TS5N214PWR
更新时间：2024-09-18 06:13:38
品牌：TI
描述：2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH
概述
规格参数
数据手册TS5N214PWR 概述
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER HIGH-BANDWIDTH BUS SWITCH 2位1 -OF- 4的FET用/解复用器高带宽总线开关 复用器或开关
TS5N214PWR 规格参数
| 是否无铅： | 不含铅 | 是否Rohs认证： | 符合 |
| 生命周期： | Active | 零件包装代码： | TSSOP |
| 包装说明： | TSSOP-16 | 针数： | 16 |
| Reach Compliance Code： | compliant | HTS代码： | 8542.39.00.01 |
| Factory Lead Time： | 6 weeks | 风险等级： | 1.68 |
| Samacsys Confidence： | 3 | Samacsys Status： | Released |
| Samacsys PartID： | 1677555 | Samacsys Pin Count： | 16 |
| Samacsys Part Category： | Integrated Circuit | Samacsys Package Category： | Small Outline Packages |
| Samacsys Footprint Name： | TS5N214PWR-1 | Samacsys Released Date： | 2018-12-19 16:35:02 |
| Is Samacsys： | N | 模拟集成电路 - 其他类型： | DIFFERENTIAL MULTIPLEXER |
| 标称带宽： | 25 MHz | 最大输入电压： | 10 V |
| 最小输入电压： | JESD-30 代码： | R-PDSO-G16 | |
| JESD-609代码： | e4 | 长度： | 5 mm |
| 湿度敏感等级： | 1 | 信道数量： | 2 |
| 功能数量： | 1 | 端子数量： | 16 |
| 标称断态隔离度： | 50 dB | 最大通态电阻 (Ron)： | 12.5 Ω |
| 最高工作温度： | 85 °C | 最低工作温度： | -40 °C |
| 输出： | SEPARATE OUTPUT | 封装主体材料： | PLASTIC/EPOXY |
| 封装代码： | TSSOP | 封装形状： | RECTANGULAR |
| 封装形式： | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | 峰值回流温度（摄氏度）： | 260 |
| 认证状态： | Not Qualified | 座面最大高度： | 1 mm |
| 最大供电电流 (Isup)： | 10 mA | 最大供电电压 (Vsup)： | 5.25 V |
| 最小供电电压 (Vsup)： | 4.75 V | 标称供电电压 (Vsup)： | 5 V |
| 表面贴装： | YES | 最长断开时间： | 200 ns |
| 最长接通时间： | 200 ns | 温度等级： | INDUSTRIAL |
| 端子面层： | Nickel/Palladium/Gold (Ni/Pd/Au) | 端子形式： | GULL WING |
| 端子节距： | 0.65 mm | 端子位置： | DUAL |
| 处于峰值回流温度下的最长时间： | NOT SPECIFIED | 宽度： | 4.4 mm |
| Base Number Matches： | 1 |
TS5N214PWR 数据手册
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PDF下载TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
FEATURES
DBQ OR PW PACKAGE
(TOP VIEW)
•
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 3 Ω Typ)
V
CC
1OE
S1
1
2
3
4
5
6
7
8
16
15
2OE
•
•
0- to 10-V Switching on Data I/O Ports
14 S0
1B4
1B3
1B2
1B1
1A
Bidirectional Data Flow With Near-Zero
Propagation Delay
13 2B4
12 2B3
11 2B2
•
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
10
9
2B1
2A
(Cio(OFF) = 20 pF Max, B Port)
GND
•
•
VCC Operating Range From 4.75 V to 5.25 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
•
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model
(A114-B, Class II)
– 1000-V Charged-Device Model (C101)
•
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
XXXXXX
DESCRIPTION/ORDERING INFORMATION
The TS5N214 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of the pass
transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows for
minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device also
features low data I/O capacitance to minimize capacitive loading and signal distorion on the data bus. Specifically
designed to support high-bandwidth applications, the TS5N214 provides an optimized interface solution ideally
suited for broadband communications, networking, and data-intensive computing systems.
The TS5N214 is a 2-bit 1-of-4 multiplexer/demultiplexer with separate output-enable (1OE, 2OE) inputs. The
select (S0, S1) inputs control the data path of the multiplexer/demultiplexer. When OE is low, the
multiplexer/demultiplexer is enabled and the A port is connected to the B port, allowing bidirectional data flow
between ports. When OE is high, the multiplexer/demultiplexer is disabled and a high-impedance state exists
between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TS5N214DBQR
TOP-SIDE MARKING
YB214
YB214
SSOP (QSOP) – DBQ
TSSOP – PW
Tape and reel
Tape and reel
–40°C to 85°C
TS5N214PWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
FUNCTION TABLE
(EACH MULTIPLEXER/DEMULTIPLEXER)
INPUTS
INPUT/OUTPUT
A
FUNCTION
OE
L
S1
L
S0
L
B1
B2
B3
B4
Z
A port = B1 port
A port = B2 port
A port = B3 port
A port = B4 port
Disconnect
L
L
H
L
L
H
H
X
L
H
X
H
LOGIC DIAGRAM (POSITIVE LOGIC)
7
6
5
4
3
1A
1B1
SW
SW
SW
1B2
1B3
1B4
SW
9
10
11
12
13
2B1
2A
SW
SW
2B2
2B3
2B4
SW
SW
14
2
S0
S1
1
1OE
2OE
15
2
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
V
CC
Charge
Pump
(1)
EN
(1) EN is the internal enable signal applied to the switch.
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
7
UNIT
V
VCC Supply voltage range
VIN
VI/O Switch I/O voltage range(2)(3)(4)
Control input voltage range(2)(3)
7
V
11
V
II/O
ON-state switch current(5)
±100
±100
90
mA
mA
Continuous current through VCC or GND
DBQ package
PW package
θJA
Package thermal impedance(6)
Storage temperature range
°C/W
°C
108
150
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
(5) II and IO are used to denote specific conditions for II/O
.
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
4.75
2
MAX
5.25
5.25
0.8
UNIT
V
VCC
VIH
VIL
Supply voltage
High-level control input voltage
Low-level control input voltage
Data input/output voltage
Operating free-air temperature
V
0
V
VI/O
TA
0
10
V
–40
85
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS(1)
MIN TYP(2)
MAX UNIT
IIN
Control inputs
VCC = 5.25 V,
VCC = 5.25 V,
VCC = 0 V,
VIN = 0 to VCC
10
10
10
10
10
60
µA
VO = 0 to 10 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
(3)
IOZ
µA
VO = Open,
VI = 0 to 10 V
II/O = 0,
Switch ON or OFF,
ICC
Cin
VCC = 5.25 V,
VCC = 5 V,
VIN = VCC or GND
mA
pF
Control inputs
A port
VIN = 10 V or 0
Switch OFF,
VIN = VCC or GND,
VCC = 5 V,
VI/O = 10 V or 0
VI/O = 10 V or 0
VI/O = 10 V or 0
Cio(OFF)
pF
Switch OFF,
VIN = VCC or GND,
B port
VCC = 5 V,
VCC = 5 V,
20
Switch ON,
VIN = VCC or GND,
Cio(ON)
100
pF
VI = 0 V,
VI = 8 V,
VI = 10 V,
IO = 50 mA
IO = –50 mA
IO = –50 mA
3
7.5
7.5
VCC = 4.75 V,
TYP at VCC = 5 V
(4)
ron
Ω
12.5
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the I/O leakage current.
(4) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 5 V
± 0.25 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
3
(1)
tpd
A or B
S
B or A
A
ns
ns
tpd(s)
ten
200
200
200
200
200
S
B
ns
ns
OE
S
A or B
B
tdis
OE
A or B
(1) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
Dynamic Characteristics
over recommended operating free-air temperature range, VCC = 5 V ± 5% (unless otherwise noted)
PARAMETER
Bandwidth (BW)(2)
OFF isolation (OISO
TEST CONDITIONS
See Figure 4
f = 25 MHz,
MIN TYP(1) MAX UNIT
RL = 50 Ω, VI = 0.632 V (P-P),
RL = 50 Ω, VI = 0.632 V (P-P),
RL = 50 Ω, VI = 0.632 V (P-P),
25
MHz
dB
)
See Figure 5
–50
–50
Crosstalk (XTALK
)
f = 25 MHz,
See Figure 6 and Figure 7
dB
(1) All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C
(2) Bandwidth is the frequency where the gain is –3 dB below the DC gain.
4
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
TYPICAL PERFORMANCE
6
5
4
3
2
1
0
T = 25°C
A
0
1
2
3
4
5
6
7
8
9
10
V − V
I
Figure 1. Typical ron vs VI, VCC - 5 V, and IO = –50 mA
0
0
−1
−2
−3
−4
−5
−6
−7
−8
−9
−10
−20
−30
−40
−50
−60
−70
Gain
Phase
0.1
1
10
100
500
f − Frequency − MHz
Figure 2. Frequency Response vs Bandwidth
5
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
TYPICAL PERFORMANCE (continued)
180
160
140
120
100
80
60
40
20
0
0
−20
−40
−60
Phase
−20
−40
−60
−80
−100
−120
−140
−160
−180
Gain
−80
−100
−120
0.1
1
10
100
500
f − Frequency − MHz
Figure 3. Frequency Response vs OFF Isolation
180
160
140
120
100
80
0
−20
Phase
60
−40
40
20
−60
Gain
0
−20
−40
−60
−80
−100
−120
−140
−160
−180
−80
−100
−120
0.1
1
10
100
500
f − Frequency − MHz
Figure 4. Frequency Response vs Crosstalk
6
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
G1
TEST CIRCUIT
DUT
2 y V
CC
Input Generator
50 Ω
S1
Open
GND
R
L
V
I
V
O
50 Ω
V
G2
C
L
R
L
(see Note A)
S1
Open
V
I
C
V
∆
R
V
TEST
†
L
L
CC
t
5 V ± 0.25 V
5 V ± 0.25 V
5 V ± 0.25 V
100 Ω
100 Ω
100 Ω
V
CC
35 pF
35 pF
35 pF
pd(s)
t
/t
2 y V
GND
0.3 V
0.3 V
PLZ PZL
CC
t
/t
GND
V
CC
PHZ PZH
†
t
is measured with Demux inputs at opposite voltage levels, i.e. V = 5 V, V = GND.
B1 B2
pds
Output
Control
V
CC
V /2
CC
V /2
CC
(V )
IN
0 V
t
t
PLZ
PZL
Output
Waveform 1
V
V
OH
Output
Control
(V
V
CC
V /2
CC
S1 at 2 × V
V + V
∆
OL
V /2
CC
V /2
CC
CC
)
(see Note B)
IN
OL
0 V
t
t
PZH
PHZ
t
t
PLH
PHL
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
V
OH
− V
∆
V /2
CC
Output
V /2
CC
V /2
CC
0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (t
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
)
pd(s)
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t < 25 ns, t < 25 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
en
are the same as t
. The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
pd(s)
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 5. Test Circuit and Voltage Waveforms
7
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION (continued)
V
CC
Network Analyzer
50 W
B1
Channel ON: B1 to A
A
Network Analyzer Setup
Source
Signal
B2−B4
Source Power = 0 dBM
(632-mV P-P at 50-W load)
GND
DC Bias = 350 mV
50 W
Figure 6. Bandwidth (BW)
V
CC
Network Analyzer
50 W
B1
Channel OFF: B2−B4 to A
Network Analyzer Setup
A
Source
Signal
50 W
B2−B4
Source Power = 0 dBM
GND
(632-mV P-P at 50-W load)
50 W
DC Bias = 350 mV
Figure 7. OFF Isolation (OISO
)
V
CC
Network Analyzer
50 W
B1
Channel ON: B1 to A
A
Channel OFF: B2−B4 to A
Source
Signal
B2−B4
Network Analyzer Setup
50 W
Source Power = 0 dBM
GND
(632-mV P-P at 50-W load)
50 W
DC Bias = 350 mV
Figure 8. Crosstalk (XTALK
)
8
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
PARAMETER MEASUREMENT INFORMATION (continued)
V
+
Network Analyzer
50 W
Channel ON: 1B1 to 1A,
2B1 to 2A
1B1
2B1
1A
2A
Source
Signal
Network Analyzer Setup
50 W
Source Power = 0 dBM
(632 mV P-P at 50 W load)
50 W
DC Bias = 350 mV
GND
Figure 9. Adjacent Channel Crosstalk (XTALK
)
9
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
MECHANICAL DATA
DBQ (R–PDSO–G**)
PLASTIC SMALL-OUTLINE PACKAGE
0.012 (0,30)
0.008 (0,20)
0.025 (0,64)
24
0.005 (0,13)
13
0.157 (3,99) 0.244 (6,20)
0.150 (3,81)
0.008 (0,20) NOM
0.228 (5,80)
Gauge Plane
1
12
A
0.010 (0,25)
0°−8°
0.035 (0,89)
0.016 (0,40)
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.004 (0,10)
PINS **
16
20
24
28
DIM
0.197
(5,00)
0.344
(8,74)
0.344
(8,74)
0.394
(10,01)
A MAX
0.189
(4,80)
0.337
(8,56)
0.337
(8,56)
0.386
(9,80)
A MIN
M0−137
VARIATION
D
AB
AD
AE
AF
4073301/F 02/2002
A. All linear dimensions are in inches (millimeters).
B. This drawing is subject ot change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-137.
10
TS5N214
2-BIT 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
HIGH-BANDWIDTH BUS SWITCH
www.ti.com
SCDS206–AUGUST 2005
MECHANICAL DATA (continued)
PW (R–PDSO–G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°−ā8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
7,70
9,80
9,60
A MAX
A MIN
4040064/F 01/97
A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0, 15.
D. Falls within JEDEC MO-153
11
PACKAGE OPTION ADDENDUM
www.ti.com
7-Apr-2006
PACKAGING INFORMATION
Orderable Device
TS5N214DBQR
TS5N214DBQRE4
TS5N214DBQRG4
TS5N214PWR
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP/
QSOP
DBQ
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SSOP/
QSOP
DBQ
DBQ
PW
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
SSOP/
QSOP
2500 Green (RoHS & CU NIPDAU Level-2-260C-1YEAR
no Sb/Br)
TSSOP
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TS5N214PWRE4
TSSOP
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
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for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
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Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
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Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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TS5N214PWR CAD模型
引脚图
封装焊盘图
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