TRSF3238EIDBG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION; 3V至5.5V多通道RS - 232线路驱动器/接收器，具有± 15 kV的ESD （ HBM ）保护
| 型号： | TRSF3238EIDBG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD (HBM) PROTECTION |
| 文件： | 总20页 (文件大小：610K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
FEATURES
DB, DW, OR PW PACKAGE
•
RS-232 Bus-Pin ESD Protection Exceeds
(TOP VIEW)
±15 kV Using Human-Body Model (HBM)
C2+
GND
C2−
C1+
27 V+
26
1
28
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
2
3
V
CC
•
•
•
•
Operates With 3-V to 5.5-V VCC Supply
Operates up to 1000 kbit/s
V−
4
25 C1−
DOUT1
DOUT2
DOUT3
RIN1
5
24 DIN1
Five Drivers and Three Receivers
6
23
22
21
20
19
18
17
16
15
DIN2
Auto-Powerdown Plus Feature Enables
Flexible Power-Down Mode
7
DIN3
8
ROUT1
ROUT2
DIN4
9
RIN2
DOUT4
RIN3
•
•
•
•
Low Standby Current . . . 1 μA Typical
External Capacitors . . . 4 × 0.1 μF
10
11
12
13
14
ROUT3
DIN5
Accept 5-V Logic Input With 3.3-V Supply
DOUT5
FORCEON
FORCEOFF
Always-Active Noninverting Receiver Output
(ROUT1B)
ROUT1B
INVALID
•
ESD Protection for RS-232 Interface Pins
–
–
–
±15-kV Human-Body Model (HBM)
±8-kV IEC61000-4-2, Contact Discharge
±15-kV IEC61000-4-2, Air-Gap Discharge
RHB PACKAGE
(TOP VIEW)
APPLICATIONS
•
•
•
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Subnotebooks
Laptops
Palmtop PCs
Hand-Held Equipment
Modems
32 31 30 29 28 27 26 25
1
2
3
4
5
6
7
8
24
DOUT1
DOUT2
DOUT3
RIN1
RIN2
DOUT4
RIN3
C1–
DIN1
DIN2
DIN3
ROUT1
ROUT2
DIN4
23
22
21
20
19
18
17
Printers
NC
ROUT3
9 10 11 12 13 14 15 16
DESCRIPTION/ORDERING INFORMATION
The TRSF3238E consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV
ESD (HBM) protection on the driver output (DOUT) and receiver input (RIN) terminals. The device meets the
requirements of TIA/EIA-232-F and provides the electrical interface between notebook and subnotebook
computer applications. The charge pump and four small external capacitors allow operation from a single 3-V to
5.5-V supply. In addition, the device includes an always-active noninverting output (ROUT1B), which allows
applications using the ring indicator to transmit data while the device is powered down. The TRSF3238E
operates at data signaling rates up to 1000 kbit/s.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
Copyright © 2007, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
Flexible control options for power management are featured when the serial port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for
approximately 30 s, the built-in charge pump and drivers are powered down, reducing the supply current to
1 μA. By disconnecting the serial port or placing the peripheral drivers off, auto-powerdown plus occurs if there
is no activity in the logic levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and
FORCEOFF are high. With auto-powerdown plus enabled, the device activates automatically when a valid signal
is applied to any receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than
2.7 V or less than –2.7 V, or has been between –0.3 V and 0.3 V for less than 30 μs. INVALID is low (invalid
data) if all receiver input voltages are between –0.3 V and 0.3 V for more than 30 μs. Refer to Figure 5 for
receiver input levels.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRSF3238ECRHBR
TRSF3238ECDW
TRSF3238ECDWR
TRSF3238ECDB
TOP-SIDE MARKING
RS38EC
QFN – RHB
SOIC – DW
Reel of 2000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
Reel of 2000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
Tube of 50
Reel of 2000
TRS3238EC
TRS3238EC
0°C to 70°C
SSOP – DB
TRSF3238ECDBR
TRSF3238ECPW
TRSF3238ECPWR
TRSF3238EIRHBR
TRSF3238EIDW
TSSOP – PW
QFN – RHB
SOIC – DW
RS38EC
RS38EI
TRS3238EI
TRSF3238EIDWR
TRSF3238EIDB
–40°C to 85°C
SSOP – DB
TRS3238EI
RS38EI
TRSF3238EIDBR
TRSF3238EIPW
TSSOP – PW
TRSF3238EIPWR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
2
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
FUNCTION TABLES
abc
Each Driver(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
Z
H
L
Powered off
H
H
H
H
H
H
X
Normal operation with
auto-powerdown plus disabled
H
L
X
<30 s
<30 s
>30 s
>30 s
H
L
Normal operation with
auto-powerdown plus enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown plus feature
H
L
(1) H = high level, L = low level, X = irrelevant, Z = high impedance
Each Receiver(1)
INPUTS
FORCEOFF
OUTPUTS
RECEIVER STATUS
RIN2 AND
RIN3
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
ROUT2 AND
ROUT3
RIN1
ROUT1B
L
H
X
X
L
L
X
L
H
L
Z
Z
H
L
Powered off while
ROUT1B is active
X
L
L
H
H
H
H
H
<30 s
<30 s
<30 s
<30 s
<30 s
L
H
L
Normal operation with
auto-powerdown plus
disabled/enabled
H
L
H
H
L
H
L
H
H
Open
Open
H
(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
3
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
24
5
6
DIN1
DOUT1
23
DIN2
DOUT2
DOUT3
DOUT4
DOUT5
22
7
10
12
DIN3
19
DIN4
17
DIN5
14
FORCEOFF
15
Auto-Powerdown Plus
INVALID
13
FORCEON
16
ROUT1B
21
8
ROUT1
RIN1
20
9
ROUT2
RIN2
RIN3
18
11
ROUT3
4
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
–0.3
0.3
MAX
UNIT
VCC
V+
Supply voltage range(2)
Positive-output supply voltage range(2)
Negative-output supply voltage range(2)
6
V
V
V
V
7
–7
V–
V+ – V– Supply voltage difference(2)
13
Driver (FORCEOFF, FORCEON)
Receiver
–0.3
–25
6
VI
Input voltage range
Output voltage range
V
V
25
Driver
–13.2
–0.3
13.2
VCC + 0.3
62
VO
Receiver (INVALID)
DB package
DW package
46
θJA
Package thermal impedance(3)(4)
°C/W
PW package
62
RHB package
TBD
150
150
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 6
MIN NOM
MAX UNIT
VCC = 3.3 V
VCC = 5 V
VCC = 3.3 V
VCC = 5 V
3
4.5
2
3.3
5
3.6
V
Supply voltage
5.5
5.5
V
DIN, FORCEOFF,
FORCEON
VIH
Driver and control high-level input voltage
2.4
0
5.5
VIL
VI
Driver and control low-level input voltage
Receiver input voltage
DIN, FORCEOFF, FORCEON
0.8
25
70
85
V
V
–25
0
TRSF3238EC
TRSF3238EI
TA
Operating free-air temperature
°C
–40
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
II
Input leakage current FORCEOFF, FORCEON
±0.01
±1
μA
No load,
Auto-powerdown plus
disabled
FORCEOFF and FORCEON at VCC
VCC at 3.3 V or 5 V
,
0.5
1
2
mA
Supply current
Powered off
(TA = 25°C)
ICC
No load, FORCEOFF at GND
10
10
No load, FORCEOFF at VCC
,
μA
Auto-powerdown plus
enabled
FORCEON at GND,
All RIN are open or grounded
1
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
5
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
DRIVER SECTION
xxx
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
All DOUT at RL = 3 kΩ to GND
MIN TYP(2) MAX UNIT
VOH High-level output voltage
VOL Low-level output voltage
5
5.4
–5.4
V
V
All DOUT at RL = 3 kΩ to GND
VI = VCC
–5
IIH
IIL
High-level input current
Low-level input current
±0.01
±0.01
±1
±1
μA
μA
VI at GND
VCC = 3.6 V
VCC = 5.5 V
VO = ±2 V
±35 ±60
±40 ±100
10M
IOS
ro
Short-circuit output current(3) VO = 0 V
mA
Ω
Output resistance
VCC, V+, and V– = 0 V,
FORCEOFF = GND
300
VO = ±12 V,
VO = ±10 V,
VCC = 3 V to 3.6 V
±25
IOZ
Output leakage current
μA
VCC = 4.5 V to 5.5 V
±25
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
CL = 1000 pF
MIN TYP(2) MAX UNIT
250
Maximum data rate RL = 3 kΩ,
CL = 250 pF,
VCC = 3 V to 4.5 V
VCC = 4.5 V to 5.5 V
See Figure 2
1000
1000
kbit/s
(see Figure 1)
One DOUT switching
CL = 1000 pF,
tsk(p)
Pulse skew(3)
CL = 150 pF to 2500 pF,
CL = 150 pF to 1000 pF,
RL = 3 kΩ to 7 kΩ,
25
ns
Slew rate,
transition region
(see Figure 1)
SR(tr)
RL = 3 kΩ to 7 kΩ,
VCC = 3.3 V
18
150 V/μs
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP
±15
±15
±8
UNIT
HBM
DOUT
IEC 61000-4-2, Air-Gap Discharge
IEC 61000-4-2, Contact Discharge
kV
6
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
RECEIVER SECTION
xxx
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
High-level output voltage
TEST CONDITIONS
IOH = –1 mA
MIN
TYP(2)
MAX UNIT
VOH
VOL
VCC – 0.6
VCC – 0.1
V
Low-level output voltage
IOL = 1.6 mA
VCC = 3.3 V
VCC = 5 V
0.4
2.4
2.4
V
1.5
1.8
VIT+
Positive-going input threshold voltage
V
VCC = 3.3 V
VCC = 5 V
0.6
0.8
1.2
VIT–
Negative-going input threshold voltage
V
1.5
Vhys
IOZ
ri
Input hysteresis (VIT+ – VIT–
)
0.3
V
Output leakage current (except ROUT1B)
Input resistance
FORCEOFF = 0 V
±0.05
5
±10
μA
kΩ
VI = ±3 V to ±25 V
3
7
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
CL = 150 pF, See Figure 3
TYP(2) UNIT
tPLH Propagation delay time, low- to high-level output
tPHL Propagation delay time, high- to low-level output
150
150
200
200
50
ns
ns
ns
ns
ns
CL = 150 pF, See Figure 3
CL = 150 pF, RL = 3 kΩ, See Figure 4
CL = 150 pF, RL = 3 kΩ, See Figure 4
See Figure 3
ten
Output enable time
Output disable time
tdis
tsk(p) Pulse skew(3)
(1) Testing supply conditions are C1–C4 = 0.1 μF at VCC = 3.3 V ± 0.15 V; C1–C4 = 0.22 μF at VCC = 3.3 V ± 0.3 V; and C1 = 0.047 μF
and C2–C4 = 0.33 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PARAMETER
TEST CONDITIONS
TYP
±15
±15
±8
UNIT
HBM
RIN
IEC 61000-4-2, Air-Gap Discharge
IEC 61000-4-2, Contact Discharge
kV
7
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
AUTO-POWERDOWN PLUS SECTION
xxx
Electrical Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
Receiver input threshold
for INVALID high-level output voltage
VT+(valid)
VT–(valid)
VT(invalid)
VOH
FORCEON = GND, FORCEOFF = VCC
2.7
V
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND, FORCEOFF = VCC
FORCEON = GND, FORCEOFF = VCC
–2.7
–0.3
V
V
V
V
Receiver input threshold
for INVALID low-level output voltage
0.3
0.4
IOH = –1 mA, FORCEON = GND,
FORCEOFF = VCC
INVALID high-level output voltage
INVALID low-level output voltage
VCC – 0.6
IOL = 1.6 mA, FORCEON = GND,
FORCEOFF = VCC
VOL
Switching Characteristics
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
MIN
TYP(1)
0.1
MAX UNIT
tvalid
tinvalid
ten
μs
μs
μs
50
25
tdis
Receiver or driver edge to auto-powerdown plus
15
30
60
s
(1) All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C.
8
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
PARAMETER MEASUREMENT INFORMATION
3 V
Input
RS-232
0 V
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
V
OH
3 V
−3 V
3 V
−3 V
3 V
FORCEOFF
Output
OL
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PLH
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3 V
−3 V
Input
1.5 V
1.5 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
FORCEOFF
V
V
OH
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 3. Receiver Propagation Delay Times
9
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
Input
1.5 V
1.5 V
V
CC
GND
3 V or 0 V
FORCEON
0 V
S1
t
PHZ
R
L
(S1 at GND)
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
FORCEOFF
50 Ω
t
t
PZL
PLZ
(S1 at V )
CC
(S1 at V )
CC
Generator
(see Note B)
0.3 V
Output
50%
V
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis
D. tPZL and tPZH are the same as ten
VOLTAGE WAVEFORMS
.
.
Figure 4. Receiver Enable and Disable Times
10
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TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
PARAMETER MEASUREMENT INFORMATION (continued)
Valid RS-232 Level, INVALID High
ROUT
2.7 V
Generator
(see Note B)
50 Ω
Indeterminate
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
Auto-
Powerdown
Plus
INVALID
−2.7 V
C = 30 pF
(see Note A)
L
Valid RS-232 Level, INVALID High
†
Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
DIN
DOUT
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50%
O
duty cycle, t ≤ 10 ns, t ≤ 10 ns.
r
f
3 V
2.7 V
Receiver
Input
0 V
0 V
−2.7 V
−3 V
t
invalid
t
valid
INVALID
Output
V
CC
50%
50%
0 V
3 V to 5 V
Driver
Input
50%
50%
0 V
≈5.5 V
Driver
Output
≈ −5.5 V
t
dis
t
dis
t
en
t
en
V+
V+
V+ −0.3 V
Supply
Voltages
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation-Delay Times and Supply-Enabling Time
11
Submit Documentation Feedback
TRSF3238E
3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD (HBM) PROTECTION
www.ti.com
SLLS826–AUGUST 2007
APPLICATION INFORMATION
+
C
= 0.1 µF
BYPASS
−
28
27
C1+
V+
1
2
C2+
+
−
+
GND
†
C3
C2
+
−
−
C1
3
4
26
25
24
C2−
V−
V
CC
−
+
C1−
C4
5
6
7
8
9
DIN1
DIN2
DIN3
DOUT1
DOUT2
DOUT3
RIN1
23
22
21
20
ROUT1
ROUT2
RS-232 Port
RIN2
Logic I/Os
5 kΩ
10
11
19
18
DOUT4
RIN3
DIN4
ROUT3
5 kΩ
12
17
16
DOUT5
DIN5
ROUT1B
5 kΩ
Auto-
Powerdown
Plus
13
14
15
FORCEON
FORCEOFF
INVALID
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
†
C3 can be connected to V or GND.
CC
3.3 V ± 0.15 V
3.3 V ± 0.3 V
5 V ± 0.5 V
0.1 µF
0.22 µF
0.047 µF
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum
or electrolytic capacitors are used, they should be connected as
shown.
3 V to 5.5 V
Figure 6. Typical Operating Circuit and Capacitor Values
12
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRSF3238ECDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3238ECDBG4
TRSF3238ECDBR
TRSF3238ECDBRG4
TRSF3238ECDW
TRSF3238ECDWG4
TRSF3238ECDWR
TRSF3238ECDWRG4
TRSF3238EIDB
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
DB
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3238EIDBG4
TRSF3238EIDBR
TRSF3238EIDBRG4
TRSF3238EIDW
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRSF3238EIDWG4
TRSF3238EIDWR
TRSF3238EIDWRG4
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TRSF3238ECDBR
TRSF3238ECDWR
TRSF3238EIDBR
TRSF3238EIDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
28
28
28
28
2000
1000
2000
1000
330.0
330.0
330.0
330.0
16.4
32.4
16.4
32.4
8.2
11.35 18.67
8.2 10.5
11.35 18.67
10.5
2.5
3.1
2.5
3.1
12.0
16.0
12.0
16.0
16.0
32.0
16.0
32.0
Q1
Q1
Q1
Q1
DW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRSF3238ECDBR
TRSF3238ECDWR
TRSF3238EIDBR
TRSF3238EIDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
28
28
28
28
2000
1000
2000
1000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
55.0
38.0
55.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
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Copyright © 2012, Texas Instruments Incorporated
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