TS2DDR2811_14 [TI]
1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH;
| 型号： | TS2DDR2811_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH |
| 文件： | 总13页 (文件大小：222K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS2DDR2811
www.ti.com
SCDS294 –DECEMBER 2009
1-GHz BANDWIDTH, 8-CHANNEL SPST SWITCH
Check for Samples: TS2DDR2811
1
FEATURES
ZXY PACKAGE
(BOTTOM VIEW)
•
•
•
•
Wide Bandwidth (BW = 1100 MHz Typ)
Low Crosstalk (XTALK = –37 dB Typ)
Low Bit-to-Bit Skew (tsk(o) = 100 ps Max)
D
C
B
A
Low and Flat ON-State Resistance
(rON = 4 Ω Typ, rON(flat) = 0.5 Ω Typ)
•
•
Low Input/Output Capacitance
(CON = 8 pF Typ)
Rail-to-Rail Switching on Data I/O Ports
(0 V to 5 V)
•
•
VCC Operating Range From 3 V to 3.6 V
1
2
3
4
5
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
TERMINAL ASSIGNMENTS
•
ESD Performance Tested Per JESD 22
D
C
B
A
B6
B 7
GND
A7
B5
B4
A5
A6
2
B3
B2
A3
A4
3
SEL
B1
A1
A2
4
B0
N.C.
VCC
A0
–
2000-V Human-Body Model
(A114-B, Class II)
–
1000-V Charged-Device Model (C101)
1
5
APPLICATIONS
•
•
•
•
DDR2 Signal Switching
GbE LAN Signal Switching
Hub and Router Signal Switching
Audio/Video Switching
DESCRIPTION/ORDERING INFORMATION
The TS2DDR2811 is a 8-channel single-pole single-throw (SPST) signal switch capable of switching signals with
bandwidth in excess of 1 GHz. The device includes a select pin (SEL) that is used to select any 1 of the 8
channel inputs. This select pin controls the data path of the SPST switch. The device provides a low and flat
ON-state resistance (rON) and an excellent ON-state resistance match. Low input/output capacitance, high
bandwidth, low skew, and low crosstalk among channels make this device suitable for various high-bandwidth
applications, such as DDR2, 10/100/1000 Base-T, audio, and video.
Table 1. ORDERING INFORMATION
TA
PACKAGE(1) (2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
SJ811
–40°C to 85°C
BGA – ZXY
Tape and reel
TS2DDR2811ZXYR
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS2DDR2811
SCDS294 –DECEMBER 2009
www.ti.com
FUNCTION TABLE
INPUT
SEL
INPUT
OUTPUT
FUNCTION
H
L
An
-
Bn
-
An = Bn
An and Bn are Hi-Z
LOGIC DIAGRAM
A
0
B
0
A
1
B
1
A
2
B
2
A
3
B
3
A
4
B
4
A
5
B
5
A
6
B
6
A
7
B
7
Control
Logic
SEL
TERMINAL FUNCTIONS
BALL
DESCRIPTION
NAME
NO.
A0, A1, A2, A3,
A4, A5, A6, A7
A5, B4, A4 B3,
A3, B2, A2, A1
Data I/Os
B0, B1, B2,B3,
B4, B5 , B6, B7
D5, C4, C3, D3,
C2, D2, D1, C1
Data I/Os
GND
SEL
VCC
B1
D4
B5
Ground
Select inputs
Supply voltage
2
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SCDS294 –DECEMBER 2009
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX UNIT
VCC
VIN
VI/O
IIK
Supply voltage range
4.6
7
V
Control input voltage range(2) (3)
Switch I/O voltage range(2) (3) (4)
Control input clamp current
I/O port clamp current
V
7
V
VIN < 0 or VIN > VCC
VI/O < 0 or VI/O > VCC
–50
–50
±128
±100
mA
mA
mA
mA
II/OK
II/O
ON-state switch current(5)
Continuous current through VDD or GND
Package thermal impedance(6)
Storage temperature range
θJA
31.8 °C/W
150 °C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
.
(5) II and IO are used to denote specific conditions for II/O
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
MIN
3
MAX UNIT
VCC
VIH
VIL
VI
Supply voltage
3.6
5.5
0.8
5.5
VCC
85
V
V
High-level control input voltage
Low-level control input voltage
Input voltage
SEL
SEL
SEL
2
0
V
0
V
VI/O
TA
Input/output voltage
0
V
Operating free-air temperature
–40
°C
(1) All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
ELECTRICAL CHARACTERISTICS
for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER
SEL
TEST CONDITIONS(1)
MIN TYP(2) MAX UNIT
VIK
IIH
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
f = 1 M Hz,
VI = 0,
IIN = –18 mA
–0.7 –1.2
±1
V
μA
μA
μA
pF
pF
pF
Ω
SEL
VIN = VCC
VIN = GND
II/O = 0,
IIL
SEL
±1
ICC
CIN
Switch ON or OFF
250 500
SEL
VIN = 0
2
2.5
8
2.5
4
COFF
CON
B port
f = 1 MHz,
f = 1 MHz,
1.5 V ≤ VI ≤ VCC
Outputs open,
Outputs open,
IO = –40 mA
IO = –40 mA
IO = –40 mA
Switch OFF
Switch ON
VI = 0,
TBD
6
rON
VCC = 3 V,
VCC = 3 V,
VCC = 3 V,
,
4
(3)
rON(flat)
VI = 1.5 V and VCC
,
0.5
0.4
Ω
(4)
ΔrON
1.5 V ≤ VI ≤ VCC
,
1
Ω
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.
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SCDS294 –DECEMBER 2009
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ELECTRICAL CHARACTERISTICS
for 10/100 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN
TYP(2)
MAX UNIT
VIK
SEL
SEL
SEL
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
VCC = 3.6 V,
f = 1 MHz,
VI = 0,
IIN = –18 mA
VIN = VCC
–0.7
–1.2
±1
V
μA
μA
μA
pF
pF
pF
Ω
IIH
IIL
VIN = GND
II/O = 0,
±1
ICC
Switch ON or OFF
250
2
500
2.5
4
CIN
SEL
VIN = 0
COFF
CON
rON
B port
f = 1 MHz,
f = 1 MHz,
1.25 V ≤ VI ≤ VCC
Outputs open,
Switch OFF
Switch ON
2.5
8
VI = 0,
Outputs open,
VCC = 3 V,
VCC = 3 V,
VCC = 3 V,
,
IO = –10 mA to –30 mA
IO = –10 mA to –30 mA
IO = –10 mA to –30 mA
4
6
1
(3)
rON(flat)
VI = 1.25 V and VCC
,
0.5
0.4
Ω
(4)
ΔrON
1.25 V ≤ VI ≤ VCC
,
Ω
(1) VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) rON(flat) is the difference of rON in a given channel at specified voltages.
(4) ΔrON is the difference of rON from center (A4, A5) ports to any other port.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF
(unless otherwise noted) (see Figure 5 and Figure 6)
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
TYP(1)
MAX
UNIT
(2)
tpd
A or B
SEL
B or A
A or B
A or B
B or A
40
ps
ns
ns
ps
ps
tPZH, tPZL
0.5
0.9
15
9
tPHZ, tPLZ
SEL
(3)
tsk(o)
A or B
50
50
100
150
(4)
tsk(p)
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance when driven by an ideal voltage source (zero output impedance).
(3) Output skew between center port (A4 to A5) to any other port
(4) Skew between opposite transitions of the same output in a given device |tPHL – tPLH
|
DYNAMIC CHARACTERISTICS
over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V (unless otherwise noted)
PARAMETER
XTALK
TEST CONDITIONS
f = 250 MHz,
TYP(1)
–37
UNIT
dB
RL = 100 Ω,
RL = 100 Ω,
RL = 50 Ω,
See Figure 8
See Figure 9
OIRR
f = 250 MHz,
See Figure 7
–37
dB
BW
1100
MHz
(1) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
4
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SCDS294 –DECEMBER 2009
OPERATING CHARACTERISTICS
0
−2
0
−20
−40
−4
−6
−60
−8
−80
−10
−12
0.1
−100
1000
10,000
1
0.1
10
100
1
10
Frequency (MHz)
Figure 1. Gain vs Frequency
100
1000
10,000
Frequency (MHz)
Figure 2. OFF Isolation vs Frequency
6
5
4
3
2
1
0
0
−20
−40
−60
−80
−100
0
1
2
3
4
5
6
1000
10,000
1
0.1
10
100
V
COM
(V)
Frequency (MHz)
Figure 3. Crosstalk vs Frequency
Figure 4. rON (Ω) vs Vcom (V)
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SCDS294 –DECEMBER 2009
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PARAMETER MEASUREMENT INFORMATION
(Enable and Disable Times)
V
CC
Input Generator
V
SEL
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
GND
R
L
V
V
O
I
C
L
50 Ω
V
G2
R
L
(see Note A)
S1
V
I
V
∆
C
L
R
L
V
CC
TEST
t
/t
PLZ PZL
3.3 V ± 0.3 V
3.3 V ± 0.3 V
2
V
200 Ω
200 Ω
GND
10 pF
10 pF
0.3 V
0.3 V
×
CC
t
/t
PHZ PZH
GND
V
CC
3.3 V
0 V
Output Control
(V
1.65 V
1.65 V
)
SEL
V
SEL
t
t
PLZ
PZL
Output
V
OH
OL
Waveform 1
S1 at 2 ×V
V
/2
/2
CC
V
O
O
CC
V
V
+ 0.3 V
OL
V
(see Note B)
t
t
PHZ
PZH
Output
Waveform 2
S1 at GND
(see Note B)
V
V
OH
- 0.3 V
OH
V
V
CC
OL
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control. Waveform 2is for an output with internal conditions such that the output is high, except when disabled by the
output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5
ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis
F. tPZL and tPZH are the same as ten
.
.
Figure 5. Test Circuit and Voltage Waveforms
6
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SCDS294 –DECEMBER 2009
PARAMETER MEASUREMENT INFORMATION
(Skew)
V
CC
Input Generator
V
SEL
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
50 Ω
S1
Open
GND
R
L
V
V
O
I
C
L
(see Note A)
50 Ω
V
G2
R
L
S1
V
in
C
L
R
L
V
CC
TEST
t
3.3 V ± 0.3 V
3.3 V ± 0.3 V
Open
200 Ω
200 Ω
V
V
or GND
or GND
10 pF
10 pF
sk(o)
CC
t
Open
sk(p)
CC
3.5 V
Data In at
Ax or A y
V
I
2.5 V
1.5 V
t
t
PHLx
PLHx
V
OH
Data Out at
XB or XB
V
O
O
(V + V )/2
OH OL
3.5 V
1
2
V
OL
2.5 V
1.5 V
Input
t
t
sk(o)
sk(o)
V
OH
V
Data Out at
t
t
PHL
PLH
(V + V )/2
OH OL
YB or YB
1
2
V
OH
V
OL
Output
(V + V )/2
OH OL
t
t
PHLy
PLHy
V
OL
t
= t
- t
PHL PLH
sk(p)
t
= t
- t
or t
- t
PHLy PHLx
sk(o)
PLHy
PLHx
VOLTAGE WAVEFORMS
OUTPUT SKEW (t
VOLTAGE WAVEFORMS
PULSE SKEW [t
)
]
sk(p)
sk(o)
A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output
control. Waveform 2is for an output with internal conditions such that the output is high, except when disabled by the
output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5
ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 6. Test Circuit and Voltage Waveforms
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SCDS294 –DECEMBER 2009
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PARAMETER MEASUREMENT INFORMATION
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
B
X
x
C
L
= 10 pF
(see Note A)
DUT
SEL
V
SEL
A. CL includes probe and jig capacitance.
Figure 7. Test Circuit for Frequency Response (BW)
Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the
input, the output is measured at B0. All unused analog I/O ports are left open.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
8
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SCDS294 –DECEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
A
B
0
0
R
L
= 100 W
B
1
1
DUT
A
A
B
2
2
R
L
= 100 W
B
3
3
SEL
V
SEL
Figure 8. Test Circuit for Crosstalk (XTALK
)
Crosstalk is measured at the output of the nonadjacent ON channel. For example, when VSELn = 0 and A0 is the
input, the output is measured at B0. All unused analog input (A) ports are connected to GND, and output (B)
ports are connected to GND through 50-Ω pulldown resistors.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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PARAMETER MEASUREMENT INFORMATION (continued)
EXT TRIGGER
BIAS
Network Analyzer
(HP8753ES)
V
BIAS
P1
P2
V
CC
A
A
0B
0
1
1
1
R
L
= 100 Ω
1B
DUT
0B
1B
2
2
SEL
V
SE
L
A. CL includes probe and jig capacitance.
B. A 50-Ω termination resistor is needed to match the loading of the network analyzer.
Figure 9. Test Circuit for Off Isolation (OIRR
)
OFF isolation is measured at the output of the OFF channel. For example, when VSELn = VCC and A0 is the input,
the output is measured at B0. All unused analog input (A) ports are left open, and output (B) ports are connected
to GND through 50-Ω pulldown resistors.
HP8753ES Setup
Average = 4
RBW = 3 kHz
VBIAS = 0.35 V
ST = 2 s
P1 = 0 dBM
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PACKAGE OPTION ADDENDUM
www.ti.com
18-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TS2DDR2811ZXYR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZXY
20
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
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