TS3A4751PWR [TI]

0.9-ohm LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH; 0.9欧姆的低电压单电源四路SPST模拟开关
TS3A4751PWR
型号: TS3A4751PWR
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

0.9-ohm LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH
0.9欧姆的低电压单电源四路SPST模拟开关

复用器 开关 复用器或开关 信号电路 光电二极管 输出元件 PC
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
FEATURES  
APPLICATIONS  
Power Routing  
Low ON-State Resistance (ron)  
Battery Powered Systems  
Audio and Video Signal Routing  
Low-Voltage Data-Acquisition Systems  
Communications Circuits  
PCMCIA Cards  
Cellular Phones  
Modems  
Hard Drives  
– 0.9 Max (3-V Supply)  
– 1.5 Max (1.8-V Supply)  
ron Flatness: 0.4 Max (3-V)  
ron Matching  
– 0.05 Max (3-V Supply)  
– 0.25 Max (1.8-V Supply)  
1.6-V to 3.6-V Single-Supply Operation  
1.8-V CMOS Logic Compatible (3-V Supply)  
TSSOP PACKAGE  
(TOP VIEW)  
High Current-Handling Capacity (100 mA  
Continuous)  
Fast Switching: tON = 14 ns, tOFF = 9 ns  
ESD Protection Exceeds JESD-22  
– 4000-V Human Body Model (A114-A)  
– 300-V Machine Model (A115-A)  
14  
1
2
3
4
5
6
7
V+  
NO1  
COM1  
NO2  
13  
12  
11  
10  
9
IN1  
IN4  
COM2  
IN2  
NO4  
COM4  
COM3  
NO3  
– 1000-V Charged Device Model (C101)  
IN3  
8
GND  
DESCRIPTION/ORDERING INFORMATION  
The TS3A4751 is a low ON-state resistance (ron), low-voltage, quad, single-pole/single-throw (SPST) analog  
switch that operates from a single 1.6-V to 3.6-V supply. This device has fast switching speeds, handles  
rail-to-rail analog signals, and consumes very low quiescent power.  
The digital input is 1.8-V CMOS compatible when using a single 3-V supply.  
The TS3A4751 has four normally open (NO) switches. The TS3A4751 is available in a 14-pin thin shrink  
small-outline package (TSSOP).  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
YC751  
–40°C to 85°C  
TSSOP – PWR Reel of 2000  
TS3A4751PWR  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
FUNCTION TABLE  
NO TO COM,  
COM TO NO  
IN  
L
OFF  
ON  
H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2006, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
MAX  
UNIT  
V+  
Supply voltage range referenced to GND(2)  
–0.3  
4
V
VNO  
VCOM Analog and digital voltage range  
VIN  
–0.3  
V+ + 0.3  
V
INO  
On-state switch current  
ICOM  
VNO, VCOM = 0 to V+  
–100  
100  
mA  
mA  
I+  
Continuous current through V+ or GND  
IGND  
±100  
Peak current pulsed at 1 ms, 10% duty cycle  
COM, VI/O  
±200  
88  
mA  
°C/W  
°C  
(3)  
θJA  
TA  
Package thermal impedance  
Operating temperature range  
Junction temperature  
–40  
–65  
85  
TJ  
150  
150  
°C  
Tstg  
Storage temperature range  
°C  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) Signals on COM or NO exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current rating.  
(3) The package thermal impedance is measured in accordance with JESD 51-7.  
2
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
Electrical Characteristics for 3-V Supply(1)(2)  
V+ = 2.7 V to 3.6 V, TA = –40°C to 85°C, VIH = 1.4 V, VIL = 0.5 V (unless otherwise noted).  
PARAMETER  
Analog Switch  
SYMBOL  
TEST CONDITIONS  
TA  
MIN TYP(3)  
MAX  
UNIT  
Analog signal range  
VCOM, VNO  
ron  
0
V+  
0.9  
1.1  
0.05  
0.15  
0.4  
0.5  
2
V
25°C  
Full  
0.7  
V+ = 2.7 V, ICOM = –100 mA,  
VNO = 1.5 V  
ON-state resistance  
25°C  
Full  
0.03  
0.23  
ON-state resistance match  
between channels(4)  
V+ = 2.7 V, ICOM = –100 mA,  
VNO = 1.5 V  
ron  
25°C  
Full  
ON-state resistance  
flatness(5)  
V+ = 2.7 V, ICOM = –100 mA,  
VNO = 1 V, 1.5 V, 2 V  
ron(flat)  
25°C  
Full  
–2  
–18  
–2  
1
1
NO  
V+ = 3.6 V, VCOM = 0.3 V, 3 V,  
VNO = 3 V, 0.3 V  
INO(OFF)  
ICOM(OFF)  
ICOM(ON)  
nA  
nA  
nA  
OFF leakage current(6)  
18  
25°C  
Full  
2
COM  
V+ = 3.6 V, VCOM = 0.3 V, 3 V,  
VNO = 3 V, 0.3 V  
OFF leakage current(6)  
–18  
–2.5  
–5  
18  
25°C  
Full  
0.01  
2.5  
5
COM  
V+ = 3.6 V, VCOM = 0.3 V, 3 V,  
VNO = 0.3 V, 3 V, or floating  
ON leakage current(6)  
Dynamic  
25°C  
Full  
5
4
14  
15  
9
VNO = 1.5 V, RL = 50 ,  
CL = 35 pF, See Figure 14  
Turn-on time  
tON  
ns  
25°C  
Full  
VNO = 1.5 V, RL = 50 ,  
CL = 35 pF, See Figure 14  
Turn-off time  
tOFF  
QC  
ns  
10  
VGEN = 0, RGEN = 0, CL = 1 nF,  
See Figure 15  
Charge injection  
25°C  
3
pC  
NO OFF capacitance  
COM OFF capacitance  
COM ON capacitance  
Bandwidth  
CNO(OFF)  
CCOM(OFF)  
CCOM(ON)  
BW  
f = 1 MHz, See Figure 16  
f = 1 MHz, See Figure 16  
f = 1 MHz, See Figure 16  
RL = 50 , Switch ON  
25°C  
25°C  
25°C  
25°C  
23  
20  
pF  
pF  
43  
pF  
125  
–40  
–62  
–73  
–95  
0.04  
0.003  
MHz  
f = 10 MHz  
RL = 50 , CL = 5 pF,  
See Figure 17  
OFF isolation(7)  
OISO  
XTALK  
THD  
25°C  
25°C  
25°C  
dB  
dB  
%
f = 1 MHz  
f = 10 MHz  
f = 1 MHz  
RL = 32 Ω  
RL = 600 Ω  
RL = 50 , CL = 5 pF,  
See Figure 17  
Crosstalk  
f = 20 Hz to 20 kHz,  
VCOM = 2 VP-P  
Total harmonic distortion  
Digital Control Inputs (IN1–IN4)  
Input logic high  
VIH  
VIL  
Full  
Full  
1.4  
V
V
Input logic low  
0.5  
1
25°C  
Full  
0.5  
Input leakage current  
IIN  
VI = 0 or V+  
nA  
–20  
1.6  
20  
Supply  
Power-supply range  
V+  
I+  
3.6  
0.075  
0.75  
V
25°C  
Positive-supply current  
V+ = 3.6 V, VIN = 0 or V+  
µA  
Full  
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.  
(2) Parts are tested at 85°C and specified by design and correlation over the full temperature range.  
(3) Typical values are at V+ = 3 V, TA = 25°C.  
(4) ron = ron(max) – ron(min)  
(5) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal  
ranges.  
(6) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.  
(7) OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch  
3
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
Electrical Characteristics for 1.8-V Supply(1)(2)  
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C, VIH = 1 V, VIL = 0.4 V (unless otherwise noted)  
PARAMETER  
Analog Switch  
SYMBOL  
TEST CONDITIONS  
TA  
MIN TYP(3)  
MAX UNIT  
Analog signal range  
VCOM, VNO  
ron  
0
V+  
1.5  
2
V
25°C  
Full  
1
V+ = 1.8 V, ICOM = –10 mA,  
VNO = 0.9 V  
ON-state resistance  
25°C  
Full  
0.09  
0.7  
0.15  
0.25  
0.9  
1.5  
1
ON-state resistance match  
between channels(4)  
V+ = 1.8 V, ICOM = –10 mA,  
VNO = 0.9 V  
ron  
25°C  
Full  
ON-state resistance  
flatness(5)  
V+ = 1.8 V, ICOM = –10 mA,  
0 VNO V+  
ron(flat)  
25°C  
Full  
–1  
–10  
–1  
0.5  
0.5  
NO  
V+ = 1.95 V, VCOM = 0.15 V, 1.65 V,  
VNO = 1.8 V, 0.15 V  
INO(OFF)  
ICOM(OFF)  
ICOM(ON)  
nA  
nA  
nA  
OFF leakage current(6)  
10  
1
25°C  
Full  
COM  
V+ = 1.95 V, VCOM = 0.15 V, 1.65 V,  
VNO = 1.65 V, 0.15 V  
OFF leakage current(6)  
–10  
–1  
10  
1
25°C  
Full  
0.01  
COM  
V+ = 1.95 V, VCOM = 0.15 V, 1.65 V,  
VNO = 0.15 V, 1.65 V, or floating  
ON leakage current(6)  
–3  
3
Dynamic  
25°C  
Full  
6
5
18  
20  
10  
12  
VNO = 1.5 V, RL = 50 ,  
CL = 35 pF, See Figure 14  
Turn-on time  
tON  
ns  
25°C  
Full  
VNO = 1.5 V, RL = 50 ,  
CL = 35 pF, See Figure 14  
Turn-off time  
tOFF  
QC  
ns  
VGEN = 0, RGEN = 0, CL = 1 nF,  
See Figure 15  
Charge injection  
25°C  
3.2  
pC  
NO OFF capacitance  
COM OFF capacitance  
COM ON capacitance  
Bandwidth  
CNO(OFF)  
CCOM(OFF)  
CCOM(ON)  
BW  
f = 1 MHz, See Figure 16  
f = 1 MHz, See Figure 16  
f = 1 MHz, See Figure 16  
RL = 50 , Switch ON  
25°C  
25°C  
25°C  
25°C  
23  
20  
pF  
pF  
43  
pF  
123  
–61  
–36  
–95  
–73  
0.14  
0.013  
MHz  
dB  
f = 10 MHz  
RL = 50 , CL = 5 pF,  
See Figure 17  
OFF isolation(7)  
OISO  
XTALK  
THD  
25°C  
25°C  
25°C  
f = 100 MHz  
f = 10 MHz  
f = 100 MHz  
RL = 32 Ω  
dB  
%
RL = 50 , CL = 5 pF,  
See Figure 17  
Crosstalk  
f = 20 Hz to 20 kHz, VCOM  
= 2 VP-P  
Total harmonic distortion  
RL = 600 Ω  
Digital Control Inputs (IN1–IN4)  
Input logic high  
VIH  
VIL  
Full  
Full  
1
V
V
Input logic low  
0.4  
5
25°C  
Full  
0.1  
Input leakage current  
IIN  
VI = 0 or V+  
nA  
–10  
1.6  
10  
Supply  
Power-supply range  
V+  
I+  
3.6  
0.05  
0.5  
V
25°C  
Positive-supply current  
VI = 0 or V+  
µA  
Full  
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.  
(2) Parts are tested at 85°C and specified by design and correlation over the full temperature range.  
(3) Typical values are at TA = 25°C.  
(4) ron = ron(max) – ron(min)  
(5) Flatness is defined as the difference between the maximum and minimum value of ron as measured over the specified analog signal  
ranges.  
(6) Leakage parameters are 100% tested at the maximum-rated hot operating temperature and specified by correlation at TA = 25°C.  
(7) OFF isolation = 20log10 (VCOM/VNO), VCOM = output, VNO = input to OFF switch  
4
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TYPICAL PERFORMANCE  
1.6  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
855C  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
255C  
V
= 1.8 V  
+
–405C  
V
+
= 2.7 V  
0.0  
0.0  
0.0  
0.5  
1.0  
1.5  
2.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
V
COM  
(V)  
V
COM  
(V)  
Figure 1. ron vs VCOM  
Figure 2. ron vs VCOM (V+ = 1.8 V)  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
1000.00  
100.00  
10.00  
NC/NO (OFF)  
855C  
255C  
COM (ON)  
–405C  
0.0  
0.0  
1.00  
−40°C  
25°C  
(°C)  
85°C  
0.5  
1.0  
1.5  
(V)  
2.0  
2.5  
3.0  
V
COM  
T
A
Figure 3. ron vs VCOM (V+ = 2.7 V)  
Figure 4. ION and IOFF vs Temperature  
(V+ = 3.6 V)  
8
7
6
5
4
3
2
1
35  
30  
25  
20  
15  
10  
5
V = 3 V  
+
t
ON  
V = 1.8 V  
+
t
OFF  
0
1.6  
0
0.0  
2.0  
2.4  
2.8  
3.2  
3.6  
4.0  
0.5  
1.0  
1.5  
V
2.0  
(V)  
2.5  
3.0  
3.5  
V (V)  
+
COM  
Figure 5. QC vs VCOM  
Figure 6. tON and tOFF vs Supply Voltage  
5
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TYPICAL PERFORMANCE (continued)  
7
6
5
4
3
2
1
0
1000.000  
100.000  
10.000  
1.000  
855C  
t
= 1.8 V  
ON  
255C  
t
t
t
= 1.8 V  
= 3 V  
= 3 V  
OFF  
–405C  
ON  
0.100  
OFF  
0.010  
0.001  
−40°C  
25°C  
(°C)  
85°C  
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
T
A
V
+
(V)  
Figure 7. tON and tOFF vs Temperature  
Figure 8. ICC vs V+  
0
0
−10  
−20  
−30  
−40  
−50  
−60  
−70  
−80  
−90  
−2  
−4  
−6  
−8  
−10  
−12  
−14  
0.1  
1
10  
100  
1000  
0.1  
1
10  
100  
1000  
Frequency (MHz)  
Frequency (MHz)  
Figure 9. Gain vs Frequency  
(V+ = 3 V)  
Figure 10. OFF Isolation vs Frequency  
(V+ = 3 V)  
0.042  
0.041  
0.040  
0.039  
0.038  
0.037  
0.0040  
0.0036  
0.0032  
0.0028  
0.0024  
0.0020  
0.0016  
0.0012  
0.0008  
0.0004  
0
0
0
10  
100  
1K  
10K  
100K  
10  
100  
1K  
10K  
100K  
Frequency (kHz)  
Frequency (kHz)  
Figure 11. Total Harmonic Distortion vs Frequency  
Figure 12. Total Harmonic Distortion vs Frequency  
(RL = 32 )  
(RL = 600 )  
6
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TYPICAL PERFORMANCE (continued)  
0
−20  
−40  
−60  
−80  
−100  
0
0.1  
1
10  
100  
1000  
Frequency (MHz)  
Figure 13. Crosstalk vs Frequency (V+ = 3 V)  
PIN DESCRIPTION  
PIN NO.  
NAME  
DESCRIPTION  
Normally open  
1, 3, 8, 11  
NO1, NO2, NO3, NO4  
COM1, COM2, COM3,  
COM4  
2, 4, 9, 10  
Common  
Ground  
7
13, 5, 6, 12  
14  
GND  
IN1, IN2, IN3, IN4  
V+  
Logic control inputs  
Positive supply voltage  
7
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0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
APPLICATION INFORMATION  
Proper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum  
ratings because stresses beyond the listed ratings can cause permanent damage to the devices. Always  
sequence V+ on first, followed by NO or COM.  
Although it is not required, power-supply bypassing improves noise margin and prevents switching noise  
propagation from the V+ supply to other components. A 0.1-µF capacitor, connected from V+ to GND, is  
adequate for most applications.  
Logic Inputs  
The TS3A4751 logic inputs can be driven up to 3.6 V, regardless of the supply voltage. For example, with a  
1.8-V supply, IN may be driven low to GND and high to 3.6 V. Driving IN rail to rail minimizes power  
consumption.  
Analog Signal Levels  
Analog signals that range over the entire supply voltage (V+ to GND) can be passed with very little change in ron  
(see Typical Operating Characteristics). The switches are bidirectional, so NO and COM can be used as either  
inputs or outputs.  
Layout  
High-speed switches require proper layout and design procedures for optimum performance. Reduce stray  
inductance and capacitance by keeping traces short and wide. Ensure that bypass capacitors are as close to the  
device as possible. Use large ground planes where possible.  
8
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TS3A4751  
0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TEST CIRCUITS/TIMING DIAGRAMS  
V+  
V+  
tR < 5 ns  
tF < 5 ns  
V
IH + 0.5 V  
NO  
VNO  
50%  
50%  
IN  
0
IN  
VCOM  
COM  
VNO  
90%  
90%  
VCOM  
0
35 pF  
50 W  
GND  
tON  
tOFF  
Figure 14. Switching Times  
V+  
V+  
RGEN  
NO  
VGEN  
VI  
IN  
VO  
COM  
GND  
CL  
1000 pF  
V+  
0
VI  
VO  
DVO  
Figure 15. Charge Injection (QC)  
9
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0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TEST CIRCUITS/TIMING DIAGRAMS (continued)  
V+  
V+  
NO  
1-MHz  
Capacitance  
Analyzer  
As  
Required  
IN  
COM  
GND  
Figure 16. NO and COM Capacitance  
0.1 mF  
V+  
Network  
Analyzer  
V+  
VI  
50 W  
50 W  
NO  
(1)  
VO  
Ref  
Meas  
V+  
IN  
COM  
GND  
50 W 50 W  
OFF isolation = 20 log VO/VI  
Measurements are standardized against  
short at socket terminals. OFF isolation is  
measured between COM and OFF terminals  
on each switch. Bandwidth is measured between  
COM and ON terminals on each switch. Signal  
direction through switch is reversed; worst  
values are recorded.  
(1)Add 50-W termination for  
OFF isolation  
Figure 17. OFF Isolation, Bandwidth, and Crosstalk  
10  
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0.9-LOW-VOLTAGE SINGLE-SUPPLY QUAD SPST ANALOG SWITCH  
www.ti.com  
SCDS227CJULY 2006REVISED SEPTEMBER 2006  
TEST CIRCUITS/TIMING DIAGRAMS (continued)  
Channel ON: COM to NO  
V
V = V /2  
f
C
R
= 50 pF  
= 600 W  
I
+
SOURCE  
L
L
= V P-P  
+
= 20 Hz to 20 kHz  
SOURCE  
V+/2  
Audio Analyzer  
NO  
Signal  
Source  
600 W  
COM  
IN  
(A)  
C
L
600 W  
-V+/2  
A. CL includes probe and jig capacitance.  
Figure 18. Total Harmonic Distortion (THD)  
11  
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Sep-2006  
PACKAGING INFORMATION  
Orderable Device  
TS3A4751PWR  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
PW  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TS3A4751PWRG4  
TSSOP  
PW  
14  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,  
enhancements, improvements, and other changes to its products and services at any time and to discontinue  
any product or service without notice. Customers should obtain the latest relevant information before placing  
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and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI  
deems necessary to support this warranty. Except where mandated by government requirements, testing of all  
parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for  
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and applications, customers should provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,  
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Audio  
Amplifiers  
amplifier.ti.com  
www.ti.com/audio  
Data Converters  
dataconverter.ti.com  
Automotive  
www.ti.com/automotive  
DSP  
dsp.ti.com  
Broadband  
Digital Control  
Military  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
Logic  
interface.ti.com  
logic.ti.com  
Power Mgmt  
Microcontrollers  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
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Telephony  
Video & Imaging  
Wireless  
www.ti.com/wireless  
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Copyright 2006, Texas Instruments Incorporated  

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