TRS222CDW [TI]
5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 5 - V双RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | TRS222CDW |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V DUAL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
| 文件： | 总15页 (文件大小：373K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
FEATURES
DW OR N PACKAGE
(TOP VIEW)
•
ESD Protection for RS-232 Bus Pins
–
±15-kV Human-Body Model (HBM)
1
2
3
4
5
6
7
8
9
18
17
16
15
14
13
12
11
10
NC
C1+
SHDN
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
V
CC
V+
C1−
GND
DOUT1
RIN1
•
•
•
Operates at 5-V VCC Supply
Operates up to 200 kbit/s
C2+
Low Supply Current in Shutdown
Mode . . . 2 μA Typical
C2−
V−
ROUT1
DIN1
•
•
External Capacitors . . . 4 × 0.1 μF
DOUT2
RIN2
DIN2
ROUT2
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRS222 consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD
protection pin to pin (serial-port connection pins, including GND). This device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. This device operates at data signaling rates up to 200 kbit/s and a maximum of 30-V/μs driver output
slew rate. By using shutdown (SHDN), all receivers can be disabled.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS222CN
TOP-SIDE MARKING
TRS222CN
PDIP – N
Tube of 20
0°C to 70°C
Tube of 20
Reel of 1000
Tube of 20
Tube of 20
Reel of 1000
TRS222CDW
TRS222CDWR
TRS222IN
SOIC – DW
PDIP – N
TRS222C
TRS222IN
TRS222I
–40°C to 85°C
TRS222IDW
TRS222IDWR
SOIC – DW
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
FUNCTION TABLES
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
12
15
DIN1
DIN2
DOUT1
DOUT2
RS-232
Outputs
TTC/CMOS
Inputs
11
8
13
10
14
9
ROUT1
ROUT2
RIN1
RIN2
TTC/CMOS
Outputs
RS-232
Inputs
18
SHDN
2
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
MAX UNIT
VCC
VI
Supply voltage range(2)
Input voltage range
6
VCC – 0.3
±30
V
Drivers
V
Receivers
Drivers
±15
VO
Output voltage range
V
Receivers
–0.3
VCC + 0.3
Continuous
58
DOUT
θJA
Short-circuit duration
DW package
N package
Package thermal impedance(3)(4)
°C/W
TBD
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN
4.5
2
NOM
MAX UNIT
VCC Supply voltage
Driver high-level input voltage
5
5.5
V
DIN
VIH
VIL
VI
V
Shutdown high-level input voltage
Driver and control low-level input voltage
Shutdown low-level input voltage
Driver input voltage
SHDN
DIN
2
0.8
0.8
5.5
30
V
V
SHDN
DIN
0
–30
0
Receiver input voltage
TRS222C
TRS222I
70
TA
Operating free-air temperature
°C
–40
85
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
No load
3 kΩ on both inputs
MIN
TYP
4
MAX UNIT
10
ICC
Supply current
VCC = 5 V,
SHDN = VCC
mA
15
2
Shutdown supply current
50
μA
μA
SHDN
Shutdown input leakage current
±1
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
3
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN
5
TYP(2)
8
MAX UNIT
VOH
VOL
High-level output voltage
Low-level output voltage
Driver high-level input current
Control high-level input current
Driver low-level input current
Control low-level input current
Short-circuit output current(3)
Output leakage current
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
V
V
DOUT at RL = 3 kΩ to GND,
DIN = VCC
–5
–8
5
40
μA
1
IIH
SHDN = VCC
0.01
–5
DIN = 0 V
–40
μA
–1
IIL
SHDN = 0 V
–0.01
±22
±0.01
10 M
IOS
Ioff
ro
VCC = 5.5 V,
VO = 0 V
±7
mA
VCC = 5.5 V, SHDN = GND,
VCC, V+, and V– = 0 V,
VO = ±10 V
VO = ±2 V
±10
μA
Output resistance
300
Ω
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Data rate
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
CL = 1000 pF,
RL = 3 kΩ,
200
kbit/s
One DOUT switching,
See Figure 1
Propagation delay time,
low- to high-level output
tPLH(D)
tPHL(D)
See Figure 1
1.5
1.3
3.5
3.5
μs
μs
Propagation delay time,
high- to low-level output
See Figure 1
tPHL(D)
tPLH(D)
–
Driver (+ to –) propagation
delay difference
300
300
12
ns
CL = 150 pF to 2500 pF,
See Figure 2
RL = 3 kΩ to 7 kΩ,
RL = 3 kΩ to 7 kΩ,
tsk(p)
SR(tr)
tET
Pulse skew(3)
ns
Slew rate, transition region
(see Figure 1)
CL = 50 pF to 2500 pF,
VCC = 5 V
6
30
V/μs
μs
Driver output enable time
(after SHDN goes high)
250
300
Driver output disable time
(after SHDN goes low)
tDT
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
ri
High-level output voltage
3.5
VCC – 0.2
V
Low-level output voltage
IOH = 3.2 mA
VCC = 5 V
VCC = 5 V
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
1.7
1.3
0.5
5
0.8
0.2
3
V
Input hysteresis (VIT+ – VIT–
Input resistance
)
1
7
V
VI = ±3 V to ±25 V
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
CL = 150 pF
CL = 150 pF
MIN
TYP(2)
0.6
MAX UNIT
tPLH(R)
tPHL(R)
tPHL(R )
tPLH(R)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
1
1
μs
μs
0.5
–
Receiver (+ to –) propagation delay difference
Pulse skew(3)
100
100
ns
ns
tsk(p)
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
DOUT, RIN
TEST CONDITIONS
TYP
UNIT
Human-Body Model
±15
kV
5
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
PLH (D)
C
L
PHL (D)
R
L
(see Note A)
V
OH
OL
3 V
−3 V
3 V
−3 V
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
PHL (D)
PLH (D)
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
t
Generator
(see Note B)
50 Ω
C
L
t
PHL (D)
PLH (D)
V
R
L
(see Note A)
OH
50%
50%
Output
V
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH (R)
PHL (R)
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
APPLICATION INFORMATION
18
17
1
2
NC
SHDN
V
CC
C1+
V+
+
−
C
BYPASS
= 0.1 µF
+
−
16
3
4
5
GND
C1
+
−
†
C3
0.1 µF,
6.3 V
0.1 µF,
6.3 V
15
14
C1−
C2+
C2−
DOUT1
RIN1
5 kΩ
+
−
C2
6
7
0.1 µF,
6 V
13
12
ROUT1
DIN1
V−
−
C4
+
11
10
8
9
DOUT2
DIN2
RIN2
ROUT2
5 kΩ
†
C3 can be connected to V or GND.
CC
A. Resistor values shown are nominal
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown.
Figure 4. Typical Operating Circuit and Capacitor Values
7
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
APPLICATION INFORMATION (continued)
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS222 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, ensure that the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS222 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS-232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
ESD Test Conditions
ESD testing stringently is performed by TI, based on various conditions and procedures. Contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated
during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage
of concern, and subsequently discharged into the DUT through a 1.5-kΩ resistor.
R
D
1.5 kΩ
C
+
−
S
DUT
V
HBM
100 pF
Figure 5. HBM ESD Test Circuit
8
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TRS222
5-V DUAL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS813–JULY 2007
APPLICATION INFORMATION (continued)
1.5
V
HBM
= 2 kV
DUT = 10-V, 1-Ω Zener Diode
1
0.5
0
0
50
100
200
150
Time − ns
Figure 6. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
9
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS222CDW
TRS222CDWG4
TRS222CDWR
TRS222CDWRG4
TRS222CN
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
18
18
18
18
18
18
18
18
18
18
18
18
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
SOIC
SOIC
SOIC
PDIP
PDIP
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
DW
DW
DW
N
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TRS222CNE4
TRS222IDW
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
DW
DW
DW
DW
N
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
TRS222IDWG4
TRS222IDWR
TRS222IDWRG4
TRS222IN
40 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TRS222INE4
N
20
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS222CDWR
TRS222IDWR
SOIC
SOIC
DW
DW
18
18
2000
2000
330.0
330.0
24.4
24.4
10.9
10.9
12.0
12.0
2.7
2.7
12.0
12.0
24.0
24.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS222CDWR
TRS222IDWR
SOIC
SOIC
DW
DW
18
18
2000
2000
370.0
370.0
355.0
355.0
55.0
55.0
Pack Materials-Page 2
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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