TS3A27518E_16 [TI]
6-Channel, 1:2 Multiplexer/Demultiplexer;型号: | TS3A27518E_16 |
厂家: | TEXAS INSTRUMENTS |
描述: | 6-Channel, 1:2 Multiplexer/Demultiplexer |
文件: | 总26页 (文件大小:911K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TS3A27518E
www.ti.com ........................................................................................................................................................... SCDS260B–MARCH 2009–REVISED MAY 2009
6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD
AND 1.8-V LOGIC COMPATIBLE CONTROL INPUTS
1
FEATURES
RTW PACKAGE
(TOP VIEW)
•
•
•
•
1.65-V to 3.6-V Single-Supply Operation
Isolation in Powerdown Mode, V+ = 0
Low Capacitance Switches, 21.5 pF (Typical)
24 23 22 21 20 19
Bandwidth up to 240 MHz for High-Speed
Rail-to-Rail Signal Handling
1
2
3
4
5
6
18
17
16
15
14
13
COM1
GND
COM2
COM3
V+
NC4
EN
NC5
NO5
NO4
NO6
•
•
Crosstalk and Off Isolation of -62dB
1.8-V Logic Threshold Compatibility for
Control Inputs
COM4
7
8
9 10 11 12
•
•
3.6-V Tolerant Control Inputs
Latch-Up Performance Exceeds 100-mA Per
JESD 78, Class II
•
ESD Performance Tested Per JESD 22
–
2500-V Human-Body Model
(A114-B, Class II)
PW PACKAGE
(TOP VIEW)
–
1500-V Charged-Device Model (C101)
1
24
NC2
IN1
•
•
ESD Performance: NC/NO Ports
±6-kV Contact Discharge (IEC 61000-4-2)
2
3
23
22
21
20
19
18
17
16
15
14
13
NC1
N.C.
NC3
NC6
NC4
EN
–
4
COM1
GND
24-QFN (4 × 4 mm), 24-BGA (3 × 3 mm) and
24-TSSOP (7.9 × 6.6 mm) Packages
5
6
COM2
COM3
NC5
NO5
NO4
NO6
NO3
IN2
7
APPLICATIONS
V
+
8
•
•
•
SD/SDIO and MMC Two Port MUX
PC VGA Video MUX/Video Systems
Audio and Video Signal Routing
9
COM4
COM5
NO1
10
11
12
COM6
NO2
N.C. – Not internally connected
ZQS PACKAGE
(TOP VIEW)
ZQS PIN ASSIGNMENTS
1
2
3
4
5
1
2 4
3
5
A
B
C
D
E
COM1
COM2
COM3
COM4
COM5
NC2
N.C.
NC1
GND
IN2
NC3
IN1
NC6
NC4
NC5
NO4
NO6
A
B
C
D
E
V+
EN
COM6
NO1
NO5
NO3
NO2
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009, Texas Instruments Incorporated
TS3A27518E
SCDS260B–MARCH 2009–REVISED MAY 2009........................................................................................................................................................... www.ti.com
DESCRIPTION/ORDERING INFORMATION
The TS3A27518E is a 6-bit 1-of-2 Mux/Demux designed to operate from 1.65 V to 3.6 V. This device can handle
both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E has
two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all
outputs in high-impedance mode. The control pins are compatible with 1.8V logic thresholds and are backward
compatible with 2.5 V and 3.3 V logic thresholds as well.
The TS3A27518E allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple
cards or peripherals since the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The
TS3A27518E has two control pins that give additional flexibility to the user. For example, the ability to mux two
different audio-video signals in equipment such as an LCD television,an LCD monitor, or a notebook docking
station.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TS3A27518EZQSR
TOP-SIDE MARKING
YL518E
BGA – ZQS
QFN – RTW
TSSOP – PW
Tape and reel
–40°C to 85°C
Tape and reel
Tape and reel
TS3A27518ERTWR
TS3A27518EPWR
YL518E
YL518E
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
LOGIC DIAGRAM
SUMMARY OF CHARACTERISTICS
V+ = 3.3 V, TA = 25°C
V
CC
1-of-2
IN1
Configuration
Multiplexer/Demultiplexer
Logic
EN
IN2
Number of channels
6
ON-state resistance (ron
)
6.2 Ω (max)
0.7 Ω (max)
ON-state resistance match (Δron
)
ON-state resistance flatness
2.1 Ω (max)
NC1
NO1
(rON(flat)
)
NC4
Turn-on/turn-off time (tON/tOFF
)
59 ns/ 60.6 ns (max)
22.7 ns (max)
0.81 pC
COM1
NO4
Break-before-make time (tBBM
Charge injection (QC)
Bandwidth (BW)
)
COM4
NC2
NO2
240 MHz
NC5
OFF isolation (OISO
Crosstalk (XTALK
)
–62 dB at 10 MHz
–62 dB at 10 MHz
0.05%
NO5
COM2
)
COM5
Total harmonic distortion (THD)
Power-supply current (I+)
NC3
NO3
NC6
< 0.3 µA (max)
NO6
24-pin QFN (RTW),
24-BGA (ZQS)
COM3
Package options
COM6
24-TSSOP (PW)
GND
FUNCTION TABLE
NC1/2/3 TO COM1/2/3,
COM1/2/3 TO NC1/2/3
NC4/5/6 TO COM4/5/6, NO1/2/3 TO COM1/2/3,
NO4/5/6 TO COM4/5/6,
COM4/5/6 TO NO4/5/6
EN
IN1
IN2
COM4/5/6 TO NC4/5/6
COM1/2/3 TO NO1/2/3
H
L
L
L
L
X
L
X
L
OFF
ON
OFF
ON
OFF
OFF
ON
OFF
OFF
OFF
ON
H
L
L
OFF
ON
ON
H
H
OFF
OFF
OFF
ON
H
OFF
ON
2
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TS3A27518E
TS3A27518E
www.ti.com ........................................................................................................................................................... SCDS260B–MARCH 2009–REVISED MAY 2009
SDIO EXPANDER APPLICATION BLOCK DIAGRAM
V
CC
V
V
CC
CC
NC1
COM1
COM2
COM3
COM4
COM5
NO1
NC2
NO2
NC3
SD/MMC
Memory Card
NO3
NC4
SDIO Port
NO4
NC5
NO5
NC6
COM6
NO6
Digital
Baseband or
Apps Processor
IN1, IN2, EN
V
CC
TS3A27518
SDIO Peripheral
(Bluetooth,
WLAN, DTV, etc)
Copyright © 2009, Texas Instruments Incorporated
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3
Product Folder Link(s): TS3A27518E
TS3A27518E
SCDS260B–MARCH 2009–REVISED MAY 2009........................................................................................................................................................... www.ti.com
ABSOLUTE MINIMUM AND MAXIMUM RATINGS(1)(2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V+
Supply voltage range(3)
–0.5
4.6
V
VNC
VNO
VCOM
Analog voltage range(3)(4)(5)
Analog port diode current(6)
ON-state switch current(7)
–0.5
–50
–50
4.6
V
IK
V+ < VNC, VNO, VCOM < 0
VNC, VNO, VCOM = 0 to V+
mA
mA
INC
INO
50
ICOM
VI
Digital input voltage range(3)(4)
Digital input clamp current(3)(4)
Continuous current through V+
Continuous current through GND
Storage temperature range
–0.5
–50
4.6
V
IIK
VIO < VI < 0
mA
mA
mA
°C
I+
100
IGND
Tstg
–100
–65
150
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Requires clamp diodes on analog port to V+.
(7) Pulse at 1-ms duration <10% duty cycle
THERMAL IMPEDANCE RATINGS
UNIT
PW package
RTW package
ZQS package
87.9
66
θJA
Package thermal impedance(1)
°C/W
171.6
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY(1)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
Analog signal
range
VCOM
VNO, VNC
,
0
V+
Ω
Ω
25°C
Full
4.4
0.3
6.2
7.6
0.7
ON-state
resistance
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 15
ron
3 V
3 V
ON-state
resistance match
between channels
25°C
VNC or VNO = 2.1 V,
ICOM = –32 mA,
Switch ON,
See Figure 15
Δron
Ω
Ω
Full
25°C
Full
0.8
2.1
2.3
0.5
ON-state
resistance
flatness
0.95
0.05
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 16
ron(flat)
3 V
VNC or VNO = 1 V,
VCOM = 3 V,
or
VNC or VNO = 3 V,
VCOM = 1 V,
25°C
–0.5
–7
INC(OFF)
INO(OFF)
,
3.6 V
Full
25°C
Full
7
1
NC, NO
OFF leakage
current
Switch OFF,
See Figure 16
µA
VNC or VNO = 0 to 3.6 V,
VCOM = 3.6 V to 0,
or
VNC or VNO = 3.6 V to 0,
VCOM = 0 to 3.6 V,
–1
0.05
INC(PWROFF)
INO(PWROFF)
,
0 V
–12
12
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TS3A27518E
TS3A27518E
www.ti.com ........................................................................................................................................................... SCDS260B–MARCH 2009–REVISED MAY 2009
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY (continued)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX
UNIT
VNC or VNO = 3 V,
25°C
–1
0.01
1
VCOM = 1 V,
or
VNC or VNO = 1 V,
VCOM = 3 V,
ICOM(OFF)
3.6 V
Full
25°C
Full
–2
–1
2
1
COM
Switch OFF,
See Figure 16
OFF leakage
current
µA
VNC or VNO = 3.6 V to 0,
VCOM = 0 to 3.6 V,
ICOM(PWROFF) or
VNC or VNO = 0 to 3.6 V,
0.02
0.04
0.03
0 V
–12
–2.5
–7
1
VCOM = 3.6 V to 0,
VNC or VNO = 1 V,
VCOM = Open,
or
VNC or VNO = 3 V,
VCOM = Open,
25°C
Full
2.2
7
NC, NO
INO(ON)
,
Switch ON,
See Figure 17
ON leakage
current
3.6 V
3.6 V
µA
µA
INC(ON)
VNC or VNO = Open,
VCOM = 1 V,
or
VNC or VNO = Open,
VCOM = 3 V,
25°C
Full
–2
2
COM
ON leakage
current
Switch ON,
See Figure 17
ICOM(ON)
–7
7
Digital Control Inputs (IN1, IN2, EN)(2)
Input logic high
Input logic low
VIH
VIL
Full
Full
3.6 V
3.6 V
1.2
0
3.6
0.65
0.1
V
V
25°C
Full
–0.1
–2.5
0.05
Input leakage current
Dynamic
IIH, IIL
VI = V+ or 0
3.6 V
µA
2.5
25°C
Full
3.3 V
3 V to 3.6 V
3.3 V
18.1
25.4
11.1
59
60
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
tON
tOFF
tBBM
ns
ns
ns
25°C
Full
60.6
61
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-off time
3 V to 3.6 V
3.3 V
25°C
Full
4
22.7
28
Break-before-
make time
VNC = VNO = V+/2,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
3 V to 3.6 V
VGEN = 0,
RGEN = 0,
CL = 0.1 nF,
See Figure 24
Charge injection
QC
25°C
25°C
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
0.81
13
pC
pF
pF
pF
pF
pF
MHz
dB
dB
dB
%
NC, NO
OFF capacitance
CNC(OFF)
CNO(OFF)
,
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
See Figure 18
COM
OFF capacitance
VNC or VNO = V+ or GND,
Switch OFF,
CCOM(OFF)
8.5
NC, NO
ON capacitance
CNC(ON)
CNO(ON)
,
VNC or VNO = V+ or GND,
Switch OFF,
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
21.5
21.5
2
COM
ON capacitance
VCOM = V+ or GND,
Switch ON,
CCOM(ON)
Digital input
capacitance
CI
BW
VI = V+ or GND
Switch ON,
See Figure 20
Bandwidth
RL = 50 Ω,
240
–62
–62
–71
0.05
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
See Figure 22
OFF isolation
Crosstalk
OISO
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
XTALK
XTALK(ADJ)
THD
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
Crosstalk adjacent
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
Supply
25°C
Full
0.04
0.3
3
Positive
supply current
I+
VI = V+ or GND,
Switch ON or OFF
3.6 V
µA
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2009, Texas Instruments Incorporated
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Product Folder Link(s): TS3A27518E
TS3A27518E
SCDS260B–MARCH 2009–REVISED MAY 2009........................................................................................................................................................... www.ti.com
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY(1)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
Analog signal
range
VCOM
VNO, VNC
,
0
V+
Ω
Ω
25°C
Full
5.5
0.3
9.6
11.5
0.8
ON-state
resistance
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 15
ron
2.3 V
2.3 V
ON-state
resistance match
between channels
25°C
VNC or VNO = 1.6 V,
ICOM = –32 mA,
Switch ON,
See Figure 15
Δron
Ω
Ω
Full
25°C
Full
0.9
2.2
2.3
0.3
ON-state
resistance
flatness
0.91
0.04
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 16
ron(flat)
2.3 V
2.7 V
VNC or VNO = 0.5 V,
VCOM = 2.3 V,
or
VNC or VNO = 2.3 V,
VCOM = 0.5 V,
25°C
–0.3
–6
INC(OFF)
INO(OFF)
,
Full
25°C
Full
6
0.6
10
NC, NO
OFF leakage
current
Switch OFF,
See Figure 16
µA
VNC or VNO = 0 to 2.7 V,
VCOM =2.7 V to 0,
or
VNC or VNO = 2.7 V to 0,
VCOM = 0 to 2.7 V,
–0.6
–10
–0.7
–1
0.02
0.02
0.02
INC(PWROFF)
INO(PWROFF)
,
0 V
VNC or VNO = 0.5 V,
VCOM = 2.3 V,
or
VNC or VNO = 2.3 V,
VCOM = 0.5 V,
25°C
Full
0.7
1
ICOM(OFF)
2.7 V
COM
OFF leakage
current
Switch OFF,
See Figure 16
µA
VNC or VNO = 2.7 V to 0,
VCOM = 0 to 2.7 V,
or
VNC or VNO = 0 to 2.7 V,
VCOM = 2.7 V to 0,
25°C
Full
–0.7
–7.2
0.7
7.2
ICOM(PWROFF)
0 V
NC, NO
ON leakage
current
VNC or VNO = 0.5 V or 2.3
V,
VCOM = Open,
25°C
Full
–2.1
–6
0.03
0.02
2.1
6
INO(ON)
INC(ON)
,
Switch ON,
See Figure 17
2.7 V
2.7 V
µA
µA
VNC or VNO = Open,
VCOM = 0.5 V,
or
VNC or VNO = Open,
VCOM = 2.3 V,
25°C
–2
2
COM
ON leakage
current
Switch ON,
See Figure 17
ICOM(ON)
Full
–5.7
5.7
Digital Control Inputs (IN1, IN2, EN)(2)
Input logic high
Input logic low
VIH
VIL
VI = V+ or GND
VI = V+ or 0
Full
Full
2.7 V
2.7 V
1.15
0
3.6
0.55
0.1
V
V
25°C
Full
-0.1
–2.1
0.01
Input leakage current
Dynamic
IIH, IIL
2.7 V
µA
2.1
25°C
Full
2.5 V
2.3 V to 2.7 V
2.5 V
17.2
17.1
13
36.8
42.5
29.8
34.4
30
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
tON
tOFF
tBBM
ns
ns
ns
25°C
Full
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-off time
2.3 V to 2.7 V
2.5 V
25°C
Full
4.5
Break-before-
make time
VNC = VNO = V+/2,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
2.3 V to 2.7 V
33.3
VGEN = 0,
RGEN = 0,
CL = 0.1 nF,
See Figure 24
Charge injection
QC
25°C
25°C
2.5 V
2.5 V
2.5 V
0.47
13.5
9
pC
pF
pF
NC, NO
OFF capacitance
CNC(OFF)
CNO(OFF)
,
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 18
See Figure 18
COM
OFF capacitance
VNC or VNO = V+ or GND,
Switch OFF,
CCOM(OFF)
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
6
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Product Folder Link(s): TS3A27518E
TS3A27518E
www.ti.com ........................................................................................................................................................... SCDS260B–MARCH 2009–REVISED MAY 2009
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (continued)
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
NC, NO
ON capacitance
CNC(ON)
CNO(ON)
,
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 18
See Figure 18
See Figure 18
25°C
2.5 V
22
pF
COM
ON capacitance
VCOM = V+ or GND,
Switch ON,
CCOM(ON)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
2.5 V
2.5 V
2.5 V
2.5 V
2.5 V
2.5 V
2.5 V
22
2
pF
pF
Digital input
capacitance
CI
BW
VI = V+ or GND
Switch ON,
See Figure 20
Bandwidth
RL = 50 Ω,
240
–62
–62
–71
0.06
MHz
dB
dB
dB
%
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
See Figure 22
OFF isolation
Crosstalk
OISO
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
XTALK
XTALK(ADJ)
THD
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
Crosstalk adjacent
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
Supply
25°C
Full
0.01
0.1
µA
2
Positive
supply current
I+
VI = V+ or GND,
Switch ON or OFF
2.7 V
ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY(1)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
Analog signal
range
VCOM
VNO, VNC
,
0
V+
Ω
Ω
25°C
Full
7.1
0.3
14.4
16.3
1
ON-state
resistance
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 15
ron
1.65 V
1.65 V
ON-state
resistance match
between channels
25°C
VNC or VNO = 1.5 V,
ICOM = –32 mA,
Switch ON,
See Figure 15
Δron
Ω
Ω
Full
25°C
Full
1.2
5.5
ON-state
resistance
flatness
2.7
0 ≤ (VNC or VNO) ≤ V+,
ICOM = –32 mA,
Switch ON,
See Figure 16
ron(flat)
1.65 V
1.95 V
7.3
VNC or VNO = 0.3 V,
VCOM = 1.65 V,
or
VNC or VNO = 1.65 V,
VCOM = 0.3 V
25°C
–0.25
–5
0.03
0.25
INC(OFF)
INO(OFF)
,
µA
µA
µA
µA
µA
Full
25°C
Full
5
0.4
7.2
0.4
0.9
0.4
5
NC, NO
OFF leakage
current
Switch OFF,
See Figure 16
VNC or VNO = 1.95 V to 0,
VCOM = 0 to 1.95 V,
or
VNC or VNO = 0 to 1.95 V,
VCOM = 1.95 V to 0,
–0.4
–7.2
–0.4
–0.9
–0.4
–5
0.01
0.02
0.02
0.02
INC(PWROFF)
INO(PWROFF)
,
0 V
1.95 V
0 V
VNC or VNO = 0.3 V,
VCOM = 1.65 V,
or
VNC or VNO = 1.65 V,
VCOM = 0.3 V
25°C
Full
ICOM(OFF)
ICOM(OFF)
,
COM
OFF leakage
current
Switch OFF,
See Figure 16
VNC or VNO = 1.95 V to 0,
VCOM = 0 to 1.95 V,
or
VNC or VNO = 0 to 1.95 V,
VCOM = 1.95 V to 0,
25°C
Full
ICOM(PWROFF)
ICOM(PWROFF)
,
VNC or VNO = 0.3 V,
VCOM = Open,
or
VNC or VNO = 1.65 V,
VCOM = Open,
25°C
Full
–2
2
NC, NO
ON leakage
current
INO(ON)
INC(ON)
,
Switch ON,
See Figure 17
1.95 V
–5.2
5.2
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
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ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (continued)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP
MAX UNIT
VNC or VNO = Open,
25°C
–2
0.02
2
COM
ON leakage
current
VCOM = 0.3 V,
or
VNC or VNO = Open,
VCOM = 1.65 V,
Switch ON,
See Figure 17
ICOM(ON)
1.95 V
µA
Full
–5.2
5.2
Digital Control Inputs (IN1, IN2, EN)(2)
Input logic high
Input logic low
VIH
VIL
VI = V+ or GND
VI = V+ or 0
Full
Full
1.95 V
1.95 V
1
0
3.6
0.4
0.1
2.1
V
V
25°C
Full
-0.1
-2.1
0.01
Input leakage current
IIH, IIL
1.95 V
µA
Dynamic
25°C
Full
1.8 V
14.1
16.1
18.4
49.3
56.7
26.5
31.2
58
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
Turn-off time
tON
tOFF
tBBM
ns
ns
ns
1.65 V to 1.95
V
25°C
Full
1.8 V
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
1.65 V to 1.95
V
25°C
Full
1.8 V
5.3
Break-before-
make time
VNC = VNO = V+/2,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
1.65 V to 1.95
V
58
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 24
Charge injection
QC
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
0.21
9
pC
pF
NC, NO
OFF capacitance
CNC(OFF)
CNO(OFF)
,
VNC or VNO = V+ or GND,
Switch OFF,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
NC, NO
ON capacitance
CNC(ON)
CNO(ON)
,
VNC or VNO = V+ or GND,
Switch OFF,
22
pF
COM
ON capacitance
VCOM = V+ or GND,
Switch ON,
CCOM(ON)
22
pF
Digital input
capacitance
CI
BW
VI = V+ or GND
2
pF
Switch ON,
See Figure 20
Bandwidth
RL = 50 Ω,
240
-60
-60
-71
0.1
MHz
dB
dB
dB
%
RL = 50 Ω,
f = 10 MHz,
Switch OFF,
See Figure 22
OFF isolation
Crosstalk
OISO
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
XTALK
XTALK(ADJ)
THD
RL = 50 Ω,
f = 10 MHz,
Switch ON,
See Figure 23
Crosstalk adjacent
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
Supply
25°C
Full
0.01
0.1
1.5
Positive
supply current
I+
VI = V+ or GND,
Switch ON or OFF
1.95 V
µA
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
8
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PARAMETER DESCRIPTION
SYMBOL
VCOM
VNC
DESCRIPTION
Voltage at COM
Voltage at NC
Voltage at NO
VNO
ron
Resistance between COM and NC or NO ports when the channel is ON
Δron
Difference of ron between channels in a specific device
ron(flat)
INC(OFF)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output
(COM) open
INC(ON)
INO(OFF)
INO(ON)
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output
(COM) open
ICOM(OFF)
ICOM(ON)
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the OFF state
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the ON state and the
output (NC or NO) open
VIH
VIL
Minimum input voltage for logic high for the control input (IN, EN)
Maximum input voltage for logic low for the control input (IN, EN)
Voltage at the control input (IN, EN)
VI
IIH, IIL
Leakage current measured at the control input (IN, EN)
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output NC or NO) signal when the switch is turning ON.
tON
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation
delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning OFF.
tOFF
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or NO)
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.
Charge injection, QC = CL × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.
QC
CNC(OFF)
CNC(ON)
CNO(OFF)
CNO(ON)
CCOM(OFF)
CCOM(ON)
CI
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF
Capacitance at the NC port when the corresponding channel (NC to COM) is ON
Capacitance at the NC port when the corresponding channel (NO to COM) is OFF
Capacitance at the NC port when the corresponding channel (NO to COM) is ON
Capacitance at the COM port when the corresponding channel (COM to NC) is OFF
Capacitance at the COM port when the corresponding channel (COM to NC) is ON
Capacitance of control input (IN, EN)
OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific
frequency, with the corresponding channel (NC to COM) in the OFF state.
OISO
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC1 to NO1). Adjacent
crosstalk is a measure of unwanted signal coupling from an ON channel to an adjacent ON channel (NC1 to NC2) .This is
measured in a specific frequency and in dB.
XTALK
BW
THD
I+
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root
mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental
harmonic.
Static power-supply current with the control (IN) pin at V+ or GND
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TYPICAL CHARACTERISTICS
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
85ºC
85ºC
25ºC
–40ºC
25ºC
-–40ºC
0.0
0.5
1.0
1.5
(V)
2.0
2.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
COM Voltage, V
COM Voltage, V
(V)
COM
COM
Figure 1. ON-State Resistance vs COM Voltage (V+ = 3 V)
Figure 2. ON-State Resistance vs COM Voltage (V+ = 2.3 V)
12
10
8
600
550
500
450
400
350
300
250
200
150
100
50
COM (OFF)
COM (ON)
NO (OFF)
NO (ON)
6
4
85ºC
25ºC
2
-–40ºC
0
0
0.0
0.2
0.4
0.6
0.8
1.0
COM
1.2
(V)
1.4
1.6
1.8
–40
25
85
COM Voltage, V
Temperature, T (°C)
A
Figure 3. ON-State Resistance vs COM Voltage (V+ = 1.65
V)
Figure 4. Leakage Current vs Temperature (V+ = 3.3 V)
10
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TYPICAL CHARACTERISTICS (continued)
45
4.0
40
3.5
35
3.0
30
2.5
25
20
15
10
5
2.0
1.5
1.0
0.5
0.0
INx = High
INx = Low
0
–5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
Supply Voltage, V (V)
Input Voltage, V (V)
+
IN
Figure 5. Supply Current vs Supply Voltage
Figure 6. Control Input Thresholds (IN1, TA = 25°C)
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
1.8 V
2.5 V
3.3 V
NO1TOCOM1-NO2
NO1TOCOM1-NO3
NO1TOCOM1-NO4
NO1TOCOM1-NO5
NO1TOCOM1-NO6
0.1
1
10
Frequency (MHz)
100
1000
0.1
1
10
Frequency (MHz)
100
1000
Figure 7. Crosstalk Adjacent
Figure 8. Crosstalk
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TYPICAL CHARACTERISTICS (continued)
0.11
0.10
0.09
0.08
0.07
0.06
0.05
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
1.8 V
2.5 V
3.3 V
1.8 V
2.5 V
3.3 V
0.1
1
10
Frequency (MHz)
100
1000
0.1
1
10
100
1000
Frequency (Hz)
Figure 9. Total Harmonic Distortion vs Frequency
Figure 10. OFF Isolation
0
–2
1
0
–4
–1
–2
–3
–4
–5
–6
–7
–6
–8
–10
–12
–14
–16
–18
–20
1.8 V
2.5 V
3.3 V
0
0.3
0.6
0.9
1.2
1.5
1.8
0.1
1
10
100
1000
Bias Voltage (V)
Frequency (MHz)
Figure 11. Insertion Loss
Figure 12. Charge Injection vs Bias Voltage (1.8 V)
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TYPICAL CHARACTERISTICS (continued)
2
4
2
0
0
–2
–4
–2
–4
–6
–8
–6
–10
–12
–14
–16
–8
–10
0
0.3
0.6
0.9
1.2
1.5
1.8
2.1
2.4
2.5
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.4 2.7 3.0 3.3
Bias Voltage (V)
Bias Voltage (V)
Figure 13. Charge Injection vs Bias Voltage (2.5 V)
Figure 14. Charge Injection vs Bias Voltage (3.3 V)
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PARAMETER MEASUREMENT INFORMATION
+
Ω
IN
+
Figure 15. ON-state Resistance (rON
)
OFF-State Leakage Current
Channel OFF
+
+
V = V or V
IL
I
IH
IN
+
Figure 16. OFF-State Leakage Current
(ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF)
)
14
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PARAMETER MEASUREMENT INFORMATION (continued)
ON-State Leakage Current
+
Channel ON
V = V or V
I
IH
IL
IN
+
Figure 17. ON-State Leakage Current
(ICOM(ON), INC(ON)
)
V
NO NO
Capacitance
Meter
V
= V or GND and
+
BIAS
V = V or V
IH
I
IL
Capacitance is measured at NO,
COM, and IN inputs during ON
and OFF conditions.
COM COM
V
BIAS
Figure 18. Capacitance
(CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON)
)
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PARAMETER MEASUREMENT INFORMATION (continued)
R
C
V
COM
TEST
L
L
t
V
+
50 Ω
50 Ω
35 pF
35 pF
ON
t
V
+
OFF
IN
Logic
Intput
(V )
I
t
t
ON
OFF
90%
90%
Switch
Output
(V
)
NO
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Figure 19. Turn-On (tON) and Turn-Off Time (tOFF
)
V
or V
NO
NC
NC or NO
NC or NO
V
OH
V
or V
= V /2
NO +
NC
R
C
= 50 Ω
L
L
= 35 pF
A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
Figure 20. Break-Before-Make Time (tBBM
)
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PARAMETER MEASUREMENT INFORMATION (continued)
Channel ON: NO to COM
V = V or V
50 Ω
I
IH
IL
Network Analyzer Setup
Source Power = 0 dBM
(632-mV P-P at 50-Ω load)
DC Bias = 350 mV
IN
Ω
+
+
+
Figure 21. Bandwidth (BW)
Channel OFF: NO to COM
V = V or V
50 Ω
I
IH
IL
Ω
Network Analyzer Setup
Source Power = 0 dBM
(632-mV P-P at 50-Ω load)
DC Bias = 350 mV
IN
Ω
Figure 22. OFF Isolation (OISO
)
Channel ON: NC to COM
Channel OFF: NO to COM
V = V or V
V
V
50 Ω
NC
NC
I
IH
IL
NO
NO
Network Analyzer Setup
Ω
Source Power = 0 dBM
(632-mV P-P at 50-Ω load)
DC Bias = 350 mV
IN
Ω
Figure 23. Crosstalk (XTALK
)
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PARAMETER MEASUREMENT INFORMATION (continued)
Δ
IN
x Δ
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Figure 24. Charge Injection (QC)
Channel ON: COM to NO
= V P-P
V = V or V
IH
R
= 600 Ω
C = 50 pF
L
I
IL
= 20 Hz to 20 kHz
L
V
f
SOURCE
+
SOURCE
V /2
+
Audio Analyzer
600 Ω
NO
COM
IN
+
600 Ω
–V /2
+
A. CL includes probe and jig capacitance.
Figure 25. Total Harmonic Distortion (THD)
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PACKAGE OPTION ADDENDUM
www.ti.com
4-Jun-2009
PACKAGING INFORMATION
Orderable Device
TS3A27518EPWR
TS3A27518ERTWR
TS3A27518EZQSR
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
PW
24
24
24
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
QFN
RTW
ZQS
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
2500 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TS3A27518EPWR
TS3A27518ERTWR
TS3A27518EZQSR
TSSOP
QFN
PW
RTW
ZQS
24
24
24
2000
3000
2500
330.0
330.0
330.0
16.4
12.4
12.4
6.95
4.3
8.3
4.3
3.3
1.6
1.5
1.6
8.0
8.0
8.0
16.0
12.0
12.0
Q1
Q2
Q1
BGA MI
CROSTA
R JUNI
OR
3.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
2-Jun-2009
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS3A27518EPWR
TS3A27518ERTWR
TS3A27518EZQSR
TSSOP
QFN
PW
RTW
ZQS
24
24
24
2000
3000
2500
346.0
346.0
340.5
346.0
346.0
338.1
33.0
29.0
20.6
BGA MICROSTAR
JUNIOR
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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