TS5A3159A_14 [TI]
1-Ω SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER;
| 型号： | TS5A3159A_14 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 1-Ω SPDT ANALOG SWITCH 5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER 光电二极管 |
| 文件： | 总30页 (文件大小：695K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
1-Ω SPDT ANALOG SWITCH
5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
Check for Samples: TS5A3159A
1
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
Cell Phones
PDAs
•
•
•
•
•
•
•
•
•
•
Isolation in Power-Down Mode, V+ = 0
Pin Compatible With TS5A3159
Portable Instrumentation
Audio and Video Signal Routing
Low-Voltage Data Acquisition Systems
Communication Circuits
Modems
Hard Drives
Computer Peripherals
Wireless Terminals and Peripherals
Specified Break-Before-Make Switching
Low On-State Resistance (1 Ω)
Control Inputs Are 5.5-V Tolerant
Low Charge Injection
Excellent On-State Resistance Matching
Low Total Harmonic Distortion (THD)
1.65-V to 5.5-V Single-Supply Operation
Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II
•
ESD Performance Tested Per JESD
–
2000-V Human-Body Model
(A114-B, Class II)
–
1000-V Charged-Device Model (C101)
DESCRIPTION
The TS5A3159A is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers low on-state resistance and excellent on-state resistance matching with the
break-before-make feature, to prevent signal distortion during the transferring of a signal from one channel to
another. The device has an excellent total harmonic distortion (THD) performance and consumes very low
power. These features make this device suitable for portable audio applications.
DBV OR DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
C1
B1
A1
C2
B2
A2
NC
GND
NO
3 4
2 5
1 6
COM
V+
NO
GND
NC
1
2
3
6
5
4
IN
V+
IN
COM
NO – Normally open
NC – Normally closed
FUNCTION TABLE
NC TO COM,
COM TO NC
NO TO COM,
COM TO NO
IN
L
ON
OFF
ON
H
OFF
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005–2010, Texas Instruments Incorporated
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
SUMMARY OF CHARACTERISTICS(1)
2:1 Multiplexer/
Demultiplexer
(1 × SPDT)
Configuration
Number of channels
On-state resistance (ron
On-state resistance match (Δron
On-state resistance flatness (ron(flat)
Turn-on/turn-off time (tON/tOFF
1
1.1 Ω
)
)
0.1 Ω
)
0.15 Ω
)
20 ns/15 ns
12 ns
Break-before-make time (tBBM
Charge injection (QC)
Bandwidth (BW)
)
–20 pC
100 MHz
OFF isolation (OISO
Crosstalk (XTALK
)
–65 dB at 1 MHz
–66 dB at 1 MHz
0.01%
)
Total harmonic distortion (THD)
Leakage current (INO(OFF)/INC(OFF)
Power-supply current (I+)
Package options
)
±20 nA
50 nA
6-pin DBV, DCK, or YZP
(1) V+ = 5 V, TA = 25°C
ORDERING INFORMATION(1)
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING(3)
TA
PACKAGE(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000
TS5A3159AYZPR
_ _ _JJ_
–40°C to 85°C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK(3)
Reel of 3000
Reel of 3000
TS5A3159ADBVR
TS5A3159ADCKR
JAJ_
JJ_
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
2
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
Absolute Minimum and Maximum Ratings(1) (2)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V+
Supply voltage range(3)
–0.5
6.5
V
VNO
VNC
,
Analog voltage range(3) (4) (5)
–0.5 V+ + 0.5
–50
V
VCOM
IK
IN O
IN C
ICOM
VI
Analog port diode current
On-state switch current
VN C, VNO, VCOM < 0
mA
mA
,
VNO, VN C, VCOM = 0 to V+
VNO, VN C, VCOM = 0 to V+
–200
200
,
On-state peak switch current(6)
Digital input voltage range(3) (4)
Digital input clamp current
–400
–0.5
–50
400
6.5
mA
V
IIK
VI < 0
mA
mA
mA
I+
Continuous current through V+
Continuous current through GND
100
100
165
259
123
150
125
150
IGND
–100
DBV package
qJA
Package thermal impedance(7)
DCK package
°C/W
YZP package
DBV or DCK package
YZP package
TA
Absolute maximum operating temperature(8)
Storage temperature range
°C
°C
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
(3) All voltages are with respect to ground, unless otherwise specified.
(4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(5) This value is limited to 5.5 V maximum.
(6) Pulse at 1-ms duration <10% duty cycle
(7) The package thermal impedance is calculated in accordance with JESD 51-7.
(8) The lifetime of the device will be reduced if the device operates continually at this temperature.
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
Electrical Characteristics for 5-V Supply(1)
V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
Analog signal
range
VCOM, VNO
VNC
,
0
V+
V
25°C
Full
0.8
0.7
1.1
1.5
0.9
1.1
0.1
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –100 mA,
Switch on,
See Figure 15
Peak on resistance
rpeak
4.5 V
4.5 V
Ω
25°C
Full
On-state
resistance
VNO or VNC = 2.5 V,
ICOM = –100 mA,
Switch on,
See Figure 15
ron
Ω
Ω
On-state
resistance match
between channels
25°C
0.05
VNO or VNC = 2.5 V,
ICOM = –100 mA,
Switch on,
See Figure 15
Δron
4.5 V
4.5 V
Full
0.1
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –100 mA,
Switch on,
See Figure 15
25°C
0.15
On-state
resistance flatness
ron(flat)
Ω
25°C
Full
0.1 0.25
0.25
VNO or VNC = 1 V, 1.5 V, 2.5 V,
ICOM = –100 mA,
Switch on,
See Figure 15
VNC or VNO = 1 V, VCOM = 1 V to 4.5 V,
or
VNC or VNO = 4.5 V, VCOM = 1 V to 4.5 V,
25°C
–20
2
20
INC(OFF)
INO(OFF)
,
Switch off,
See Figure 16
5.5 V
0 V
nA
mA
nA
mA
nA
Full
–100
100
NC, NO
off leakage current
25°C
Full
–1
–20
–20
0.2
2
1
20
20
INC(PWROFF)
,
VNC or VNO = 0 to 5.5 V,
INO(PWROFF) VCOM = 5.5 V to 0,
Switch off,
See Figure 16
VNC or VNO = 1 V, VCOM = Open,
or
VNC or VNO = 4.5 V, VCOM = Open,
25°C
NC, NO
on leakage current
INC(ON)
,
Switch on,
See Figure 17
5.5 V
0 V
INO(ON)
Full
–100
100
25°
Full
–1
–20
–20
0.1
2
1
20
20
COM
off leakage current
VNC or VNO = 0 to 5.5 V,
VCOM = 5.5 V to 0,
Switch off,
See Figure 16
ICOM(PWROFF)
VNC or VNO = Open, VCOM = 1 V,
or
VNC or VNO = Open, VCOM = 4.5 V,
25°C
COM
on leakage current
Switch on,
See Figure 17
ICOM(ON)
5.5 V
Full
–100
100
Digital Input (IN)
Input logic high
Input logic low
VIH
VIL
Full
Full
2.4
0
5.5
0.8
2
V
25°C 5.5 V
Full
–2
Input leakage
current
IIH, IIL
VI = 5.5 V or 0
nA
100
100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
4
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
Electrical Characteristics for 5-V Supply(1) (Continued)
V+ = 4.5 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Dynamic
SYMBOL
TEST CONDITIONS
TA
V+
MIN
TYP MAX UNIT
25°C
Full
5 V
1
1
1
1
12
5
30
35
20
30
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
Turn-off time
tON
ns
ns
ns
4.5 V to
5.5 V
25°C
Full
5 V
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
tOFF
4.5 V to
5.5 V
25°C
Full
5 V
6
Break-before-make
time
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
tBBM
4.5 V to
5.5 V
1
20
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 24
Charge injection
QC
CNC (OFF)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
5 V
5 V
5 V
5 V
5 V
5 V
5 V
5 V
5 V
–20
18
pC
pF
NC, NO
off capacitance
,
VNC or VNO = V+ or GND,
Switch off,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
See Figure 21
CNO(OFF)
NC, NO
on capacitance
CNC(ON)
,
VNC or VNO = V+ or GND,
Switch on,
55
pF
CNO(ON)
COM
on capacitance
VCOM = V+ or GND,
Switch on,
CCOM(ON)
CI
55
pF
Digital input
capacitance
VI = V+ or GND,
2
pF
RL = 50 Ω,
Switch on,
Bandwidth
Off isolation
Crosstalk
BW
100
–64
–64
0.004
MHz
dB
dB
%
RL = 50 Ω,
f = 1 MHz,
Switch off,
See Figure 22
OISO
XTALK
THD
RL = 50 Ω,
f = 1 MHz,
Switch on,
See Figure 23
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 200 Hz to 20 kHz,
See Figure 25
Supply
25°C
Full
10
50
Positive supply
current
I+
VI = V+ or GND,
Switch on or off
5.5 V
nA
500
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
Electrical Characteristics for 3.3-V Supply(1)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
Analog signal
range
VCOM, VNO
VNC
,
0
V+
V
25°C
Full
1.3
1.2
1.6
2
Peak on
resistance
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –100 mA,
Switch on,
See Figure 15
rpeak
3 V
3 V
Ω
25°C
Full
1.5
1.7
On-state
resistance
VNO or VNC = 2 V,
ICOM = –100 mA,
Switch on,
See Figure 15
ron
Ω
Ω
On-state
resistance match
between
25°C
0.1 0.15
VNO or VNC = 2 V, 0.8 V,
ICOM = –100 mA,
Switch on,
See Figure 15
Δron
3 V
3 V
Full
0.15
channels
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –100 mA,
Switch on,
See Figure 15
25°C
0.2
On-state
resistance
flatness
ron(flat)
Ω
25°C
Full
0.15
0.3
0.3
20
VNO or VNC = 2 V, 0.8 V,
ICOM = –100 mA,
Switch on,
See Figure 15
VNC or VNO = 1 V, VCOM = 1 V to 3 V,
or
VNC or VNO = 3 V, VCOM = 1 V to 3 V,
25°C
–20
–50
2
INC(OFF)
INO(OFF)
,
Switch off,
See Figure 16
3.6 V
0 V
nA
mA
nA
NC, NO
off leakage
current
Full
50
25°C
Full
–1
–15
–10
0.2
2
1
15
10
INC(PWROFF)
INO(PWROFF)
,
VNC or VNO = 0 to 3.6 V,
VCOM = 3.6 V to 0,
Switch off,
See Figure 16
NC, NO
on leakage
current
VNC or VNO = 1 V, VCOM = Open,
or
VNC or VNO = 3 V, VCOM = Open,
25°C
INC(ON)
INO(ON)
,
Switch on,
See Figure 17
3.6 V
Full
25°
–20
–1
20
1
COM
off leakage
current
0.2
2
VNC or VNO = 3.6 V to 0,
VCOM = 0 to 3.6 V,
Switch off,
See Figure 16
ICOM(PWROFF)
0 V
mA
Full
–15
–10
–20
15
10
20
COM
on leakage
current
VNC or VNO = Open, VCOM = 1 V,
or
VNC or VNO = Open, VCOM = 3 V,
25°C
Full
Switch on,
See Figure 17
ICOM(ON)
3.6 V
nA
Digital Input (IN)
Input logic high
Input logic low
VIH
VIL
Full
Full
2.4
0
5.5
0.8
2
V
25°C
Full
–2
Input leakage
current
IIH, IIL
VI = 5.5 V or 0
3.6 V
nA
–100
100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
6
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
Electrical Characteristics for 3.3-V Supply(1) (Continued)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Dynamic
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
25°C 3.3 V
5
3
1
1
16
9
35
50
20
30
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
Turn-off time
tON
ns
ns
ns
3 V to
Full
3.6 V
25°C 3.3 V
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
tOFF
3 V to
Full
3.6 V
25°C 3.3 V
9
Break-before-make
time
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
tBBM
3 V to
Full
1
40
3.6 V
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 24
Charge injection
QC
CNC (OFF)
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
25°C 3.3 V
–11
18
pC
pF
NC, NO
off capacitance
,
VNC or VNO = V+ or GND,
Switch off,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
See Figure 21
CNO(OFF)
NC, NO
on capacitance
CNC(ON)
,
VNC or VNO = V+ or GND,
Switch on,
55
pF
CNO(ON)
COM
on capacitance
VCOM = V+ or GND,
Switch on,
CCOM(ON)
CI
55
pF
Digital input
capacitance
VI = V+ or GND,
2
pF
RL = 50 Ω,
Switch on,
Bandwidth
Off isolation
Crosstalk
BW
100
–64
–64
0.01
MHz
dB
dB
%
RL = 50 Ω,
f = 1 MHz,
Switch off,
See Figure 22
OISO
XTALK
THD
RL = 50 Ω,
f = 1 MHz,
Switch on,
See Figure 23
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
Supply
25°C
3.6 V
Full
10
25
Positive supply
current
I+
VI = V+ or GND,
Switch on or off
nA
100
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
Electrical Characteristics for 2.5-V Supply(1)
V+ = 2.3 V to 2.7, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
Analog signal
range
VCOM, VNO
VNC
,
0
V+
V
25°C
Full
1.8
1.5
2.5
2.7
2
Peak on
resistance
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –8 mA,
Switch on,
See Figure 15
rpeak
2.3 V
2.3 V
Ω
25°C
Full
On-state
resistance
VNO or VNC = 1.8 V,
ICOM = –8 mA,
Switch on,
See Figure 15
ron
Ω
Ω
2.4
0.2
On-state
resistance match
between
25°C
0.15
VNO or VNC = 1.8 V,
ICOM = –8 mA,
Switch on,
See Figure 15
Δron
2.3 V
2.3 V
Full
0.2
channels
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –8 mA,
Switch on,
See Figure 15
25°C
0.6
0.6
On-state
resistance
flatness
ron(flat)
Ω
25°C
Full
1
1
VNO or VNC = 0.8 V, 1.8 V,
ICOM = –8 mA,
Switch on,
See Figure 15
VNC or VNO = 0.5 V, VCOM = 0.5 V to 2.3 V,
or
VNC or VNO = 2.3 V, VCOM = 0.5 V to 2.3 V,
25°C
–20
–50
2
20
INC(OFF)
INO(OFF)
,
Switch off,
See Figure 16
2.7 V
0 V
nA
mA
nA
NC, NO
off leakage
current
Full
50
25°C
Full
–1
–10
–10
0.1
2
1
10
10
INC(PWROFF)
INO(PWROFF)
,
VNC or VNO = 0 to 3.6 V,
VCOM = 3.6 V to 0,
Switch off,
See Figure 16
NC, NO
on leakage
current
VNC or VNO = 0.5 V, VCOM = Open,
or
VNC or VNO = 2.2 V, VCOM = Open,
25°C
INC(ON)
,
Switch on,
See Figure 17
2.7 V
INO(ON)
Full
25°
–20
–1
20
10
20
10
20
COM
0.1
2
VNC or VNO = 2.7 V to 0,
VCOM = 0 to 2.7 V,
Switch off,
See Figure 16
off leakage
current
ICOM(PWROFF)
0 V
mA
Full
–10
–10
–20
COM
VNC or VNO = Open, VCOM = 0.5 V,
or
VNC or VNO = Open, VCOM = 2.2 V,
25°C
Full
Switch on,
See Figure 17
on leakage
current
ICOM(ON)
2.7 V
nA
Digital Input (IN)
Input logic high
Input logic low
VIH
VIL
Full
Full
1.8
0
5.5
0.6
2
V
25°C
Full
–2
20
Input leakage
current
IIH, IIL
VI = 5.5 V or 0
2.7 V
nA
20
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
8
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
Electrical Characteristics for 2.5-V Supply(1) (Continued)
V+ = 2.3 V to 2.7, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Dynamic
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
25°C 2.5 V
5
5
2
2
2
2
22
6
40
50
35
50
35
45
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
Turn-off time
tON
ns
ns
ns
2.3 V to
Full
2.7 V
25°C 2.5 V
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
tOFF
2.3 V to
Full
2.7 V
25°C 2.5 V
13
Break-before-make
time
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
tBBM
2.3 V to
Full
2.7 V
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 24
Charge injection
QC
CNC (OFF)
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
25°C 2.5 V
–7
18
pC
pF
NC, NO
off capacitance
,
VNC or VNO = V+ or GND,
Switch off,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
See Figure 21
CNO(OFF)
NC, NO
on capacitance
CNC(ON)
,
VNC or VNO = V+ or GND,
Switch on,
55
pF
CNO(ON)
COM
on capacitance
VCOM = V+ or GND,
Switch on,
CCOM(ON)
CI
55
pF
Digital input
capacitance
VI = V+ or GND,
2
pF
RL = 50 Ω,
Switch on,
Bandwidth
Off isolation
Crosstalk
BW
100
–64
–64
0.02
MHz
dB
dB
%
RL = 50 Ω,
f = 1 MHz,
Switch off,
See Figure 22
OISO
XTALK
THD
RL = 50 Ω,
f = 1 MHz,
Switch on,
See Figure 23
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
Supply
25°C
2.7 V
Full
10
20
50
Positive supply
current
I+
VI = V+ or GND,
Switch on or off
nA
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
9
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
3
2.5
2
Vt+
Vt-
1.5
1
0.5
0
2.3
2.7
3
3.6
4.5
5.5
Power Supply – V
Figure 1. Logic Threshold vs Power Supply
10
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
Electrical Characteristics for 1.8-V Supply(1)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Analog Switch
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
Analog signal
range
VCOM, VNO
VNC
,
0
V+
V
25°C
Full
5
2
Peak on
resistance
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –2 mA,
Switch on,
See Figure 15
rpeak
1.65 V
1.65 V
Ω
15
2.5
3.5
0.4
25°C
Full
On-state
resistance
VNO or VNC = 1.5 V,
ICOM = –2 mA,
Switch on,
See Figure 15
ron
Ω
Ω
On-state
resistance match
between
25°C
0.15
VNO or VNC = 1.5 V,
ICOM = –2 mA,
Switch on,
See Figure 15
Δron
1.65 V
1.65 V
Full
0.4
channels
0 ≤ (VNO or VNC) ≤ V+,
ICOM = –8 mA,
Switch on,
See Figure 15
25°C
5
On-state
resistance
flatness
ron(flat)
Ω
25°C
Full
4.5
VNO or VNC = 0.6 V, 1.5 V,
ICOM = –2 mA,
Switch on,
See Figure 15
VNC or VNO = 0.3 V,
VCOM = 0.3 V to 1.65 V,
or
VNC or VNO = 1.65 V,
VCOM = 0.3 V to 1.65 V,
25°C
–5
2
5
INC(OFF)
INO(OFF)
,
Switch off,
See Figure 16
1.95 V
nA
NC, NO
off leakage
current
Full
–20
20
25°C
Full
–1
–5
–5
0.1
2
1
5
5
INC(PWROFF)
INO(PWROFF)
VNC or VNO = 0 to 1.95 V,
VCOM = 1.95 V to 0,
Switch off,
See Figure 16
0 V
mA
NC, NO
on leakage
current
VNC or VNO = 0.3 V, VCOM = Open,
or
VNC or VNO = 1.65 V, VCOM = Open,
25°C
INC(ON)
,
Switch on,
See Figure 17
1.95 V
nA
INO(ON)
Full
25°
–20
–1
20
7
COM
off leakage
current
0.1
2
VNC or VNO = 1.95 V to 0,
VCOM = 0 to 1.95 V,
Switch off,
See Figure 16
ICOM(PWROFF)
0 V
mA
Full
–5
5
COM
on leakage
current
VNC or VNO = Open, VCOM = 0.3 V,
or
VNC or VNO = Open, VCOM = 1.65 V,
25°C
Full
–5
5
Switch on,
See Figure 17
ICOM(ON)
1.95 V
nA
–20
20
Digital Input (IN)
Input logic high
Input logic low
VIH
VIL
Full
Full
1.5
0
5.5
0.6
2
V
25°C
Full
–2
20
Input leakage
current
IIH, IIL
VI = 5.5 V or 0
1.95 V
nA
20
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
11
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
Electrical Characteristics for 1.8-V Supply(1) (Continued)
V+ = 1.65 V to 1.95 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
Dynamic
SYMBOL
TEST CONDITIONS
TA
V+
MIN TYP MAX UNIT
25°C
Full
1.8 V
10
10
2
35
15
22
70
75
40
50
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
Turn-on time
Turn-off time
tON
ns
ns
ns
1.65 V to
1.95 V
25°C
Full
1.8 V
VCOM = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 19
tOFF
1.65 V to
1.95 V
2
25°C
Full
1.8 V
Break-before-make
time
VNC = VNO = V+,
RL = 50 Ω,
CL = 35 pF,
See Figure 20
tBBM
1.65 V to
1.95 V
2
70
VGEN = 0,
RGEN = 0,
CL = 1 nF,
See Figure 24
Charge injection
QC
CNC (OFF)
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
25°C
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
1.8 V
–4
18
pC
pF
NC, NO
off capacitance
,
VNC or VNO = V+ or GND,
CNO(OFF) Switch off,
See Figure 18
See Figure 18
See Figure 18
See Figure 18
See Figure 21
NC, NO
on capacitance
CNC(ON)
,
VNC or VNO = V+ or GND,
Switch on,
55
pF
CNO(ON)
COM
on capacitance
VCOM = V+ or GND,
Switch on,
CCOM(ON)
55
pF
Digital input
capacitance
CI
VI = V+ or GND,
2
pF
RL = 50 Ω,
Switch on,
Bandwidth
Off isolation
Crosstalk
BW
105
64
MHz
dB
dB
%
RL = 50 Ω,
f = 1 MHz,
Switch off,
See Figure 22
OISO
XTALK
THD
RL = 50 Ω,
f = 1 MHz,
Switch on,
See Figure 23
64
Total harmonic
distortion
RL = 600 Ω,
CL = 50 pF,
f = 20 Hz to 20 kHz,
See Figure 25
0.06
Supply
25°C
Full
5
15
50
Positive supply
current
I+
VI = V+ or GND,
Switch on or off
1.95 V
mA
(1) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
12
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
TYPICAL PERFORMANCE
3.50
3.00
2.50
2.00
1.50
1.00
0.50
0.00
T
= 85°C
= 25°C
= −40°C
1.5
A
V = 1.8 V
+
T
A
1.3
1.1
0.9
0.7
0.5
0.3
0.1
V = 2.5 V
+
T
A
V = 3.3 V
+
V = 5 V
+
0
1
2
3
4
0.0
0.5
1.0
(V)
1.5
2.0
V
COM
(V)
V
COM
Figure 2. ron vs VCOM
Figure 3. ron vs VCOM (V+ = 3.3 V)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
20
COM (on)
0
−20
−40
NO/NC (off)
T = 85°C
A
T = 25°C
A
NO/NC (on)
T = −40°C
A
0
1
2
3
4
5
6
−60 −40 −20
0
20
40
60
80
100
V
COM
(V)
Temperature (°C)
Figure 4. ron vs VCOM (V+ = 5 V)
Figure 5. Leakage Current vs Temperature
(V+ = 3.3 V)
3500
3000
2500
2000
1500
1000
500
70
60
COM (pwroff)
50
V = 5 V
+
V = 3 V
+
40
30
20
10
0
−10
−20
−30
NO/NC (pwroff)
0
0
1
2
3
4
5
6
−500
−60 −40 −20
0
20
40
60
80
100
Bias Voltage (V)
Temperature (°C)
Figure 6. Leakage Current vs Temperature
(V+ = 5 V)
Figure 7. Charge Injection vs Bias Voltage
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
13
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
TYPICAL PERFORMANCE (continued)
45
40
35
30
25
20
15
10
5
16
14
12
10
8
t
ON
t
OFF
t
OFF
6
t
ON
4
2
0
0
0
1
2
3
4
5
6
−40°C
25°C
(5C)
85°C
V
+
(V)
T
A
Figure 8. tON and tOFF vs Supply Voltage
Figure 9. I+ vs Temperature
0
2.5
2.0
1.5
1.0
0.5
0.0
V
IN
rising
−2
−4
V
falling
IN
−6
−8
−10
−12
−14
−40°C
25°C
T (5C)
85°C
0.1
1
10
100
1000
Frequency (MHz)
A
Figure 10. I+ vs Temperature
Figure 11. Bandwidth (V+ = 5 V)
0.010
0.009
0.008
0.007
0.006
0.005
0.004
0.003
0.002
0
−10
−20
−30
−40
−50
−60
−70
−80
−90
0.1
1
10
100
1000
0
Frequency (MHz)
10
100
1000
10000
100000
Frequency (Hz)
Figure 12. Attenuation vs Frequency
Figure 13. Total Harmonic Distortion vs Frequency
(V+ = 5 V)
14
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
TYPICAL PERFORMANCE (continued)
180
160
140
120
100
80
60
40
20
0
-20
-40°C
25°C
85°C
TA (°C)
Figure 14. Power-Supply Current vs Temperature
(V+ = 5 V)
PIN DESCRIPTION
NO.
NAME
DESCRIPTION
1
2
3
4
5
6
NO
Normally open
GND
NC
Digital ground
Normally closed
COM
V+
Common
Power supply
IN
Digital control to connect COM to NO
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
15
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
PARAMETER DESCRIPTION
SYMBOL
DESCRIPTION
VCOM
VNC
Voltage at COM
Voltage at NC
Voltage at NO
VNO
ron
Resistance between COM and NC or COM and NO ports when the channel is on
Peak on-state resistance over a specified voltage range
Difference of ron between channels
rpeak
Δron
ron(flat)
Difference between the maximum and minimum value of ron in a channel over the specified range of conditions
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the off state under
worst-case input and output conditions
INC(OFF)
INC(PWROFF)
INO(OFF)
Leakage current measured at the NC port during the power-down condition, V+ = 0
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the off state under
worst-case input and output conditions
INO(PWROFF)
INC(ON)
Leakage current measured at the NO port during the power-down condition, V+ = 0
Leakage current measured at the NC port, with the corresponding channel (NC to COM) in the on state and the
output (COM) being open
Leakage current measured at the NO port, with the corresponding channel (NO to COM) in the on state and the
output (COM) being open
INO(ON)
Leakage current measured at the COM port, with the corresponding channel (COM to NO or COM to NC) in the on
state and the output (NC or NO) being open
ICOM(ON)
ICOM(PWROFF)
Leakage current measured at the COM port during the power-down condition, V+ = 0
Minimum input voltage for logic high for the control input (IN)
Maximum input voltage for logic low for the control input (IN)
Voltage at (IN)
VIH
VIL
VI
IIH, IIL
Leakage current measured at (IN)
Turn-on time for the switch. This parameter is measured under the specified range of conditions and by the
propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning on.
tON
tOFF
tBBM
Turn-off time for the switch. This parameter is measured under the specified range of conditions and by the
propagation delay between the digital control (IN) signal and analog outputs (COM, NC, or NO) signal when the
switch is turning off.
Break-before-make time. This parameter is measured under the specified range of conditions and by the
propagation delay between the output of two adjacent analog channels (NC and NO) when the control signal
changes state.
Charge injection is a measurement of unwanted signal coupling from the control (IN) input to the analog (NC, NO,
or COM) output. This is measured in coulomb (C) and measured by the total charge induced due to switching of the
control input. Charge injection, QC = CL × ΔVO, CL is the load capacitance and ΔVO is the change in analog output
voltage.
QC
CNC(OFF)
CNO(OFF)
CNC(ON)
CNO(ON)
CCOM(ON)
CIN
Capacitance at the NC port when the corresponding channel (NC to COM) is off
Capacitance at the NO port when the corresponding channel (NO to COM) is off
Capacitance at the NC port when the corresponding channel (NC to COM) is on
Capacitance at the NO port when the corresponding channel (NO to COM) is on
Capacitance at the COM port when the corresponding channel (COM to NC or COM to NO) is on
Capacitance of (IN)
OFF isolation of the switch is a measurement off-state switch impedance. This is measured in dB in a specific
frequency, with the corresponding channel (NC to COM or NO to COM) in the off state.
OISO
Crosstalk is a measurement of unwanted signal coupling from an on channel to an off channel (NC to NO or NO to
NC). This is measured in a specific frequency and in dB.
XTALK
BW
Bandwidth of the switch. This is the frequency in which the gain of an on channel is –3 dB below the DC gain.
Total harmonic distortion describes the signal distortion caused by the analog switch. This is defined as the ratio or
root mean square (RMS) value of the second, third, and higher harmonic to the absolute magnitude of the
fundamental harmonic.
THD
I+
Static power supply current with the control (IN) pin at V+ or GND
16
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
PARAMETER MEASUREMENT INFORMATION
V
+
V
NC
NO
NC
COM
V
COM
+
Channel On
COM * VNO or VNC
W
V
NO
V
r
+
on
ICOM
IN
I
COM
V
I
V = V or V
IL
I
IH
+
GND
Figure 15. On-State Resistance (ron)
V
+
V
NC
NC
COM
V
COM
+
+
V
NO
NO
IN
Off-State Leakage Current
Channel Off
V = V or V
IL
I
IH
V
I
+
GND
Figure 16. OFF-State Leakage Current (INC(OFF), INC(PWROFF), INO(OFF), INO(PWROFF), ICOM(OFF), ICOM(PWROFF)
)
V
+
V
NC
NO
NC
COM
V
COM
+
V
NO
On-State Leakage Current
Channel On
V = V or V
IL
I
IH
IN
V
I
+
GND
Figure 17. On-State Leakage Current (ICOM(ON), INC(ON), INO(ON)
)
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
17
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
V
+
V
NC
NO
NC
Capacitance
Meter
V
BIAS
= V or GND
+
V
NO
V = V or GND
I
+
V
COM
IN
COM
Capacitance is measured at NC,
NO, COM, and IN inputs during
on and off conditions.
V
BIAS
V
I
GND
Figure 18. Capacitance (CI, CCOM(ON), CNC(OFF), CNO(OFF), CNC(ON), CNO(ON)
)
V
+
TEST
R
L
C
L
V
COM
V
NC
or V
NC or NO
NC or NO
NO
t
50 Ω
50 Ω
35 pF
35 pF
V
ON
+
+
COM
IN
V
COM
(2)
C
L
R
L
t
V
OFF
V
I
V
0
Logic
Input
(V )
I
+
(2)
C
L
R
L
50%
50%
Logic
GND
(1)
Input
t
ON
t
OFF
Switch
Output
90%
90%
(V or V
)
NO
NC
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Figure 19. Turn-On (tON) and Turn-Off Time (tOFF
)
18
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
V
+
V
Logic
Input
(V )
I
+
V
NC
or V
NO
50%
NC or NO
NC or NO
0
V
COM
COM
Switch
Output
90%
90%
(2)
C
R
L
L
(V
)
COM
IN
V
I
t
BBM
Logic
Input
V
or V = V
NO +
NC
(1)
GND
R = 50 Ω
L
C = 35 pF
L
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Figure 20. Break-Before-Make Time (tBBM
)
V
+
Network Analyzer
50 W
V
NC
NC
NO
Channel On: NC to COM
V = V or GND
V
COM
COM
I
+
Source
Signal
Network Analyzer Setup
IN
V
Source Power = 0 dBm
(632-mV P-P at 50-W load)
I
50 W
+
GND
DC Bias = 350 mV
Figure 21. Bandwidth (BW)
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
19
Product Folder Link(s): TS5A3159A
TS5A3159A
SCDS200C –AUGUST 2005–REVISED MAY 2010
www.ti.com
V
+
Network Analyzer
Channel Off: NC to COM
V = V or GND
50 W
V
NC
NC
I
+
V
COM
COM
Source
50 W
NO
IN
Signal
Network Analyzer Setup
Source Power = 0 dBm
V
I
(632-mV P-P at 50-W load)
50 W
+
GND
DC Bias = 350 mV
Figure 22. OFF Isolation (OISO)
V
+
Network Analyzer
Channel On: NC to COM
Channel Off: NO to COM
V = V or GND
50 W
V
V
NC
NC
V
COM
I
+
Source
Signal
NO
IN
NO
Network Analyzer Setup
50 W
V
I
50 W
Source Power = 0 dBm
(632-mV P-P at 50-W load)
+
GND
DC Bias = 350 mV
Figure 23. Crosstalk (XTALK
)
20
Submit Documentation Feedback
Copyright © 2005–2010, Texas Instruments Incorporated
Product Folder Link(s): TS5A3159A
TS5A3159A
www.ti.com
SCDS200C –AUGUST 2005–REVISED MAY 2010
V
IH
V
+
Logic
Input
OFF
ON
OFF
V
(V
I)
IL
R
GEN
NC or NO
NC or NO
COM
V
COM
+
V
COM
∆V
COM
V
GEN
(2)
C
L
V
= 0 to V
= 0
GEN
+
V
I
IN
R
GEN
C = 1 nF
L
Logic
Input
GND
Q = C × ∆V
C L COM
(1)
V = V or V
IL
I
IH
A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns,
tf < 5 ns.
B. CL includes probe and jig capacitance.
Figure 24. Charge Injection (QC)
V = V or V
Channel On: COM to NC
= V P-P
R = 600 Ω
I
IH
IL
L
V /2
+
V
f = 20 Hz to 20 kHz
SOURCE
C = 50 pF
L
SOURCE
+
V
+
Audio Analyzer
R
L
10 mF
NO
NC
10 mF
Source
Signal
COM
IN
(1)
C
L
600 W
600 W
V
I
GND
600 W
A. CL includes probe and jig capacitance.
Figure 25. Total Harmonic Distortion (THD)
Copyright © 2005–2010, Texas Instruments Incorporated
Submit Documentation Feedback
21
Product Folder Link(s): TS5A3159A
PACKAGE OPTION ADDENDUM
www.ti.com
26-Apr-2010
PACKAGING INFORMATION
Orderable Device
TS5A3159ADBVR
TS5A3159ADBVRE4
TS5A3159ADBVRG4
TS5A3159ADBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOT-23
DBV
6
6
6
6
6
6
6
6
6
6
6
6
6
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
YZP
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS5A3159ADBVTE4
TS5A3159ADBVTG4
TS5A3159ADCKR
TS5A3159ADCKRE4
TS5A3159ADCKRG4
TS5A3159ADCKT
TS5A3159ADCKTE4
TS5A3159ADCKTG4
TS5A3159AYZPR
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SC70
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DSBGA
3000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Apr-2010
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TS5A3159ADBVR
TS5A3159ADBVR
TS5A3159ADBVT
TS5A3159ADBVT
TS5A3159ADCKR
TS5A3159ADCKR
TS5A3159ADCKT
TS5A3159AYZPR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
YZP
6
6
6
6
6
6
6
6
3000
3000
250
180.0
180.0
180.0
180.0
180.0
180.0
180.0
178.0
9.2
9.2
9.2
9.2
9.2
8.4
8.4
9.2
3.23
3.23
3.23
3.23
2.24
2.24
2.24
1.02
3.17
3.17
3.17
3.17
2.34
2.34
2.34
1.52
1.37
1.37
1.37
1.37
1.22
1.22
1.22
0.63
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
250
3000
3000
250
SC70
SC70
DSBGA
3000
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jul-2010
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TS5A3159ADBVR
TS5A3159ADBVR
TS5A3159ADBVT
TS5A3159ADBVT
TS5A3159ADCKR
TS5A3159ADCKR
TS5A3159ADCKT
TS5A3159AYZPR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
YZP
6
6
6
6
6
6
6
6
3000
3000
250
205.0
202.0
205.0
202.0
205.0
202.0
202.0
220.0
200.0
201.0
200.0
201.0
200.0
201.0
201.0
220.0
33.0
28.0
33.0
28.0
33.0
28.0
28.0
35.0
250
3000
3000
250
SC70
SC70
DSBGA
3000
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Audio
Amplifiers
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
Automotive
www.ti.com/automotive
www.ti.com/communications
Communications and
Telecom
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
Consumer Electronics
Energy
www.ti.com/consumer-apps
www.ti.com/energy
Logic
Industrial
www.ti.com/industrial
Power Mgmt
Microcontrollers
RFID
power.ti.com
Medical
www.ti.com/medical
microcontroller.ti.com
www.ti-rfid.com
Security
www.ti.com/security
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
Wireless
www.ti.com/video
www.ti.com/wireless-apps
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2010, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明