TS321IDBVRG4 [TI]
LOW-POWER SINGLE OPERATIONAL AMPLIFIER; 低功耗单路运算放大器
| 型号： | TS321IDBVRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LOW-POWER SINGLE OPERATIONAL AMPLIFIER |
| 文件： | 总11页 (文件大小：368K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS321
www.ti.com...................................................................................................................................... SLOS489B–DECEMBER 2005–REVISED SEPTEMBER 2008
LOW-POWER SINGLE OPERATIONAL AMPLIFIER
1
FEATURES
D (SOIC) PACKAGE
(TOP VIEW)
•
Wide Power-Supply Range
–
–
Single Supply…3 V to 30 V
Dual Supply…±1.5 V to ±15 V
1
2
8
7
NC
IN–
IN+
VCC–
NC
VCC+
•
Large Output Voltage Swing…
0 V to 3.5 V (Min) (VCC = 5 V)
3
4
6
5
OUT
NC
•
•
•
Low Supply Current…500 µA (Typ)
Low Input Bias Current…20 nA (Typ)
Stable With High Capacitive Loads
NC – No internal connection
DBV (SOT-23-5) PACKAGE
(TOP VIEW)
VCC+
1
2
5
OUT
VCC–
3
4
IN+
IN–
DESCRIPTION/ORDERING INFORMATION
The TS321 is a bipolar operational amplifier for cost-sensitive applications in which space savings are important.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TS321ID
TOP-SIDE MARKING(2)
SR321I
Tube of 75
SOIC – D
Reel of 2500
Reel of 3000
Reel of 250
TS321IDR
–40°C to 125°C
TS321IDBVR
TS321IDBVT
SOT-23-5 – DBV
9C1_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) DBV: The actual top-side marking has one additional character that designates the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2008, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS321
SLOS489B–DECEMBER 2005–REVISED SEPTEMBER 2008...................................................................................................................................... www.ti.com
SCHEMATIC DIAGRAM
VCC
IN–
IN+
OUT
2
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): TS321
TS321
www.ti.com...................................................................................................................................... SLOS489B–DECEMBER 2005–REVISED SEPTEMBER 2008
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
32
UNIT
Single
Dual
VCC
Supply voltage(2)
V
±16
VID
VI
Differential input voltage(3)
Input voltage range(2)(4)
32
V
V
–0.3
32
II
Input current(4)
50
mA
tshort
Duration of output short circuit to ground
Unlimited
97
D package
θJA
Package thermal impedance, junction to free air(5)(6)
°C/W
DBV package
206
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) These voltage values are with respect to the midpoint between VCC+ and VCC–
.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Neither input must ever be more positive than VCC+ or more negative than VCC–
.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
MIN
3
MAX
30
UNIT
V
Single supply
Dual supply
VCC
TA
Supply voltage
±1.5
–40
±15
125
Operating free-air temperature
°C
Copyright © 2005–2008, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TS321
TS321
SLOS489B–DECEMBER 2005–REVISED SEPTEMBER 2008...................................................................................................................................... www.ti.com
Electrical Characteristics
VCC+ = 5 V, VCC– = GND, VO = 1.4 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
0.5
4
RS = 0, 5 V < VCC+ < 30 V,
0 < VIC < (VCC+ – 1.5 V)
VIO
Input offset voltage
mV
5
Full range
25°C
2
20
30
nA
50
IIO
Input offset current
Input bias current(1)
Full range
25°C
150
nA
IIB
Full range
25°C
200
50
25
100
Large-signal differential voltage VCC = 15 V, RL = 2 kΩ,
amplification VO = 1.4 V to 11.4 V
AVD
V/mV
Full range
25°C
0
VCC+ – 1.5
VICR
Common-mode input voltage(2) VCC = 30 V
V
V
V
Full range
25°C
0
VCC+ – 2
26
27
28
RL = 2 kΩ
RL = 10 kΩ
RL = 2 kΩ
Full range
25°C
25.5
27
VCC = 30 V
VOH
High-level output voltage
Full range
25°C
26.5
3.5
3
VCC = 5 V
Full range
25°C
5
15
20
VOL
Low-level output voltage
Gain bandwidth product
RL = 10 kΩ
Full range
VCC = 30 V, VI = 10 mV, RL = 2 kΩ,
f = 100 kHz, CL = 100 pF
GBP
25°C
25°C
0.8
0.4
MHz
VCC = 15 V, VI = 0.5 V to 3 V,
RL = 2 kΩ, CL = 100 pF, unity gain
SR
Slew rate
V/µs
φm
Phase margin
25°C
25°C
25°C
25°C
25°C
25°C
25°C
60
85
°
CMRR Common-mode rejection ratio
ISOURCE Output source current
R
S ≤ 10 kΩ
65
20
10
12
dB
mA
mA
µA
mA
dB
VCC = 15 V, VO = 2 V, VID = 1 V
40
VO = 2 V
VCC = 15 V, VID = 1 V
VO = 0.2 V
20
ISINK
Output sink current
50
IO
Short-circuit to GND
VCC = 15 V
40
60
SVR
Supply-voltage rejection ratio
VCC = 5 V to 30 V
VCC = 5 V
65
110
500
600
600
800
900
25°C
VCC = 30 V
ICC
Total supply current
No load
µA
VCC = 5 V
900
Full range
VCC = 30 V
1000
VCC = 30 V, VO = 2 Vpp, AV = 20 dB,
RL = 2 kΩ, f = 1 kHz, CL = 100 pF
THD
eN
Total harmonic distortion
25°C
25°C
0.015
50
%
Equivalent input noise voltage
VCC = 30 V, f = 1 kHz, RS = 100 Ω
nV/√Hz
(1) The direction of the input current is out of the device. This current essentially is constant, independent of the state of the output, so no
loading change exists on the input lines.
(2) The input common-mode voltage of either input signal should not be allowed to go negative by more than 0.3 V. The upper end of the
common-mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 32 V without damage.
4
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Copyright © 2005–2008, Texas Instruments Incorporated
Product Folder Link(s): TS321
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2009
PACKAGING INFORMATION
Orderable Device
TS321ID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
5
5
5
5
5
5
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS321IDBVR
TS321IDBVRE4
TS321IDBVRG4
TS321IDBVT
TS321IDBVTE4
TS321IDBVTG4
TS321IDE4
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBV
DBV
DBV
DBV
DBV
DBV
D
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS321IDG4
SOIC
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS321IDR
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS321IDRE4
TS321IDRG4
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-May-2009
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TS321IDBVR
TS321IDBVT
TS321IDR
SOT-23
SOT-23
SOIC
DBV
DBV
D
5
5
8
3000
250
180.0
180.0
330.0
9.2
9.2
3.23
3.23
6.4
3.17
3.17
5.2
1.37
1.37
2.1
4.0
4.0
8.0
8.0
8.0
Q3
Q3
Q1
2500
12.4
12.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
24-Sep-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS321IDBVR
TS321IDBVT
TS321IDR
SOT-23
SOT-23
SOIC
DBV
DBV
D
5
5
8
3000
250
202.0
202.0
340.5
201.0
201.0
338.1
28.0
28.0
20.6
2500
Pack Materials-Page 2
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