TRS208CDBG4 [TI]
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 5 -V多通道RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | TRS208CDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
| 文件： | 总16页 (文件大小：454K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
FEATURES
•
ESD Protection for RS-232 I/O Pins
±15-kV Human-Body Model (HBM)
DB, DW, OR NT PACKAGE
(TOP VIEW)
–
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
24
23
22
21
20
19
18
17
16
15
14
13
DOUT2
DOUT1
RIN2
ROUT2
DIN1
ROUT1
RIN1
GND
DOUT3
RIN3
ROUT3
DIN4
DOUT4
DIN3
DIN2
ROUT4
RIN4
V-
2
•
•
•
•
•
Operates at 5-V VCC Supply
Four Drivers and Four Receivers
Operates up to 120 kbit/s
3
4
5
6
External Capacitors . . . 4 × 0.1 μF
7
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
8
9
VCC
10
11
12
C1+
APPLICATIONS
V+
C2-
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
C1-
C2+
DESCRIPTION/ORDERING INFORMATION
The TRS208 device consists of four line drivers, four line receivers, and a dual charge-pump circuit with ±15-kV
HBM ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements
of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and
the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS208CNT
TOP-SIDE MARKING
PREVIEW
PDIP – NT
SOIC – DW
Tube of 15
Tube of 25
Reel of 2000
Tube of 60
Reel of 2000
Tube of 15
Tube of 25
Reel of 2000
Tube of 60
Reel of 2000
TRS208CDW
TRS208C
0°C to 70°C
TRS208CDWR
TRS208CDB
SSOP – DB
PDIP – NT
SOIC – DW
RU08C
TRS208CDBR
TRS208INT
PREVIEW
TRS208I
TRS208IDW
–40°C to 85°C
TRS208IDWR
TRS208IDB
SSOP – DB
RU08I
TRS208IDBR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
FUNCTION TABLES
XXX
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
5
2
DIN1
DOUT1
18
19
21
1
24
20
DIN2
DIN3
DIN4
DOUT2
DOUT3
DOUT4
TTL/CMOS
Inputs
RS-232
Outputs
6
7
3
ROUT1
ROUT2
ROUT3
RIN1
RIN2
RIN3
4
TTL/CMOS
Outputs
RS-232
Inputs
22
23
17
16
ROUT4
RIN4
2
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive charge pump voltage range(2)
Negative charge pump voltage range(2)
6
14
V
V
V
V
VCC – 0.3
–14
V–
0.3
V+ – V– Supply voltage difference(2)
13
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V– – 0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
63
VO
Output voltage range
Short-circuit duration
Receivers
DOUT
DB package(3)(4)
DW package(3)(4)
NT package(3)(5)
θJA
Package thermal impedance
46
°C/W
67
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) The package thermal impedance is calculated in accordance with JESD 51-3.
Recommended Operating Conditions(1)
See Figure 4
MIN
4.5
2
NOM
MAX UNIT
Supply voltage
5
5.5
V
V
V
VIH
VIL
Driver high-level input voltage
Driver low-level input voltage
Driver input voltage
DIN
DIN
DIN
0.8
5.5
30
70
85
0
–30
0
VI
V
Receiver input voltage
TRS208C
TRS208I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Supply current
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
TEST CONDITIONS
MIN
TYP
MAX
UNIT
ICC
No load,
VCC = 5 V, TA = 25°C
11
20
mA
3
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
Short-circuit output current
Output resistance
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND, DIN = GND
DOUT at RL = 3 kΩ to GND, DIN = VCC
VI = VCC
MIN
5
TYP(2)
9
MAX UNIT
VOH
VOL
IIH
V
V
–5
–9
15
200
–200
±60
μA
μA
mA
Ω
IIL
VI at 0 V
–15
±10
(3)
IOS
ro
VCC = 5.5 V,
VO = 0 V
VCC, V+, and V– = 0 V,
VO = ±2 V
300
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 50 pF to 1000 pF, RL = 3 kΩ to 7 kΩ,
Maximum data rate
120
kbit/s
One DOUT switching,
See Figure 1
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
tPLH(D)
tPHL(D)
tsk(p)
2
2
μs
μs
ns
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 1
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
Pulse skew(3)
300
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 1000 pF, RL = 3 kΩ to 7 kΩ,
VCC = 5 V
SR(tr)
3
6
30
V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
TEST CONDITIONS
TYP
UNIT
DOUT, RIN
Human-Body Model (HBM)
±15
kV
4
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
ri
High-level output voltage
IOH = –1 mA
IOL = 1.6 mA
VCC = 5 V,
VCC = 5 V,
VCC = 5 V
3.5
V
Low-level output voltage
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
TA = 25°C
TA = 25°C
1.7
1.2
0.5
5
0.8
0.2
3
V
Input hysteresis (VIT+ – VIT–
)
1
7
V
Input resistance
VI = ±3 V to ±25 V, VCC = 5 V,
TA = 25°C
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
CL = 150 pF
MIN
TYP(2)
0.5
MAX
10
UNIT
μs
tPLH(R)
tPHL(R)
tsk(p)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
CL = 150 pF
0.5
10
μs
300
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
tPLH (D)
VOH
VOL
Input
1.5 V
1.5 V
RS-232
Output
Generator
50 W
(see Note B)
tPHL (D)
CL
(see Note A)
RL
3 V
–3 V
3 V
–3 V
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
tPHL (D) or tPLH (D)
SR(tf) =
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3 V
RS-232
Output
1.5 V
1.5 V
Input
0 V
tPLH (D)
Generator
50 W
(see Note B)
CL
(see Note A)
tPHL (D)
RL
VOH
VOL
50%
50%
Output
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
-3 V
Output
Generator
50 W
(see Note B)
tPHL (R)
tPLH (R)
CL
(see Note A)
VOH
VOL
50%
50%
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
APPLICATION INFORMATION
1
2
24
23
DOUT2
DOUT1
DOUT3
RIN3
5 kW
3
4
22
RIN2
ROUT3
5 kW
5 V
400 kW
ROUT2
21
20
DIN4
5 V
DOUT4
400 kW
5 V
5
6
DIN1
400 kW
19
ROUT1
DIN3
5 V
400 kW
18
7
8
RIN1
GND
DIN2
5 kW
17
16
ROUT4
RIN4
+
–
0.1 mF
5 kW
0.1 mF
9
16 V
VCC
15
14
V–
–
+
–
+
0.1 mF
6.3 V
10
11
C1+
V+
C2–
–
+
0.1 mF
16 V
+
–
0.1 mF
6.3 V
13
12
C2+
C1–
NOTES: A. Resistor values shown are nominal.
B. Non-polarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
7
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
APPLICATION INFORMATION (continued)
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS208 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS208 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated
during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage
of concern and subsequently discharged into the DUT through a 1.5-kΩ resistor.
RD
1.5 kW
CS
+
DUT
VHBM
-
100 pF
Figure 5. HBM ESD Test Circuit
8
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TRS208
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS810–JULY 2007
APPLICATION INFORMATION (continued)
1.5
VHBM = 2 kV
DUT = 10-V, 1-W Zener Diode
|
1.0
0.5
0.0
0
50
100
150
200
Time - ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
9
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TRS208CDB
TRS208CDBG4
TRS208CDBR
TRS208CDBRG4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SSOP
SSOP
DB
DB
DB
DB
24
24
24
24
60
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
2000
2000
Green (RoHS
& no Sb/Br)
Request Free Samples
Green (RoHS
& no Sb/Br)
Request Free Samples
TRS208CDW
TRS208CDWG4
TRS208CDWR
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
DW
DW
DW
24
24
24
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Purchase Samples
Purchase Samples
2000
2000
60
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208CDWRG4
TRS208IDB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SSOP
SSOP
SSOP
SSOP
DW
DB
DB
DB
DB
24
24
24
24
24
Green (RoHS
& no Sb/Br)
Request Free Samples
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
TRS208IDBG4
TRS208IDBR
60
Green (RoHS
& no Sb/Br)
Contact TI Distributor
or Sales Office
2000
2000
Green (RoHS
& no Sb/Br)
Request Free Samples
TRS208IDBRG4
Green (RoHS
& no Sb/Br)
Request Free Samples
TRS208IDW
TRS208IDWG4
TRS208IDWR
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
DW
DW
DW
24
24
24
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Purchase Samples
Purchase Samples
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
TRS208IDWRG4
ACTIVE
SOIC
DW
24
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Request Free Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS208CDBR
TRS208CDWR
TRS208IDBR
TRS208IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
24
24
24
24
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
24.4
16.4
24.4
8.2
10.75
8.2
8.8
15.7
8.8
2.5
2.7
2.5
2.7
12.0
12.0
12.0
12.0
16.0
24.0
16.0
24.0
Q1
Q1
Q1
Q1
DW
10.75
15.7
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS208CDBR
TRS208CDWR
TRS208IDBR
TRS208IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
24
24
24
24
2000
2000
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
41.0
33.0
41.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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