TRSF3222ECDBG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器，具有± 15 kV ESD保护
| 型号： | TRSF3222ECDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
| 文件： | 总19页 (文件大小：652K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
FEATURES
DB, DW, OR PW PACKAGE
•
ESD Protection for RS-232 Bus Pins
(TOP VIEW)
–
–
–
±15-kV Human-Body Model (HBM)
EN
C1+
1
2
3
4
5
6
7
8
9
10
20 PWRDOWN
±8-kV IEC 61000-4-2, Contact Discharge
±15-kV IEC 61000-4-2, Air-Gap Discharge
19
18
17
16
15
14
13
12
11
V
CC
V+
C1−
C2+
C2−
GND
DOUT1
RIN1
ROUT1
NC
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
•
•
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 1000 kbit/s
V−
DOUT2
RIN2
ROUT2
DIN1
DIN2
NC
Two Drivers and Two Receivers
Low Standby Current . . . 1 μA Typ
External Capacitors . . . 4 × 0.1 μF
Accepts 5-V Logic Input With 3.3-V Supply
NC − No internal connection
RHL PACKAGE
(TOP VIEW)
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
24
1
2
23
22
21
20
19
18
17
16
15
14
C1+
NC
V+
C1–
C2+
C2–
V–
V
CC
3
NC
DESCRIPTION/
ORDERING INFORMATION
4
GND
DOUT1
RIN1
ROUT1
NC
DIN1
NC
DIN2
5
The TRSF3222E consists of two line drivers, two line
receivers, and a dual charge-pump circuit with
±15-kV ESD protection pin to pin (serial-port
connection pins, including GND).
6
7
8
9
DOUT2
NC
RIN2
The TRSF3222E meets the requirements of
TIA/EIA-232-F and provides the electrical interface
between an asynchronous communication controller
and the serial-port connector. The charge pump and
four small external capacitors allow operation from a
single 3-V to 5.5-V supply. The TRSF3222E
operates at typical data signaling rates up to
1000 kbit/s and is an improved drop-in replacement
for industry-popular '3222 two-driver, two-receiver
functions.
10
11
12
13
NC − No internal connection
The TRSF3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low,
which draws only 1 μA from the power supply. When the device is powered down, the receivers remain active
while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is
disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the
high-impedance state by setting enable (EN) high.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRSF3222ECDW
TRSF3222ECDWR
TRSF3222ECDB
TOP-SIDE MARKING
Tube of 25
SOIC – DW
SSOP – DB
TSSOP – PW
SOIC – DW
SSOP – DB
TSSOP – PW
TRSF3222EC
Reel of 2000
Tube of 70
0°C to 70°C
RT22EC
RT22EC
TRSF3222EI
RT22EI
Reel of 2000
Tube of 70
TRSF3222ECDBR
TRSF3222ECPW
TRSF3222ECPWR
TRSF3222EIDW
Reel of 2000
Tube of 25
Reel of 2000
Tube of 70
TRSF3222EIDWR
TRSF3222EIDB
–40°C to 85°C
Reel of 2000
Tube of 70
TRSF3222EIDBR
TRSF3222EIPW
RT22EI
Reel of 2000
TRSF3222EIPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLES
XXX
Each Driver(1)
INPUTS
PWRDOWN
OUTPUT
DOUT
DIN
X
L
H
H
Z
H
L
L
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver(1)
INPUTS
OUTPUT
ROUT
RIN
L
EN
L
H
L
H
L
X
H
L
Z
H
Open
(1) H = high level, L = low level, X = irrelevant,
Z = high impedance (off),
Open = input disconnected or connected driver off
2
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)(1)
13
17
8
DIN1
DOUT1
DOUT2
12
20
DIN2
Powerdown
PWRDOWN
1
EN
15
16
ROUT1
RIN1
RIN2
5 kW
10
9
ROUT2
5 kW
(1) Pin numbers shown are for the DB, DW, and PW packages.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
6
V
V
V
V
7
–7
V–
V+ – V– Supply voltage difference(2)
13
Driver (EN, PWRDOWN)
Receiver
–0.3
–25
6
VI
Input voltage range
Output voltage range
V
V
25
Driver
–13.2
–0.3
13.2
VCC + 0.3
70
VO
Receiver
DB package
DW package
PW package
RHL package
58
θJA
Package thermal impedance(3)(4)
°C/W
83
TBD
150
150
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
3
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
Recommended Operating Conditions(1)
See Figure 5
MIN NOM MAX UNIT
VCC = 3.3 V
3
4.5
2
3.3
5
3.6
5.5
Supply voltage
V
V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
VIH
Driver and control high-level input voltage
DIN, EN, PWRDOWN
2.4
VIL
VI
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, EN, PWRDOWN
DIN, EN, PWRDOWN
0.8
5.5
25
70
85
V
V
V
0
–25
0
VI
TRSF3222EC
TRSF3222EI
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Input leakage current (EN, PWRDOWN)
Supply current
TEST CONDITIONS
MIN TYP(2)
MAX
±1
UNIT
II
±0.01
0.3
1
μA
mA
μA
No load, PWRDOWN at VCC
No load, PWRDOWN at GND
1
ICC
Supply current (powered off)
10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
4
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
DRIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
DOUT at RL = 3 kΩ to GND,
DIN = GND
DIN = VCC
5
5.4
–5.4
V
V
DOUT at RL = 3 kΩ to GND,
VI = VCC
–5
±0.01
±0.01
±1
±1
μA
μA
IIL
VI at GND
VCC = 3.6 V
IOS
ro
Short-circuit output current(3)
Output resistance
VO = 0 V
±35
±60
mA
VCC = 5.5 V
VCC, V+, and V– = 0 V,
VO = ±2 V
300
10M
Ω
VCC = 3 V to 3.6 V,
VO = ±12 V
±25
±25
IOZ
Output leakage current
PWRDOWN = GND
μA
VCC = 4.5 V to 5.5 V,
VO = ±10 V
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
CL = 1000 pF
MIN TYP(2)
MAX UNIT
250
1000
1000
300
8
Maximum data rate
(See Figure 1)
RL = 3 kΩ,
One DOUT switching
CL = 250 pF,
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
See Figure 2
kbit/s
CL = 1000 pF,
tsk(p)
Pulse skew(3)
Slew rate,
SR(tr) transition region
(see Figure 1)
CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ,
ns
90
RL = 7 kΩ,
CL = 150 pF to 1000 pF
CL = 1000 pF
12
60 V/μs
150
RL = 3 kΩ
CL = 150 pF to 250 pF
24
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
5
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
RECEIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
High-level output voltage
TEST CONDITIONS
IOH = –1 mA
IOL = 1.6 mA
VCC = 3.3 V
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6
VCC – 0.1
V
Low-level output voltage
0.4
2.4
2.4
V
1.5
1.8
VIT+
Positive-going input threshold voltage
V
VCC = 5 V
VCC = 3.3 V
0.6
0.8
1.2
VIT–
Negative-going input threshold voltage
V
VCC = 5 V
1.5
Vhys
IOZ
ri
Input hysteresis (VIT+ – VIT–
Output leakage current
Input resistance
)
0.3
V
EN = 1
±0.05
5
±10
μA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2) UNIT
tPLH Propagation delay time, low- to high-level output
tPHL Propagation delay time, high- to low-level output
300
300
200
200
300
ns
ns
ns
ns
ns
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ten
Output enable time
Output disable time
tdis
tsk(p) Pulse skew(3)
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 μF, C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
RS-232
Output
0 V
Generator
(see Note B)
50 Ω
C
L
t
R
L
t
TLH
THL
(see Note A)
3 V
PWRDOWN
V
V
OH
3 V
−3 V
3 V
−3 V
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
THL
TLH
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
PWRDOWN
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
EN
0 V
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH
PHL
C
L
(see Note A)
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
7
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
V
CC
GND
Input
1.5 V
1.5 V
S1
0 V
R
L
t
t
PZH
PHZ
S1 at GND)
(S1 at GND)
3 V or 0 V
Output
V
OH
C
L
Output
50%
(see Note A)
EN
0.3 V
0.3 V
t
PLZ
Generator
(see Note B)
(S1 at V
)
CC
50 Ω
Output
50%
V
OL
t
PZL
(S1 at V )
CC
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Enable and Disable Times
8
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TRSF3222E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS823–JULY 2007
APPLICATION INFORMATION
1
20
EN
Powerdown
PWRDOWN
2
19
18
V
C1+
V+
CC
+
−
C
BYPASS
= 0.1 µF
+
−
3
4
5
6
7
GND
C1
+
−
†
C3
17
16
DOUT1
RIN1
C1−
C2+
C2−
V−
5 kW
+
−
C2
C4
15
14
13
12
11
ROUT1
NC
−
+
8
9
DOUT2
RIN2
DIN1
DIN2
NC
5 kW
10
ROUT2
†
C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. NC − No internal connection
C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown.
V
CC
vs CAPACITOR VALUES
V
C1
C2, C3, and C4
0.1 µF
CC
0.1 µF
0.047 µF
0.1 µF
3.3 V " 0.3 V
5 V " 0.5 V
3 V to 5.5 V
0.33 µF
0.47 µF
Figure 5. Typical Operating Circuit and Capacitor Values
9
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRSF3222ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
20
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3222ECDBG4
TRSF3222ECDBR
TRSF3222ECDBRG4
TRSF3222ECDW
TRSF3222ECDWG4
TRSF3222ECDWR
TRSF3222ECDWRG4
TRSF3222ECPW
TRSF3222ECPWG4
TRSF3222ECPWR
TRSF3222ECPWRG4
TRSF3222EIDB
SSOP
SSOP
SSOP
SOIC
DB
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
DB
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3222EIDBG4
TRSF3222EIDBR
TRSF3222EIDBRG4
TRSF3222EIDW
DB
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
PW
PW
PW
PW
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3222EIDWG4
TRSF3222EIDWR
TRSF3222EIDWRG4
TRSF3222EIPW
SOIC
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3222EIPWG4
TRSF3222EIPWR
TRSF3222EIPWRG4
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TRSF3222ECDBR
TRSF3222ECDWR
TRSF3222ECPWR
TRSF3222EIDBR
TRSF3222EIDWR
TRSF3222EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
24.4
16.4
16.4
24.4
16.4
8.2
10.8
6.95
8.2
7.5
13.0
7.1
2.5
2.7
1.6
2.5
2.7
1.6
12.0
12.0
8.0
16.0
24.0
16.0
16.0
24.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
TSSOP
SSOP
SOIC
7.5
12.0
12.0
8.0
DW
PW
10.8
6.95
13.0
7.1
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRSF3222ECDBR
TRSF3222ECDWR
TRSF3222ECPWR
TRSF3222EIDBR
TRSF3222EIDWR
TRSF3222EIPWR
SSOP
SOIC
DB
DW
PW
DB
20
20
20
20
20
20
2000
2000
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
45.0
38.0
38.0
45.0
38.0
TSSOP
SSOP
SOIC
DW
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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