TPS73219DBVT [TI]
Cap-Free, NMOS, 250mA Low Dropout Regulator with Reverse Current Protection; 无电容， NMOS ， 250毫安低压差稳压器具有反向电流保护
| 型号： | TPS73219DBVT |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Cap-Free, NMOS, 250mA Low Dropout Regulator with Reverse Current Protection |
| 文件： | 总26页 (文件大小：920K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS732xx
www.ti.com
SBVS037L–AUGUST 2003–REVISED AUGUST 2007
Cap-Free, NMOS, 250mA Low Dropout Regulator
with Reverse Current Protection
1
FEATURES
DESCRIPTION
2
•
Stable with No Output Capacitor or Any Value
The TPS732xx family of low-dropout (LDO) voltage
regulators uses a new topology: an NMOS pass
element in a voltage-follower configuration. This
topology is stable using output capacitors with low
ESR, and even allows operation without a capacitor.
It also provides high reverse blockage (low reverse
current) and ground pin current that is nearly constant
over all values of output current.
or Type of Capacitor
•
•
•
Input Voltage Range: 1.7V to 5.5V
Ultralow Dropout Voltage: 40mV Typ at 250mA
Excellent Load Transient Response—with or
without Optional Output Capacitor
•
New NMOS Topology Provides Low Reverse
Leakage Current
The TPS732xx uses an advanced BiCMOS process
to yield high precision while delivering very low
dropout voltages and low ground pin current. Current
consumption, when not enabled, is under 1µA and
ideal for portable applications. The extremely low
output noise (30µVRMS with 0.1µF CNR) is ideal for
powering VCOs. These devices are protected by
thermal shutdown and foldback current limit.
•
•
•
Low Noise: 30µVRMS Typ (10kHz to 100kHz)
0.5% Initial Accuracy
1% Overall Accuracy (Line, Load, and
Temperature)
•
•
Less Than 1µA Max IQ in Shutdown Mode
Thermal Shutdown and Specified Min/Max
Current Limit Protection
DRB PACKAGE
3mmx 3mm SON
(TOP VIEW)
DBV PACKAGE
SOT23
(TOP VIEW)
•
Available in Multiple Output Voltage Versions
–
–
–
Fixed Outputs of 1.20V to 5.0V
Adjustable Outputs from 1.20V to 5.5V
Custom Outputs Available
OUT
N/C
1
2
3
4
8
7
6
5
IN
1
5
IN
GND
EN
OUT
N/C
N/C
EN
NR/FB
GND
2
NR/FB
3
4
APPLICATIONS
DCQ PACKAGE
SOT223
(TOP VIEW)
•
•
•
•
Portable/Battery-Powered Equipment
Post-Regulation for Switching Supplies
Noise-Sensitive Circuitry such as VCOs
Point of Load Regulation for DSPs, FPGAs,
ASICs, and Microprocessors
TAB IS GND
6
3
1
2
4
5
Optional
Optional
VIN
VOUT
IN
OUT
TPS732xx
GND
IN
GND
EN
OUT NR/FB
EN
NR
Optional
Typical Application Circuit for Fixed-Voltage Versions
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2007, Texas Instruments Incorporated
TPS732xx
www.ti.com
SBVS037L–AUGUST 2003–REVISED AUGUST 2007
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS732xxyyyz
XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable(3)).
YYY is package designator.
Z is package quantity.
(1) For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet
or see the TI website at www.ti.com.
(2) Most output voltages of 1.25V and 1.3V to 5.0V in 100mV increments are available through the use of innovative factory EEPROM
programming; minimum order quantities may apply. Contact factory for details and availability.
(3) For fixed 1.20V operation, tie FB to OUT.
ABSOLUTE MAXIMUM RATINGS
over operating junction temperature range unless otherwise noted(1)
TPS732xx
–0.3 to 6.0
–0.3 to 6.0
–0.3 to 5.5
–0.3 to 6.0
Internally limited
Indefinite
UNIT
VIN range
V
V
V
V
VEN range
VOUT range
VNR, VFB range
Peak output current
Output short-circuit duration
Continuous total power dissipation
Junction temperature range, TJ
Storage temperature range
ESD rating, HBM
See Dissipation Ratings Table
–55 to +150
–65 to +150
2
°C
°C
kV
V
ESD rating, CDM
500
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics
is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
POWER DISSIPATION RATINGS(1)
DERATING FACTOR
ABOVE TA = 25°C
T
A ≤ 25°C
TA = 70°C
TA = 85°C
BOARD
PACKAGE
RΘJC
RΘJA
POWER RATING POWER RATING POWER RATING
Low-K(2)
DBV
DBV
DCQ
DCQ
DRB
64°C/W
64°C/W
15°C/W
15°C/W
1.2°C/W
255°C/W
180°C/W
53°C/W
45°C/W
40C/W
3.9mW/°C
5.6mW/°C
18.9mW/°C
22.2mW/°C
25.0mW/°C
390mW
560mW
1.89W
2.22W
2.50W
215mW
310mW
1.04W
1.22W
1.38W
155mW
225mW
0.76W
0.89W
1.0W
(3)
High-K
Low-K(2)
High-K(3)
High-K(3)(4)
(1) See Power Dissipation in the Applications section for more information related to thermal design.
(2) The JEDEC Low-K (1s) board design used to derive this data was a 3 inch x 3 inch, two-layer board with 2-ounce copper traces on top
of the board.
(3) The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch x 3 inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on the top and bottom of the board.
(4) Based on preliminary thermal simulations.
2
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SBVS037L–AUGUST 2003–REVISED AUGUST 2007
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 0.5V(1), IOUT = 10mA, VEN = 1.7V, and
COUT = 0.1µF, unless otherwise noted. Typical values are at TJ = 25°C.
PARAMETER
TEST CONDITIONS
MIN
1.7
TYP
MAX UNIT
VIN
Input voltage range(1)
Internal reference (TPS73201)
Output voltage range (TPS73201)(2)
Nominal
5.5
1.210
V
V
V
VFB
TJ = +25°C
1.198
VFB
1.20
5.5 – VDO
+0.5
TJ = +25°C
–0.5
VOUT
Accuracy(1)(3)
%
VOUT + 0.5V ≤ VIN ≤ 5.5V;
10 mA ≤ IOUT ≤ 250mA
VIN, IOUT, and T
–1.0
±0.5
+1.0
ΔVOUT%/ΔVIN
Line regulation(1)
VOUT(nom) + 0.5V ≤ VIN ≤ 5.5V
1mA ≤ IOUT ≤ 250mA
0.01
0.002
%/V
ΔVOUT%/ΔIOUT Load regulation
%/mA
10mA ≤ IOUT ≤ 250mA
0.0005
Dropout voltage(4)
VDO
IOUT = 250mA
40
150
600
mV
(VIN = VOUT (nom) – 0.1V)
ZO(DO)
ICL
Output impedance in dropout
Output current limit
1.7 V ≤ VIN ≤ VOUT + VDO
VOUT = 0.9 × VOUT(nom)
VOUT = 0V
0.25
425
300
0.1
Ω
250
mA
mA
µA
ISC
Short-circuit current
IREV
Reverse leakage current(5) (–IIN
)
VEN ≤ 0.5V, 0V ≤ VIN ≤ VOUT
10
550
950
IOUT = 10mA (IQ)
IOUT = 250mA
400
650
IGND
Ground pin current
µA
V
EN ≤ 0.5V, VOUT ≤ VIN ≤ 5.5,
ISHDN
IFB
Shutdown current (IGND
)
0.02
1
A
–40°C ≤ TJ ≤ +100°C
FB pin current (TPS73201)
0.1
58
0.3
µA
f = 100Hz, IOUT = 250 mA
f = 10kHz, IOUT = 250 mA
COUT = 10µF, No CNR
Power-supply rejection ratio
(ripple rejection)
PSRR
dB
37
27 × VOUT
8.5 × VOUT
Output noise voltage
BW = 10Hz – 100kHz
VN
µVRMS
µs
COUT = 10µF, CNR = 0.01µF
VOUT = 3V, RL = 30Ω
COUT = 1 µF, CNR = 0.01 µF
tSTR
Startup time
600
VEN(HI)
VEN(LO)
IEN(HI)
Enable high (enabled)
1.7
0
VIN
0.5
0.1
V
V
Enable low (shutdown)
Enable pin current (enabled)
VEN = 5.5V
0.02
+160
+140
µA
Shutdown
Reset
Temp increasing
Temp decreasing
TSD
TJ
Thermal shutdown temperature
Operating junction temperature
°C
°C
–40
+125
(1) Minimum VIN = VOUT + VDO or 1.7V, whichever is greater.
(2) TPS73201 is tested at VOUT = 2.5V.
(3) Tolerance of external resistors not included in this specification.
(4) VDO is not measured for fixed output versions with VOUT(nom) < 1.8V since minimum VIN = 1.7V.
(5) Fixed-voltage versions only; refer to Applications section for more information.
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SBVS037L–AUGUST 2003–REVISED AUGUST 2007
FUNCTIONAL BLOCK DIAGRAMS
IN
4MHz
Charge Pump
EN
Thermal
Protection
Ref
Servo
Ω
27k
Bandgap
Error
Amp
Current
Limit
OUT
Ω
8k
GND
R1
R2
Ω
R1 + R2 = 80k
NR
Figure 1. Fixed Voltage Version
IN
Table 1. Standard 1%
Resistor Values for
Common Output Voltages
V
O
R
1
R
2
4MHz
1.2V
1.5V
1.8V
2.5V
2.8V
3.0V
3.3V
Short
Open
Charge Pump
23.2kΩ
28.0kΩ
39.2kΩ
44.2kΩ
46.4kΩ
52.3kΩ
95.3kΩ
56.2kΩ
36.5kΩ
33.2kΩ
30.9kΩ
30.1kΩ
EN
Thermal
Protection
Ref
Servo
Ω
27k
Bandgap
Error
Amp
NOTE: V
= (R + R )/R × 1.204;
1 2 2
OUT
OUT
FB
Current
Limit
R
R
19kΩ for best
1
2
accuracy.
GND
Ω
80k
Ω
8k
R1
R2
Figure 2. Adjustable Voltage Version
4
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SBVS037L–AUGUST 2003–REVISED AUGUST 2007
PIN ASSIGNMENTS
DRB PACKAGE
3mm x 3mm SON
(TOP VIEW)
DCQ PACKAGE
SOT223
(TOP VIEW)
DBV PACKAGE
SOT23
(TOP VIEW)
OUT
N/C
1
2
3
4
8
7
6
5
IN
TAB IS GND
N/C
N/C
EN
6
3
5
4
IN
GND
EN
1
2
3
OUT
NR/FB
GND
NR/FB
1
2
4
5
IN
GND
EN
OUT
NR/FB
TERMINAL FUNCTIONS
TERMINAL
SOT23
(DBV)
SOT223
(DCQ)
3×3 SON
(DRB)
NAME
PIN NO.
PIN NO.
PIN NO.
DESCRIPTION
Input supply
Ground
IN
1
2
3
1
3, 6
5
8
4, Pad
5
GND
EN
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the
regulator into shutdown mode. Refer to the Shutdown section under Applications
Information for more details. EN can be connected to IN if not used.
NR
4
4
5
4
4
2
3
3
1
Fixed voltage versions only—connecting an external capacitor to this pin bypasses
noise generated by the internal bandgap, reducing output noise to very low levels.
FB
Adjustable voltage version only—this is the input to the control loop error amplifier,
and is used to set the output voltage of the device.
OUT
Output of the Regulator. There are no output capacitor requirements for stability.
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SBVS037L–AUGUST 2003–REVISED AUGUST 2007
TYPICAL CHARACTERISTICS
For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
LOAD REGULATION
Referred to IOUT = 10mA
LINE REGULATION
0.5
0.4
0.3
0.2
0.1
0
0.20
0.15
0.10
0.05
0
Referred to VIN = VOUT + 0.5V at IOUT = 10mA
−
_
40 C
_
+25 C
_
+25 C
_
_
+125 C
+125 C
−
−
−
−
−
0.1
0.2
0.3
0.4
0.5
−
0.05
0.10
0.15
0.20
−
_
40 C
−
−
−
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
50
100
150
200
250
−
IOUT (mA)
VIN VOUT (V)
Figure 3.
Figure 4.
DROPOUT VOLTAGE
vs OUTPUT CURRENT
DROPOUT VOLTAGE
vs TEMPERATURE
100
80
60
40
20
0
100
80
60
40
20
0
TPS73225DBV
TPS73225DBV
IOUT = 250mA
_
+125 C
_
+25 C
−
_
40 C
−
−
25
50
0
25
50
75
100
125
0
50
100
IOUT (mA)
Figure 5.
150
200
250
_
Temperature ( C)
Figure 6.
OUTPUT VOLTAGE ACCURACY HISTOGRAM
OUTPUT VOLTAGE DRIFT HISTOGRAM
IOUT = 10mA
30
18
16
14
12
10
8
IOUT = 10mA
All Voltage Versions
25
20
15
10
5
6
4
2
0
0
_
VOUT Error (%)
Worst Case dVOUT/dT (ppm/ C)
Figure 7.
Figure 8.
6
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
GROUND PIN CURRENT vs OUTPUT CURRENT
GROUND PIN CURRENT vs TEMPERATURE
1000
900
800
700
600
500
400
300
200
100
0
800
700
600
500
400
300
200
100
0
IOUT = 250mA
VIN = 5.5V
VIN = 4V
VIN = 2V
VIN = 5.5V
VIN = 4V
VIN = 2V
−
−
25
0
50
100
150
OUT (mA)
200
250
50
0
25
50
75
100
125
_
I
Temperature ( C)
Figure 9.
Figure 10.
GROUND PIN CURRENT IN SHUTDOWN
vs TEMPERATURE
CURRENT LIMIT vs VOUT
(FOLDBACK)
1
500
450
400
350
300
250
200
150
100
50
VENABLE = 0.5V
VIN = VOUT + 0.5V
ICL
ISC
0.1
TPS73233
0.5
0.01
0
−
−
25
50
0
25
50
75
100
125
0
1.0
1.5
2.0
2.5
3.0
3.5
_
Temperature ( C)
VOUT (V)
Figure 11.
Figure 12.
CURRENT LIMIT vs TEMPERATURE
CURRENT LIMIT vs VIN
600
550
500
450
400
350
300
250
600
550
500
450
400
350
300
250
−
−
25
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
50
0
25
50
75
100
125
_
VIN (V)
Temperature ( C)
Figure 13.
Figure 14.
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
PSRR (RIPPLE REJECTION) vs FREQUENCY
PSRR (RIPPLE REJECTION) vs VIN - VOUT
40
35
30
25
20
15
10
5
90
80
70
60
50
40
30
20
10
0
IOUT = 100mA
COUT = Any
IOUT = 1mA
µ
COUT = 1 F
IOUT = 1mA
COUT = 10 F
µ
IO = 100mA
µ
C
O = 1 F
IOUT = 1mA
COUT = Any
Frequency = 10kHz
IOUT = 100mA
COUT = 10 F
COUT = 10mF
µ
VOUT = 2.5V
IOUT = Any
VIN = VOUT + 1V
µ
COUT = 0 F
IOUT = 100mA
0
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
10
100
1k
10k
100k
1M
10M
V
IN - VOUT (V)
Frequency (Hz)
Figure 15.
Figure 16.
NOISE SPECTRAL DENSITY
CNR = 0µF
NOISE SPECTRAL DENSITY
CNR = 0.01µF
1
1
µ
COUT = 1 F
µ
COUT = 1 F
µ
COUT = 0 F
0.1
0.1
µ
COUT = 10 F
µ
COUT = 0 F
µ
COUT = 10 F
IOUT = 150mA
IOUT = 150mA
10 100
0.01
0.01
10
100
1k
10k
100k
1k
10k
100k
Frequency (Hz)
Frequency (Hz)
Figure 17.
Figure 18.
RMS NOISE VOLTAGE vs COUT
RMS NOISE VOLTAGE vs CNR
60
50
40
30
20
10
0
140
120
100
80
VOUT = 5.0V
VOUT = 5.0V
VOUT = 3.3V
VOUT = 1.5V
VOUT = 3.3V
VOUT = 1.5V
60
40
20
µ
CNR = 0.01 F
µ
COUT = 0 F
10Hz < Frequency < 100kHz
10Hz < Frequency < 100kHz
0
0.1
1
10
1p
10p
100p
1n
10n
µ
COUT ( F)
CNR (F)
Figure 19.
Figure 20.
8
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
TPS73233
LOAD TRANSIENT RESPONSE
TPS73233
LINE TRANSIENT RESPONSE
µ
COUT = 0 F
VIN = 3.8V
IOUT = 250mA
50mV/tick
50mV/tick
VOUT
VOUT
VOUT
µ
COUT = 0 F
50mV/div
VOUT
µ
OUT = 1 F
C
µ
COUT = 100 F
µ
COUT = 10 F
50mV/div
1V/div
VOUT
50mV/tick
50mA/tick
dVIN
dt
5.5V
µ
= 0.5V/
s
250mA
4.5V
VIN
10mA
IOUT
µ
µ
10 s/div
10 s/div
Figure 21.
Figure 22.
TPS73233
TURN-ON RESPONSE
TPS73233
TURN-OFF RESPONSE
Ω
Ω
RL = 1k
RL = 20
VOUT
µ
COUT = 0
F
COUT = 10µF
RL = 20Ω
COUT = 1µF
RL = 20Ω
1V/div
1V/div
1V/div
1V/div
µ
COUT = 1
F
Ω
RL = 1k
RL = 20Ω
COUT = 10
µ
COUT = 0
F
µ
F
VOUT
2V
2V
VEN
0V
0V
VEN
µ
100 s/div
µ
100 s/div
Figure 23.
Figure 24.
TPS73233
POWER UP / POWER DOWN
IENABLE vs TEMPERATURE
10
1
6
5
4
3
2
1
0
VIN
VOUT
0.1
0.01
−
−
1
2
50ms/div
−
−
25
50
0
25
50
75
100
125
Temperature (°C)
Figure 25.
Figure 26.
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TYPICAL CHARACTERISTICS (continued)
For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5V, IOUT = 10mA, VEN = 1.7V, and COUT = 0.1µF, unless otherwise
noted.
TPS73201
RMS NOISE VOLTAGE vs CFB
TPS73201
IFB vs TEMPERATURE
60
55
50
45
40
35
30
25
20
160
140
120
100
80
60
VOUT = 2.5V
40
µ
COUT = 0 F
Ω
R1 = 39.2k
20
10Hz < Frequency < 100kHz
0
10p
100p
1n
10n
−
−
25
50
0
25
50
75
100
125
CFB (F)
_
Temperature ( C)
Figure 27.
Figure 28.
TPS73201
TPS73201
LOAD TRANSIENT, ADJUSTABLE VERSION
CFB = 10nF
LINE TRANSIENT, ADJUSTABLE VERSION
VOUT = 2.5V
CFB = 10nF
Ω
R1 = 39.2k
µ
COUT = 0 F
µ
COUT = 0 F
VOUT
VOUT
100mV/div
100mV/div
100mV/div
100mV/div
µ
COUT = 10 F
µ
COUT = 10 F
VOUT
VOUT
4.5V
250mA
3.5V
VIN
10mA
IOUT
µ
5 s/div
µ
10 s/div
Figure 29.
Figure 30.
10
Submit Documentation Feedback
Copyright © 2003–2007, Texas Instruments Incorporated
Product Folder Link(s): TPS732xx
TPS732xx
www.ti.com
SBVS037L–AUGUST 2003–REVISED AUGUST 2007
APPLICATION INFORMATION
in addition to the internal 8kΩ resistor, presents the
same impedance to the error amp as the 27kΩ
bandgap reference output. This impedance helps
compensate for leakages into the error amp
terminals.
The TPS732xx belongs to a family of new generation
LDO regulators that use an NMOS pass transistor to
achieve ultra-low-dropout performance, reverse
current blockage, and freedom from output capacitor
constraints. These features, combined with low noise
and an enable input, make the TPS732xx ideal for
portable applications. This regulator family offers a
wide selection of fixed output voltage versions and an
adjustable output version. All versions have thermal
and over-current protection, including foldback
current limit.
INPUT AND OUTPUT CAPACITOR
REQUIREMENTS
Although an input capacitor is not required for
stability, it is good analog design practice to connect
a 0.1µF to 1µF low ESR capacitor across the input
supply near the regulator. This counteracts reactive
input sources and improves transient response, noise
Figure 31 shows the basic circuit connections for the
fixed voltage models. Figure 32 gives the connections
for the adjustable output version (TPS73201).
rejection, and ripple rejection.
A
higher-value
capacitor may be necessary if large, fast rise-time
load transients are anticipated or the device is
located several inches from the power source.
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
Optional output capacitor.
May improve load transient,
noise, or PSRR.
The TPS732xx does not require an output capacitor
for stability and has maximum phase margin with no
capacitor. It is designed to be stable for all available
types and values of capacitors. In applications where
VIN – VOUT < 0.5V and multiple low ESR capacitors
are in parallel, ringing may occur when the product of
COUT and total ESR drops below 50nΩF. Total ESR
includes all parasitic resistances, including capacitor
ESR and board, socket, and solder joint resistance.
In most applications, the sum of capacitor ESR and
trace resistance will meet this requirement.
VIN
VOUT
IN
OUT
TPS732xx
GND
EN
NR
Optional bypass
capacitor to reduce
output noise.
Figure 31. Typical Application Circuit for
Fixed-Voltage Versions
OUTPUT NOISE
A precision band-gap reference is used to generate
the internal reference voltage, VREF. This reference is
the dominant noise source within the TPS732xx and
it generates approximately 32VRMS (10Hz to 100kHz)
at the reference output (NR). The regulator control
loop gains up the reference noise with the same gain
as the reference voltage, so that the noise voltage of
the regulator is approximately given by:
Optional input capacitor.
May improve source
Optional output capacitor.
May improve load transient
noise, or PSRR.
impedance, noise, or PSRR.
VIN
VOUT
IN
OUT
FB
TPS73201
R1
CFB
EN
GND
R2
VOUT
VREF
(R1 ) R2)
Optional capacitor
reduces output noise
and improves
VN + 32mVRMS
+ 32mVRMS
(R1 + R2)
VOUT
=
x 1.204
R2
(1)
R2
transient response.
Since the value of VREF is 1.2V, this relationship
reduces to:
Figure 32. Typical Application Circuit for
Adjustable-Voltage Version
mVRMS
V
ǒ Ǔ
VN(mVRMS) + 27
VOUT(V)
(2)
R1 and R2 can be calculated for any output voltage
using the formula shown in Figure 32. Sample
resistor values for common output voltages are
shown in Figure 2.
for the case of no CNR
.
For best accuracy, make the parallel combination of
R1 and R2 approximately euqal to 19kΩ. This 19kΩ,
Copyright © 2003–2007, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TPS732xx
TPS732xx
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SBVS037L–AUGUST 2003–REVISED AUGUST 2007
An internal 27kΩ resistor in series with the noise
reduction pin (NR) forms a low-pass filter for the
voltage reference when an external noise reduction
capacitor, CNR, is connected from NR to ground. For
CNR = 10nF, the total noise in the 10Hz to 100kHz
bandwidth is reduced by a factor of ~3.2, giving the
approximate relationship:
SHUTDOWN
The Enable pin is active high and is compatible with
standard TTL-CMOS levels. VEN below 0.5V (max)
turns the regulator off and drops the ground pin
current to approximately 10nA. When shutdown
capability is not required, the Enable pin can be
connected to VIN. When a pull-up resistor is used,
and operation down to 1.8V is required, use pull-up
resistor values below 50kΩ. To ensure all charge is
removed from the gate of the pass element, the
Enable pin must be driven low before the input
voltage is removed. If the Enable pin is not driven
low, the pass element may be left on because of
stored charge on the gate.
mVRMS
V
ǒ Ǔ
VN(mVRMS) + 8.5
VOUT(V)
(3)
for CNR = 10nF.
This noise reduction effect is shown as RMS Noise
Voltage vs CNR in the Typical Characteristics section.
The TPS73201 adjustable version does not have the
noise-reduction pin available. However, connecting a
feedback capacitor, CFB, from the output to the FB pin
will reduce output noise and improve load transient
performance.
DROPOUT VOLTAGE
The TPS732xx uses an NMOS pass transistor to
achieve extremely low dropout. When (VIN – VOUT) is
less than the dropout voltage (VDO), the NMOS pass
device is in its linear region of operation and the
input-to-output resistance is the RDS-ON of the NMOS
pass element.
The TPS732xx uses an internal charge pump to
develop an internal supply voltage sufficient to drive
the gate of the NMOS pass element above VOUT. The
charge pump generates ~250µV of switching noise at
~4MHz; however, charge-pump noise contribution is
negligible at the output of the regulator for most
For large step changes in load current, the TPS732xx
requires a larger voltage drop from VIN to VOUT to
avoid degraded transient response. The boundary of
this transient dropout region is approximately twice
the dc dropout. Values of VIN – VOUT above this line
insure normal transient response.
values of IOUT and COUT
.
BOARD LAYOUT RECOMMENDATION TO
IMPROVE PSRR AND NOISE PERFORMANCE
Operating in the transient dropout region can cause
an increase in recovery time. The time required to
recover from a load transient is a function of the
magnitude of the change in load current rate, the rate
of change in load current, and the available
headroom (VIN to VOUT voltage drop). Under
worst-case conditions [full-scale instantaneous load
change with (VIN – VOUT) close to dc dropout levels],
To improve ac performance such as PSRR, output
noise, and transient response, it is recommended that
the PCB be designed with separate ground planes for
VIN and VOUT, with each ground plane connected only
at the GND pin of the device. In addition, the ground
connection for the bypass capacitor should connect
directly to the GND pin of the device.
the TPS732xx can take
microseconds to return to the specified regulation
accuracy.
a couple of hundred
INTERNAL CURRENT LIMIT
The TPS732xx internal current limit helps protect the
regulator during fault conditions. Foldback current
limit helps to protect the regulator from damage
during output short-circuit conditions by reducing
current limit when VOUT drops below 0.5V. See
Figure 12 in the Typical Characteristics section for a
TRANSIENT RESPONSE
The low open-loop output impedance provided by the
NMOS pass element in
a
voltage follower
configuration allows operation without an output
capacitor for many applications. As with any
regulator, the addition of a capacitor (nominal value
1µF) from the output pin to ground will reduce
undershoot magnitude but increase its duration. In
the adjustable version, the addition of a capacitor,
CFB, from the output to the adjust pin will also
improve the transient response.
graph of IOUT vs VOUT
.
12
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Copyright © 2003–2007, Texas Instruments Incorporated
Product Folder Link(s): TPS732xx
TPS732xx
www.ti.com
SBVS037L–AUGUST 2003–REVISED AUGUST 2007
The TPS732xx does not have active pull-down when
the output is over-voltage. This allows applications
that connect higher voltage sources, such as
alternate power supplies, to the output. This also
results in an output overshoot of several percent if the
load current quickly drops to zero when a capacitor is
connected to the output. The duration of overshoot
can be reduced by adding a load resistor. The
overshoot decays at a rate determined by output
capacitor COUT and the internal/external load
resistance. The rate of decay is given by:
Any tendency to activate the thermal protection circuit
indicates excessive power dissipation or an
inadequate heatsink. For reliable operation, junction
temperature should be limited to +125°C maximum.
To estimate the margin of safety in a complete design
(including
heatsink),
increase
the
ambient
temperature until the thermal protection is triggered;
use worst-case loads and signal conditions. For good
reliability, thermal protection should trigger at least
+35°C above the maximum expected ambient
condition of your application. This produces
worst-case junction temperature of +125°C at the
highest expected ambient temperature and
worst-case load.
a
(Fixed voltage version)
VOUT
dVńdt +
COUT 80kW ø RLOAD
(4)
The internal protection circuitry of the TPS732xx has
been designed to protect against overload conditions.
It was not intended to replace proper heatsinking.
Continuously running the TPS732xx into thermal
shutdown will degrade device reliability.
(Adjustable voltage version)
VOUT
dVńdt +
(
)
COUT 80kW ø R1 ) R2 ø RLOAD
(5)
POWER DISSIPATION
REVERSE CURRENT
The ability to remove heat from the die is different for
The NMOS pass element of the TPS732xx provides
inherent protection against current flow from the
output of the regulator to the input when the gate of
the pass device is pulled low. To ensure that all
charge is removed from the gate of the pass element,
the enable pin must be driven low before the input
voltage is removed. If this is not done, the pass
element may be left on due to stored charge on the
gate.
each
package
type,
presenting
different
considerations in the PCB layout. The PCB area
around the device that is free of other components
moves the heat from the device to the ambient air.
Performance data for JEDEC low- and high-K boards
are shown in the Power Dissipation Ratings table.
Using heavier copper will increase the effectiveness
in removing heat from the device. The addition of
plated through-holes to heat-dissipating layers will
also improve the heat-sink effectiveness.
After the enable pin is driven low, no bias voltage is
needed on any pin for reverse current blocking. Note
that reverse current is specified as the current flowing
out of the IN pin due to voltage applied on the OUT
pin. There will be additional current flowing into the
OUT pin due to the 80kΩ internal resistor divider to
ground (see Figure 1 and Figure 2).
Power dissipation depends on input voltage and load
conditions. Power dissipation (PD) is equal to the
product of the output current times the voltage drop
across the output pass element (VIN to VOUT):
PD + (VIN * VOUT) IOUT
(6)
For the TPS73201, reverse current may flow when
VFB is more than 1.0V above VIN.
Power dissipation can be minimized by using the
lowest possible input voltage necessary to assure the
required output voltage.
THERMAL PROTECTION
Package Mounting
Thermal protection disables the output when the
junction temperature rises to approximately +160°C,
allowing the device to cool. When the junction
temperature cools to approximately +140°C, the
output circuitry is again enabled. Depending on power
dissipation, thermal resistance, and ambient
temperature, the thermal protection circuit may cycle
on and off. This limits the dissipation of the regulator,
protecting it from damage due to overheating.
Solder pad footprint recommendations for the
TPS732xx are presented in Application Bulletin
Solder Pad Recommendations for Surface-Mount
Devices (SBFA015), available from the Texas
Instruments web site at www.ti.com.
Copyright © 2003–2007, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): TPS732xx
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2008
PACKAGING INFORMATION
Orderable Device
TPS73201DBVR
TPS73201DBVRG4
TPS73201DBVT
TPS73201DBVTG4
TPS73201DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
6
6
6
6
8
8
8
8
5
5
5
5
5
5
5
5
6
6
6
6
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SON
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73201DCQG4
TPS73201DCQR
TPS73201DCQRG4
TPS73201DRBR
TPS73201DRBRG4
TPS73201DRBT
TPS73201DRBTG4
TPS73213DBVR
TPS73213DBVRG4
TPS73213DBVT
TPS73213DBVTG4
TPS73215DBVR
TPS73215DBVRG4
TPS73215DBVT
TPS73215DBVTG4
TPS73215DCQ
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SON
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73215DCQG4
TPS73215DCQR
TPS73215DCQRG4
TPS73216DBVR
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2008
Orderable Device
TPS73216DBVRG4
TPS73216DBVT
TPS73216DBVTG4
TPS73218DBVR
TPS73218DBVRG4
TPS73218DBVT
TPS73218DBVTG4
TPS73218DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
5
5
5
5
5
5
5
6
6
6
6
5
5
5
5
5
5
6
6
6
6
5
5
5
5
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
DBV
DBV
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DBV
DCQ
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73218DCQG4
TPS73218DCQR
TPS73218DCQRG4
TPS73219DBVR
TPS73219DBVT
TPS73225DBVR
TPS73225DBVRG4
TPS73225DBVT
TPS73225DBVTG4
TPS73225DCQ
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73225DCQG4
TPS73225DCQR
TPS73225DCQRG4
TPS73230DBVR
TPS73230DBVRG4
TPS73230DBVT
TPS73230DBVTG4
TPS73230DCQ
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2008
Orderable Device
TPS73230DCQG4
TPS73230DCQR
TPS73230DCQRG4
TPS73233DBVR
TPS73233DBVRG4
TPS73233DBVT
TPS73233DBVTG4
TPS73233DCQ
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-223
DCQ
6
6
6
5
5
5
5
6
6
6
6
5
5
5
5
6
6
6
6
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-223
SOT-223
SOT-223
DCQ
DCQ
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
DBV
DBV
DBV
DBV
DCQ
DCQ
DCQ
DCQ
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73233DCQG4
TPS73233DCQR
TPS73233DCQRG4
TPS73250DBVR
TPS73250DBVRG4
TPS73250DBVT
TPS73250DBVTG4
TPS73250DCQ
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TPS73250DCQG4
TPS73250DCQR
TPS73250DCQRG4
78 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2008
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Apr-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPS73201DBVR
TPS73201DBVT
TPS73201DCQR
TPS73201DRBR
TPS73201DRBR
TPS73201DRBT
TPS73201DRBT
TPS73213DBVR
TPS73213DBVT
TPS73215DBVR
TPS73215DBVT
TPS73215DCQR
TPS73216DBVR
TPS73216DBVT
TPS73218DBVR
TPS73218DBVT
TPS73218DCQR
TPS73219DBVR
SOT-23
SOT-23
DBV
DBV
5
5
6
8
8
8
8
5
5
5
5
6
5
5
5
5
6
5
3000
250
179.0
179.0
330.0
330.0
330.0
180.0
330.0
179.0
179.0
179.0
179.0
330.0
179.0
179.0
179.0
179.0
330.0
179.0
8.4
8.4
3.2
3.2
6.8
3.3
3.3
3.3
3.3
3.2
3.2
3.2
3.2
6.8
3.2
3.2
3.2
3.2
6.8
3.2
3.2
3.2
7.3
3.3
3.3
3.3
3.3
3.2
3.2
3.2
3.2
7.3
3.2
3.2
3.2
3.2
7.3
3.2
1.4
1.4
1.88
1.0
1.1
1.1
1.0
1.4
1.4
1.4
1.4
1.88
1.4
1.4
1.4
1.4
1.88
1.4
4.0
4.0
8.0
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
8.0
4.0
4.0
4.0
4.0
8.0
4.0
8.0
8.0
Q3
Q3
Q3
Q2
Q2
Q2
Q2
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
SOT-223 DCQ
2500
3000
3000
250
12.4
12.4
12.4
12.4
12.4
8.4
12.0
12.0
12.0
12.0
12.0
8.0
SON
SON
DRB
DRB
DRB
DRB
DBV
DBV
DBV
DBV
SON
SON
250
SOT-23
SOT-23
SOT-23
SOT-23
3000
250
8.4
8.0
3000
250
8.4
8.0
8.4
8.0
SOT-223 DCQ
2500
3000
250
12.4
8.4
12.0
8.0
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
8.4
8.0
3000
250
8.4
8.0
8.4
8.0
SOT-223 DCQ
SOT-23 DBV
2500
3000
12.4
8.4
12.0
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Apr-2008
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TPS73219DBVT
TPS73225DBVR
TPS73225DBVT
TPS73225DCQR
TPS73230DBVR
TPS73230DBVT
TPS73230DCQR
TPS73233DBVR
TPS73233DBVT
TPS73233DCQR
TPS73250DBVR
TPS73250DBVT
TPS73250DCQR
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
6
5
5
6
5
5
6
5
5
6
250
3000
250
179.0
179.0
179.0
330.0
179.0
179.0
330.0
179.0
179.0
330.0
179.0
179.0
330.0
8.4
8.4
3.2
3.2
3.2
6.8
3.2
3.2
6.8
3.2
3.2
6.8
3.2
3.2
6.8
3.2
3.2
3.2
7.3
3.2
3.2
7.3
3.2
3.2
7.3
3.2
3.2
7.3
1.4
1.4
4.0
4.0
4.0
8.0
4.0
4.0
8.0
4.0
4.0
8.0
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
8.4
1.4
8.0
SOT-223 DCQ
2500
3000
250
12.4
8.4
1.88
1.4
12.0
8.0
SOT-23
SOT-23
DBV
DBV
8.4
1.4
8.0
SOT-223 DCQ
2500
3000
250
12.4
8.4
1.88
1.4
12.0
8.0
SOT-23
SOT-23
DBV
DBV
8.4
1.4
8.0
SOT-223 DCQ
2500
3000
250
12.4
8.4
1.88
1.4
12.0
8.0
SOT-23
SOT-23
DBV
DBV
8.4
1.4
8.0
SOT-223 DCQ
2500
12.4
1.88
12.0
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS73201DBVR
TPS73201DBVT
TPS73201DCQR
TPS73201DRBR
SOT-23
SOT-23
SOT-223
SON
DBV
DBV
DCQ
DRB
5
5
6
8
3000
250
195.0
195.0
358.0
370.0
200.0
200.0
335.0
355.0
45.0
45.0
35.0
55.0
2500
3000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Apr-2008
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS73201DRBR
TPS73201DRBT
TPS73201DRBT
TPS73213DBVR
TPS73213DBVT
TPS73215DBVR
TPS73215DBVT
TPS73215DCQR
TPS73216DBVR
TPS73216DBVT
TPS73218DBVR
TPS73218DBVT
TPS73218DCQR
TPS73219DBVR
TPS73219DBVT
TPS73225DBVR
TPS73225DBVT
TPS73225DCQR
TPS73230DBVR
TPS73230DBVT
TPS73230DCQR
TPS73233DBVR
TPS73233DBVT
TPS73233DCQR
TPS73250DBVR
TPS73250DBVT
TPS73250DCQR
SON
DRB
DRB
DRB
DBV
DBV
DBV
DBV
DCQ
DBV
DBV
DBV
DBV
DCQ
DBV
DBV
DBV
DBV
DCQ
DBV
DBV
DCQ
DBV
DBV
DCQ
DBV
DBV
DCQ
8
8
8
5
5
5
5
6
5
5
5
5
6
5
5
5
5
6
5
5
6
5
5
6
5
5
6
3000
250
346.0
190.5
370.0
195.0
195.0
195.0
195.0
358.0
195.0
195.0
195.0
195.0
358.0
195.0
195.0
195.0
195.0
358.0
195.0
195.0
358.0
195.0
195.0
358.0
195.0
195.0
358.0
346.0
212.7
355.0
200.0
200.0
200.0
200.0
335.0
200.0
200.0
200.0
200.0
335.0
200.0
200.0
200.0
200.0
335.0
200.0
200.0
335.0
200.0
200.0
335.0
200.0
200.0
335.0
29.0
31.8
55.0
45.0
45.0
45.0
45.0
35.0
45.0
45.0
45.0
45.0
35.0
45.0
45.0
45.0
45.0
35.0
45.0
45.0
35.0
45.0
45.0
35.0
45.0
45.0
35.0
SON
SON
250
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-23
SOT-23
SOT-23
SOT-23
SOT-223
SOT-23
SOT-23
SOT-223
SOT-23
SOT-23
SOT-223
SOT-23
SOT-23
SOT-223
3000
250
3000
250
2500
3000
250
3000
250
2500
3000
250
3000
250
2500
3000
250
2500
3000
250
2500
3000
250
2500
Pack Materials-Page 3
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