit architecture: the current
drawn through the IN pin is limited to a finite value. This IINRUSHLIMIT charges the output to the final voltage. All
current drawn through VIN charges the output capacitance when the load is disconnected. Equation 1 shows the
inrush current limit performed by the circuit.
IINRUSHLIMIT ( A ) = COUT(mF)x0.454545(V / ms)+ ILOAD (A)
(1)
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Feature Description (continued)
Assuming a COUT of 2.2 μF with the load disconnected (that is, ILOAD = 0), the IINRUSHLIMIT is calculated to be
100 mA. The inrush current charges the LDO output capacitor. If the output of the LDO regulates to 1.3 V, then
the LDO charges the output capacitor to the final output value in approximately 28.6 μs.
Another consideration is when a load is connected to the output of an LDO. The TPS720-Q1 inrush current limit
circuit employs a technique that supplies not only the IINRUSHLIMIT, but the additional current required by the load.
If ILOAD = 350 mA, then IINRUSHLIMIT calculates to be approximately 450 mA (from Equation 1).
7.3.3 Shutdown
The enable pin (EN) is active high and is compatible with standard and low-voltage, TTL-CMOS levels. When
shutdown capability is not required, EN can be connected to the IN pin.
7.3.4 Undervoltage Lockout (UVLO)
The TPS720-Q1 uses an undervoltage lockout circuit on the BIAS pin to keep the output shut off until the internal
circuitry is operating properly. The UVLO circuit has a deglitch feature that typically ignores undershoot transients
on the input if these transients are less than 50 μs in duration.
7.4 Device Functional Modes
Driving the EN pin over 1.1 V turns on the regulator. Driving the EN pin below 0.4 V causes the regulator to enter
shutdown mode. In shutdown, the current consumption of the device is typically reduced to 500 nA.
12
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Input and Output Capacitor Requirements
Although a capacitor is not required for stability on the IN pin, good analog design practice is to connect a 0.1-μF
to 1-μF low equivalent series resistance (ESR) capacitor across the IN pin input supply near the regulator. This
capacitor counteracts reactive input sources and improves transient response, noise rejection, and ripple
rejection. A higher-value capacitor may be necessary if large, fast rise-time load transients are anticipated, or if
the device is located far from the power source. If source impedance is not sufficiently low, a 0.1-μF input
capacitor may be necessary to ensure stability.
The BIAS pin does not require an input capacitor because BIAS does not source high currents. However, if
source impedance is not sufficiently low, TI recommends a small 0.1-µF bypass capacitor.
The TPS720-Q1 is designed to be stable with standard ceramic capacitors with values of 2.2 μF or larger at the
output. X5R- and X7R-type capacitors are best because they have minimal variation in value and ESR over
temperature. Maximum ESR must be less than 250 mΩ.
8.1.2 Output Regulation With the IN Pin Floating
The TPS720-Q1 supports a novel feature where the output of the LDO regulates under light loads when the IN
pin is left floating. Under normal conditions when the IN pin is connected to a power source, the BIAS pin draws
only tens of milliamperes. However, when the IN pin is floating, an innovative circuit allows a maximum current of
500 μA to be drawn by the load through the BIAS pin and maintains the output in regulation. This feature is
particularly useful in power-saving applications where a dc-dc converter connected to the IN pin is disabled, but
the LDO is required to regulate the output voltage to a light load.
Figure 25 shows an application example where a microcontroller is not turned off (to maintain the state of the
internal memory), but where the regulated supply (shown as the TPS62xxx) is turned off to reduce power. In this
case, the TPS720-Q1 BIAS pin provides sufficient load current to maintain a regulated voltage to the
microcontroller.
10 mH
2.6 V to 5.5 V
BIAS
VIN
EN
IN
OUT
SW
FB
TPS62xxx
TPS720-Q1
2.2 mF
10 mF
EN
GND
GND
Microcontroller
Control to turn on or off the dc-dc.
The output of the dc-dc is floating when
the TPS62xxx EN pin is low.
Figure 25. Floating IN Pin Regulation Example
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Application Information (continued)
8.1.3 Dropout Voltage
The TPS720-Q1 uses a NMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the
dropout voltage (VDO), the NMOS pass device is in the linear region of operation and the input-to-output
resistance is the RDS(ON) of the NMOS pass element. VDO approximately scales with output current because the
NMOS device behaves like a resistor in dropout.
PSRR and transient response are degraded when (VIN – VOUT) approaches dropout. This effect is shown in
Figure 19.
8.1.4 Transient Response
Increasing the size of the output capacitor reduces overshoot and undershoot magnitude but increases duration
of the transient response.
8.1.5 Minimum Load
The TPS720-Q1 is stable with no output load. Although some LDOs suffer from low loop gain at very light output
loads, the TPS720-Q1 employs an innovative, low-current mode circuit under very light or no-load conditions
which improves output voltage regulation performance.
8.2 Typical Application
VBATT
CBIAS
BIAS
1.8 V
1.3 V
Standalone
dc/dc
VCORE
IN
OUT
TPS720xx
Converter
or PMU
CIN
COUT
EN
GND
VEN
Figure 26. Typical Application Schematic
8.2.1 Design Requirements
Table 1 lists the parameters for this design example.
Table 1. Design Parameters
DESIGN PARAMETER
EXAMPLE VALUE
VIN
2.3 V
3.2 V
1.8 V
VBIAS
VOUT
IOUT
10-mA typical, 350-mA peak
14
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8.2.2 Detailed Design Procedures
TI recommends selecting the minimum component size; a small size solution for this design example is desired.
Set CIN = 1 µF, C BIAS = 100 nF, and COUT = 2.2 µF.
8.2.3 Application Curves
1.83
1.82
1.81
1.8
1.83
1.82
1.81
1.8
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
TJ = -40°C
TJ = 0°C
TJ = 25°C
TJ = 85°C
TJ = 105°C
TJ = 125°C
1.79
1.79
3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9
4
4.1 4.2 4.3 4.4 4.5
0
50
100
150
200
250
300
350
Input Voltage (V)
Output Current (mA)
IOUT = 350 mA
Figure 27. VIN Line Regulation
Figure 28. Load Regulation
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9 Power Supply Recommendations
The input supply and bias supply for the LDO must be within the recommended operating conditions and must
provide adequate headroom for the device to have a regulated output. The minimum capacitor requirements
must be met, and if the input supply is noisy, additional input capacitors with low ESR can improve transient
performance.
10 Layout
10.1 Layout Guidelines
TI recommends designing the board with separate ground planes for VIN and VOUT, with the ground plane
connected only at the GND pin of the device to improve ac performance (such as PSRR, output noise, and
transient response.) In addition, the ground connection for the output capacitor must be connected directly to the
GND pin of the device. High equivalent series resistance (ESR) capacitors can degrade PSRR. The BIAS pin
draws very little current and can be routed as a signal. Take care to shield the BIAS pin from high frequency
coupling.
10.2 Layout Example
Ground Plane
To Enable
Signal
To Bias Supply
4
5
BIAS
GND
EN
NC
3
2
1
CBIAS
COUT
CIN
6
IN
OUT
To Load
To Input Supply
Ground Plane
Figure 29. Recommended Layout
16
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10.3 Thermal Considerations
Thermal protection disables the output when the junction temperature rises to approximately +160°C, allowing
the device to cool. When the junction temperature cools to approximately +140°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit can cycle on and off. This cycling limits the dissipation of the regulator, protecting the regulator from
damage as a result of overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heat sink. For reliable operation, limit junction temperature to a maximum of +125°C. To estimate the margin of
safety in a complete design (including heat sink), increase the ambient temperature until the thermal protection is
triggered; use worst-case loads and signal conditions. For good reliability, trigger thermal protection at least 35°C
above the maximum expected ambient condition of the particular application. This configuration produces a
worst-case junction temperature of +125°C at the highest expected ambient temperature and worst-case load.
The internal protection circuitry of the TPS720-Q1 is designed to protect against overload conditions. This
circuitry is not intended to replace proper heat sinking. Continuously running the TPS720-Q1 into thermal
shutdown degrades device reliability.
10.4 Power Dissipation
The printed-circuit-board (PCB) area around the device that is free of other components moves the heat from the
device to ambient air. Performance data for JEDEC boards are given in the Thermal Information table. Using
heavier copper increases the effectiveness in removing heat from the device. The addition of plated through-
holes to heat-dissipating layers also improves the heat sink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation (PD) is equal to the product of
the output current times the voltage drop across the output pass element (VIN to VOUT), as shown in Equation 2:
PD =(VIN - VOUT )ì IOUT
(2)
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11 器件和文档支持
11.1 器件支持
11.1.1 开发支持
11.1.1.1 评估模块
评估模块 (EVM) 可与 TPS720-Q1 配套使用,帮助评估初始电路性能。TPS720xxDRVEVM 评估模块(和相关用
户指南)可在德州仪器 (TI) 网站上的产品文件夹中获取,也可直接从 TI 网上商店购买。
的表注中的输出电压范围从“0.9V 至 3.0V”更改为“0.9V 至 3.3V”
11.1.2 器件命名规则
表 2. 器件命名规则(1)(2)
产品
VOUT
xx(x) 为标称输出电压。对于分辨率为 100mV 的输出电压,订货编号中使用两位数字;否则,使用三位数
字(例如,28 = 2.8V;125 = 1.25V)。
yyy 为封装标识符。
TPS720xx(x)QyyyzQ1
z 为封装数量。R 表示 3000 片,T 表示 250 片。
(1) 要获得最新的封装和订货信息,请参见本文档末尾的封装选项附录,或者访问器件产品文件夹(www.ti.com.cn)。
(2) 可提供 0.9V 至 3.3V 范围内的输出电压(以 50mV 为单位增量)。更多详细信息及可用性,请联系制造商。
11.2 文档支持
11.2.1 相关文档ꢀ
相关文档如下:
•
•
•
《高效降压低功耗 DC-DC 转换器》(文献编号:SGLS243)。
《TPS720xxDRVEVM 评估模块》(文献编号:SBVU024)。
《使用新的热指标》(文献编号:SBVA025)。
11.3 接收文档更新通知
如需接收文档更新通知,请访问 www.ti.com.cn 网站上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册
后,即可每周定期收到已更改的产品信息。有关更改的详细信息,请查阅已修订文档中包含的修订历史记录。
11.4 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.5 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
18
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11.6 静电放电警告
ESD 可能会损坏该集成电路。德州仪器 (TI) 建议通过适当的预防措施处理所有集成电路。如果不遵守正确的处理措施和安装程序 , 可
能会损坏集成电路。
ESD 的损坏小至导致微小的性能降级 , 大至整个器件故障。 精密的集成电路可能更容易受到损坏 , 这是因为非常细微的参数更改都可
能会导致器件与其发布的规格不相符。
11.7 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本,请查阅左侧的导航栏。
版权 © 2016, Texas Instruments Incorporated
19
重要声明
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JESD48 最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息, 并验证这些信息是否完整且是最新的。所有产品的销售
都遵循在订单确认时所提供的TI 销售条款与条件。
TI 保证其所销售的组件的性能符合产品销售时 TI 半导体产品销售条件与条款的适用规范。仅在 TI 保证的范围内,且 TI 认为 有必要时才会使
用测试或其它质量控制技术。除非适用法律做出了硬性规定,否则没有必要对每种组件的所有参数进行测试。
TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用 TI 组件的产品和应用自行负责。为尽量减小与客户产品和应 用相关的风险,
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在转售 TI 组件或服务时,如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分,则会失去相关 TI 组件 或服务的所有明
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客户认可并同意,尽管任何应用相关信息或支持仍可能由 TI 提供,但他们将独力负责满足与其产品及在其应用中使用 TI 产品 相关的所有法
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及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而
对 TI 及其代理造成的任何损失。
在某些场合中,为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特 有的可满足适用
的功能安全性标准和要求的终端产品解决方案。尽管如此,此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III(或类似的生命攸关医疗设备)的授权许可,除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意,对并非指定面
向军事或航空航天用途的 TI 组件进行军事或航空航天方面的应用,其风险由客户单独承担,并且由客户独 力负责满足与此类使用相关的所有
法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品,这些产品主要用于汽车。在任何情况下,因使用非指定产品而无法达到 ISO/TS16949 要
求,TI不承担任何责任。
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IMPORTANT NOTICE
邮寄地址: 上海市浦东新区世纪大道1568 号,中建大厦32 楼邮政编码: 200122
Copyright © 2016, 德州仪器半导体技术(上海)有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS72009QDRVRQ1
TPS720105QDRVRQ1
TPS72010QDRVRQ1
TPS720115QDRVRQ1
TPS72011QDRVRQ1
TPS72012QDRVRQ1
TPS72015QDRVRQ1
TPS72018QDRVRQ1
TPS72025QDRVRQ1
TPS72027QDRVRQ1
TPS720285QDRVRQ1
TPS72028QDRVRQ1
TPS72029QDRVRQ1
TPS72030QDRVRQ1
TPS72033QDRVRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
WSON
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
DRV
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
11P
15G
11Q
15H
11I
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
NIPDAU
11R
11J
11K
11W
15I
11M
11L
11N
11O
15J
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
GENERIC PACKAGE VIEW
DRV 6
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4206925/F
PACKAGE OUTLINE
DRV0006A
WSON - 0.8 mm max height
SCALE 5.500
PLASTIC SMALL OUTLINE - NO LEAD
2.1
1.9
A
B
PIN 1 INDEX AREA
2.1
1.9
0.8
0.7
C
SEATING PLANE
0.08 C
(0.2) TYP
0.05
0.00
1
0.1
EXPOSED
THERMAL PAD
3
4
6
2X
7
1.3
1.6 0.1
1
4X 0.65
0.35
0.25
6X
PIN 1 ID
(OPTIONAL)
0.3
0.2
6X
0.1
C A
C
B
0.05
4222173/B 04/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
6X (0.45)
6X (0.3)
(1)
1
7
6
SYMM
(1.6)
(1.1)
4X (0.65)
4
3
SYMM
(1.95)
(R0.05) TYP
(
0.2) VIA
TYP
LAND PATTERN EXAMPLE
SCALE:25X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4222173/B 04/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
www.ti.com
EXAMPLE STENCIL DESIGN
DRV0006A
WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
SYMM
7
6X (0.45)
METAL
1
6
6X (0.3)
(0.45)
SYMM
4X (0.65)
(0.7)
4
3
(R0.05) TYP
(1)
(1.95)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
www.ti.com
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TI 均以“原样”提供技术性及可靠性数据(包括数据表)、设计资源(包括参考设计)、应用或其他设计建议、网络工具、安全信息和其他资
源,不保证其中不含任何瑕疵,且不做任何明示或暗示的担保,包括但不限于对适销性、适合某特定用途或不侵犯任何第三方知识产权的暗示
担保。
所述资源可供专业开发人员应用TI 产品进行设计使用。您将对以下行为独自承担全部责任:(1) 针对您的应用选择合适的TI 产品;(2) 设计、
验证并测试您的应用;(3) 确保您的应用满足相应标准以及任何其他安全、安保或其他要求。所述资源如有变更,恕不另行通知。TI 对您使用
所述资源的授权仅限于开发资源所涉及TI 产品的相关应用。除此之外不得复制或展示所述资源,也不提供其它TI或任何第三方的知识产权授权
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TI 所提供产品均受TI 的销售条款 (http://www.ti.com.cn/zh-cn/legal/termsofsale.html) 以及ti.com.cn上或随附TI产品提供的其他可适用条款的约
束。TI提供所述资源并不扩展或以其他方式更改TI 针对TI 产品所发布的可适用的担保范围或担保免责声明。IMPORTANT NOTICE
邮寄地址:上海市浦东新区世纪大道 1568 号中建大厦 32 楼,邮政编码:200122
Copyright © 2020 德州仪器半导体技术(上海)有限公司
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