TRS3232IDWRG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器【 15 kV ESD保护![TRS3232IDWRG4](http://pdffile.icpdf.com/pdf1/p00109/img/icpdf/TRS3232_591065_icpdf.jpg)
型号: | TRS3232IDWRG4 |
厂家: | ![]() |
描述: | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH 【15-kV ESD PROTECTION |
文件: | 总16页 (文件大小:505K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
FEATURES
•
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
D, DB, DW, OR PW PACKAGE
(TOP VIEW)
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
1
C1+
V+
VCC
15 GND
16
2
3
4
5
6
7
8
•
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 250 kbit/s
14
13
12
11
10
9
C1-
DOUT1
RIN1
C2+
Two Drivers and Two Receivers
C2-
ROUT1
DIN1
Low Supply Current . . . 300 μA Typical
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
V-
DOUT2
RIN2
DIN2
ROUT2
Alternative High-Speed Pin-Compatible Device
(1 Mbit/s)
–
TRSF3232
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS3232CD
TOP-SIDE MARKING
TRS3232C
Tube of 40
SOIC – D
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
Tube of 40
Reel of 2500
Tube of 40
Reel of 2000
Tube of 80
Reel of 2000
Tube of 90
Reel of 2000
TRS3232CDR
TRS3232CDW
TRS3232CDWR
TRS3232CDB
TRS3232CDBR
TRS3232PW
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – D
TRS3232C
RS32C
0°C to 70°C
RS32C
TRS3232PWR
TRS3232ID
TRS3232I
TRS3232I
RS32I
TRS3232IDR
TRS3232IDW
SOIC – DW
SSOP – DB
TSSOP – PW
TRS3232IDWR
TRS3232IDB
–40°C to 85°C
TRS3232IDBR
TRS3232IPW
RS32I
TRS3232IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
The TRS3232 device consists of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. The devices operate at data signaling rates up to 250 kbit/s and a maximum of 30-V/μs driver
output slew rate.
FUNCTION TABLES
xxx
Each Driver(1)
INPUT
DIN
OUTPUT
DOUT
L
H
L
H
(1) H = high level, L = low level
Each Receiver(1)
INPUT
RIN
OUTPUT
ROUT
L
H
H
L
Open
H
(1) H = high level, L = low level,
Open = input disconnected or
connected driver off
LOGIC DIAGRAM (POSITIVE LOGIC)
11
10
12
9
14
DIN1
DIN2
DOUT1
DOUT2
RIN1
7
13
8
ROUT1
ROUT2
RIN2
2
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX
UNIT
VCC
Supply voltage range(2)
6
V
V
V
V
V+
Positive output supply voltage range(2)
Negative output supply voltage range(2)
Supply voltage difference(2)
7
V–
–7
V+ – V–
13
6
Drivers
–0.3
–25
VI
Input voltage range
Output voltage range
V
V
Receivers
Drivers
25
–13.2
–0.3
13.2
VCC + 0.3
73
VO
Receivers
D package
DB package
DW package
PW package
82
θJA
Package thermal impedance(3)(4)
°C/W
57
108
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN
3
NOM
3.3
5
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
DIN
3.6
V
Supply voltage
4.5
2
5.5
VIH
VIL
VI
Driver high-level input voltage
DIN
V
2.4
Driver low-level input voltage
Driver input voltage
0.8
5.5
25
70
85
V
V
DIN
0
–25
0
Receiver input voltage
TRS3232C
TRS3232I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
Supply current
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
ICC
No load, VCC = 3.3 V or 5 V
0.3
1
mA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
3
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
5
5.4
–5.4
±0.01
±0.01
±35
V
V
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
±1
±1
μA
μA
IIL
VI at GND
VCC = 3.6 V,
VO = 0 V
VO = 0 V
VO = ±2 V
±60
±60
(3)
IOS
ro
Short-circuit output current
Output resistance
mA
VCC = 5.5 V,
±35
VCC, V+, and V– = 0 V,
300
10M
Ω
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 1000 pF,
One DOUT switching,
RL = 3 kΩ,
See Figure 1
Maximum data rate
150
250
300
kbit/s
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
See Figure 2
tsk(p)
Pulse skew(3)
ns
CL = 150 pF to 1000 pF
CL = 150 pF to 2500 pF
6
4
30
Slew rate, transition region
(see Figure 1)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
SR(tr)
V/μs
30
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
4
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
IOH = –1 mA
IOL = 1.6 mA
VCC = 3.3 V
MIN
TYP(2)
MAX
UNIT
V
VOH
VOL
VCC – 0.6
VCC – 0.1
0.4
2.4
2.4
V
1.5
1.8
1.2
1.5
0.3
5
VIT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
VCC = 5 V
VCC = 3.3 V
0.6
0.8
VIT–
VCC = 5 V
Vhys
rI
Input hysteresis (VIT+ – VIT–
)
V
Input resistance
VI = ±3 V to ±25 V
3
7
kΩ
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 3)
PARAMETER
TEST CONDITIONS
CL = 150 pF
TYP(2)
300
UNIT
ns
tPLH
tPHL
tsk(p)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Pulse skew(3)
CL = 150 pF
300
ns
300
ns
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ±0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
RS-232
0 V
Output
Generator
50 W
(see Note B)
tTHL
tTLH
CL
RL
(see Note A)
VOH
VOL
3 V
-3 V
3 V
-3 V
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
tTHL or tTLH
SR(tr) =
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 1. Driver Slew Rate
3 V
RS-232
Output
1.5 V
1.5 V
Input
0 V
Generator
50 W
(see Note B)
CL
(see Note A)
tPHL
tPLH
RL
VOH
VOL
50%
50%
Output
TEST CIRCUIT
NOTES: A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 2. Driver Pulse Skew
3 V
Input
1.5 V
1.5 V
-3 V
Output
Generator
50 W
(see Note B)
tPHL
tPLH
CL
(see Note A)
VOH
VOL
50%
50%
Output
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 W, 50% duty cycle, tr £ 10 ns, tf £ 10 ns.
Figure 3. Receiver Propagation Delay Times
6
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TRS3232
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS812–JULY 2007
APPLICATION INFORMATION
1
2
3
4
16
VCC
C1+
V+
+
CBYPASS
= 0.1 mF
-
+
15
14
GND
C1
+
C3†
-
-
DOUT1
C1-
C2+
C2-
13
RIN1
+
5 kW
C2
-
5
6
7
12
11
ROUT1
DIN1
V-
-
C4
+
10
9
DOUT2
RIN2
DIN2
8
ROUT2
5 kW
†
C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
VCC vs CAPACITOR VALUES
VCC
C1
C2, C3, C4
3.3 V ± 0.3 V
5 V ± 0.5 V
3 V to 5.5 V
0.1 mF
0.047 mF
0.1 mF
0.1 mF
0.33 mF
0.47 mF
Figure 4. Typical Operating Circuit and Capacitor Values
7
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS3232CD
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232CDB
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232CDBG4
TRS3232CDBR
TRS3232CDBRG4
TRS3232CDG4
TRS3232CDR
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232CDRG4
TRS3232CDW
TRS3232CDWG4
TRS3232CDWR
TRS3232CDWRG4
TRS3232CPW
TRS3232CPWG4
TRS3232CPWR
TRS3232CPWRG4
TRS3232ID
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
DW
DW
DW
PW
PW
PW
PW
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232IDB
SSOP
SSOP
SSOP
SSOP
SOIC
DB
DB
DB
DB
D
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232IDBG4
TRS3232IDBR
TRS3232IDBRG4
TRS3232IDG4
TRS3232IDR
80 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232IDRG4
TRS3232IDW
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
DW
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
Orderable Device
TRS3232IDWG4
TRS3232IDWR
TRS3232IDWRG4
TRS3232IPW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
16
16
16
16
16
16
16
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
DW
DW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS3232IPWG4
TRS3232IPWR
TRS3232IPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
330
330
(mm)
16
TRS3232CDBR
TRS3232CDR
TRS3232CDWR
TRS3232CPWR
TRS3232IDBR
TRS3232IDR
DB
D
16
16
16
16
16
16
16
16
SITE 41
SITE 27
SITE 60
SITE 41
SITE 41
SITE 27
SITE 60
SITE 41
8.2
6.5
6.6
10.3
10.7
5.6
2.5
2.1
2.7
1.6
2.5
2.1
2.7
1.6
12
8
16
16
16
12
16
16
16
12
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
16
DW
PW
DB
D
16
10.75
7.0
12
8
12
16
8.2
6.6
12
8
16
6.5
10.3
10.7
5.6
TRS3232IDWR
TRS3232IPWR
DW
PW
16
10.75
7.0
12
8
12
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
4-Oct-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
TRS3232CDBR
TRS3232CDR
TRS3232CDWR
TRS3232CPWR
TRS3232IDBR
TRS3232IDR
DB
D
16
16
16
16
16
16
16
16
SITE 41
SITE 27
SITE 60
SITE 41
SITE 41
SITE 27
SITE 60
SITE 41
346.0
342.9
346.0
346.0
346.0
342.9
346.0
346.0
346.0
336.6
346.0
346.0
346.0
336.6
346.0
346.0
33.0
28.58
33.0
29.0
33.0
28.58
33.0
29.0
DW
PW
DB
D
TRS3232IDWR
TRS3232IPWR
DW
PW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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