TPS79328DBVR [TI]
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NANOSTAR? WAFER CHIP SCALE AND SOT23; 超低噪声,高PSRR ,快速射频200mA的低压差线性稳压器NANOSTAR ?晶圆级和SOT23型号: | TPS79328DBVR |
厂家: | TEXAS INSTRUMENTS |
描述: | ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR REGULATORS IN NANOSTAR? WAFER CHIP SCALE AND SOT23 |
文件: | 总18页 (文件大小:446K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS79301, TPS79318
D
B
V
6
Y
E
Q
D BV 5
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
ULTRALOW-NOISE, HIGH PSRR, FAST RF 200-mA LOW-DROPOUT LINEAR
REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23
FEATURES
DESCRIPTION
•
200-mA RF Low-Dropout Regulator
With Enable
The TPS793xx family of low-dropout (LDO)
low-power linear voltage regulators features high
power-supply rejection ratio (PSRR), ultralow-noise,
fast start-up, and excellent line and load transient
responses in NanoStar wafer chip scale and SOT23
packages. NanoStar packaging gives an ultrasmall
footprint as well as an ultralow profile and package
weight, making it ideal for portable applications such
as handsets and PDAs. Each device in the family is
stable, with a small 2.2-µF ceramic capacitor on the
output. The TPS793xx family uses an advanced,
proprietary BiCMOS fabrication process to yield ex-
tremely low dropout voltages (e.g., 112 mV at
200 mA, TPS79330). Each device achieves fast
start-up times (approximately 50 µs with a 0.001-µF
bypass capacitor) while consuming very low quiesc-
ent current (170 µA typical). Moreover, when the
device is placed in standby mode, the supply current
is reduced to less than 1 µA. The TPS79328 exhibits
approximately 32 µVRMS of output voltage noise at
2.8-V output with a 0.1-µF bypass capacitor. Appli-
•
Available in 1.8-V, 2.5-V, 2.8-V, 2.85-V, 3-V,
3.3-V, 4.75-V, and Adjustable (1.22-V to 5.5-V)
•
•
•
•
•
•
High PSRR (70 dB at 10 kHz)
Ultralow-Noise (32 µVRMS, TPS79328)
Fast Start-Up Time (50 µs)
Stable With a 2.2-µF Ceramic Capacitor
Excellent Load/Line Transient Response
Very Low Dropout Voltage (112 mV at Full
Load, TPS79330)
•
5- and 6-Pin SOT23 (DBV) and NanoStar Wafer
Chip Scale (YEQ) Packages
APPLICATIONS
•
•
•
•
•
RF: VCOs, Receivers, ADCs
Audio
Cellular and Cordless Telephones
Bluetooth™, Wireless LAN
Handheld Organizers, PDAs
cations with analog components
that
are
noise-sensitive, such as portable RF electronics,
benefit from the high PSRR and low-noise features
as well as the fast response time.
DBV PACKAGE
(TOP VIEW)
TPS79328
TPS79328
OUT
NR
IN
1
2
5
RIPPLE REJECTION
vs
OUTPUT SPECTRAL NOISE DENSITY
vs
GND
FREQUENCY
FREQUENCY
0.30
3
4
100
90
EN
V
= 3.8 V
= 2.2 µF
IN
I
= 200 mA
OUT
Fixed Option
C
C
OUT
= 0.1 µF
0.25
0.20
80
NR
DBV PACKAGE
(TOP VIEW)
70
IN
GND
EN
OUT
FB
1
2
6
5
60
0.15
50
40
30
I
= 1 mA
OUT
I
= 10 mA
OUT
3
4
NR
0.10
0.05
I
= 200 mA
Adjustable Option
YEQ
OUT
20
10
0
V
C
C
= 3.8 V
= 10 µF
IN
PACKAGE
(TOP VIEW)
OUT
= 0.01 µF
NR
0
IN
OUT
100
1 k
10 k
100 k
10
100
1 k
10 k 100 k 1 M 10 M
C3 C1
B2
A3 A1
Frequency (Hz)
Frequency (Hz)
NR
GND
EN
Figure 1.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth Sig, Inc.
NanoStar is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains PRO-
DUCTION DATA information current as of publication date. Prod-
ucts conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily
include testing of all parameters.
Copyright © 2001–2004, Texas Instruments Incorporated
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
AVAILABLE OPTIONS(1)(2)
PRODUCT
VOLTAGE
PACKAGE
SOT23 (DBV)
SOT23 (DBV)
CSP (YEQ)
TJ
SYMBOL
PGVI
PHHI
E3
PART NUMBER
TPS79301DBVR
TPS79318DBVR
TPS79318YEQ
TPS79325DBVR
TPS79325YEQ
TPS79328DBVR
TPS79328YEQ
TPS793285DBVR
TPS793285YEQ
TPS79330DBVR
TPS79330YEQ
TPS79333DBVR
TPS793475DBVR
TPS79301
1.22 V to 5.5 V
TPS79318
TPS79325
TPS79328
TPS793285
TPS79330
1.8 V
2.5 V
2.8 V
2.85 V
3 V
SOT23 (DBV)
CSP (YEQ)
PGWI
E4
SOT23 (DBV)
CSP (YEQ)
PGXI
E2
-40°C to +125°C
SOT23 (DBV)
CSP (YEQ)
PHII
E5
SOT23 (DBV)
CSP (YEQ)
PGYI
E6
TPS79333
3.3 V
SOT23 (DBV)
SOT23 (DBV)
PHUI
PHJI
TPS793475
4.75 V
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
(2) DBVR indicates tape and reel of 3000 parts. YEQR indicates tape and reel of 3000 parts. YEQT indicates tape and reel of 250 parts.
ABSOLUTE MAXIMUM RATINGS
over operating temperature range (unless otherwise noted)(1)
UNIT
VIN range
-0.3 V to 6 V
-0.3 V to VIN + 0.3 V
-0.3 V to 6 V
VEN range
VOUT range
Peak output current
Internally limited
2 kV
ESD rating, HBM
ESD rating, CDM
500 V
Continuous total power dissipation
Junction temperature range, DBV package
Junction temperature range, YEQ package
Storage temperature range, Tstg
See Dissipation Ratings Table
-40°C to 150°C
-40°C to 125°C
-65°C to 150°C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
DISSIPATION RATINGS TABLE
T
A ≤ 25°C
TA = 70°C
POWER
RATING
TA = 85°C
POWER
RATING
DERATING FACTOR
POWER
RATING
BOARD
Low-K(1)
High-K(2)
Low-K(1)
High-K(2)
PACKAGE
DBV
RθJC
RθJA
ABOVE TA = 25°C
65°C/W
65°C/W
27°C/W
27°C/W
255°C/W
180°C/W
255°C/W
190°C/W
3.9 mW/°C
5.6 mW/°C
3.9 mW/°C
5.3 mW/°C
390 mW
560 mW
390 mW
530 mW
215 mW
310 mW
215 mW
296 mW
155 mW
225 mW
155 mW
216 mW
DBV
YEQ
YEQ
(1) The JEDEC low-K (1s) board design used to derive this data was a 3-inch x 3-inch, two layer board with 2 ounce copper traces on top
of the board.
(2) The JEDEC high-K (2s2p) board design used to derive this data was a 3-inch x 3-inch, multilayer board with 1 ounce internal power and
ground planes and 2 ounce copper traces on top and bottom of the board.
ELECTRICAL CHARACTERISTICS
over recommended operating temperature range TJ = -40 to 125°C, VEN = VIN, VIN = VOUT(nom) + 1 V(1), IOUT = 1 mA,
COUT = 10 µF, CNR = 0.01 µF (unless otherwise noted). Typical values are at 25°C.
PARAMETER
VIN Input voltage(1)
TEST CONDITIONS
MIN
TYP
MAX
5.5
UNIT
V
2.7
IOUT Continuous output current
VFB Internal reference (TPS79301)
Output voltage range (TPS79301)
0
200
mA
V
1.201
VFB
1.225
1.250
5.5 - VDO
1.836
2.55
V
TPS79318
0 µA < IOUT < 200 mA,
0 µA < IOUT < 200 mA,
0 µA < IOUT < 200 mA,
0 µA < IOUT < 200 mA,
0 µA < IOUT < 200 mA,
0 µA ≤ IOUT < 200 mA,
0 µA < IOUT < 200 mA,
VOUT + 1 V < VIN≤ 5.5 V
0 µA < IOUT < 200 mA,
IOUT = 200 mA
2.8 V < VIN < 5.5 V
3.5 V < VIN < 5.5 V
3.8 V < VIN < 5.5 V
3.85 V < VIN < 5.5 V
4 V < VIN < 5.5 V
1.764
2.45
2.744
2.793
2.94
3.234
4.655
1.8
2.5
2.8
2.85
3
V
TPS79325
TPS79328
TPS793285
TPS79330
TPS79333
V
2.856
2.907
3.06
V
Output voltage
V
V
4.3 V < VIN < 5.5 V
5.25 V < VIN < 5.5 V
3.3
4.75
0.05
5
3.366
4.845
0.12
V
TPS793475
V
(1)
Line regulation (∆VOUT%/∆VIN
)
%/V
mV
Load regulation (∆VOUT%/∆IOUT
)
TJ = 25°C
TPS79328
TPS793285
TPS79330
TPS79333
TPS793475
120
200
200
200
180
125
600
220
1
IOUT = 200 mA
120
112
102
77
Dropout voltage(2)
(VIN = VOUT(nom) - 0.1V)
IOUT = 200 mA
mV
IOUT = 200 mA
IOUT = 200 mA
Output current limit
GND pin current
Shutdown current(3)
FB pin current
VOUT = 0 V
285
mA
µA
µA
µA
0 µA < IOUT < 200 mA
170
VEN = 0 V, 2.7 V < VIN < 5.5 V
VFB = 1.8 V
0.07
1
f = 100 Hz, TJ = 25°C,
f = 100 Hz, TJ = 25°C,
f = 10 kHz, TJ = 25°C,
f = 100 kHz, TJ = 25°C,
IOUT = 10 mA
70
68
70
43
IOUT = 200 mA
IOUT = 200 mA
IOUT = 200 mA
CNR = 0.001 µF
CNR = 0.0047 µF
CNR = 0.01 µF
CNR = 0.1 µF
Power-supply ripple rejection TPS79328
Output noise voltage (TPS79328)
dB
55
36
33
32
BW = 200 Hz to 100 kHz,
IOUT = 200 mA
µVRMS
(1) Minimum VIN is 2.7 V or VOUT + VDO, whichever is greater.
(2) Dropout is not measured for the TPS79318 and TPS79325 since minimum VIN = 2.7 V.
(3) For adjustable versions, this applies only after VIN is applied; then VEN transitions high to low.
3
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
ELECTRICAL CHARACTERISTICS (continued)
over recommended operating temperature range TJ = -40 to 125°C, VEN = VIN, VIN = VOUT(nom) + 1 V, IOUT = 1 mA,
COUT = 10 µF, CNR = 0.01 µF (unless otherwise noted). Typical values are at 25°C.
PARAMETER
TEST CONDITIONS
MIN
TYP
50
MAX
UNIT
CNR = 0.001 µF
CNR = 0.0047 µF
CNR = 0.01 µF
Time, start-up (TPS79328)
RL = 14 Ω, COUT = 1 µF
70
µs
100
High level enable input voltage
Low level enable input voltage
EN pin current
2.7 V < VIN < 5.5 V
2.7 V < VIN < 5.5 V
VEN = 0
1.7
0
VIN
0.7
1
V
V
-1
µA
V
UVLO threshold
VCC rising
2.25
2.65
UVLO hysteresis
100
mV
4
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
FUNCTIONAL BLOCK DIAGRAMS
ADJUSTABLE VERSION
IN
OUT
59 k
UVLO
2.45V
Current
Sense
R1
R2
ILIM
SHUTDOWN
GND
EN
_
+
FB
UVLO
Thermal
Shutdown
External to
the Device
QuickStart
Bandgap
Reference
1.22V
250 kΩ
V
ref
IN
NR
FIXED VERSION
IN
OUT
UVLO
2.45V
Current
Sense
GND
EN
SHUTDOWN
+
ILIM
R1
R2
_
UVLO
Thermal
Shutdown
R2 = 40 kΩ
QuickStart
Bandgap
Reference
1.22V
250 kΩ
V
ref
NR
IN
Terminal Functions
TERMINAL
DESCRIPTION
SOT23 SOT23
WCSP
FIXED
NAME
NR
ADJ
FIXED
Connecting an external capacitor to this pin bypasses noise generated by the internal bandgap.
This improves power-supply rejection and reduces output noise.
4
4
B2
A3
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
EN
3
3
FB
GND
IN
5
2
1
6
N/A
2
N/A
A1
This terminal is the feedback input voltage for the adjustable device.
Regulator ground
1
C3
C1
Unregulated input to the device.
OUT
5
Output of the regulator.
5
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE)
TPS79328
OUTPUT VOLTAGE
vs
TPS79328
OUTPUT VOLTAGE
vs
TPS79328
GROUND CURRENT
vs
OUTPUT CURRENT
JUNCTION TEMPERATURE
JUNCTION TEMPERATURE
2.805
2.804
2.803
2.802
2.801
2.800
2.799
250
200
2.805
2.800
2.795
2.790
2.785
V
= 3.8 V
= 10 µF
OUT
= 25°C
IN
V
C
= 3.8 V
IN
C
T
= 10 µF
I
= 1 mA
OUT
OUT
J
I
= 1 mA
OUT
I
= 200 mA
OUT
150
100
50
0
I
= 200 mA
OUT
2.798
2.797
2.780
2.775
V
C
= 3.8 V
= 10 µF
IN
2.796
2.795
OUT
−40 −25 −10 5 20 35 50 65 80 95 110 125
(°C)
0
50
100
(mA)
150
200
−40 −25−10 5 20 35 50 65 80 95 110 125
I
T
J
(°C)
T
J
OUT
Figure 2.
Figure 3.
Figure 4.
TPS79328 OUTPUT SPECTRAL
TPS79328 OUTPUT SPECTRAL
TPS79328 OUTPUT SPECTRAL
NOISE DENSITY
vs
NOISE DENSITY
vs
NOISE DENSITY
vs
FREQUENCY
FREQUENCY
FREQUENCY
0.30
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.30
V
= 3.8 V
IN
V
C
C
= 3.8 V
V
C
C
= 3.8 V
IN
= 10 µF
OUT
= 0.1 µF
NR
IN
I
= 200 mA
OUT
= 2.2 µF
OUT
= 0.1 µF
0.25
0.20
0.25
0.20
0.15
0.10
0.05
0
C
= 10 µF
OUT
= 0.001 µF
NR
C
NR
C
= 0.0047 µF
NR
C
I
= 1 mA
OUT
= 0.01 µF
NR
0.15
I
= 1 mA
OUT
C
NR
= 0.1 µF
0.10
0.05
I
= 200 mA
OUT
I
= 200 mA
OUT
0
100
1 k
10 k
100 k
100
1 k
10 k
100 k
100
1 k
10 k
100 k
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
Figure 5.
Figure 6.
Figure 7.
ROOT MEAN SQUARE OUTPUT
TPS79328
DROPOUT VOLTAGE
vs
NOISE
vs
OUTPUT IMPEDANCE
vs
CNR
FREQUENCY
JUNCTION TEMPERATURE
2.5
180
160
140
120
100
80
60
50
40
30
20
10
V
= 3.8 V
= 10 µF
OUT
= 25° C
IN
V
= 2.7 V
IN
V
= 2.8 V
= 200 mA
= 10 µF
OUT
C
T
C
OUT
= 10 µF
I
OUT
J
C
OUT
2.0
1.5
I
= 200 mA
OUT
I
= 1 mA
OUT
1.0
0.5
I
= 100 mA
OUT
60
40
I
= 10 mA
OUT
20
BW = 100 Hz to 100 kHz
0.01
0
0
10
0
−40 −25−10 5 20 35 50 65 80 95 110 125
100
1 k
10 k 100 k 1 M
10 M
0.001
0.1
Frequency (Hz)
T
J
(°C)
C
NR
(µF)
Figure 8.
Figure 9.
Figure 10.
6
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)
TPS79328
RIPPLE REJECTION
vs
TPS79328
RIPPLE REJECTION
vs
TPS79328
RIPPLE REJECTION
vs
FREQUENCY
FREQUENCY
FREQUENCY
100
90
100
90
80
70
60
50
40
30
100
V
C
C
= 3.8 V
V
C
C
= 3.8 V
IN
= 2.2 µF
OUT
= 0.1 µF
NR
IN
90
80
70
60
50
40
= 2.2 µF
OUT
= 0.01 µF
I
= 200 mA
OUT
NR
80
I
= 200 mA
I
= 200 mA
OUT
OUT
70
60
50
40
30
I
= 10 mA
I
= 10 mA
OUT
OUT
I
= 10 mA
OUT
30
20
20
20
10
0
V
= 3.8 V
= 10 µF
IN
C
C
OUT
= 0.01 µF
10
0
10
0
NR
10
100
1 k
10 k 100 k 1 M 10 M
10
100
1 k
10 k 100 k 1 M 10 M
10
100
1 k
10 k 100 k 1 M 10 M
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
Figure 11.
Figure 12.
Figure 13.
TPS79328 OUTPUT VOLTAGE,
ENABLE VOLTAGE
vs
TPS79328
LINE TRANSIENT RESPONSE
TPS79328
LOAD TRANSIENT RESPONSE
TIME (START-UP)
V
C
= 3.8 V
IN
4.8
4
20
= 10 µF
OUT
V
V
= 3.8 V
2
0
IN
0
= 2.8 V
OUT
3.8
I
= 200 mA
−20
OUT
C
T
= 2.2 µF
= 25°C
I
C
C
= 200 mA
OUT
OUT
−40
300
= 2.2 µF
J
OUT
C
NR
= 0.001 µF
= 0.01 µF
dv
dt
0µ.4sV
NR
+
di
dt
0.02A
µs
20
0
3
2
1
0
+
200
100
C
= 0.0047 µF
= 0.01 µF
NR
1mA
-20
C
NR
0
0
50 100 150200 250 300 350 400 450 500
0
20 40 60 80 100 120 140 160 180 200
0
10 20 30 40 50 60 70 80 90 100
Time (µs)
Time (µs)
Time (µs)
Figure 14.
Figure 15.
Figure 16.
TPS79301
DROPOUT VOLTAGE
vs
DROPOUT VOLTAGE
vs
OUTPUT CURRENT
POWER-UP / POWER-DOWN
INPUT VOLTAGE
200
150
250
200
150
100
V
R
= 3 V
= 15 Ω
OUT
L
T
= 125°C
= 25°C
J
T
= 125°C
J
T
J
T
J
= 25°C
100
V
IN
V
OUT
T
= −55°C
50
0
J
T
= −40°C
J
50
0
I
= 200 mA
OUT
0
20 40 60 80 100 120 140 160 180 200
(mA)
5.0
2.5
3.0
3.5
4.0
4.5
1s/div
I
V
(V)
OUT
IN
Figure 17.
Figure 18.
Figure 19.
7
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued)
TYPICAL REGIONS OF STABILITY
TYPICAL REGIONS OF STABILITY
EQUIVALENT SERIES RESISTANCE
EQUIVALENT SERIES RESISTANCE
(ESR)
vs
OUTPUT CURRENT
(ESR)
vs
OUTPUT CURRENT
100
10
100
10
C
= 2.2 µF
OUT
C
= 10 µF
OUT
= 5.5 V
V
= 5.5 V, V
≥ 1.5 V
IN
OUT
V
IN
= −40°C to 125°C
T
J
= −40°C to 125°C
T
J
Region of Instability
Region of Instability
1
1
0.1
0.1
Region of Stability
Region of Stability
0.01
0.01
0.20
0
0.02
0.04
0.06
(A)
0.08
0.20
0
0.02
0.04
0.06
(A)
0.08
I
I
OUT
OUT
Figure 20.
Figure 21.
8
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
APPLICATION INFORMATION
The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive
battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output
noise, low quiescent current (170 µA typically), and enable-input to reduce supply currents to less than 1 µA
when the regulator is turned off.
A typical application circuit is shown in Figure 22.
V
IN
VIN
VOUT
IN
OUT
NR
TPS793xx
V
OUT
EN
GND
µ
µ
F
0.1
F
2.2
µ
0.01
F
Figure 22. Typical Application Circuit
External Capacitor Requirements
A 0.1-µF or larger ceramic input bypass capacitor, connected between IN and GND and located close to the
TPS793xx, is required for stability and improves transient response, noise rejection, and ripple rejection. A
higher-value input capacitor may be necessary if large, fast-rise-time load transients are anticipated or the device
is located several inches from the power source.
Like most low dropout regulators, the TPS793xx requires an output capacitor connected between OUT and GND
to stabilize the internal control loop. The minimum recommended capacitance is 2.2 µF. Any 2.2-µF or larger
ceramic capacitor is suitable, provided the capacitance does not vary significantly over temperature. If load
current is not expected to exceed 100 mA, a 1.0-µF ceramic capacitor can be used.
The internal voltage reference is a key source of noise in an LDO regulator. The TPS793xx has an NR pin which
is connected to the voltage reference through a 250-kΩ internal resistor. The 250-kΩ internal resistor, in
conjunction with an external bypass capacitor connected to the NR pin, creates a low pass filter to reduce the
voltage reference noise and, therefore, the noise at the regulator output. In order for the regulator to operate
properly, the current flow out of the NR pin must be at a minimum, because any leakage current creates an IR
drop across the internal resistor thus creating an output error. Therefore, the bypass capacitor must have
minimal leakage current. The bypass capacitor should be no more than 0.1-µF to ensure that it is fully charged
during the quickstart time provided by the internal switch shown in the Functional Block Diagrams
As an example, the TPS79328 exhibits only 32 µVRMS of output voltage noise using a 0.1-µF ceramic bypass
capacitor and a 2.2-µF ceramic output capacitor. Note that the output starts up slower as the bypass capacitance
increases due to the RC time constant at the NR pin that is created by the internal 250-kΩ resistor and external
capacitor.
Board Layout Recommendation to Improve PSRR and Noise Performance
To improve ac measurements like PSRR, output noise, and transient response, it is recommended that the board
be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the GND
pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the GND
pin of the device.
9
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
APPLICATION INFORMATION (continued)
Power Dissipation and Junction Temperature
Specified regulator operation is assured to a junction temperature of 125°C; the maximum junction temperature
should be restricted to 125°C under normal operating conditions. This restriction limits the power dissipation the
regulator can handle in any given application. To ensure the junction temperature is within acceptable limits,
calculate the maximum allowable dissipation, PD(max), and the actual dissipation, PD, which must be less than or
equal to PD(max)
.
The maximum power dissipation limit is determined using Equation 1:
TJ max TA
PD max
+
(
)
RQJA
(1)
Where:
•
•
•
TJmax is the maximum allowable junction temperature.
RθJA is the thermal resistance junction-to-ambient for the package (see the Dissipation Ratings Table).
TA is the ambient temperature.
The regulator dissipation is calculated using Equation 2:
ǒ
Ǔ
PD + VIN*VOUT IOUT
(2)
Power dissipation resulting from quiescent current is negligible. Excessive power dissipation triggers the thermal
protection circuit.
Programming the TPS79301 Adjustable LDO Regulator
The output voltage of the TPS79301 adjustable regulator is programmed using an external resistor divider as
shown in Figure 23. The output voltage is calculated using Equation 3:
R1
R2
ǒ1 ) Ǔ
VOUT + VREF
(3)
Where:
•
VREF = 1.2246 V typ (the internal reference voltage)
Resistors R1 and R2 should be chosen for approximately 50-µA divider current. Lower value resistors can be
used for improved noise performance, but the solution consumes more power. Higher resistor values should be
avoided as leakage current into/out of FB across R1/R2 creates an offset voltage that artificially in-
creases/decreases the feedback voltage and thus erroneously decreases/increases VOUT. The recommended
design procedure is to choose R2 = 30.1 kΩ to set the divider current at 50 µA, C1 = 15 pF for stability, and then
calculate R1 using Equation 4:
VOUT
ǒ Ǔ
R1 +
R2
Vref * 1
(4)
In order to improve the stability of the adjustable version, it is suggested that a small compensation capacitor be
placed between OUT and FB. For voltages <1.8 V, the value of this capacitor should be 100 pF. For voltages
>1.8 V, the approximate value of this capacitor can be calculated as shown in Equation 5:
*7
(3 x 10 ) x (R1 ) R2)
C1
+
(R1 x R2)
(5)
The suggested value of this capacitor for several resistor ratios is shown in the table below. If this capacitor is
not used (such as in a unity-gain configuration) or if an output voltage <1.8 V is chosen, then the minimum
recommended output capacitor is 4.7 µF instead of 2.2 µF.
10
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
APPLICATION INFORMATION (continued)
OUTPUT VOLTAGE
PROGRAMMING GUIDE
VIN
VOUT
IN
OUT
FB
TPS793xx
OUTPUT
VOLTAGE
R1
R2
µ
C1
1
F
R1
R2
C1
EN
NR
µ
1
F
GND
1.22 V
2.5 V
3.3 V
3.6 V
short
31.6 k
51 k
open
0 pF
µ
0.01
F
30.1 k
30.1 k
30.1 k
22 pF
15 pF
15 pF
Ω
Ω
Ω
Ω
Ω
Ω
59 k
Figure 23. TPS79301 Adjustable LDO Regulator Programming
Regulator Protection
The TPS793xx PMOS-pass transistor has a built-in back diode that conducts reverse current when the input
voltage drops below the output voltage (e.g., during power-down). Current is conducted from the output to the
input and is not internally limited. If extended reverse voltage operation is anticipated, external limiting might be
appropriate.
The TPS793xx features internal current limiting and thermal protection. During normal operation, the TPS793xx
limits output current to approximately 400 mA. When current limiting engages, the output voltage scales back
linearly until the overcurrent condition ends. While current limiting is designed to prevent gross device failure,
care should be taken not to exceed the power dissipation ratings of the package or the absolute maximum
voltage ratings of the device. If the temperature of the device exceeds approximately 165°C, thermal-protection
circuitry shuts it down. Once the device has cooled down to below approximately 140°C, regulator operation
resumes.
11
TPS79301, TPS79318
TPS79325, TPS79328, TPS793285
TPS79330, TPS79333, TPS793475
www.ti.com
SLVS348H–JULY 2001–REVISED OCTOBER 2004
TPS793xxYEQ NanoStar™ Wafer Chip Scale Information
0,79
0,84
1,30
1,34
0.625 Max
NOTES:A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
D. This package is tin-lead (SnPb); consult the factory for availability of lead-free material.
NanoStar is a trademark of Texas Instruments.
Figure 24. NanoStar™ Wafer Chip Scale Package
12
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TPS79301DBVR
ACTIVE
SOT-23
DBV
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79301DBVRG4
TPS79318DBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
6
5
3000
None
Call TI
Call TI
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79318DBVRG4
TPS79318DBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79318YEQR
TPS79318YEQT
TPS79325DBVR
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
SOT-23
YEQ
YEQ
DBV
5
5
5
3000
250
None
None
Call TI
Call TI
Level-1-240C-UNLIM
Level-1-240C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79325DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79325YEQR
TPS79325YEQT
TPS793285DBVR
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
SOT-23
YEQ
YEQ
DBV
5
5
5
3000
250
None
None
Call TI
Call TI
Level-1-240C-UNLIM
Level-1-240C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS793285DBVRG4
TPS793285DBVT
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS793285YEQR
TPS793285YEQT
TPS79328DBVR
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
SOT-23
YEQ
YEQ
DBV
5
5
5
3000
250
None
None
Call TI
Call TI
Level-1-240C-UNLIM
Level-1-240C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79328DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79328YEQR
TPS79328YEQT
TPS79330DBVR
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
SOT-23
YEQ
YEQ
DBV
5
5
5
3000
250
None
None
Call TI
Call TI
Level-1-240C-UNLIM
Level-1-240C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79330DBVRG4
ACTIVE
SOT-23
DBV
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79330YEQR
TPS79330YEQT
TPS79333DBVR
ACTIVE
ACTIVE
ACTIVE
DSBGA
DSBGA
SOT-23
YEQ
YEQ
DBV
5
5
5
3000
250
None
None
Call TI
Call TI
Level-1-240C-UNLIM
Level-1-240C-UNLIM
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79333DBVRG4
TPS793475DBVR
TPS793475DBVRG4
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Feb-2005
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Amplifiers
amplifier.ti.com
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