TPS73130MDBVREP [TI]

CAP-FREE NMOS 150 mA LOW DROPOUT REGULATOR WITH REVERSE CURRENT PROTECTION; 具有反向电流保护无电容NMOS 150毫安低压差稳压器
TPS73130MDBVREP
型号: TPS73130MDBVREP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

CAP-FREE NMOS 150 mA LOW DROPOUT REGULATOR WITH REVERSE CURRENT PROTECTION
具有反向电流保护无电容NMOS 150毫安低压差稳压器

线性稳压器IC 调节器 电源电路 光电二极管 输出元件 PC
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TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
CAP-FREE NMOS 150 mA LOW DROPOUT REGULATOR  
WITH REVERSE CURRENT PROTECTION  
1
FEATURES  
2
Controlled Baseline  
Low Noise: 30 μVRMS Typ (10 kHz to 100 kHz)  
One Assembly  
Test Site  
0.5% Initial Accuracy  
1% Overall Accuracy Over Line, Load, and  
Temperature  
One Fabrication Site  
Less Than 1 μA Maximum IQ in Shutdown  
Mode  
Extended Temperature Performance of  
–55°C to 125°C  
Thermal Shutdown and Specified Min/Max  
Current Limit Protection  
Enhanced Diminishing Manufacturing Sources  
(DMS) Support  
Available in Multiple Output Voltage Versions  
Enhanced Product-Change Notification  
(1)  
Fixed Outputs of 1.2 V to 5 V  
Adjustable Outputs from 1.2 V to 5.5 V  
Custom Outputs Available  
Qualification Pedigree  
Stable With No Output Capacitor or Any Value  
or Type of Capacitor  
Input Voltage Range of 1.7 V to 5.5 V  
APPLICATIONS  
Ultralow Dropout Voltage: 30 mV Typical  
Portable/Battery-Powered Equipment  
Post-Regulation for Switching Supplies  
Noise-Sensitive Circuitry such as VCOs  
Point of Load Regulation for DSPs, FPGAs,  
ASICs, and Microprocessors  
Excellent Load Transient Response—With or  
Without Optional Output Capacitor  
New NMOS Topology Provides Low Reverse  
Leakage Current  
(1) Component qualification in accordance with JEDEC and  
industry standards to ensure reliable operation over an  
extended temperature range. This includes, but is not limited  
to, Highly Accelerated Stress Test (HAST) or biased 85/85,  
temperature cycle, autoclave or unbiased HAST,  
electromigration, bond intermetallic life, and mold compound  
life. Such qualification testing should not be viewed as  
justifying use of this component beyond specified  
performance and environmental limits.  
DESCRIPTION/ORDERING INFORMATION  
The TPS731xx family of low-dropout (LDO) linear voltage regulators uses a new topology: an NMOS pass  
element in a voltage-follower configuration. This topology is stable using output capacitors with low ESR and  
even allows operation without a capacitor. It also provides high reverse blockage (low reverse current) and  
ground pin current that is nearly constant over all values of output current.  
The TPS731xx uses an advanced BiCMOS process to yield high precision while delivering low dropout voltages  
and low ground pin current. Current consumption, when not enabled, is under 1 μA and ideal for portable  
applications. The low output noise (30 μVRMS with 0.1 μF CNR) is ideal for powering VCOs. These devices are  
protected by thermal shutdown and foldback current limit.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2007, Texas Instruments Incorporated  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
Optional  
Optional  
DBV PACKAGE  
SOT23  
(TOP VIEW)  
VIN  
VOUT  
IN  
OUT  
TPS731xx  
GND  
EN  
NR  
5
4
IN  
GND  
EN  
1
2
3
OUT  
Optional  
Typical Application Circuit for Fixed-Voltage Versions  
NR/FB  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
PRODUCT INFORMATION(1)  
(2)  
PRODUCT  
VOUT  
TPS731xxMyyyzEP  
XX is nominal output voltage (for example, 25 = 2.5 V, 01 = Adjustable(3)).  
YYY is package designator.  
Z is package quantity.  
(1) For the most current specification and package information, see the Package Option Addendum located at the end of this data sheet or  
see the Texas Instruments website at www.ti.com.  
(2) Output voltages from 1.3 V to 4 V in 100 mV increments are available through the use of innovative factory EEPROM programming.  
Minimum order quantities apply; contact factory for details and availability.  
(3) For fixed 1.2 V operation, tie FB to OUT  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TPS73101MDBVREP  
TPS73115MDBVREP  
TPS731125MDBVREP  
TPS73118MDBVREP  
TPS73125MDBVREP  
TPS73130MDBVREP  
TPS73132MDBVREP  
TPS73133MDBVREP  
TPS73150MDBVREP  
TOP-SIDE MARKING  
PKAM  
PKBM  
PMMM  
PKCM  
–55°C to 125°C  
SOT23 - DBV  
PKDM  
PKEM  
PKFM  
PKHM  
PKIM  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
2
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Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
ABSOLUTE MAXIMUM RATINGS  
over operating junction temperature range unless otherwise noted(1)  
VIN range  
–0.3 V to 6 V  
–0.3 V to 6 V  
–0.3 V to 5.5 V  
Internally limited  
Indefinite  
VEN range  
VOUT range  
Peak output current  
Output short-circuit duration  
See Power Dissipation Ratings  
Continuous total power dissipation  
Table  
Ambient temperature range, TA  
Storage temperature range  
ESD rating, HBM  
–55°C to 150°C  
–65°C to 150°C  
2 kV  
ESD rating, CDM  
500 V  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics  
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.  
POWER DISSIPATION RATINGS(1)  
T
A 25°C  
TA = 70°C  
POWER  
RATING  
TA = 85°C  
POWER  
RATING  
TA = 125°C  
POWER  
RATING  
DERATING FACTOR  
ABOVE TA = 25°C  
BOARD  
PACKAGE  
RΘJC  
RΘJA  
POWER  
RATING  
Low-K(2)  
DBV  
DBV  
64°C/W 255°C/W  
64°C/W 180°C/W  
3.9 mW/°C  
5.6 mW/°C  
450 mW  
638 mW  
275 mW  
388 mW  
215 mW  
305 mW  
58 mW  
83 mW  
(3)  
High-K  
(1) See Power Dissipation in the Application Information section for more information related to thermal design.  
(2) The JEDEC Low-K (1s) board design used to derive this data was a 3 inch × 3 inch, two-layer board with 2-ounce copper traces on top  
of the board.  
(3) The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch × 3 inch, multilayer board with 1-ounce internal power and  
ground planes and 2-ounce copper traces on the top and bottom of the board.  
Copyright © 2006–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
 
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
ELECTRICAL CHARACTERISTICS  
Over operating temperature range (TA = –55°C to +125°C), VIN = VOUT(nom) + 0.5 V(1), IOUT = 10 mA, VEN = 1.7 V, and  
COUT = 0.1 μF, unless otherwise noted. Typical values are at TA = 25°C  
PARAMETER  
TEST CONDITIONS  
MIN  
1.7  
TYP  
MAX UNIT  
VIN  
Input voltage range(1)  
Internal reference (TPS73101)  
Output voltage range (TPS73101)  
Nominal  
5.5  
1.21  
V
V
VFB  
TA = 25°C  
1.198  
VFB  
1.2  
5.5 – VDO  
V
TA = 25°C  
±0.5  
±0.5  
%
VOUT  
Accuracy(1)  
VOUT + 0.5 V VIN 5.5 V,  
10 mA IOUT 150 mA  
VIN, IOUT, and T  
–1  
+1  
%
ΔVOUT%/ΔVIN Line regulation(1)  
ΔVOUT%/ΔIOUT Load regulation  
VOUT(nom) + 0.5 V VIN 5.5 V  
1 mA IOUT 150 mA  
0.01  
0.002  
%/V  
%/mA  
mV  
10 mA IOUT 150 mA  
0.0005  
Dropout voltage(2)  
VDO  
IOUT = 150 mA  
30  
100  
500  
(VIN = VOUT (nom) – 0.1 V)  
ZO(DO)  
ICL  
Output impedance in dropout  
Output current limit  
1.7 V VIN VOUT + VDO  
VOUT = 0.9 × VOUT(nom)  
VOUT = 0 V  
0.25  
360  
150  
mA  
mA  
μA  
ISC  
Short-circuit current  
200  
IREV  
Reverse leakage current(3) (–IIN  
)
VEN 0.5 V, 0 V VIN VOUT  
0.1  
15  
550  
750  
1
IOUT = 10 mA (IQ)  
IOUT = 150 mA  
400  
IGND  
Ground pin current  
μA  
550  
ISHDN  
IFB  
Shutdown current (IGND  
)
VEN 0.5 V, VOUT VIN 5.5  
0.02  
μA  
μA  
FB pin current (TPS73101)  
0.1  
0.475  
f = 100 Hz, IOUT = 150 mA  
f = 10 kHz, IOUT = 150 mA  
COUT = 10 μF, No CNR  
58  
Power-supply rejection ratio  
(ripple rejection)  
PSRR  
dB  
37  
27 × VOUT  
8.5 × VOUT  
Output noise voltage  
BW = 10 Hz to 100 kHz  
VN  
μVRMS  
μs  
COUT = 10 μF, CNR = 0.01 μF  
VOUT = 3 V, RL = 30Ω  
COUT = 1 μF, CNR = 0.01 μF  
tSTR  
Startup time  
600  
VEN(HI)  
VEN(LO)  
IEN(HI)  
Enable high (enabled)  
1.7  
0
VIN  
0.5  
0.1  
V
V
Enable low (shutdown)  
Enable pin current (enabled)  
VEN = 5.5 V  
0.02  
160  
140  
μA  
Shutdown, Temperature increasing  
Reset, Temperature decreasing  
TSD  
TA  
Thermal shutdown temperature  
Operating ambient temperature  
°C  
°C  
–55  
125  
(1) Minimum VIN = VOUT + VDO or 1.7 V, whichever is greater.  
(2) VDO is not measured for the TPS73115 (VO(nom) = 1.5 V) and TPS731125 (VO(nom) = 1.25 V) since minimum VIN = 1.7 V.  
(3) Fixed-voltage versions only; see the Applications Infomation section for more information.  
4
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Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
16  
14  
12  
10  
8
6
4
2
0
100  
110  
120  
130  
140  
150  
160  
Continuous Tj (°C)  
A. Tj = θJA × W + TA (at standard JESD 51 conditions)  
Figure 1. Estimated Device Life at Elevated Temperatures  
Electromigration Fail Mode  
Copyright © 2006–2007, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
FUNCTIONAL BLOCK DIAGRAMS  
IN  
4MHz  
Charge Pump  
EN  
Thermal  
Protection  
Ref  
Servo  
27k  
Bandgap  
Error  
Amp  
Current  
Limit  
OUT  
8k  
GND  
R1  
R2  
R1 + R2 = 80k  
NR  
Figure 2. Fixed Voltage Version  
IN  
Table 1. Standard 1%  
Resistor Values for  
Common Output Voltages  
V
O
R
1
R
2
4MHz  
Charge Pump  
1.2V  
1.5V  
1.8V  
2.5V  
2.8V  
3.0V  
3.3V  
5.0V  
Short  
Open  
23.2k  
28.0kΩ  
39.2kΩ  
44.2kΩ  
46.4kΩ  
52.3kΩ  
78.7kΩ  
95.3kΩ  
56.2kΩ  
36.5kΩ  
33.2kΩ  
30.9kΩ  
30.1kΩ  
24.9kΩ  
EN  
Thermal  
Protection  
Ref  
Servo  
27k  
Bandgap  
Error  
Amp  
OUT  
FB  
Current  
Limit  
NOTE: V  
= (R + R )/R × 1.204;  
1 2 2  
OUT  
R
R
19kfor best  
1
2
GND  
80k  
8k  
accuracy.  
R1  
R2  
Figure 3. Adjustable Voltage Version  
6
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Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
 
 
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
PIN ASSIGNMENTS  
DBV PACKAGE  
SOT23  
(TOP VIEW)  
5
4
IN  
GND  
EN  
1
2
3
OUT  
NR/FB  
TERMINAL FUNCTIONS  
TERMINAL  
SOT23  
(DBV)  
DESCRIPTION  
NAME  
PIN NO.  
IN  
1
2
Unregulated input supply  
Ground  
GND  
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into shutdown  
mode. Refer to the Shutdown section under Application Information for more details. EN can be connected to  
IN if not used.  
EN  
NR  
3
4
Fixed voltage versions only—connecting an external capacitor to this pin bypasses noise generated by the  
internal bandgap, reducing output noise to very low levels.  
Adjustable voltage version only—this is the input to the control loop error amplifier, and is used to set the  
output voltage of the device.  
FB  
4
5
OUT  
Output of the regulator. There are no output capacitor requirements for stability.  
Copyright © 2006–2007, Texas Instruments Incorporated  
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7
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
TYPICAL CHARACTERISTICS  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF,  
unless otherwise noted  
LOAD REGULATION  
Referred to IOUT = 10mA  
LINE REGULATION  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0.20  
0.15  
0.10  
0.05  
0
Referred to VIN = VOUT + 0.5V at IOUT = 10mA  
_
+25 C  
_
+125 C  
0.1  
0.2  
0.3  
0.4  
0.5  
0.05  
0.10  
0.15  
0.20  
_
40 C  
0
15  
30 45  
60  
75  
90 105 120 135 150  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
VIN VOUT (V)  
IOUT (mA)  
Figure 4.  
Figure 5.  
DROPOUT VOLTAGE vs OUTPUT CURRENT  
DROPOUT VOLTAGE vs TEMPERATURE  
50  
40  
30  
20  
10  
0
50  
40  
30  
20  
10  
0
TPS73125DBV  
IOUT = 150mA  
TPS73125DBV  
_
+125 C  
_
+25 C  
_
40 C  
25  
0
30  
60  
IOUT (mA)  
Figure 6.  
90  
120  
150  
50  
0
25  
50  
75  
100  
125  
_
Temperature ( C)  
Figure 7.  
OUTPUT VOLTAGE ACCURACY HISTOGRAM  
OUTPUT VOLTAGE DRIFT HISTOGRAM  
IOUT = 10mA  
30  
18  
IOUT = 10mA  
16  
14  
12  
10  
8
All Voltage Versions  
25  
20  
15  
10  
5
6
4
2
0
0
_
VOUT Error (%)  
Worst Case dVOUT/dT (ppm/ C)  
Figure 8.  
Figure 9.  
8
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Copyright © 2006–2007, Texas Instruments Incorporated  
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF,  
unless otherwise noted  
GROUND PIN CURRENT vs OUTPUT CURRENT  
GROUND PIN CURRENT vs TEMPERATURE  
IOUT = 150mA  
700  
600  
500  
400  
300  
200  
100  
0
700  
600  
500  
400  
300  
200  
100  
0
VIN = 5.5V  
VIN = 4V  
VIN = 2V  
VIN = 5.5V  
VIN = 4V  
VIN = 2V  
25  
0
30  
60  
IOUT (mA)  
90  
120  
150  
50  
0
25  
50  
75  
100  
125  
_
Temperature ( C)  
Figure 10.  
Figure 11.  
CURRENT LIMIT vs VOUT  
(FOLDBACK)  
GROUND PIN CURRENT in SHUTDOWN  
vs TEMPERATURE  
400  
350  
300  
250  
200  
150  
100  
50  
1
VENABLE = 0.5V  
VIN = VO + 0.5V  
ICL  
ISC  
0.1  
TPS73133  
0.5  
0
0.01  
25  
0
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
50  
0
25  
50  
75  
100  
125  
VOUT (V)  
_
Temperature ( C)  
Figure 12.  
CURRENT LIMIT vs VIN  
Figure 13.  
CURRENT LIMIT vs TEMPERATURE  
500  
450  
400  
350  
300  
250  
200  
150  
500  
450  
400  
350  
300  
250  
200  
150  
25  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
4.5  
5.0  
5.5  
50  
0
25  
50  
75  
100  
125  
VIN (V)  
_
Temperature ( C)  
Figure 14.  
Figure 15.  
Copyright © 2006–2007, Texas Instruments Incorporated  
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9
Product Folder Link(s): TPS73101-EP TPS73115-EP TPS731125-EP TPS73118-EP TPS73125-EP TPS73130-EP  
TPS73132-EP TPS73133-EP TPS73150-EP  
 
TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF,  
unless otherwise noted  
PSRR (RIPPLE REJECTION) vs FREQUENCY  
PSRR (RIPPLE REJECTION) vs VIN – VOUT  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
40  
35  
30  
25  
20  
15  
10  
5
IO = 1mA  
IO = 1mA  
CO = Any  
CO = 1mF  
IO = 1mA  
CO = 10mF  
IO = 100mA  
CO = 1mF  
IO = 100mA  
CO = Any  
Frequency = 100kHz  
µ
COUT = 10 F  
IO = Any  
VIN = VOUT = 1.25V  
100  
VOUT = 2.5V  
CO = 0mF  
0
1k  
100k  
10  
10k  
1M  
10M  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0  
Frequency (Hz)  
VIN VOUT (V)  
Figure 16.  
Figure 17.  
NOISE SPECTRAL DENSITY  
NOISE SPECTRAL DENSITY  
CNR = 0 μF  
CNR = 0.01 μF  
1
1
µ
COUT = 1 F  
µ
COUT = 1 F  
µ
COUT = 0 F  
0.1  
0.1  
µ
COUT = 10 F  
µ
COUT = 0 F  
µ
COUT = 10 F  
IOUT = 150mA  
10 100  
IOUT = 150mA  
10 100  
0.01  
0.01  
1k  
10k  
100k  
1k  
10k  
100k  
Frequency (Hz)  
Frequency (Hz)  
Figure 18.  
Figure 19.  
RMS NOISE VOLTAGE vs COUT  
RMS NOISE VOLTAGE vs CNR  
60  
50  
40  
30  
20  
10  
0
140  
120  
100  
80  
VOUT = 5.0V  
VOUT = 5.0V  
VOUT = 3.3V  
VOUT = 1.5V  
VOUT = 3.3V  
VOUT = 1.5V  
60  
40  
20  
µ
CNR = 0.01 F  
µ
COUT = 0 F  
10Hz < Frequency < 100kHz  
10Hz < Frequency < 100kHz  
0
0.1  
1
10  
1p  
10p  
100p  
1n  
10n  
µ
COUT ( F)  
CNR (F)  
Figure 20.  
Figure 21.  
10  
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TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
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SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF,  
unless otherwise noted  
TPS73133  
LOAD TRANSIENT RESPONSE  
TPS73133  
LINE TRANSIENT RESPONSE  
µ
COUT = 0 F  
VIN = 3.8V  
IOUT = 150mA  
40mV/tick  
40mV/tick  
40mV/tick  
25mA/tick  
VOUT  
VOUT  
VOUT  
IOUT  
µ
COUT = 0 F  
50mV/div  
VOUT  
µ
OUT = 1 F  
C
µ
COUT = 100 F  
µ
COUT = 10 F  
50mV/div  
1V/div  
VOUT  
dVIN  
dt  
5.5V  
µ
= 0.5V/  
s
150mA  
4.5V  
VIN  
10mA  
µ
µ
10 s/div  
10 s/div  
Figure 22.  
Figure 23.  
TPS73133  
TURN-ON RESPONSE  
TPS73133  
TURN-OFF RESPONSE  
RL = 1k  
RL = 20  
COUT = 10  
VOUT  
µ
COUT = 0  
F
µ
F
RL = 20  
RL = 20  
1V/div  
1V/div  
1V/div  
1V/div  
µ
COUT = 1  
F
µ
COUT = 1  
F
RL = 1k  
RL = 20  
COUT = 0µF  
COUT = 10µF  
VOUT  
2V  
2V  
VEN  
0V  
0V  
VEN  
100µs/div  
100µs/div  
Figure 24.  
Figure 25.  
TPS73133  
POWER UP / POWER DOWN  
IENABLE vs TEMPERATURE  
10  
1
6
5
4
3
2
1
0
VIN  
VOUT  
0.1  
0.01  
1
2
25  
50  
0
25  
50  
75  
100  
125  
50ms/div  
_
Temperature ( C)  
Figure 26.  
Figure 27.  
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TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
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SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
TYPICAL CHARACTERISTICS (continued)  
For all voltage versions at TJ= 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF,  
unless otherwise noted  
TPS73101  
RMS NOISE VOLTAGE vs CADJ  
TPS73101  
IFB vs TEMPERATURE  
60  
55  
50  
45  
40  
35  
30  
25  
20  
160  
140  
120  
100  
80  
60  
VOUT = 2.5V  
40  
µ
COUT = 0 F  
R1 = 39.2k  
20  
10Hz < Frequency < 100kHz  
0
10p  
100p  
1n  
10n  
25  
50  
0
25  
50  
75  
100  
125  
CFB (F)  
_
Temperature ( C)  
Figure 28.  
Figure 29.  
TPS73101  
TPS73101  
LOAD TRANSIENT, ADJUSTABLE VERSION  
LINE TRANSIENT, ADJUSTABLE VERSION  
CFB = 10nF  
VOUT = 2.5V  
CFB = 10nF  
R1 = 39.2k  
µ
COUT = 0 F  
µ
COUT = 0 F  
VOUT  
VOUT  
100mV/div  
100mV/div  
50mV/div  
50mV/div  
µ
COUT = 10 F  
VOUT  
µ
COUT = 10 F  
VOUT  
4.5V  
150mA  
3.5V  
VIN  
10mA  
IOUT  
µ
µ
25 s/div  
5 s/div  
Figure 30.  
Figure 31.  
12  
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TPS73101-EP, TPS73115-EP  
TPS731125-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP  
TPS73132-EP, TPS73133-EP, TPS73150-EP  
www.ti.com  
SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
APPLICATION INFORMATION  
The TPS731xx belongs to a family of new generation  
LDO regulators that use an NMOS pass transistor to  
achieve ultra-low-dropout performance, reverse  
current blockage, and freedom from output capacitor  
constraints. These features, combined with low noise  
and an enable input, make the TPS731xx ideal for  
portable applications. This regulator family offers a  
wide selection of fixed output voltage versions and an  
adjustable output version. All versions have thermal  
and over-current protection, including foldback  
current limit.  
INPUT AND OUTPUT CAPACITOR  
REQUIREMENTS  
Although an input capacitor is not required for  
stability, it is good analog design practice to connect  
a 0.1 μF to 1 μF low ESR capacitor across the input  
supply near the regulator. This counteracts reactive  
input sources and improves transient response, noise  
rejection, and ripple rejection.  
A
higher-value  
capacitor may be necessary if large, fast rise-time  
load transients are anticipated or the device is  
located several inches from the power source.  
Figure 32 shows the basic circuit connections for the  
fixed voltage models. Figure 33 gives the connections  
for the adjustable output version (TPS73101).  
The TPS731xx does not require an output capacitor  
for stability and has maximum phase margin with no  
capacitor. It is designed to be stable for all available  
types and values of capacitors. In applications where  
VIN – VOUT < 0.5 V and multiple low ESR capacitors  
are in parallel, ringing may occur when the product of  
COUT and total ESR drops below 50 nF. Total ESR  
includes all parasitic resistances, including capacitor  
ESR and board, socket, and solder joint resistance.  
In most applications, the sum of capacitor ESR and  
trace resistance will meet this requirement.  
Optional input capacitor.  
May improve source  
impedance, noise, or PSRR.  
Optional output capacitor.  
May improve load transient,  
noise, or PSRR.  
VIN  
VOUT  
IN  
OUT  
TPS731xx  
GND  
EN  
NR  
Optional bypass  
capacitor to reduce  
output noise.  
OUTPUT NOISE  
A precision band-gap reference is used to generate  
the internal reference voltage, VREF. This reference is  
the dominant noise source within the TPS731xx and  
it generates approximately 32 μVRMS (10 Hz to  
100 kHz) at the reference output (NR). The regulator  
control loop gains up the reference noise with the  
same gain as the reference voltage, so that the noise  
voltage of the regulator is approximately given by:  
Figure 32. Typical Application Circuit for  
Fixed-Voltage Versions  
Optional input capacitor.  
May improve source  
impedance, noise, or PSRR.  
Optional output capacitor.  
May improve load transient  
noise, or PSRR.  
VOUT  
VREF  
(R1 ) R2)  
VN + 32mVRMS  
 
+ 32mVRMS  
 
VIN  
VOUT  
IN  
OUT  
FB  
R2  
(1)  
TPS73101  
R1  
CFB  
Since the value of VREF is 1.2 V, this relationship  
reduces to:  
EN  
GND  
R2  
mVRMS  
V
ǒ Ǔ  
VN(mVRMS) + 27  
  VOUT(V)  
Optional capacitor  
reduces output noise  
and improves  
(R1 + R2)  
(2)  
VOUT  
=
x 1.204  
R2  
for the case of no CNR  
.
transient response.  
An internal 27 kresistor in series with the noise  
reduction pin (NR) forms a low-pass filter for the  
voltage reference when an external noise reduction  
capacitor, CNR, is connected from NR to ground. For  
CNR = 10 nF, the total noise in the 10 Hz to 100 kHz  
bandwidth is reduced by a factor of ~3.2, giving the  
approximate relationship:  
Figure 33. Typical Application Circuit for  
Adjustable-Voltage Versions  
R1 and R2 can be calculated for any output voltage  
using the formula shown in Figure 33. Sample  
resistor values for common output voltages are  
shown in Figure 3. For the best accuracy, make the  
parallel combination of R1 and R2 approximately  
19 k.  
mVRMS  
V
ǒ Ǔ  
VN(mVRMS) + 8.5  
  VOUT(V)  
(3)  
13  
for CNR = 10nF.  
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TPS73101-EP, TPS73115-EP  
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TPS73132-EP, TPS73133-EP, TPS73150-EP  
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SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
This noise reduction effect is shown as RMS Noise  
Voltage vs CNR in the Typical Characteristics section.  
DROPOUT VOLTAGE  
The TPS731xx uses an NMOS pass transistor to  
achieve extremely low dropout. When (VIN – VOUT) is  
less than the dropout voltage (VDO), the NMOS pass  
device is in its linear region of operation and the  
input-to-output resistance is the RDS-ON of the NMOS  
pass element.  
The TPS73101 adjustable version does not have the  
noise-reduction pin available. However, connecting a  
feedback capacitor, CFB, from the output to the FB pin  
reduces output noise and improves load transient  
performance.  
The TPS731xx uses an internal charge pump to  
develop an internal supply voltage sufficient to drive  
the gate of the NMOS pass element above VOUT. The  
charge pump generates ~250 μV of switching noise  
at ~4 MHz; however, charge-pump noise contribution  
is negligible at the output of the regulator for most  
For large step changes in load current, the TPS731xx  
requires a larger voltage drop across it to avoid  
degraded transient response. The boundary of this  
transient dropout region is approximately twice the dc  
dropout. Values of VIN – VOUT above this line ensure  
normal transient response.  
values of IOUT and COUT  
.
Operating in the transient dropout region can cause  
an increase in recovery time. The time required to  
recover from a load transient is a function of the  
magnitude of the change in load current rate, the rate  
of change in load current, and the available  
headroom (VIN to VOUT voltage drop). Under  
worst-case conditions (full-scale instantaneous load  
change with (VIN – VOUT) close to dc dropout levels),  
BOARD LAYOUT RECOMMENDATION TO  
IMPROVE PSRR AND NOISE PERFORMANCE  
To improve ac performance such as PSRR, output  
noise, and transient response, it is recommended that  
the PCB be designed with separate ground planes for  
VIN and VOUT, with each ground plane connected only  
at the GND pin of the device. In addition, the ground  
connection for the bypass capacitor should connect  
directly to the GND pin of the device.  
the TPS731xx can take  
a couple of hundred  
microseconds to return to the specified regulation  
accuracy.  
TRANSIENT RESPONSE  
INTERNAL CURRENT LIMIT  
The low open-loop output impedance provided by the  
The TPS731xx internal current limit helps protect the  
regulator during fault conditions. Foldback current  
helps to protect the regulator from damage during  
output short-circuit conditions by reducing current  
limit when VOUT drops below 0.5 V. See Figure 12 in  
the Typical Characteristics section for a graph of  
NMOS pass element in  
a
voltage follower  
configuration allows operation without an output  
capacitor for many applications. As with any  
regulator, the addition of a capacitor (nominal value  
1 μF) from the output pin to ground reduces  
undershoot magnitude but increases duration. In the  
IOUT vs VOUT  
.
adjustable version, the addition of a capacitor, CFB  
,
from the output to the adjust pin also improves the  
transient response.  
SHUTDOWN  
The Enable pin is active high and is compatible with  
standard TTL-CMOS levels. VEN below 0.5 V (max)  
turns the regulator off and drops the ground pin  
current to approximately 10 nA. When shutdown  
capability is not required, the Enable pin can be  
connected to VIN. When a pullup resistor is used and  
operation down to 1.8 V is required, use pullup  
resistor values below 50 k.  
The TPS731xx does not have active pulldown when  
the output is overvoltage. This allows applications  
that connect higher voltage sources, such as  
alternate power supplies, to the output. This also  
results in an output overshoot of several percent if the  
load current quickly drops to zero when a capacitor is  
connected to the output. The duration of overshoot  
can be reduced by adding a load resistor. The  
overshoot decays at a rate determined by output  
capacitor COUT and the internal/external load  
resistance. The rate of decay is given by:  
(Fixed voltage version)  
VOUT  
dVńdt +  
COUT   80kW ø RLOAD  
(4)  
14  
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SGLS347AJUNE 2006REVISED SEPTEMBER 2007  
(Adjustable voltage version)  
35°C above the maximum expected ambient  
condition of your application. This produces  
worst-case junction temperature of 125°C at the  
highest expected ambient temperature and  
worst-case load.  
a
VOUT  
dVńdt +  
(
)
COUT   80kW ø R1 ) R2 ø RLOAD  
(5)  
REVERSE CURRENT  
The internal protection circuitry of the TPS731xx has  
been designed to protect against overload conditions.  
It was not intended to replace proper heatsinking.  
Continuously running the TPS731xx into thermal  
shutdown will degrade device reliability.  
The NMOS pass element of the TPS731xx provides  
inherent protection against current flow from the  
output of the regulator to the input when the gate of  
the pass device is pulled low. To ensure that all  
charge is removed from the gate of the pass element,  
the enable pin must be driven low before the input  
voltage is removed. If this is not done, the pass  
element may be left on due to stored charge on the  
gate.  
POWER DISSIPATION  
The ability to remove heat from the die is different for  
each  
package  
type,  
presenting  
different  
considerations in the PCB layout. The PCB area  
around the device that is free of other components  
moves the heat from the device to the ambient air.  
Performance data for JEDEC low-K and high-K  
boards are shown in the Power Dissipation Ratings  
table. Using heavier copper increases the  
effectiveness in removing heat from the device. The  
addition of plated through-holes to heat-dissipating  
layers also improves the heatsink effectiveness.  
After the enable pin is driven low, no bias voltage is  
needed on any pin for reverse current blocking. Note  
that reverse current is specified as the current flowing  
out of the IN pin due to voltage applied on the OUT  
pin. There is additional current flowing into the OUT  
pin due to the 80-kinternal resistor divider to  
ground (see Figure 2 and Figure 3).  
For the TPS73101, reverse current may flow when  
VFB is more than 1 V above VIN.  
Power dissipation depends on input voltage and load  
conditions. Power dissipation is equal to the product  
of the output current times the voltage drop across  
the output pass element (VIN to VOUT):  
THERMAL PROTECTION  
Thermal protection disables the output when the  
junction temperature rises to approximately 160°C,  
allowing the device to cool. When the junction  
temperature cools to approximately 140°C, the output  
circuitry is again enabled. Depending on power  
dissipation, thermal resistance, and ambient  
temperature, the thermal protection circuit may cycle  
on and off. This limits the dissipation of the regulator,  
protecting it from damage due to overheating.  
PD = (VIN – VOUT) × IOUT  
Power dissipation can be minimized by using the  
lowest possible input voltage necessary to ensure the  
required output voltage.  
Package Mounting  
Solder pad footprint recommendations for the  
TPS731xx are presented in Application Bulletin  
Solder Pad Recommendations for Surface-Mount  
Devices (AB-132), available from the Texas  
Instruments web site at www.ti.com.  
Any tendency to activate the thermal protection circuit  
indicates excessive power dissipation or an  
inadequate heatsink. For reliable operation, junction  
temperature should be limited to 125°C maximum. To  
estimate the margin of safety in a complete design  
(including  
heatsink),  
increase  
the  
ambient  
temperature until the thermal protection is triggered;  
use worst-case loads and signal conditions. For good  
reliability, thermal protection should trigger at least  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Mar-2009  
PACKAGING INFORMATION  
Orderable Device  
TPS73101MDBVREP  
TPS731125MDBVREP  
TPS73115MDBVREP  
TPS73118MDBVREP  
TPS73125MDBVREP  
TPS73130MDBVREP  
TPS73132MDBVREP  
TPS73133MDBVREP  
TPS73150MDBVREP  
V62/06652-01XE  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT-23  
DBV  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-02XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-03XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-04XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-05XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-06XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-07XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-08XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
V62/06652-09XE  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Mar-2009  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF TPS73101-EP, TPS731125-EP, TPS73115-EP, TPS73118-EP, TPS73125-EP, TPS73130-EP,  
TPS73132-EP, TPS73133-EP, TPS73150-EP :  
Catalog: TPS73101, TPS731125, TPS73115, TPS73118, TPS73125, TPS73130, TPS73132, TPS73133, TPS73150  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS73101MDBVREP  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
3.2  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
1.4  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
Q3  
TPS731125MDBVREP SOT-23  
TPS73115MDBVREP  
TPS73118MDBVREP  
TPS73125MDBVREP  
TPS73130MDBVREP  
TPS73132MDBVREP  
TPS73133MDBVREP  
TPS73150MDBVREP  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
20-Jul-2010  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS73101MDBVREP  
TPS731125MDBVREP  
TPS73115MDBVREP  
TPS73118MDBVREP  
TPS73125MDBVREP  
TPS73130MDBVREP  
TPS73132MDBVREP  
TPS73133MDBVREP  
TPS73150MDBVREP  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
SOT-23  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
DBV  
5
5
5
5
5
5
5
5
5
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
3000  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
203.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
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Copyright © 2011, Texas Instruments Incorporated  

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