TPS76901SKGD2 [TI]
高温超低功耗 100mA 低压差线性稳压器 | KGD | 0 | -55 to 210;
| 型号： | TPS76901SKGD2 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 高温超低功耗 100mA 低压差线性稳压器 | KGD | 0 | -55 to 210 电源电路 线性稳压器IC |
| 文件： | 总21页 (文件大小：613K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
ULTRALOW-POWER 100-mA LOW DROPOUT LINEAR REGULATORS
Check for Samples: TPS76901-HT
1
FEATURES
SUPPORTS EXTREME TEMPERATURE
APPLICATIONS
•
•
•
100-mA Low-Dropout Regulator
Available in Adjustable Versions
•
•
•
•
Controlled Baseline
One Assembly/Test Site
One Fabrication Site
Only 335-μA Quiescent Current With 100 mA
at 210°C
•
•
•
1-μA Quiescent Current in Standby Mode
Dropout Voltage Typically 71 mV at 100 mA
Over Current Limitation
Available in Extreme (–55°C/210°C)
Temperature Range(1)
•
•
•
•
Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
APPLICATIONS
•
•
Down-Hole Drilling
Texas Instruments' high temperature products
utilize highly optimized silicon (die) solutions
with design and process enhancements to
maximize performance over extended
temperatures.
High Temperature Environments
(1) Custom temperature ranges available
HKQ PACKAGE
(TOP VIEW)
HKJ PACKAGE
(TOP VIEW)
DBV PACKAGE
(TOP VIEW)
1
4
8
5
1
2
3
5
NC
OUT
IN
IN
GND
EN
OUT
NC
FB
NC
FB
NC
OUT
IN
1
2
3
4
8
7
6
5
EN
EN
NC
GND
4
NC/FB
NC
GND
HKQ as formed or HKJ mounted dead bug
DESCRIPTION
The TPS76901 low-dropout (LDO) voltage regulator offers the benefits of low dropout voltage, ultralow-power
operation, and miniaturized packaging. This regulator features low dropout voltages and ultralow quiescent
current compared to conventional LDO regulators. The TPS76901 is ideal for micropower operations and where
board space is at a premium.
A combination of new circuit design and process innovation has enabled the usual PNP pass transistor to be
replaced by a PMOS pass element. Because the PMOS pass element behaves as a low-value resistor, the
dropout voltage is very low, and is directly proportional to the load current. Since the PMOS pass element is a
voltage-driven device, the quiescent current is ultralow (28 μA maximum) and is stable over the entire range of
output load current (0 mA to 100 mA). Intended for use in portable systems such as laptops and cellular phones,
the ultralow-dropout voltage feature and ultralow-power operation result in a significant increase in system
battery operating life.
The TPS76901 also features a logic-enabled sleep mode to shut down the regulator, reducing quiescent current
to 1 μA, typical at TJ = 25°C. The TPS76901 is a variable version programmable over the range of 1.2 V to
4.5 V).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
DIE THICKNESS
BACKSIDE FINISH
15 mils.
Silicon with backgrind
GND
Al-Si-Cu (0.5%)
Origin
a
c
b
d
Table 1. BOND PAD COORDINATES
DESCRIPTION(1)
PAD NUMBER
a
b
c
d
IN
1
2
91.55
764.45
91.50
176.55
215.10
253.10
1215.75
1256.00
1256.00
1256.00
1256.00
1256.00
1256.00
1143.50
785.00
287.50
849.45
176.50
176.50
176.50
305.00
406.00
507.00
608.00
709.00
810.00
949.50
966.00
949.50
OUT
DNC
FB
130.10
177.10
1130.75
1180.00
1180.00
1180.00
1180.00
1180.00
1180.00
1058.50
700.00
202.50
3
91.50
4
91.50
DNC
DNC
DNC
DNC
DNC
DNC
EN
5
229.00
330.00
431.00
532.00
633.00
734.00
864.50
881.00
864.50
6
7
8
9
10
11
12
13
GND
IN
(1) DNC = Do not connect
2
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
1062 mm
½
½
IN
OUT
IN
GND
EN
FB
Copyright © 2009–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPS76901-HT
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
ORDERING INFORMATION(1)
ORDERABLE PART NUMBER
TPS76901HDBVT
TA
PACKAGE(2)
TOP-SIDE MARKING
–55°c to 175°C
DBV
KGD
HKJ
PCFS
NA
TPS76901SKGD1
–55°c to 210°C
TPS76901SHKJ
TPS76901SHKJ
TPS76901SHKQ
HKQ
TPS76901SHKQ
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTIONAL BLOCK DIAGRAM
OUT
IN
EN
Current Limit
V
REF
FB
GND
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
VALUE
UNIT
VREF
Input voltage range(2)
–0.3 to 13.5
V
V
V
Voltage range at EN
–0.3 to VI + 0.3
Voltage on OUT, FB
7
Internally limited
2
Peak output current
ESD rating, HBM
kV
Continuous total power dissipation
Operating virtual junction temperature range
See Dissipation Ratings Table
–55 to 210
TJ
°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
4
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
THERMAL CHARACTERISTICS FOR DBV PACKAGE
DERATING FACTOR
ABOVE TA = 25°C
BOARD
RθJC
RθJA
Low K(1)
High K(2)
65.8 °C/W
65.8 °C/W
259 °C/W
180 °C/W
3.9 mW/°C
5.6 mW/°C
(1) The JEDEC Low K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2-ounce copper traces on top
of the board.
(2) The JEDEC High K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1-ounce internal power and
ground planes and 2-ounce copper traces on top and bottom of the board.
THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE
over operating free-air temperature range (unless otherwise noted)
PARAMETER
to ceramic side of case
to top of case lid (metal side of case)
MIN
TYP
MAX
5.7
UNIT
θJC
Junction-to-case thermal resistance
°C/W
13.7
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
5
NOM
MAX
UNIT
VI
Input votlage(1)
10
4.5
V
V
VO
IO
Ouput voltage range
Continuous output current(2)
1.2
0
100
210
mA
°C
TJ
Operating junction temperature
–55
(1) To calculate the minimum input voltage for your maximum output current, use the following formula:
XXXX VI(min) = VO(max) + VDO(max load).
(2) Continuous output current and operating junction temperature are limited by internal protection circuitry, but it is not recommended that
the device operate under conditions beyond those specified in this table for extended periods of time.
ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TJ = 25°C
MIN
TYP
MAX
UNIT
VO
TJ = –55°C to 125°C
TJ = 175°C
0.95VO
0.84VO
0.84VO
1.03VO
1.03VO
1.03VO
Output voltage
VO
1.2 V ≤ VO ≤ 4.5 V
V
(10 μA to 100 mA load)(1)
TJ = 210°C
EN = 0 V,
0 mA < IO < 100 mA
TJ = 25°C
17
Quiescent Current
(GND current)(1) (2)
TJ = –55°C to 125°C
TJ = 175°C
28
28
IQ
μA
EN = 4 V,
IO = 100 mA
23
335
12
TJ = 210°C
TJ = 25°C
EN = 0 V,
IO = 0 to 100 mA
Load regulation
TJ = 175°C
16.5
23.4
0.04
mV
TJ = 210°C
TJ = 25°C
TJ = –55°C to 125°C
TJ = 175°C
0.1
0.275
0.34
Output voltage line regulation
5 V ≤ VI ≤ 10 V(1)
%
(ΔVO/VO)(2)
TJ = 210°C
BW = 300 Hz to 50 kHz,
CO = 10 μF
VN
Output noise voltage
TJ = 25°C
190
μVms
(1) Minimum IN operating voltage is 5V. Maximum IN voltage 10 V, minimum output current 10 μA, maximum output current 100 mA.
(2) Line Regulation (%) = (Δ VOUT) / (Δ VIN) x 100
Copyright © 2009–2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPS76901-HT
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
ELECTRICAL CHARACTERISTICS (continued)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TJ = 25°C
MIN
TYP
MAX
UNIT
350
TJ = –55°C to 125°C
TJ = 175°C
750
750
Output current limit
VO = 0 V(1)
mA
350
505
1
TJ = 210°C
TJ = 25°C
TJ = –55°C to 125°C
TJ = 175°C
2
ISTDBY
Standby current
FB input current
EN = VI, 5 V ≤ VI ≤ 10 V
μA
8.8
11.85
TJ = 210°C
150
TJ = –55°C to 125°C
TJ = 175°C
–1
1
IFB
VIH
VIL
FB = 1.224 V
0.02
0.2
μA
V
TJ = 210°C
High level enable input voltage 5 V ≤ VI ≤ 10 V
TJ = 25°C
1.7
TJ = 25°C
0.9
Low level enable input voltage
Power supply ripple rejection
5 V ≤ VI ≤ 10 V
TJ = 175°C
0.6
0.4
V
TJ = 210°C
f = 1 kHz,
PSRR
TJ = 25°C
60
dB
CO = 10 μF(3)
TJ = 25°C
TJ = 175°C
TJ = 210°C
TJ = 25°C
TJ = 175°C
TJ = 210°C
–1
–1
0
0.14
3.5
1
1
EN = 0 V
EN = VI
IIN
Input current
μA
3.8
5.5
(3) Minimum IN operating voltage is 5V. Maximum IN voltage 10 V, minimum output current 10 μA, maximum output current 100 mA.
DEVICE INFORMATION
TERMINAL FUNCTIONS
TERMINAL
I/O
DESCRIPTION
NAME
NC
NO.
1, 5, 8
No connection
FB
2
3
4
6
7
I
I
Feedback voltage
Enable input
EN
GND
IN
Ground
I
Input supply voltage
Regulated output voltage
OUT
O
6
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
TYPICAL CHARACTERISTICS
VOUT
vs
TEMPERATURE
(VIN = 5 V , Load = 100 mA)
3.8
3.7
3.6
3.5
3.4
3.3
3.2
25
125
150
180
200
210
Temperature - °C
Figure 1.
OUTPUT IMPEDANCE
vs
FREQUENCY
2
V = 4.3 V
I
1.8
C
= 4.7 µF
ESR = 0.3 Ω
O
1.6
T
A
= 25°C
1.4
1.2
1
0.8
I
O
= 1 mA
0.6
0.4
0.2
0
I
O
= 100 mA
10
100
1 k
10 k
100 k
1 M
f - Frequency - Hz
Figure 2.
Copyright © 2009–2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TPS76901-HT
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
LDO STARTUP TIME
EN
V
O
0
20 40 60 80 100 120 140 160 180 200
t - Time - µs
Figure 3.
8
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
TYPICAL CHARACTERISTICS (continued)
1000
100
10
1
Electromigration Fail Mode
0
110
130
150
170
190
210
230
Continuous TJ - °C
Note:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
Figure 4. TPS76901HDBVT / TPS76901SKGD1 / TPS76901SHKJ / TPS76901SHKQ
Operating Life Derating Chart
Copyright © 2009–2012, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TPS76901-HT
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
10000000
1000000
100000
10000
1000
Wirebond Voiding
Fail Mode
100
100
110
120
130
140
150
160
170
180
Continuous TJ (°C)
Note:
1. See datasheet for absolute maximum and minimum recommended operating conditions.
2. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package
interconnect life).
Figure 5. TPS76901HDBVT Operating Life Derating Chart
10
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
TPS76901-HT
www.ti.com
SLVS959C –JUNE 2009–REVISED APRIL 2012
APPLICATION INFORMATION(1)
The TPS76901 low-dropout (LDO) regulator has been optimized for use in battery-operated equipment. It
features extremely low dropout voltages, low quiescent current (17 μA nominally), and enables inputs to reduce
supply currents to 1 μA when the regulators are turned off.
DEVICE OPERATION
The TPS76901 uses a PMOS pass element to dramatically reduce both dropout voltage and supply current over
more conventional PNP-pass-element LDO designs. The PMOS pass element is a voltage-controlled device and,
unlike a PNP transistor, it does not require increased drive current as output current increases. Supply current in
the TPS76901 is essentially constant from no load to maximum load.
Current limiting prevents damage by excessive output current. The device switches into a constant-current mode
at approximately 350 mA; further load reduces the output voltage instead of increasing the output current. The
PMOS pass element includes a back gate diode that conducts reverse current when the input voltage level drops
below the output voltage level.
A voltage of 1.7 V or greater on the EN input will disable the TPS76901 internal circuitry, reducing the supply
current to 1 μA. A voltage of less than 0.9 V on the EN input will enable the TPS76901 and will enable normal
operation to resume. The EN input does not include any deliberate hysteresis, and it exhibits an actual switching
threshold of approximately 1.5 V.
A typical application circuit is shown in Figure 6.
TPS76901
1
V
I
IN
4
FB
5
OUT
V
C1
O
3
1 µF
EN
+
4.7 µF
GND
2
ESR = 0.2 Ω
Figure 6. Typical Application Circuit
EXTERNAL CAPACITOR REQUIREMENTS
Although not required, a 0.047-μF or larger ceramic input bypass capacitor, connected between IN and GND and
located close to the TPS76901, is recommended to improve transient response and noise rejection. A higher-
value electrolytic input capacitor may be necessary if large, fast-rise-time load transients are anticipated and the
device is located several inches from the power source.
Like all low dropout regulators, the TPS76901 requires an output capacitor connected between OUT and GND to
stabilize the internal control loop. The minimum recommended capacitance is 4.7 μF. The ESR (equivalent series
resistance) of the capacitor should be between 0.2 Ω and 10 Ω. to ensure stability. Capacitor values larger than
4.7 μF are acceptable, and allow the use of smaller ESR values. Capacitances less than 4.7 μF are not
recommended because they require careful selection of ESR to ensure stability. Solid tantalum electrolytic,
aluminum electrolytic, and multilayer ceramic capacitors are all suitable, provided they meet the requirements
described above. Most of the commercially available 4.7-μF surface-mount solid tantalum capacitors, including
devices from Sprague, Kemet, and Nichico, meet the ESR requirements stated above. Multilayer ceramic
capacitors may have very small equivalent series resistances and may thus require the addition of a low value
series resistor to ensure stability.
(1) Application information is provided for commercial temperature as a reference and not for high temperature.
Copyright © 2009–2012, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TPS76901-HT
TPS76901-HT
SLVS959C –JUNE 2009–REVISED APRIL 2012
www.ti.com
Table 2. CAPACITOR SELECTION
PART NO.
MANUFACTURER
VALUE
4.7 μF
10 μF
MAX ESR(1)
SIZE (H x L x W)(1)
T494B475K016AS
195D106x0016x2T
695D106x003562T
TPSC475K035R0600
KEMET
SPRAGUE
SPRAGUE
AVX
1.5 Ω
1.5 Ω
1.3 Ω
0.6 Ω
1.9 x 3.5 x 2.8
1.3 x 7.0 x 2.7
2.5 x 7.6 x 2.5
2.6 x 6.0 x 3.2
10 μF
4.7 μF
(1) Size is in mm. ESR is maximum resistance in Ohms at 100 kHz and TA = 25°C. Contact manufacturer for minimum ESR values.
OUTPUT VOLTAGE PROGRAMMING
The output voltage of the TPS76901 adjustable regulator is programmed using an external resistor divider as
shown in Figure 7. The output voltage is calculated using:
R1
R2
VO = VREF
•
(1 +
)
(1)
Where:
VREF = 1.16 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 7-μA divider current. Lower value resistors can be
used but offer no inherent advantage and waste more power. Higher values should be avoided as leakage
currents at FB increase the output voltage error. The recommended design procedure is to choose R2 = 169 kΩ
to set the divider current at 7 μA and then calculate R1 using:
VO
VREF
- 1)• R2
R1 =
(
(2)
TPS76901
1
V
I
IN
1 µF
5
V
OUT
FB
O
≥1.7 V
3
R1
R2
EN
4
≤
0.9 V
4.7 µF
GND
2
ESR = 0.2 Ω
Note:
1. The above calculations hold good for room temperature values only.
Figure 7. Adjustable LDO Reulator Programming
REGULATOR PROTECTION
The TPS76901 PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be
appropriate.
The TPS76901 features internal current limiting protection. During normal operation, the TPS76901 limits output
current to approximately 350 mA. When current limiting engages, the output voltage scales back linearly until the
over current condition ends.
12
Submit Documentation Feedback
Copyright © 2009–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS76901-HT
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS76901HDBVT
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TPS76901SHKJ
TPS76901SHKQ
TPS76901SKGD1
ACTIVE
PREVIEW
ACTIVE
CFP
CFP
HKJ
HKQ
KGD
8
8
0
1
TBD
TBD
TBD
Call TI
Call TI
Call TI
N / A for Pkg Type
Call TI
25
XCEPT
400
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS76901-HT :
Catalog: TPS76901
•
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Apr-2012
Automotive: TPS76901-Q1
•
Enhanced Product: TPS76901-EP
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
•
•
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS76901HDBVT
SOT-23
DBV
5
250
179.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SOT-23 DBV
SPQ
Length (mm) Width (mm) Height (mm)
203.0 203.0 35.0
TPS76901HDBVT
5
250
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明