TPS79925QDDCRQ1 [TI]
200 mA, LOW QUIESCENT CURRENT, ULTRA-LOW NOISE HIGH PSRR, LOW DROPOUT, LINEAR REGULATORS; 200毫安,低静态电流,超低噪声,高PSRR ,低压差,线性稳压器型号: | TPS79925QDDCRQ1 |
厂家: | TEXAS INSTRUMENTS |
描述: | 200 mA, LOW QUIESCENT CURRENT, ULTRA-LOW NOISE HIGH PSRR, LOW DROPOUT, LINEAR REGULATORS |
文件: | 总19页 (文件大小:759K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
www.ti.com
SBVS097E –MARCH 2008–REVISED JANUARY 2012
200 mA, LOW QUIESCENT CURRENT, ULTRA-LOW NOISE,
HIGH PSRR, LOW DROPOUT, LINEAR REGULATORS
Check for Samples: TPS79901-Q1, TPS79912-Q1, TPS79915-Q1, TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
1
FEATURES
23
•
Qualified for Automotive Applications
DESCRIPTION
•
200-mA Low-Dropout (LDO) Regulator
With Enable (EN)
The TPS799xx family of low-dropout (LDO)
low-power linear regulators offers excellent ac
performance with very low ground current. High
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient
response are provided while consuming a very low
40-μA (typical) ground current. The TPS799xx is
stable with ceramic capacitors and uses an advanced
BiCMOS fabrication process to yield a dropout
voltage of 100 mV (typ) at 200-mA output. The
TPS799xx uses a precision voltage reference and
feedback loop to achieve overall accuracy of 2% over
all load, line, process, and temperature variations. It
is fully specified from TJ = –40°C to 125°C and is
offered in low profile ThinSOT-23 and 2-mm × 2-mm
SON packages, ideal for wireless handsets and
WLAN cards.
•
•
Low IQ: 40 μA
Multiple Output Voltage Versions Available:
–
Fixed Outputs of 1.2 V to 4.5 V Using
Innovative Factory EEPROM Programming
–
Adjustable Outputs from 1.2 V to 6.5 V
•
•
•
•
High PSRR: 66 dB at 1 kHz
Ultralow Noise: 29.5 μVRMS
Fast Start-Up Time: 45 μs
Stable With a Low ESR, 2-μF (Typ) Output
Capacitance
•
•
•
•
Excellent Load/Line Transient Response
2% Overall Accuracy (Load/Line/Temperature)
Very Low Dropout: 100 mV
DDC (TSOT-23-5) PACKAGE
(TOP VIEW)
DRV (SON-6) PACKAGE
(TOP VIEW)
Thin SOT-23 and 2-mm × 2-mm SON-6
Packages
OUT
FB
1
2
3
6
5
4
IN
5
4
1
2
3
IN
GND
EN
OUT
NR
APPLICATIONS
GND
N/C
EN
•
•
•
•
Cellular Phones
GND
Wireless LANs, Bluetooth®
N/C – No internal connection
VCOs, RF
Handheld Organizers, PDAs
ORDERING INFORMATION(1)
TJ
VOUT
PACKAGE(2)
ORDERABLE PART NUMBER
TPS79912QDRVRQ1
TPS79915QDDCRQ1
TPS79915QDRVRQ1
TSP79918QDDCRQ1
TPS79925QDDCRQ1
TPS79927QDDCRQ1
TPS79927QDRVRQ1
TSP79933QDDCRQ1
TSP79901QDRVRQ1
TOP-SIDE MARKING
1.2 V
SON-6 – DRV
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
Reel of 3000
DAV
OFC
RAQ
CEW
OFM
OFD
OFK
PSEQ
CFA
TSOT-23-5 – DDC
SON-6 – DRV
1.5 V
1.8 V
2.5 V
TSOT-23-5 – DDC
TSOT-23-5 – DDC
TSOT-23-5 – DDC
SON-6 – DRV
–40°C to 125°C
2.7 V
3.3 V
TSOT-23-5 – DDC
Adjustable(3) SON-6 – DRV
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) For fixed 1.2-V operation, tie FB to OUT.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2008–2012, Texas Instruments Incorporated
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
SBVS097E –MARCH 2008–REVISED JANUARY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS(1)
over operating temperature range (unless otherwise noted)
VIN range
–0.3 V to 7 V
–0.3 V to VIN + 0.3 V
–0.3 V to VIN + 0.3 V
Internally limited
VEN range
VOUT range
Peak output current
Continuous total power dissipation
Junction temperature range, TJ
Storage junction temperature range , Tstg
ESD rating, HBM
See the Thermal Information table
–55°C to 150°C
–55°C to 150°C
2000 V
ESD rating, CDM
1000 V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL INFORMATION
TPS799xxQ1
THERMAL METRIC(1)(2)
UNITS
DRV (6 PINS)
74.2
DDC (5 PINS)
178.1
70.7
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
θJCtop
θJB
58.8
145.9
0.2
73.4
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
2.5
ψJB
54.4
74.1
θJCbot
7.2
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator.
2
Submit Documentation Feedback
Copyright © 2008–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
www.ti.com
SBVS097E –MARCH 2008–REVISED JANUARY 2012
ELECTRICAL CHARACTERISTICS
over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(TYP) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA,
VEN = VIN, COUT = 2.2 μF, CNR = 0.01 μF (unless otherwise noted) For TPS79901, VOUT = 3.0 V. Typical values are at
TJ = 25°C.
PARAMETER
Input voltage range(1)
TEST CONDITIONS
MIN
2.7
TYP
MAX
6.5
UNIT
V
VIN
VFB
Internal reference (TPS79901)
1.169
1.193
1.217
V
Output voltage range
(TPS79901)
VOUT
VOUT
VFB
6.5 – VDO
V
Output accuracy
Output accuracy(1)
Line regulation(1)
Nominal, TJ = 25°C
–1.0
+1.0
%
Over VIN, IOUT, temperature,
VOUT + 0.3 V ≤ VIN ≤ 6.5 V,
500 μA ≤ IOUT ≤ 200 mA
VOUT
–2.0
±1.0
+2.0
%
ΔVOUT%/ ΔVIN
VOUT(NOM) + 0.3 V ≤ VIN ≤ 6.5 V
500 μA ≤ IOUT ≤ 200 mA
0.02
0.002
100
90
%/V
ΔVOUT%/ ΔIOUT Load regulation
%/mA
Dropout voltage(2)
VDO
VOUT < 3.3 V
175
160
600
60
IOUT = 200 mA
mV
(VIN = VOUT(NOM) – 0.1 V)
VOUT ≥ 3.3 V
ICL
Output current limit
VOUT = 0.9 × VOUT(NOM)
500 μA ≤ IOUT ≤ 200 mA
200
400
40
mA
μA
μA
IGND
ISHDN
Ground pin current
Shutdown current (IGND
)
VEN ≤ 0.4 V, 2.7 V ≤ VIN ≤ 6.5 V
0.15
1.0
Feedback pin current
(TPS79901)
IFB
–0.5
0.5
μA
f = 100 Hz
70
VIN = 3.85 V,
f = 1 kHz
66
51
VOUT = 2.85 V,
CNR = 0.01 μF,
IOUT = 100 mA
PSRR
Power-supply rejection ratio
dB
f = 10 kHz
f = 100 kHz
38
Output noise voltage
BW = 10 Hz to 100 kHz, VOUT
2.8 V
CNR = 0.01 μF
10.5 VOUT
VN
=
μVRMS
CNR = none
94 VOUT
CNR = 0.001 μF
CNR = 0.047 μF
CNR = 0.01 μF
CNR = none
45
45
50
50
VOUT = 2.85 V,
RL = 14 Ω,
COUT = 2.2 μF
TSTR
Startup time
μs
VEN(HI)
VEN(LO)
IEN(HI)
Enable high (enabled)
Enable low (shutdown)
Enable pin current, enabled
1.2
0
VIN
0.4
1.0
V
V
VEN = VIN = 6.5 V
0.03
165
145
μA
°C
°C
°C
V
Shutdown, temperature increasing
Reset, temperature decreasing
TSD
Thermal shutdown temperature
TJ
Operating junction temperature
Undervoltage lock-out
Hysteresis
–40
125
VUVLO
VUVLO,hys
VIN rising
VIN falling
1.90
2.20
70
2.65
mV
(1) Minimum VIN = VOUT + VDO or 2.7 V, whichever is greater.
(2) VDO is not measured for devices with VOUT(NOM) < 2.8 V because minimum VIN = 2.7 V.
Copyright © 2008–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
SBVS097E –MARCH 2008–REVISED JANUARY 2012
www.ti.com
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAMS
IN
OUT
IN
OUT
Ω
400
Ω
400
µ
2
A
Ω
3.3M
Current
Limit
Current
Limit
Overshoot
Detect
Overshoot
Detect
Thermal
Shutdown
Thermal
Shutdown
EN
EN
UVLO
UVLO
Quickstart
1.193V
Bandgap
1.193V
Bandgap
NR
FB
500k
500k
GND
GND
Figure 1. Fixed-Voltage Version
Figure 2. Adjustable-Voltage Version
PIN CONFIGURATIONS
DDC (TSOT-23-5) PACKAGE
(TOP VIEW)
DRV (SON-6) PACKAGE
(TOP VIEW)
OUT
FB
1
2
3
6
5
4
IN
5
4
1
2
3
IN
GND
EN
OUT
NR
GND
N/C
EN
GND
N/C – No internal connection
Table 1. PIN DESCRIPTIONS
PIN
NO.
DESCRIPTION
NAME
DDC
DRV
6
IN
1
2
Input supply
Ground. The pad must be tied to GND.
GND
3, Pad
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
EN
NR
FB
3
4
4
4
2
2
Fixed-voltage versions only; connecting an external capacitor to this pin bypasses noise generated by
the internal bandgap. This capacitor allows output noise to be reduced to very low levels.
Adjustable version only; this pin is the input to the control loop error amplifier, and is used to set the
output voltage of the device.
Output of the regulator. A small capacitor (total typical capacitance ≥ 2 μF ceramic) is needed from
this pin to ground to ensure stability.
OUT
N/C
5
1
5
—
Not internally connected. This pin must either be left open or tied to GND.
4
Submit Documentation Feedback
Copyright © 2008–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
www.ti.com
SBVS097E –MARCH 2008–REVISED JANUARY 2012
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(TYP) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA, VEN = VIN
COUT = 2.2 μF, CNR = 0.01 μF (unless otherwise noted). For TPS79901, VOUT = 3 V. Typical values are at TJ = 25°C.
LOAD REGULATION LINE REGULATION
,
28.50
21.38
14.25
7.13
0
1.0
0.8
0.6
0.4
0.2
0
IOUT = 100mA
T
= −40°C
J
T
= +25°C
J
T
= +25°C
J
T
= −40°C
J
−
−
−
−
−
0.2
0.4
0.6
0.8
1.0
−
7.13
T
= +125°C
J
T
= +85°C
−
14.25
21.38
28.50
J
T
= +125°C
T
= +85°C
J
J
−
−
2.5
3.5
4.5
5.5
6.5
7.5
0
50
100
150
200
VIN (V)
IOUT (mA)
Figure 3.
Figure 4.
OUTPUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS79901 DROPOUT vs
INPUT VOLTAGE
110
100
90
80
70
60
50
40
30
20
10
0
2.0
1.5
1.0
0.5
0
IOUT = 200mA
IOUT = 1mA
IOUT = 100mA
−
−
−
−
0.5
1.0
1.5
2.0
IOUT = 200mA
2.5
3.0
3.5
4.0
4.5
5.0
5.5 6.0
6.5
7.0
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
(°C)
VIN (V)
T
J
Figure 5.
Figure 6.
GROUND PIN CURRENT vs
INPUT VOLTAGE
GROUND PIN CURRENT (DISABLED) vs
JUNCTION TEMPERATURE
60
50
40
30
20
10
0
600
500
400
300
200
100
0
VEN = 0.4V
IOUT = 200mA
IOUT = 500mA
VIN = 6.5V
VIN = 3.2V
VOUT = 2.85V
6.0 6.5 7.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
T
(°C)
VIN (V)
J
Figure 7.
Figure 8.
Copyright © 2008–2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
SBVS097E –MARCH 2008–REVISED JANUARY 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(TYP) + 0.3 V or 2.7 V, whichever is greater; IOUT = 1 mA,
VEN = VIN, COUT = 2.2 μF, CNR = 0.01 μF (unless otherwise noted). For TPS79901, VOUT = 3 V. Typical values are at
TJ = 25°C.
POWER-SUPPLY RIPPLE REJECTION vs
IN – VOUT, IOUT = 1 mA
POWER-SUPPLY RIPPLE REJECTION vs
IN – VOUT, IOUT = 100 mA
V
V
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1kHz
1MHz
1kHz
0.1kHz
1kHz
10kHz
100kHz
10kHz
100kHz
1MHz
µ
µ
µ
F
µ
CNR = 0.01
F
CNR = 0.01
COUT = 2.2 F
COUT = 2.2 F
0.0
0.5 1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0 3.5 4.0
−
−
VIN VOUT (V)
VIN VOUT (V)
Figure 9.
Figure 10.
POWER-SUPPLY RIPPLE REJECTION vs
IN – VOUT, IOUT = 200 mA
V
90
80
70
60
50
40
30
20
10
0
0.1kHz
1kHz
10kHz
100kHz
1MHz
2.5
µ
µ
CNR = 0.01
COUT = 2.2 F
F
0.0
0.5
1.0
1.5
2.0
3.0 3.5 4.0
−
VIN VOUT (V)
Figure 11.
6
Submit Documentation Feedback
Copyright © 2008–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
www.ti.com
SBVS097E –MARCH 2008–REVISED JANUARY 2012
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines the high performance required of many RF and precision
analog applications with ultra-low current consumption. High PSRR is provided by a high gain, high bandwidth
error loop with good supply rejection at very low headroom (VIN – VOUT). Fixed voltage versions provide a noise
reduction pin to bypass noise generated by the bandgap reference and to improve PSRR while a quick-start
circuit fast-charges this capacitor at startup. The combination of high performance and low ground current also
make the TPS799xx an excellent choice for portable applications. All versions have thermal and over-current
protection and are fully specified from –40°C to 125°C.
Figure 12 shows the basic circuit connections for fixed-voltage model. Figure 13 gives the connections for the
adjustable output version (TPS79901). R1 and R2 can be calculated for any output voltage using the formula in
Figure 13. Sample resistor values for common output voltages are shown in Figure 13.
Input and Output Capacitor Requirements
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1-μF to
1-μF low ESR capacitor across the input supply near the regulator. This counteracts reactive input sources and
improve transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if
large, fast rise-time load transients are anticipated or the device is located several inches from the power source.
If source impedance is not sufficiently low, a 0.1-μF input capacitor may be necessary to ensure stability.
The TPS799xx is designed to be stable with standard ceramic capacitors of values 2.2 μF or larger. X5R and
X7R type capacitors are best as they have minimal variation in value and ESR over temperature. Maximum ESR
should be <1.0 Ω.
Feedback Capacitor Requirements (TPS79901 only)
The feedback capacitor, CFB, shown in Figure 13 is required for stability. For a parallel combination of R1 and R2
equal to 250 kΩ, any value from 3 pF to 1 nF can be used. Fixed voltage versions have an internal 30-pF
feedback capacitor which is quick-charged at start-up. The adjustable version does not have this quick-charge
circuit, so values below 5 pF should be used to ensure fast startup; values above 47 pF can be used to
implement an output voltage soft-start. Larger value capacitors also improve noise slightly. The TPS79901 is
stable in unity-gain configuration (OUT tied to FB) without CFB
.
Output Noise
In most LDOs, the bandgap is the dominant noise source. If a noise reduction capacitor (CNR) is used with the
TPS799xx, the bandgap does not contribute significantly to noise. Instead, noise is dominated by the output
resistor divider and the error amplifier input. To minimize noise in a given application, use a 0.01-μF noise
reduction capacitor; for the adjustable version, smaller value resistors in the output resistor divider reduce noise.
A parallel combination that gives 2 μA of divider current has the same noise performance as a fixed-voltage
version. To further optimize noise, equivalent series resistance of the output capacitor can be set to
approximately 0.2 Ω. This configuration maximizes phase margin in the control loop, reducing total output noise
by up to 10%.
Optional input capacitor.
Optional input capacitor.
(R1 + R2)
VOUT
=
´ 1.193
May improve source
May improve source
R2
impedance, noise, or PSRR.
impedance, noise, or PSRR.
VIN
VOUT
VIN
VOUT
IN
OUT
TPS799xx
IN
OUT
FB
TPS79901
R1
R2
CFB
µ
2.2
F
2.2mF
Ceramic
EN
GND
NR
EN
GND
Ceramic
VEN
VEN
Optional bypass capacitor
to reduce output noise
and increase PSRR.
Figure 12. Typical Application Circuit for
Fixed Voltage Version
Figure 13. Typical Application Circuit for
Adjustable Voltage Version
Noise can be referred to the feedback point (FB pin) such that with CNR = 0.01 μF, total noise is approximately
given by Equation 1:
Copyright © 2008–2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
SBVS097E –MARCH 2008–REVISED JANUARY 2012
www.ti.com
10.5mVRMS
VN =
x VOUT
V
(1)
The TPS79901 adjustable version does not have the noise-reduction pin available, so ultra-low noise operation is
not possible. Noise can be minimized according to the previous recommendations.
Board Layout Recommendations to Improve PSRR and Noise Performance
To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the
board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the
GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the
GND pin of the device.
Internal Current Limit
The TPS799xx internal current limit helps protect the regulator during fault conditions. During current limit, the
output sources a fixed amount of current that is largely independent of output voltage. For reliable operation, the
device should not be operated in current limit for extended periods of time.
The PMOS pass element in the TPS799xx has a built-in body diode that conducts current when the voltage at
OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is
anticipated, external limiting may be appropriate.
Shutdown
The enable pin (EN) is active high and is compatible with standard and low voltage TTL-CMOS levels. When
shutdown capability is not required, EN can be connected to IN.
Dropout Voltage
The TPS799xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in its linear region of operation and the input-to-output resistance is the
RDS, ON of the PMOS pass element. Because the PMOS device behaves like a resistor in dropout, VDO scales
approximately with output current.
As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout.
This effect is shown in Figure 9 through Figure 11 in the Typical Characteristics section.
Startup
Fixed voltage versions of the TPS799xx use a quick-start circuit to fast-charge the noise reduction capacitor,
CNR, if present (see Functional Block Diagrams, Figure 1). This allows the combination of very low output noise
and fast start-up times. The NR pin is high impedance so a low leakage CNR capacitor must be used; most
ceramic capacitors are appropriate in this configuration.
Note that for fastest startup, VIN should be applied first, then the enable pin (EN) driven high. If EN is tied to IN,
startup is somewhat slower. The quick-start switch is closed for approximately 135 μs. To ensure that CNR is fully
charged during the quick-start time, a 0.01 μF or smaller capacitor should be used.
Transient Response
As with any regulator, increasing the size of the output capacitor reduces over/undershoot magnitude but
increase duration of the transient response. In the adjustable version, adding CFB between OUT and FB
improves stability and transient response. The transient response of the TPS799xx is enhanced by an active
pulldown that engages when the output overshoots by approximately 5% or more when the device is enabled.
When enabled, the pulldown device behaves like a 350-Ω resistor to ground.
Undervoltage Lockout (UVLO)
The TPS799xx utilizes a UVLO circuit to keep the output shut off until internal circuitry is operating properly. The
UVLO circuit has a deglitch feature so that it typically ignores undershoot transients on the input if they are less
than 50-μs duration.
8
Submit Documentation Feedback
Copyright © 2008–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
www.ti.com
SBVS097E –MARCH 2008–REVISED JANUARY 2012
Minimum Load
The TPS799xx is stable and well behaved with no output load. To meet the specified accuracy, a minimum load
of 500 μA is required. Below 500 μA at junction temperatures near 125°C, the output can drift up enough to
cause the output pulldown to turn on. The output pulldown limits voltage drift to 5% typically, but ground current
could increase by approximately 50 μA. In typical applications, the junction cannot reach high temperatures at
light loads since there is no appreciable dissipated power. The specified ground current would then be valid at no
load in most applications.
THERMAL INFORMATION
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately 165°C, allowing the
device to cool. When the junction temperature cools to approximately 145°C, the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage due to
overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to 125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least 35°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of 125°C at the highest expected ambient temperature
and worst-case load.
The internal protection circuitry of the TPS799xx has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TPS799xx into thermal shutdown
degrades device reliability.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the head from the
device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Thermal
Information table. Using heavier copper increases the effectiveness in removing heat from the device. The
addition of plated through holes to heat-dissipating layers also improves the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the
output current times the voltage drop across the output pass element, as shown in Equation 2:
ǒ
Ǔ
PD + VIN*VOUT IOUT
(2)
Package Mounting
Solder pad footprint recommendations for the TPS799xx are available from the Texas Instruments' web site at
www.ti.com.
Copyright © 2008–2012, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
TPS79901-Q1, TPS79912-Q1, TPS79915-Q1
TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1
SBVS097E –MARCH 2008–REVISED JANUARY 2012
www.ti.com
REVISION HISTORY
Changes from Revision D (June 2011) to Revision E
Page
•
Changed CDM ESD rating from 500 V to 1000 V ................................................................................................................ 2
10
Submit Documentation Feedback
Copyright © 2008–2012, Texas Instruments Incorporated
Product Folder Link(s): TPS79901-Q1 TPS79912-Q1 TPS79915-Q1 TPS79918-Q1 TPS79925-Q1 TPS79927-Q1
TPS79933-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS79901QDRVRQ1
TPS79912QDRVRQ1
TPS79915QDDCRQ1
TPS79915QDRVRQ1
TPS79918QDDCRQ1
TPS79925QDDCRQ1
TPS79927QDDCRQ1
TPS79927QDRVRQ1
TPS79933QDDCRQ1
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SON
SON
SOT
SON
SOT
SOT
SOT
SON
SOT
DRV
DRV
DDC
DRV
DDC
DDC
DDC
DRV
DDC
6
6
5
6
5
5
5
6
5
3000
3000
3000
3000
3000
3000
3000
3000
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jan-2012
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TPS79901-Q1, TPS79912-Q1, TPS79915-Q1, TPS79918-Q1, TPS79925-Q1, TPS79927-Q1, TPS79933-Q1 :
Catalog: TPS79901, TPS79912, TPS79915, TPS79918, TPS79925, TPS79927, TPS79933
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS79912QDRVRQ1
TPS79915QDDCRQ1
TPS79915QDRVRQ1
TPS79925QDDCRQ1
TPS79927QDDCRQ1
TPS79927QDRVRQ1
TPS79933QDDCRQ1
SON
SOT
SON
SOT
SOT
SON
SOT
DRV
DDC
DRV
DDC
DDC
DRV
DDC
6
5
6
5
5
6
5
3000
3000
3000
3000
3000
3000
3000
179.0
179.0
179.0
179.0
179.0
179.0
179.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
2.2
3.2
2.2
3.2
3.2
2.2
3.2
2.2
3.2
2.2
3.2
3.2
2.2
3.2
1.2
1.4
1.2
1.4
1.4
1.2
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q3
Q2
Q3
Q3
Q2
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Jan-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS79912QDRVRQ1
TPS79915QDDCRQ1
TPS79915QDRVRQ1
TPS79925QDDCRQ1
TPS79927QDDCRQ1
TPS79927QDRVRQ1
TPS79933QDDCRQ1
SON
SOT
SON
SOT
SOT
SON
SOT
DRV
DDC
DRV
DDC
DDC
DRV
DDC
6
5
6
5
5
6
5
3000
3000
3000
3000
3000
3000
3000
195.0
203.0
195.0
203.0
203.0
195.0
203.0
200.0
203.0
200.0
203.0
203.0
200.0
203.0
45.0
35.0
45.0
35.0
35.0
45.0
35.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community Home Page
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号:
TPS79925YZUR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79925YZUT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79926YZUR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79926YZUT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS799275YZUR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS799275YZUT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79927DDCR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79927DDCRG4
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79927DDCT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79927DDCTG4
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
TPS79927DRVR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear Regulator
TI
©2020 ICPDF网 联系我们和版权申明