TPS826721 [TI]
采用 MicroSiP™ 封装的 600mA 完全集成式低噪声降压转换器模块;
| 型号： | TPS826721 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 采用 MicroSiP™ 封装的 600mA 完全集成式低噪声降压转换器模块 转换器 |
| 文件： | 总31页 (文件大小：5800K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Sample &
Buy
Support &
Community
Product
Folder
Tools &
Software
Technical
Documents
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
TPS8267x 600-mA, High-Efficiency MicroSiP™ Step-Down Converter (Profile <1.0mm)
1 Features
3 Description
The TPS8267x device is a complete 600mA, DC/DC
step-down power supply intended for low-power
applications. Included in the package are the
switching regulator, inductor and input/output
capacitors. No additional components are required to
finish the design.
1
•
•
•
•
•
•
•
•
•
•
•
•
90% Efficiency at 5.5 MHz Operation
17μA Quiescent Current
Wide VIN Range From 2.3 V to 4.8 V
5.5MHz Regulated Frequency Operation
Spread Spectrum, PWM Frequency Dithering
Best in Class Load and Line Transient
±2% Total DC Voltage Accuracy
The TPS8267x is based on
synchronous step-down dc-dc converter optimized for
battery-powered portable applications. The
MicroSiP™ DC/DC converter operates at a regulated
5.5-MHz switching frequency and enters the power-
save mode operation at light load currents to maintain
high efficiency over the entire load current range.
a high-frequency
Automatic PFM/PWM Mode Switching
Low Ripple Light-Load PFM Mode
≥35dB VIN PSRR (1kHz to 10kHz)
Internal Soft Start, 120-µs Start-Up Time
The PFM mode extends the battery life by reducing
the quiescent current to 17μA (typ) during light load
operation. For noise-sensitive applications, the device
has PWM spread spectrum capability providing a
lower noise regulated output, as well as low noise at
the input. These features, combined with high PSRR
and AC load regulation performance, make this
device suitable to replace a linear regulator to obtain
better power conversion efficiency.
Integrated Active Power-Down Sequencing
(Optional)
•
Current Overload and Thermal Shutdown
Protection
•
•
Sub 1-mm Profile Solution
Total Solution Size <6.7 mm2
2 Applications
The TPS8267x is packaged in a compact (2.3mm x
2.9mm) and low profile (1.0mm) BGA package
suitable for automated assembly by standard surface
mount equipment.
•
•
•
•
Cell Phones, Smart-Phones
Camera Module, Optical Data Module
Wearable Electronics
Digital TV, WLAN, GPS and Bluetooth™
Applications
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
•
POL Applications
TPS8267x
µSIP (8)
2.30 x 2.90 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
spacer
spacer
Efficiency vs Output Current
250
225
200
100
90
VI = 3.6 V,
VO = 1.8 V
TPS82671SIP
80
Efficiency
PFM/PWM Operation
DC/DC Converter
175
150
L
70
60
V
V
IN
2.3 V .. 4.8 V
OUT
1.8 V @ 600mA
SW
VIN
CO
CI
125
100
50
40
30
20
10
0
FB
GND
EN
MODE
SELECTION
ENABLE
MODE
75
50
25
Power Loss
PFM/PWM Operation
GND
Copyright © 2016, Texas Instruments Incorporated
0
0.1
1
10
100
1000
I
- Load Current - mA
O
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION
DATA.
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
Table of Contents
9.4 Device Functional Modes........................................ 12
10 Applications and Implementation...................... 13
10.1 Application Information.......................................... 13
10.2 Typical Application ............................................... 13
11 Power Supply Recommendations ..................... 20
12 Layout................................................................... 21
12.1 Layout Guidelines ................................................. 21
12.2 Layout Example .................................................... 21
12.3 Surface Mount Information ................................... 21
13 Device and Documentation Support ................. 22
13.1 Documentation Support ........................................ 22
13.2 Related Links ........................................................ 22
13.3 Community Resources.......................................... 22
13.4 Trademarks........................................................... 22
13.5 Electrostatic Discharge Caution............................ 22
13.6 Glossary................................................................ 23
1
2
3
4
5
6
7
8
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Simplified Schematic............................................. 1
Revision History..................................................... 2
Device Comparison Table..................................... 4
Pin Configuration and Functions......................... 5
Specifications......................................................... 5
8.1 Absolute Maximum Ratings ...................................... 5
8.2 ESD Ratings.............................................................. 6
8.3 Recommended Operating Conditions....................... 6
8.4 Thermal Information.................................................. 6
8.5 Electrical Characteristics........................................... 6
8.6 Typical Characteristics.............................................. 8
Detailed Description .............................................. 9
9.1 Overview ................................................................... 9
9.2 Functional Block Diagram ......................................... 9
9.3 Feature Description................................................. 10
9
14 Mechanical, Packaging, and Orderable
Information ........................................................... 23
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (November 2014) to Revision J
Page
•
•
•
Added TPS8267195 part number to data sheet .................................................................................................................... 1
Added TPS8267195 to Electrical Characteristics table ......................................................................................................... 7
Changed Layout Example figure, Note 4 value from "...less than 0.5 mm.." to "...less than 0.5 µm.." ............................... 21
Changes from Revision H (October 2014) to Revision I
Page
•
•
•
Moved Tstg spec to Absolute Maximum Ratings table for clarification .................................................................................. 5
Changed Handling Ratings to ESD Ratings and replaced MIN/MAX values with ± VALUE for clarification ........................ 6
Added TPS826716 data and removed Product Preview note. .............................................................................................. 7
Changes from Revision G (September 2014) to Revision H
Page
•
Added TPS826716 to Device Comparison Table as Product Preview. ................................................................................. 4
Changes from Revision F (November 2012) to Revision G
Page
•
Added Device Information and Handling Rating tables, Feature Description section, Device Functional Modes,
Application and Implementation section, Power Supply Recommendations section, Layout section, Device and
Documentation Support section, and Mechanical, Packaging, and Orderable Information section. .................................... 1
•
Added device TPS826721 ..................................................................................................................................................... 4
Changes from Revision E (October 2012) to Revision F
Page
•
Added TPS826745 to Header ................................................................................................................................................ 1
2
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Changes from Revision D (April 2012) to Revision E
Page
•
Added TPS826765 to Header ................................................................................................................................................ 1
Changes from Revision C (November 2011) to Revision D
Page
•
Added devices TPS82670, TPS82673, and TPS82674 to Header ....................................................................................... 1
Changes from Revision B (August 2011) to Revision C
Page
•
Added device TPS82672 to Header info................................................................................................................................ 1
Changes from Revision A (April 2011) to Revision B
Page
•
Added TPS82676 part number to data sheet header ........................................................................................................... 1
Changes from Original (October 2010) to Revision A
Page
•
•
Added devices TPS82677 and TPS82678 to Header info ..................................................................................................... 1
Added copyright attribution for spectrum illustrations........................................................................................................... 11
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
6 Device Comparison Table
(1)
PART NUMBER
OUTPUT VOLTAGE
DEVICE SPECIFIC FEATURE
PACKAGE MARKING
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82670
1.86V
YK
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS82671
1.8V
1.8V
RA
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826711
YW
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS826716
TPS82672
TPS826721
1.6V
1.5V
2.1V
GS
WD
EO
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS82673
TPS82674
1.26V
1.2V
YL
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
SW
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826745
TPS82675
TPS82676
1.225V
1.2V
B5
RB
TU
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
1.1V
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
Output Capacitor Discharge
TPS826765
1.05V
AN
TPS82677
1.2V
Output Capacitor Discharge
SK
4A
PWM Spread Spectrum Modulation
Low PFM Output Ripple Voltage
TPS8267195
1.95V
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com
4
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
7 Pin Configuration and Functions
space
SIP-8
(TOP VIEW)
SIP-8
(BOTTOM VIEW)
A1
B1
C1
A2
B2
C2
A3
A3
A2
B2
C2
A1
B1
C1
VOUT
MODE
GND
VIN
EN
VIN
EN
VOUT
MODE
GND
C3
C3
GND
GND
space
Pin Functions
PIN
I/O
DESCRIPTION
NAME
NO.
A1
VOUT
VIN
O
I
Power output pin. Apply output load between this pin and GND.
The VIN pins supply current to the TPS8267x internal regulator.
A2, A3
This is the enable pin of the device. Connect this pin to ground to force the converter into
shutdown mode. Pull this pin to VI to enable the device. This pin must not be left floating and
must be terminated.
EN
B2
I
This is the mode selection pin of the device. This pin must not be left floating and must be
terminated.
MODE = LOW: The device is operating in regulated frequency pulse width modulation mode
(PWM) at high-load currents and in pulse frequency modulation mode (PFM) at light load
currents.
MODE
GND
B1
I
MODE = HIGH: Low-noise mode is enabled and regulated frequency PWM operation is forced.
Ground pin.
C1, C2, C3
–
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
–0.3
-0.3
–0.3
MAX UNIT
Voltage at VIN(3)
Voltage at VIN (TPS826721)(3)
6
V
5.5
(2)
VI
Voltage at VOUT
3.6
V
V
Voltage at EN, MODE
–0.3 VIN + 0.3
Internally limited
Power dissipation
TA
TINT (max) Maximum internal operating temperature
Tstg Storage temperature
Operating temperature range(4)
–40
85 °C
125 °C
125 °C
–55
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Operation above 4.8V input voltage for extended periods may affect device reliability.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating temperature (TINT(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (RθJA), as given by the following equation: TA(max)= TJ(max)–(RθJA X PD(max)). To achieve optimum performance, it is
recommended to operate the device with a maximum internal temperature of 105°C.
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
8.2 ESD Ratings
VALUE
±2000
±1000
±200
UNIT
V
Human body model (HBM) ESD stress voltage(2)
Charge device model (CDM) ESD stress voltage(3)
Machine model (MM) ESD stress voltage(4)
(1)
VESD
V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in
to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows
safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe
manufacturing with a standard ESD control process.
(4) The machine model is a 200-pF capacitor discharged directly into each pin.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN
IO
Input voltage range
Output current range
2.3
0
4.8(1)
V
TPS82671 to TPS826765
600
mA
TPS82670 to TPS82676
TPS826711, TPS826716,
TPS826721, TPS826765,
TPS8267195
0
2.5
µF
Additional output capacitance (PFM/PWM operation)(2)
TPS82677
0
0
4
7
µF
µF
°C
°C
Additional output capacitance (PWM operation)(2)
Ambient temperature
TA
TJ
–40
–40
+85
+125
Operating junction temperature
(1) Operation above 4.8V input voltage for extended periods may affect device reliability.
(2) In certain applications larger capacitor values can be tolerable, see Output Capacitor Selection section for more details.
8.4 Thermal Information
TPS8267x
THERMAL METRIC(1)
SIP
UNIT
8 PINS
RθJA
Junction-to-ambient (top) thermal resistance
Junction-to-ambient (bottom) thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
125
70
-
RθJCtop
RθJB
-
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
-
ψJB
-
RθJCbot
-
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.5 Electrical Characteristics
Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C;
Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT
1.8V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted).
=
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
SUPPLY CURRENT
IO = 0mA. Device not switching
17
5.8
40
μA
mA
μA
IQ
Operating quiescent current
Shutdown current
IO = 0mA. PWM operation
EN = GND
ISD
0.5
5
2.14
2.1
TPS8267195 only
all other versions
2.08
2.05
UVLO
Undervoltage lockout threshold
V
6
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Electrical Characteristics (continued)
Minimum and maximum values are at VIN = 2.3V to 5.5V, VOUT = 1.8V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C;
Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VIN = 3.6V, VOUT
1.8V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted).
=
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
PROTECTION
°C
°C
Thermal shutdown
140
10
Thermal shutdown hysteresis
Peak Input Current Limit
ILIM
ISC
1100
mA
Input current limit under short-circuit
conditions
VO shorted to ground
13.5
mA
ENABLE, MODE
VIH
VIL
Ilkg
High-level input voltage
1.0
4.9
V
Low-level input voltage
Input leakage current
0.4
1.5
V
Input connected to GND or VIN
IO = 0mA. PWM operation
0.01
5.45
μA
OSCILLATOR
fSW
Oscillator frequency
6.0
MHz
OUTPUT
TPS82670
TPS82671
TPS826711
TPS826716
TPS82672
TPS826721
TPS82673
TPS82674
TPS826745
TPS82675
TPS82676
TPS826765
2.5V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
0.98×VNOM
0.98×VNOM
VNOM
VNOM
1.03×VNOM
1.04×VNOM
V
V
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PWM operation
0.98×VNOM
VNOM
1.02×VNOM
V
Regulated DC
output voltage
VOUT
2.5V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
0.975×VNOM
0.975×VNOM
0.975×VNOM
0.98×VNOM
0.98×VNOM
VNOM 1.035×VNOM
VNOM 1.045×VNOM
VNOM 1.025×VNOM
V
V
V
V
V
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
TPS8267195
TPS82677
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PWM operation
2.5V ≤ VI ≤ 4.8V, 0mA ≤ IO ≤ 600 mA
PFM/PWM operation
VNOM
VNOM
1.04×VNOM
1.02×VNOM
2.5V ≤ VI ≤ 5.5V, 0mA ≤ IO ≤ 600 mA
PWM operation
Line regulation
Load regulation
VI = VO + 0.5V (min 2.5V) to 5.5V, IO = 200 mA
IO = 0mA to 600 mA. PWM operation
0.23
–0.00085
480
%/V
%/mA
kΩ
Feedback input resistance
TPS82671
IO = 1mA, VO = 1.8V
19
mVPP
TPS826711
TPS826716 IO = 1mA, VO = 1.6V
TPS826721 IO = 1mA, VO = 2.1V
TPS82673
19
19
mVPP
mVPP
Power-save mode
ripple voltage
ΔVO
TPS82674
IO = 1mA, VO = 1.2V
TPS826745
16
mVPP
TPS82675
TPS82676
IO = 1mA, VO = 1.1V
16
16
25
mVPP
mVPP
mVPP
TPS826765 IO = 1mA, VO = 1.05V
TPS82677
IO = 1mA, VO = 1.2V
TPS82671
TPS826711
Start-up time
IO = 0mA, Time from active EN to VO
120
70
μs
Discharge resistor
for power-down
sequence
rDIS
Devices featuring active discharge
150
Ω
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
8.6 Typical Characteristics
6
5.5
5
28
26
24
22
20
18
16
14
12
10
8
IO = 150 mA
T
= 85°C
A
T
= 25°C
A
IO = 300 mA
IO = 400 mA
4.5
4
IO = 500 mA
T
= -40°C
A
3.5
3
6
4
2
2.5
0
2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5
VI - Input Voltage - V
2.7
3
3.3
V
3.6
3.9
- Input Voltage - V
4.2
4.5
4.8
I
VO = 1.8 V
Figure 2. PWM Switching Frequency vs. Input Voltage
Figure 1. Quiescent Current vs. Input Voltage
85
5 m
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
I
= 10 mA
O
PFM Operation
4.5 m
5 m
I
= 150 mA
O
PWM Operation
3.5 m
3 m
2.5 m
2 m
V
= 2.7 V
I
I
= 400 mA
O
PWM Operation
V
V
= 4.2 V
= 3.6 V
I
1.5 m
1 m
I
500 m
5
0
0.01
50 n
0.1
1
10
f - Frequency - kHz
100
1000
0
Span = 1 MHz
10
f - Frequency - MHz
VI = 3.6 V
VO = 1.8 V
(TPS82671)
VO = 1.8 V
RL = 150 Ω
(TPS82671)
Figure 3. Power Supply Rejection Ratio vs. Frequency
Figure 4. Spurious Output Noise (PFM Mode) vs. Frequency
500 m
450 m
400 m
10
1
V
= 4.2 V
350 m
300 m
250 m
200 m
150 m
100 m
I
IOUT = 10 mA (PFM Mode)
0.1
V
= 2.7 V
I
IOUT = 150 mA (PWM Mode)
0.01
V
= 3.6 V
I
50 m
5 n
0
0.001
Span = 4 MHz
40
0.1
1
10
f - Frequency - kHz
100
1000
f - Frequency - MHz
VI = 3.6 V
VO = 1.8 V
(TPS82671)
VO = 1.8 V
RL = 12 Ω
(TPS82671)
Figure 6. Output Spectral Noise Density vs. Frequency
Figure 5. Spurious Output Noise (PWM Mode) vs. Frequency
8
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
9 Detailed Description
9.1 Overview
The TPS8267x is a stand-alone, synchronous, step-down converter. The converter operates at a regulated 5.5-
MHz frequency pulse width modulation (PWM) at moderate to heavy load currents. At light load currents, the
TPS8267x converter operates in power-save mode with pulse frequency modulation (PFM).
The converter uses a unique frequency-locked ring-oscillating modulator to achieve best-in-class load and line
response. One key advantage of the non-linear architecture is that there is no traditional feed-back loop. The
loop response to change in VO is essentially instantaneous, which explains the transient response. Although this
type of operation normally results in a switching frequency that varies with input voltage and load current, an
internal frequency lock loop (FLL) holds the switching frequency constant over a large range of operating
conditions.
Combined with best-in-class load and line-transient response characteristics, the low quiescent current of the
device (approximately 17μA) helps to maintain high efficiency at light load while that current preserves a fast
transient response for applications that require tight output regulation.
The TPS8267x integrates an input current limit to protect the device against heavy load or short circuits and
features an undervoltage lockout circuit to prevent the device from misoperation at low input voltages. Fully
functional operation is permitted down to 2.1V input voltage.
9.2 Functional Block Diagram
MODE
EN
VIN
CI
2.2 µF
DC/DC CONVERTER
Undervoltage
Lockout
Bias Supply
VIN
Soft-Start
Negative Inductor
Current Detect
Bandgap
VREF = 0.8 V
Power Save Mode
Switching
Current Limit
Detect
Thermal
Shutdown
Frequency
Control
R
1
–
L
Gate Driver
VOUT
Anti-
Shoot Through
1µH
R
VREF
2
CO
+
4.7 µF
Feedback Divider
GND
Copyright © 2016, Texas Instruments Incorporated
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
9.3 Feature Description
9.3.1 Power-Save Mode
www.ti.com
If the load current decreases, the converter enters power-save mode automatically. During power-save mode,
the converter operates in discontinuous current, (DCM) single-pulse PFM mode, which produces a low output
ripple compared with other PFM architectures.
When in power-save mode, the converter resumes its operation when the output voltage falls below the nominal
voltage. The converter ramps up the output voltage with a minimum of one pulse and goes into power-save
mode when the output voltage is within its regulation limits.
The IC exits PFM mode and enters PWM mode when the output current can no longer be supported in PFM
mode. As a consequence, the DC output voltage is typically positioned approximately 0.5% above the nominal
output voltage. The transition between PFM and PWM is seamless.
PFM Mode at Light Load
PFM Ripple
Nominal DC Output Voltage
PWM Mode at Heavy Load
Figure 7. Operation In PFM Mode And Transfer To PWM Mode
9.3.2 Mode Selection
The MODE pin selects the operating mode of the device. Connecting the MODE pin to GND enables the
automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at
moderate to heavy loads, and operates in PFM mode during light loads. This type of operation maintains high
efficiency over a wide load current range.
Pulling the MODE pin high forces the converter to operate in PWM mode even at light-load currents. The
advantage is that the converter modulates its switching frequency according to a spread spectrum PWM
modulation technique that allows simple filtering of the switching harmonics in noise-sensitive applications. In this
mode, the efficiency is lower when compared to the power-save mode during light loads.
For additional flexibility, it is possible to switch from power-save mode to PWM mode during operation. This type
of operation allows efficient power management by adjusting the operation of the converter to the specific system
requirements.
9.3.3 Spread Spectrum, PWM Frequency Dithering
The goal of spread spectrum architecture is to spread out the emitted RF energy over a larger frequency range
so that any resulting electromagnetic interference (EMI) is similar to white noise. The end result is a spectrum
that is continuous and lower in peak amplitude. Spread spectrum makes it easier to comply with EMI standards.
It also makes it easier to comply with the power supply ripple requirements in cellular and non-cellular wireless
applications. Radio receivers are typically susceptible to narrowband noise that is focused on specific
frequencies.
Switching regulators can be particularly troublesome in applications where electromagnetic interference (EMI) is
a concern. Switching regulators operate on a cycle-by-cycle basis to transfer power to an output. In most cases,
the frequency of operation is either fixed or regulated, based on the output load. This method of conversion
creates large components of noise at the frequency of operation (fundamental) and multiples of the operating
frequency (harmonics).
10
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Feature Description (continued)
The spread spectrum architecture varies the switching frequency by approximately ±10% of the nominal
switching frequency, thereby significantly reduces the peak radiated and conducting noise on both the input and
output supplies. The frequency dithering scheme is modulated with a triangle profile and a modulation frequency
fm.
0 dBV
F
Dfc
ENV,PEAK
Dfc
Non-modulated harmonic
F
1
Side-band harmonics
window after modulation
0 dBVref
B = 2×fm ×(1+ mf )= 2×(Dfc + fm )
Bh = 2×fm ×(1+ mf ×h)
B = 2×fm ×(1+ mf )= 2×(Dfc + fm )
Figure 8. Spectrum Of A Frequency Modulated Sin.
Wave With Sinusoidal Variation In Time
Figure 9. Spread Bands Of Harmonics In
(1)
Modulated Square Signals
Figure 8 and Figure 9 show that after modulation the sideband harmonic is attenuated when compared to the
non-modulated harmonic, and when the harmonic energy is spread into a certain frequency band. The higher the
modulation index (mf) the larger the attenuation.
δ ´ ƒc
mƒ
=
ƒm
(1)
With:
fc is the carrier frequency (i.e. nominal switching frequency)
fm is the modulating frequency (approx. 0.016*fc)
δ is the modulation ratio (approx 0.1)
Dƒc
d =
ƒc
(2)
The maximum switching frequency is limited by the process and by the parameter modulation ratio (δ), together
with fm, which is the bandwidth of the side-band harmonics around the carrier frequency fc. The bandwidth of a
frequency modulated waveform is approximately given by the Carson’s rule and can be summarized as:
B = 2 ´ ¦m ´ 1 + m = 2 ´ D¦ + ¦m
(
)
(
)
¦
c
(3)
fm < RBW: The receiver is not able to distinguish individual side-band harmonics; so, several harmonics are
added in the input filter and the measured value is higher than expected in theoretical calculations.
fm > RBW: The receiver is able to properly measure each individual side-band harmonic separately, so that the
measurements match the theoretical calculations.
(1) Spectrum illustrations and formulae (Figure 8 and Figure 9) copyright IEEE TRANSACTIONS ON ELECTROMAGNETIC
COMPATIBILITY, VOL. 47, NO.3, AUGUST 2005. See References Section for full citation.
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
9.4 Device Functional Modes
9.4.1 Enable
www.ti.com
The TPS8267x device starts operation when EN is set high and starts up with the soft start as previously
described. For proper operation, the EN pin must be terminated and must not be left floating.
Pulling the EN pin low forces the device into shutdown. In this mode, all internal circuits are turned off and the
VIN current reduces to the device leakage current, which is typically a few hundred nanoamps.
The TPS8267x device can actively discharge the output capacitor when it turns off. The integrated discharge
resistor has a typical resistance of 100 Ω. The required time to ramp down the output voltage depends on the
load current and the capacitance present at the output node.
9.4.2 Soft Start
The TPS8267x has an internal soft-start circuit that limits the in-rush current during start-up. This circuit limits
input voltage drop when a battery or a high-impedance power source is connected to the input of the MicroSiP™
DC/DC converter.
The soft-start system progressively increases the switching on-time from a minimum pulse-width of 35ns as a
function of the output voltage. This mode of operation continues for approximately 100μs after the enable. If the
output voltage does not reach its target value within the soft-start time, the soft-start transitions to a second mode
of operation.
If the output voltage rises above approximately 0.5V, the converter increases the input current limit and thus
enables the power supply to come up properly. The start-up time mainly depends on the capacitance present at
the output node and the load current.
12
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
10 Applications and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
10.1 Application Information
The TPS8267x devices are complete power supply modules, not needing further external devices. The devices
are optimized to work best with the components populated. However application conditions might demand for
different input and/or output capacitance values.
10.2 Typical Application
TPS8267XSIP
DC/DC Converter
L
V
V
OUT
SW
VIN
IN
CI
CO
FB
GND
EN
MODE
SELECTION
ENABLE
MODE
GND
Copyright © 2016, Texas Instruments Incorporated
Figure 10. MicroSIP Converter Module Schematic
10.2.1 Design Requirements
For applications requiring additional input and/or output capacitance, the following procedures should be
considered. For the maximum recommended values see Recommended Operating Conditions.
10.2.2 Detailed Design Procedure
10.2.2.1 Input Capacitor Selection
Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to
prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the
system.
For most applications, the input capacitor that is integrated into the TPS8267x should be sufficient. If the
application exhibits a noisy or erratic switching frequency, experiment with additional input ceramic capacitance
to find a remedy.
The TPS8267x uses a tiny ceramic input capacitor. When a ceramic capacitor is combined with trace or cable
inductance, such as from a wall adapter, a load step at the output can induce ringing at the VIN pin. This ringing
can couple to the output and be mistaken as loop instability or can even damage the part. In this circumstance,
additional "bulk" capacitance, such as electrolytic or tantalum, should be placed between the input of the
converter and the power source lead to reduce ringing that can occur between the inductance of the power
source leads and CI.
10.2.2.2 Output Capacitor Selection
The advanced, fast-response, voltage mode, control scheme of the TPS8267x allows the use of a tiny ceramic
output capacitor (CO). For most applications, the output capacitor integrated in the TPS8267x is sufficient.
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
Typical Application (continued)
At nominal load current, the device operates in PWM mode; the overall output voltage ripple is the sum of the
voltage step that is caused by the output capacitor ESL and the ripple current that flows through the output
capacitor impedance. At light loads, the output capacitor limits the output ripple voltage and provides holdup
during large load transitions.
The TPS8267x is designed as a Point-Of-Load (POL) regulator, to operate stand-alone without requiring any
additional capacitance. Adding a 2.2μF ceramic output capacitor (X7R or X5R dielectric) generally works from a
converter stability point of view, but does not necessarily help to minimize the output ripple voltage.
For best operation (i.e. optimum efficiency over the entire load current range, proper PFM/PWM auto transition),
the TPS8267xSIP requires a minimum output ripple voltage in PFM mode. The typical output voltage ripple is ca.
1% of the nominal output voltage VO. The PFM pulses are time controlled resulting in a PFM output voltage
ripple and PFM frequency that depends (first order) on the capacitance seen at the MicroSiPTM DC/DC
converter's output.
In applications requiring additional output bypass capacitors located close to the load, care should be taken to
ensure proper operation. If the converter exhibits marginal stability or erratic switching frequency, experiment
with additional low value series resistance (e.g. 50 to 100mΩ) in the output path to find a remedy.
Because the damping factor in the output path is directly related to several resistive parameters (e.g. inductor
DCR, power-stage rDS(on), PWB DC resistance, load switches rDS(on) …) that are temperature dependant, the
converter small and large signal behavior must be checked over the input voltage range, load current range and
temperature range.
The easiest sanity test is to evaluate, directly at the converter’s output, the following aspects:
•
•
PFM/PWM efficiency
PFM/PWM and forced PWM load transient response
During the recovery time from a load transient, the output voltage can be monitored for settling time, overshoot or
ringing that helps judge the converter’s stability. Without any ringing, the loop has usually more than 45° of phase
margin.
14
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Typical Application (continued)
10.2.3 Application Curves
100
90
80
V
= 2.7 V
I
PFM/PWM Operation
70
60
50
40
30
20
10
0
V
= 3.6 V
I
PFM/PWM Operation
V
= 4.2 V
I
V
= 3.6 V
PFM/PWM Operation
I
Forced PWM Operation
0.1
1
10
100
1000
IO - Load Current - mA
VO = 1.8 V
VO = 1.95V
Figure 12. Efficiency vs. Load Current
Figure 11. Efficiency vs. Load Current
VO = 1.2 V
VO = 1.8 V
PFM/PWM Operation
Figure 13. Efficiency vs. Load Current
Figure 14. Efficiency vs. Input Voltage
VO = 1.8 V
PFM/PWM Operation (TPS82671)
VO = 1.2 V
PFM/PWM Operation (TPS82675)
Figure 15. Peak-to-Peak Output Ripple Voltage vs. Load
Current
Figure 16. Peak-to-Peak Output Ripple Voltage vs. Load
Current
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
Typical Application (continued)
VO = 1.8 V
PFM/PWM Operation (TPS82671)
VO = 1.2 V
(TPS82671)
Figure 18. DC Output Voltage vs. Load Current
Figure 17. Peak-to-Peak Output Ripple Voltage vs. Load
Current
VO = 1.2 V
(TPS82675)
VO = 1.2 V
PFM/PWM Operation (TPS82677)
Figure 19. DC Output Voltage vs. Load Current
Figure 20. DC Output Voltage vs. Load Current
VO = 1.8 V
MODE = Low (TPS82671)
VO = 1.8 V
MODE = Low (TPS82671)
Figure 21. Combined Line/Load Transient Response
Figure 22. Combined Line/Load Transient Response
16
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Typical Application (continued)
VO = 1.8 V
VI = 3.6 V
MODE = Low (TPS82671)
VO = 1.8 V
VI = 3.6 V
MODE = Low (TPS82671)
Figure 23. Load Transient Response in PFM/PWM
Operation
Figure 24. Load Transient Response in PFM/PWM
Operation
VO = 1.8 V
VI = 2.7 V
MODE = Low (TPS82671)
VO = 1.8 V
VI = 4.5 V
MODE = Low (TPS82671)
Figure 25. Load Transient Response in PFM/PWM
Operation
Figure 26. Load Transient Response in PFM/PWM
Operation
VO = 1.8 V
VI = 2.7 V
MODE = Low (TPS82671)
VO = 1.8 V
VI = 3.6 V
MODE = Low (TPS82671)
Figure 28. Load Transient Response in PFM/PWM
Operation
Figure 27. Load Transient Response in PFM/PWM
Operation
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
Typical Application (continued)
VO = 1.8 V
VI = 4.5 V
MODE = Low (TPS82671)
VO = 1.8 V
VI = 3.6 V
MODE = Low (TPS82671)
Figure 29. Load Transient Response in PFM/PWM
Operation
Figure 30. AC Load Transient Response
VO = 1.2 V
VI = 3.6 V
MODE = Low
VO = 1.2 V
VI = 3.6 V
MODE = Low
Figure 32. Load Transient Response in PFM/PWM
Operation
Figure 31. Load Transient Response in PFM/PWM
Operation
VO = 1.2 V
VI = 2.7 V
MODE = Low
VO = 1.2 V
VI = 4.5 V
MODE = Low
Figure 33. Load Transient Response in PFM/PWM
Operation
Figure 34. Load Transient Response in PFM/PWM
Operation
18
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
Typical Application (continued)
VO = 1.2 V
VI = 3.6 V
MODE = Low
VO = 1.2 V
VI = 2.7 V
MODE = Low
Figure 35. Load Transient Response in PFM/PWM
Operation
Figure 36. Load Transient Response in PFM/PWM
Operation
VO = 1.2 V
VI = 4.5 V
MODE = Low (TPS82671)
VO = 1.2 V
VI = 3.6 V
MODE = Low (TPS82671)
Figure 37. Load Transient Response in PFM/PWM
Operation
Figure 38. AC Load Transient Response
VO = 1.8 V
Figure 39. PFM/PWM Boundaries
(TPS82671)
VO = 1.2 V
(TPS82674)
Figure 40. PFM/PWM Boundaries
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
Typical Application (continued)
VO = 1.8 V
VI = 3.6 V
IO = 0 mA
VO = 1.8 V
VI = 3.6 V
(TPS82671)
MODE = Low
RL = 100 Ω
MODE = Low
Figure 41. Start-Up
Figure 42. Start-Up
11 Power Supply Recommendations
The TPS8267X devices are designed to operate from a 2.3-V to 4.8-V input voltage supply. The input power
supply's output current needs to be rated according to the output voltage and the output current of the power rail
application.
20
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
12 Layout
12.1 Layout Guidelines
In making the pad size for the µSiP LGA balls, it is recommended that the layout use non-solder-mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 43 shows the appropriate diameters for a MicroSiPTM
layout.
12.2 Layout Example
Copper Trace Width
Solder Pad Width
Solder Mask Opening
Copper Trace Thickness
Solder Mask Thickness
M0200-01
Figure 43. Recommended Land Pattern Image And Dimensions
(5)
(6)
SOLDER PAD
SOLDER MASK
OPENING
COPPER
THICKNESS
STENCIL
COPPER PAD
STENCIL THICKNESS
DEFINITIONS(1)(2)(3)(4)
OPENING
Non-solder-mask
defined (NSMD)
0.30mm
0.360mm
1oz max (0.032mm)
0.34mm diameter
0.1mm thick
(1) Circuit traces from non-solder-mask defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask
opening. Wider trace widths reduce device stand off and affect reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application.
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less than 0.5 µm to avoid a reduction in thermal fatigue
performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern.
(6) For best solder stencil performance use laser cut stencils with electro polishing. Chemically etched stencils give inferior solder paste
volume control.
12.3 Surface Mount Information
The TPS8267x MicroSiP™ DC/DC converter uses an open frame construction that is designed for a fully
automated assembly process and that features a large surface area for pick and place operations. See the "Pick
Area" in the package drawings.
Package height and weight have been kept to a minimum thereby to allow the MicroSiP™ device to be handled
similarly to a 0805 component.
See JEDEC/IPC standard J-STD-20b for reflow recommendations.
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
21
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
www.ti.com
13 Device and Documentation Support
13.1 Documentation Support
13.1.1 References
"EMI Reduction in Switched Power Converters Using Frequency Modulation Techniques", in IEEE
TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, VOL. 4, NO. 3, AUGUST 2005, pp 569-576 by
Josep Balcells, Alfonso Santolaria, Antonio Orlandi, David González, Javier Gago.
13.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 1. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
TPS82670
TPS82671
TPS82672
TPS82673
TPS82674
TPS82675
TPS82676
TPS82677
TPS826711
TPS826716
TPS826721
TPS826745
TPS826765
TPS8267195
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
13.3 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
13.4 Trademarks
MicroSiP, E2E are trademarks of Texas Instruments.
Bluetooth is a trademark of Bluetooth SIG, Inc.
All other trademarks are the property of their respective owners.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
22
Submit Documentation Feedback
Copyright © 2010–2016, Texas Instruments Incorporated
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
TPS82670, TPS82671, TPS82672, TPS82673, TPS82674, TPS82675, TPS82676
TPS82677, TPS826711, TPS826716, TPS826721, TPS826745, TPS826765, TPS8267195
www.ti.com
SLVSAI0J –OCTOBER 2010–REVISED MAY 2016
13.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical packaging and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2010–2016, Texas Instruments Incorporated
Submit Documentation Feedback
23
Product Folder Links: TPS82670 TPS82671 TPS82672 TPS82673 TPS82674 TPS82675 TPS82676 TPS82677
TPS826711 TPS826716 TPS826721 TPS826745 TPS826765 TPS8267195
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2023
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS82670SIPR
ACTIVE
uSiP
SIP
8
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
-40 to 85
YK
TXI670
Samples
TPS82670SIPT
TPS826711SIPR
TPS826711SIPT
TPS826716SIPR
TPS826716SIPT
TPS82671SIPR
TPS82671SIPT
TPS826721SIPR
TPS826721SIPT
TPS82672SIPR
TPS82672SIPT
TPS82673SIPR
TPS82673SIPT
TPS826745SIPR
TPS826745SIPT
TPS82674SIPR
TPS82674SIPT
TPS82675SIPR
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
YK
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
Samples
YW
YW
GS
GS
RA
RA
EO
EO
WD
WD
YL
YL
B5
B5
SW
SW
RB
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2023
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS82675SIPT
ACTIVE
uSiP
SIP
8
250
RoHS (In
Work) & Green
(In Work)
SNAGCU
Level-2-260C-1 YEAR
-40 to 85
RB
Samples
TPS826765SIPR
TPS826765SIPT
TPS82676SIPR
TPS82676SIPT
TPS82677SIPR
TPS82677SIPT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
3000 RoHS & Green
250 RoHS & Green
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
SNAGCU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
AN
AN
TU
TU
SK
SK
Samples
Samples
Samples
Samples
Samples
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
17-Mar-2023
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2021
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS82670SIPT
TPS826711SIPR
TPS826711SIPT
TPS826716SIPR
TPS826716SIPT
TPS82671SIPR
TPS82671SIPT
TPS826721SIPR
TPS826721SIPT
TPS82672SIPR
TPS82672SIPT
TPS82673SIPR
TPS82673SIPT
TPS826745SIPR
TPS826745SIPT
TPS82674SIPR
TPS82674SIPT
TPS82675SIPR
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
250
3000
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
2.45
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
3.05
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
1.1
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
Q2
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2021
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS82675SIPT
TPS826765SIPR
TPS826765SIPT
TPS82676SIPR
TPS82676SIPT
TPS82677SIPR
TPS82677SIPT
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
8
250
3000
250
178.0
178.0
178.0
178.0
178.0
178.0
178.0
9.0
9.0
9.0
9.0
9.0
9.0
9.0
2.45
2.45
2.45
2.45
2.45
2.45
2.45
3.05
3.05
3.05
3.05
3.05
3.05
3.05
1.1
1.1
1.1
1.1
1.1
1.1
1.1
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q2
Q2
Q2
Q2
Q2
Q2
Q2
3000
250
3000
250
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS82670SIPT
TPS826711SIPR
TPS826711SIPT
TPS826716SIPR
TPS826716SIPT
TPS82671SIPR
TPS82671SIPT
TPS826721SIPR
TPS826721SIPT
TPS82672SIPR
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
8
8
8
8
250
3000
250
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
3000
250
3000
250
3000
250
3000
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
10-Mar-2021
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS82672SIPT
TPS82673SIPR
TPS82673SIPT
TPS826745SIPR
TPS826745SIPT
TPS82674SIPR
TPS82674SIPT
TPS82675SIPR
TPS82675SIPT
TPS826765SIPR
TPS826765SIPT
TPS82676SIPR
TPS82676SIPT
TPS82677SIPR
TPS82677SIPT
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
uSiP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
SIP
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
250
3000
250
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
223.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
194.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
3000
250
3000
250
3000
250
3000
250
3000
250
3000
250
Pack Materials-Page 3
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2023, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明