TS5A22364QDGSRQ1 [TI]

具有负信号处理功能的汽车类 0.65Ω、5V、2:1 (SPDT) 2 通道模拟开关 | DGS | 10 | -40 to 125;


型号：	TS5A22364QDGSRQ1
厂家：	TEXAS INSTRUMENTS
描述：	具有负信号处理功能的汽车类 0.65Ω、5V、2:1 (SPDT) 2 通道模拟开关 \| DGS \| 10 \| -40 to 125 开关光电二极管
文件：	总29页 (文件大小：1522K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

TS5A22364-Q1 具有负信号功能的 0.65Ω 双路 SPDT 模拟开关

1 特性

2 应用

•

适用于汽车电子应用

•

车用信息娱乐

音频路由

指定的先断后合 (BBM) 开关

负信号摆幅功能：最大摆幅范围为 –2.75V 到

2.75V (V_CC= 2.75V)

工业自动化

医疗成像

•

内部分流开关，可防止在切换电源时出现喀哒声和

噼啪声

3 说明

•

低导通状态电阻（0.65Ω 典型值）

低电荷注入

TS5A22364-Q1 是一款双通道单刀双掷 (SPDT) 模拟

开关，设计用于 2.3V 至 5.5V 电源。该器件支持负信

号摆幅，允许低于接地电平的信号通过开关，同时不发

生失真。此外，TS5A22364-Q1 还包含一个内部分流

开关，能够在常闭或常开引脚未连接至 COM 时使其电

容放电。此开关可降低在切换电源时出现的喀哒声和噼

啪声。先断后合特性可防止信号在跨路径传输时出现失

真。该器件同时拥有低导通电阻、出色的通道间导通状

态电阻匹配以及最小总谐波失真 (THD) 性能，是音频

应用的理想选择。

出色的通道间导通状态电阻匹配

2.25V 至 5.5V 电源 (V_CC

)

锁断性能达 100mA，符合 AEC Q100-004

静电放电 (ESD) 性能

–

通过 2500V 人体模型测试，符合 AEC Q100-

002

–

通过 1500V 带电器件模型测试，符合 AEC

Q100-011

器件信息⁽¹⁾

器件型号

封装

封装尺寸（标称值）

TS5A22364-Q1

VSSOP (10)

3.00mm x 3.00mm

(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。

LP38690 的

TS5A22364-Q1

OUT+

OUT-

NC1

NO1

Audio

Source 1

COM1

IN1

Input Select

8-ꢀ

Speaker

Shunt

Switch

IN2

NC2

NO2

COM2

OUT+

OUT-

Audio

Source 2

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

English Data Sheet: SCDS361

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

8.2 Functional Block Diagram ....................................... 16

8.3 Feature Description................................................. 16

8.4 Device Functional Modes........................................ 16

Application and Implementation ........................ 17

9.1 Application Information............................................ 17

9.2 Typical Application ................................................. 17

特性.......................................................................... 1

应用.......................................................................... 1

说明.......................................................................... 1

修订历史记录 ........................................................... 2

Pin Configuration and Functions......................... 3

Specifications......................................................... 4

6.1 Absolute Maximum Ratings ..................................... 4

6.2 ESD Ratings ............................................................ 4

6.3 Recommended Operating Conditions ...................... 4

6.4 Thermal Information.................................................. 5

6.5 Electrical Characteristics—2.5-V Supply ................. 5

6.6 Electrical Characteristics—3.3-V Supply ................. 6

6.7 Electrical Characteristics—5-V Supply .................... 7

6.8 Typical Characteristics.............................................. 9

Parameter Measurement Information ................ 12

Detailed Description ............................................ 16

8.1 Overview ................................................................. 16

10 Power Supply Recommendations ..................... 19

11 Layout................................................................... 20

11.1 Layout Guidelines ................................................. 20

11.2 Layout Example ................................................... 20

12 器件和文档支持 ..................................................... 21

12.1 接收文档更新通知 ................................................. 21

12.2 社区资源................................................................ 21

12.3 商标....................................................................... 21

12.4 静电放电警告......................................................... 21

13 机械、封装和可订购信息....................................... 21

4 修订历史记录

Changes from Original (October 2014) to Revision A

Page

•

器件状态从产品预览改为量产数据.......................................................................................................................................... 1

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

5 Pin Configuration and Functions

DGS Package

10-Pin VSSOP

Top View

VCC

NO1

NO2

COM2

NC2

IN2

COM1

NC1

IN1

GND

Pin Functions

I/O

DESCRIPTION

NO.

NAME

VCC

NO1

COM1

NC1

Supply power

I/O

Normally open (NO) signal path, switch 1

Common signal path, switch 1

Normally closed (NC) signal path, switch 1

Digital control pin to connect COM1 to NO1, switch 1

Ground

IN1

GND

IN2

—

Digital control pin to connect COM2 to NO2, switch 2

Normally closed (NC) signal path, switch 2

Common signal path, switch 2

NC2

I/O

COM2

NO2

Normally open (NO) signal path, switch 2

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

(2)

MIN

MAX

UNIT

V_CC

Supply voltage⁽³⁾

–0.5

V_NC

Analog voltage on NC1-NC2 pin^{(3) (4) (5)}

Analog voltage on NO1-NO2 pin^{(3) (4) (5)}

Analog voltage on COM1-COM2 pin^{(3) (4) (5)}

V_NO

V_COM

V_CC– 6

–50

V_CC+ 0.5

V_NC, V_NO, V_COM< 0

V_NC, V_NO, V_COM> V_CC

I_I/OK

Analog port diode input clamp current

I_NC

I_NO

I_COM

On-state switch continuous current

On-state switch peak current⁽⁶⁾

–150

–300

150

300

V_NC, V_NO, V_COM= 0 to V_CC

I_RSH

V_IN

I_IK

Off-state switch shunt resistor current

Digital input voltage

Digital input clamp current^{(3) (4)}

–20

–0.5

–50

6.5

V_IN< 0

I_CC

I_GND

Continuous current through V_CCor GND

Storage temperature

–100

–65

100

150

°C

T_stg

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(3) All voltages are with respect to ground, unless otherwise specified.

(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(5) This value is limited to 5.5 V maximum.

(6) Pulse at 1-ms duration <10% duty cycle.

6.2 ESD Ratings

MIN

MAX

UNIT

Human body model (HBM), per AEC Q100-002⁽¹⁾

–2500

2500

V_ESD

Electrostatic discharge

Charged device model (CDM), per

all pins

–1500

1500

AEC Q100-011

(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

V_CC

V_NC

V_NO

V_COM

V_IN

Supply voltage

Signal path voltage

Digital control

2.3

V_CC– 5.5

GND

5.5

V_CC

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

6.4 Thermal Information

TS5A22364-Q1

THERMAL METRIC^{(1) (2)}

DGS (VSSOP)

10 PINS

163.3

56.4

UNIT

R_θJA

Junction-to-ambient thermal resistance

Junction-to-case (top) thermal resistance

Junction-to-board thermal resistance

°C/W

R_θJC(top)

R_θJB

83.1

ψ_JT

Junction-to-top characterization parameter

Junction-to-board characterization parameter

Junction-to-case (bottom) thermal resistance

6.8

ψ_JB

81.8

R_θJC(bot)

N/A

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2) The package thermal impedance is calculated in accordance with JESD 51-7.

6.5 Electrical Characteristics—2.5-V Supply

V_CC= 2.3 V to 2.7 V, T_A= –40°C to +125°C (unless otherwise noted)

(1)

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP

MAX UNIT

ANALOG SWITCH

V_COM

V_NO

V_NC

V_CC

5.5

–

Analog signal

V_CC

Ω

V_NCor V_NO= V_CC, 1.5 V,

V_CC– 5.5 V

I_COM= –100 mA

25°C

–40°C to +125°C

25°C

0.65

0.023

0.18

0.94

1.3

On-state

resistance

COM to NO or NC,

See Figure 14

R_on

2.7 V

On-state

resistance match

between channels

0.11

0.15

0.46

0.56

V_NCor V_NO= 1.5 V,

I_COM= –100 mA

COM to NO or NC,

See Figure 14

ΔR_on

–40°C to +125°C

25°C

On-state

resistance

flatness

V_NCor V_NO= V_CC, 1.5 V,

V_CC– 5.5 V

I_COM= –100 mA

COM to NO or NC,

See Figure 14

R_on(flat)

–40°C to +125°C

Shunt switch

resistance

R_SH

I_NOor I_NC= 10 mA

–40°C to +125°C

2.7 V

Ω

25°C

–200

200

On-state leakage

current

V_NCand V_NO= floating,

V_COM= V_CC, V_CC– 5.5 V

I_COM(ON)

See Figure 16

–40°C to +125°C

–2500

2500

DIGITAL CONTROL INPUTS (IN)⁽²⁾

Input logic high

Input logic low

V_IH

V_IL

–40°C to +125°C

25°C

1.4

V_CC

0.4

–250

250

Input leakage

current

I_IH, I_IL

V_IN= V_CCor 0

2.7 V

2.5 V

–40°C to +125°C

DYNAMIC

25°C

120

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnon time

t_ON

2.3 V to

2.7 V

R_L= 300 Ω

–40°C to +125°C

25°C

2.5 V

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnoff time

t_OFF

2.3 V to

2.7 V

R_L= 300 Ω

–40°C to +125°C

Break-before-make

time

t_BBM

Q_C

See Figure 19

25°C

2.5 V

V_GEN= 0,

R_GEN= 0,

C_L= 1 nF,

See Figure 23

Charge injection

215

On-State

NC, NO, COM

capacitance

V_COM= V_CCor GND,

Switch ON, f = 10 MHz

C_COM(ON)

See Figure 17

25°C

2.5 V

370

Digital input

capacitance

C_I

V_IN= V_CCor GND

See Figure 17

See Figure 20

25°C

2.5 V

2.6

Bandwidth

R_L= 50 Ω, –3 dB

MHz

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(2) All unused digital inputs of the device must be held at V_CCor GND to ensure proper device operation. See the Implications of Slow or

Floating CMOS Inputs application report, SCBA004.

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

Electrical Characteristics—2.5-V Supply (continued)

V_CC= 2.3 V to 2.7 V, T_A= –40°C to +125°C (unless otherwise noted) ⁽¹⁾

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP

MAX UNIT

f = 100 kHz,

See Figure 21

Off-state isolation

O_ISO

R_L= 50 Ω

25°C

2.5 V

–66

f = 100 kHz,

See Figure 22

Crosstalk

X_TALK

25°C

2.5 V

–75

f = 20 Hz to

20 kHz,

See Figure 24

Total harmonic

distortion

R_L= 600 Ω,

C_L= 35 pF

THD

0.01

SUPPLY

25°C

0.2

1.1

μA

V_COMand V_IN= V_CCor GND, V_NCand V_NO= floating

2.7 V

Positive

supply current

–40°C to +125°C

1.3

I_CC

V_COM= V_CC– 5.5 V, V_IN= V_CCor GND, V_NCand V_NO

= floating

–40°C to +125°C

3.3

μA

6.6 Electrical Characteristics—3.3-V Supply

V_CC= 3 V to 3.6 V, T_A= –40°C to +125°C (unless otherwise noted)

(1)

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP MAX UNIT

ANALOG SWITCH

V_COM

V_NO

V_NC

V_CC

5.5

–

Analog signal

V_CC

V_NCor V_NO≤ V_CC

1.5 V,

V_CC– 5.5 V,

I_COM= –100 mA

25°C

–40°C to +125°C

25°C

0.61

0.024

0.12

0.87

0.97

0.13

0.46

0.5

On-state

resistance

COM to NO or NC,

See Figure 14

R_on

3 V

Ω

On-state

resistance match

between

channels

V_NCor V_NO= 1.5 V,

I_COM= –100 mA

COM to NO or NC,

See Figure 14

ΔR_on

Ω

–40°C to +125°C

25°C

V_NCor V_NO≤ V_CC

On-state

resistance

flatness

1.5 V,

V_CC– 5.5 V,

I_COM= –100 mA

COM to NO or NC,

See Figure 14

R_on(flat)

–40°C to +125°C

Shunt switch

resistance

I_NOor

I_NC= 10 mA

R_SH

–40°C to +125°C

3 V

Ω

25°C

–200

200

On-state leakage

current

V_NCand V_NO= floating,

V_COM= V_CC,V_CC– 5.5 V

COM to NO or NC,

See Figure 16

I_COM(ON)

3.6 V

–40°C to +125°C

–2500

2500

DIGITAL CONTROL INPUTS (IN)⁽²⁾

Input logic high

Input logic low

V_IH

V_IL

–40°C to +125°C

25°C

1.4

V_CC

0.6

–250

250

Input leakage

current

I_IH, I_IL

V_IN= V_CCor 0

3.6 V

3.3 V

–40°C to +125°C

DYNAMIC

25°C

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnon time

t_ON

3 V to 3.6

R_L= 300 Ω

–40°C to +125°C

25°C

3.3 V

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnoff time

t_OFF

3 V to 3.6

R_L= 300 Ω

–40°C to +125°C

Break-before-

make time

t_BBM

Q_C

See Figure 19

25°C

3.3 V

V_GEN= 0,

R_GEN= 0,

C_L= 1 nF,

See Figure 23

Charge injection

On-State

NC, NO, COM

capacitance

300

V_COM= V_CCor GND,

f = 10 MHz

C_COM(ON)

See Figure 17

25°C

3.3 V

370

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(2) All unused digital inputs of the device must be held at V_CCor GND to ensure proper device operation. See the Implications of Slow or

Floating CMOS Inputs application report, SCBA004.

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

Electrical Characteristics—3.3-V Supply (continued)

V_CC= 3 V to 3.6 V, T_A= –40°C to +125°C (unless otherwise noted) ⁽¹⁾

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP MAX UNIT

Digital input

C_I

V_IN= V_CCor GND

R_L= 50 Ω, –3 dB

R_L= 50 Ω

See Figure 17

25°C

3.3 V

2.6

17.5

–68

MHz

capacitance

Bandwidth

Switch ON,

See Figure 20

25°C

3.3 V

f = 100 kHz,

See Figure 21

Off-state isolation

Crosstalk

O_ISO

X_TALK

THD

f = 100 kHz,

See Figure 22

R_L= 50 Ω

–76

Total harmonic

distortion

R_L= 600 Ω,

C_L= 35 pF

f = 20 Hz to 20 kHz,

See Figure 24

0.008

SUPPLY

V_COMand V_IN= V_CCor

25°C

0.1

1.2

1.3

GND, V_NCand V_NO

floating

3.6 V

μA

–40°C to +125°C

Positive

supply current

I_CC

V_COM= V_CC– 5.5 V, V_IN

V_CCor GND, V_NCand V_NO

= floating

–40°C to +125°C

3.4

6.7 Electrical Characteristics—5-V Supply⁽¹⁾

V_CC= 4.5 V to 5.5 V, T_A= –40°C to +125°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP

MAX UNIT

ANALOG SWITCH

V_COM

V_NO, V_NC

V_CC–

5.5

Analog signal

V_CC

V_NCor V_NO= V_CC, 1.6 V,

V_CC= –5.5 V,

I_COM= –100 mA

25°C

–40°C to +125°C

25°C

0.52

0.04

0.74

0.83

0.23

On-state

resistance

COM to NO or NC,

See Figure 14

R_on

4.5 V

Ω

On-state

resistance match

between

V_NCor V_NO= 1.6 V,

I_COM= –100 mA

COM to NO or NC,

See Figure 14

ΔR_on

Ω

–40°C to +125°C

0.30

channels

On-state

resistance

flatness

V_NCor V_NO= V_CC, 1.6 V,

V_CC= –5.5 V,

I_COM= –100 mA

25°C

0.076

0.46

0.5

COM to NO or NC,

See Figure 14

R_on(flat)

–40°C to +125°C

Shunt switch

resistance

R_SH

I_NOor I_NC= 10 mA

–40°C to +125°C

4.5 V

5.5 V

Ω

25°C

–200

200

On-state leakage

current

V_NCand V_NO= Floating,

V_COM= VCC, V_CC– 5.5 V

I_COM(ON)

See Figure 16

–40°C to +125°C

–2500

2500

DIGITAL CONTROL INPUTS (IN)⁽²⁾

Input logic high

Input logic low

V_IH

V_IL

–40°C to +125°C

25°C

2.4

V_CC

0.8

–250

250

Input leakage

current

I_IH, I_IL

V_IN= V_CCor 0

5.5 V

5 V

–40°C to +125°C

DYNAMIC

25°C

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnon time

t_ON

4.5 V to

5.5 V

R_L= 300 Ω

–40°C to +125°C

25°C

5 V

V_COM= V_CC

C_L= 35 pF,

See Figure 18

Turnoff time

t_OFF

4.5 V to

5.5 V

R_L= 300 Ω

–40°C to +125°C

Break-before-

make time

V_NC= V_NO= V_CC/2

R_L= 300 Ω

C = 35 pF,

See Figure 19

t_BBM

25°C

5 V

3.5

V_GEN= 0,

R_GEN= 0

C_L= 1_LnF,

See Figure 23

Charge injection Q_C

500

(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

(2) All unused digital inputs of the device must be held at V_CCor GND to ensure proper device operation. See the Implications of Slow or

Floating CMOS Inputs application report, SCBA004.

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

Electrical Characteristics—5-V Supply⁽¹⁾(continued)

V_CC= 4.5 V to 5.5 V, T_A= –40°C to +125°C (unless otherwise noted)

PARAMETER

TEST CONDITIONS

T_A

V_CC

MIN

TYP

MAX UNIT

ON-State

C_COM(ON)

V_COM= V_CCor GND

See Figure 17

25°C

5 V

370

NC, NO, COM

capacitance

Digital input

capacitance

C_I

V_IN= V_CCor GND

R_L= 50 Ω

See Figure 17

See Figure 20

25°C

5 V

2.6

18.3

–70

MHz

Bandwidth

f = 100 kHz,

See Figure 21

Off-state isolation O_ISO

R_L= 50 Ω

f = 100 kHz,

See Figure 22

Crosstalk

X_TALK

THD

R_L= 50 Ω

25°C

5 V

–78

Total harmonic

distortion

R_L= 600 Ω,

C_L= 35 pF

f = 20 Hz to 20 kHz,

See Figure 24

0.009

SUPPLY

25°C

0.2

1.3

V_COMand V_IN= V_CCor GND,

V_NCor V_NO= floating

–40°C to +125°C

3.5

Positive

supply current

I_CC

5.5 V

μA

V_COM= V_CC– 5.5 V, V_IN

V_CCor GND, V_NCor V_NO

floating

–40°C to +125°C

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

6.8 Typical Characteristics

1.1

V_CC= 2.3 V

V_CC= 3 V

V_CC= 4.5 V

T_A= -40°C

T_A= 25°C

T_A= 85°C

T_A= 125°C

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.9

0.8

0.7

0.6

0.5

0.4

0.3

-3.5

-2.5

-1.5

-0.5

0.5

1.5

2.5

3.5

4.5

-3 -2.4 -1.8 -1.2 -0.6

0.6 1.2 1.8 2.4

Voltage V_COM(V)

D001

Figure 1. On-Resistance vs Voltage V_COM

Figure 2. On-Resistance vs Voltage V_COM(V_CC= 2.3 V)

0.75

0.65

0.55

0.45

0.35

0.25

0.7

T_A= -40°C

T_A= 25°C

T_A= 85°C

T_A= 125°C

T_A= -40°C

T_A= 25°C

T_A= 85°C

T_A= 125°C

0.65

0.6

0.55

0.5

0.45

0.4

0.35

0.3

0.25

0.2

0.15

0.1

-3

-2

-1

Voltage V_COM(V)

D001

Figure 3. On-Resistance vs Voltage V_COM(V_CC= 3 V)

Figure 4. On-Resistance vs Voltage V_COM(V_CC= 4.5 V)

-1

-2

-3

-4

-5

-6

-7

-8

-9

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5 V

T = -40 C

T = 25 C

T = 125 C

-10

-11

-12

-10

-11

-12

1x10⁵

4.01x10⁷8.01x10⁷1.201x10⁸1.601x10⁸

Frequency (Hz)

2x10⁸

1x10⁵

4.01x10⁷8.01x10⁷1.201x10⁸1.601x10⁸

Frequency (Hz)

2x10⁸

D005

D006

Figure 5. Insertion Loss vs Frequency for Varying V_CC

Figure 6. Insertion Loss vs Frequency for Varying

Temperature

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

Typical Characteristics (continued)

-8

-16

-24

-32

-40

-48

-56

-64

-72

-80

-16

-24

-32

-40

-48

-56

-64

-72

-80

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5 V

T = -40 C

T = 25 C

T = 125 C

1x10⁵

4.01x10⁷8.01x10⁷1.201x10⁸1.601x10⁸

Frequency (Hz)

2x10⁸

1x10⁵

4.01x10⁷8.01x10⁷1.201x10⁸1.601x10⁸

Frequency (Hz)

2x10⁸

D007

D008

Figure 7. Off Isolation vs Frequency for Varying V_CC

Figure 8. Off Isolation vs Frequency for Varying

Temperature

-10

-20

-45

-30

-40

-50

-60

-70

-80

-90

-95

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5 V

T = -40 C

T = 25 C

T = 125 C

-100

-110

-120

100000

2.01E+7

4.01E+7

6.01E+7

8.01E+7

1E+8

1x10⁵

4.01x10⁷8.01x10⁷1.201x10⁸1.601x10⁸

Frequency (Hz)

2x10⁸

Frequency (Hz)

D009

D010

Figure 9. Crosstalk vs Frequency for Varying V_CC

Figure 10. Crosstalk vs Frequency (V_CC= 3.3 V)

500

400

300

200

100

0.009

0.008

0.007

0.006

0.005

0.004

0.003

0.002

0.001

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5 V

V_CC= 2.5 V

V_CC= 3.3 V

V_CC= 5.5 V

-100

-200

5x10⁰

6.005x10³

1.2005x10⁴

1.8005x10⁴

0.5

1.5

2.5

3.5

4.5

Frequency (Hz)

Voltage (V)

D012

D011

Figure 12. Total Harmonic Distortion vs Frequency

Figure 11. Charge Injection vs Voltage V_COM

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

Typical Characteristics (continued)

2.25E-8

2E-8

1.75E-8

1.5E-8

1.25E-8

1E-8

7.5E-9

5E-9

2.5E-9

-2.5E-9

0.5

1.5

2.5

3.5

4.5

5.5

Voltage (V)

D001

T = 25°C

V_NCand V_NO= Floating

V_COMand V_IN= GND

Figure 13. Power-Supply Current vs Voltage

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

7 Parameter Measurement Information

V_CC

ꢀ

Figure 14. On-State Resistance (R_on)

V_CC

Off-State leakage current

Channel Off

V_I= V_IHor V_IL

Figure 15. Off-State Leakage Current (I_COM(OFF), I_NO(OFF)

)

V_CC

On-state leakage current

Channel On

V_I= V_IHor V_IL

Figure 16. On-State Leakage Current

(I_COM(ON), I_NO(ON)

)

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

Parameter Measurement Information (continued)

V_CC

/ꢀpꢀcitꢀnce

aeter

V_BIAS= V_CCor GND and

V_I= V_IHor V_IL

Capacitance is measured at NO,

COM, and IN inputs during ON

and OFF conditions.

/ha

.L!{

Figure 17. Capacitance

(C_I, C_COM(OFF), C_COM(ON), C_NO(OFF), C_NO(ON)

)

V_CC

V_COM

V_CC

TEST

300 ꢀ

35 pF

V_CC

OFF

Logic

Input

(V_I)

V_CC

OFF

90%

Switch

Output(

V_NO

)

A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r< 5 ns,

t_f< 5 ns.

B. C_Lincludes probe and jig capacitance.

Figure 18. Turnon (t_ON) and Turnoff time (t_OFF

)

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

Parameter Measurement Information (continued)

V_CC

V_NC

V_NO

V_CC

R_PU

V_CC

NC or NO

V_OH

10%

V_NCor V_NO= GND

R_L= 1 kꢀ

R_PU= 100 ꢀ

C_L= 35 pF

A. C_Lincludes probe and jig capacitance.

B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r< 5 ns,

t_f< 5 ns.

Figure 19. Break-Before-Make Time (t_BBM

)

V_CC

Channel ON:NO to COM

V_I= V_IHor V_IL

50 ꢀ

Network Analyzer Setup

Source power = 0 dBm

(632-mV P-P at 50 ꢀ load)

DC Bias=350 mV

50 ꢀ

Figure 20. Bandwidth (BW)

V_CC

Channel OFF: NO to COM

V_I= V_IHor V_IL

50 ꢀ

NetworkAnalyzerSetup

Source power = 0 dBm

(632-mV P-P at 50 Ω load)

DC bias = 350 mVꢀ

50 ꢀ

Figure 21. Off Isolation (O_ISO

)

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

Parameter Measurement Information (continued)

V_CC

Channel ON: NC to COM

V_NC

50 Ω

NCNO

Channel OFF: NO to COM

V_I= V_IHor V_IL

V_NO

NetworkAnalyzerSetup

50 Ω

Source power = 0 dBm

(632-mV P-P at 50 ꢀ load)

DC bias = 350 mV

50 Ω

Figure 22. Crosstalk (X_TALK

)

V_CC

x û

A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z_O= 50 Ω, t_r< 5 ns,

t_f< 5 ns.

B. C_Lincludes probe and jig capacitance.

Figure 23. Charge Injection (Q_C)

Channel ON: COM to NO

V_SOURCE= 0.5 V P-P

V_I= V_IHor V_IL

f_SOURCE= 20 Hz to 20 kHz C_L= 35 pF

R_L= 600 Ω

V_CC

Audio Analyzer

600 ꢀ

COM

600 ꢀ

A. C_Lincludes probe and jig capacitance.

Figure 24. Total Harmonic Distortion (THD)

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

8 Detailed Description

8.1 Overview

The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3-

V to 5.5-V power supply. The device features negative signal swing capability that allows signals below ground to

pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch,

which automatically discharges any capacitance at the NC or NO terminals when they are not connected to

COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-

make feature prevents signal distortion during the transferring of a signal from one path to another. Low On-state

resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion

(THD) performance are ideal for audio applications.

8.2 Functional Block Diagram

TS5A22364-Q1

OUT+

OUT-

NC1

NO1

Audio

Source 1

COM1

IN1

Input Select

8-ꢀ

Speaker

Shunt

Switch

IN2

NC2

NO2

COM2

OUT+

OUT-

Audio

Source 2

8.3 Feature Description

8.3.1 Click-and-Pop Reduction

The 50-Ω shunt switches on the TS5A22364-Q1 automatically discharge any capacitance at the NC or NO

terminals when they are not connected to COM. This reduces the audible click-and-pop sounds that occur when

switching between audio sources. Audible clicks and pops are caused when a step DC voltage is switched into

the speaker. By automatically discharging the side that is not connected, any residual DC voltage is removed,

thereby reducing the clicks and pops.

8.4 Device Functional Modes

Table 1 shows the function table for the TS5A22364-Q1.

Table 1. Function Table

NC TO COM,

COM TO NC

NO TO COM,

COM TO NO

OFF

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

9.1.1 Negative Signal Swing Capability

The TS5A22364-Q1 dual SPDT switches feature negative signal capability that allows signals below ground to

pass through without distortion. These analog switches operate from a single 2.3-V to 5.5-V supply. The input

and output signal swing of the device is dependant on the supply voltage V_CC: the device can pass signals as

high as V_CCand as low as V_CC– 5.5 V, including signals below ground with minimal distortion. The Off state

signal path (either NC or NO) during the operation of the TS5A22364-Q1 cannot handle negative DC voltage.

Table 2 shows the input-output signal swing the user can get with different supply voltages.

Table 2. Input-Output Signal Swing

MINIMUM

(V_NC, V_NO, V_COM) =

V_CC– 5.5

MAXIMUM

MINIMUM

MAXIMUM

SUPPLY

VOLTAGE,

VCC

(V_NC, V_NO, V_COM) = (V_NC, V_NO, V_COM) = (V_NC, V_NO, V_COM) =

V_CC

V_CC– 5.5

V_CC

ON State signal path

OFF state signal path

5.5 V

4.2 V

3.3 V

3 V

0 V

5.5 V

4.2 V

3.3 V

3 V

0 V

5.5 V

4.2 V

3.3 V

3 V

–1.3 V

–2.2 V

–2.5 V

–3 V

2.5 V

9.2 Typical Application

The 50-Ω shunt switches on the TS5A22364-Q1 automatically discharge any capacitance at the NC or NO

terminals when they are unconnected to COM. This reduces audible click-and-pop sounds that occur when

switching between audio sources. Audible clicks and pops are caused when a step DC voltage is switched into

the speaker. By automatically discharging the side that is not connected, any residual DC voltage is removed,

thereby reducing the clicks and pops. See Figure 25.

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

Typical Application (continued)

TS5A22364-Q1

OUT+

NC1

NO1

Audio

OUT-

Source 1

COM1

IN1

Input Select

8-ꢀ

Speaker

Shunt

Switch

IN2

NC2

NO2

COM2

OUT+

OUT-

Audio

Source 2

Figure 25. Shunt Switch Block Diagram

9.2.1 Design Requirements

Tie the digitally controlled input select pins IN1 and IN2 to V_CCor GND to avoid unwanted switch states that

could result if the logic control pins are left floating.

9.2.2 Detailed Design Procedure

Select the appropriate supply voltage to cover the entire voltage swing of the signal passing through the switch

because the TS5A22364-Q1 operates from a single 2.3-V to 5.5-V supply and the input-output signal swing of

the device is dependant of the supply voltage V_CC. The device passes signals as high as V_CCand as low as

V_CC– 5.5 V. Use Table 2 as a guide for selecting supply voltage based on the signal passing through the switch.

Limit the current through the shunt resistor so as not to exceed the ±20 mA.

Ensure that the device is powered up with a supply voltage on VCC before a voltage can be applied to the signal

paths NC and NO.

9.2.3 Application Curve

1.1

V_CC= 2.3 V

V_CC= 3 V

V_CC= 4.5 V

0.9

0.8

0.7

0.6

0.5

0.4

0.3

-3.5

-2.5

-1.5

-0.5

0.5

1.5

2.5

3.5

4.5

Voltage V_COM(V)

D001

Figure 26. On-Resistance vs Voltage V_COM

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

10 Power Supply Recommendations

The TS5A22364-Q1 operates from a single 2.3-V to 5.5-V supply. The device must be powered up with a supply

voltage on VCC before a voltage can be applied to the signal paths NC and NO. It is recommended to include a

100 μs delay after VCC is at voltage before applying a signal on NC and NO paths.

It is also good practice to place a 0.1-μF bypass capacitor on the supply pin VCC to GND to smooth out lower

frequency noise to provide better load regulation across the frequency spectrum.

TS5A22364-Q1

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

www.ti.com.cn

11 Layout

11.1 Layout Guidelines

It is recommended to place a bypass capacitor as close to the supply pin VCC as possible to help smooth out

lower frequency noise to provide better load regulation across the frequency spectrum.

Minimize trace lengths and vias on the signal paths in order to preserve signal integrity.

11.2 Layout Example

LEGEND

Polygonal Copper Pour

VIA to Power Plane

VIA to GND

Bypass Capacitor

VCC

To System

VCC

NO2

COM2

NC2

To System

NO1

To System

COM1

IN2

NC1

IN1

GND

Figure 27. Layout Example of TS5A22364-Q1

TS5A22364-Q1

www.ti.com.cn

ZHCSF59A –OCTOBER 2014–REVISED JULY 2016

12 器件和文档支持

12.1 接收文档更新通知

如需接收文档更新通知，请访问 ti.com 上的器件产品文件夹。点击右上角的提醒我 (Alert me) 注册后，即可每周定

期收到已更改的产品信息。有关更改的详细信息，请查阅已修订文档中包含的修订历史记录。

12.2 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.3 商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 静电放电警告

这些装置包含有限的内置 ESD 保护。存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损

伤。

13 机械、封装和可订购信息

以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对

本文档进行修订的情况下发生改变。要获得这份数据表的浏览器版本，请查阅左侧的导航栏。

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IMPORTANT NOTICE

邮寄地址：上海市浦东新区世纪大道1568 号，中建大厦32 楼邮政编码： 200122

PACKAGE OPTION ADDENDUM

www.ti.com

10-Dec-2020

PACKAGING INFORMATION

Orderable Device

Status Package Type Package Pins Package

Eco Plan

Lead finish/

Ball material

MSL Peak Temp

Op Temp (°C)

Device Marking

Samples

Drawing

Qty

(1)

(2)

(3)

(4/5)

(6)

TS5A22364QDGSRQ1

ACTIVE

VSSOP

DGS

2500 RoHS & Green

NIPDAUAG

Level-2-260C-1 YEAR

-40 to 125

SJN

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

⁽³⁾MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

⁽⁵⁾Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6)

Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Jul-2020

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

TS5A22364QDGSRQ1 VSSOP

DGS

2500

330.0

12.4

5.3

3.4

1.4

8.0

12.0

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

17-Jul-2020

*All dimensions are nominal

Device

Package Type Package Drawing Pins

VSSOP DGS 10

SPQ

Length (mm) Width (mm) Height (mm)

366.0 364.0 50.0

TS5A22364QDGSRQ1

2500

Pack Materials-Page 2

PACKAGE OUTLINE

DGS0010A

VSSOP - 1.1 mm max height

SMALL OUTLINE PACKAGE

SEATING PLANE

0.1 C

5.05

4.75

TYP

PIN 1 ID

AREA

8X 0.5

3.1

2.9

NOTE 3

0.27

0.17

10X

3.1

2.9

1.1 MAX

0.1

C A

NOTE 4

0.23

0.13

TYP

SEE DETAIL A

0.25

GAGE PLANE

0.15

0.05

0.7

0.4

0 - 8

DETAIL A

TYPICAL

4221984/A 05/2015

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not

exceed 0.15 mm per side.

4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.

5. Reference JEDEC registration MO-187, variation BA.

www.ti.com

EXAMPLE BOARD LAYOUT

DGS0010A

VSSOP - 1.1 mm max height

SMALL OUTLINE PACKAGE

10X (1.45)

(R0.05)

TYP

SYMM

10X (0.3)

SYMM

8X (0.5)

(4.4)

LAND PATTERN EXAMPLE

SCALE:10X

SOLDER MASK

OPENING

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

METAL

0.05 MAX

ALL AROUND

0.05 MIN

ALL AROUND

SOLDER MASK

DEFINED

NON SOLDER MASK

DEFINED

SOLDER MASK DETAILS

NOT TO SCALE

4221984/A 05/2015

NOTES: (continued)

6. Publication IPC-7351 may have alternate designs.

7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.

www.ti.com

EXAMPLE STENCIL DESIGN

DGS0010A

VSSOP - 1.1 mm max height

SMALL OUTLINE PACKAGE

10X (1.45)

SYMM

(R0.05) TYP

10X (0.3)

8X (0.5)

SYMM

(4.4)

SOLDER PASTE EXAMPLE

BASED ON 0.125 mm THICK STENCIL

SCALE:10X

4221984/A 05/2015

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate

design recommendations.

9. Board assembly site may have different recommendations for stencil design.

www.ti.com

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TS5A22364QDGSRQ1 [TI]

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