TPS780330220DDCR [TI]

150mA, Low-Dropout Regulator, Ultralow-Power, IQ 500nA with Pin-Selectable, Dual-Level Output Voltage; 150mA,低压降稳压器,超低功耗, IQ 500nA的与引脚可选,双电平输出电压
TPS780330220DDCR
型号: TPS780330220DDCR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

150mA, Low-Dropout Regulator, Ultralow-Power, IQ 500nA with Pin-Selectable, Dual-Level Output Voltage
150mA,低压降稳压器,超低功耗, IQ 500nA的与引脚可选,双电平输出电压

稳压器
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TPS780 Series  
www.ti.com ....................................................................................................................................................... SBVS083CJANUARY 2007REVISED MAY 2008  
150mA, Low-Dropout Regulator, Ultralow-Power, IQ 500nA  
with Pin-Selectable, Dual-Level Output Voltage  
The VSET pin allows the end user to switch between  
1
FEATURES  
two  
voltage  
levels  
on-the-fly  
through  
a
2
Low IQ: 500nA  
microprocessor-compatible input. This LDO is  
designed specifically for battery-powered applications  
where dual-level voltages are needed. With ultralow  
IQ (500nA), microprocessors, memory cards, and  
smoke detectors are ideal applications for this device.  
150mA, Low-Dropout Regulator with  
Pin-Selectable Dual Voltage Level Output  
Low Dropout: 200mV at 150mA  
3% Accuracy Over Load/Line/Temperature  
The ultralow-power and selectable dual-level output  
voltages allow designers to customize power  
consumption for specific applications. Designers can  
now shift to a lower voltage level in a battery-powered  
design when the microprocessor is in sleep mode,  
further reducing overall system power consumption.  
The two voltage levels are preset at the factory  
through a unique architecture using an EPROM. The  
EPROM technique allows for numerous output  
voltage options between VSET low (1.5V to 4.2V) and  
VSET high (2.0V to 3.0V) in the fixed output version  
only. Consult with your local factory representative for  
exact voltage options and ordering information;  
minimum order quantities may apply.  
Available in Dual-Level, Fixed Output Voltages  
from 1.5V to 4.2V Using Innovative Factory  
EPROM Programming  
Available in an Adjustable Version from 1.22V  
to 5.25V or a Dual-Level Output Version  
VSET Pin Toggles Output Voltage Between Two  
Factory-Programmed Voltage Levels  
Stable with a 1.0µF Ceramic Capacitor  
Thermal Shutdown and Overcurrent Protection  
CMOS Logic Level-Compatible Enable Pin  
Available in DDC (TSOT23-5) or DRV (2mm ×  
2mm SON-6) Package Options  
The TPS780 series are designed to be compatible  
with the TI MSP430 and other similar products. The  
enable pin is compatible with standard CMOS logic.  
This LDO is stable with any output capacitor greater  
than 1.0µF. Therefore, implementations of this device  
require minimal board space because of miniaturized  
packaging and a potentially small output capacitor.  
The TPS780 series IQ (500nA) also come with  
thermal shutdown and current limit to protect the  
device during fault conditions. All packages have an  
operating temperature range of TJ = –40°C to  
+125°C. For more cost-sensitive applications  
requiring a dual-level voltage option and only on par  
IQ, consider the TPS781 series, with an IQ of 1.0µA  
and dynamic voltage scaling.  
APPLICATIONS  
TI MSP430 Attach Applications  
Power Rails with Programming Mode  
Dual Voltage Levels for Power-Saving Mode  
Wireless Handsets, Smartphones, PDAs, MP3  
Players, and Other Battery-Operated Handheld  
Products  
DESCRIPTION  
The TPS780 family of low-dropout (LDO) regulators  
offer the benefits of ultralow power (IQ = 500nA),  
miniaturized packaging (2×2 SON-6), and selectable  
dual-level output voltage levels. An adjustable version  
is also available, but does not have the capability to  
shift voltage levels.  
TPS780DDC  
TSOT23-5  
TPS780DRV  
2mm x 2mm SON-6  
(TOP VIEW)  
(TOP VIEW)  
IN  
GND  
EN  
1
2
3
5
4
OUT  
OUT  
N/C  
1
2
3
6
5
4
IN  
Thermal  
Pad  
GND  
EN  
VSET/FB  
VSET/FB  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2008, Texas Instruments Incorporated  
TPS780 Series  
SBVS083CJANUARY 2007REVISED MAY 2008 ....................................................................................................................................................... www.ti.com  
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.  
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more  
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.  
ORDERING INFORMATION(1)(2)  
PRODUCT  
VOUT  
TPS780vvvxxxyyyz  
VVV is the nominal output voltage for VOUT(HIGH) and corresponds to VSET pin low.  
XXX is the nominal output voltage for VOUT(LOW) and corresponds to VSET pin high.  
YYY is the package designator.  
Z is the tape and reel quantity (R = 3000, T = 250).  
Adjustable version(3)(4)  
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Additional output voltage combinations are available on a quick-turn basis using innovative, factory EPROM programming.  
Minimum-order quantities apply; contact your sales representative for details and availability.  
(3) To order the adjustable version, use TPS78001YYYZ.  
(4) The device is either fixed voltage, dual-level VOUT, or adjustable voltage only. Device design does not permit a fixed and adjustable  
output simultaneously.  
ABSOLUTE MAXIMUM RATINGS(1)  
At TJ = –40°C to +125°C, unless otherwise noted. All voltages are with respect to GND.  
PARAMETER  
TPS780 Series  
–0.3 to +6.0  
–0.3 to VIN + 0.3(2)  
UNIT  
Input voltage range, VIN  
V
V
V
Enable and VSET voltage range, VEN and VVSET  
Output voltage range, VOUT  
–0.3 to VIN + 0.3V  
Maximum output current, IOUT  
Output short-circuit duration  
Total continuous power dissipation, PDISS  
Internally limited  
Indefinite  
See the Dissipation Ratings table  
Human body model (HBM)  
ESD rating  
2
kV  
V
Charged device model (CDM)  
500  
Operating junction temperature range, TJ  
Storage temperature range, TSTG  
–40 to +125  
–55 to +150  
°C  
°C  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
(2) VEN and VVSET absolute maximum rating are VIN + 0.3V or +6.0V, whichever is less.  
DISSIPATION RATINGS  
DERATING FACTOR  
BOARD  
High-K(1)  
High-K(1)  
PACKAGE  
DRV  
RθJC  
RθJA  
ABOVE TA = +25°C  
TA < +25°C  
1540mW  
500mW  
TA = +70°C  
845mW  
TA = +85°C  
615mW  
20°C/W  
90°C/W  
65°C/W  
200°C/W  
15.4mW/°C  
DDC  
5.0mW/°C  
275mW  
200mW  
(1) The JEDEC high-K (2s2p) board used to derive this data was a 3-inch × 3-inch, multilayer board with 1-ounce internal power and ground  
planes and 2-ounce copper traces on top and bottom of the board.  
2
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Copyright © 2007–2008, Texas Instruments Incorporated  
 
TPS780 Series  
www.ti.com ....................................................................................................................................................... SBVS083CJANUARY 2007REVISED MAY 2008  
ELECTRICAL CHARACTERISTICS  
Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(NOM) + 0.5V or 2.2V, whichever is greater; IOUT  
100µA, VVSET = VEN = VIN, COUT = 1.0µF, fixed or adjustable, unless otherwise noted. Typical values at TJ = +25°C.  
=
TPS780 Series  
PARAMETER  
TEST CONDITIONS  
MIN  
2.2  
–2  
TYP  
MAX  
5.5  
UNIT  
V
VIN  
Input voltage range  
Nominal  
TJ = +25°C, VSET = high/low  
±1  
+2  
%
(1)  
VOUT  
DC output accuracy  
Internal reference(2)  
(adjustable version only)  
Output voltage range(3)(4)  
(adjustable version only)  
Over VIN, IOUT  
temperature  
,
VOUT + 0.5V VIN 5.5V,  
0mA IOUT 150mA, VSET = high/low  
–3.0  
±2.0  
+3.0  
%
V
VFB  
TJ = +25°C, VIN = 4.0V, IOUT = 75mA  
VIN = 5.5V, IOUT = 100µA(2)  
1.216  
5.25  
VOUT_RANGE  
VFB  
V
ΔVOUT/ΔVIN Line regulation  
VOUT(NOM) + 0.5V VIN 5.5V, IOUT = 5mA  
0mA IOUT 150mA  
–1  
–2  
+1  
+2  
%
%
ΔVOUT/ΔIOUT Load regulation  
VDO  
VN  
Dropout voltage(5)  
VIN = 95% VOUT(NOM), IOUT = 150mA  
250  
mV  
BW = 100Hz to 100kHz, VIN = 2.2V,  
VOUT = 1.2V, IOUT = 1mA  
Output noise voltage  
86  
µVRMS  
VSET high (output VOUT(LOW)  
selected), or EN high (enabled)  
VHI  
1.2  
VIN  
0.4  
V
V
VSET low (output VOUT(HIGH)  
selected), or EN low (disabled)  
VLO  
ICL  
0
Output current limit  
VOUT = 0.90 × VOUT(NOM)  
IOUT = 0mA(6)  
150  
230  
420  
5
400  
800  
mA  
nA  
µA  
IGND  
Ground pin current  
IOUT = 150mA  
V
EN 0.4V, 2.2V VIN < 5.5V,  
ISHDN  
Shutdown current (IGND  
)
18  
130  
nA  
TJ = –40°C to +100°C  
VEN = VVSET = 5.5V  
VEN = VVSET = 5.5V  
IVSET  
IEN  
VSET pin current  
EN pin current  
FB pin current(7)  
70  
40  
nA  
nA  
IFB  
VIN = 5.5V, VOUT = 1.2V, IOUT = 100µA  
10  
nA  
(adjustable version only)  
f = 10Hz  
40  
20  
15  
dB  
dB  
dB  
VIN = 4.3V,  
VOUT = 3.3V,  
IOUT = 150mA  
PSRR  
Power-supply rejection ratio  
f = 100Hz  
f = 1kHz  
VOUT transition time (high-to-low)  
VOUT = 97% × VOUT(HIGH)  
VOUT_LOW = 2.2V, VOUT(HIGH) = 3.3V,  
IOUT = 10mA  
tTR(HL)  
tTR(LH)  
tSTR  
800  
800  
500  
µs  
µs  
µs  
VOUT transition time (low-to-high)  
VOUT = 97% × VOUT(LOW)  
VOUT_HIGH = 3.3V, VOUT(LOW) = 2.2V,  
IOUT = 10mA  
COUT = 1.0µF, VOUT = 10% VOUT(NOM) to  
VOUT = 90% VOUT(NOM)  
Startup time(8)  
IOUT = 150mA, COUT = 1.0µF, VOUT = 2.8V,  
VOUT = 90% VOUT(NOM) to VOUT = 10%  
VOUT(NOM)  
tSHDN  
Shutdown time(9)  
500(10)  
µs  
Shutdown, temperature increasing  
Reset, temperature decreasing  
+160  
+140  
°C  
°C  
°C  
TSD  
TJ  
Thermal shutdown temperature  
Operating junction temperature  
–40  
+125  
(1) The output voltage for VSET = low/high is programmed at the factory.  
(2) Adjustable version only.  
(3) No VSET pin on the adjustable version.  
(4) No dynamic voltage scaling on the adjustable version.  
(5) VDO is not measured for devices with VOUT(NOM) < 2.3V because minimum VIN = 2.2V.  
(6) IGND = 800nA (max) up to +100°C.  
(7) The TPS78001 FB pin is tied to VOUT. Adjustable version only.  
(8) Time from VEN = 1.2V to VOUT = 90% (VOUT(NOM)).  
(9) Time from VEN = 0.4V to VOUT = 10% (VOUT(NOM)).  
(10) See Shutdown in the Application Information section for more details.  
Copyright © 2007–2008, Texas Instruments Incorporated  
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TPS780 Series  
SBVS083CJANUARY 2007REVISED MAY 2008 ....................................................................................................................................................... www.ti.com  
FUNCTIONAL BLOCK DIAGRAM  
IN  
OUT  
Current  
Limit  
Thermal  
Shutdown  
EPROM  
Bandgap  
EN  
Active  
Pull-  
Down  
10kW  
(1)  
SET/FB  
V
LOGIC  
GND  
(1) Feedback pin (FB) for adjustable versions; VSET for fixed voltage versions.  
PIN CONFIGURATIONS  
TPS780DDC  
TSOT23-5  
TPS780DRV  
2mm x 2mm SON-6  
(TOP VIEW)  
(TOP VIEW)  
IN  
GND  
EN  
1
2
3
5
4
OUT  
OUT  
N/C  
1
2
3
6
5
4
IN  
Thermal  
GND  
EN  
(1)  
Pad  
VSET/FB  
VSET/FB  
(1) It is recommended that the SON package thermal pad be connected to ground.  
Table 1. TERMINAL FUNCTIONS  
TERMINAL  
DRV  
NAME  
OUT  
DDC  
5
DESCRIPTION  
Regulated output voltage pin. A small (1µF) ceramic capacitor is needed from this pin to  
ground to assure stability. See the Input and Output Capacitor Requirements in the  
Application Information section for more details.  
1
2
3
N/C  
4
Not connected.  
Feedback pin (FB) for adjustable versions; VSET for fixed voltage versions. Driving the select  
pin (VSET) below 0.4V selects preset output voltage high. Driving the VSET pin over 1.2V  
selects preset output voltage low.  
VSET/FB  
Driving the enable pin (EN) over 1.2V turns on the regulator. Driving this pin below 0.4V puts  
the regulator into shutdown mode, reducing operating current to 18nA typical.  
EN  
4
5
3
2
GND  
Ground pin.  
Input pin. A small capacitor is needed from this pin to ground to assure stability. Typical input  
capacitor = 1.0µF. Both input and output capacitor grounds should be tied back to the IC  
ground with no significant impedance between them.  
IN  
6
1
Thermal pad Thermal pad  
It is recommended that the SON package thermal pad be connected to ground.  
4
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Copyright © 2007–2008, Texas Instruments Incorporated  
TPS780 Series  
www.ti.com ....................................................................................................................................................... SBVS083CJANUARY 2007REVISED MAY 2008  
TYPICAL CHARACTERISTICS  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
LINE REGULATION  
IOUT = 5mA, VOUT = 1.22V (typ)  
TPS78001  
LINE REGULATION  
IOUT = 5mA, VVSET = 1.2V, VOUT = 2.2V (typ)  
TPS780330220  
0.3  
0.2  
1.0  
0.8  
0.6  
TJ = +25°C  
TJ = -40°C  
TJ = +85°C  
0.4  
0.1  
TJ = +25°C  
0.2  
TJ = +125°C  
0
0
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
TJ = +125°C  
-0.1  
-0.2  
-0.3  
TJ = +85°C  
TJ = -40°C  
2.2  
2.7  
3.8  
2.7  
3.2  
3.7  
VIN (V)  
Figure 1.  
4.2  
4.7  
5.2  
5.7  
5.7  
5.6  
2.7  
3.8  
0
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
VIN (V)  
Figure 2.  
LINE REGULATION  
LINE REGULATION  
IOUT = 150mA, VVSET = 1.2V, VOUT = 2.2V (typ)  
TPS780330220  
IOUT = 5mA, VVSET = 0.4V, VOUT = 3.3V (typ)  
TPS780330220  
3
2
1.0  
0.8  
TJ = -40°C  
0.6  
TJ = +25°C  
0.4  
1
0.2  
TJ = +25°C  
TJ = -40°C  
0
0
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
TJ = +85°C  
-1  
-2  
-3  
TJ = +85°C  
3.2  
3.7  
4.2  
4.7  
5.2  
4.0  
4.2  
4.4  
4.6  
4.8  
5.0  
5.2 5.4  
5.6  
VIN (V)  
VIN (V)  
Figure 3.  
Figure 4.  
LINE REGULATION  
LOAD REGULATION  
VOUT = 3.3V  
IOUT = 150mA, VVSET = 0.4V, VOUT = 3.3V (typ)  
TPS780330220  
TPS78001  
3
2
1.5  
1.0  
0.5  
0
TJ = +125°C  
1
TJ = -40°C  
TJ = +25°C  
0
-1  
-2  
-3  
-0.5  
-1.0  
TJ = +85°C  
TJ = +25°C  
TJ = +85°C  
TJ = -40°C  
4.0  
4.2  
4.4  
4.6  
4.8  
5.0  
5.2 5.4  
25  
50  
75  
100  
125  
150  
VIN (V)  
IOUT (mA)  
Figure 5.  
Figure 6.  
Copyright © 2007–2008, Texas Instruments Incorporated  
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5
TPS780 Series  
SBVS083CJANUARY 2007REVISED MAY 2008 ....................................................................................................................................................... www.ti.com  
TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
LOAD REGULATION  
VVSET = 1.2V, VIN = 2.7V, VOUT = 2.2V  
TPS780330220  
LOAD REGULATION  
VVSET = 0.4V, VIN = 3.8V, VOUT = 3.3V  
TPS780330220  
3.0  
2.5  
3
2
2.0  
TJ = -40°C  
1.5  
1
1.0  
0.5  
0
TJ = -40°C  
0
-1  
-2  
-3  
-0.5  
-1.0  
-1.5  
-2.0  
TJ = +25°C  
TJ = +85°C  
TJ = +25°C  
TJ = +85°C  
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
IOUT (mA)  
IOUT (mA)  
Figure 7.  
Figure 8.  
DROPOUT VOLTAGE vs OUTPUT CURRENT  
VOUT = 3.3V (typ), VIN = 0.95 × VOUT (typ)  
TPS78001  
DROPOUT VOLTAGE vs OUTPUT CURRENT  
VVSET = 0.4V, VOUT = 3.3V (typ), VIN = 0.95 × VOUT (typ)  
TPS780330220  
200  
180  
160  
140  
120  
100  
80  
250  
TJ = +125°C  
TJ = +85°C  
200  
150  
100  
50  
TJ = +85°C  
TJ = +125°C  
60  
40  
TJ = -40°C  
TJ = +25°C  
TJ = -40°C  
TJ = +25°C  
20  
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
IOUT (mA)  
IOUT (mA)  
Figure 9.  
Figure 10.  
DROPOUT VOLTAGE vs TEMPERATURE  
VOUT = 3.3V (typ), VIN = 0.95 × VOUT (typ)  
TPS78001  
DROPOUT VOLTAGE vs TEMPERATURE  
VVSET = 0.4V, VOUT = 3.3V (typ), VIN = 0.95 × VOUT (typ)  
TPS780330220  
250  
200  
150  
100  
50  
250  
200  
150  
100  
50  
150mA  
100mA  
150mA  
100mA  
50mA  
10mA  
50mA  
10mA  
0
0
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
Temperature (°C)  
Figure 11.  
Figure 12.  
6
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Copyright © 2007–2008, Texas Instruments Incorporated  
TPS780 Series  
www.ti.com ....................................................................................................................................................... SBVS083CJANUARY 2007REVISED MAY 2008  
TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 50mA, VOUT = 1.22V  
TPS78001  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 150mA, VOUT = 1.22V  
TPS78001  
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
TJ = +125°C  
TJ = +85°C  
TJ = +125°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = +25°C  
TJ = -40°C  
2.2  
2.7  
3.2  
3.7  
VIN (V)  
Figure 13.  
4.2  
4.7  
5.2  
5.7  
2.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
VIN (V)  
Figure 14.  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 0mA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 1mA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
TJ = +125°C  
TJ = +125°C  
TJ = +85°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = +25°C  
TJ = -40°C  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
VIN (V)  
VIN (V)  
Figure 15.  
Figure 16.  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 50mA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 150mA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
6
5
4
3
2
1
0
12  
11  
10  
9
TJ = +125°C  
TJ = +85°C  
TJ = +125°C  
8
TJ = +85°C  
7
6
5
4
TJ = +25°C  
3
TJ = -40°C  
TJ = +25°C  
2
TJ = -40°C  
1
0
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
VIN (V)  
VIN (V)  
Figure 17.  
Figure 18.  
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 0mA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 1mA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
1000  
900  
800  
700  
600  
500  
400  
300  
200  
100  
0
TJ = +125°C  
TJ = +125°C  
TJ = +85°C  
TJ = +25°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = -40°C  
3.8  
4.0  
4.2  
4.4  
4.6  
VIN (V)  
Figure 19.  
4.8  
5.0  
5.2 5.4  
5.6  
3.8  
4.0  
4.2  
4.4  
4.6  
VIN (V)  
Figure 20.  
4.8  
5.0  
5.2 5.4  
5.6  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 50mA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
GROUND PIN CURRENT vs INPUT VOLTAGE  
IOUT = 150mA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
6
5
4
3
2
1
0
9
8
7
6
5
4
3
2
1
0
TJ = +125°C  
TJ = +85°C  
TJ = +125°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = +25°C  
TJ = -40°C  
3.8  
4.0  
4.2  
4.4  
4.6  
4.8  
5.0  
5.2 5.4  
5.6  
3.8  
4.0  
4.2  
4.4  
4.6  
VIN (V)  
Figure 22.  
4.8  
5.0  
5.2 5.4  
5.6  
VIN (V)  
Figure 21.  
GROUND PIN CURRENT vs OUTPUT CURRENT  
VVSET = 1.2V, VIN = 5.5V, VOUT = 2.2V  
TPS780330220  
GROUND PIN CURRENT vs OUTPUT CURRENT  
VVSET = 0.4V, VIN = 5.5V, VOUT = 3.3V  
TPS780330220  
10  
8
10  
8
TJ = +125°C  
TJ = +85°C  
TJ = +125°C  
TJ = +85°C  
6
6
4
4
2
2
TJ = +25°C  
TJ = -40°C  
TJ = -40°C  
TJ = +25°C  
0
0
0
25  
50  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
IOUT (mA)  
IOUT (mA)  
Figure 23.  
Figure 24.  
8
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
SHUTDOWN CURRENT vs INPUT VOLTAGE  
IOUT = 0mA, VVSET = 0.4V  
TPS78001  
CURRENT LIMIT vs INPUT VOLTAGE  
VOUT = 90% VOUT (typ), VOUT = 1.22V (typ)  
TPS78001  
60  
50  
40  
30  
20  
10  
0
280  
270  
260  
250  
240  
230  
220  
210  
200  
TJ = -40°C  
TJ = +25°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = +85°C  
2.2  
2.7  
3.2  
3.7  
VIN (V)  
Figure 25.  
4.2  
4.7  
5.2  
5.7  
2.2  
2.7  
3.2  
3.7  
VIN (V)  
Figure 26.  
4.2  
4.7  
5.2  
5.7  
CURRENT LIMIT vs INPUT VOLTAGE  
VVSET = 1.2V, VOUT = 95% VOUT (typ), VOUT = 2.2V (typ)  
TPS780330220  
CURRENT LIMIT vs INPUT VOLTAGE  
VVSET = 0.4V, VOUT = 95% VOUT (typ), VOUT = 3.3V (typ)  
TPS780330220  
300  
300  
290  
280  
270  
260  
250  
240  
230  
220  
210  
200  
290  
280  
270  
260  
250  
240  
230  
220  
210  
200  
TJ = -40°C  
TJ = -40°C  
TJ = +25°C  
TJ = +85°C  
TJ = +125°C  
TJ = +25°C  
TJ = +85°C  
TJ = +125°C  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
3.8  
4.0  
4.2  
4.4  
4.6  
VIN (V)  
Figure 28.  
4.8  
5.0  
5.2 5.4  
5.6  
VIN (V)  
Figure 27.  
FEEDBACK PIN CURRENT vs TEMPERATURE  
IOUT = 0mA, VOUT = 1.22V  
TPS78001  
VSET PIN CURRENT vs INPUT VOLTAGE  
IOUT = 100µA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
1.0  
0.8  
0.6  
0.4  
0.2  
0
5
4
3
2
1
0
TJ = +25°C  
TJ = -40°C  
TJ = +85°C  
VIN max  
VIN min  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
VIN (V)  
Temperature (°C)  
Figure 29.  
Figure 30.  
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
VSET PIN CURRENT vs INPUT VOLTAGE  
IOUT = 100µA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
ENABLE PIN CURRENT vs INPUT VOLTAGE  
IOUT = 1mA, VOUT = 1.22V  
TPS78001  
2.5  
2.0  
1.5  
1.0  
0.5  
0
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
TJ = +125°C  
TJ = -40°C  
TJ = +85°C  
TJ = +25°C  
TJ = -40°C  
TJ = +85°C  
TJ = +25°C  
-0.5  
3.8  
4.0  
4.2  
4.4  
4.6  
VIN (V)  
Figure 31.  
4.8  
5.0  
5.2 5.4  
5.6  
2.2  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
VIN (V)  
Figure 32.  
ENABLE PIN CURRENT vs INPUT VOLTAGE  
IOUT = 100µA, VVSET = 1.2V, VOUT = 2.2V  
TPS780330220  
ENABLE PIN CURRENT vs INPUT VOLTAGE  
IOUT = 100µA, VVSET = 0.4V, VOUT = 3.3V  
TPS780330220  
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
TJ = +85°C  
TJ = -40°C  
TJ = +25°C  
TJ = -40°C  
TJ = +85°C  
TJ = +25°C  
2.7  
3.2  
3.7  
4.2  
4.7  
5.2  
5.7  
3.8  
4.0  
4.2 4.4  
4.6  
4.8  
5.0  
5.2  
5.4  
5.6  
VIN (V)  
VIN (V)  
Figure 33.  
Figure 34.  
ENABLE PIN HYSTERESIS vs TEMPERATURE  
IOUT = 1mA, TPS78001  
ENABLE PIN HYSTERESIS vs TEMPERATURE  
IOUT = 1mA, TPS780330220  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
VEN On  
VEN On  
VEN Off  
VEN Off  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
Temperature (°C)  
Figure 35.  
Figure 36.  
10  
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
%ΔVOUT vs TEMPERATURE  
IOUT = 1mA, VIN = 3.8V, VOUT = 3.3V  
TPS78001  
%ΔVOUT vs TEMPERATURE  
VVSET = 1.2V, VIN = 2.7V, VOUT = 2.2V (typ)  
TPS780330220  
0.4  
0.3  
1
0
0.1mA  
0.2  
0.1  
5mA  
0
-0.1  
-0.2  
-0.3  
-0.4  
-1  
-2  
150mA  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
Temperature (°C)  
Temperature (°C)  
Figure 37.  
Figure 38.  
%ΔVOUT vs TEMPERATURE  
VVSET = 0.4V, VIN = 3.8V, VOUT = 3.3V (typ)  
TPS780330220  
OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY  
CIN = 1µF, COUT = 2.2µF, VVSET = 1.2V, VIN = 2.7V  
TPS780330220  
3
2
100  
10  
1
150mA  
1
109mVRMS  
0.1mA  
5mA  
0
0.1  
-1  
-2  
-3  
50mA  
150mA  
109mVRMS  
0.01  
0.001  
1mA  
108mVRMS  
-40 -25 -10  
5
20 35 50 65 80 95 110 125  
10  
100  
1k  
10k  
100k  
Temperature (°C)  
Frequency (Hz)  
Figure 39.  
Figure 40.  
RIPPLE REJECTION vs FREQUENCY  
VIN = 2.7V, VOUT = 1.2V, COUT = 2.2µF  
TPS78001  
INPUT VOLTAGE RAMP vs OUTPUT VOLTAGE  
TPS780330220  
80  
70  
60  
50  
40  
30  
20  
10  
0
VIN = 0.0V to 5.0V  
VOUT = 3.3V  
VIN  
1mA  
VOUT  
IOUT = 150mA  
COUT = 10mF  
Enable  
50mA  
Load Current  
0V  
150mA  
Time (20ms/div)  
10  
100  
1k  
10k  
100k  
1M  
10M  
Frequency (Hz)  
Figure 41.  
Figure 42.  
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
OUTPUT VOLTAGE vs ENABLE (SLOW RAMP)  
TPS780330220  
INPUT VOLTAGE vs DELAY TO OUTPUT  
TPS780330220  
VIN  
VSET  
Enable  
VOUT  
Load Current  
VIN  
Load Current  
VIN = 5.5V  
VOUT = 3.3V  
IOUT = 150mA  
COUT = 10mF  
VIN = 0.0V to 5.5V  
VOUT = 2.2V  
VOUT  
0A  
0V  
IOUT = 100mA  
0V  
COUT = 10mF  
Time (20ms/div)  
Time (1ms/div)  
Figure 43.  
Figure 44.  
LINE TRANSIENT RESPONSE  
TPS780330220  
LINE TRANSIENT RESPONSE  
TPS780330220  
VIN  
VIN  
1V/div  
1V/div  
VOUT  
VOUT  
VIN = 4.0V to 4.5V  
VIN = 4.0V to 4.5V  
VOUT = 2.2V  
VOUT = 3.3V  
IOUT = 150mA  
Slew Rate = 1V/ms  
IOUT = 150mA  
Slew Rate = 1V/ms  
Time (200ms/div)  
Time (200ms/div)  
Figure 45.  
Figure 46.  
LOAD TRANSIENT RESPONSE  
TPS780330220  
LOAD TRANSIENT RESPONSE  
TPS780330220  
Enable  
Enable  
VIN  
VOUT  
VIN  
VOUT  
VIN = 5.5V  
VOUT = 3.3V  
IOUT = 0mA to 10mA  
Load  
Load  
COUT = 10mF  
Current  
VIN = 5.5V  
Current  
VOUT = 3.3V  
IOUT = 0mA to 60mA  
COUT = 10mF  
0A  
0A  
Time (5ms/div)  
Time (2ms/div)  
Figure 47.  
Figure 48.  
12  
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TYPICAL CHARACTERISTICS (continued)  
Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater;  
IOUT = 100µA, VEN = VVSET = VIN, COUT = 1µF, and CIN = 1µF, unless otherwise noted.  
ENABLE PIN vs OUTPUT VOLTAGE RESPONSE  
AND OUTPUT CURRENT  
TPS780330220  
ENABLE PIN vs OUTPUT VOLTAGE DELAY  
TPS780330220  
Enable  
VIN = 5.5V  
VOUT = 3.3V  
Enable  
VIN  
VOUT  
IOUT = 150mA  
VOUT  
VIN  
COUT = 10mF  
Load Current  
Load  
Current  
VIN = 5.50V  
VOUT = 3.3V  
IOUT = 150mA  
COUT = 10mF  
0V  
0V  
Time (1ms/div)  
Time (1ms/div)  
Figure 49.  
Figure 50.  
VSET PIN TOGGLE  
TPS780330220  
VSET PIN TOGGLE  
TPS780330220  
VOUT  
VOUT  
1V/div  
VSET  
VSET  
1V/div  
VIN = 5.0V  
Enable = VIN  
VIN = 5.0V  
IOUT = 150mA  
IOUT = 150mA  
VOUT Transitioning from 2.2V to 3.3V  
VOUT Transitioning from 3.3V to 2.2V  
Time (500ms/div)  
Time (500ms/div)  
Figure 51.  
Figure 52.  
VSET PIN TOGGLE (SLOW RAMP)  
TPS780330220  
VIN  
VSET  
VOUT  
100mA  
VIN = 5.5V  
VOUT = 3.3V  
IOUT = 150mA  
50mA  
0A  
Load Current  
to 100mA  
COUT = 10mF  
Time (50ms/div)  
Figure 53.  
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APPLICATION INFORMATION  
Programming the TPS78001 Adjustable LDO  
APPLICATION EXAMPLES  
Regulator  
The TPS780 series of LDOs typically take less than  
The output voltage of the TPS78001 adjustable  
800µs to transition from a lower voltage of 2.2V to a  
regulator is programmed using an external resistor  
higher voltage of 3.3V under an output load of  
divider as shown in Figure 55. The output voltage  
150mA; see Figure 51. Additionally, the TPS780  
operating range is 1.2V to 5.1V, and is calculated  
series contain active pull-down circuitry that  
using Equation 1:  
automatically pulls charge out of the voltage capacitor  
R1  
to transition the output voltage from the higher  
VOUT = VFB ´ 1 +  
(
)
R2  
voltage to the lower voltage, even with no load  
(1)  
connected.  
Output  
voltage  
overshoots  
and  
Where:  
undershoots are minimal under this load condition.  
The TPS780 series typically take less than 800µs to  
transition from VSET low (3.3V to 2.2V), or VSET high  
(2.2V to 3.3V); see Figure 51 and Figure 52. Both  
output states of the TPS780 series are  
factory-programmable between 1.5V to 4.2V. Note  
that during startup or steady-state conditions, it is  
important that the EN pin and VSET pin voltages never  
exceed VIN + 0.3V.  
VFB = 1.216V typ (the internal reference voltage)  
Resistors R1 and R2 should be chosen for  
approximately 1.2µA divider current. Lower value  
resistors can be used for improved noise  
performance, but the solution consumes more power.  
Higher resistor values should be avoided because  
leakage current into/out of FB across R1/R2 creates  
an offset voltage that artificially increases/decreases  
the feedback voltage and thus erroneously  
4.2V to 5.5V  
2.2V to 3.3V  
decreases/increases VOUT  
common output voltages and resistor values. The  
recommended design procedure is to choose R2  
. Table 2 lists several  
VIN  
VOUT  
IN  
OUT  
1mF  
1mF  
=
TPS780  
1Mto set the divider current at 1.2µA, and then  
calculate R1 using Equation 2:  
On  
Off  
EN  
VOUT  
R1 =  
- 1 ´ R2  
)
(
VFB  
VSET High = VOUT(LOW)  
VSET Low = VOUT(HIGH)  
(2)  
VSET  
GND  
VIN  
VOUT  
1mF  
IN  
OUT  
1mF  
Figure 54. Typical Application Circuit  
R1  
TPS78001  
FB  
EN  
The TPS780 is also used effectively in dynamic  
voltage scaling (DVS) applications. DVS applications  
are required to dynamically switch between a high  
operational voltage to a low standby voltage in order  
to reduce power consumption. Modern multimillion  
gate microprocessors fabricated with the latest  
sub-micron processes save power by transitioning to  
a lower voltage to reduce leakage currents while  
maintaining content. This architecture enables the  
microprocessor to transition quickly into an  
operational state (wake up) without requiring a reload  
of the states from external memory, or a reboot.  
R2  
GND  
R1  
R2  
VOUT = VFB ´ (1 +  
)
Figure 55. TPS78001 Adjustable LDO Regulator  
Programming  
Table 2. Output Voltage Programming Guide  
OUTPUT VOLTAGE  
R1  
R2  
1.8V  
2.8V  
5.0V  
0.499MΩ  
1.33MΩ  
3.16MΩ  
1MΩ  
1MΩ  
1MΩ  
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Powering the MSP430 Microcontroller  
3.0V  
VIN  
VOUT  
VCC  
Several versions of the TPS780 are ideal for  
powering the MSP430 microcontroller. Table 3 shows  
potential applications of some voltage versions.  
1mF  
1mF  
LDO  
GND  
MSP430  
I/O  
VSS  
Table 3. Typical MSP430 Applications  
VOUT(HIGH)  
(TYP)  
VOUT(LOW)  
(TYP)  
DEVICE  
APPLICATION  
VOUT, MIN > 1.800V  
required by many  
MSP430s. Allows  
lowest power  
VCC = 3.0V  
5mA  
TPS780360200  
3.6V  
2.0V  
consumption  
operation.  
Active  
Mode  
VOUT, MIN > 2.200V  
required by some  
MSP430s FLASH  
operation.  
1.6mA IQ  
TPS780360220  
TPS780360300  
3.6V  
3.6V  
2.2V  
3.0V  
LPM3/Sleep Mode  
VOUT, MIN > 2.700V  
required by some  
MSP430s FLASH  
operation.  
Figure 56. Typical LDO without DVS  
VOUT, MIN < 3.600V  
required by some  
MSP430s. Allows  
highest speed  
TPS780360220  
3.6V  
2.2V  
2.2V to 3.6V  
VIN  
VOUT  
VCC  
operation.  
1mF  
1mF  
TPS780  
VSET  
MSP430  
The TPS780 family offers many output voltage  
versions to allow designers to optimize the supply  
voltage for the processing speed required of the  
MSP430. This flexible architecture minimizes the  
supply current consumed by the particular MSP430  
application. The MSP430 total system power can be  
reduced by substituting the 500nA IQ TPS780 series  
LDO in place of an existing ultra-low IQ LDO (typical  
best case = 1µA). Additionally, DVS allows for  
increasing the clock speed in active mode (MSP430  
VCC = 3.6V). The 3.6V VCC reduces the MSP430 time  
in active mode. In low-power mode, MSP430 system  
power can be further reduced by lowering the  
MSP430 VCC to 2.2V in sleep mode.  
I/O  
GND  
VSS  
VCC = 3.6V  
5mA  
VCC = 2.2V  
Active  
Mode  
700nA IQ  
Current  
LPM3/Sleep Mode  
Key features of the TPS780 series are an ultralow  
quiescent current (500nA), DVS, and miniaturized  
packaging. The TPS780 family are available in  
SON-6 and TSOT-23 packages. Figure 56 shows a  
typical MSP430 circuit powered by an LDO without  
DVS. Figure 57 is an MSP430 circuit using a TPS780  
LDO that incorporates an integrated DVS, thus  
simplifying the circuit design. In a circuit without DVS,  
as Figure 56 illustrates, VCC is always at 3.0V. When  
the MSP430 goes into sleep mode, VCC remains at  
3.0V; if DVS is applied, VCC could be reduced in  
sleep mode. In Figure 57, the TPS780 LDO with  
integrated DVS maintains 3.6V VCC until a logic high  
signal from the MSP430 forces VOUT to level shift  
VOUT from 3.6V down to 2.2V, thus reducing power in  
sleep mode.  
Figure 57. TPS780 with Integrated DVS  
The other benefit of DVS is that it allows a higher VCC  
voltage on the MSP430, increasing the clock speed  
and reducing the active mode dwell time.  
Copyright © 2007–2008, Texas Instruments Incorporated  
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15  
 
 
 
TPS780 Series  
SBVS083CJANUARY 2007REVISED MAY 2008 ....................................................................................................................................................... www.ti.com  
The total system power savings is outlined in Table 4,  
Table 5, and Table 6. In Table 4, the MSP430 power  
savings are calculated for various MSP430 devices  
using a TPS780 series with integrated DVS versus a  
standard ultralow IQ LDO without DVS. In Table 5, the  
TPS780 series quiescent power is calculated for a VIN  
of 4.2V, with the same VIN used for the ultralow IQ  
LDO. Quiescent power dissipation in an LDO is the  
VIN voltage times the ground current, because zero  
load is applied. After the dissipation power is  
calculated for the individual LDOs in Table 5, simple  
subtraction outputs the LDO power savings using the  
TPS780 series. Table 6 calculates the total system  
power savings using a TPS780 series LDO in place  
of an ultralow IQ 1.2µA LDO in an MSP430F1121  
application. There are many different versions of the  
MSP430. Actual power savings will vary depending  
on the selected device.  
capacitor may be necessary if large, fast rise-time  
load transients are anticipated, or if the device is not  
located near the power source. If source impedance  
is not sufficiently low, a 0.1µF input capacitor may be  
necessary to ensure stability.  
The TPS780 is designed to be stable with standard  
ceramic capacitors with values of 1.0µF or larger at  
the output. X5R- and X7R-type capacitors are best  
because they have minimal variation in value and  
ESR over temperature. Maximum ESR should be less  
than 1.0. With tolerance and dc bias effects, the  
minimum capacitance required to ensure stability is  
1µF.  
BOARD LAYOUT RECOMMENDATIONS TO  
IMPROVE PSRR AND NOISE PERFORMANCE  
To improve ac performance (such as PSRR, output  
noise, and transient response), it is recommended  
that the printed circuit board (PCB) be designed with  
separate ground planes for VIN and VOUT, with each  
ground plane connected only at the GND pin of the  
device. In addition, the ground connection for the  
output capacitor should connect directly to the GND  
pin of the device. High ESR capacitors may degrade  
PSRR.  
INPUT AND OUTPUT CAPACITOR  
REQUIREMENTS  
Although an input capacitor is not required for  
stability, it is good analog design practice to connect  
a 0.1µF to 1.0µF low equivalent series resistance  
(ESR) capacitor across the input supply near the  
regulator. This capacitor counteracts reactive input  
sources and improves transient response, noise  
rejection, and ripple rejection.  
A
higher-value  
Table 4. DVS MSP430 Power Savings with the TPS780 Series on selected MSP430 Devices  
LPM3 AT VCC = 3V, LPM3 AT VCC = 3.0V  
LPM3 AT VCC  
2.2V, IQ  
=
LPM3 AT VCC = 2.2V  
IQ  
× IQ  
× IQ  
µW SAVINGS  
DEVICE  
(µA)  
(µW)  
(µA)  
(µW)  
USING ONLY DVS  
MSP430F1121  
MSP430F149  
MSP430F2131  
MSP430F249  
MSP430F413  
MSP430F449  
1.6  
1.6  
0.9  
1.0  
0.9  
1.6  
4.8  
4.8  
2.7  
3.0  
2.7  
4.8  
0.7  
0.9  
0.7  
0.9  
0.7  
1.1  
1.5  
2.0  
1.5  
2.0  
1.5  
2.4  
3.3  
2.8  
1.2  
1.0  
1.2  
2.4  
Table 5. Typical Ultralow IQ LDO Quiescent Power Dissipation Versus the TPS780 Series  
MSP430 SYSTEM  
TYPICAL ULTRALOW IQ  
TYPICAL ULTRALOW IQ LDO AT +25°C AMBIENT  
TPS780 SERIES  
TYPICAL IQ AT +25°C  
AMBIENT  
TPS780 SERIES AT  
+25C AMBIENT, POWER  
DISSIPATION  
POWER SAVINGS  
USING THE TPS780  
SERIES  
LDO AT +25°C AMBIENT  
POWER DISSIPATION  
QUIESCENT POWER  
DISSIPATION SAVINGS  
(µW)  
IQ  
(µA)  
I
Q × VIN = 4.2V  
TPS780 IQ  
I
Q × VIN = 4.2V  
(µW)  
(µA)  
(µW)  
1.20  
5.04  
0.42  
1.76  
3.28  
Table 6. Total System Power Dissipation  
TOTAL SYSTEM POWER IN  
SLEEP MODE 3  
LDO DISSIPATION  
5.04µW  
MSP430 DISSIPATION  
4.8µW(1)  
Typical 1.2µA LDO, no DVS  
9.84µW  
3.26µW  
TPS780 Series with DVS  
1.76µW  
1.5µW(1)  
(1) Value taken from Table 4 and relative to the MSP430F1121.  
16 Submit Documentation Feedback  
Copyright © 2007–2008, Texas Instruments Incorporated  
 
 
 
TPS780 Series  
www.ti.com ....................................................................................................................................................... SBVS083CJANUARY 2007REVISED MAY 2008  
INTERNAL CURRENT LIMIT  
4.2V to 5.5V  
2.2V  
VIN  
VOUT  
The TPS780 series are internally current-limited to  
protect the regulator during fault conditions. During  
current limit, the output sources a fixed amount of  
current that is largely independent of output voltage.  
For reliable operation, the device should not be  
operated in a current limit state for extended periods  
of time.  
IN  
OUT  
1mF  
1mF  
TPS780  
EN  
The PMOS pass element in the TPS780 series has a  
built-in body diode that conducts current when the  
voltage at OUT exceeds the voltage at IN. This  
current is not limited, so if extended reverse voltage  
operation is anticipated, external limiting to 5% of  
rated output current may be appropriate.  
VSET  
GND  
Figure 59. Circuit to Tie Both EN and VSET High  
DROPOUT VOLTAGE  
SHUTDOWN  
The TPS780 series use a PMOS pass transistor to  
achieve low dropout. When (VIN – VOUT) is less than  
the dropout voltage (VDO), the PMOS pass device is  
the linear region of operation and the input-to-output  
resistance is the RDS(ON) of the PMOS pass element.  
VDO approximately scales with output current  
because the PMOS device behaves like a resistor in  
dropout. As with any linear regulator, PSRR and  
The enable pin (EN) is active high and is compatible  
with standard and low-voltage CMOS levels. When  
shutdown capability is not required, EN should be  
connected to the IN pin, as shown in Figure 58.  
Figure 59 shows both EN and VSET connected to IN.  
The TPS780 series, with internal active output  
pull-down circuitry, discharges the output to within 5%  
VOUT with a time (t) shown in Equation 3:  
transient response are degraded as (VIN – VOUT  
)
approaches dropout. This effect is shown in the  
Typical Characteristics section. Refer to application  
report SLVA207, Understanding LDO Dropout,  
available for download from www.ti.com.  
10kW ´ RL  
´ COUT  
t = 3  
10kW + RL  
(3)  
Where:  
RL= output load resistance  
COUT = output capacitance  
TRANSIENT RESPONSE  
As with any regulator, increasing the size of the  
output capacitor reduces over/undershoot magnitude  
but increases duration of the transient response. For  
more information, see Figure 48.  
4.2V to 5.5V  
2.2V to 3.3V  
VIN  
VOUT  
IN  
OUT  
1mF  
1mF  
TPS780  
ACTIVE VOUT PULL-DOWN  
EN  
In the TPS780 series, the active pull-down discharges  
VOUT when the device is off. However, the input  
voltage must be greater than 2.2V for the active  
pull-down to work.  
VSET High = VOUT(LOW)  
VSET Low = VOUT(HIGH)  
VSET  
GND  
MINIMUM LOAD  
The TPS780 series are stable with no output load.  
Traditional PMOS LDO regulators suffer from lower  
loop gain at very light output loads. The TPS780  
series employ an innovative, low-current circuit under  
very light or no-load conditions, resulting in improved  
output voltage regulation performance down to zero  
output current. See Figure 47 for the load transient  
response.  
Figure 58. Circuit Showing EN Tied High when  
Shutdown Capability is Not Required  
Copyright © 2007–2008, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
 
 
 
TPS780 Series  
SBVS083CJANUARY 2007REVISED MAY 2008 ....................................................................................................................................................... www.ti.com  
THERMAL INFORMATION  
THERMAL PROTECTION  
POWER DISSIPATION  
Thermal protection disables the output when the  
junction temperature rises to approximately +160°C,  
allowing the device to cool. Once the junction  
temperature cools to approximately +140°C, the  
output circuitry is enabled. Depending on power  
dissipation, thermal resistance, and ambient  
temperature, the thermal protection circuit may cycle  
on and off again. This cycling limits the dissipation of  
the regulator, protecting it from damage as a result of  
overheating.  
The ability to remove heat from the die is different for  
each  
package  
type,  
presenting  
different  
considerations in the PCB layout. The PCB area  
around the device that is free of other components  
moves the heat from the device to the ambient air.  
Performance data for JEDEC low- and high-K boards  
are given in the Dissipation Ratings table. Using  
heavier copper increases the effectiveness in  
removing heat from the device. The addition of plated  
through-holes to heat-dissipating layers also  
improves the heatsink effectiveness. Power  
dissipation depends on input voltage and load  
conditions. Power dissipation (PD) is equal to the  
product of the output current times the voltage drop  
across the output pass element (VIN to VOUT), as  
shown in Equation 4:  
Any tendency to activate the thermal protection circuit  
indicates excessive power dissipation or an  
inadequate heatsink. For reliable operation, junction  
temperature should be limited to +125°C maximum.  
To estimate the margin of safety in a complete design  
(including  
heatsink),  
increase  
the  
ambient  
PD = (VIN - VOUT) ´ IOUT  
temperature until the thermal protection is triggered;  
use worst-case loads and signal conditions. For good  
reliability, thermal protection should trigger at least  
+35°C above the maximum expected ambient  
condition of your particular application. This  
(4)  
PACKAGE MOUNTING  
Solder pad footprint recommendations for the  
TPS780 series are available from the Texas  
Instruments web site at www.ti.com through the  
TPS780 series product folders.  
configuration produces  
a
worst-case junction  
temperature of +125°C at the highest expected  
ambient temperature and worst-case load.  
The internal protection circuitry of the TPS780 series  
has been designed to protect against overload  
conditions. However, it is not intended to replace  
proper heatsinking. Continuously running the TPS780  
series into thermal shutdown degrades device  
reliability.  
18  
Submit Documentation Feedback  
Copyright © 2007–2008, Texas Instruments Incorporated  
 
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Aug-2008  
PACKAGING INFORMATION  
Orderable Device  
TPS78001DDCR  
TPS78001DDCRG4  
TPS78001DDCT  
TPS78001DDCTG4  
TPS78001DRVR  
TPS78001DRVRG4  
TPS78001DRVT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOT  
DDC  
5
5
5
5
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
SOT  
SOT  
SOT  
SON  
SON  
SON  
SON  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS78001DRVTG4  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TPS780270200DDCR  
TPS780270200DDCT  
TPS780330220DDCR  
PREVIEW  
PREVIEW  
ACTIVE  
SOT  
SOT  
SOT  
DDC  
DDC  
DDC  
5
5
5
3000  
250  
TBD  
TBD  
Call TI  
Call TI  
Call TI  
Call TI  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
TPS780330220DDCRG4  
TPS780330220DDCT  
TPS780330220DDCTG4  
TPS780330220DRVR  
TPS780330220DRVRG4  
TPS780330220DRVT  
TPS780330220DRVTG4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOT  
SOT  
SOT  
SON  
SON  
SON  
SON  
DDC  
DDC  
DDC  
DRV  
DRV  
DRV  
DRV  
5
5
5
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
5-Aug-2008  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Jul-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TPS78001DDCR  
TPS78001DDCT  
SOT  
SOT  
SON  
SON  
SOT  
SOT  
SON  
SON  
DDC  
DDC  
DRV  
DRV  
DDC  
DDC  
DRV  
DRV  
5
5
6
6
5
5
6
6
3000  
250  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
179.0  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
8.4  
3.2  
3.2  
2.2  
2.2  
3.2  
3.2  
2.2  
2.2  
3.2  
3.2  
2.2  
2.2  
3.2  
3.2  
2.2  
2.2  
1.4  
1.4  
1.2  
1.2  
1.4  
1.4  
1.2  
1.2  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
4.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
8.0  
Q3  
Q3  
Q2  
Q2  
Q3  
Q3  
Q2  
Q2  
TPS78001DRVR  
3000  
250  
TPS78001DRVT  
TPS780330220DDCR  
TPS780330220DDCT  
TPS780330220DRVR  
TPS780330220DRVT  
3000  
250  
3000  
250  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
29-Jul-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TPS78001DDCR  
TPS78001DDCT  
SOT  
SOT  
SON  
SON  
SOT  
SOT  
SON  
SON  
DDC  
DDC  
DRV  
DRV  
DDC  
DDC  
DRV  
DRV  
5
5
6
6
5
5
6
6
3000  
250  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
195.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
200.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
45.0  
TPS78001DRVR  
3000  
250  
TPS78001DRVT  
TPS780330220DDCR  
TPS780330220DDCT  
TPS780330220DRVR  
TPS780330220DRVT  
3000  
250  
3000  
250  
Pack Materials-Page 2  
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