TPS77818PWPR [TI]

FAST-TRANSIENT-RESPONSE 750mA LOW-DROPOUT LINEAR REGULATORS; 快速瞬态响应750毫安低压差线性稳压器
TPS77818PWPR
型号: TPS77818PWPR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

FAST-TRANSIENT-RESPONSE 750mA LOW-DROPOUT LINEAR REGULATORS
快速瞬态响应750毫安低压差线性稳压器

线性稳压器IC 调节器 电源电路 光电二极管 输出元件
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
PWP PACKAGE  
(TOP VIEW)  
D
Open Drain Power-On Reset With 200 ms  
Delay (TPS777xx)  
D
D
D
D
D
D
D
Open Drain Power Good (TPS778xx)  
750-mA Low-Dropout Voltage Regulator  
GND/HSINK  
GND/HSINK  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
GND/HSINK  
GND/HSINK  
NC  
NC  
RESET/PG  
FB/NC  
OUT  
OUT  
GND/HSINK  
GND/HSINK  
GND  
NC  
EN  
IN  
IN  
Available in 1.5-V, 1.8-V, 2.5-V, 3.3-V Fixed  
Output and Adjustable Versions  
Dropout Voltage to 260 mV (Typ) at 750 mA  
(TPS77x33)  
NC  
GND/HSINK  
GND/HSINK  
Ultralow 85 mA Typical Quiescent Current  
Fast Transient Response  
2% Tolerance Over Specified Conditions for  
Fixed-Output Versions  
NC − No internal connection  
D
D
8-Pin SOIC and 20-Pin TSSOP PowerPAD  
(PWP) Package  
D PACKAGE  
(TOP VIEW)  
Thermal Shutdown Protection  
GND  
EN  
IN  
RESET/PG  
1
2
3
4
8
7
6
5
description  
FB/NC  
OUT  
TPS777xx and TPS778xx are designed to have a  
IN  
OUT  
fast transient response and be stable with a 10 µF  
low ESR capacitor. This combination provides  
high performance at a reasonable cost.  
TPS77x33  
DROPOUT VOLTAGE  
vs  
TPS77x33  
FREE-AIR TEMPERATURE  
LOAD TRANSIENT RESPONSE  
3
2
1
0
10  
10  
10  
10  
C
= 2x47 µF  
o
ESR = 1/2x100 mΩ  
= 3.3 V  
50  
0
V
O
I
= 750 mA  
O
V = 4.3 V  
I
−50  
1000  
500  
0
I
O
= 10 mA  
−1  
10  
10  
I
= 0  
O
C
= 10 µF  
o
−2  
−60 −40 −20  
T
0
20 40 60 80 100 120 140  
0
20 40 60 80 100 120 140 160 180 200  
− Free-Air Temperature − °C  
t − Time − µs  
A
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
All trademarks are the property of their respective owners.  
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Copyright 1999 − 2004, Texas Instruments Incorporated  
1
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
description (continued)  
Because the PMOS device behaves as a low-value resistor, the dropout voltage is very low (typically 260 mV at an output  
current of 750 mA for the TPS77x33) and is directly proportional to the output current. Additionally, since the PMOS pass  
element is a voltage-driven device, the quiescent current is very low and independent of output loading (typically 85 µA over  
the full range of output current, 0 mA to 750 mA). These two key specifications yield a significant improvement in operating  
life for battery-powered systems. This LDO family also features a sleep mode; applying a TTL high signal to EN (enable)  
shuts down the regulator, reducing the quiescent current to 1 µA at TJ = 25°C.  
The RESET output of the TPS777xx initiates a reset in microcomputer and microprocessor systems in the event of an  
undervoltage condition. An internal comparator in the TPS777xx monitors the output voltage of the regulator to detect an  
undervoltage condition on the regulated output voltage.  
Power good (PG) of the TPS778xx is an active high output, which can be used to implement a power-on reset or a  
low-battery indicator.  
The TPS777xx and TPS778xx are offered in 1.5-V, 1.8-V, 2.5-V, and 3.3-V fixed-voltage versions and in an adjustable  
version (programmable over the range of 1.5 V to 5.5 V for the TPS77701 option and 1.2 V to 5.5 V for the TPS77801 option).  
Output voltage tolerance is specified as a maximum of 2% over line, load, and temperature ranges. The TPS777xx and  
TPS778xx families are available in 8-pin SOIC and 20-pin PWP packages.  
AVAILABLE OPTIONS  
OUTPUT  
VOLTAGE  
(V)  
PACKAGED DEVICES  
T
J
TSSOP  
(PWP)  
SOIC  
(D)  
TYP  
3.3  
2.5  
1.8  
1.5  
TPS77733PWP TPS77833PWP  
TPS77725PWP TPS77825PWP  
TPS77718PWP TPS77818PWP  
TPS77715PWP TPS77815PWP  
TPS77733D  
TPS77833D  
TPS77825D  
TPS77818D  
TPS77815D  
TPS77725D  
TPS77718D  
TPS77715D  
40°C to 125°C  
Adjustable  
1.5 V to 5.5 V  
TPS77701PWP  
TPS77701D  
Adjustable  
1.2 V to 5.5 V  
TPS77801PWP  
TPS77801D  
The TPS77x01 is programmable using an external resistor divider (see application information). The D and PWP  
packages are available taped and reeled. Add an R suffix to the device type (e.g., TPS77701DR).  
6
7
16  
RESET/  
PG  
V
I
IN  
IN  
RESET/PG  
14  
13  
OUT  
OUT  
V
O
5
0.1 µF  
EN  
(1)  
C
o
+
10 µF  
GND  
3
(1)  
See application information section for capacitor selection details.  
Figure 1. Typical Application Configuration for Fixed Output Options  
2
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
functional block diagram—adjustable version  
IN  
EN  
PG or RESET  
OUT  
_
+
+
_
200 ms Delay  
(for RESET Option)  
R1  
V
ref  
= 1.1834 V  
FB/NC  
R2  
GND  
External to the device  
functional block diagram—fixed-voltage version  
IN  
EN  
PG or RESET  
_
+
OUT  
+
_
200 ms Delay  
(for RESET Option)  
R1  
V
ref  
= 1.1834 V  
R2  
GND  
3
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
Terminal Functions  
SOIC Package (TPS777xx)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
2
EN  
I
I
Enable input  
FB/NC  
GND  
IN  
7
Feedback input voltage for adjustable device (no connect for fixed options)  
1
Regulator ground  
Input voltage  
3, 4  
5, 6  
8
I
OUT  
O
O
Regulated output voltage  
RESET output  
RESET  
TSSOP Package (TPS777xx)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
5
EN  
I
I
Enable input  
FB/NC  
15  
3
Feedback input voltage for adjustable device (no connect for fixed options)  
GND  
Regulator ground  
Ground/heatsink  
GND/HSINK  
1, 2, 9, 10, 11,  
12, 19, 20  
IN  
6, 7  
4, 8, 17, 18  
13, 14  
I
Input  
NC  
No connect  
OUT  
RESET  
O
O
Regulated output voltage  
RESET output  
16  
SOIC Package (TPS778xx)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
2
EN  
I
I
Enable input  
FB/NC  
GND  
IN  
7
Feedback input voltage for adjustable device (no connect for fixed options)  
1
Regulator ground  
Input voltage  
3, 4  
5, 6  
8
I
OUT  
PG  
O
O
Regulated output voltage  
PG output  
TSSOP Package (TPS778xx)  
TERMINAL  
I/O  
DESCRIPTION  
NAME  
NO.  
5
EN  
I
I
Enable input  
FB/NC  
15  
3
Feedback input voltage for adjustable device (no connect for fixed options)  
GND  
Regulator ground  
Ground/heatsink  
GND/HSINK  
1, 2, 9, 10, 11,  
12, 19, 20  
IN  
6, 7  
4, 8, 17, 18  
13, 14  
I
Input  
NC  
OUT  
PG  
No connect  
O
O
Regulated output voltage  
PG output  
16  
4
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TPS777xx RESET timing diagram  
V
I
(1)  
V
res  
V
res  
t
V
O
(2)  
V
IT+  
(2)  
V
IT+  
Threshold  
Voltage  
Less than 5% of the  
output voltage  
(2)  
(2)  
V
IT−  
V
IT−  
t
RESET  
Output  
200 ms  
Delay  
200 ms  
Delay  
Output  
Undefined  
Output  
Undefined  
t
(1)  
V
is the minimum input voltage for a valid RESET. The symbol V is not currently listed within EIA or JEDEC standards for semiconductor  
res  
res  
symbology.  
(2)  
V
IT  
−Trip voltage is typically 5% lower than the output voltage (95%V ) V  
IT−  
to V is the hysteresis voltage.  
IT+  
O
5
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
(1)  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Input voltage range(2), V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 13.5 V  
I
Voltage range at EN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 16.5 V  
Maximum RESET voltage (TPS777xx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V  
Maximum PG voltage (TPS778xx) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16.5 V  
Peak output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally limited  
Output voltage, V (OUT, FB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V  
O
Continuous total power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See dissipation rating tables  
Operating junction temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 125°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
ESD rating, HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV  
(1)  
(2)  
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
All voltage values are with respect to network terminal ground.  
DISSIPATION RATING TABLE 1 − FREE-AIR TEMPERATURES  
AIR FLOW  
(CFM)  
T
< 25°C  
DERATING FACTOR  
T
= 70°C  
T = 85°C  
A
A
A
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
POWER RATING POWER RATING  
A
0
568 mW  
5.68 mW/°C  
9.04 mW/°C  
312 mW  
497 mW  
227 mW  
361 mW  
D
250  
904 mW  
DISSIPATION RATING TABLE 2 − FREE-AIR TEMPERATURES  
AIR FLOW  
(CFM)  
T
< 25°C  
DERATING FACTOR  
T
= 70°C  
T = 85°C  
A
A
A
PACKAGE  
POWER RATING  
ABOVE T = 25°C  
POWER RATING POWER RATING  
A
0
2.9 W  
23.5 mW/°C  
34.6 mW/°C  
23.8 mW/°C  
57.9 mW/°C  
1.9 W  
2.8 W  
1.9 W  
4.6 W  
1.5 W  
2.2 W  
1.5 W  
3.8 W  
§
PWP  
PWP  
300  
0
4.3 W  
3 W  
300  
7.2 W  
(1)  
(2)  
This parameter is measured with the recommended copper heat sink pattern on a 1-layer PCB, 5 in × 5 in PCB, 1 oz.  
copper, 2 in × 2 in coverage (4 in ).  
2
This parameter is measured with the recommended copper heat sink pattern on a 8-layer PCB, 1.5 in × 2 in PCB, 1 oz.  
2
2
copper with layers 1, 2, 4, 5, 7, and 8 at 5% coverage (0.9 in ) and layers 3 and 6 at 100% coverage (6 in ). For more  
information, refer to TI technical brief SLMA002.  
recommended operating conditions  
MIN  
2.7  
MAX  
10  
UNIT  
(1)  
Input voltage, V  
V
I
TPS77701  
TPS77801  
1.5  
5.5  
Output voltage range, V  
V
O
1.2  
5.5  
Operating junction temperature, T  
40  
125  
°C  
J
(1)  
Minimum V = V  
IN OUT  
+ V  
DO  
or 2.7V, whichever is greater.  
6
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
electrical characteristics over recommended operating temperature range (TJ = −40°C to 125°C),  
V = V  
+ 1 V, I = 1 mA, EN = 0 V, C = 10 µF (unless otherwise noted)  
I
O(typ)  
O
o
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
1.5 V V 5.5 V, T = 25°C  
V
O
J
O
TPS77701  
TPS77801  
TPS77x15  
TPS77x18  
TPS77x25  
TPS77x33  
1.5 V V 5.5 V,  
0.98V  
1.02V  
O
O
O
1.2 V V 5.5 V,  
T = 25°C  
J
V
O
O
1.2 V V 5.5 V,  
0.98V  
1.02V  
O
O
O
T = 25°C,  
J
2.7 V < V < 10 V  
IN  
1.5  
1.8  
2.5  
3.3  
85  
T = −40°C to 125°C, 2.7 V < V < 10 V  
J IN  
1.470  
1.764  
2.450  
3.234  
1.530  
1.836  
2.550  
3.366  
125  
Output voltage (10 µA to 750 mA load)  
V
T = 25°C,  
J
2.8 V < V < 10 V  
IN  
T = −40°C to 125°C, 2.8 V < V < 10 V  
J IN  
T = 25°C,  
J
3.5 V < V < 10 V  
IN  
T = −40°C to 125°C, 3.5 V < V < 10 V  
J IN  
T = 25°C,  
J
4.3 V < V < 10 V  
IN  
T = −40°C to 125°C, 4.3 V < V < 10 V  
J IN  
10 µA < I < 750 mA, T = 25°C  
O
J
Quiescent current (GND current)  
µA  
I
O
= 750 mA  
Output voltage line regulation (V /V  
V
O
+ 1 V < V 10 V, T = 25°C  
0.01  
3
%/V  
mV  
O
O
I
J
)
Load regulation  
BW = 200 Hz to 100 kHz, C = 10 µF,  
o
Output noise voltage (TPS77x18)  
54  
µVrms  
T = 25°C, I = 750 µA  
J
C
Output current limit  
V
O
= 0 V  
1.2  
1.7  
2
A
Thermal shutdown junction temperature  
Standby current  
150  
°C  
EN = V  
EN = V  
T = 25°C,  
J
I,  
1
µA  
µA  
2.7 V < V < 10 V  
I
I,  
10  
2.7 V < V < 10 V  
I
FB input current  
TPS77x01  
FB = 1.5 V  
2
nA  
V
High level enable input voltage  
Low level enable input voltage  
1.7  
92  
0.9  
V
f = 1 KHz,  
T = 25°C  
J
C
= 10 µF,  
o
Power supply ripple rejection  
60  
dB  
V
Minimum input voltage for valid RESET  
Trip threshold voltage  
Hysteresis voltage  
I
= 300 µA  
1.1  
O(RESET)  
V
O
decreasing  
98  
%V  
%V  
V
O
Measured at V  
0.5  
Reset  
O
O
(TPS777xx)  
Output low voltage  
V = 2.7 V,  
I
I
= 1 mA  
0.15  
0.4  
1
O(RESET)  
Leakage current  
V
= 5 V  
µA  
(RESET)  
RESET time-out delay  
200  
ms  
7
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
electrical characteristics over recommended operating temperature range (TJ = −40°C to 125°C),  
V = V  
I
+ 1 V, I = 1 mA, EN = 0 V, C = 10 µF (unless otherwise noted) (continued)  
O(typ)  
O
o
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
Minimum input voltage for valid PG  
Trip threshold voltage  
Hysteresis voltage  
I
= 300 µA  
1.1  
V
O(PG)  
decreasing  
V
92  
98  
%V  
%V  
V
O
O
PG  
(TPS778xx)  
Measured at V  
0.5  
O
O
Output low voltage  
V = 2.7 V,  
I
= 1 mA  
0.15  
0.4  
1
I
O(PG)  
Leakage current  
V
= 5 V  
µA  
(PG)  
EN = 0 V  
EN = V  
−1  
−1  
0
260  
260  
1
Input current (EN)  
Dropout voltage (1)  
µA  
1
I
I
O
I
O
I
O
I
O
= 750 mA,  
= 750 mA,  
= 750 mA,  
= 750 mA,  
T = 25°C  
J
TPS77733  
TPS77833  
427  
427  
mV  
T = 25°C  
J
(1)  
IN voltage equals V (typ) − 100 mV; TPS77x01 output voltage set to 3.3 V nominal with external resistor divider. TPS77x15, TPS77x18, and  
TPS77x25 dropout voltage limited by input voltage range limitations (i.e., TPS77x33 input voltage needs to drop to 3.2 V for purpose of this  
test).  
O
TYPICAL CHARACTERISTICS  
Table of Graphs  
FIGURE  
vs Output current  
vs Free-air temperature  
vs Free-air temperature  
vs Frequency  
2, 3, 4  
5, 6, 7  
8
V
Output voltage  
O
Ground current  
Power supply ripple rejection  
Output spectral noise density  
Output impedance  
9
vs Frequency  
10  
Z
o
vs Frequency  
11  
vs Input voltage  
12  
V
DO  
Dropout voltage  
vs Free-air temperature  
vs Output voltage  
13  
Input voltage (min)  
14  
Line transient response  
Load transient response  
Output voltage  
15, 17  
16, 18  
19  
V
O
vs Time  
Equivalent series resistance (ESR)  
vs Output current  
21 − 24  
8
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
TPS77x33  
TPS77x15  
OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
1.4985  
3.2835  
V = 2.7 V  
T = 25°C  
A
V = 4.3 V  
I
I
T
= 25°C  
A
1.4980  
1.4975  
1.4970  
1.4965  
1.4960  
3.2830  
3.2825  
3.2820  
3.2815  
3.2810  
1.4955  
1.4950  
3.2805  
3.2800  
0
0.125  
0.25 0.375  
0.5  
0.675  
0.75  
0
0.125  
0.25 0.375  
O
0.5  
0.675  
0.75  
I
− Output Current − A  
I
− Output Current − A  
O
Figure 2  
Figure 3  
TPS77x25  
TPS77x33  
OUTPUT VOLTAGE  
vs  
OUTPUT VOLTAGE  
vs  
OUTPUT CURRENT  
FREE-AIR TEMPERATURE  
2.4960  
2.4955  
2.4950  
2.4945  
3.32  
3.31  
V = 4.3 V  
V = 3.5 V  
I
I
T
A
= 25°C  
3.30  
3.29  
3.28  
3.27  
3.26  
3.25  
I
O
= 750 mA  
2.4940  
2.4935  
2.4930  
I
O
= 1 mA  
2.4925  
2.4920  
0
0.125  
0.25 0.375  
0.5  
0.675  
0.75  
−60 −40 −20  
0
20 40 60 80 100 120 140  
I
O
− Output Current − A  
T
A
− Free-Air Temperature − °C  
Figure 5  
Figure 4  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
TPS77x15  
OUTPUT VOLTAGE  
vs  
TPS77x25  
OUTPUT VOLTAGE  
vs  
FREE-AIR TEMPERATURE  
FREE-AIR TEMPERATURE  
1.515  
2.515  
2.510  
2.505  
2.500  
2.495  
2.490  
V = 3.5 V  
I
V = 2.7 V  
I
1.510  
1.505  
1.500  
1.495  
1.490  
1.485  
I
O
= 750 mA  
I
O
= 750 mA  
I
= 1 mA  
O
I
O
= 1 mA  
2.485  
2.480  
−60 −40 −20  
0
20 40 60 80 100 120 140  
−60 −40 −20  
0
20  
40  
60  
80 100 120  
T
A
− Free-Air Temperature − °C  
T
A
− Free-Air Temperature − °C  
Figure 6  
Figure 7  
TPS77xxx  
GROUND CURRENT  
vs  
TPS77x33  
POWER SUPPLY RIPPLE REJECTION  
vs  
FREE-AIR TEMPERATURE  
FREQUENCY  
100  
95  
90  
85  
80  
75  
90  
80  
70  
V = 4.3 V  
I
C
T
A
= 10 µF  
= 25°C  
o
60  
50  
40  
30  
20  
I
= 500 mA  
= 750 mA  
O
I
= 1 mA  
O
I
O
10  
0
10  
−60 −40 −20  
0
20 40 60 80 100 120 140  
10  
100  
1k  
10k  
100k  
1M  
T
A
− Free-Air Temperature − °C  
f − Frequency − Hz  
Figure 9  
Figure 8  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
TPS77x33  
TPS77x33  
OUTPUT IMPEDANCE  
vs  
OUTPUT SPECTRAL NOISE DENSITY  
vs  
FREQUENCY  
FREQUENCY  
−5  
−6  
10  
0
−1  
−2  
V = 4.3 V  
I
V = 4.3 V  
I
C
T
A
= 10 µF  
= 25°C  
o
C
T
A
= 10 µF  
= 25°C  
o
I
O
= 1 mA  
I
O
= 7 mA  
10  
10  
I
O
= 750 mA  
−7  
−8  
10  
I
O
= 750 mA  
10  
10  
2
3
10  
4
10  
5
10  
10  
1
2
10  
3
10  
4
10  
5
10  
6
10  
10  
f − Frequency − Hz  
f − Frequency − kHz  
Figure 10  
Figure 11  
TPS77x33  
DROPOUT VOLTAGE  
vs  
TPS77x01  
DROPOUT VOLTAGE  
vs  
INPUT VOLTAGE  
FREE-AIR TEMPERATURE  
3
2
1
0
10  
10  
10  
10  
600  
500  
400  
300  
200  
100  
0
I
= 750 mA  
O
I
= 750 mA  
O
T
= 125°C  
A
T
= 25°C  
A
I
O
= 10 mA  
T
A
= −40°C  
−1  
10  
10  
I
= 0  
O
C
= 10 µF  
o
−2  
−60 −40 −20  
0
20 40 60 80 100 120 140  
2.5  
3
3.5  
4
4.5  
5
V − Input Voltage − V  
I
T
A
− Free-Air Temperature − °C  
Figure 13  
Figure 12  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
INPUT VOLTAGE (MIN)  
TPS77x15  
vs  
OUTPUT VOLTAGE  
LINE TRANSIENT RESPONSE  
4
I
O
= 0.75 A  
3.7  
2.7  
T
= 25°C  
A
T
A
= 125°C  
3
T
A
= −40°C  
10  
2.7  
0
−10  
C
T
A
= 10 µF  
= 25°C  
o
2
1.5 1.75  
2
2.25 2.5 2.75  
3
3.25 3.5  
0
20 40 60 80 100 120 140 160 180 200  
V
O
− Output Voltage − V  
t − Time − µs  
Figure 14  
Figure 15  
TPS77x15  
TPS77x33  
LOAD TRANSIENT RESPONSE  
LINE TRANSIENT RESPONSE  
C
= 2x47 µF  
o
C
T
A
= 10 µF  
= 25°C  
o
ESR = 1/2x100 mΩ  
= 1.5 V  
50  
0
V
O
V = 2.7 V  
I
5.3  
−50  
1000  
500  
4.3  
10  
0
0
−10  
0
20 40 60 80 100 120 140 160 180 200  
0
20 40 60 80 100 120 140 160 180 200  
t − Time − µs  
t − Time − µs  
Figure 17  
Figure 16  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
TPS77x33  
OUTPUT VOLTAGE  
vs  
TPS77x33  
LOAD TRANSIENT RESPONSE  
TIME (AT STARTUP)  
4
C
= 2x47 µF  
o
ESR = 1/2x100 mΩ  
= 3.3 V  
C
I
T
A
= 10 µF  
= 750 mA  
= 25°C  
o
O
50  
0
V
O
3
2
1
V = 4.3 V  
I
−50  
1000  
500  
0
0
0
0
20 40 60 80 100 120 140 160 180 200  
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9  
t − Time − ms  
1
t − Time − µs  
Figure 18  
Figure 19  
To Load  
IN  
V
I
OUT  
+
R
L
C
o
R
EN  
GND  
ESR  
Figure 20. Test Circuit for Typical Regions of Stability (Figures 21 through 24) (Fixed Output Options)  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
TYPICAL CHARACTERISTICS  
TYPICAL REGION OF STABILITY  
TYPICAL REGION OF STABILITY  
EQUIVALENT SERIES RESISTANCE  
vs  
(1)  
EQUIVALENT SERIES RESISTANCE  
(1)  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
Region of Instability  
Region of Instability  
1
1
V
C
= 3.3 V  
= 4.7 µF  
O
o
V
= 3.3 V  
O
C
= 4.7 µF  
o
Region of Stability  
Region of Stability  
V = 4.3 V  
V = 4.3 V  
I
A
I
J
T
= 25°C  
T
= 125°C  
0.1  
0.01  
0.1  
0.01  
Region of Instability  
Region of Instability  
0
125  
250  
375  
500  
625  
750  
0
125  
250  
375  
500  
625  
750  
I
O
− Output Current − mA  
I
O
− Output Current − mA  
Figure 21  
Figure 22  
TYPICAL REGION OF STABILITY  
TYPICAL REGION OF STABILITY  
(1)  
EQUIVALENT SERIES RESISTANCE  
(1)  
EQUIVALENT SERIES RESISTANCE  
vs  
vs  
OUTPUT CURRENT  
OUTPUT CURRENT  
10  
10  
Region of Instability  
Region of Instability  
1
1
V
C
= 3.3 V  
= 22 µF  
O
o
V
= 3.3 V  
O
Region of Stability  
C
= 22 µF  
o
V = 4.3 V  
Region of Stability  
I
A
V = 4.3 V  
I
J
T
= 25°C  
T
= 125°C  
0.1  
0.01  
0.1  
0.01  
Region of Instability  
Region of Instability  
0
125  
I
250  
375  
500  
625  
750  
0
125  
250  
375  
500  
625  
750  
− Output Current − mA  
O
I
O
− Output Current − mA  
Figure 23  
Figure 24  
(1)  
Equivalent series resistance (ESR) refers to the total series resistance, including the ESR of the capacitor, any series resistance added  
externally, and PWB trace resistance to C .  
o
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
APPLICATION INFORMATION  
The TPS777xx and TPS778xx families include four fixed-output voltage regulators (1.5 V, 1.8 V, 2.5 V, and 3.3 V), and an  
adjustable regulator, the TPS77x01 (adjustable from 1.5 V to 5.5 V for TPS77701 option and 1.2 V to 5.5 V for TPS77801  
option).  
device operation  
The TPS777xx and TPS778xx feature very low quiescent current, which remains virtually constant even with varying loads.  
Conventional LDO regulators use a pnp pass element, the base current of which is directly proportional to the load current  
through the regulator (IB = IC/β). The TPS777xx and TPS778xx use a PMOS transistor to pass current; because the gate  
of the PMOS is voltage driven, operating current is low and invariable over the full load range.  
Another pitfall associated with the pnp-pass element is its tendency to saturate when the device goes into dropout. The  
resulting drop in β forces an increase in IB to maintain the load. During power up, this translates to large start-up currents.  
Systems with limited supply current may fail to start up. In battery-powered systems, it means rapid battery discharge when  
the voltage decays below the minimum required for regulation. The TPS777xx and TPS778xx quiescent currents remain  
low even when the regulator drops out, eliminating both problems.  
The TPS777xx and TPS778xx families also feature a shutdown mode that places the output in the high-impedance state  
(essentially equal to the feedback-divider resistance) and reduces quiescent current to 2 µA. If the shutdown feature is not  
used, EN should be tied to ground.  
minimum load requirements  
The TPS777xx and TPS778xx families are stable even at zero load; no minimum load is required for operation.  
FB—pin connection (adjustable version only)  
The FB pin is an input pin to sense the output voltage and close the loop for the adjustable option . The output voltage is  
sensed through a resistor divider network to close the loop as it is shown in Figure 26. Normally, this connection should  
be as short as possible; however, the connection can be made near a critical circuit to improve performance at that point.  
Internally, FB connects to a high-impedance wide-bandwidth amplifier and noise pickup feeds through to the regulator  
output. Routing the FB connection to minimize/avoid noise pickup is essential.  
external capacitor requirements  
An input capacitor is not usually required; however, a ceramic bypass capacitor (0.047 µF or larger) improves load transient  
response and noise rejection if the TPS777xx or TPS778xx are located more than a few inches from the power supply. A  
higher-capacitance electrolytic capacitor may be necessary if large (hundreds of milliamps) load transients with fast rise  
times are anticipated.  
Like all low dropout regulators, the TPS777xx and TPS778xx require an output capacitor connected between OUT and  
GND to stabilize the internal control loop. The minimum recommended capacitance value is 10 µF and the ESR (equivalent  
series resistance) must be between 50 mand 1.5 . Capacitor values 10 µF or larger are acceptable, provided the ESR  
is less than 1.5 . Solid tantalum electrolytic, aluminum electrolytic, and multilayer ceramic capacitors are all suitable,  
provided they meet the requirements described previously.  
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SLVS230G − SEPTEMBER 1999 − REVISED JANUARY 2004  
APPLICATION INFORMATION  
external capacitor requirements (continued)  
6
7
16  
RESET/PG  
RESET/  
PG  
V
I
IN  
IN  
250 kΩ  
14  
13  
V
OUT  
OUT  
O
C1  
0.1 µF  
5
EN  
C
+
o
10 µF  
GND  
3
Figure 25. Typical Application Circuit (Fixed Versions)  
programming the TPS77x01 adjustable LDO regulator  
The output voltage of the TPS77x01 adjustable regulator is programmed using an external resistor divider as shown in  
Figure 26. The output voltage is calculated using:  
R1  
R2  
  ǒ1 )  
ref  
Ǔ
(1)  
V
+ V  
O
Where:  
ref = 1.1834 V typ (the internal reference voltage)  
V
Resistors R1 and R2 should be chosen for approximately 10-µA divider current. Lower value resistors can be used but offer  
no inherent advantage and waste more power. Higher values should be avoided as leakage currents at FB increase the  
output voltage error. The recommended design procedure is to choose R2 = 110 kto set the divider current at  
approximately 10 µA and then calculate R1 using:  
V
O
R1 +  
ǒ
* 1  
Ǔ
  R2  
(2)  
V
ref  
OUTPUT VOLTAGE  
PROGRAMMING GUIDE  
TPS77x01  
OUTPUT  
VOLTAGE  
R1  
121  
R2  
110  
UNIT  
RESET/  
Reset or PG Output  
250 kΩ  
V
I
IN  
PG  
0.1 µF  
2.5 V  
3.3 V  
kΩ  
kΩ  
kΩ  
kΩ  
1.7 V  
196  
226  
332  
110  
110  
110  
EN  
OUT  
V
O
3.6 V  
0.9 V  
R1  
C
4.75 V  
o
FB / NC  
GND  
R2  
Figure 26. TPS77x01 Adjustable LDO Regulator Programming  
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APPLICATION INFORMATION  
reset indicator  
The TPS777xx features a RESET output that can be used to monitor the status of the regulator. The internal comparator  
monitors the output voltage: when the output drops to between 92% and 98% of its nominal regulated value, the RESET  
output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If not used, it can be left  
floating. RESET can be used to drive power-on reset circuitry or as a low-battery indicator. RESET does not assert itself  
when the regulated output voltage falls outside the specified 2% tolerance, but instead reports an output voltage low relative  
to its nominal regulated value (refer to timing diagram for start-up sequence).  
power-good indicator  
The TPS778xx features a power-good (PG) output that can be used to monitor the status of the regulator. The internal  
comparator monitors the output voltage: when the output drops to between 92% and 98% of its nominal regulated value,  
the PG output transistor turns on, taking the signal low. The open-drain output requires a pullup resistor. If not used, it can  
be left floating. PG can be used to drive power-on reset circuitry or used as a low-battery indicator.  
regulator protection  
The TPS777xx and TPS778xx PMOS-pass transistors have a built-in back diode that conducts reverse currents when the  
input voltage drops below the output voltage (e.g., during power down). Current is conducted from the output to the input  
and is not internally limited. When extended reverse voltage is anticipated, external limiting may be appropriate.  
The TPS777xx and TPS778xx also feature internal current limiting and thermal protection. During normal operation, the  
TPS777xx and TPS778xx limit output current to approximately 1.7 A. When current limiting engages, the output voltage  
scales back linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,  
care should be taken not to exceed the power dissipation ratings of the package. If the temperature of the device exceeds  
150°C(typ), thermal-protection circuitry shuts it down. Once the device has cooled below 130°C(typ), regulator operation  
resumes.  
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APPLICATION INFORMATION  
POWER DISSIPATION AND JUNCTION TEMPERATURE  
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature should be  
restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle  
in any given application. To ensure the junction temperature is within acceptable limits, calculate the maximum allowable  
dissipation, PD(max), and the actual dissipation, PD, which must be less than or equal to PD(max)  
The maximum-power-dissipation limit is determined using the following equation:  
T max * T  
.
J
A
P
+
D(max)  
R
qJA  
Where:  
T max is the maximum allowable junction temperature.  
J
R
is the thermal resistance junction-to-ambient for the package, and is calculated as  
θJA  
1
from the dissipation rating tables.  
derating factor  
T is the ambient temperature.  
A
The regulator dissipation is calculated using:  
+ ǒVI * V  
Ǔ
P
  I  
D
O
O
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation will trigger the thermal  
protection circuit.  
18  
PACKAGE OPTION ADDENDUM  
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11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
TPS77701D  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
SOIC  
SOIC  
D
8
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
77701  
TPS77701DG4  
TPS77701DR  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
75  
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77701  
SOIC  
8
Green (RoHS  
& no Sb/Br)  
77701  
TPS77701DRG4  
TPS77701PWP  
TPS77701PWPG4  
TPS77701PWPR  
TPS77701PWPRG4  
TPS77715D  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77701  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
PWP  
PWP  
D
20  
20  
20  
20  
8
Green (RoHS  
& no Sb/Br)  
PT77701  
PT77701  
PT77701  
PT77701  
77715  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77715DG4  
TPS77715DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77715  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77715  
TPS77715DRG4  
TPS77715PWP  
TPS77715PWPG4  
TPS77718D  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77715  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
D
20  
20  
8
Green (RoHS  
& no Sb/Br)  
PT77715  
PT77715  
77718  
70  
Green (RoHS  
& no Sb/Br)  
75  
Green (RoHS  
& no Sb/Br)  
TPS77718DG4  
TPS77718DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77718  
SOIC  
D
8
2500  
Green (RoHS  
& no Sb/Br)  
77718  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TPS77718DRG4  
TPS77718PWP  
TPS77718PWPG4  
TPS77718PWPR  
TPS77718PWPRG4  
TPS77725D  
ACTIVE  
SOIC  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
D
8
20  
20  
20  
20  
8
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
77718  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PWP  
PWP  
PWP  
PWP  
D
70  
70  
Green (RoHS  
& no Sb/Br)  
PT77718  
PT77718  
PT77718  
PT77718  
77725  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77725DG4  
TPS77725PWP  
TPS77725PWPG4  
TPS77725PWPR  
TPS77725PWPRG4  
TPS77733D  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77725  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
PWP  
PWP  
D
20  
20  
20  
20  
8
70  
Green (RoHS  
& no Sb/Br)  
PT77725  
PT77725  
PT77725  
PT77725  
77733  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77733DG4  
TPS77733DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77733  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77733  
TPS77733DRG4  
TPS77733PWP  
TPS77733PWPG4  
TPS77733PWPR  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77733  
HTSSOP  
HTSSOP  
HTSSOP  
PWP  
PWP  
PWP  
20  
20  
20  
Green (RoHS  
& no Sb/Br)  
PT77733  
PT77733  
PT77733  
70  
Green (RoHS  
& no Sb/Br)  
2000  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TPS77733PWPRG4  
TPS77801D  
ACTIVE  
HTSSOP  
SOIC  
PWP  
20  
8
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
PT77733  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
75  
75  
Green (RoHS  
& no Sb/Br)  
77801  
TPS77801DG4  
TPS77801DR  
SOIC  
8
Green (RoHS  
& no Sb/Br)  
77801  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77801  
TPS77801DRG4  
TPS77801PWP  
TPS77801PWPG4  
TPS77801PWPR  
TPS77801PWPRG4  
TPS77815D  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77801  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
PWP  
PWP  
D
20  
20  
20  
20  
8
Green (RoHS  
& no Sb/Br)  
PT77801  
PT77801  
PT77801  
PT77801  
77815  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77815DG4  
TPS77815DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77815  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77815  
TPS77815DRG4  
TPS77815PWP  
TPS77815PWPG4  
TPS77815PWPR  
TPS77815PWPRG4  
TPS77818D  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77815  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
PWP  
PWP  
D
20  
20  
20  
20  
8
Green (RoHS  
& no Sb/Br)  
PT77815  
PT77815  
PT77815  
PT77815  
77818  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TPS77818DG4  
TPS77818PWP  
TPS77818PWPG4  
TPS77818PWPR  
TPS77818PWPRG4  
TPS77825D  
ACTIVE  
SOIC  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
D
8
20  
20  
20  
20  
8
75  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-2-260C-1 YEAR  
77818  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
PWP  
PWP  
PWP  
PWP  
D
70  
70  
Green (RoHS  
& no Sb/Br)  
PT77818  
PT77818  
PT77818  
PT77818  
77825  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77825DG4  
TPS77825DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77825  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77825  
TPS77825DRG4  
TPS77825PWP  
TPS77825PWPG4  
TPS77825PWPR  
TPS77825PWPRG4  
TPS77833D  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77825  
HTSSOP  
HTSSOP  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
PWP  
PWP  
D
20  
20  
20  
20  
8
Green (RoHS  
& no Sb/Br)  
PT77825  
PT77825  
PT77825  
PT77825  
77833  
70  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
75  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TPS77833DG4  
TPS77833DR  
SOIC  
D
8
75  
Green (RoHS  
& no Sb/Br)  
77833  
SOIC  
D
8
2500  
2500  
70  
Green (RoHS  
& no Sb/Br)  
77833  
TPS77833DRG4  
TPS77833PWP  
SOIC  
D
8
Green (RoHS  
& no Sb/Br)  
77833  
HTSSOP  
PWP  
20  
Green (RoHS  
& no Sb/Br)  
PT77833  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 125  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
TPS77833PWPG4  
TPS77833PWPR  
TPS77833PWPRG4  
ACTIVE  
HTSSOP  
HTSSOP  
HTSSOP  
PWP  
20  
20  
20  
70  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
Level-2-260C-1 YEAR  
PT77833  
ACTIVE  
ACTIVE  
PWP  
PWP  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
PT77833  
PT77833  
Green (RoHS  
& no Sb/Br)  
-40 to 125  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 5  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TPS77701DR  
TPS77715DR  
SOIC  
SOIC  
SOIC  
D
D
D
8
8
2500  
2500  
2500  
2000  
2000  
2500  
2000  
2500  
2000  
2500  
2000  
2000  
2500  
2000  
2500  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
12.4  
12.4  
12.4  
16.4  
16.4  
12.4  
16.4  
12.4  
16.4  
12.4  
16.4  
16.4  
12.4  
16.4  
12.4  
16.4  
6.4  
6.4  
5.2  
5.2  
5.2  
7.1  
7.1  
5.2  
7.1  
5.2  
7.1  
5.2  
7.1  
7.1  
5.2  
7.1  
5.2  
7.1  
2.1  
2.1  
2.1  
1.6  
1.6  
2.1  
1.6  
2.1  
1.6  
2.1  
1.6  
1.6  
2.1  
1.6  
2.1  
1.6  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
12.0  
12.0  
12.0  
16.0  
16.0  
12.0  
16.0  
12.0  
16.0  
12.0  
16.0  
16.0  
12.0  
16.0  
12.0  
16.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
TPS77718DR  
8
6.4  
TPS77718PWPR  
TPS77725PWPR  
TPS77733DR  
HTSSOP PWP  
HTSSOP PWP  
20  
20  
8
6.95  
6.95  
6.4  
SOIC  
HTSSOP PWP  
SOIC  
HTSSOP PWP  
SOIC  
D
TPS77733PWPR  
TPS77801DR  
20  
8
6.95  
6.4  
D
TPS77801PWPR  
TPS77815DR  
20  
8
6.95  
6.4  
D
TPS77815PWPR  
TPS77818PWPR  
TPS77825DR  
HTSSOP PWP  
HTSSOP PWP  
20  
20  
8
6.95  
6.95  
6.4  
SOIC  
HTSSOP PWP  
SOIC  
HTSSOP PWP  
D
TPS77825PWPR  
TPS77833DR  
20  
8
6.95  
6.4  
D
TPS77833PWPR  
20  
6.95  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
26-Mar-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS77701DR  
TPS77715DR  
SOIC  
SOIC  
D
D
8
8
2500  
2500  
2500  
2000  
2000  
2500  
2000  
2500  
2000  
2500  
2000  
2000  
2500  
2000  
2500  
2000  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
35.0  
35.0  
35.0  
38.0  
38.0  
35.0  
38.0  
35.0  
38.0  
35.0  
38.0  
38.0  
35.0  
38.0  
35.0  
38.0  
TPS77718DR  
SOIC  
D
8
TPS77718PWPR  
TPS77725PWPR  
TPS77733DR  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
D
20  
20  
8
TPS77733PWPR  
TPS77801DR  
HTSSOP  
SOIC  
PWP  
D
20  
8
TPS77801PWPR  
TPS77815DR  
HTSSOP  
SOIC  
PWP  
D
20  
8
TPS77815PWPR  
TPS77818PWPR  
TPS77825DR  
HTSSOP  
HTSSOP  
SOIC  
PWP  
PWP  
D
20  
20  
8
TPS77825PWPR  
TPS77833DR  
HTSSOP  
SOIC  
PWP  
D
20  
8
TPS77833PWPR  
HTSSOP  
PWP  
20  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other  
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest  
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale  
supplied at the time of order acknowledgment.  
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary  
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily  
performed.  
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and  
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or  
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information  
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or  
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the  
third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration  
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service  
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.  
TI is not responsible or liable for any such statements.  
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