TSB43CB43APGFG4 [TI]
iceLynx Micro with Streaming Audio 176-LQFP -20 to 70;![TSB43CB43APGFG4](http://pdffile.icpdf.com/pdf2/p00247/img/icpdf/TSB43CB43APG_1499787_icpdf.jpg)
型号: | TSB43CB43APGFG4 |
厂家: | ![]() |
描述: | iceLynx Micro with Streaming Audio 176-LQFP -20 to 70 通信 时钟 数据传输 PC 外围集成电路 |
文件: | 总8页 (文件大小:162K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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TSB43CA43A
TSB43CB43A
TSB43CA42
www.ti.com
SLLA211–JUNE 2006
iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution
FEATURES
•
Internal ARM7
•
1394 Features
– 50-MHz operating frequency
– Integrated 400 Mbps 3-port PHY
– 32-bit and thumb (16-bit) mode support
– UART included for communication
– Compliant with IEEE 1394-1995 and IEEE
1394a-2000 standards
– 256K bytes of program memory included on
chip
– Supports bus manager functions and
automatic 1394 self-ID verification.
– ARM JTAG included for software debug
Data Buffers
– Separate Async Ack FIFO decreases the
ack-tracking burden on in-CPU and ex-CPU
•
•
– Large 16.5K byte total FIFO
•
DTLA Encryption Support for MPEG2-DVB,
DSS, DV, and Audio (TSB43CA43A and
TSB43CA42 Only)
– Programmable data/space available
indicators for buffer flow control
Hardware Packet Formatting for the
Following Standards
– Two M6 baseline ciphers (one per HSDI
port)
– DVB MPEG2 transport stream (IEC61883-4)
– DSS MPEG2 transport stream per standard
– DV Stream (IEC 61883-2) SD-DV
• Content key generation from exchange
key
– AKE acceleration features in hardware
– Audio over 1394 (IEC 61883-6)
• Random Number Generator
– Audio Music Protocol (version 1.0 and
enhancements)
• Secure Hash Algorithm, Revision 1
(SHA-1)
– Asynchronous and asynchronous stream
(as defined by IEEE 1394)
– Other AKE acceleration features
• Elliptical curve digital signature algorithm
(EC-DCA) both signature and verification
•
Additional Features
– PID filtering for transmit function (up to 16
separate PIDs per HSDI)
• Elliptical curve Diffie-Hellman (EC-DH),
first phase value and shared secret
calculation
– Packet insertion – two insertion buffers per
HSDI
• 160-bit math functions
– 11 general-purpose inputs/outputs (GPIOs)
– Interrupt driven to minimize CPU polling.
– Single 3.3-V supply
•
High Speed Data Interface (HSDI)
– Two configurable high speed data
interfaces support the following audio and
video modes:
– JTAG interface to support post-assembly
scan of device I/O – boundary scan
• MPEG2-DVB interface
• MPEG2-DSS interface
• DV codec interface
• IEC60958 interface
• Audio DAC interface
• SACD interface
•
External CPU Interface
– 16-bit parallel asynchronous I/O-type
– 16-bit parallel synchronous I/O-type
– 16-bit parallel synchronous memory type
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006, Texas Instruments Incorporated
TSB43CA43A
TSB43CB43A
TSB43CA42
www.ti.com
SLLA211–JUNE 2006
DESCRIPTION
The iceLynx-Micro (consumer electronics link with integrated microcontroller and physical layer (PHY)) is a high
performance 1394 link-layer device designed as a total solution for digitally interfacing advanced audio/video
consumer electronics applications. The device is offered in both a DTCP encryption/decryption version
(TSB43CA43A and TSB43CA42) and a non-DTCP encryption/decryption version (TSB43CB43).
In addition to supporting transmit and receive of MPEG2 and DSS formatted transport streams with encryption
and decryption, the iceLynx-Micro supports the IEC 61883-6 and audio music protocol standards for audio
format and packetizing and asynchronous and asynchronous stream (as defined by 1394).
The device also features an embedded ARM7TDMI microprocessor core with access to 256K bytes of internal
program memory. The ARM7 is embedded to process 1394 specific transactions, thus significantly reducing the
processing power required by the host CPU and the development time required by the user. The ARM7 is
accessed from the 16/1-bit host CPU interface, from a UART communication port, or from a JTAG debug port.
The iceLynx-Micro integrated 3-port PHY allows the user enhanced flexibility as two additional devices can be
utilized in a system application. The PHY’s speeds are capable of running at 100 Mbps, 200 Mbps, or 400 Mbps.
The PHY follows all requirements as stated in the IEEE 1394-1995 and IEEE 1394a-2000 standards.
The TSB43CA43A and TSB43CA42 version of iceLynx-Micro incorporates two M6 baseline ciphers (one per
HSDI port) per the 5C specification to support transmit and receive of MPEG2 formatted transport streams with
encryption and decryption. The TSB43CB43 version of iceLynx-Micro is identical to the TSB43CA43A without
implementation of the encryption/decryption features. The TSB43CB43 device allows customers that do not
require the encryption/decryption features to incorporate iceLynx-Micro without becoming DTLA licensees. Both
devices support the IEC 61883-6 and audio music protocol standards for audio format and packetizing.
NOTE:
This product is for high-volume CE applications only. For a complete datasheet or
more information contact support@ti.com.
2
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
PACKAGING INFORMATION
Orderable Device
TSB43CA42GGW
TSB43CA42PGF
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-20 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
OBSOLETE
BGA
MICROSTAR
GGW
176
176
TBD
Call TI
Call TI
TSB43CA42
ACTIVE
LQFP
PGF
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-20 to 70
TSB43CA42
TSB43CA42PGFG4
TSB43CA42ZGW
ACTIVE
ACTIVE
LQFP
PGF
176
176
TBD
Call TI
Call TI
-20 to 70
-20 to 70
BGA
MICROSTAR
ZGW
126
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TSB43CA42Z
TSB43CA43AZGW
TSB43CB43APGF
TSB43CB43APGFG4
OBSOLETE
ACTIVE
BGA
MICROSTAR
ZGW
PGF
PGF
176
176
176
TBD
Call TI
Call TI
-20 to 70
-20 to 70
-20 to 70
LQFP
40
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-3-260C-168 HR
Level-3-260C-168 HR
TSB43CB43A
TSB43CB43A
ACTIVE
LQFP
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-May-2014
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
ꢀ ꢁꢂꢃꢄ ꢅꢆꢂ ꢄꢇꢈ ꢉꢄꢊꢄ
ꢋ
ꢋ
ꢋ
OCTOBER 1994
PGF (S-PQFP-G176)
PLASTIC QUAD FLATPACK
132
89
133
88
0,27
0,17
M
0,08
0,50
0,13 NOM
176
45
1
44
Gage Plane
21,50 SQ
24,20
SQ
23,80
26,20
25,80
0,25
0,05 MIN
0°−ā7°
SQ
0,75
0,45
1,45
1,35
Seating Plane
0,08
1,60 MAX
4040134/B 03/95
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Falls within JEDEC MO-136
1
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