TS12A12511DRJR [TI]

6,-6 V/12 V, 5 Ohm, LOW rON SINGLE SPDT ANALOG SWITCH; 6 , -6 V / 12 V , 5欧姆,低rON的单SPDT模拟开关
TS12A12511DRJR
型号: TS12A12511DRJR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

6,-6 V/12 V, 5 Ohm, LOW rON SINGLE SPDT ANALOG SWITCH
6 , -6 V / 12 V , 5欧姆,低rON的单SPDT模拟开关

复用器 开关 复用器或开关 信号电路 光电二极管 输出元件
文件: 总24页 (文件大小:869K)
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TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
±6 V/+12 V, 5 , LOW rON SINGLE SPDT ANALOG SWITCH  
Check for Samples: TS12A12511  
1
FEATURES  
±2.7 V to ±6 V Dual Supply  
2.7 V to 12 V Single Supply  
5-(typ) ON-State Resistance  
DGK PACKAGE  
(TOP VIEW)  
1
8
COM  
NC  
NO  
1.6-(typ) ON-State Resistance Flatness  
3.3-V, 5-V Compatible Digital Control Inputs  
Rail-to-Rail Analog Signal Handling  
Fast tON, tOFF Times  
V
7
6
2
3
4
GND  
IN  
N.C.  
V
+
5
Tiny 8-Lead SOT-23, 8-Lead MSOP, and QFN-8  
Packages  
DCN PACKAGE  
(TOP VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
COM  
NO  
1
8
NC  
2
3
4
7
V
ESD Performance Tested per JESD 22  
GND  
IN  
6
5
2000-V Human-Body Model  
(A114-B, Class II)  
V
+
N.C.  
1000-V Charged-Device Model (C101)  
DRJ PACKAGE  
(TOP VIEW)  
APPLICATIONS  
Automatic Test Equipment  
Power Routing  
1
8
NO  
COM  
2
7
Communication Systems  
Data Acquisition Systems  
Sample-and-Hold Systems  
Relay Replacement  
V
NC  
3
4
6
5
GND  
IN  
V
+
N.C.  
Battery-Powered Systems  
N.C. Not internally connected  
NC Normally closed  
NO Normally open  
The Exposed Thermal Pad must be  
electrically connected to Vor left floating.  
DESCRIPTION/ORDERING INFORMATION  
The TS12A12511 is a single-pole double-throw (SPDT) analog switch capable of passing signals with swings of  
0 to 12 V or 6 V to 6 V. This switch conducts equally well in both directions when it is on. It also offers a low  
ON-state resistance of 5 Ω (typical), which is matched to within 1 Ω between channels. The max current  
consumption is <1 μA and 3 dB bandwidth is >93 MHz. The TS12A12511 exhibits break-before-make switching  
action, preventing momentary shorting when switching channels. This device is available packaged in an 8-lead  
MSOP, 8-lead SOT-23, and a 8-pin QFN.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
UNLESS OTHERWISE NOTED this document contains  
Copyright © 20092011, Texas Instruments Incorporated  
PRODUCTION DATA information current as of publication date.  
Products conform to specifications per the terms of Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
 
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
Table 1. ORDERING INFORMATION  
TA  
PACKAGE(1) (2)  
ORDERABLE PART NUMBER  
TS12A12511DGKR  
TOP-SIDE MARKING  
2US  
MSOP DGK  
QFN DRJ  
SOT DCN  
Tape and reel  
40°C to 85°C  
Tape and reel  
Tape and reel  
TS12A12511DRJR  
ZVE  
NFH  
TS12A12511DCNR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
TRUTH TABLE  
IN  
L
NC TO COM, COM TO NC NO TO COM, COM TO NO  
On  
Off  
Off  
On  
H
ABSOLUTE MAXIMUM RATINGS(1)  
TA = 25°C (unless otherwise noted).  
MIN  
MAX  
13  
UNIT  
V
V+ to V–  
V+ to GND  
Vto GND  
0.3  
6.5  
13  
V
0.3  
V
VI/O  
IIN  
Analog inputs  
V
0.5  
V + + 0.5  
±30  
V
Digital inputs  
mA  
mA  
mA  
°C  
°C  
Peak current  
NC, NO, or COM  
NC, NO, or COM  
±100  
±50  
II/O  
Continuous current  
Storage temperature range  
Operating temperature range  
Tstg  
TA  
65  
40  
150  
85  
(1) Stresses beyond those listed under absolute maximum ratingsmay cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditionsis not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
THERMAL IMPEDANCE RATINGS  
UNIT  
DCN package  
DGK package  
DRJ package  
220  
173  
103  
θJA  
Package thermal impedance  
°C/W  
2
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
ELECTRICAL CHARACTERISTICS  
±5-V Dual Supply  
V+ = 5 V ± 10%, V- = -5 V ± 10%, TA = 40°C to 85°C (unless otherwise noted)  
TA= 25°C  
TA= 40°C to 85°C  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
Analog Switch  
Analog signal range  
V–  
V+  
8
V
VNC = -4.5 V to +4.5 V  
or VNO = 4.5 V to 4.5 V, ICOM = 10 mA;  
see Figure 12  
ON-state resistance  
rON  
5
1
5
ON-state resistance  
match between  
channels  
VNC = -4.5 V to +4.5 V  
or VNO = -4.5 V to +4.5 V,  
ICOM = 10 mA  
ΔrON  
1.2  
2.2  
1.6  
2.2  
VNC = -3.3 V to +3.3 V  
or VNO = -3.3 V to +3.3 V,  
ICOM = 10 mA  
ON-state resistance  
flatness  
rON(flat)  
1.6  
Leakage Currents  
VNC = -4.5 V to +4.5 V  
or VNO = -4.5 V to +4.5V  
VCOM = -4.5 V to +4.5 V; see Figure 13  
INC(OFF)  
INO(OFF)  
,
OFF leakage current  
±0.5  
±0.5  
±1  
±1  
±50  
±50  
nA  
nA  
VNC = -4.5 V to +4.5 V  
or VNO = -4.5 V to +4.5 V  
VCOM = open; see Figure 14  
INC(ON)  
INO(ON)  
,
ON leakage current  
Digital Inputs  
High-level input  
voltage  
VINH  
2.4  
0
V+  
V
Low-level input  
voltage  
VINL  
IINL, IINH  
CIN  
0.8  
V
Input current  
VIN = VINL or VINH  
0.005  
2.5  
±1  
μA  
pF  
Control input  
capacitance  
Dynamic(1)  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V; see Figure 16  
Turn-ON time  
tON  
tOFF  
tBBM  
QC  
80  
41  
95  
50  
115  
56  
ns  
ns  
ns  
pC  
dB  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V  
Turn-OFF time  
Break-before-make  
time delay  
RL = 300 , CL = 35 pF,  
VNC = VNO = 3.3 V; see Figure 17  
36  
18  
VNC = VNO = 0 V, RGEN = 0 , CL = 1 nF;  
see Figure 18  
Charge injection  
OFF isolation  
26  
RL = 50 , CL = 5 pF, f = 1 MHz;  
see Figure 19  
OISO  
70  
Channel-to-channel  
crosstalk  
RL = 50 , CL = 5 pF, f = 1 MHz,  
see Figure 20  
XTALK  
BW  
70  
93  
dB  
MHz  
%
Bandwidth 3 dB  
RL = 50 , CL = 5 pF; see Figure 21  
Total harmonic  
distortion  
RL = 600 , CL = 15pF, VNO = 1VRMS,  
f = 20 kHz; see Figure 22  
THD  
0.004  
NC, NO  
OFF capacitance  
CNC(OFF)  
CNO(OFF)  
,
f = 1 MHz; see Figure 15  
f = 1 MHz; see Figure 15  
14  
60  
pF  
pF  
CCOM(ON)  
CNC(ON)  
CNO(ON)  
,
COM, NC, NO  
ON capacitance  
,
Supply  
Positive supply current  
I+  
0.03  
1
μA  
(1) Ensured by design, not subject to production test.  
Copyright © 20092011, Texas Instruments Incorporated  
3
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
12-V Single Supply  
V+ = 12 V ± 10%, V= 0 V, GND = 0 V, TA = 40°C to 85°C (unless otherwise noted)  
TA= 25°C  
TA= 40°C to 85°C  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
Analog Switch  
Analog signal range  
ON-state resistance  
0
V+  
8
V
VNC =0 V to 10.8 V or VNO = 0 V to  
10.8 V,  
ICOM = 10 mA, see Figure 12  
ron  
5
1.6  
1.7  
5
ON-state resistance  
match between  
channels  
VNC = 0 V to 10.8 V or VNO = 0 V to  
10.8 V,  
ICOM = 10 mA  
Δron  
2.4  
2.6  
3.2  
VNC = 3.3 V to 7V or VNO = 3.3 V to  
7 V,  
ICOM = 10 mA  
ON-state resistance  
flatness  
ron(flat)  
1.8  
Leakage Currents  
VNC = 0 V to 10.8 V or VNO = 0 V to  
10.8 V,  
VCOM = 0 V to 10.8 V; see  
Figure 13  
INC(OFF)  
INO(OFF)  
,
OFF leakage current  
±0.5  
±0.5  
±10  
±10  
±50  
±50  
nA  
nA  
VNC = 0 V to 10.8V or VNO = 0 V to  
10.8 V,  
VCOM = open; see Figure 14  
INC(ON)  
,
ON leakage current  
INO(ON)  
Digital Inputs  
High-level input voltage  
Low-level input voltage  
Input current  
VINH  
VINL  
5
0
V+  
0.8  
V
V
IINL, IINH  
CIN  
VIN = VINL or VINH  
±0.005  
±0.1  
μA  
pF  
Digital input capacitance  
2.7  
4
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
ELECTRICAL CHARACTERISTICS  
12-V Single Supply (continued)  
V+ = 12 V ± 10%, V= 0 V, GND = 0 V, TA = 40°C to 85°C (unless otherwise noted)  
TA= 25°C  
TA= 40°C to 85°C  
PARAMETER  
Dynamic(1)  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V; see Figure 16  
Turn-ON time  
Turn-OFF time  
tON  
tOFF  
tBBM  
56  
25  
30  
85  
30  
110  
31  
ns  
ns  
ns  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V; see Figure 16  
Break-before-make  
time delay  
RL = 300 , CL = 35 pF,  
VNC = VNO = 3.3 V; see Figure 17  
19  
RGEN = VNC = VNO = 0 V, RGEN = 0  
, CL = 1 nF;  
see Figure 18  
Charge injection  
OFF isolation  
QC  
491  
pC  
RL = 50 , CL = 5 pF, f = 1 MHz,  
see Figure 19  
OISO  
XTALK  
BW  
70  
70  
122  
0.04  
14  
dB  
dB  
Channel-to-channel  
crosstalk  
RL = 50 , CL = 5 pF, f = 1 MHz,  
see Figure 20  
RL = 50 , CL = 5 pF, see  
Figure 21  
Bandwidth 3 dB  
MHz  
%
RL = 600 , CL = 15pF, VNO  
=
Total harmonic distortion  
THD  
1VRMS, f = 20 kHz; see Figure 22  
NC, NO  
OFF capacitance  
CNC(OFF)  
CINO(OFF)  
,
f = 1 MHz, see Figure 15  
pF  
CCOM(ON)  
CNC(ON)  
CNO(ON)  
,
COM, NC, NO  
ON capacitance  
,
f = 1 MHz, see Figure 15  
55  
pF  
Supply  
Positive supply current  
I+  
0.07  
1
μA  
(1) Ensured by design, not subject to production test.  
Copyright © 20092011, Texas Instruments Incorporated  
5
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
5-V Single Supply  
V+ = 5 V ± 10%, V= 0 V, GND = 0 V, TA = 40°C to 85°C (unless otherwise noted)  
TA= 25°C  
TA= 40°C to 85°C  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
Analog Switch  
Analog signal range  
ON-state resistance  
0
V+  
V
VNC =0 V to 4.5 V or VNO = 0 V to  
4.5 V,  
ICOM = 10 mA;  
ron  
8
10  
12.5  
see Figure 12  
ON-state resistance  
match between  
channels  
VNC =0 V to 4.5 V or VNO = 0 V to  
4.5 V,  
ICOM = 10 mA  
Δron  
1
1.1  
1.5  
2
VNC =0 V to 4.5 V or VNO = 0 V to  
4.5 V,  
ICOM = 10 mA  
ON-state resistance  
flatness  
ron(flat)  
1.3  
1.3  
Leakage Currents  
VNC =0 V to 4.5 V or VNO = 0 V to  
4.5 V,  
VCOM = 0 V to 4.5 V; see Figure 13  
INC(OFF)  
INO(OFF)  
,
OFF leakage current  
±0.5  
±0.5  
±1  
±1  
±50  
±50  
nA  
nA  
VNC = 0 V to 4.5V or VNO = 0 V to  
4.5 V,  
VCOM = open; see Figure 14  
INC(ON)  
,
ON leakage current  
INO(ON)  
Digital Inputs  
High-level input voltage  
Low-level input voltage  
Input current  
VINH  
VINL  
2.4  
0
V+  
0.8  
V
V
IINL, IINH  
CIN  
VIN = VINL or VINH  
0.01  
2.8  
±0.1  
μA  
pF  
Digital input capacitance  
6
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
ELECTRICAL CHARACTERISTICS  
5-V Single Supply (continued)  
V+ = 5 V ± 10%, V= 0 V, GND = 0 V, TA = 40°C to 85°C (unless otherwise noted)  
TA= 25°C  
TA= 40°C to 85°C  
PARAMETER  
Dynamic(1)  
SYMBOL  
TEST CONDITIONS  
UNIT  
MIN  
TYP  
MAX  
MIN  
TYP  
MAX  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V; see Figure 16  
Turn-ON time  
Turn-OFF time  
tON  
tOFF  
tBBM  
119  
38  
145  
47  
178  
ns  
ns  
ns  
RL = 300 , CL = 35 pF,  
VCOM = 3.3 V; see Figure 16  
95.2  
Break-before-make  
time delay  
RL = 300 , CL = 35 pF,  
VNC = VNO = 3.3 V; see Figure 17  
79  
44  
VGEN = VNC = VNO = 0 V, RGEN = 0  
, CL = 1 nF;  
see Figure 18  
Charge injection  
OFF isolation  
QC  
65  
pC  
dB  
RL = 50 , CL = 5 pF, f = 1 MHz,  
see Figure 19  
OISO  
70  
Channel-to-channel  
crosstalk  
RL = 50 , CL = 5 pF, f = 1 MHz,  
see Figure 20  
XTALK  
BW  
70  
152  
dB  
MHz  
%
Bandwidth 3 dB  
RL = 50 , see Figure 21  
RL = 600 , CL = 15 pF, VNO = 1  
VRMS, f = 20 kHz; see Figure 22  
Total harmonic distortion  
THD  
0.04  
NC, NO  
OFF capacitance  
CNC(OFF)  
CNO(OFF)  
,
f = 1 MHz, see Figure 15  
f = 1 MHz, see Figure 15  
15  
55  
pF  
pF  
CCOM(ON)  
CNC(ON)  
INO(ON)  
,
COM, NC, NO  
ON capacitance  
,
Power Requirements  
V+ supply current  
I+  
VIN = 0 V or V+  
0.02  
1
μA  
(1) Ensured by design, not subject to production test.  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
Pin Function Descriptions  
TERMINAL  
NAME  
DESCRIPTION  
NO.  
COM  
NC  
1
2
3
4
5
6
Common terminal. Can be an input or output.  
Normally closed. Can be an input or output.  
Ground (0 V) reference  
GND  
V+  
Most positive power supply  
N.C.  
IN  
No connect. Not internally connected.  
Logic control input  
Most negative power supply. This pin is only used in dual-supply applications and should be tied to ground in  
single-supply applications.  
7
8
V–  
NO  
Normally open. Can be an input or output.  
Copyright © 20092011, Texas Instruments Incorporated  
7
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
TYPICAL PERFORMANCE CHARACTERISTICS  
0.10  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
0.05  
0.00  
-0.05  
-0.10  
-0.15  
-0.20  
-0.25  
-0.30  
-0.35  
-0.40  
V+=3V, V-=-3.0V  
V+=5V, V-=-5V  
V+=6V,V-=-6V  
25C/3V  
25C/5V  
25C/6V  
-6.0  
-4.0  
-2.0  
0.0  
2.0  
4.0  
6.0  
-6  
-5  
-4  
-3  
-2  
-1  
0
1
2
3
4
5
6
Switch I/O Voltage (V)  
V
IO  
(V)  
Figure 1. rON vs VIO  
Figure 2. Leakage Current vs I/O voltage (Switch ON)  
0.05  
0.00  
3.00  
2.50  
2.00  
1.50  
1.00  
0.50  
0.00  
-0.05  
-0.10  
-0.15  
-0.20  
-0.25  
-0.30  
-0.35  
V+=3V, V-=-3V  
V+=5V, V-=-5V  
V+=6V, V-=-6V  
25C/3V  
25C/5V  
25C/6V  
-6.0  
-4.0  
-2.0  
0.0  
2.0  
4.0  
6.0  
Switch I/O Voltage (V)  
-40.00  
25.00  
85.00  
Temperature (degrees C)  
Figure 3. Leakage Current vs I/O Voltage (Switch OFF)  
Figure 4. Positive Supply Current vs Temperature  
0.00  
-0.50  
-1.00  
-1.50  
-2.00  
-2.50  
-3.00  
7.0  
6.0  
5.0  
4.0  
3.0  
2.0  
1.0  
0.0  
-1.0  
-40.00  
25.00  
85.00  
V+=3V, V-=-3V  
V+=5V, V-=-5V  
V+=6V, V-=-6V  
V+=3V,V-=-3V  
V+=5V,V-=-5V  
V+=6V,V-=-6V  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Control Input Voltage (V)  
Temperature (Degrees C)  
Figure 5. Negative Supply Current vs Temperature  
Figure 6. Control Input (IN) Threshold Voltage  
8
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
-5.00  
-15.00  
-25.00  
-35.00  
-45.00  
-55.00  
-65.00  
-75.00  
0.0  
-2.0  
-4.0  
-6.0  
-8.0  
-10.0  
-12.0  
-14.0  
-16.0  
-18.0  
1.00E+6  
10.00E+6  
100.00E+6  
1.00E+9  
1.00E+6  
10.00E+6  
100.00E+6  
Frequency (Hz)  
1.00E+9  
Frequency (Hz)  
Figure 7. Bandwidth Dual Supply (±5V)  
Figure 8. Off Isolation vs Frequency Dual Supply (±5v)  
0.050  
0.045  
0.040  
0.035  
0.030  
0.025  
0.020  
0.015  
0.010  
0.005  
0.000  
-5.0  
-15.0  
-25.0  
-35.0  
-45.0  
-55.0  
-65.0  
12V_0V/NC-COM  
12V_0V/NO-COM  
5V_0V/NC-COM  
5V_0V/NO-COM  
5V_5V/NC-COM  
5V_5V/NO-COM  
-75.0  
1.00E+6  
10.00E+6  
100.00E+6  
Frequency (Hz)  
1.00E+9  
10  
100  
1000  
10000  
100000  
Frequency  
Figure 9. Crosstalk vs Frequency Dual Supply (±5V)  
Figure 10. THD+N (%) vs Frequency  
Copyright © 20092011, Texas Instruments Incorporated  
9
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
TYPICAL PERFORMANCE CHARACTERISTICS (continued)  
600  
500  
400  
300  
200  
100  
0
-100  
-200  
-300  
-400  
-500  
Bias Voltage  
Figure 11. Charge Injection vs Bias Voltage  
10  
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
TEST CIRCUITS  
V
+
V
NO  
NO  
COM  
V
COM  
+
Channel ON  
VCOM  
V
NO  
r
on  
V = V or V  
IL  
ICOM  
I
COM  
V
I
IN  
I
IH  
+
GND  
V–  
Figure 12. ON-State Resistance  
V
+
V
NO  
NO  
OFF-State Leakage Current  
Channel OFF  
COM  
V
COM  
+
+
V = V or V  
IL  
I
IH  
V
I
IN  
+
GND  
V–  
Figure 13. OFF-State Leakage Current (ICOM(OFF), INC(OFF)  
)
V
+
V
NO  
NO  
COM  
ON-State Leakage Current  
Channel ON  
V
COM  
+
V = V or V  
IL  
I
IH  
V
I
IN  
+
GND  
V–  
Figure 14. ON-State Leakage Current (ICOM(ON), INC(ON)  
)
Copyright © 20092011, Texas Instruments Incorporated  
11  
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
V
+
V
NO  
NO  
Capacitance  
Meter  
V
BIAS  
= V , V , or GND and  
+ IO  
V = V or GND  
IO  
I
COM COM  
IN  
Capacitance is measured at NO,  
COM, and IN inputs during ON  
and OFF conditions.  
V
BIAS  
V
I
GND  
V–  
Figure 15. Capacitance (CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON)  
)
V
+
TEST  
R
L
C
L
V
COM  
V
NO  
NO  
t
50  
50 Ω  
35 pF  
35 pF  
V
ON  
+
COM  
V
COM  
(2)  
C
L
R
L
t
V
+
OFF  
IN  
V
I
V
0
Logic  
Input  
IO  
50%  
50%  
Logic  
(1)  
(V )  
I
GND  
Input  
t
ON  
t
OFF  
V–  
Switch  
Output  
90%  
90%  
(V  
NO  
)
(1)  
(2)  
All input pulses are supplied by generators having the following characteristics: PRR10 MHz, Z = 50 , t < 5 ns, t < 5 ns.  
f
O
r
C includes probe and jig capacitance.  
L
Figure 16. Turn-ON (tON) and Turn-OFF Time (tOFF  
)
12  
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
V
+
V
IO  
Logic  
Input  
V
NC  
or V  
NO  
50%  
NC or NO  
NC or NO  
(V )  
I
0
V
COM  
COM  
Switch  
Output  
90%  
90%  
(2)  
C
R
L
L
(V  
)
COM  
IN  
V
I
t
BBM  
Logic  
(1)  
V
or V = V /2  
NO +  
NC  
GND  
Input  
R = 50  
L
C = 35 pF  
L
V–  
(1)  
(2)  
All input pulses are supplied by generators having the following characteristics: PRR10 MHz, Z = 50 , t < 5 ns, t < 5 ns.  
f
O
r
C includes probe and jig capacitance.  
L
Figure 17. Break-Before-Make Time Delay (tBBM  
)
V
IH  
V
+
Logic  
Input  
OFF  
ON  
OFF  
V
(V  
I)  
IL  
R
GEN  
NO  
COM  
V
COM  
+
V
COM  
V  
COM  
V
GEN  
(1)  
C
L
V
= 0 to V  
= 0  
GEN  
+
V
I
IN  
R
GEN  
C = 1 nF  
L
Logic  
(2)  
GND  
Q = C × V  
C L COM  
Input  
V = V or V  
IL  
I
IH  
V–  
(1)  
(2)  
C includes probe and jig capacitance.  
L
All input pulses are supplied by generators having the following characteristics: PRR10 MHz, Z = 50 , t < 5 ns, t < 5 ns.  
f
O
r
Figure 18. Charge Injection (QC)  
V
+
Network Analyzer  
Channel OFF: NO to COM  
V = V or GND  
50 W  
V
NO  
NO  
I
IO  
V
COM  
COM  
Source  
Signal  
50 W  
Network Analyzer Setup  
Source Power = 0 dBm  
V
I
IN  
(632-mV P-P at 50-Wload)  
50 W  
+
GND  
DC Bias = 350 mV  
V–  
Figure 19. OFF Isolation (OISO  
)
Copyright © 20092011, Texas Instruments Incorporated  
13  
TS12A12511  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
www.ti.com  
V
+
Network Analyzer  
50 W  
V
NO1  
NO1  
NO2  
Channel ON: NO to COM  
COM1  
COM2  
Source  
Signal  
V
NO2  
Network Analyzer Setup  
50 W  
Source Power = 0 dBm  
V
I
IN  
50 W  
(632 mV P-P at 50 Wload)  
+
DC Bias = 350 mV  
GND  
V–  
Figure 20. Channel-to-Channel Crosstalk (XTALK  
)
V
+
Network Analyzer  
50 W  
V
NO NO  
Channel ON: NO to COM  
V = V or V  
V
COM  
COM  
I
IH  
IL  
Source  
Signal  
Network Analyzer Setup  
V
I
IN  
Source Power = 0 dBm  
50 W  
(632-mV P-P at 50-Wload)  
+
GND  
DC Bias = 350 mV  
V–  
Figure 21. Bandwidth (BW)  
V = (V – V /2) or -V /2  
+
Channel ON: COM to NO  
= V P-P  
R = 600  
L
I
IO  
+
V
f = 20 Hz to 20 kHz  
SOURCE  
C = 50 pF  
L
SOURCE  
+
V /2  
+
Audio Analyzer  
NO  
Source  
Signal  
COM  
IN  
(1)  
C
L
600  
V
I
600  
V–  
-V /2  
+
(1)  
C includes probe and jig capacitance.  
L
Figure 22. Total Harmonic Distortion  
14  
Copyright © 20092011, Texas Instruments Incorporated  
TS12A12511  
www.ti.com  
SCDS248B OCTOBER 2009REVISED APRIL 2011  
REVISION HISTORY  
Changes from Revision A (May 2010) to Revision B  
Page  
Deleted preview status from DGK and DCN packages. ....................................................................................................... 1  
Copyright © 20092011, Texas Instruments Incorporated  
15  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
TS12A12511DCNR  
TS12A12511DGKR  
TS12A12511DRJR  
SOT-23  
VSSOP  
SON  
DCN  
DGK  
DRJ  
8
8
8
3000  
2500  
1000  
180.0  
330.0  
180.0  
8.4  
3.23  
5.3  
3.17  
3.4  
1.37  
1.4  
4.0  
8.0  
8.0  
8.0  
Q3  
Q1  
Q2  
12.4  
12.4  
12.0  
12.0  
4.25  
4.25  
1.15  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Aug-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TS12A12511DCNR  
TS12A12511DGKR  
TS12A12511DRJR  
SOT-23  
VSSOP  
SON  
DCN  
DGK  
DRJ  
8
8
8
3000  
2500  
1000  
202.0  
358.0  
210.0  
201.0  
335.0  
185.0  
28.0  
35.0  
35.0  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms  
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