TSB43CB43APGFG4 [TI]

iceLynx Micro with Streaming Audio 176-LQFP -20 to 70;
TSB43CB43APGFG4
型号: TSB43CB43APGFG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

iceLynx Micro with Streaming Audio 176-LQFP -20 to 70

通信 时钟 数据传输 PC 外围集成电路
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TSB43CA43A  
TSB43CB43A  
TSB43CA42  
www.ti.com  
SLLA211JUNE 2006  
iceLynx-Micro IEEE 1394a-2000 Consumer Electronics Solution  
FEATURES  
Internal ARM7  
1394 Features  
– 50-MHz operating frequency  
– Integrated 400 Mbps 3-port PHY  
– 32-bit and thumb (16-bit) mode support  
– UART included for communication  
– Compliant with IEEE 1394-1995 and IEEE  
1394a-2000 standards  
– 256K bytes of program memory included on  
chip  
– Supports bus manager functions and  
automatic 1394 self-ID verification.  
– ARM JTAG included for software debug  
Data Buffers  
– Separate Async Ack FIFO decreases the  
ack-tracking burden on in-CPU and ex-CPU  
– Large 16.5K byte total FIFO  
DTLA Encryption Support for MPEG2-DVB,  
DSS, DV, and Audio (TSB43CA43A and  
TSB43CA42 Only)  
– Programmable data/space available  
indicators for buffer flow control  
Hardware Packet Formatting for the  
Following Standards  
– Two M6 baseline ciphers (one per HSDI  
port)  
– DVB MPEG2 transport stream (IEC61883-4)  
– DSS MPEG2 transport stream per standard  
– DV Stream (IEC 61883-2) SD-DV  
Content key generation from exchange  
key  
– AKE acceleration features in hardware  
– Audio over 1394 (IEC 61883-6)  
Random Number Generator  
– Audio Music Protocol (version 1.0 and  
enhancements)  
Secure Hash Algorithm, Revision 1  
(SHA-1)  
– Asynchronous and asynchronous stream  
(as defined by IEEE 1394)  
– Other AKE acceleration features  
Elliptical curve digital signature algorithm  
(EC-DCA) both signature and verification  
Additional Features  
– PID filtering for transmit function (up to 16  
separate PIDs per HSDI)  
Elliptical curve Diffie-Hellman (EC-DH),  
first phase value and shared secret  
calculation  
– Packet insertion – two insertion buffers per  
HSDI  
160-bit math functions  
– 11 general-purpose inputs/outputs (GPIOs)  
– Interrupt driven to minimize CPU polling.  
– Single 3.3-V supply  
High Speed Data Interface (HSDI)  
– Two configurable high speed data  
interfaces support the following audio and  
video modes:  
– JTAG interface to support post-assembly  
scan of device I/O – boundary scan  
MPEG2-DVB interface  
MPEG2-DSS interface  
DV codec interface  
IEC60958 interface  
Audio DAC interface  
SACD interface  
External CPU Interface  
– 16-bit parallel asynchronous I/O-type  
– 16-bit parallel synchronous I/O-type  
– 16-bit parallel synchronous memory type  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006, Texas Instruments Incorporated  
TSB43CA43A  
TSB43CB43A  
TSB43CA42  
www.ti.com  
SLLA211JUNE 2006  
DESCRIPTION  
The iceLynx-Micro (consumer electronics link with integrated microcontroller and physical layer (PHY)) is a high  
performance 1394 link-layer device designed as a total solution for digitally interfacing advanced audio/video  
consumer electronics applications. The device is offered in both a DTCP encryption/decryption version  
(TSB43CA43A and TSB43CA42) and a non-DTCP encryption/decryption version (TSB43CB43).  
In addition to supporting transmit and receive of MPEG2 and DSS formatted transport streams with encryption  
and decryption, the iceLynx-Micro supports the IEC 61883-6 and audio music protocol standards for audio  
format and packetizing and asynchronous and asynchronous stream (as defined by 1394).  
The device also features an embedded ARM7TDMI microprocessor core with access to 256K bytes of internal  
program memory. The ARM7 is embedded to process 1394 specific transactions, thus significantly reducing the  
processing power required by the host CPU and the development time required by the user. The ARM7 is  
accessed from the 16/1-bit host CPU interface, from a UART communication port, or from a JTAG debug port.  
The iceLynx-Micro integrated 3-port PHY allows the user enhanced flexibility as two additional devices can be  
utilized in a system application. The PHY’s speeds are capable of running at 100 Mbps, 200 Mbps, or 400 Mbps.  
The PHY follows all requirements as stated in the IEEE 1394-1995 and IEEE 1394a-2000 standards.  
The TSB43CA43A and TSB43CA42 version of iceLynx-Micro incorporates two M6 baseline ciphers (one per  
HSDI port) per the 5C specification to support transmit and receive of MPEG2 formatted transport streams with  
encryption and decryption. The TSB43CB43 version of iceLynx-Micro is identical to the TSB43CA43A without  
implementation of the encryption/decryption features. The TSB43CB43 device allows customers that do not  
require the encryption/decryption features to incorporate iceLynx-Micro without becoming DTLA licensees. Both  
devices support the IEC 61883-6 and audio music protocol standards for audio format and packetizing.  
NOTE:  
This product is for high-volume CE applications only. For a complete datasheet or  
more information contact support@ti.com.  
2
Submit Documentation Feedback  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-May-2014  
PACKAGING INFORMATION  
Orderable Device  
TSB43CA42GGW  
TSB43CA42PGF  
Status Package Type Package Pins Package  
Eco Plan  
Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-20 to 70  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(6)  
(3)  
(4/5)  
OBSOLETE  
BGA  
MICROSTAR  
GGW  
176  
176  
TBD  
Call TI  
Call TI  
TSB43CA42  
ACTIVE  
LQFP  
PGF  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-20 to 70  
TSB43CA42  
TSB43CA42PGFG4  
TSB43CA42ZGW  
ACTIVE  
ACTIVE  
LQFP  
PGF  
176  
176  
TBD  
Call TI  
Call TI  
-20 to 70  
-20 to 70  
BGA  
MICROSTAR  
ZGW  
126  
Green (RoHS  
& no Sb/Br)  
SNAGCU  
Level-3-260C-168 HR  
TSB43CA42Z  
TSB43CA43AZGW  
TSB43CB43APGF  
TSB43CB43APGFG4  
OBSOLETE  
ACTIVE  
BGA  
MICROSTAR  
ZGW  
PGF  
PGF  
176  
176  
176  
TBD  
Call TI  
Call TI  
-20 to 70  
-20 to 70  
-20 to 70  
LQFP  
40  
40  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
Level-3-260C-168 HR  
Level-3-260C-168 HR  
TSB43CB43A  
TSB43CB43A  
ACTIVE  
LQFP  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-May-2014  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish  
value exceeds the maximum column width.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
ꢀ ꢁꢂꢃꢄ ꢅꢆꢂ ꢄꢇꢈ ꢉꢄꢊꢄ  
OCTOBER 1994  
PGF (S-PQFP-G176)  
PLASTIC QUAD FLATPACK  
132  
89  
133  
88  
0,27  
0,17  
M
0,08  
0,50  
0,13 NOM  
176  
45  
1
44  
Gage Plane  
21,50 SQ  
24,20  
SQ  
23,80  
26,20  
25,80  
0,25  
0,05 MIN  
0°ā7°  
SQ  
0,75  
0,45  
1,45  
1,35  
Seating Plane  
0,08  
1,60 MAX  
4040134/B 03/95  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MO-136  
1
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