TPS79933 [TI]
200mA Low Quiescent Current, Ultra-Low Noise, High PSRR, Low Dropout Linear Regulator; 路200mA的低静态电流，超低噪声，高PSRR ，低压降线性稳压器
| 型号： | TPS79933 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 200mA Low Quiescent Current, Ultra-Low Noise, High PSRR, Low Dropout Linear Regulator |
| 文件： | 总18页 (文件大小：368K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
200mA Low Quiescent Current, Ultra-Low Noise,
High PSRR, Low Dropout Linear Regulator
FEATURES
DESCRIPTION
•
•
•
200mA Low Dropout Regulator with EN
The TPS799xx family of low-dropout (LDO)
low-power linear regulators offer excellent AC per-
formance with very low ground current. High
power-supply rejection ratio (PSRR), low noise, fast
start-up, and excellent line and load transient re-
sponse are provided while consuming a very low
40µA (typical) ground current. The TPS799xx is
stable with ceramic capacitors and uses an advanced
BiCMOS fabrication process to yield dropout voltage
typically 110mV at 200mA output. The TPS799xx
uses a precision voltage reference and feedback loop
to achieve overall accuracy of 2% over all load, line,
process, and temperature variations. It is fully speci-
fied from TJ = -40°C to +125°C and is offered in low
profile ThinSOT23 and Wafer Chip-Scale packages
(WCSP), ideal for wireless handsets and WLAN
cards.
Low IQ: 40µA
Available in Multiple Output Voltage Versions:
– Fixed Outputs of 1.5V, 1.6V, 1.8V, 2.5V, 2.7V,
2.8V, 2.85V, 2.9V, 3.0V, 3.2V and 3.3V
– Adjustable Outputs from 1.2V to 6.5V
– Additional Outputs Available Using
Innovative Factory EEPROM Programming
•
•
•
•
High PSRR: 66dB at 1kHz
Ultra-low Noise: 29.5µVRMS
Fast Start-Up Time: 45µs
Stable with a 2.0µF Ceramic Output
Capacitance
•
•
•
•
Excellent Load/Line Transient Response
2% Overall Accuracy (Load/Line/Temp)
Very Low Dropout: 100mV
ThinSOT-23, WCSP, and 2mm x 2mm SON
(Available 9/05) Packages
APPLICATIONS
•
•
•
•
Cellular Phones
Wireless LAN, Bluetooth™
VCOs, RF
Handheld Organizers, PDAs
TPS799xxDDC
TSOT23−5
TPS79901DDC
TSOT23−5
TPS799xxYZU
WCSP PACKAGE
(TOP VIEW)
TPS79901YZU
WCSP PACKAGE
(TOP VIEW)
(TOP VIEW)
(TOP VIEW)
C3
C1
C3
C1
5
4
1
2
3
IN
GND
EN
OUT
NR
5
4
1
2
3
IN
GND
EN
OUT
FB
IN
GND
FB
OUT
EN
IN
GND
NR
OUT
EN
B2
B2
A3
A1
A3
A1
TPS799xx DRV PACKAGE
2mm x 2mm SON
(TOP VIEW)
TPS79901 DRV PACKAGE
2mm x 2mm SON
(TOP VIEW)
OUT
NR
1
2
3
OUT
FB
1
2
3
6
5
4
IN
6
5
4
IN
N/C
EN
N/C
EN
GND
GND
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
(2)
PRODUCT
VOUT
TPS799xxyyyz
XX is nominal output voltage (for example, 28 = 2.8V, 285 = 2.85V, 01 = Adjustable).
YYY is package designator.
Z is package quantity.
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming;
minimum order quantities may apply. Contact factory for details and availability.
PACKAGE-LEAD
(DESIGNATOR)
PACKAGE
MARKING
PRODUCT
VOLTAGE
SOT23 (DDC)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
WCSP (YZU)
SOT23 (DDC)
WCSP (YZU)
AWT
E9
Adjustable
TPS79901
1.2V to 5.5V(1)
AWU
EA
TPS79915
TPS79916
TPS79918
1.5V
1.6V
1.8V
F2
AWV
EB
AWW
EC
TPS79925
TPS79927
TPS79928
2.5V
2.7V
2.8V
F5
AWX
ED
AXY
EE
TPS79285
TPS79929
TPS79930
TPS79932
TPS79933
2.85V
2.9V
3.0V
3.2V
3.3V
EZ
AXZ
EF
F4
AXX
EG
(1) For fixed 1.2V operation, tie FB to OUT.
2
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
ABSOLUTE MAXIMUM RATINGS
Over operating temperature range (unless otherwise noted)(1)
PARAMETER
TPS799xx
-0.3 to +7.0
UNIT
VIN range
V
V
V
VEN range
-0.3 to VIN +0.3
-0.3 to VIN +0.3
Internally limited
See Dissipation Ratings Table
-55 to +150
VOUT range
Peak output current
Continuous total power dissipation
Junction temperature range, TJ
Storage junction temperature range , TSTG
ESD rating, HBM
°C
°C
kV
V
-55 to +150
2
ESD rating, CDM
500
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
DISSIPATION RATINGS
DERATING FACTOR
BOARD
Low-K(1)
High-K(2)
Low-K(1)
High-K(2)
PACKAGE
DDC
RθJC
RθJA
ABOVE TA = 25°C
TA < 25°C
360mW
500mW
390mW
530mW
TA = 70°C
200mW
275mW
215mW
295mW
TA = 85°C
145mW
200mW
155mW
215mW
90°C/W
90°C/W
27°C/W
27°C/W
280°C
200°C
255°C
190°C
3.6mW/°C
DDC
5.0mW/°C
YZU
3.9mW/°C
YZU
5.3mW/°C
(1) The JEDEC low-K (1s) board used to derive this data was a 3in x 3in, two-layer board with 2-ounce copper traces on top of the board.
(2) The JEDEC high-K (2s2p) board used to derive this data was a 3in x 3in, multilayer board with 1-ounce internal power and ground
planes and 2-ounce copper traces on top and bottom of the board.
3
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
ELECTRICAL CHARACTERISTICS
Over operating temperature range (TJ = – 40°C to +125°C), VIN = VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT = 1mA,
VEN = VIN, COUT = 2.2µF, CNR = 0.01µF, unless otherwise noted. For TPS79901, VOUT = 3.0V.
Typical values are at TJ = +25°C.
PARAMETER
Input voltage range(1)
TEST CONDITIONS
MIN
2.7
TYP
MAX
6.5
UNIT
V
VIN
VFB
Internal reference (TPS79901)
Output voltage range (TPS79901)
1.169
VFB
1.193
1.217
6.5-VDO
+1.0
V
VOUT
VOUT
V
Output accuracy
Nominal
Over VIN
TJ = +25°C
VOUT + 0.3V ≤ VIN ≤ 6.5V
-1.0
%
,
VOUT
Output accuracy(1)
-2.0
±1.0
+2.0
%
IOUT, Temp 500µA ≤ IOUT ≤ 200mA
VOUT(NOM) + 0.3V ≤ VIN≤ 6.5V
500µA ≤ IOUT≤ 200mA
∆VOUT%/ ∆VIN Line regulation(1)
∆VOUT%/ ∆IOUT Load regulation
0.02
%/V
0.002
%/mA
Dropout voltage(2)
(VIN = VOUT(NOM) - 0.1V)
VDO
VOUT < 3.3V IOUT = 200mA
100
90
175
160
mV
mV
Dropout voltage
VDO
VOUT≥ 3.3V IOUT = 200mA
(VIN = VOUT(NOM) - 0.1V)
ICL
IGND
ISHDN
IFB
Output current limit
Ground pin current
Shutdown current (IGND
VOUT = 0.9 × VOUT(NOM)
500µA ≤ IOUT ≤ 200mA
EN ≤ 0.4V, 2.7V ≤ VIN ≤ 6.5V
200
-0.5
400
40
600
60
mA
µA
µA
µA
dB
dB
dB
dB
µVRMS
µVRMS
µs
)
V
0.15
1.0
0.5
Feedback pin current (TPS79901)
f = 100Hz
70
66
Power-supply rejection ratio
VIN = 3.85V, VOUT = 2.85V,
CNR = 0.01µF, IOUT = 100mA
f = 1kHz
PSRR
VN
f = 10kHz
51
f = 100kHz
CNR = 0.01µF
CNR = none
CNR = 0.001µF
CNR = 0.047µF
CNR = 0.01µF
CNR = none
38
29.5
263
45
Output noise voltage
BW = 10Hz – 100kHz, VOUT = 2.8V
Startup time
VOUT = 2.85V,
RL = 14Ω, COUT = 2.2µF
45
µs
TSTR
50
µs
50
µs
VEN(HI)
VEN(LO)
IEN(HI)
Enable high (enabled)
Enable low (shutdown)
Enable pin current, enabled
1.2
0
VIN
0.4
1.0
V
V
VEN = VIN = 6.5V
0.03
165
145
µA
°C
Shutdown, temperature increasing
Reset, temperature decreasing
TSD
TJ
Thermal shutdown temperature
°C
Operating junction temperature
Under voltage lockout
Hysteresis
-40
+125
2.50
°C
VIN rising
VIN falling
1.90
2.20
70
V
UVLO
mV
(1) Minimum VIN = VOUT + VDO or 2.7V, whichever is greater.
(2) VDO is not measured for devices with VOUT(NOM) < 2.8V because minimum VIN = 2.7V.
4
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
DEVICE INFORMATION
FUNCTIONAL BLOCK DIAGRAMS
IN
OUT
IN
OUT
Ω
400
Ω
400
µ
2
A
Ω
3.3M
Current
Limit
Current
Limit
Overshoot
Detect
Overshoot
Detect
Thermal
Shutdown
Thermal
Shutdown
EN
EN
UVLO
UVLO
Quickstart
500k
1.193V
Bandgap
1.193V
Bandgap
NR
FB
500k
GND
GND
Figure 1. Fixed Voltage Versions
Figure 2. Adjustable Voltage Versions
Table 1. PIN DESCRIPTIONS
TPS799xx
DESCRIPTION
NAME
DDC
YZU
C3
IN
1
2
Input supply.
Ground
GND
B2
Driving the enable pin (EN) high turns on the regulator. Driving this pin low puts the regulator into
shutdown mode. EN can be connected to IN if not used.
EN
NR
3
4
4
5
A1
A3
A3
C1
Fixed voltage versions only; connecting an external capacitor to this pin bypasses noise generated
by the internal bandgap. This allows output noise to be reduced to very low levels.
Adjustable version only; this is the input to the control loop error amplifier, and is used to set the
output voltage of the device.
FB
Output of the regulator. A small capacitor (total typical capacitance ≥ 2.0µF ceramic) is needed from
this pin to ground to assure stability.
OUT
5
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
TYPICAL CHARACTERISTICS
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
=
LOAD REGULATION
LINE REGULATION
28.50
21.38
14.25
7.13
0
1.0
0.8
0.6
0.4
0.2
0
IOUT = 100mA
T
= −40°C
J
T
= +25°C
J
T
= +25°C
J
T
= −40°C
J
−
−
−
−
−
0.2
0.4
0.6
0.8
1.0
−
7.13
T
= +125°C
J
T
= +85°C
−
14.25
21.38
28.50
J
T
= +125°C
T
= +85°C
J
J
−
−
2.5
3.5
4.5
5.5
6.5
7.5
0
50
100
150
200
VIN (V)
IOUT (mA)
Figure 3.
Figure 4.
OUTPUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS799285 DROPOUT VOLTAGE vs
OUTPUT CURRENT
2.0
1.5
1.0
0.5
0
200
180
160
140
120
100
80
T
= +125°C
J
T
= +85°C
J
IOUT = 1mA
IOUT = 100mA
−
−
−
−
0.5
1.0
1.5
2.0
T
J
= +25°C
J
IOUT = 200mA
60
40
T
= −40°C
20
0
0
50
100
150
200
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
(°C)
IOUT (mA)
T
J
Figure 5.
Figure 6.
TPS799285 DROPOUT VOLTAGE vs
JUNCTION TEMPERATURE
TPS79901 DROPOUT vs
INPUT VOLTAGE
110
100
90
80
70
60
50
40
30
20
10
0
200
180
160
140
120
100
80
IOUT = 200mA
IOUT = 200mA
IOUT = 100mA
60
40
20
IOUT = 1mA
0
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
2.5
3.0
3.5
4.0
4.5
5.0
5.5 6.0
6.5
7.0
VIN (V)
T
(°C)
J
Figure 7.
Figure 8.
6
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
=
GROUND PIN CURRENT vs
INPUT VOLTAGE
TPS799285 GROUND PIN CURRENT vs
JUNCTION TEMPERATURE
60
50
40
30
20
10
0
60
50
40
30
20
10
0
VIN = 3.2V
VIN = 5.0V
IOUT = 200mA
I
= 500µA
OUT
VIN = 2.7V
(dropout)
VOUT = 2.85V
IOUT = 200mA
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
(°C)
VIN (V)
T
J
Figure 9.
Figure 10.
GROUND PIN CURRENT (DISABLED) vs
JUNCTION TEMPERATURE
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
90
80
70
60
50
40
30
20
10
0
600
500
400
300
200
100
0
VEN = 0.4V
IOUT = 100mA
IOUT = 1mA
IOUT = 200mA
VIN = 6.5V
VIN = 3.2V
µ
CNR = 0.01 F
µ
COUT = 2.2
F
10 100
1k
10k
100k
1M
10M
−
−
−
40 25 15
5
20 35 50 65 80 95 110 125
Frequency (Hz)
T
(°C)
J
Figure 11.
Figure 12.
7
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
=
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.5V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.25V)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
IOUT = 100mA
IOUT = 1mA
IOUT = 1mA
IOUT = 200mA
IOUT = 100mA
IOUT = 200mA
100k
µ
CNR = 0.01 F
µ
CNR = 0.01 F
µ
COUT = 2.2
F
µ
COUT = 2.2 F
10 100
1k
10k
1M
10M
10 100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 13.
Figure 14.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 0.25V)
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
IOUT = 1mA
IOUT = 1mA
IOUT = 200mA
IOUT = 200mA
µ
CNR = 0.01 F
µ
CNR = 0.01 F
µ
COUT = 10.0
F
µ
COUT = 10.0
F
10 100
1k
10k
100k
1M
10M
10 100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 15.
Figure 16.
TPS799285 POWER-SUPPLY RIPPLE REJECTION vs
FREQUENCY (VIN- VOUT = 1.0V)
POWER-SUPPLY RIPPLE REJECTION vs
VIN - VOUT, IOUT = 1mA
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1kHz
1MHz
1kHz
IOUT = 1mA
100kHz
10kHz
IOUT = 200mA
µ
CNR = 0.01 F
COUT = 2.2 F
CNR = None
COUT = 10.0
µ
µ
F
10
100
1k
10k
100k
1M
10M
0.0
0.5 1.0
1.5
2.0
2.5
3.0
3.5
4.0
Frequency (Hz)
−
VIN VOUT (V)
Figure 17.
Figure 18.
8
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
=
POWER-SUPPLY RIPPLE REJECTION vs
VIN - VOUT, IOUT = 100mA
POWER-SUPPLY RIPPLE REJECTION vs
VIN- VOUT, IOUT = 200mA
90
80
70
60
50
40
30
20
10
0
90
80
70
60
50
40
30
20
10
0
0.1kHz
0.1kHz
1kHz
1kHz
10kHz
10kHz
100kHz
100kHz
1MHz
1MHz
2.5
µ
CNR = 0.01
µ
COUT = 2.2 F
F
µ
µ
CNR = 0.01
COUT = 2.2 F
F
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.5
1.0
1.5
2.0
3.0
3.5
4.0
−
−
VIN VOUT (V)
VIN VOUT (V)
Figure 19.
Figure 20.
TPS799285
TOTAL NOISE vs CNR
TPS799285
TOTAL NOISE vs COUT
200
180
160
140
120
100
80
35
30
25
20
15
10
5
IOUT = 1mA
µ
OUT = 2.2 F
C
60
40
IOUT = 1mA
20
µ
CNR = 0.01
F
0
0
0.01
0.1
1
10
0
5
10
COUT ( F)
15
20
25
CNR (nF)
µ
Figure 21.
Figure 22.
TPS799285
LINE TRANSIENT RESPONSE
TPS799285
LOAD TRANSIENT RESPONSE
VIN = 3.35V
µ
COUT = 2.2 F
IOUT = 150mA
100mV/div
100mV/div
IOUT
µ
COUT = 10
F
20mV/div
VOUT
µ
COUT = 10
F
IOUT
µ
COUT = 2.2
F
20mV/div
1V/div
VOUT
150mA
dVIN
dt
4.15V
µ
= 1V/
s
100mA/div
1mA
IOUT
3.15V
VIN
µ
20 s/div
µ
20 s/div
Figure 23.
Figure 24.
9
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
TYPICAL CHARACTERISTICS (continued)
Over operating temperature range (TJ=- 40°C to +125°C), VIN=VOUT(TYP) + 0.3V or 2.7V, whichever is greater; IOUT=1mA, VEN
VIN, COUT=2.2µF, CNR=0.01µF, unless otherwise noted. For TPS79901, VOUT=3.0V. Typical values are at TJ=+25°C.
=
TPS799285
TURN-ON RESPONSE (VEN = VIN
TPS799285
ENABLE RESPONSE
)
VIN = 3.85V
Ω,
RLOAD = 19
Ω
2.85k
Ω
RLOAD = 19
COUT = 2.2
VOUT
VOUT
µ
COUT = 2.2
F
µ
F
Ω,
RLOAD = 19
Ω
2.85k
µ
COUT = 10 F
Ω
RLOAD = 2.85k
µ
µ
F
COUT = 2.2 F, 10
1V/div
4V/div
1V/div
5V/div
3.85V
VIN
VEN
0V
µ
µ
10 s/div
10 s/div
Figure 25.
Figure 26.
TPS799285
POWER-UP / POWER-DOWN
7
6
5
4
3
2
1
0
Ω
RL = 19
VIN
VOUT
−
1
50ms/div
Figure 27.
10
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
APPLICATION INFORMATION
The TPS799xx family of LDO regulators combines the high performance required of many RF and precision
analog applications with ultra-low current consumption. High PSRR is provided by a high gain, high bandwidth
error loop with good supply rejection at very low headroom (VIN – VOUT). Fixed voltage versions provide a noise
reduction pin to bypass noise generated by the bandgap reference and to improve PSRR while a quick-start
circuit fast-charges this capacitor at startup for quick startup times. The combination of high performance and low
ground current also make the TPS799xx an excellent choice for portable applications. All versions have thermal
and over-current protection and are fully specified from –40°C to +125°C.
Figure 28 shows the basic circuit connections for fixed voltage models. Figure 29 gives the connections for the
adjustable output version (TPS79901). R1 and R2 can be calculated for any output voltage using the formula in
Figure 29. Sample resistor values for common output voltages are shown in Figure 29.
Optional input capacitor.
Optional input capacitor.
May improve source
impedance, noise, or PSRR.
May improve source
impedance, noise, or PSRR.
(R1 + R2)
R2
×
1.193
VOUT
=
VIN
VOUT
IN
OUT
TPS799xx
GND
VIN
VOUT
IN
OUT
FB
TPS799xx
µ
2.2
F
R1
R2
CFB
EN
NR
µ
2.2
F
Ceramic
EN
GND
Ceramic
VEN
Optional bypass capacitor
to reduce output noise
and increase PSRR.
VEN
Figure 28. Typical Application Circuit for
Fixed Voltage Versions
Figure 29. Typical Application Circuit for
Adjustable Voltage Version
Input and Output Capacitor Requirements
Although an input capacitor is not required for stability, it is good analog design practice to connect a 0.1µF to
1µF low ESR capacitor across the input supply near the regulator. This will counteract reactive input sources and
improve transient response, noise rejection, and ripple rejection. A higher-value capacitor may be necessary if
large, fast rise-time load transients are anticipated or the device is located several inches from the power source.
If source impedance is not sufficiently low, a 0.1µF input capacitor may be necessary to ensure stability.
The TPS799xx is designed to be stable with standard ceramic capacitors of values 2.2µF or larger. X5R and
X7R type capacitors are best as they have minimal variation in value and ESR over temperature. Maximum ESR
should be < 1.0Ω.
Feedback Capacitor Requirements (TPS79901 only)
The feedback capacitor, CFB, shown in Figure 29 is required for stability. For a parallel combination of R1 and R2
equal to 250kΩ, any value from 3pF to 1nF can be used. Fixed voltage versions have an internal 30pF feedback
capacitor which is quick-charged at start-up. The adjustable version does not have this quick-charge circuit, so
values below 5pF should be used to ensure fast startup; values above 47pF can be used to implement an output
voltage soft-start. Larger value capacitors also improve noise slightly. The TPS79901 is stable in unity-gain
configuration (OUT tied to FB) without CFB
.
11
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
Output Noise
In most LDOs, the bandgap is the dominant noise source. If a noise reduction capacitor (CNR) is used with the
TPS799xx, the bandgap does not contribute significantly to noise. Instead, noise is dominated by the output
resistor divider and the error amplifier input. To minimize noise in a given application, use a 0.01µF noise
reduction capacitor; for the adjustable version, smaller value resistors in the output resistor divider reduce noise.
A parallel combination that gives 2µA of divider current will have the same noise performance as a fixed voltage
version. To further optimize noise, equivalent series resistance of the output capacitor can be set to
approximately 0.2Ω. This configuration maximizes phase margin in the control loop, reducing total output noise
by up to 10%.
Noise can be referred to the feedback point (FB pin) such that with CNR = 0.01µF total noise is approximately
given by Equation 1:
10.7mVRMS
VN +
VOUT
V
(1)
The TPS79901 adjustable version does not have the noise-reduction pin available, so ultra-low noise operation is
not possible. Noise can be minimized according to the above recommendations.
Board Layout Recommendations to Improve PSRR and Noise Performance
To improve ac performance such as PSRR, output noise, and transient response, it is recommended that the
board be designed with separate ground planes for VIN and VOUT, with each ground plane connected only at the
GND pin of the device. In addition, the ground connection for the bypass capacitor should connect directly to the
GND pin of the device.
Internal Current Limit
The TPS799xx internal current limit helps protect the regulator during fault conditions. During current limit, the
output will source a fixed amount of current that is largely independent of output voltage. For reliable operation,
the device should not be operated in current limit for extended periods of time.
The PMOS pass element in the TPS799xx has a built-in body diode that conducts current when the voltage at
OUT exceeds the voltage at IN. This current is not limited, so if extended reverse voltage operation is
anticipated, external limiting may be appropriate.
Shutdown
The enable pin (EN) is active high and is compatible with standard and low voltage TTL-CMOS levels. When
shutdown capability is not required, EN can be connected to IN.
Dropout Voltage
The TPS799xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout
voltage (VDO), the PMOS pass device is in its linear region of operation and the input-to-output resistance is the
RDS,ON of the PMOS pass element. Because the PMOS device behaves like a resistor in dropout, VDO will
approximately scale with output current.
As with any linear regulator, PSRR and transient response are degraded as (VIN – VOUT) approaches dropout.
This effect is shown in Figure 18 through Figure 20 in the Typical Characteristics section.
Startup
Fixed voltage versions of the TPS799xx use a quick-start circuit to fast-charge the noise reduction capacitor,
CNR, if present (see Functional Block Diagrams, Figure 1). This allows the combination of very low output noise
and fast start-up times. The NR pin is high impedance so a low leakage CNR capacitor must be used; most
ceramic capacitors are appropriate in this configuration.
Note that for fastest startup, VIN should be applied first, then the enable pin (EN) driven high. If EN is tied to IN,
startup will be somewhat slower. Refer to Figure 25 and Figure 26 in the Typical Characteristics section. The
quick-start switch is closed for approximately 135µs. To ensure that CNR is fully charged during the quick-start
time, a 0.01µF or smaller capacitor should be used.
12
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
Transient Response
As with any regulator, increasing the size of the output capacitor will reduce over/undershoot magnitude but
increase duration of the transient response. In the adjustable version, adding CFB between OUT and FB will
improve stability and transient response. The transient response of the TPS799xx is enhanced by an active
pull-down that engages when the output overshoots by approximately 5% or more when the device is enabled.
When enabled, the pull-down device behaves like a 350Ω resistor to ground.
Under-Voltage Lock-Out (UVLO)
The TPS799xx utilizes an under-voltage lock-out circuit to keep the output shut off until internal circuitry is
operating properly. The UVLO circuit has a de-glitch feature so that it will typically ignore undershoot transients
on the input if they are less than 50µs duration.
Minimum Load
The TPS799xx is stable and well-behaved with no output load. To meet the specified accuracy, a minimum load
of 500µA is required. Below 500µA at junction temperatures near +125°C, the output can drift up enough to
cause the output pull-down to turn on. The output pull-down will limit voltage drift to 5% typically but ground
current could increase by approximately 50µA. In typical applications, the junction cannot reach high
temperatures at light loads since there is no appreciable dissipated power. The specified ground current would
then be valid at no load in most applications.
Thermal Information
Thermal Protection
Thermal protection disables the output when the junction temperature rises to approximately +165°C, allowing
the device to cool. When the junction temperature cools to approximately +145°C the output circuitry is again
enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection
circuit may cycle on and off. This cycling limits the dissipation of the regulator, protecting it from damage due to
overheating.
Any tendency to activate the thermal protection circuit indicates excessive power dissipation or an inadequate
heatsink. For reliable operation, junction temperature should be limited to +125°C maximum. To estimate the
margin of safety in a complete design (including heatsink), increase the ambient temperature until the thermal
protection is triggered; use worst-case loads and signal conditions. For good reliability, thermal protection should
trigger at least +35°C above the maximum expected ambient condition of your particular application. This
configuration produces a worst-case junction temperature of +125°C at the highest expected ambient
temperature and worst-case load.
The internal protection circuitry of the TPS799xx has been designed to protect against overload conditions. It
was not intended to replace proper heatsinking. Continuously running the TPS799xx into thermal shutdown will
degrade device reliability.
Power Dissipation
The ability to remove heat from the die is different for each package type, presenting different considerations in
the PCB layout. The PCB area around the device that is free of other components moves the head from the
device to the ambient air. Performance data for JEDEC low- and high-K boards are given in the Dissipation
Ratings table. Using heavier copper will increase the effectiveness in removing heat from the device. The
addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.
Power dissipation depends on input voltage and load conditions. Power dissipation is equal to the product of the
output current time the voltage drop across the output pass element, as shown in Equation 2:
ǒ
Ǔ
PD + VIN*VOUT @ IOUT
(2)
Package Mounting
Solder pad footprint recommendations for the TPS799xx are available from the Texas Instruments' web site at
www.ti.com.
13
TPS79901, TPS79915, TPS79916, TPS79918
TPS79925, TPS79927, TPS79928, TPS799285
TPS79929, TPS79930, TPS79932, TPS79933
www.ti.com
SBVS056C–JANUARY 2005–REVISED MAY 2005
Thermal Information (continued)
1,052
0,952
1,416
1,316
Pin A1 Index Area
0,35
0,25
0,625 Max
0,30
0,20
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. NanoStar package configuration.
NanoStar is a trademark of Texas Instruments.
Figure 30. YZU Wafer Chip-Scale Preliminary Package Dimensions (mm)
14
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
HPA00086DDCR
TPS79901DDCR
ACTIVE
ACTIVE
TO/SOT
TO/SOT
DDC
5
5
3000
TBD
Call TI
Call TI
DDC
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79901DDCRG4
TPS79901DDCT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
DDC
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79901DDCTG4
TPS79915DDCR
TPS79915DDCRG4
TPS79915DDCT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79915DDCTG4
TPS79918DDCR
TPS79918DDCRG4
TPS79918DDCT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79918DDCTG4
TPS79925DDCR
TPS79925DDCRG4
TPS79925DDCT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79925DDCTG4
TPS799285DDCR
TPS799285DDCRG4
TPS799285DDCT
TPS799285DDCTG4
TPS79928DDCR
TPS79928DDCRG4
TPS79928DDCT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79928DDCTG4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-Jul-2005
Orderable Device
TPS79930DDCR
TPS79930DDCRG4
TPS79930DDCT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TO/SOT
DDC
5
5
5
5
5
5
5
5
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
TO/SOT
DDC
DDC
DDC
DDC
DDC
DDC
DDC
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79930DDCTG4
TPS79933DDCR
TPS79933DDCRG4
TPS79933DDCT
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TPS79933DDCTG4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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Applications
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Amplifiers
amplifier.ti.com
www.ti.com/audio
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dataconverter.ti.com
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dsp.ti.com
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Digital Control
Military
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/military
Interface
Logic
interface.ti.com
logic.ti.com
Power Mgmt
Microcontrollers
power.ti.com
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www.ti.com/opticalnetwork
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microcontroller.ti.com
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Copyright 2005, Texas Instruments Incorporated
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TPS79933DRVT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS79933DRVTG4
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS79933QDDCRQ1
200 mA, LOW QUIESCENT CURRENT, ULTRA-LOW NOISE HIGH PSRR, LOW DROPOUT, LINEAR REGULATORSWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS79933YZUR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS79933YZUT
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TPS79942DDCR
200mA, Low Quiescent Current, Ultra-Low Noise, High PSRR Low Dropout Linear RegulatorWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
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