TRS207CDBRG4 [TI]
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 5 -V多通道RS - 232线路驱动器/接收器,具有± 15 kV ESD保护型号: | TRS207CDBRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
文件: | 总16页 (文件大小:396K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
FEATURES
•
ESD Protection for RS-232 Bus Pins
±15-kV Human-Body Model (HBM)
DB OR DW PACKAGE
(TOP VIEW)
–
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
24
23
22
21
20
19
18
17
16
15
14
13
DOUT3
DOUT1
DOUT2
RIN1
ROUT1
DIN2
DOUT4
RIN2
ROUT2
DIN5
DOUT5
DIN4
DIN3
ROUT3
RIN3
V−
2
•
•
•
•
Operates at 5-V VCC Supply
Operates up to 120 kbit/s
3
4
External Capacitors . . . 4 × 0.1 μF
5
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
6
7
DIN1
8
GND
APPLICATIONS
9
V
CC
10
11
12
C1+
V+
C1−
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
C2−
C2+
DESCRIPTION/ORDERING INFORMATION
The TRS207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS207CDW
TOP-SIDE MARKING
TRS207C
Tube of 25
SOIC – DW
SSOP – DB
SOIC – DW
SSOP – DB
0°C to 70°C
Reel of 2000
Reel of 2000
Tube of 25
TRS207CDWR
TRS207CDBR
RU07C
TRS207I
RU07I
TRS207IDW
–40°C to 85°C
Reel of 2000
Reel of 2000
TRS207IDWR
TRS207IDBR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
FUNCTION TABLES
xxx
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
7
2
DIN1
DIN2
DOUT1
DOUT2
6
3
18
19
21
1
24
20
TTL/CMOS
Inputs
RS-232
Outputs
DIN3
DIN4
DIN5
DOUT3
DOUT4
DOUT5
5
4
23
16
ROUT1
ROUT2
ROUT3
RIN1
RIN2
RIN3
22
17
TTL/CMOS
Outputs
RS-232
Inputs
2
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX
6
UNIT
VCC
V+
Supply voltage range(2)
Positive output supply voltage range(2)
Negative output supply voltage range(2)
V
V
V
VCC – 0.3
–14
14
V–
0.3
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V– – 0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
63
VO
Output voltage range
Receivers
DOUT
Short-circuit duration
DB package
DW package
θJA
Package thermal impedance(3)(4)
°C/W
46
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN
4.5
2
NOM
MAX
UNIT
Supply voltage
5
5.5
V
V
V
VIH
VIL
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
DIN
DIN
DIN
0.8
5.5
30
70
85
0
–30
0
VI
V
Receiver input voltage
TRS207C
TRS207I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage (unless otherwise noted) (see Figure 4)
PARAMETER
Supply current
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
TEST CONDITIONS
MIN
TYP
11
MAX UNIT
20 mA
ICC
No load,
VCC = 5 V,
TA = 25°C
3
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
5
TYP(2)
9
MAX
UNIT
V
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
Short-circuit output current
Output resistance
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
–9
V
15
200
–200
±60
μA
μA
mA
Ω
IIL
VI at 0 V
–15
±10
(3)
IOS
ro
VCC = 5.5 V,
VO = 0 V
VCC, V+, and V– = 0 V,
VO = ±2 V
300
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 50 pF to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 1
Maximum data rate
120
kbit/s
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
tPLH(D)
tPHL(D)
tsk(p)
2
2
μs
μs
ns
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
RL = 3 kΩ to 7 kΩ,
Pulse skew(3)
300
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 1000 pF,
VCC = 5 V
SR(tr)
3
6
30
V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
TEST CONDITIONS
TYP
±15
UNIT
DOUT, RIN
Human-Body Model
kV
4
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
IOH = –1 mA
MIN
3.5 VCC – 0.4
TYP(2)
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
ri
High-level output voltage
V
Low-level output voltage
IOL = 1.6 mA
VCC = 5 V,
VCC = 5 V,
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
TA = 25°C
TA = 25°C
1.7
0.8
0.2
3
1.2
0.5
5
V
Input hysteresis (VIT+ – VIT–
)
1
7
V
Input resistance
VI = ±3 V to ±25 V
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
0.5
MAX UNIT
tPLH
tPHL
tsk(p)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
10
10
μs
μs
ns
CL = 150 pF
0.5
300
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
L
PHL (D)
PLH (D)
R
L
(see Note A)
V
OH
OL
3 V
−3 V
3 V
−3 V
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
PHL (D)
PLH (D)
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
t
Generator
(see Note B)
50 Ω
C
L
t
PHL (D)
PLH (D)
R
L
(see Note A)
V
OH
OL
50%
50%
Output
V
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH (R)
PHL (R)
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
APPLICATION INFORMATION
24
23
1
2
DOUT4
RIN2
DOUT3
DOUT1
5 kΩ
3
4
22
DOUT2
RIN1
ROUT2
5 V
5 kΩ
400 kΩ
21
20
DIN5
5
6
ROUT1
DIN2
DOUT5
5 V
5 V
5 V
400 kΩ
400 kΩ
400 kΩ
19
DIN4
5 V
400 kΩ
18
17
16
7
8
DIN1
GND
DIN3
ROUT3
RIN3
C
+
−
BYPASS
= 0.1µF
C4 =
5 kΩ
9
0.1 µF
16 V
V
CC
15
14
V−
−
+
†
−
+
=
C3
0.1 µF
6.3 V
10
11
C1+
V+
C2−
−
C2 =
0.1 µF
16 V
+
+
−
C1 =
0.1 µF
13
12
C2+
C1−
6.3 V
†
C3 can be connected to V or GND.
CC
A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
7
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
APPLICATION INFORMATION (continued)
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS207 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS207 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15-kV when powered down.
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated
during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage
of concern, and subsequently discharged into the DUT through a 1.5-kΩ resistor.
R
D
1.5 kΩ
+
−
100 pF
C
S
DUT
V
HBM
Figure 5. HBM ESD Test Circuit
8
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TRS207
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS809–JUNE 2007
APPLICATION INFORMATION (continued)
1.5
V
HBM
= 2 kV
1.0
0.5
DUT = 10-V 1-Ω Zener Diode
0.0
0
50
100
150
200
Time (ns)
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test is no longer as pertinent to the RS-232 pins.
9
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS207CDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
24
24
24
24
24
24
24
24
24
24
24
24
24
24
24
24
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS207CDBG4
TRS207CDBR
TRS207CDBRG4
TRS207CDW
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
DB
DB
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS207CDWG4
TRS207CDWR
TRS207CDWRG4
TRS207IDB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS207IDBG4
TRS207IDBR
DB
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS207IDBRG4
TRS207IDW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS207IDWG4
TRS207IDWR
TRS207IDWRG4
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS207CDBR
TRS207CDWR
TRS207IDBR
TRS207IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
24
24
24
24
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
16.4
24.4
8.2
10.75
8.2
8.8
15.7
8.8
2.5
2.7
2.5
2.7
12.0
12.0
12.0
12.0
16.0
24.0
16.0
24.0
Q1
Q1
Q1
Q1
DW
10.75
15.7
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS207CDBR
TRS207CDWR
TRS207IDBR
TRS207IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
24
24
24
24
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
33.0
41.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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