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TRS3386E_09 [TI]

RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE; RS - 232收发器，带有SPLIT电源引脚逻辑端
TRS3386E_09
型号： TRS3386E_09
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE
RS - 232收发器，带有SPLIT电源引脚逻辑端
文件： 总16页 (文件大小：379K)
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TRS3386E  
www.ti.com ............................................................................................................................................................ SLLS829B–APRIL 2007–REVISED APRIL 2009  
RS-232 TRANSCEIVER WITH SPLIT SUPPLY PIN FOR LOGIC SIDE  
1
FEATURES  
PW OR DW PACKAGE  
•
VL Pin for Compatibility With Mixed-Voltage  
Systems Down to 1.8 V on Logic Side  
TOP VIEW  
•
Enhanced ESD Protection on RIN Inputs and  
DOUT Outputs  
C1+ 1  
V+ 2  
20  
19  
PWRDOWN  
VCC  
–
–
–
±15-kV Human-Body Model  
C1− 3  
18 GND  
±15-kV IEC 61000-4-2, Air-Gap Discharge  
±8-kV IEC 61000-4-2, Contact Discharge  
C2+ 4  
17 DOUT1  
C2− 5  
16  
15  
14  
13  
12  
DOUT2  
DOUT3  
RIN1  
RIN2  
VL  
•
•
•
•
Low 300-µA Supply Current  
Specified 250-kbps Data Rate  
1-µA Low-Power Shutdown  
V− 6  
DIN1 7  
DIN2 8  
DIN3 9  
ROUT2 10  
Meets EIA/TIA-232 Specifications Down  
to 3 V  
11 ROUT1  
•
Designed to be Interchangeable With Industry  
Standard '3386 Devices  
APPLICATIONS  
•
•
•
•
•
Hand-Held Equipment  
PDAs  
Cell Phones  
Battery-Powered Equipment  
Data Cables  
DESCRIPTION/ORDERING INFORMATION  
The TRS3386E is a three-driver and two-receiver RS-232 interface device, with split supply pins for mixed-signal  
operations. All RS-232 inputs and outputs are protected to ±15 kV using the IEC 61000-4-2 Air-Gap Discharge  
method, ±8 kV using the IEC 61000-4-2 Contact Discharge method, and ±15 kV using the Human-Body Model.  
The charge pump requires only four small 0.1-µF capacitors for operation from a 3.3-V supply. The TRS3386E is  
capable of running at data rates up to 250 kbps, while maintaining RS-232-compliant output levels.  
The TRS3386E has a unique VL pin that allows operation in mixed-logic voltage systems. Both driver in (DIN)  
and receiver out (ROUT) logic levels are pin programmable through the VL pin. The TRS3386E is available in a  
space-saving thin shrink small-outline package (TSSOP).  
ORDERING INFORMATION  
TA  
0°C to 70°C  
PACKAGE(1)(2)  
TSSOP – PW  
ORDERABLE PART NUMBER  
TRS3386ECPWR  
TOP-SIDE MARKING  
RV86EC  
SOIC – DW  
TSSOP – PW  
SOIC – DW  
TRS3386ECDWR  
TRS3386EIPWR  
TRS3386EIDWR  
TRS3386EC  
RV86EI  
–40°C to 85°C  
TRS3386EI  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TRS3386E  
SLLS829B–APRIL 2007–REVISED APRIL 2009 ............................................................................................................................................................ www.ti.com  
TRUTH TABLE (SHUTDOWN FUNCTION)  
DRIVER  
OUTPUTS  
PWRDWN  
RECEIVER OUTPUTS  
CHARGE PUMP  
L
High-Z  
High-Z  
Active  
Inactive  
Active  
H
Active  
FUNCTIONAL BLOCK DIAGRAM  
7
17  
16  
15  
DIN1  
DIN1  
DIN2  
DOUT1  
DOUT2  
DOUT3  
8
9
20  
Powerdown  
PWRDOWN  
11  
10  
14  
13  
ROUT1  
ROUT2  
RIN1  
RIN2  
5 K  
5 K  
2
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Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TRS3386E  
TRS3386E  
www.ti.com ............................................................................................................................................................ SLLS829B–APRIL 2007–REVISED APRIL 2009  
TERMINAL FUNCTIONS  
TERMINAL  
DESCRIPTION  
NAME  
C1+  
V+  
NO.  
1
Positive terminal of the voltage-doubler charge-pump capacitor  
5.5-V supply generated by the charge pump  
2
C1–  
C2+  
C2–  
V–  
3
Negative terminal of the voltage-doubler charge-pump capacitor  
Positive terminal of the inverting charge-pump capacitor  
Negative terminal of the inverting charge-pump capacitor  
–5.5-V supply generated by the charge pump  
4
5
6
DIN1  
DIN2  
DIN3  
7
8
9
Driver inputs  
ROUT2  
ROUT1  
10  
11  
Receiver outputs. Swing between 0 and VL.  
VL  
12  
Logic-level supply. All CMOS inputs and outputs are referenced to this supply.  
RS-232 receiver inputs  
RIN2  
RIN1  
13  
14  
DOUT3  
DOUT2  
DOUT1  
15  
16  
17  
RS-232 driver outputs  
GND  
VCC  
18  
19  
Ground  
3-V to 5.5-V supply voltage  
Powerdown input  
L = Powerdown  
PWRDWN  
20  
H = Normal operation  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.3  
–0.3  
–0.3  
0.3  
MAX UNIT  
VCC to GND  
6
V
V
V
V
V
VL to GND  
VCC + 0.3  
V+ to GND  
7
V– to GND  
V+ + |V–|(2)  
–7  
13  
DIN, PWRDWN to GND  
–0.3  
–0.3  
6
VI  
Input voltage  
V
V
RIN to GND  
DOUT to GND  
ROUT  
±25  
±13.2  
VO  
Output voltage  
VL + 0.3  
Continuous  
Short-circuit duration DOUT to GND  
Continuous power dissipation  
TA = 70°C, 20-pin TSSOP  
(derate 7 mW/°C above 70°C)  
559 mW  
TJ  
Junction temperature  
150 °C  
150 °C  
300 °C  
Tstg  
Storage temperature range  
Lead temperature (soldering, 10 s)  
–65  
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the  
specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.  
(2) V+ and V– can have maximum magnitudes of 7 V, but their absolute difference cannot exceed 13 V.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TRS3386E  
TRS3386E  
SLLS829B–APRIL 2007–REVISED APRIL 2009 ............................................................................................................................................................ www.ti.com  
Recommended Operating Conditions  
MIN  
3
MAX UNIT  
VCC Supply voltage  
5.5  
VCC  
0.8  
V
V
VL  
Supply voltage  
1.65  
VL = 3 V or 5.5 V  
VL = 2.3 V  
Input logic threshold low  
DIN, PWRDWN  
DIN, PWRDWN  
0.6  
V
VL = 1.65 V  
VL = 5.5 V  
0.5  
2.4  
2.0  
1.4  
0.9  
0
VL = 3 V  
Input logic threshold high  
V
VL = 2.7 V  
VL = 1.95 V  
TRS3386ECPWR  
TRS3386EIPWR  
70  
85  
25  
Operating temperature  
Receiver input voltage  
°C  
V
–40  
–25  
Electrical Characteristics  
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,  
C2–C4 = 0.33 µF (tested at 5 V ± 10%) (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP(1)  
MAX  
UNIT  
DC Characteristics (VCC = 3.3 V or 5 V, TA = 25°C)  
Powerdown supply current  
Supply current  
PWRDWN = GND, All inputs at VCC or GND  
PWRDWN = VCC, No load  
1
10  
1
µA  
0.3  
mA  
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.  
ESD Protection  
PARAMETER  
TEST CONDITIONS  
TYP  
±15  
±15  
±8  
UNIT  
Human-Body Model  
RIN, DOUT  
IEC 61000-4-2 Air-Gap Discharge  
IEC 61000-4-2 Contact Discharge  
kV  
4
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Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TRS3386E  
TRS3386E  
www.ti.com ............................................................................................................................................................ SLLS829B–APRIL 2007–REVISED APRIL 2009  
RECEIVER SECTION  
Electrical Characteristics  
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,  
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
ROUT, receivers disabled  
MIN  
TYP(1)  
MAX  
±10  
0.4  
UNIT  
µA  
V
Ioff  
Output leakage current  
Output voltage low  
Output voltage high  
±0.05  
VOL  
VOH  
IOUT = 1.6 mA  
IOUT = –1 mA  
VL – 0.6  
0.8  
VL – 0.1  
1.2  
V
VL = 5 V  
VIT–  
Input threshold low  
Input threshold high  
TA = 25°C  
TA = 25°C  
V
V
VL = 3.3 V  
VL = 5 V  
0.6  
1.5  
1.8  
2.4  
2.4  
VIT+  
Vhys  
VL = 3.3 V  
1.5  
Input hysteresis  
Input resistance  
0.5  
V
TA = 25°C  
3
5
7
kΩ  
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C  
Switching Characteristics  
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,  
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)  
PARAMETER  
TEST CONDITIONS  
TYP(1)  
0.15  
0.15  
50  
UNIT  
tPHL  
Receiver propagation delay  
Receiver input to receiver output, CL = 150 pF  
µs  
tPLH  
tPHL – tPLH  
ten  
Receiver skew  
ns  
ns  
ns  
Receiver output enable time  
Receiver output disable time  
From PWRDWN  
From PWRDWN  
200  
tdis  
200  
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TRS3386E  
TRS3386E  
SLLS829B–APRIL 2007–REVISED APRIL 2009 ............................................................................................................................................................ www.ti.com  
DRIVER SECTION  
Electrical Characteristics  
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,  
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)  
PARAMETER  
Output voltage swing  
Output resistance  
TEST CONDITIONS  
All driver outputs loaded with 3 kΩ to ground  
VCC = V+ = V– = 0, Driver output = ±2 V  
VT_OUT = 0  
MIN TYP(1)  
MAX UNIT  
VOH  
rO  
±5  
±5.4  
10M  
V
300  
Ω
IOS  
Output short-circuit current  
±60  
±25  
mA  
VT_OUT = ±12 V, Driver disabled,  
VCC = 0 or 3 V to 5.5 V  
IOZ  
Output leakage current  
µA  
Driver input hysteresis  
Input leakage current  
0.5  
±1  
V
DIN, PWRDWN  
±0.01  
µA  
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C  
Timing Requirements  
over operating free-air temperature range, VCC = VL = 3 V to 5.5 V, C1–C4 = 0.1 µF (tested at 3.3 V ± 10%), C1 = 0.047 µF,  
C2–C4 = 0.33 µF (tested at 5 V ± 10%), TA = TMIN to TMAX (unless otherwise noted)  
PARAMETER  
MIN  
TYP(1)  
MAX  
UNIT  
kbps  
µs  
Maximum data rate  
Time-to-exit powerdown  
Driver skew(2)  
RL = 3 kΩ, CL = 1000 pF, One driver switching  
250  
|VT_OUT| > 3.7 V  
100  
100  
|tPHL – tPLH  
|
ns  
VCC = 3.3 V,  
TA = 25°C,  
RL = 3 kΩ to 7 kΩ,  
Measured from 3 V  
to –3 V or –3 V to 3 V  
CL = 150 pF to 1000 pF  
CL = 150 pF to 2500 pF  
6
4
30  
30  
Transition-region  
slew rate  
V/µs  
(1) Typical values are at VCC = VL = 3.3 V, TA = 25°C.  
(2) Driver skew is measured at the driver zero crosspoint.  
ESD Protection  
PARAMETER  
TEST CONDITIONS  
TYP UNIT  
Human-Body Model  
±15  
RIN, DOUT  
IEC 61000-4-2 Air-Gap Discharge  
IEC 61000-4-2 Contact Discharge  
±15  
±8  
kV  
6
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TRS3386E  
TRS3386E  
www.ti.com ............................................................................................................................................................ SLLS829B–APRIL 2007–REVISED APRIL 2009  
APPLICATION INFORMATION  
3.3 V  
20  
19  
12  
C
BYPASS  
V
V
L
PWRDWN  
CC  
2
6
1
3
4
5
C1+  
V+  
V−  
C1  
0.1mF  
C3  
0.1  
C1−  
C2+  
µF  
µF  
C2  
0.1mF  
C4  
0.1  
C2−  
7
DOUT1  
DIN1  
17  
16  
15  
DOUT2  
DOUT3  
DIN2  
DIN3  
TTL/CMOS  
Inputs  
V
V
L
14  
13  
11 ROUT1  
10 ROUT2  
RIN1  
5kΩ  
TTL/CMOS  
Outputs  
L
RIN2  
5kΩ  
GND  
18  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TRS3386E  
TRS3386E  
SLLS829B–APRIL 2007–REVISED APRIL 2009 ............................................................................................................................................................ www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
3 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
0 V  
Generator  
(see Note B)  
50 Ω  
C
L
t
R
L
t
TLH  
THL  
(see Note A)  
3 V  
PWRDWN  
V
V
OH  
3 V  
−3 V  
3 V  
−3 V  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
6 V  
or t  
SR(tr) +  
t
THL  
TLH  
NOTES: A. C includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle,  
O
t ≤ 10 ns, t ≤ 10 ns.  
r
f
Figure 1. Driver Slew Rate  
3 V  
0 V  
Input  
1.5 V  
1.5 V  
RS-232  
Output  
Generator  
(see Note B)  
50 Ω  
C
L
t
t
PLH  
PHL  
R
L
(see Note A)  
V
V
OH  
3 V  
PWRDWN  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
NOTES: A. C includes probe and jig capacitance.  
VOLTAGE WAVEFORMS  
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.  
O
r
f
Figure 2. Driver Pulse Skew  
PWRDWN  
3 V  
3 V  
Input  
1.5 V  
1.5 V  
−3 V  
Output  
Generator  
(see Note B)  
50 Ω  
t
t
PHL  
PLH  
C
L
(see Note A)  
V
V
OH  
50%  
50%  
Output  
OL  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A. C includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.  
O
r
f
Figure 3. Receiver Propagation Delay Times  
8
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Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TRS3386E  
TRS3386E  
www.ti.com ............................................................................................................................................................ SLLS829B–APRIL 2007–REVISED APRIL 2009  
PARAMETER MEASUREMENT INFORMATION (Continued)  
3 V  
0 V  
V
CC  
GND  
Input  
1.5 V  
1.5 V  
S1  
R
L
t
t
PZH  
PHZ  
S1 at GND)  
(S1 at GND)  
3 V or 0 V  
Output  
V
OH  
C
L
Output  
50%  
(see Note A)  
PWRDWN  
0.3 V  
0.3 V  
t
PLZ  
Generator  
(see Note B)  
(S1 at V  
)
CC  
50 Ω  
Output  
50%  
V
OL  
t
PZL  
(S1 at V )  
CC  
TEST CIRCUIT  
VOLTAGE WAVEFORMS  
NOTES: A. C includes probe and jig capacitance.  
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.  
O
r
f
Figure 4. Receiver Enable and Disable Times  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TRS3386E  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Apr-2009  
PACKAGING INFORMATION  
Orderable Device  
TRS3386ECDW  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
DW  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TRS3386ECDWG4  
TRS3386ECDWR  
TRS3386ECDWRG4  
TRS3386ECPW  
SOIC  
SOIC  
DW  
DW  
DW  
PW  
PW  
PW  
PW  
DW  
DW  
DW  
DW  
PW  
PW  
PW  
PW  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
SOIC  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TRS3386ECPWG4  
TRS3386ECPWR  
TRS3386ECPWRG4  
TRS3386EIDW  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TRS3386EIDWG4  
TRS3386EIDWR  
TRS3386EIDWRG4  
TRS3386EIPW  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TRS3386EIPWG4  
TRS3386EIPWR  
TRS3386EIPWRG4  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Apr-2009  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Apr-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TRS3386ECDWR  
TRS3386ECPWR  
TRS3386EIDWR  
TRS3386EIPWR  
SOIC  
TSSOP  
SOIC  
DW  
PW  
DW  
PW  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
24.4  
16.4  
24.4  
16.4  
10.8  
6.95  
10.8  
6.95  
13.0  
7.1  
2.7  
1.6  
2.7  
1.6  
12.0  
8.0  
24.0  
16.0  
24.0  
16.0  
Q1  
Q1  
Q1  
Q1  
13.0  
7.1  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Apr-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TRS3386ECDWR  
TRS3386ECPWR  
TRS3386EIDWR  
TRS3386EIPWR  
SOIC  
TSSOP  
SOIC  
DW  
PW  
DW  
PW  
20  
20  
20  
20  
2000  
2000  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
33.0  
41.0  
33.0  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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Applications  
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Amplifiers  
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dataconverter.ti.com  
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Copyright © 2010, Texas Instruments Incorporated  

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