TS3A27518E_16 [TI]

6-Channel, 1:2 Multiplexer/Demultiplexer;
TS3A27518E_16
型号: TS3A27518E_16
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

6-Channel, 1:2 Multiplexer/Demultiplexer

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TS3A27518E  
www.ti.com ........................................................................................................................................................... SCDS260BMARCH 2009REVISED MAY 2009  
6-BIT, 1-of-2 MULTIPLEXER/DEMULTIPLEXER WITH INTEGRATED IEC L-4 ESD  
AND 1.8-V LOGIC COMPATIBLE CONTROL INPUTS  
1
FEATURES  
RTW PACKAGE  
(TOP VIEW)  
1.65-V to 3.6-V Single-Supply Operation  
Isolation in Powerdown Mode, V+ = 0  
Low Capacitance Switches, 21.5 pF (Typical)  
24 23 22 21 20 19  
Bandwidth up to 240 MHz for High-Speed  
Rail-to-Rail Signal Handling  
1
2
3
4
5
6
18  
17  
16  
15  
14  
13  
COM1  
GND  
COM2  
COM3  
V+  
NC4  
EN  
NC5  
NO5  
NO4  
NO6  
Crosstalk and Off Isolation of -62dB  
1.8-V Logic Threshold Compatibility for  
Control Inputs  
COM4  
7
8
9 10 11 12  
3.6-V Tolerant Control Inputs  
Latch-Up Performance Exceeds 100-mA Per  
JESD 78, Class II  
ESD Performance Tested Per JESD 22  
2500-V Human-Body Model  
(A114-B, Class II)  
PW PACKAGE  
(TOP VIEW)  
1500-V Charged-Device Model (C101)  
1
24  
NC2  
IN1  
ESD Performance: NC/NO Ports  
±6-kV Contact Discharge (IEC 61000-4-2)  
2
3
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
NC1  
N.C.  
NC3  
NC6  
NC4  
EN  
4
COM1  
GND  
24-QFN (4 × 4 mm), 24-BGA (3 × 3 mm) and  
24-TSSOP (7.9 × 6.6 mm) Packages  
5
6
COM2  
COM3  
NC5  
NO5  
NO4  
NO6  
NO3  
IN2  
7
APPLICATIONS  
V
+
8
SD/SDIO and MMC Two Port MUX  
PC VGA Video MUX/Video Systems  
Audio and Video Signal Routing  
9
COM4  
COM5  
NO1  
10  
11  
12  
COM6  
NO2  
N.C. – Not internally connected  
ZQS PACKAGE  
(TOP VIEW)  
ZQS PIN ASSIGNMENTS  
1
2
3
4
5
1
2 4  
3
5
A
B
C
D
E
COM1  
COM2  
COM3  
COM4  
COM5  
NC2  
N.C.  
NC1  
GND  
IN2  
NC3  
IN1  
NC6  
NC4  
NC5  
NO4  
NO6  
A
B
C
D
E
V+  
EN  
COM6  
NO1  
NO5  
NO3  
NO2  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  
TS3A27518E  
SCDS260BMARCH 2009REVISED MAY 2009........................................................................................................................................................... www.ti.com  
DESCRIPTION/ORDERING INFORMATION  
The TS3A27518E is a 6-bit 1-of-2 Mux/Demux designed to operate from 1.65 V to 3.6 V. This device can handle  
both digital and analog signals, and signals up to V+ can be transmitted in either direction. The TS3A27518E has  
two control pins, each controlling three 1-of-2 muxes at the same time, and an enable pin that is used to put all  
outputs in high-impedance mode. The control pins are compatible with 1.8V logic thresholds and are backward  
compatible with 2.5 V and 3.3 V logic thresholds as well.  
The TS3A27518E allows any SD, SDIO, and multimedia card host controllers to be expanded out to multiple  
cards or peripherals since the SDIO interface consists of 6-bits: CMD, CLK, and Data[0:3] signals. The  
TS3A27518E has two control pins that give additional flexibility to the user. For example, the ability to mux two  
different audio-video signals in equipment such as an LCD television,an LCD monitor, or a notebook docking  
station.  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TS3A27518EZQSR  
TOP-SIDE MARKING  
YL518E  
BGA – ZQS  
QFN – RTW  
TSSOP – PW  
Tape and reel  
–40°C to 85°C  
Tape and reel  
Tape and reel  
TS3A27518ERTWR  
TS3A27518EPWR  
YL518E  
YL518E  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
LOGIC DIAGRAM  
SUMMARY OF CHARACTERISTICS  
V+ = 3.3 V, TA = 25°C  
V
CC  
1-of-2  
IN1  
Configuration  
Multiplexer/Demultiplexer  
Logic  
EN  
IN2  
Number of channels  
6
ON-state resistance (ron  
)
6.2 (max)  
0.7 (max)  
ON-state resistance match (Δron  
)
ON-state resistance flatness  
2.1 (max)  
NC1  
NO1  
(rON(flat)  
)
NC4  
Turn-on/turn-off time (tON/tOFF  
)
59 ns/ 60.6 ns (max)  
22.7 ns (max)  
0.81 pC  
COM1  
NO4  
Break-before-make time (tBBM  
Charge injection (QC)  
Bandwidth (BW)  
)
COM4  
NC2  
NO2  
240 MHz  
NC5  
OFF isolation (OISO  
Crosstalk (XTALK  
)
–62 dB at 10 MHz  
–62 dB at 10 MHz  
0.05%  
NO5  
COM2  
)
COM5  
Total harmonic distortion (THD)  
Power-supply current (I+)  
NC3  
NO3  
NC6  
< 0.3 µA (max)  
NO6  
24-pin QFN (RTW),  
24-BGA (ZQS)  
COM3  
Package options  
COM6  
24-TSSOP (PW)  
GND  
FUNCTION TABLE  
NC1/2/3 TO COM1/2/3,  
COM1/2/3 TO NC1/2/3  
NC4/5/6 TO COM4/5/6, NO1/2/3 TO COM1/2/3,  
NO4/5/6 TO COM4/5/6,  
COM4/5/6 TO NO4/5/6  
EN  
IN1  
IN2  
COM4/5/6 TO NC4/5/6  
COM1/2/3 TO NO1/2/3  
H
L
L
L
L
X
L
X
L
OFF  
ON  
OFF  
ON  
OFF  
OFF  
ON  
OFF  
OFF  
OFF  
ON  
H
L
L
OFF  
ON  
ON  
H
H
OFF  
OFF  
OFF  
ON  
H
OFF  
ON  
2
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS3A27518E  
TS3A27518E  
www.ti.com ........................................................................................................................................................... SCDS260BMARCH 2009REVISED MAY 2009  
SDIO EXPANDER APPLICATION BLOCK DIAGRAM  
V
CC  
V
V
CC  
CC  
NC1  
COM1  
COM2  
COM3  
COM4  
COM5  
NO1  
NC2  
NO2  
NC3  
SD/MMC  
Memory Card  
NO3  
NC4  
SDIO Port  
NO4  
NC5  
NO5  
NC6  
COM6  
NO6  
Digital  
Baseband or  
Apps Processor  
IN1, IN2, EN  
V
CC  
TS3A27518  
SDIO Peripheral  
(Bluetooth,  
WLAN, DTV, etc)  
Copyright © 2009, Texas Instruments Incorporated  
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3
Product Folder Link(s): TS3A27518E  
TS3A27518E  
SCDS260BMARCH 2009REVISED MAY 2009........................................................................................................................................................... www.ti.com  
ABSOLUTE MINIMUM AND MAXIMUM RATINGS(1)(2)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
UNIT  
V+  
Supply voltage range(3)  
–0.5  
4.6  
V
VNC  
VNO  
VCOM  
Analog voltage range(3)(4)(5)  
Analog port diode current(6)  
ON-state switch current(7)  
–0.5  
–50  
–50  
4.6  
V
IK  
V+ < VNC, VNO, VCOM < 0  
VNC, VNO, VCOM = 0 to V+  
mA  
mA  
INC  
INO  
50  
ICOM  
VI  
Digital input voltage range(3)(4)  
Digital input clamp current(3)(4)  
Continuous current through V+  
Continuous current through GND  
Storage temperature range  
–0.5  
–50  
4.6  
V
IIK  
VIO < VI < 0  
mA  
mA  
mA  
°C  
I+  
100  
IGND  
Tstg  
–100  
–65  
150  
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may  
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond  
those specified is not implied.  
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum  
(3) All voltages are with respect to ground, unless otherwise specified.  
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
(5) This value is limited to 5.5 V maximum.  
(6) Requires clamp diodes on analog port to V+.  
(7) Pulse at 1-ms duration <10% duty cycle  
THERMAL IMPEDANCE RATINGS  
UNIT  
PW package  
RTW package  
ZQS package  
87.9  
66  
θJA  
Package thermal impedance(1)  
°C/W  
171.6  
(1) The package thermal impedance is calculated in accordance with JESD 51-7.  
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY(1)  
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
Analog Switch  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX  
UNIT  
Analog signal  
range  
VCOM  
VNO, VNC  
,
0
V+  
25°C  
Full  
4.4  
0.3  
6.2  
7.6  
0.7  
ON-state  
resistance  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
ron  
3 V  
3 V  
ON-state  
resistance match  
between channels  
25°C  
VNC or VNO = 2.1 V,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
Δron  
Full  
25°C  
Full  
0.8  
2.1  
2.3  
0.5  
ON-state  
resistance  
flatness  
0.95  
0.05  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 16  
ron(flat)  
3 V  
VNC or VNO = 1 V,  
VCOM = 3 V,  
or  
VNC or VNO = 3 V,  
VCOM = 1 V,  
25°C  
–0.5  
–7  
INC(OFF)  
INO(OFF)  
,
3.6 V  
Full  
25°C  
Full  
7
1
NC, NO  
OFF leakage  
current  
Switch OFF,  
See Figure 16  
µA  
VNC or VNO = 0 to 3.6 V,  
VCOM = 3.6 V to 0,  
or  
VNC or VNO = 3.6 V to 0,  
VCOM = 0 to 3.6 V,  
–1  
0.05  
INC(PWROFF)  
INO(PWROFF)  
,
0 V  
–12  
12  
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum  
Submit Documentation Feedback  
4
Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS3A27518E  
TS3A27518E  
www.ti.com ........................................................................................................................................................... SCDS260BMARCH 2009REVISED MAY 2009  
ELECTRICAL CHARACTERISTICS FOR 3.3-V SUPPLY (continued)  
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX  
UNIT  
VNC or VNO = 3 V,  
25°C  
–1  
0.01  
1
VCOM = 1 V,  
or  
VNC or VNO = 1 V,  
VCOM = 3 V,  
ICOM(OFF)  
3.6 V  
Full  
25°C  
Full  
–2  
–1  
2
1
COM  
Switch OFF,  
See Figure 16  
OFF leakage  
current  
µA  
VNC or VNO = 3.6 V to 0,  
VCOM = 0 to 3.6 V,  
ICOM(PWROFF) or  
VNC or VNO = 0 to 3.6 V,  
0.02  
0.04  
0.03  
0 V  
–12  
–2.5  
–7  
1
VCOM = 3.6 V to 0,  
VNC or VNO = 1 V,  
VCOM = Open,  
or  
VNC or VNO = 3 V,  
VCOM = Open,  
25°C  
Full  
2.2  
7
NC, NO  
INO(ON)  
,
Switch ON,  
See Figure 17  
ON leakage  
current  
3.6 V  
3.6 V  
µA  
µA  
INC(ON)  
VNC or VNO = Open,  
VCOM = 1 V,  
or  
VNC or VNO = Open,  
VCOM = 3 V,  
25°C  
Full  
–2  
2
COM  
ON leakage  
current  
Switch ON,  
See Figure 17  
ICOM(ON)  
–7  
7
Digital Control Inputs (IN1, IN2, EN)(2)  
Input logic high  
Input logic low  
VIH  
VIL  
Full  
Full  
3.6 V  
3.6 V  
1.2  
0
3.6  
0.65  
0.1  
V
V
25°C  
Full  
–0.1  
–2.5  
0.05  
Input leakage current  
Dynamic  
IIH, IIL  
VI = V+ or 0  
3.6 V  
µA  
2.5  
25°C  
Full  
3.3 V  
3 V to 3.6 V  
3.3 V  
18.1  
25.4  
11.1  
59  
60  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
Turn-on time  
tON  
tOFF  
tBBM  
ns  
ns  
ns  
25°C  
Full  
60.6  
61  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
Turn-off time  
3 V to 3.6 V  
3.3 V  
25°C  
Full  
4
22.7  
28  
Break-before-  
make time  
VNC = VNO = V+/2,  
RL = 50 ,  
CL = 35 pF,  
See Figure 20  
3 V to 3.6 V  
VGEN = 0,  
RGEN = 0,  
CL = 0.1 nF,  
See Figure 24  
Charge injection  
QC  
25°C  
25°C  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
0.81  
13  
pC  
pF  
pF  
pF  
pF  
pF  
MHz  
dB  
dB  
dB  
%
NC, NO  
OFF capacitance  
CNC(OFF)  
CNO(OFF)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
See Figure 18  
See Figure 18  
See Figure 18  
See Figure 18  
See Figure 18  
COM  
OFF capacitance  
VNC or VNO = V+ or GND,  
Switch OFF,  
CCOM(OFF)  
8.5  
NC, NO  
ON capacitance  
CNC(ON)  
CNO(ON)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
21.5  
21.5  
2
COM  
ON capacitance  
VCOM = V+ or GND,  
Switch ON,  
CCOM(ON)  
Digital input  
capacitance  
CI  
BW  
VI = V+ or GND  
Switch ON,  
See Figure 20  
Bandwidth  
RL = 50 ,  
240  
–62  
–62  
–71  
0.05  
RL = 50 ,  
f = 10 MHz,  
Switch OFF,  
See Figure 22  
OFF isolation  
Crosstalk  
OISO  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
XTALK  
XTALK(ADJ)  
THD  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
Crosstalk adjacent  
Total harmonic  
distortion  
RL = 600 ,  
CL = 50 pF,  
f = 20 Hz to 20 kHz,  
See Figure 25  
Supply  
25°C  
Full  
0.04  
0.3  
3
Positive  
supply current  
I+  
VI = V+ or GND,  
Switch ON or OFF  
3.6 V  
µA  
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
Copyright © 2009, Texas Instruments Incorporated  
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Product Folder Link(s): TS3A27518E  
TS3A27518E  
SCDS260BMARCH 2009REVISED MAY 2009........................................................................................................................................................... www.ti.com  
ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY(1)  
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
Analog Switch  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX UNIT  
Analog signal  
range  
VCOM  
VNO, VNC  
,
0
V+  
25°C  
Full  
5.5  
0.3  
9.6  
11.5  
0.8  
ON-state  
resistance  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
ron  
2.3 V  
2.3 V  
ON-state  
resistance match  
between channels  
25°C  
VNC or VNO = 1.6 V,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
Δron  
Full  
25°C  
Full  
0.9  
2.2  
2.3  
0.3  
ON-state  
resistance  
flatness  
0.91  
0.04  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 16  
ron(flat)  
2.3 V  
2.7 V  
VNC or VNO = 0.5 V,  
VCOM = 2.3 V,  
or  
VNC or VNO = 2.3 V,  
VCOM = 0.5 V,  
25°C  
–0.3  
–6  
INC(OFF)  
INO(OFF)  
,
Full  
25°C  
Full  
6
0.6  
10  
NC, NO  
OFF leakage  
current  
Switch OFF,  
See Figure 16  
µA  
VNC or VNO = 0 to 2.7 V,  
VCOM =2.7 V to 0,  
or  
VNC or VNO = 2.7 V to 0,  
VCOM = 0 to 2.7 V,  
–0.6  
–10  
–0.7  
–1  
0.02  
0.02  
0.02  
INC(PWROFF)  
INO(PWROFF)  
,
0 V  
VNC or VNO = 0.5 V,  
VCOM = 2.3 V,  
or  
VNC or VNO = 2.3 V,  
VCOM = 0.5 V,  
25°C  
Full  
0.7  
1
ICOM(OFF)  
2.7 V  
COM  
OFF leakage  
current  
Switch OFF,  
See Figure 16  
µA  
VNC or VNO = 2.7 V to 0,  
VCOM = 0 to 2.7 V,  
or  
VNC or VNO = 0 to 2.7 V,  
VCOM = 2.7 V to 0,  
25°C  
Full  
–0.7  
–7.2  
0.7  
7.2  
ICOM(PWROFF)  
0 V  
NC, NO  
ON leakage  
current  
VNC or VNO = 0.5 V or 2.3  
V,  
VCOM = Open,  
25°C  
Full  
–2.1  
–6  
0.03  
0.02  
2.1  
6
INO(ON)  
INC(ON)  
,
Switch ON,  
See Figure 17  
2.7 V  
2.7 V  
µA  
µA  
VNC or VNO = Open,  
VCOM = 0.5 V,  
or  
VNC or VNO = Open,  
VCOM = 2.3 V,  
25°C  
–2  
2
COM  
ON leakage  
current  
Switch ON,  
See Figure 17  
ICOM(ON)  
Full  
–5.7  
5.7  
Digital Control Inputs (IN1, IN2, EN)(2)  
Input logic high  
Input logic low  
VIH  
VIL  
VI = V+ or GND  
VI = V+ or 0  
Full  
Full  
2.7 V  
2.7 V  
1.15  
0
3.6  
0.55  
0.1  
V
V
25°C  
Full  
-0.1  
–2.1  
0.01  
Input leakage current  
Dynamic  
IIH, IIL  
2.7 V  
µA  
2.1  
25°C  
Full  
2.5 V  
2.3 V to 2.7 V  
2.5 V  
17.2  
17.1  
13  
36.8  
42.5  
29.8  
34.4  
30  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
Turn-on time  
tON  
tOFF  
tBBM  
ns  
ns  
ns  
25°C  
Full  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
Turn-off time  
2.3 V to 2.7 V  
2.5 V  
25°C  
Full  
4.5  
Break-before-  
make time  
VNC = VNO = V+/2,  
RL = 50 ,  
CL = 35 pF,  
See Figure 20  
2.3 V to 2.7 V  
33.3  
VGEN = 0,  
RGEN = 0,  
CL = 0.1 nF,  
See Figure 24  
Charge injection  
QC  
25°C  
25°C  
2.5 V  
2.5 V  
2.5 V  
0.47  
13.5  
9
pC  
pF  
pF  
NC, NO  
OFF capacitance  
CNC(OFF)  
CNO(OFF)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
See Figure 18  
See Figure 18  
COM  
OFF capacitance  
VNC or VNO = V+ or GND,  
Switch OFF,  
CCOM(OFF)  
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum  
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
6
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ELECTRICAL CHARACTERISTICS FOR 2.5-V SUPPLY (continued)  
V+ = 2.3 V to 2.7 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX UNIT  
NC, NO  
ON capacitance  
CNC(ON)  
CNO(ON)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
See Figure 18  
See Figure 18  
See Figure 18  
25°C  
2.5 V  
22  
pF  
COM  
ON capacitance  
VCOM = V+ or GND,  
Switch ON,  
CCOM(ON)  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
2.5 V  
2.5 V  
2.5 V  
2.5 V  
2.5 V  
2.5 V  
2.5 V  
22  
2
pF  
pF  
Digital input  
capacitance  
CI  
BW  
VI = V+ or GND  
Switch ON,  
See Figure 20  
Bandwidth  
RL = 50 ,  
240  
–62  
–62  
–71  
0.06  
MHz  
dB  
dB  
dB  
%
RL = 50 ,  
f = 10 MHz,  
Switch OFF,  
See Figure 22  
OFF isolation  
Crosstalk  
OISO  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
XTALK  
XTALK(ADJ)  
THD  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
Crosstalk adjacent  
Total harmonic  
distortion  
RL = 600 ,  
CL = 50 pF,  
f = 20 Hz to 20 kHz,  
See Figure 25  
Supply  
25°C  
Full  
0.01  
0.1  
µA  
2
Positive  
supply current  
I+  
VI = V+ or GND,  
Switch ON or OFF  
2.7 V  
ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY(1)  
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
Analog Switch  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX UNIT  
Analog signal  
range  
VCOM  
VNO, VNC  
,
0
V+  
25°C  
Full  
7.1  
0.3  
14.4  
16.3  
1
ON-state  
resistance  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
ron  
1.65 V  
1.65 V  
ON-state  
resistance match  
between channels  
25°C  
VNC or VNO = 1.5 V,  
ICOM = –32 mA,  
Switch ON,  
See Figure 15  
Δron  
Full  
25°C  
Full  
1.2  
5.5  
ON-state  
resistance  
flatness  
2.7  
0 (VNC or VNO) V+,  
ICOM = –32 mA,  
Switch ON,  
See Figure 16  
ron(flat)  
1.65 V  
1.95 V  
7.3  
VNC or VNO = 0.3 V,  
VCOM = 1.65 V,  
or  
VNC or VNO = 1.65 V,  
VCOM = 0.3 V  
25°C  
–0.25  
–5  
0.03  
0.25  
INC(OFF)  
INO(OFF)  
,
µA  
µA  
µA  
µA  
µA  
Full  
25°C  
Full  
5
0.4  
7.2  
0.4  
0.9  
0.4  
5
NC, NO  
OFF leakage  
current  
Switch OFF,  
See Figure 16  
VNC or VNO = 1.95 V to 0,  
VCOM = 0 to 1.95 V,  
or  
VNC or VNO = 0 to 1.95 V,  
VCOM = 1.95 V to 0,  
–0.4  
–7.2  
–0.4  
–0.9  
–0.4  
–5  
0.01  
0.02  
0.02  
0.02  
INC(PWROFF)  
INO(PWROFF)  
,
0 V  
1.95 V  
0 V  
VNC or VNO = 0.3 V,  
VCOM = 1.65 V,  
or  
VNC or VNO = 1.65 V,  
VCOM = 0.3 V  
25°C  
Full  
ICOM(OFF)  
ICOM(OFF)  
,
COM  
OFF leakage  
current  
Switch OFF,  
See Figure 16  
VNC or VNO = 1.95 V to 0,  
VCOM = 0 to 1.95 V,  
or  
VNC or VNO = 0 to 1.95 V,  
VCOM = 1.95 V to 0,  
25°C  
Full  
ICOM(PWROFF)  
ICOM(PWROFF)  
,
VNC or VNO = 0.3 V,  
VCOM = Open,  
or  
VNC or VNO = 1.65 V,  
VCOM = Open,  
25°C  
Full  
–2  
2
NC, NO  
ON leakage  
current  
INO(ON)  
INC(ON)  
,
Switch ON,  
See Figure 17  
1.95 V  
–5.2  
5.2  
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum  
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ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (continued)  
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
TA  
V+  
MIN  
TYP  
MAX UNIT  
VNC or VNO = Open,  
25°C  
–2  
0.02  
2
COM  
ON leakage  
current  
VCOM = 0.3 V,  
or  
VNC or VNO = Open,  
VCOM = 1.65 V,  
Switch ON,  
See Figure 17  
ICOM(ON)  
1.95 V  
µA  
Full  
–5.2  
5.2  
Digital Control Inputs (IN1, IN2, EN)(2)  
Input logic high  
Input logic low  
VIH  
VIL  
VI = V+ or GND  
VI = V+ or 0  
Full  
Full  
1.95 V  
1.95 V  
1
0
3.6  
0.4  
0.1  
2.1  
V
V
25°C  
Full  
-0.1  
-2.1  
0.01  
Input leakage current  
IIH, IIL  
1.95 V  
µA  
Dynamic  
25°C  
Full  
1.8 V  
14.1  
16.1  
18.4  
49.3  
56.7  
26.5  
31.2  
58  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
Turn-on time  
Turn-off time  
tON  
tOFF  
tBBM  
ns  
ns  
ns  
1.65 V to 1.95  
V
25°C  
Full  
1.8 V  
VCOM = V+,  
RL = 50 ,  
CL = 35 pF,  
See Figure 19  
1.65 V to 1.95  
V
25°C  
Full  
1.8 V  
5.3  
Break-before-  
make time  
VNC = VNO = V+/2,  
RL = 50 ,  
CL = 35 pF,  
See Figure 20  
1.65 V to 1.95  
V
58  
VGEN = 0,  
RGEN = 0,  
CL = 1 nF,  
See Figure 24  
Charge injection  
QC  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
25°C  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
1.8 V  
0.21  
9
pC  
pF  
NC, NO  
OFF capacitance  
CNC(OFF)  
CNO(OFF)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
See Figure 18  
See Figure 18  
See Figure 18  
See Figure 18  
NC, NO  
ON capacitance  
CNC(ON)  
CNO(ON)  
,
VNC or VNO = V+ or GND,  
Switch OFF,  
22  
pF  
COM  
ON capacitance  
VCOM = V+ or GND,  
Switch ON,  
CCOM(ON)  
22  
pF  
Digital input  
capacitance  
CI  
BW  
VI = V+ or GND  
2
pF  
Switch ON,  
See Figure 20  
Bandwidth  
RL = 50 ,  
240  
-60  
-60  
-71  
0.1  
MHz  
dB  
dB  
dB  
%
RL = 50 ,  
f = 10 MHz,  
Switch OFF,  
See Figure 22  
OFF isolation  
Crosstalk  
OISO  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
XTALK  
XTALK(ADJ)  
THD  
RL = 50 ,  
f = 10 MHz,  
Switch ON,  
See Figure 23  
Crosstalk adjacent  
Total harmonic  
distortion  
RL = 600 ,  
CL = 50 pF,  
f = 20 Hz to 20 kHz,  
See Figure 25  
Supply  
25°C  
Full  
0.01  
0.1  
1.5  
Positive  
supply current  
I+  
VI = V+ or GND,  
Switch ON or OFF  
1.95 V  
µA  
(2) All unused digital inputs of the device must be held at V+ or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
8
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PARAMETER DESCRIPTION  
SYMBOL  
VCOM  
VNC  
DESCRIPTION  
Voltage at COM  
Voltage at NC  
Voltage at NO  
VNO  
ron  
Resistance between COM and NC or NO ports when the channel is ON  
Δron  
Difference of ron between channels in a specific device  
ron(flat)  
INC(OFF)  
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions  
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the OFF state  
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the ON state and the output  
(COM) open  
INC(ON)  
INO(OFF)  
INO(ON)  
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the OFF state  
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the ON state and the output  
(COM) open  
ICOM(OFF)  
ICOM(ON)  
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the OFF state  
Leakage current measured at the COM port, with the corresponding channel (COM to NC or NO) in the ON state and the  
output (NC or NO) open  
VIH  
VIL  
Minimum input voltage for logic high for the control input (IN, EN)  
Maximum input voltage for logic low for the control input (IN, EN)  
Voltage at the control input (IN, EN)  
VI  
IIH, IIL  
Leakage current measured at the control input (IN, EN)  
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the propagation  
delay between the digital control (IN) signal and analog output NC or NO) signal when the switch is turning ON.  
tON  
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the propagation  
delay between the digital control (IN) signal and analog output (NC or NO) signal when the switch is turning OFF.  
tOFF  
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC or NO)  
output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the control input.  
Charge injection, QC = CL × ΔVCOM, CL is the load capacitance and ΔVCOM is the change in analog output voltage.  
QC  
CNC(OFF)  
CNC(ON)  
CNO(OFF)  
CNO(ON)  
CCOM(OFF)  
CCOM(ON)  
CI  
Capacitance at the NC port when the corresponding channel (NC to COM) is OFF  
Capacitance at the NC port when the corresponding channel (NC to COM) is ON  
Capacitance at the NC port when the corresponding channel (NO to COM) is OFF  
Capacitance at the NC port when the corresponding channel (NO to COM) is ON  
Capacitance at the COM port when the corresponding channel (COM to NC) is OFF  
Capacitance at the COM port when the corresponding channel (COM to NC) is ON  
Capacitance of control input (IN, EN)  
OFF isolation of the switch is a measurement of OFF-state switch impedance. This is measured in dB in a specific  
frequency, with the corresponding channel (NC to COM) in the OFF state.  
OISO  
Crosstalk is a measurement of unwanted signal coupling from an ON channel to an OFF channel (NC1 to NO1). Adjacent  
crosstalk is a measure of unwanted signal coupling from an ON channel to an adjacent ON channel (NC1 to NC2) .This is  
measured in a specific frequency and in dB.  
XTALK  
BW  
THD  
I+  
Bandwidth of the switch. This is the frequency in which the gain of an ON channel is –3 dB below the DC gain.  
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio of root  
mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the fundamental  
harmonic.  
Static power-supply current with the control (IN) pin at V+ or GND  
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TYPICAL CHARACTERISTICS  
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
1
0
85ºC  
85ºC  
25ºC  
–40ºC  
25ºC  
-–40ºC  
0.0  
0.5  
1.0  
1.5  
(V)  
2.0  
2.5  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
COM Voltage, V  
COM Voltage, V  
(V)  
COM  
COM  
Figure 1. ON-State Resistance vs COM Voltage (V+ = 3 V)  
Figure 2. ON-State Resistance vs COM Voltage (V+ = 2.3 V)  
12  
10  
8
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
COM (OFF)  
COM (ON)  
NO (OFF)  
NO (ON)  
6
4
85ºC  
25ºC  
2
-–40ºC  
0
0
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
COM  
1.2  
(V)  
1.4  
1.6  
1.8  
–40  
25  
85  
COM Voltage, V  
Temperature, T (°C)  
A
Figure 3. ON-State Resistance vs COM Voltage (V+ = 1.65  
V)  
Figure 4. Leakage Current vs Temperature (V+ = 3.3 V)  
10  
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TYPICAL CHARACTERISTICS (continued)  
45  
4.0  
40  
3.5  
35  
3.0  
30  
2.5  
25  
20  
15  
10  
5
2.0  
1.5  
1.0  
0.5  
0.0  
INx = High  
INx = Low  
0
–5  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
1.6  
1.8  
2.0  
Supply Voltage, V (V)  
Input Voltage, V (V)  
+
IN  
Figure 5. Supply Current vs Supply Voltage  
Figure 6. Control Input Thresholds (IN1, TA = 25°C)  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
1.8 V  
2.5 V  
3.3 V  
NO1TOCOM1-NO2  
NO1TOCOM1-NO3  
NO1TOCOM1-NO4  
NO1TOCOM1-NO5  
NO1TOCOM1-NO6  
0.1  
1
10  
Frequency (MHz)  
100  
1000  
0.1  
1
10  
Frequency (MHz)  
100  
1000  
Figure 7. Crosstalk Adjacent  
Figure 8. Crosstalk  
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TYPICAL CHARACTERISTICS (continued)  
0.11  
0.10  
0.09  
0.08  
0.07  
0.06  
0.05  
–10  
–20  
–30  
–40  
–50  
–60  
–70  
–80  
–90  
–100  
1.8 V  
2.5 V  
3.3 V  
1.8 V  
2.5 V  
3.3 V  
0.1  
1
10  
Frequency (MHz)  
100  
1000  
0.1  
1
10  
100  
1000  
Frequency (Hz)  
Figure 9. Total Harmonic Distortion vs Frequency  
Figure 10. OFF Isolation  
0
–2  
1
0
–4  
–1  
–2  
–3  
–4  
–5  
–6  
–7  
–6  
–8  
–10  
–12  
–14  
–16  
–18  
–20  
1.8 V  
2.5 V  
3.3 V  
0
0.3  
0.6  
0.9  
1.2  
1.5  
1.8  
0.1  
1
10  
100  
1000  
Bias Voltage (V)  
Frequency (MHz)  
Figure 11. Insertion Loss  
Figure 12. Charge Injection vs Bias Voltage (1.8 V)  
12  
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TYPICAL CHARACTERISTICS (continued)  
2
4
2
0
0
–2  
–4  
–2  
–4  
–6  
–8  
–6  
–10  
–12  
–14  
–16  
–8  
–10  
0
0.3  
0.6  
0.9  
1.2  
1.5  
1.8  
2.1  
2.4  
2.5  
0
0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.4 2.7 3.0 3.3  
Bias Voltage (V)  
Bias Voltage (V)  
Figure 13. Charge Injection vs Bias Voltage (2.5 V)  
Figure 14. Charge Injection vs Bias Voltage (3.3 V)  
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PARAMETER MEASUREMENT INFORMATION  
+
Ω
IN  
+
Figure 15. ON-state Resistance (rON  
)
OFF-State Leakage Current  
Channel OFF  
+
+
V = V or V  
IL  
I
IH  
IN  
+
Figure 16. OFF-State Leakage Current  
(ICOM(OFF), INC(OFF), ICOM(PWROFF), INC(PWROFF)  
)
14  
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PARAMETER MEASUREMENT INFORMATION (continued)  
ON-State Leakage Current  
+
Channel ON  
V = V or V  
I
IH  
IL  
IN  
+
Figure 17. ON-State Leakage Current  
(ICOM(ON), INC(ON)  
)
V
NO NO  
Capacitance  
Meter  
V
= V or GND and  
+
BIAS  
V = V or V  
IH  
I
IL  
Capacitance is measured at NO,  
COM, and IN inputs during ON  
and OFF conditions.  
COM COM  
V
BIAS  
Figure 18. Capacitance  
(CI, CCOM(OFF), CCOM(ON), CNC(OFF), CNC(ON)  
)
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PARAMETER MEASUREMENT INFORMATION (continued)  
R
C
V
COM  
TEST  
L
L
t
V
+
50 Ω  
50 Ω  
35 pF  
35 pF  
ON  
t
V
+
OFF  
IN  
Logic  
Intput  
(V )  
I
t
t
ON  
OFF  
90%  
90%  
Switch  
Output  
(V  
)
NO  
A. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns,  
tf < 5 ns.  
B. CL includes probe and jig capacitance.  
Figure 19. Turn-On (tON) and Turn-Off Time (tOFF  
)
V
or V  
NO  
NC  
NC or NO  
NC or NO  
V
OH  
V
or V  
= V /2  
NO +  
NC  
R
C
= 50 Ω  
L
L
= 35 pF  
A. CL includes probe and jig capacitance.  
B. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns,  
tf < 5 ns.  
Figure 20. Break-Before-Make Time (tBBM  
)
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PARAMETER MEASUREMENT INFORMATION (continued)  
Channel ON: NO to COM  
V = V or V  
50 Ω  
I
IH  
IL  
Network Analyzer Setup  
Source Power = 0 dBM  
(632-mV P-P at 50-Ω load)  
DC Bias = 350 mV  
IN  
Ω
+
+
+
Figure 21. Bandwidth (BW)  
Channel OFF: NO to COM  
V = V or V  
50 Ω  
I
IH  
IL  
Ω
Network Analyzer Setup  
Source Power = 0 dBM  
(632-mV P-P at 50-Ω load)  
DC Bias = 350 mV  
IN  
Ω
Figure 22. OFF Isolation (OISO  
)
Channel ON: NC to COM  
Channel OFF: NO to COM  
V = V or V  
V
V
50 Ω  
NC  
NC  
I
IH  
IL  
NO  
NO  
Network Analyzer Setup  
Ω
Source Power = 0 dBM  
(632-mV P-P at 50-Ω load)  
DC Bias = 350 mV  
IN  
Ω
Figure 23. Crosstalk (XTALK  
)
Copyright © 2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
17  
Product Folder Link(s): TS3A27518E  
TS3A27518E  
SCDS260BMARCH 2009REVISED MAY 2009........................................................................................................................................................... www.ti.com  
PARAMETER MEASUREMENT INFORMATION (continued)  
Δ
IN  
x Δ  
A. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr < 5 ns,  
tf < 5 ns.  
B. CL includes probe and jig capacitance.  
Figure 24. Charge Injection (QC)  
Channel ON: COM to NO  
= V P-P  
V = V or V  
IH  
R
= 600 Ω  
C = 50 pF  
L
I
IL  
= 20 Hz to 20 kHz  
L
V
f
SOURCE  
+
SOURCE  
V /2  
+
Audio Analyzer  
600 Ω  
NO  
COM  
IN  
+
600 Ω  
–V /2  
+
A. CL includes probe and jig capacitance.  
Figure 25. Total Harmonic Distortion (THD)  
18  
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Copyright © 2009, Texas Instruments Incorporated  
Product Folder Link(s): TS3A27518E  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2009  
PACKAGING INFORMATION  
Orderable Device  
TS3A27518EPWR  
TS3A27518ERTWR  
TS3A27518EZQSR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
PW  
24  
24  
24  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
QFN  
RTW  
ZQS  
3000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
BGA MI  
CROSTA  
R JUNI  
OR  
2500 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
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provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
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information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
2-Jun-2009  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TS3A27518EPWR  
TS3A27518ERTWR  
TS3A27518EZQSR  
TSSOP  
QFN  
PW  
RTW  
ZQS  
24  
24  
24  
2000  
3000  
2500  
330.0  
330.0  
330.0  
16.4  
12.4  
12.4  
6.95  
4.3  
8.3  
4.3  
3.3  
1.6  
1.5  
1.6  
8.0  
8.0  
8.0  
16.0  
12.0  
12.0  
Q1  
Q2  
Q1  
BGA MI  
CROSTA  
R JUNI  
OR  
3.3  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
2-Jun-2009  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TS3A27518EPWR  
TS3A27518ERTWR  
TS3A27518EZQSR  
TSSOP  
QFN  
PW  
RTW  
ZQS  
24  
24  
24  
2000  
3000  
2500  
346.0  
346.0  
340.5  
346.0  
346.0  
338.1  
33.0  
29.0  
20.6  
BGA MICROSTAR  
JUNIOR  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
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