TS2DDR2811_14 [TI]

1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH;
TS2DDR2811_14
型号: TS2DDR2811_14
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH

文件: 总13页 (文件大小:222K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TS2DDR2811  
www.ti.com  
SCDS294 DECEMBER 2009  
1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH  
Check for Samples: TS2DDR2811  
1
FEATURES  
ZXY PACKAGE  
(BOTTOM VIEW)  
Wide Bandwidth (BW = 1100 MHz Typ)  
Low Crosstalk (XTALK = –37 dB Typ)  
Low Bit-to-Bit Skew (tsk(o) = 100 ps Max)  
D
C
B
A
Low and Flat ON-State Resistance  
(rON = 4 Typ, rON(flat) = 0.5 Typ)  
Low Input/Output Capacitance  
(CON = 8 pF Typ)  
Rail-to-Rail Switching on Data I/O Ports  
(0 V to 5 V)  
VCC Operating Range From 3 V to 3.6 V  
1
2
3
4
5
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
TERMINAL ASSIGNMENTS  
ESD Performance Tested Per JESD 22  
D
C
B
A
B6  
B 7  
GND  
A7  
B5  
B4  
A5  
A6  
2
B3  
B2  
A3  
A4  
3
SEL  
B1  
A1  
A2  
4
B0  
N.C.  
VCC  
A0  
2000-V Human-Body Model  
(A114-B, Class II)  
1000-V Charged-Device Model (C101)  
1
5
APPLICATIONS  
DDR2 Signal Switching  
GbE LAN Signal Switching  
Hub and Router Signal Switching  
Audio/Video Switching  
DESCRIPTION/ORDERING INFORMATION  
The TS2DDR2811 is a 8-channel single-pole single-throw (SPST) signal switch capable of switching signals with  
bandwidth in excess of 1 GHz. The device includes a select pin (SEL) that is used to select any 1 of the 8  
channel inputs. This select pin controls the data path of the SPST switch. The device provides a low and flat  
ON-state resistance (rON) and an excellent ON-state resistance match. Low input/output capacitance, high  
bandwidth, low skew, and low crosstalk among channels make this device suitable for various high-bandwidth  
applications, such as DDR2, 10/100/1000 Base-T, audio, and video.  
Table 1. ORDERING INFORMATION  
TA  
PACKAGE(1) (2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
SJ811  
–40°C to 85°C  
BGA – ZXY  
Tape and reel  
TS2DDR2811ZXYR  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TS2DDR2811  
SCDS294 DECEMBER 2009  
www.ti.com  
FUNCTION TABLE  
INPUT  
SEL  
INPUT  
OUTPUT  
FUNCTION  
H
L
An  
-
Bn  
-
An = Bn  
An and Bn are Hi-Z  
LOGIC DIAGRAM  
A
0
B
0
A
1
B
1
A
2
B
2
A
3
B
3
A
4
B
4
A
5
B
5
A
6
B
6
A
7
B
7
Control  
Logic  
SEL  
TERMINAL FUNCTIONS  
BALL  
DESCRIPTION  
NAME  
NO.  
A0, A1, A2, A3,  
A4, A5, A6, A7  
A5, B4, A4 B3,  
A3, B2, A2, A1  
Data I/Os  
B0, B1, B2,B3,  
B4, B5 , B6, B7  
D5, C4, C3, D3,  
C2, D2, D1, C1  
Data I/Os  
GND  
SEL  
VCC  
B1  
D4  
B5  
Ground  
Select inputs  
Supply voltage  
2
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
www.ti.com  
SCDS294 DECEMBER 2009  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX UNIT  
VCC  
VIN  
VI/O  
IIK  
Supply voltage range  
4.6  
7
V
Control input voltage range(2) (3)  
Switch I/O voltage range(2) (3) (4)  
Control input clamp current  
I/O port clamp current  
V
7
V
VIN < 0 or VIN > VCC  
VI/O < 0 or VI/O > VCC  
–50  
–50  
±128  
±100  
mA  
mA  
mA  
mA  
II/OK  
II/O  
ON-state switch current(5)  
Continuous current through VDD or GND  
Package thermal impedance(6)  
Storage temperature range  
θJA  
31.8 °C/W  
150 °C  
Tstg  
–65  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) All voltages are with respect to ground, unless otherwise specified.  
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(4) VI and VO are used to denote specific conditions for VI/O  
.
(5) II and IO are used to denote specific conditions for II/O  
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.  
RECOMMENDED OPERATING CONDITIONS(1)  
MIN  
3
MAX UNIT  
VCC  
VIH  
VIL  
VI  
Supply voltage  
3.6  
5.5  
0.8  
5.5  
VCC  
85  
V
V
High-level control input voltage  
Low-level control input voltage  
Input voltage  
SEL  
SEL  
SEL  
2
0
V
0
V
VI/O  
TA  
Input/output voltage  
0
V
Operating free-air temperature  
–40  
°C  
(1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
ELECTRICAL CHARACTERISTICS  
for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V  
(unless otherwise noted)  
PARAMETER  
SEL  
TEST CONDITIONS(1)  
MIN TYP(2) MAX UNIT  
VIK  
IIH  
VCC = 3.6 V,  
VCC = 3.6 V,  
VCC = 3.6 V,  
VCC = 3.6 V,  
f = 1 M Hz,  
VI = 0,  
IIN = –18 mA  
–0.7 –1.2  
±1  
V
μA  
μA  
μA  
pF  
pF  
pF  
SEL  
VIN = VCC  
VIN = GND  
II/O = 0,  
IIL  
SEL  
±1  
ICC  
CIN  
Switch ON or OFF  
250 500  
SEL  
VIN = 0  
2
2.5  
8
2.5  
4
COFF  
CON  
B port  
f = 1 MHz,  
f = 1 MHz,  
1.5 V VI VCC  
Outputs open,  
Outputs open,  
IO = –40 mA  
IO = –40 mA  
IO = –40 mA  
Switch OFF  
Switch ON  
VI = 0,  
TBD  
6
rON  
VCC = 3 V,  
VCC = 3 V,  
VCC = 3 V,  
,
4
(3)  
rON(flat)  
VI = 1.5 V and VCC  
,
0.5  
0.4  
(4)  
ΔrON  
1.5 V VI VCC  
,
1
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.  
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.  
(3) rON(flat) is the difference of rON in a given channel at specified voltages.  
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
SCDS294 DECEMBER 2009  
www.ti.com  
ELECTRICAL CHARACTERISTICS  
for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V  
(unless otherwise noted)  
PARAMETER  
TEST CONDITIONS(1)  
MIN  
TYP(2)  
MAX UNIT  
VIK  
SEL  
SEL  
SEL  
VCC = 3.6 V,  
VCC = 3.6 V,  
VCC = 3.6 V,  
VCC = 3.6 V,  
f = 1 MHz,  
VI = 0,  
IIN = –18 mA  
VIN = VCC  
–0.7  
–1.2  
±1  
V
μA  
μA  
μA  
pF  
pF  
pF  
IIH  
IIL  
VIN = GND  
II/O = 0,  
±1  
ICC  
Switch ON or OFF  
250  
2
500  
2.5  
4
CIN  
SEL  
VIN = 0  
COFF  
CON  
rON  
B port  
f = 1 MHz,  
f = 1 MHz,  
1.25 V VI VCC  
Outputs open,  
Switch OFF  
Switch ON  
2.5  
8
VI = 0,  
Outputs open,  
VCC = 3 V,  
VCC = 3 V,  
VCC = 3 V,  
,
IO = –10 mA to –30 mA  
IO = –10 mA to –30 mA  
IO = –10 mA to –30 mA  
4
6
1
(3)  
rON(flat)  
VI = 1.25 V and VCC  
,
0.5  
0.4  
(4)  
ΔrON  
1.25 V VI VCC  
,
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.  
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.  
(3) rON(flat) is the difference of rON in a given channel at specified voltages.  
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, RL = 200 , CL = 10 pF  
(unless otherwise noted) (see Figure 5 and Figure 6)  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
MIN  
TYP(1)  
MAX  
UNIT  
(2)  
tpd  
A or B  
SEL  
B or A  
A or B  
A or B  
B or A  
40  
ps  
ns  
ns  
ps  
ps  
tPZH, tPZL  
0.5  
0.9  
15  
9
tPHZ, tPLZ  
SEL  
(3)  
tsk(o)  
A or B  
50  
50  
100  
150  
(4)  
tsk(p)  
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.  
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load  
capacitance when driven by an ideal voltage source (zero output impedance).  
(3) Output skew between center port (A4 to A5) to any other port  
(4) Skew between opposite transitions of the same output in a given device |tPHL – tPLH  
|
DYNAMIC CHARACTERISTICS  
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted)  
PARAMETER  
XTALK  
TEST CONDITIONS  
f = 250 MHz,  
TYP(1)  
–37  
UNIT  
dB  
RL = 100 ,  
RL = 100 ,  
RL = 50 ,  
See Figure 8  
See Figure 9  
OIRR  
f = 250 MHz,  
See Figure 7  
–37  
dB  
BW  
1100  
MHz  
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.  
4
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
www.ti.com  
SCDS294 DECEMBER 2009  
OPERATING CHARACTERISTICS  
0
−2  
0
−20  
−40  
−4  
−6  
−60  
−8  
−80  
−10  
−12  
0.1  
−100  
1000  
10,000  
1
0.1  
10  
100  
1
10  
Frequency (MHz)  
Figure 1. Gain vs Frequency  
100  
1000  
10,000  
Frequency (MHz)  
Figure 2. OFF Isolation vs Frequency  
6
5
4
3
2
1
0
0
−20  
−40  
−60  
−80  
−100  
0
1
2
3
4
5
6
1000  
10,000  
1
0.1  
10  
100  
V
COM  
(V)  
Frequency (MHz)  
Figure 3. Crosstalk vs Frequency  
Figure 4. rON () vs Vcom (V)  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
SCDS294 DECEMBER 2009  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
(Enable and Disable Times)  
V
CC  
Input Generator  
V
SEL  
50  
50 Ω  
V
G1  
TEST CIRCUIT  
DUT  
2 × V  
CC  
Input Generator  
50 Ω  
S1  
Open  
GND  
R
L
V
V
O
I
C
L
50 Ω  
V
G2  
R
L
(see Note A)  
S1  
V
I
V
C
L
R
L
V
CC  
TEST  
t
/t  
PLZ PZL  
3.3 V ± 0.3 V  
3.3 V ± 0.3 V  
2
V
200 Ω  
200 Ω  
GND  
10 pF  
10 pF  
0.3 V  
0.3 V  
×
CC  
t
/t  
PHZ PZH  
GND  
V
CC  
3.3 V  
0 V  
Output Control  
(V  
1.65 V  
1.65 V  
)
SEL  
V
SEL  
t
t
PLZ  
PZL  
Output  
V
OH  
OL  
Waveform 1  
S1 at 2 ×V  
V
/2  
/2  
CC  
V
O
O
CC  
V
V
+ 0.3 V  
OL  
V
(see Note B)  
t
t
PHZ  
PZH  
Output  
Waveform 2  
S1 at GND  
(see Note B)  
V
V
OH  
- 0.3 V  
OH  
V
V
CC  
OL  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output  
control. Waveform 2is for an output with internal conditions such that the output is high, except when disabled by the  
output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5  
ns, tf 2.5 ns.  
D. The outputs are measured one at a time, with one transition per measurement.  
E. tPLZ and tPHZ are the same as tdis  
F. tPZL and tPZH are the same as ten  
.
.
Figure 5. Test Circuit and Voltage Waveforms  
6
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
www.ti.com  
SCDS294 DECEMBER 2009  
PARAMETER MEASUREMENT INFORMATION  
(Skew)  
V
CC  
Input Generator  
V
SEL  
50  
50 Ω  
V
G1  
TEST CIRCUIT  
DUT  
2 × V  
CC  
Input Generator  
50 Ω  
S1  
Open  
GND  
R
L
V
V
O
I
C
L
(see Note A)  
50 Ω  
V
G2  
R
L
S1  
V
in  
C
L
R
L
V
CC  
TEST  
t
3.3 V ± 0.3 V  
3.3 V ± 0.3 V  
Open  
200 Ω  
200 Ω  
V
V
or GND  
or GND  
10 pF  
10 pF  
sk(o)  
CC  
t
Open  
sk(p)  
CC  
3.5 V  
Data In at  
Ax or A y  
V
I
2.5 V  
1.5 V  
t
t
PHLx  
PLHx  
V
OH  
Data Out at  
XB or XB  
V
O
O
(V + V )/2  
OH OL  
3.5 V  
1
2
V
OL  
2.5 V  
1.5 V  
Input  
t
t
sk(o)  
sk(o)  
V
OH  
V
Data Out at  
t
t
PHL  
PLH  
(V + V )/2  
OH OL  
YB or YB  
1
2
V
OH  
V
OL  
Output  
(V + V )/2  
OH OL  
t
t
PHLy  
PLHy  
V
OL  
t
= t  
- t  
PHL PLH  
sk(p)  
t
= t  
- t  
or t  
- t  
PHLy PHLx  
sk(o)  
PLHy  
PLHx  
VOLTAGE WAVEFORMS  
OUTPUT SKEW (t  
VOLTAGE WAVEFORMS  
PULSE SKEW [t  
)
]
sk(p)  
sk(o)  
A. CL includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output  
control. Waveform 2is for an output with internal conditions such that the output is high, except when disabled by the  
output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5  
ns, tf 2.5 ns.  
D. The outputs are measured one at a time, with one transition per measurement.  
Figure 6. Test Circuit and Voltage Waveforms  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
SCDS294 DECEMBER 2009  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION  
EXT TRIGGER  
BIAS  
Network Analyzer  
(HP8753ES)  
V
BIAS  
P1  
P2  
V
CC  
A
B
X
x
C
L
= 10 pF  
(see Note A)  
DUT  
SEL  
V
SEL  
A. CL includes probe and jig capacitance.  
Figure 7. Test Circuit for Frequency Response (BW)  
Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the  
input, the output is measured at B0. All unused analog I/O ports are left open.  
HP8753ES Setup  
Average = 4  
RBW = 3 kHz  
VBIAS = 0.35 V  
ST = 2 s  
P1 = 0 dBM  
8
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
www.ti.com  
SCDS294 DECEMBER 2009  
PARAMETER MEASUREMENT INFORMATION (continued)  
EXT TRIGGER  
BIAS  
Network Analyzer  
(HP8753ES)  
V
BIAS  
P1  
P2  
V
CC  
A
A
B
0
0
R
L
= 100 W  
B
1
1
DUT  
A
A
B
2
2
R
L
= 100 W  
B
3
3
SEL  
V
SEL  
Figure 8. Test Circuit for Crosstalk (XTALK  
)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSELn = 0 and A0 is the  
input, the output is measured at B0. All unused analog input (A) ports are connected to GND, and output (B)  
ports are connected to GND through 50-pulldown resistors.  
HP8753ES Setup  
Average = 4  
RBW = 3 kHz  
VBIAS = 0.35 V  
ST = 2 s  
P1 = 0 dBM  
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TS2DDR2811  
TS2DDR2811  
SCDS294 DECEMBER 2009  
www.ti.com  
PARAMETER MEASUREMENT INFORMATION (continued)  
EXT TRIGGER  
BIAS  
Network Analyzer  
(HP8753ES)  
V
BIAS  
P1  
P2  
V
CC  
A
A
0B  
0
1
1
1
R
L
= 100  
1B  
DUT  
0B  
1B  
2
2
SEL  
V
SE  
L
A. CL includes probe and jig capacitance.  
B. A 50-termination resistor is needed to match the loading of the network analyzer.  
Figure 9. Test Circuit for Off Isolation (OIRR  
)
OFF isolation is measured at the output of the OFF channel. For example, when VSELn = VCC and A0 is the input,  
the output is measured at B0. All unused analog input (A) ports are left open, and output (B) ports are connected  
to GND through 50-pulldown resistors.  
HP8753ES Setup  
Average = 4  
RBW = 3 kHz  
VBIAS = 0.35 V  
ST = 2 s  
P1 = 0 dBM  
10  
Submit Documentation Feedback  
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS2DDR2811  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Dec-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TS2DDR2811ZXYR  
ACTIVE  
BGA MI  
CROSTA  
R JUNI  
OR  
ZXY  
20  
2500 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are  
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide  
adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,  
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information  
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a  
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual  
property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied  
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive  
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional  
restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all  
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not  
responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably  
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing  
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and  
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products  
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be  
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in  
such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at  
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are  
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated  
products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Applications  
Audio  
Automotive  
Broadband  
Digital Control  
Medical  
Military  
Optical Networking  
Security  
amplifier.ti.com  
dataconverter.ti.com  
www.dlp.com  
www.ti.com/audio  
Data Converters  
DLP® Products  
DSP  
Clocks and Timers  
Interface  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/medical  
www.ti.com/military  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
dsp.ti.com  
www.ti.com/clocks  
interface.ti.com  
logic.ti.com  
power.ti.com  
microcontroller.ti.com  
www.ti-rfid.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
Telephony  
Video & Imaging  
Wireless  
RF/IF and ZigBee® Solutions www.ti.com/lprf  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2009, Texas Instruments Incorporated  

相关型号:

TS2GCF100I

Industrial CF Card
TRANSCEND

TS2GCF133

133X CompactFlash Card
TRANSCEND

TS2GCF266

266X CompactFlash Card
TRANSCEND

TS2GCFI

industrial CompactFlash Card
TRANSCEND

TS2GDOM40H-S

40-Pin IDE Flash Module (Horizontal)
TRANSCEND

TS2GDOM40V

40-Pin IDE Flash Module
TRANSCEND

TS2GDOM40V-S

40-Pin IDE Flash Module
TRANSCEND

TS2GDOM44H

44-Pin IDE Flash Module(Horizontal)
TRANSCEND

TS2GDOM44H-S

44-Pin IDE Flash Module(Horizontal)
TRANSCEND

TS2GDOM44V

44-Pin IDE Flash Module
TRANSCEND

TS2GDOM44V-S

44-Pin IDE Flash Module
TRANSCEND

TS2GF300

300X CompactFlash Card
TRANSCEND