TSC2004IRTJR [TI]
12 位、毫微功耗、4 线触摸屏控制器 | RTJ | 20 | -40 to 85;
| 型号： | TSC2004IRTJR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 12 位、毫微功耗、4 线触摸屏控制器 | RTJ | 20 | -40 to 85 控制器 商用集成电路 |
| 文件： | 总62页 (文件大小：2126K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TSC2004
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SBAS408E–JUNE 2007–REVISED MARCH 2008
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire
TOUCH SCREEN CONTROLLER with I2C™ Interface
1
FEATURES
APPLICATIONS
•
•
•
•
Cellular Phones
23
•
4-Wire Touch Screen Interface
Portable Instruments
MP3 Players, Pagers
Multiscreen Touch Control
•
•
•
•
•
•
Ratiometric Conversion
Single 1.2V to 3.6V Supply
Preprocessing to Reduce Bus Activity
High-Speed I2C-Compatible Interface
Internal Detection of Screen Touch
Register-Based Programmable:
DESCRIPTION
The TSC2004 is a very low-power touch screen
controller designed to work with power-sensitive,
handheld applications that are based on advanced
low-voltage processors. It works with a supply voltage
as low as 1.2V, which can be supplied by a
–
–
–
10-Bit or 12-Bit Resolution
Sampling Rates
System Timing
single-cell battery. It contains
a
complete,
•
•
•
•
On-Chip Temperature Measurement
Touch Pressure Measurement
Auto Power-Down Control
Low Power:
ultralow-power, 12-bit, analog-to-digital (A/D) resistive
touch screen converter, including drivers and the
control logic to measure touch pressure.
In addition to these standard features, the TSC2004
offers
preprocessing
of
the
touch
screen
–
–
–
–
–
760µW at 1.8V, 50SSPS
measurements to reduce bus loading, thus reducing
the consumption of host processor resources that can
then be redirected to more critical functions.
The TSC2004 supports an I2C serial bus and data
transmission protocol in all three defined modes:
580µW at 1.6V, 50SSPS
285µW at 1.2V, 50SSPS
74µW at 1.6V, 8.2kSPS Eq. Rate
47µW at 1.2V, 8.2kSPS Eq. Rate
standard,
fast,
and
high-speed.
It
offers
•
•
Enhanced ESD Protection:
programmable resolution of 10 or 12 bits to
accommodate different screen sizes and performance
needs.
–
–
–
–
±8kV HBM
±1kV CDM
±25kV Air Gap Discharge
±12kV Contact Discharge
The TSC2004 is available in a miniature, 18-lead,
5 x 5 array, (2.554 ±0.54)mm x (2.554 ±0.54)mm
wafer chip-scale package (WCSP), and a 20-pin, 4 x
4 QFN package. Both packages are characterized for
the –40°C to +85°C industrial temperature range.
2.5 x 2.5 WCSP-18 and 4 x 4 QFN-20 Packages
U.S. Patent No. 6,246,394; other patents pending.
PENIRQ
PINTDAV
DAV
VREF
X+
Touch
SCL
X-
Y+
Y-
Screen
Drivers
2
I C
SAR
ADC
SDA
Interface
Mux
Serial
Interface
AD0
and
TEMP
AD1
Control
AUX
Internal
Clock
RESET
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
3
I2C is a trademark of NXP Semiconductors.
All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2007–2008, Texas Instruments Incorporated
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TYPICAL
INTEGRAL
LINEARITY
(LSB)
TYPICAL
GAIN
ERROR
(LSB)
NO MISSING
CODES
RESOLUTION PACKAGE
SPECIFIED
TEMPERATURE PACKAGE
TRANSPORT
MEDIA,
QUANTITY
PACKAGE
DESIGNATOR
ORDERING
NUMBER
PRODUCT
(BITS)
TYPE
RANGE
MARKING
Small Tape
and Reel, 250
TSC2004IRTJT
TSC2004IRTJR
TSC2004IYZKT
20-Pin,
0.8 x 4 x 4
Thin QFN
RTJ
YZK
–40°C to +85°C
TSC2004I
Tape and
Reel, 3000
TSC2004
–0.8 to +1.4
+0.1
11
18-Pin,
5 x 5 Matrix,
2.5 x 2.5
DSBGA
Small Ta\pe
and Reel, 250
–40°C to +85°C
TSC2004I
Tape and
Reel, 3000
TSC2004IYZKR
(WCSP)
(1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet, or see
the TI website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range (unless otherwise noted).
TSC2004
–0.4 to SNSVDD + 0.1
–0.4 to SNSVDD + 0.1
–0.3 to 5
UNIT
V
Analog input X+, Y+, AUX to SNSGND
Analog input X–, Y– to SNSGND
SNSVDD to SNSGND
V
V
Voltage range
SNSVDD to AGND
–0.3 to 5
V
I/OVDD to DGND
–0.3 to 5
V
SNSVDD to I/OVDD
–2.40 to +0.3
–0.3 to I/OVDD + 0.3
–0.3 to I/OVDD + 0.3
(TJ Max - TA)/θJA
113
V
Digital input voltage to DGND
Digital output voltage to DGND
Power dissipation
V
V
Low-K
WCSP package
°C/W
°C/W
°C/W
°C
Thermal impedance, θJA
High-K
62
QFN package
39.97
Operating free-air temperature range, TA
Storage temperature range, TSTG
Junction temperature, TJ Max
–40 to +85
–65 to +150
+150
°C
°C
Vapor phase (60 sec)
Infrared (15 sec)
X+, X–, Y+, Y–
+215
°C
Lead temperature
+220
°C
IEC contact discharge(2)
IEC air discharge(2)
±12
kV
X+, X–, Y+, Y–
±25
kV
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to
absolute-maximum rated conditions for extended periods may affect device reliability.
(2) Test method based on IEC standard 61000-4-2. Contact Texas Instruments for test details.
2
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Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TSC2004
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD(1) = +1.2V to +3.6V, unless otherwise noted.
TSC2004
PARAMETER
TEST CONDITIONS
MIN
0
TYP
MAX UNIT
AUXILIARY ANALOG INPUT
Input voltage range
Input capacitance
Input leakage current
A/D CONVERTER
Resolution
VREF
+1
V
12
pF
µA
–1
Programmable: 10 or 12 bits
12
Bits
Bits
No missing codes
Integral linearity
12-bit resolution
11
–3 –0.8 to +1.4
–2 –0.6 to +0.7
+3 LSB(2)
Differential linearity
+4
5
LSB
LSB
LSB
TSC2004IRTJ
TSC2004IYZK
TSC2004IRTJ
TSC2004IYZK
–5
2.2
2.2
0.1
0.1
SNSVDD = 1.6V, VREF = 1.6V,
High-Speed mode, filter off
Offset error
Gain error
–3
+3
SNSVDD = 1.6V, VREF = 1.6V,
High-Speed mode, filter off
LSB
REFERENCE INPUT
VREF range
1.2
–40
3.3
SNSVDD
V
Non-continuous AUX mode, SNSVDD = VREF = 1.6V,
TA = +25°C, fADC = 2MHz, High-Speed mode
VREF input current drain
1.2
1
µA
GΩ
Input impedance
A/D converter not converting
TOUCH SENSORS
PENIRQ 50kΩ pull-up
resistor, RIRQ
TA = +25°C, SNSVDD = VREF = 1.6V
47
kΩ
Y+, X+
Switch
on-resistance
TA = +25°C, SNSVDD = VREF = 1.6V
TA = +25°C, SNSVDD = VREF = 1.6V
6
5
Ω
Ω
Y–, X–
Switch drivers drive
current(3)
100ms duration
50
mA
INTERNAL TEMPERATURE SENSOR
Temperature range
+85
°C
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
SNSVDD = 1.6V
SNSVDD = 3V
0.3
1.6
0.3
1.6
±3
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
°C/LSB
Differential method(4)
Resolution
Accuracy
TEMP1(5)
Differential method(4)
TEMP1(5)
±2
±3
±2
INTERNAL OSCILLATOR
SNSVDD = 1.2V, TA = +25°C
SNSVDD = 1.6V
3.2
3.7
MHz
MHz
MHz
%/°C
%/°C
%/°C
Clock frequency, fOSC
4.3
SNSVDD = 3.0V, TA = +25°C
SNSVDD = 1.2V
4.1
0.118
–0.018
–0.032
Frequency drift
SNSVDD = 1.6V
SNSVDD = 3.0V
(1) I/OVDD must be ≤ SNSVDD.
(2) LSB means Least Significant Bit. With VREF = +2.5V, one LSB is 610µV.
(3) Assured by design, but not tested. Exceeding 50mA source current may result in device degradation.
(4) Difference between TEMP1 and TEMP2 measurement; no calibration necessary.
(5) Temperature drift is –2.1mV/°C.
Copyright © 2007–2008, Texas Instruments Incorporated
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TSC2004
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SBAS408E–JUNE 2007–REVISED MARCH 2008
ELECTRICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, unless otherwise noted.
TSC2004
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX UNIT
DIGITAL INPUT/OUTPUT
Logic family
CMOS
1.2V ≤ I/OVDD < 1.6V
1.6V ≤ I/OVDD ≤ 3.6V
1.2V ≤ I/OVDD < 1.6V
1.6V ≤ I/OVDD ≤ 3.6V
SCL and SDA pins
SCL and SDA pins
IOH = 2 TTL loads
IOL = 2 TTL loads
0.7 × I/OVDD
0.7 × I/OVDD
–0.3
I/OVDD + 0.3
V
V
VIH
VIL
I/OVDD + 0.3
0.2 × I/OVDD
V
–0.3
0.3 × I/OVDD
V
IIL
Logic level
CIN
–1
1
10
µA
pF
V
VOH
I/OVDD – 0.2
I/OVDD
0.2
VOL
ILEAK
0
V
Floating output
–1
1
µA
pF
COUT
Floating output
10
Data format
Straight Binary
POWER-SUPPLY REQUIREMENTS
Power-supply voltage
SNSVDD
I/OVDD(6)
Specified performance
1.2
1.2
3.6
V
V
SNSVDD
Filter off, M = W = 1, C[3:0] =
(1,0,0,0), RM = 1, CL[1:0] = (0,1),
cont AUX mode, fADC = 2MHz,
High-Speed mode, without
reading data register
SNSVDD = I/OVDD = VREF = 1.6V
506
625
µA
TA = +25°C, filter on, M = 15, W = SNSVDD = I/OVDD = VREF = 1.2V
237
364
797
237
342
757
µA
µA
µA
µA
µA
µA
7, PSM = 1, C[3:0] = (0,0,0,0),
RM = 1, CL[1:0] = (0,1), BTD[2:0]
= (1,0,1), 50SSPS, MAVEX =
x
SNSVDD = I/OVDD = VREF = 1.6V
x
MAVEY = MAVEZ = 1, fADC
=
2MHz, High-Speed mode, sensor
drivers supply included
SNSVDD = I/OVDD = VREF = 3.0V
TA = +25°C, filter off, M = W = 1,
PSM = 1, C[3:0] = (0,0,0,0), RM =
1, CL[1:0] = (0,1), BTD[2:0] =
(1,0,1), 50SSPS, MAVEX =
SNSVDD = I/OVDD = VREF = 1.2V
x
SNSVDD = I/OVDD = VREF = 1.6V
x
MAVEY = MAVEZ = 1, fADC
=
2MHz, High-Speed mode, sensor
drivers supply included
SNSVDD = I/OVDD = VREF = 3.0V
Quiescent supply
current(7)(8)
SNSVDD = I/OVDD = VREF = 1.2V
SNSVDD = I/OVDD = VREF = 1.6V
SNSVDD = I/OVDD = VREF = 3.0V
176
268
526
µA
µA
µA
TA = +25°C, filter off, M = W = 1,
C[3:0] = (0,1,0,1), RM = 1, CL[1:0]
= (0,1), non-cont AUX mode, fADC
= 2MHz, High-Speed mode
SNSVDD = I/OVDD = VREF = 1.2V,
~10.3kSPS effective rate
347
468
µA
µA
µA
µA
µA
µA
µA
TA = +25°C, filter on, M = 7, W =
3, C[3:0] = (0,1,0,1), RM = 1,
CL[1:0] = (0,1), MAVEAUX = 1,
SNSVDD = I/OVDD = VREF = 1.6V,
~11.8kSPS effective rate
non-cont AUX mode, fADC
=
2MHz, High-Speed mode, full
speed
SNSVDD = I/OVDD = VREF = 3.0V,
~12.3kSPS effective rate
897
SNSVDD = I/OVDD = VREF = 1.2V,
~1.17kSPS effective rate
TA = +25°C, filter on, M = 7, W =
3, C[3:0] = (0,1,0,1), RM = 1,
CL[1:0] = (0,1), MAVEAUX = 1,
39.4
46.4
85.3
0.023
SNSVDD = I/OVDD = VREF = 1.6V,
~1.17kSPS effective rate
non-cont AUX mode, fADC
2MHz, High-Speed mode,
reduced speed (8.2kSPS
equivalent rate)
=
SNSVDD = I/OVDD = VREF = 3.0V,
~1.17kSPS effective rate
TA = +25°C, Not addressed, SCL = SDA = 1,
Power-down supply current
0.8
SNSVDD = I/OVDD = VREF = 1.6V
(6) I/OVDD must be ≤ SNSVDD.
(7) Supply current from SNSVDD.
(8) For detailed information on test condition parameter and bit settings, see the Digital Interface section.
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TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
PIN CONFIGURATIONS
RTJ PACKAGE(1)
QFN-20
YZK PACKAGE
WCSP-18
(TOP VIEW, SOLDER BUMPS ON BOTTOM SIDE)
(TOP VIEW)
AGND
VREF SNSVDD
X+
SUBGND
NC
Y+
5
4
3
2
1
AUX
NC
X-
15 14 13 12 11
16
17
18
19
20
10
9
X-
Y-
AGND
AUX
I/OVDD
DGND
NC
NC
NC
Y-
8
SNSGND
NC
NC
TSC2004
AD1
NC
SNSGND
AD0
7
I/OVDD
DGND
Thermal Pad
6
AD0
SCL
SDA
PINTDAV RESET
1
2
3
4
5
A
B
C
D
E
Columns
(FRONT VIEW)
(1) The thermal pad is internally connected to
SUBGND. The thermal pad can be
connected to the analog ground or left
floating. Keep the thermal pad separate
from the digital ground, if possible.
PIN ASSIGNMENTS
PIN NO.
PIN
QFN
WCSP
NAME
I/O
A/D DESCRIPTION
1
2
3
4
5
6
7
D1
SDA
I/O
D
D
D
D
D
Serial data I/O
C1
SCL
I
I
Serial clock.
B2
AD1
Address input bit 1
A1
PINTDAV
RESET
DGND
I/OVDD
O
I
Interrupt output. Data available or PENIRQ, depending on setting. Pin polarity with active low.
System reset. All register values reset to default values.
Digital ground
B1
A2
A3
Digital I/O interface voltage
B3, B4,
C2, C3,
D2, D3
No internal connection, but solder bumps are populated. These pins may be connected to analog ground
for mechanical stability.
8, 19
NC
9
A4
A5
B5
C5
D5
E5
D4
E4
E3
E2
E1
C4
AUX
AGND
VREF
SNSVDD
X+
I
I
A
A
Auxiliary channel input
10
11
12
13
14
15
16
17
18
20
—
Analog ground
External reference input
Power supply for sensor drivers and other analog blocks.
I
I
A
A
X+ channel input
Y+
Y+ channel input
SUBGND
X–
Substrate ground (for ESD current). Connection to AGND (on the PCB) is recommended.
I
I
A
A
X– channel input
Y–
Y– channel input
SNSGND
AD0
Sensor driver return
Address input bit 0
I
D
NC
No solder bump for this location.
Copyright © 2007–2008, Texas Instruments Incorporated
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SBAS408E–JUNE 2007–REVISED MARCH 2008
TIMING INFORMATION
S
Sr
P
S
SDA
tSU, STA
tSU, DAT
tBUF
tHD, STA
tHD, DAT
tLOW
tSU, STO
SCL
tHD, STA
tHIGH
tR
tF
S = START Condition
Sr = Repeated START Condition
P = STOP Condition
= Resistor Pull-Up
Figure 1. Detailed I/O Timing for Standard and Fast Modes
Sr
Sr
P
tFDA
tRDA
SDA
tHD, DAT
tSU, STO
tSU, STA
tHD, STA
tSU, DAT
SCL
tFCL
tLOW
(1)
(1)
tRCL1
tRCL
tLOW
tRCL1
tHIGH
tHIGH
= Current Source Pull-Up
= Resistor Pull-Up
Sr = Repeated START Condition
P = STOP Condition
NOTE: (1) First rising edge of the SCL signal after Sr and after each acknowledge bit.
Figure 2. Detailed I/O Timing for High-Speed Mode
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SBAS408E–JUNE 2007–REVISED MARCH 2008
TIMING REQUIREMENTS for Figure 1: I2C Standard Mode (fSCL = 100kHz)(1)
All specifications typical at –40°C to +85°C, SNSVDD = I/OVDD = +1.2V to +3.6V, unless otherwise noted.
2-WIRE STANDARD MODE PARAMETERS
TEST CONDITIONS
SNSVDD ≥ 1.6V
MIN
10
MAX
UNIT
µs
Reset low time(2)
tWL(RESET)
1.2V ≤ SNSVDD < 1.6V
13
µs
SCL clock frequency
fSCL
tBUF
100
kHz
Bus free time between a STOP and START
condition
4.7
µs
Hold time (repeated) START condition
Low period of SCL clock
tHD, STA
tLOW
4.0
4.7
4.0
4.7
0
µs
µs
µs
µs
µs
ns
ns
ns
µs
pF
ns
High period of the SCL clock
Setup time for a repeated START condition
Data hold time
tHIGH
tSU, STA
tHD, DAT
tSU, DAT
tR
3.45
Data setup time
250
Rise time of both SDA and SCL signals
Fall time of both SDA and SCL signals
Setup time for STOP condition
Capacitive load for each bus line
Pulse width of spike suppressed
Cb = total bus capacitance
Cb = total bus capacitance
1000
300
tF
tSU, STO
Cb
4.0
Cb = total capacitance of one bus line in pF
400
N/A
tSP
N/A
(1) All input signals are specified with tR = tF = 5ns (30% to 70% of I/OVDD) and timed from a voltage level of (VIL + VIH)/2.
(2) Refer to Figure 38.
TIMING REQUIREMENTS for Figure 1: I2C Fast Mode (fSCL = 400kHz)(1)
All specifications typical at –40°C to +85°C, SNSVDD = I/OVDD = +1.2V to +3.6V, unless otherwise noted.
2-WIRE FAST MODE PARAMETERS
Reset low time(2)
TEST CONDITIONS
SNSVDD ≥ 1.6V
MIN
10
MAX
UNIT
µs
tWL(RESET)
1.2V ≤ SNSVDD < 1.6V
13
µs
SCL clock frequency
fSCL
tBUF
400
kHz
Bus free time between a STOP and START
condition
1.3
µs
Hold time (repeated) START condition
Low period of SCL clock
tHD, STA
tLOW
0.6
µs
µs
µs
µs
µs
ns
ns
ns
µs
pF
ns
1.3
High period of the SCL clock
Setup time for a repeated START condition
Data hold time
tHIGH
tSU, STA
tHD, DAT
tSU, DAT
tR
0.6
0.6
0
100
0.9
Data setup time
Rise time of both SDA and SCL signals
Fall time of both SDA and SCL signals
Setup time for STOP condition
Capacitive load for each bus line
Pulse width of spike suppressed
Cb = total bus capacitance
Cb = total bus capacitance
20 + 0.1 × Cb
20 + 0.1 × Cb
0.6
300
300
tF
tSU, STO
Cb
Cb = total capacitance of one bus line in pF
400
50
tSP
0
(1) All input signals are specified with tR = tF = 5ns (30% to 70% of I/OVDD) and timed from a voltage level of (VIL + VIH)/2.
(2) Refer to Figure 38.
Copyright © 2007–2008, Texas Instruments Incorporated
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SBAS408E–JUNE 2007–REVISED MARCH 2008
TIMING REQUIREMENTS for Figure 2: I2C High-Speed Mode (fSCL = 1.7MHz)(1)
All specifications typical at –40°C to +85°C, SNSVDD = I/OVDD = +1.2V to +3.6V, unless otherwise noted.
2-WIRE HIGH-SPEED MODE PARAMETERS
Reset low time(2)
tWL(RESET)
TEST CONDITIONS
SNSVDD ≥ 1.6V
MIN
10
MAX
UNIT
µs
µs
MHz
ns
1.2V ≤ SNSVDD < 1.6V
13
SCL clock frequency
fSCL
1.7
Hold time (repeated) START condition
Low period of SCL clock
High period of the SCL clock
Setup time for a repeated START condition
Data hold time
tHD, STA
tLOW
160
320
120
160
0
ns
tHIGH
ns
tSU, STA
tHD, DAT
tSU, DAT
tRCL
ns
150
ns
Data setup time
10
ns
Rise time of SCL signal
Rise time of SDA signal
Fall time of SCL signal
Cb = total bus capacitance
Cb = total bus capacitance
Cb = total bus capacitance
Cb = total bus capacitance
20
80
160
80
ns
tRDA
20
ns
tFCL
20
ns
Fall time of SDA signal
tFDA
20
160
ns
Rise time of SCL signal after a repeated START
condition and after an acknowledge bit
tRCL1
Cb = total bus capacitance
20
160
ns
Setup time for STOP condition
Capacitive load for each bus line
Pulse width of spike suppressed
tSU, STO
Cb
160
ns
pF
ns
Cb = total capacitance of one bus line in pF
400
10
tSP
0
(1) All input signals are specified with tR = tF = 5ns (30% to 70% of VDD) and timed from a voltage level of (VIL + VIH)/2.
(2) Refer to Figure 38.
TIMING REQUIREMENTS for Figure 2: I2C High-Speed Mode (fSCL = 3.4MHz)(1)
All specifications typical at –40°C to +85°C, SNSVDD = I/OVDD = +1.2V(2) to +3.6V, unless otherwise noted.
2-WIRE HIGH-SPEED MODE PARAMETERS
Reset low time(3)
tWL(RESET)
TEST CONDITIONS
SNSVDD ≥ 1.6V
MIN
10
MAX
UNIT
µs
1.2V ≤ SNSVDD < 1.6V
13
µs
SCL clock frequency
fSCL
3.4
MHz
ns
Hold time (repeated) START condition
Low period of SCL clock
High period of the SCL clock
Setup time for a repeated START condition
Data hold time
tHD, STA
tLOW
160
160
60
160
0
ns
tHIGH
ns
tSU, STA
tHD, DAT
tSU, DAT
tRCL
ns
70
ns
Data setup time
10
10
10
10
10
ns
Rise time of SCL signal
Rise time of SDA signal
Fall time of SCL signal
Cb = total bus capacitance
Cb = total bus capacitance
Cb = total bus capacitance
Cb = total bus capacitance
40
80
40
80
ns
tRDA
ns
tFCL
ns
Fall time of SDA signal
tFDA
ns
Rise time of SCL signal after a repeated START
condition and after an acknowledge bit
tRCL1
Cb = total bus capacitance
10
80
ns
Setup time for STOP condition
Capacitive load for each bus line
Pulse width of spike suppressed
tSU, STO
Cb
160
ns
pF
ns
Cb = total capacitance of one bus line in pF
100
10
tSP
0
(1) All input signals are specified with tR = tF = 5ns (30% to 70% of I/OVDD) and timed from a voltage level of (VIL + VIH)/2.
(2) Because of the low supply voltage of 1.2V and the wide temperature range of –40°C to +85°C, the I2C system devices may not reach
the maximum specification of I2C High-Speed mode, and fSCL may not reach 3.4Mhz.
(3) Refer to Figure 38.
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TYPICAL CHARACTERISTICS
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, fADC = fOSC/2,
High-Speed mode (fSCL = 3.4MHz), 12-bit mode, and non-continuous AUX measurement, unless otherwise noted.
CHANGE IN OFFSET
vs TEMPERATURE
CHANGE IN GAIN
vs TEMPERATURE
1.5
1.0
1.5
1.0
SNSVDD = IOVDD = VREF
SNSVDD = I/OVDD = VREF
SNSVDD = 3.0V
SNSVDD = 1.2V
0.5
0.5
SNSVDD = 1.6V
0
0
SNSVDD = 3.0V
-0.5
-1.0
-1.5
-0.5
-1.0
-1.5
SNSVDD = 1.6V
SNSVDD = 1.2V
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Figure 3.
Figure 4.
SNSVDD SUPPLY CURRENT
vs TEMPERATURE
SNSVDD SUPPLY CURRENT
vs SNSVDD SUPPLY VOLTAGE
650
550
450
350
250
150
50
1.00
0.75
0.50
0.25
0
I/OVDD = SNSVDD = VREF
I/OVDD = SNSVDD = VREF
TA = +25°C
SNSVDD = 3.0V
fADC = 1MHz
SNSVDD = 1.6V
SNSVDD = 1.2V
fADC = 2MHz
-40
-20
0
20
40
60
80
100
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
SNSVDD (V)
Figure 5.
Figure 6.
SNSVDD SUPPLY CURRENT
vs SNSVDD SUPPLY VOLTAGE
1.2
1.0
0.8
0.6
0.4
0.2
0
I/OVDD = SNSVDD = VREF
TA = +25°C
tPVS, tPRE, tSNS = default values
TSC-Initiated Mode Scan X, Y, Z at 50SSPS
M = 15, W = 7(1)
M = 1, W = 1(1)
Touch Sensor Modeled By:
2kW for Y-Plane
2kW for Y-Plane
1kW for Z (Touch Resistance)(2)
1.2
1.6
2.0
2.4
2.8
3.2
3.6
SNSVDD (V)
(1) See Table 1
(2) See Figure 26
Figure 7.
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TYPICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, fADC = fOSC/2,
High-Speed mode (fSCL = 3.4MHz), 12-bit mode, and non-continuous AUX measurement, unless otherwise noted.
POWER-DOWN SUPPLY CURRENT
vs TEMPERATURE
POWER-DOWN SUPPLY CURRENT
vs SNSVDD SUPPLY VOLTAGE
1000
800
600
400
200
0
60
45
30
15
0
SNSVDD = I/OVDD = VREF
SNSVDD = I/OVDD = VREF
TA = +25°C
SNSVDD = 3.0V
SNSVDD = 3.6V
SNSVDD = 1.6V
-40
-20
0
20
40
60
80
100
100
100
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
SNSVDD (V)
Figure 9.
Figure 8.
I/OVDD SUPPLY CURRENT
vs TEMPERATURE
I/OVDD SUPPLY CURRENT
vs I/OVDD SUPPLY VOLTAGE
25
20
15
10
5
80
70
60
50
40
30
20
10
0
I/OVDD = SNSVDD = VREF
I/OVDD = SNSVDD = VREF
TA = +25°C
I/OVDD = 1.6V
I/OVDD = 1.2V
fADC = 2MHz
fADC = 1MHz
0
-40
-20
0
20
40
60
80
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
I/OVDD (V)
Figure 10.
Figure 11.
REFERENCE INPUT CURRENT
vs TEMPERATURE
REFERENCE INPUT CURRENT
vs SNSVDD SUPPLY VOLTAGE
2.0
1.5
1.0
0.5
0
4.0
3.0
2.0
1.0
0
SNSVDD = I/OVDD = VREF
SNSVDD = I/OVDD = VREF
SNSVDD = 1.6V
SNSVDD = 1.2V
-40
-20
0
20
40
60
80
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
SNSVDD (V)
Figure 12.
Figure 13.
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TYPICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, fADC = fOSC/2,
High-Speed mode (fSCL = 3.4MHz), 12-bit mode, and non-continuous AUX measurement, unless otherwise noted.
SWITCH ON-RESISTANCE
vs TEMPERATURE
SWITCH ON-RESISTANCE
vs TEMPERATURE
7
6
5
4
3
2
1
9
8
7
6
5
4
3
2
X+
Y+
Y+
X+
X-
Y-
X-
Y-
X+, Y+: SNSVDD = 1.8V to Pin
X-, Y-: Pin to GND
X+, Y+: SNSVDD = 3V to Pin
X-, Y-: Pin to GND
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Figure 14.
Figure 15.
SWITCH ON-RESISTANCE
vs SNSVDD SUPPLY VOLTAGE
TEMP DIODE VOLTAGE
vs TEMPERATURE
850
800
750
700
650
600
550
500
450
400
11
10
9
Measurement Includes
A/D Converter Offset
and Gain Errors
Y+
95.3mV
TEMP2
X+
8
7
X-
Y-
6
TEMP1
138.2mV
5
X+, Y+: SNSVDD to Pin
X-, Y-: Pin to GND
TA = +25°C
I/OVDD = SNSVDD = 3V
VREF = 2.5V
4
3
-40
-20
0
20
40
60
80
100
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
SNSVDD (V)
Figure 16.
Figure 17.
TEMP1 DIODE VOLTAGE
vs SNSVDD SUPPLY VOLTAGE
TEMP2 DIODE VOLTAGE
vs SNSVDD SUPPLY VOLTAGE
590
588
586
584
582
580
578
706
704
702
700
698
696
694
SNSVDD = IOVDD = VREF
Measurement Includes
A/D Converter Offset
and Gain Errors
SNSVDD = IOVDD = VREF
Measurement Includes
A/D Converter Offset
and Gain Errors
TA = +25°C
TA = +25°C
1.2
1.6
2.0
2.4
2.8
3.2
3.6
1.2
1.6
2.0
2.4
2.8
3.2
3.6
SNSVDD (V)
SNSVDD (V)
Figure 18.
Figure 19.
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TYPICAL CHARACTERISTICS (continued)
At TA = –40°C to +85°C, SNSVDD = VREF = +1.2V to +3.6V, I/OVDD = +1.2V to +3.6V, fADC = fOSC/2,
High-Speed mode (fSCL = 3.4MHz), 12-bit mode, and non-continuous AUX measurement, unless otherwise noted.
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
4.20
4.15
4.10
4.05
4.00
3.95
3.90
3.85
3.80
3.75
3.70
SNSVDD = I/OVDD = VREF = 3.0V
SNSVDD = I/OVDD = VREF = 1.6V
-40
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Figure 20.
Figure 21.
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs TEMPERATURE
INTERNAL OSCILLATOR CLOCK FREQUENCY
vs SNSVDD SUPPLY VOLTAGE
3.50
3.40
3.30
3.20
3.10
3.00
2.90
4.20
4.10
4.00
3.90
3.80
3.70
3.60
3.50
3.40
3.30
3.20
SNSVDD = I/OVDD = VREF
SNSVDD = I/OVDD = VREF = 1.2V
TA = +25°C
-40
-20
0
20
40
60
80
100
1.2
1.6
2.0
2.4
2.8
3.2
3.6
Temperature (°C)
SNSVDD (V)
Figure 22.
Figure 23.
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OVERVIEW
The TSC2004 is an analog interface circuit for a human interface touch screen device. A register-based
architecture eases integration with microprocessor-based systems through a standard I2C bus. All peripheral
functions are controlled through the registers and onboard state machines. The TSC2004 features include:
•
•
•
•
•
•
Very low-power touch screen controller
Very small onboard footprint
Relieves host from tedious routine tasks by flexible preprocessing, saving resources for more critical tasks
Ability to work on very low supply voltage
Minimal connection interface allows easiest isolation and reduces the number of dedicated I/O pins required
Miniature, yet complete; requires no external supporting component. (NOTE: Although the TSC2004 can use
an external reference, it is also possible to use SNSVDD as the reference.)
•
Enhanced ESD protection
The TSC2004 consists of the following blocks (refer to the block diagram on the front page):
•
•
•
•
•
•
Touch Screen Interface
Auxiliary Input (AUX)
Temperature Sensor
Acquisition Activity Preprocessing
Internal Conversion Clock
I2C Interface
Communication with the TSC2004 is done via an I2C serial interface. The TSC2004 is an I2C slave device;
therefore, data are shifted into or out of the TSC2004 under the control of the host microprocessor, which also
provides the serial data clock.
Control of the TSC2004 and its functions is accomplished by writing to different registers in the TSC2004. A
simple command protocol (compatible with I2C) is used to address these registers. This protocol can be an I2C
write-addressing followed by multiple control bytes, or multiple combinations of control/data bytes to be written
into different registers (two bytes each). Reading from registers is performed by writing an I2C read-addressing to
the TSC, followed by one or multiple sequential reads from the registers.
The address of the register to be read can be written in TSC Control Byte 0 with the register address and
read-bit (as described in the previous paragraph), and serves as a pointer to the register map where the first
read starts. This designated register address is static; there is no need to write a register address again unless it
is overwritten by a new register address, or if the TSC is reset (by a software reset or by the RESET pin).
The measurement result is placed in the TSC2004 registers and may be read by the host at any time. This
preprocessing frees up the host so that resources can be redirected for more critical tasks. Two optional signals
are also available from the TSC2004 to indicate that data are available for the host to read. PINTDAV is a
programmable interrupt/status output pin. When PINTDAV is programmed as a DAV output, it indicates that an
A/D conversion has completed and that data are available. When this pin is programmed as a PENIRQ output, it
indicates that a touch has been detected on the touch screen. The status register of the TSC2004 provides an
extended status reading including the state of DAV and PENIRQ without the cost of any dedicated pin. Figure 24
shows a typical application of the TSC2004.
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1.6VDC
1mF
0.1mF
1mF
0.1mF
AGND
1.6VDC
1mF
0.1mF
DGND
Host
SNSGND
1.2kW
1.2kW
Processor
PINTDAV
RESET
SDA
GPIO
GPIO
SDA
SCL
X+
Y+
X-
Y-
TSC2004
SCL
Touch
Screen
(PINTDAV is optional;
software implementation
polling of the Status
register is possible)
Auxilary Input
AGND
Figure 24. Typical Circuit Configuration
TOUCH SCREEN OPERATION
A resistive touch screen operates by applying a voltage across a resistor network and measuring the change in
resistance at a given point on the matrix where the screen is touched by an input (stylus, pen, or finger). The
change in the resistance ratio marks the location on the touch screen.
The TSC2004 supports the resistive 4-wire configurations, as shown in Figure 25. The circuit determines location
in two coordinate pair dimensions, although a third dimension can be added for measuring pressure.
4-WIRE TOUCH SCREEN COORDINATE PAIR MEASUREMENT
A 4-wire touch screen is typically constructed as shown in Figure 25. It consists of two transparent resistive
layers separated by insulating spacers.
Conductive Bar
Transparent Conductor (ITO)
Bottom Side
Y+
X+
Silver
Transparent
Conductor (ITO)
Top Side
Ink
X-
Y-
Insulating Material (Glass)
ITO = Indium Tin Oxide
Figure 25. 4-Wire Touch Screen Construction
The 4-wire touch screen panel works by applying a voltage across the vertical or horizontal resistive network.
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The A/D converter converts the voltage measured at the point where the panel is touched. A measurement of the
Y position of the pointing device is made by connecting the X+ input to a data converter chip, turning on the Y+
and Y– drivers, and digitizing the voltage seen at the X+ input. The voltage measured is determined by the
voltage divider developed at the point of touch. For this measurement, the horizontal panel resistance in the X+
lead does not affect the conversion because of the high input impedance of the A/D converter.
Voltage is then applied to the other axis, and the A/D converter converts the voltage representing the X position
on the screen. This process provides the X and Y coordinates to the associated processor.
Measuring touch pressure (Z) can also be done with the TSC2004. To determine pen or finger touch, the
pressure of the touch must be determined. Generally, it is not necessary to have very high performance for this
test; therefore, 10-bit resolution mode is recommended (however, data sheet calculations are shown using the
12-bit resolution mode). There are several different ways of performing this measurement. The TSC2004
supports two methods. The first method requires knowing the X-plate resistance, the measurement of the
X-Position, and two additional cross panel measurements (Z2 and Z1) of the touch screen (see Figure 26).
Equation 1 calculates the touch resistance:
XPostition Z2
ǒ Ǔ
RTOUCH + RX−plate
@
* 1
4096
Z1
(1)
The second method requires knowing both the X-plate and Y-plate resistance, measurement of X-Position and
Y-Position, and Z1. Equation 2 also calculates the touch resistance:
RX−plate @ XPostition
YPosition
4096
4096
Z1
ǒ Ǔ ǒ Ǔ
RTOUCH
+
*1 *RY−plate @ 1*
4096
(2)
Measure X-Position
X+
Y+
Touch
X-Position
X-
Y-
Measure Z1-Position
Y+
X+
Touch
Z1-Position
X-
Y-
Y+
X+
Touch
Z2-Position
X-
Y-
Measure Z2-Position
Figure 26. Pressure Measurement
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When the touch panel is pressed or touched and the drivers to the panel are turned on, the voltage across the
touch panel often overshoots and then slowly settles down (decays) to a stable dc value. This effect is a result of
mechanical bouncing caused by vibration of the top layer sheet of the touch panel when the panel is pressed.
This settling time must be accounted for, or else the converted value will be in error. Therefore, a delay must be
introduced between the time the driver for a particular measurement is turned on, and the time a measurement is
made.
In some applications, external capacitors may be required across the touch screen for filtering noise picked up by
the touch screen (for example, noise generated by the LCD panel or back-light circuitry). The value of these
capacitors provides a low-pass filter to reduce the noise, but will cause an additional settling time requirement
when the panel is touched.
The TSC2004 offers several solutions to this problem. A programmable delay time is available that sets the delay
between turning the drivers on and making a conversion. This delay is referred to as the panel voltage
stabilization time, and is used in some of the TSC2004 modes. In other modes, the TSC2004 can be
commanded to turn on the drivers only without performing a conversion. Time can then be allowed before the
command is issued to perform a conversion.
The TSC2004 touch screen interface can measure position (X,Y) and pressure (Z). Determination of these
coordinates is possible under three different modes of the A/D converter:
•
•
•
TSMode1 — conversion controlled by the TSC2004 initiated by the TSC;
TSMode2 — conversion controlled by the TSC2004 initiated by the host responding to the PENIRQ signal; or
TSMode3 — conversion completely controlled by the host processor.
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INTERNAL TEMPERATURE SENSOR
In some applications, such as battery recharging, an ambient temperature measurement is required. The
temperature measurement technique used in the TSC2004 relies on the characteristics of a semiconductor
junction operating at a fixed current level. The forward diode voltage (VBE) has a well-defined characteristic
versus temperature. The ambient temperature can be predicted in applications by knowing the +25°C value of
the VBE voltage and then monitoring the delta of that voltage as the temperature changes.
The TSC2004 offers two modes of temperature measurement. The first mode requires calibration at a known
temperature, but only requires a single reading to predict the ambient temperature. The TEMP1 diode, shown in
Figure 27, is used during this measurement cycle. This voltage is typically 580mV at +25°C with a 10µA current.
The absolute value of this diode voltage can vary by a few millivolts; the temperature coefficient (TC) of this
voltage is very consistent at –2.1mV/°C. During the final test of the end product, the diode voltage is stored at a
known room temperature, in system memory, for calibration purposes by the user. The result is an equivalent
temperature measurement resolution of 0.3°C/LSB (1LSB = 610µV with VREF = 2.5V).
SNSVDD
+IN
Converter
-IN
AGND
Figure 27. Functional Block Diagram of Temperature Measurement Mode
The second mode does not require a test temperature calibration, but uses a two-measurement (differential)
method to eliminate the need for absolute temperature calibration and for achieving 2°C/LSB accuracy. This
mode requires a second conversion of the voltage across the TEMP2 diode with a resistance 91 times larger
than the TEMP1 diode. The voltage difference between the first (TEMP1) and second (TEMP2) conversion is
represented by:
kT
q
DV +
@ ln(N)
(3)
Where:
N = the resistance ratio = 91.
k = Boltzmann's constant = 1.3807 × 10-23 J/K (joules/kelvins).
q = the electron charge = 1.6022 × 10-19 C (coulombs).
T = the temperature in kelvins (K).
This method can provide much improved absolute temperature measurement, but a lower resolution of
1.6°C/LSB. The resulting equation to solve for T is:
q @ DV
k @ ln(N)
T +
(4)
Where:
ΔV = VBE (TEMP2) – VBE(TEMP1) (in mV).
T = 2.573 ΔV (in K),
or T = 2.573 ΔV – 273 (in °C).
Temperature 1 and/or temperature 2 measurements have the same timing as Figure 46.
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ANALOG-TO-DIGITAL CONVERTER
Figure 28 shows the analog inputs of the TSC2004. The analog inputs (X, Y, and Z touch panel coordinates, chip
temperature and auxiliary inputs) are provided via a multiplexer to the Successive Approximation Register (SAR)
Analog-to-Digital (A/D) converter. The A/D architecture is based on capacitive redistribution architecture, which
inherently includes a sample-and-hold function.
SNSVDD
VREF
PINTDAV
SNSVDD
Level Shift
(1)
RIRQ
50kW
Preprocessing
Data
Pen Touch
Available
Zone
Control
Logic
Detect
MAV
C3-C0
AGND
X+
X-
SNSVDD
Y+
+REF
+IN
Y-
Converter
-IN
-REF
SNSGND
AUX
AGND
(1) Untrimmed resistor; see the typical value in the Electrical Characteristics
Figure 28. Simplified Diagram of the Analog Input Section
A unique configuration of low on-resistance switches allows an unselected A/D converter input channel to
provide power and an accompanying pin to provide ground for driving the touch panel. By maintaining a
differential input to the converter and a differential reference input architecture, it is possible to negate errors
caused by the driver switch on-resistances.
The A/D converter is controlled by two A/D Converter Control registers. Several modes of operation are possible,
depending on the bits set in the control registers. Channel selection, scan operation, preprocessing, resolution,
and conversion rate may all be programmed through these registers. These modes are outlined in the sections
that follow for each type of analog input. The conversion results are stored in the appropriate result register.
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Data Format
The TSC2004 output data are in Straight Binary format as shown in Figure 29. This figure shows the ideal output
code for the given input voltage and does not include the effects of offset, gain, or noise.
(1)
FS = Full-Scale Voltage = VREF
1LSB = VREF(1)/4096
1LSB
11...111
11...110
11...101
00...010
00...001
00...000
0V
FS - 1LSB
Input Voltage(2) (V)
(1) Reference voltage at converter: +REF – (–REF). See Figure 28.
(2) Input voltage at converter, after multiplexer: +IN – (–IN). See Figure 28.
Figure 29. Ideal Input Voltages and Output Codes
Reference
The TSC2004 uses an external voltage reference that applied to the VREF pin. It is possible to use VDD as the
reference voltage because the upper reference voltage range is the same as the supply voltage range.
Variable Resolution
The TSC2004 provides either 10-bit or 12-bit resolution for the A/D converter. Lower resolution is often practical
for measuring slow changing signals such as touch pressure. Performing the conversions at lower resolution
reduces the amount of time it takes for the A/D converter to complete its conversion process, which also lowers
power consumption.
Conversion Clock and Conversion Time
The TSC2004 contains an internal clock (oscillator) that drives the internal state machines that perform the many
functions of the part. This clock is divided down to provide a conversion clock for the A/D converter. The division
ratio for this clock is set in the A/D Converter Control register (see Table 15). The ability to change the
conversion clock rate allows the user to choose the optimal values for resolution, speed, and power dissipation. If
the 4MHz (oscillator) clock is used directly as the A/D converter clock (when CL[1:0] = (0,0)), the A/D converter
resolution is limited to 10 bits. Using higher resolutions at this speed does not result in more accurate
conversions. 12-bit resolution requires that CL[1:0] is set to (0,1) or (1,0).
Regardless of the conversion clock speed, the internal clock runs nominally at 3.8MHz at a 3V supply (SNSVDD)
and slows down to 3.6MHz at a 1.6V supply. The conversion time of the TSC2004 depends on several functions.
While the conversion clock speed plays an important role in the time it takes for a conversion to complete, a
certain number of internal clock cycles are needed for proper sampling of the signal. Moreover, additional times
(such as the panel voltage stabilization time), can add significantly to the time it takes to perform a conversion.
Conversion time can vary depending on the mode in which the TSC2004 is used. Throughout this data sheet,
internal and conversion clock cycles are used to describe the amount of time that many functions take. These
times must be taken into account when considering the total system design.
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Touch Detect
PINTDAV can be programmed to generate an interrupt to the host. Figure 30 details an example for the
Y-position measurement. While in the power-down mode, the Y– driver is on and connected to GND. The internal
pen-touch signal depends on whether or not the X+ input is driven low. When the panel is touched, the X+ input
is pulled to ground through the touch screen and the internal pen-touch output is set to low because of the
detection on the current path through the panel to GND, which initiates an interrupt to the processor. During the
measurement cycles for X- and Y-Position, the X+ input is disconnected, which eliminates any leakage current
from the pull-up resistor to flow through the touch screen, thus causing no errors.
Analog VDD
Plane
SNSVDD
PINTDAV
SNSVDD
Level
Shifter
(1)
RIRQ
50kW
Y+
X+
Pen Touch
Data Available
Control
Logic
High when
the X+ or Y+
driver is on.
Sense
DGND
Y-
High when the X+ or Y+
driver is on, or when any
sensor connection/short
circuit tests are activated.
ON
Vias go to system analog ground plane.
SNSGND
AGND
(1) Untrimmed resistor; see the typical value in the Electrical Characteristics
Figure 30. Example of a Pen-Touch Induced Interrupt via the PINTDAV Pin
In modes where the TSC2004 must detect whether or not the screen is still being touched (for example, when
doing a pen-touch initiated X, Y, and Z conversion), the TSC2004 must reset the drivers so that the RIRQ resistor
is connected again. Because of the high value of this pull-up resistor, any capacitance on the touch screen inputs
causes a long delay time, and may prevent the detection from occurring correctly. To prevent this possible delay,
the TSC2004 has a circuit that allows any screen capacitance to be precharged, so that the pull-up resistor does
not have to be the only source for the charging current. The time allowed for this precharge, as well as the time
needed to sense if the screen is still touched, can be set in the configuration register.
This configuration underscores the need to use the minimum possible capacitor values on the touch screen
inputs. These capacitors may be needed to reduce noise, but too large a value will increase the needed
precharge and sense times, as well as the panel voltage stabilization time.
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Preprocessing
The TSC2004 offers an array of powerful preprocessing operations that reduce unnecessary traffic on the bus
and reduce the host processor loading. This reduction is especially critical for the serial interface, where limited
bandwidth is a tradeoff, keeping the connection lines to a minimum.
All data acquisition tasks are looking for specific data that meet certain criteria. Many of these tasks fall into a
predefined range, while other tasks may be looking for a value in a noisy environment. If these data are all to be
retrieved by host processor for processing, the limited bus bandwidth quickly saturates, along with the host
processor processing capability. In any case, the host processor must always be reserved for more critical tasks,
not for routine work.
The preprocessing unit consists of two main functions: the combined MAV filter (median value filter and
averaging filter), followed by the zone detection.
Preprocessing—Median Value Filter and Averaging Value Filter
The first preprocessing function, a combined MAV filter, can be operated independently as a median value filter
(MVF), an averaging value filter (AVF), and a combined filter (MAVF).
If the acquired signal source is noisy because of the digital switching circuit, it may be necessary to evaluate the
data without noise. In this case, the median value filter (MVF) operation helps to discard the noise. The array of
N converted results is first sorted. The return value is either the middle (median value) of an array of M converted
results, or the average value of a window size of W of converted results:
•
•
•
N = the total number of converted results used by the MAV filter
M = the median value filter size programmed
W = the averaging window size programmed
If M = 1, then N = W. A special case is W = 1, which means the MAVF is bypassed. Otherwise, if W > 1, only
averaging is performed on these converted results. In either case, the return value is the averaged value of
window size W of converted results. If M > 1 and W = 1, then N = M, meaning only the median value filter is
operating. The return value is the middle position converted result from the array of M converted results. If M > 1
and W > 1, then N = M. In this case, W < M. The return value is the averaged value of middle portion W of
converted results out of the array of M converted results. Since the value of W is an odd number in this case, the
averaging value is calculated with the middle position converted result counted twice (so a total of W + 1
converted results are averaged).
Table 1. Median Value Filter Size Selection
MEDIAN VALUE FILTER
M =
POSSIBLE AVERAGING WINDOW SIZE
W =
M1
0
M0
0
1
3
1, 4, 8, 16
1
0
1
1
0
7
1, 3
1
1
15
1, 3, 7
Table 2. Averaging Value Filter Size Selection
AVERAGING VALUE FILTER SIZE SELECTION
W =
W1
0
W0
0
M = 1 (Averaging Only)
M > 1
1
4
1
0
1
3
7
1
0
8
1
1
16
Reserved
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NOTE: The default setting for MAVF is MVF (median value filter with averaging bypassed) for any invalid
configuration. For example, if (M1, M0, W1, W0) = (1,0,1,0), the MAVF performs as it was configured for
(1,0,0,0), median filter only with filter size = 7 and no averaging. The only exception is M > 1 and (W1, W0) =
(1,1). This setting is reserved and should not be used.
Table 3. Combined MAV Filter Setting
M
W
INTERPRETATION
Bypass both MAF and AVF
Bypass MVF only
N =
W
OUTPUT
= 1
= 1
> 1
= 1
> 1
= 1
The converted result
W
Average of W converted results
Median of M converted results
Bypass AVF only
M
Average of middle W of M converted results with the median
counted twice
> 1
> 1
M > W
M
The MAV filter is available for all analog inputs including the touch screen inputs, temperature measurements
TEMP1 and TEMP2, and the AUX measurement.
Averaging output
from window W
W
M = 1
N
N Acquired
Data
N measurements input
into temporary array
Sort by
descending order
Median value
from array M
N
M > 1 and W = 1
N
N
M
M
Averaging output
from window W
W
M > 1 and W > 1
Figure 31. MAV Filter Operation (patent pending)
Zone Detection
The Zone Detection unit is capable of screening all processed data from the MAVF and retaining only the data of
interest (data that fit the prerequisite). This unit can be programmed to send an alert if a predefined condition set
by two threshold value registers is met. Three different zones may be set:
1. Above the upper limit (X ≥ Threshold High)
2. Between the two thresholds (Threshold Low < X < Threshold High)
3. Below the lower limit (X ≤ Threshold Low)
The AUX and temperatures TEMP1 and TEMP2 have separate threshold value registers that can be enabled or
disabled. This function is not available to the touch screen inputs. Once the preset condition is met, the DAV
output to the PINTDAV pin is pulled low and the corresponding DAV bit is set.
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I2C INTERFACE
The TSC2004 supports the I2C serial bus and data transmission protocol in all three defined modes: standard,
fast, and high-speed. A device that sends data onto the bus is defined as a transmitter, and a device receiving
data as a receiver. The device that controls the message is called a master. Devices controlled by the master are
slaves. The bus must be controlled by a master device that generates the serial clock (SCL), controls the bus
access, and generates the START and STOP conditions. The TSC2004 operates as a slave on the I2C bus.
Connections to the bus are made via the open-drain I/O lines, SDA and SCL.
The following bus protocol has been defined (see Figure 32):
•
•
Data transfer may be initiated only when the bus is not busy.
During data transfer, the data line must remain stable whenever the clock line is HIGH. Changes in the data
line while the clock line is HIGH will be interpreted as control signals.
Accordingly, the following bus conditions have been defined:
Bus Not BusyBoth data and clock lines remain HIGH.
Start Data TransferA change in the state of the data line, from HIGH to LOW, while the clock is HIGH, defines a
START condition.
Stop Data TransferA change in the state of the data line, from LOW to HIGH, while the clock line is HIGH,
defines the STOP condition.
Data ValidThe state of the data line represents valid data, when, after a START condition, the data line is stable
for the duration of the HIGH period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a START condition and terminated with a STOP condition.
The number of data bytes transferred between START and STOP conditions is not limited
and is determined by the master device. The information is transferred byte-wise and each
receiver acknowledges with a ninth-bit.
Within the I2C bus specifications, a standard mode (100kHz clock rate), a fast mode (400kHz
clock rate), and a high-speed mode (3.4MHz clock rate) are each defined. The TSC2004
works in all three modes.
Acknowledge Each receiving device, when addressed, is obliged to generate an acknowledge after the
reception of each byte. The master device must generate an extra clock pulse that is associated with this
acknowledge bit.
A device that acknowledges must pull down the SDA line during the acknowledge clock
pulse in such a way that the SDA line is stable LOW during the HIGH period of the
acknowledge clock pulse. Of course, setup and hold times must be taken into account. A
master must signal an end of data to the slave by not generating an acknowledge bit on the
last byte that has been clocked out of the slave. In this case, the slave must leave the data
line HIGH to enable the master to generate the STOP condition.
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Figure 32 details how data transfer is accomplished on the I2C bus. Depending upon the state of the R/W bit, two
types of data transfer are possible:
1. Data transfer from a master transmitter to a slave receiver. The first byte transmitted by the master is the
slave address. Next follows a number of data bytes. The slave returns an acknowledge bit after the slave
address and each received byte.
2. Data transfer from a slave transmitter to a master receiver. The first byte, the slave address, is
transmitted by the master. The slave then returns an acknowledge bit. Next, a number of data bytes are
transmitted by the slave to the master. The master returns an acknowledge bit after all received bytes other
than the last byte. At the end of the last received byte, a not-acknowledge is returned.
The master device generates all of the serial clock pulses and the START and STOP conditions. A transfer ends
with a STOP condition or a repeated START condition. Because a repeated START condition is also the
beginning of the next serial transfer, the bus will not be released.
The TSC2004 may operate in the following two modes:
1. Slave Receiver Mode: Serial data and clock are received through SDA and SCL. After each byte is
received, an acknowledge bit is transmitted. START and STOP conditions are recognized as the beginning
and end of a serial transfer. Address recognition is performed by hardware after reception of the slave
address and direction bit.
2. Slave Transmitter Mode: The first byte (the slave address) is received and handled as in the slave receiver
mode. However, in this mode the direction bit indicates that the transfer direction is reversed. Serial data are
transmitted on SDA by the TSC2004 while the serial clock is input on SCL. START and STOP conditions are
recognized as the beginning and end of a serial transfer.
I2C Fast or Standard Mode (F/S Mode)
In I2C Fast or Standard (F/S) mode, serial data transfer must meet the timing shown in the Timing Information
section.
In the serial transfer format of F/S mode, the master signals the beginning of a transmission to a slave with a
START condition (S), which is a high-to-low transition on the SDA input while SCL is high. When the master has
finished communicating with the slave, the master issues a STOP condition (P), which is a low-to-high transition
on SDA while SCL is high, as shown in Figure 32. The bus is free for another transmission after a stop condition
has occurred. Figure 32 shows the complete F/S mode transfer on the I2C, two-wire serial interface. The address
byte, control byte, and data byte are transmitted between the START and STOP conditions. The SDA state is
only allowed to change while SCL is low, except for the START and STOP conditions. Data are transmitted in
8-bit words. Nine clock cycles are required to transfer the data into or out of the device (8-bit word plus
acknowledge bit).
P
or
Sr
S
SDA
MSB
Slave Address
R/W
Direction Bit
Acknowledgement
Signal from Receiver
Acknowledgement
Signal from Receiver
1
2
6
7
8
9
1
2
3-8
8
9
SCL
ACK
ACK
Repeated If More Bytes Are Transferred
S = START Condition
Sr = Repeated START Condition
P = STOP Condition
= Resistor Pull-Up
Figure 32. Complete Fast- or Standard-Mode Transfer
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I2C High-Speed Mode (Hs Mode)
Serial data transfer format in High-Speed (Hs) mode meets the Fast or Standard (F/S) mode I2C bus
specification. Hs mode can only commence after the following conditions (all of which are in F/S mode) exist:
1. START condition (S)
2. 8-bit master code (00001xxx)
3. not-acknowledge bit (N)
Figure 33 shows this sequence in more detail. Hs-mode master codes are reserved 8-bit codes used only for
triggering Hs mode, and are not to be used for slave addressing or any other purpose. The master code
indicates to other devices that an Hs-mode transfer is about to begin and the connected devices must meet the
Hs mode specification. Because no device is allowed to acknowledge the master code, the master code is
followed by a not-acknowledge bit (N).
After the not-acknowledge bit (N) and SCL have been pulled up to a HIGH level, the master switches to Hs-mode
and enables (at time tH; shown in Figure 33) the current-source pull-up circuit for SCL. Because other devices
can delay the serial transfer before tH by stretching the LOW period of SCL, the master enables its
current-source pull-up circuit when all devices have released SCL, and SCL has reached a HIGH level, thus
speeding up the last part of the rise time of the SCL.
The master then sends a repeated START condition (Sr) followed by a 7-bit slave address with a R/W bit
address, and receives an acknowledge bit (A) from the selected slave. After a repeated START (Sr) condition
and after each acknowledge bit (A) or not-acknowledge bit (N), the master disables its current-source pull-up
circuit. This disabling enables other devices to delay the serial transfer by stretching the LOW period of SCL. The
master re-enables its current-source pull-up circuit again when all devices have released, and SCL reaches a
HIGH level, which speeds up the last part of the SCL signal rise time.
Data transfer continues in Hs mode after the next repeated START (Sr), and only switches back to F/S mode
after a STOP condition (P). To reduce the overhead of the master code, it is possible that a master links a
number of Hs mode transfers, separated by repeated START conditions (Sr).
8-Bit Master Code 00001xxx
N
tH
S
SDA
SCL
1
2 to 5
6
7
8
9
Fast or Standard Mode
R/W
A
n x (8-Bit DATA
+
A/N)
7-Bit Slave Address
Sr
Sr P
SDA
SCL
1
6
7
8
9
1
2 to 5
6
7
8
9
2 to 5
If P then
Fast or Standard Mode
High-Speed Mode
If Sr (dotted lines)
then High-Speed Mode
A = Acknowledge (SDA LOW)
= Current Source Pull-Up
= Resistor Pull-Up
tH
N = Not Acknowledge (SDA HIGH)
S = START Condition
P = STOP Condition
tFS
Sr = Repeated START Condition
Figure 33. Complete High-Speed Mode Transfer
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DIGITAL INTERFACE
ADDRESS BYTE
The TSC2004 has a 7-bit slave address word. The first five bits (MSBs) of the slave address are factory-preset to
comply with the I2C standard for A/D converters and are always set at '10010'. The logic state of the address
input pins (AD1-AD0) determine the two LSBs of the device address to activate communication. Therefore, a
maximum of four devices with the same preset code can be connected on the same bus at one time.
The AD1-AD0 address inputs are only read during a power-up of the device, and should be connected to a digital
supply (I/OVDD), or digital ground (DGND). The slave address is latched into the TSC2004 on the falling edge of
SCL after the read/write bit has been received by the slave.
The last bit of the address byte (R/W) defines the operation to be performed. When set to a '1', a read operation
is selected; when set to a ‘0’, a write operation is selected. Following the START condition, the TSC2004
monitors the SDA bus, checking the device type identifier being transmitted. Upon receiving the '10010' code, the
appropriate device select bits, and the R/W bit, the slave device outputs an acknowledge signal on the SDA line.
Table 4. I2C Slave Address Byte
MSB
D7
LSB
D0
D6
D5
D4
D3
D2
D1
1
0
0
1
0
AD1
AD0
R/W
Bit D0: R/W
1: I2C master read from TSC (I2C read addressing).
0: I2C master write to TSC (I2C write addressing).
I2C Write-Addressing Byte
A = Acknowledge (SDA LOW)
S = START Condition
From Master to Slave
From Slave to Master
S/Sr
1
0
0
1
0
AD1 AD0
0
A
START or
Repeated START
ACK
Sr = Repeated START Condition
I2C Read-Addressing Byte
S/Sr
1
0
0
1
0
AD1 AD0
1
A
START or
Repeated START
ACK
Figure 34. I2C Bus Addressing (Slave Address Byte Format)
CONTROL BYTE
Table 5. Control Byte Format:
Start a Conversion and Mode Setting
MSB
D7
LSB
D0
D6
D5
D4
D3
D2
D1
1
C3
C2
C1
C0
RM
SWRST
STS
R/W
(Control Byte 1)
0
Reserved
(Write '0')
A3
A2
A1
A0
PND0
(Control Byte 0)
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Table 6. Control Byte 1 Bit Register Description (D7 = 1)
BIT
D7
NAME
Control Byte ID
C3:C0
DESCRIPTION
1
D6-D3
Converter Function Select as detailed in Table 7
0: 10 Bit
D2
RM
1: 12 Bit
Software Reset. This bit is self-clearing.
1: Reset all register values to default
Stop bit for all converter functions. This bit is self-clearing.
D1
SWRST
STS
D0
Bit D7: Control Byte ID
1: Control Byte 1 (start conversion and channel select and conversion-related configuration).
0: Control Byte 0 (read/write data registers and non-conversion-related controls).
Bits D6-D3: C3-C0
Converter function select bits. These bits select the input to be converted, and the converter function to be
executed. Table 7 lists the possible converter functions.
Table 7. Converter Function Select
C3
C2
C1
C0
FUNCTION
Touch screen scan function: X, Y, Z1, and Z2 coordinates converted and the results returned
0
0
0
0
to X, Y, Z1, and Z2 data registers. Scan continues until either the pen is lifted or a stop bit is
sent.
Touch screen scan function: X and Y coordinates converted and the results returned to X and
Y data registers. Scan continues until either the pen is lifted or a stop bit is sent.
0
0
0
0
0
0
0
1
1
1
0
1
Touch screen scan function: X coordinate converted and the results returned to X data
register.
Touch screen scan function: Y coordinate converted and the results returned to Y data
register.
Touch screen scan function: Z1 and Z2 coordinates converted and the results returned to Z1
and Z2 data registers.
0
0
0
1
1
1
0
0
1
0
1
0
Auxiliary input converted and the results returned to the AUX data register.
A temperature measurement is made and the results returned to the Temperature
Measurement 1 data register.
A differential temperature measurement is made and the results returned to the Temperature
Measurement 2 data register.
0
1
1
1
0
0
1
0
0
1
0
1
Auxiliary input is converted continuously and the results returned to the AUX data register.
Touch screen panel connection to X-axis drivers is tested. The test result is output to
PINTDAV and shown in STATUS register.
Touch screen panel connection to Y-axis drivers is tested. The test result is output to
PINTDAV and shown in STATUS register.
1
1
1
0
0
1
1
1
0
0
1
0
RESERVED (Note: any condition caused by this command can be cleared by setting the STS
bit to 1).
Touch screen panel short-circuit (between X and Y plates) is tested through Y-axis. The test
result is output to PINTDAV and shown in the STATUS register.
1
1
1
1
1
1
0
1
1
1
0
1
X+, X– drivers status
Y+, Y– drivers status
Y+, X– drivers status
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Touch Screen Scan Function for XYZ or XY
C3-C0 = 0000 or 0001: These scan functions can collaborate with the PSM bit that defines the control mode of
converter functions. If the PSM bit is set to '1', these scan function select commands are recommended to be
issued before a pen touch is detected in order to allow the TSC2004 to initiate and control the scan processes
immediately after the screen is touched. If these functions are not issued before a pen touch is detected, the
TSC2004 waits for the host to write these functions before starting a scan process. If PSM stays as '1' after a
TSC-initiated scan function is complete, the host is not required to write these function select bits again for each
of the following pen touches after the detected touch. In the host-controlled converter function mode (PSM = 0),
the host must send these functions select bits repeatedly for each scan function after a detected pen touch.
Note that the data registers may be updated while a host reading is in progress. Using the sequential read cycle
(see Figure 36) prevents the TSC from updating registers while a host reading is in progress. To ensure that the
XYZ or XY coordinates are correctly read, use the sequential read cycle to read the coordinates after the scan.
Touch Screen Sensor Connection Tests for X-Axis and Y-Axis
Range of resistances of different touch screen panels can be selected by setting the TBM bits in CFR1; see
Table 20. Once the resistance of the sensor panel is selected, two continuity tests are run separately for the
X-axis and Y-axis. The unit under test must pass both connection tests to ensure that a proper connection is
secured.
C3-C0 = 1001: PINTDAV = 0 during this connection test. A '1' shown at end of the test indicates the X-axis
drivers are well-connected to the sensor; otherwise, X-axis drivers are poorly connected. If drivers fail to connect,
then PINTDAV stays low until a stop bit (STS set to '1') is issued.
C3-C0 = 1010: PINTDAV = 0 during this connection test. A '1' shown at end of the test indicates the Y-axis
drivers are well-connected to the sensor; otherwise, Y-axis drivers are poorly connected. If the drivers are fail to
connect, then PINTDAV stays low until a stop bit (STS set to '1') is issued.
Touch Sensor Short-Circuit Test
If the TBM bits of CFR1 detailed in Table 20 are all set to '1', a short-circuit in the touch sensor can be detected.
C3-C0 = 1011: Reserved.
C3-C0 = 1100: PINTDAV = 0 during this short-circuit test. A '1' shown at end of the test indicates there is no
short-circuit detected (through Y-axis) between the flex and stable layers. If there is a short-circuit detected,
PINTDAV stays low until a stop bit (STS set to '1') is issued.
RM—Resolution select. If RM = 1, the conversion result resolution is 12-bit; otherwise, the resolution is 10-bit.
This bit is the same RM bit shown in CFR0.
SWRST—Software reset input. All register values are set to default value if a '1' is written to this bit. This bit is
automatically set to '0' in order to cancel the software reset and resume normal operation.
STS—Stop bit for all converter functions. When writing a '1' to this register, this bit aborts the converter function
currently running in the TSC2004. A '0' is automatically written to this register in order to end the stop bit. This bit
can only stop converter functions; it does not reset any data, status, or configuration registers. This bit is the
same STS bit shown in CFR0, but can only be read through the CFR0 register with different interpretations.
Table 8. STS Bit Operation
OPERATION
Write
VALUE
DESCRIPTION
0
1
Normal operation
Write
Stop converter functions and power down
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Table 9. Control Byte 0 Bit Register Description (D7 = 0)
BIT
NAME
DESCRIPTION
1: Control Byte 1—start conversion, channel select, and converison-related configuration
D7
Control Byte ID
0: Control Byte 0—read/write data registers and non-conversion-related controls
Register Address Bits as detailed in Table 10
D6-D3
D2
A3-A0
RESERVED
A '0' must be set in this bit for normal operation
Power Not Down Control
1: A/D converter biasing circuitry is always on between conversions but is shut down
after the converter function stops
D1
D0
PND0
R/W
0: A/D converter biasing circuitry is shut down either between conversions or after the
converter function stops
TSC Internal Register Data Flow Control
1: Set the starting address of the TSC internal registers for a register read (see
Figure 35)
0: Write to TSC internal registers
Table 10. Internal Register Map
REGISTER ADDRESS
A3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
REGISTER CONTENT
X measurement result
Y measurement result
Z1 measurement result
Z2 measurement result
AUX measurement result
Temp1 measurement result
Temp2 measurement result
Status
READ/WRITE
R
R
R
R
R
R
R
R
AUX high threshold
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
AUX low threshold
Temp high threshold (apply to both TEMP1 and TEMP2)
Temp low threshold (apply to both TEMP1 and TEMP2)
CFR0
CFR1
CFR2
Converter function select status
R/W—Register read and write control. A '1' indicates that the value of the internal register address bits A3-A0 is
stored internally as the starting address for a register read (see Figure 35). The content of the addressed register
is sent to SDA by using I2C read addressing (see Figure 36 and Figure 37). A '0' indicates that the data following
Control Byte 0 on SDA are written into the internal register addressed by bits A3-A0 (see Figure 35).
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START A WRITE CYCLE
A write cycle begins when the master issues the slave address to the TSC2004. The slave address consists of
seven address bits and a write bit (R/W = 0; see Table 5). When the eighth bit has been received and the
address matches the AD1-AD0 address input pin setting, the TSC2004 issues an acknowledge bit by pulling
SDA low for one additional clock cycle (ACK = 0); see Figure 34.
When the master receives the acknowledge bit from the TSC2004, the master writes the input control byte to the
slave; see Table 5. After the control byte is received by the slave, the slave issues another acknowledge bit by
pulling SDA low for one clock cycle (ACK = 0). The master then ends the write cycle by issuing a STOP or
repeated START condition; see Figure 35.
Write Cycle
7
1
0
8
S
I2C Slave Address
A
Control Byte 1
A
P
I2C Write-
Addressing Byte
STOP(1)
1
C3 C2 C1 C0 RM
START
ACK
Converter Function Select
7
1
8
8
8
Data Byte 1/2
Data Byte 2/2
(LOW Byte)
S
I2C Slave Address
0
A
Control Byte 0
A
P
A
A
(HIGH Byte)
I2C Write-
Addressing Byte
STOP(1)
0
ACK
A3 A2 A1 A0
0
START
TSC Internal Register Address for Write Data
7
1
8
S
I2C Slave Address
0
A
Control Byte 0
A
P
I2C Write-
Addressing Byte
STOP(1)
0
ACK
A3 A2 A1 A0
1
START
TSC Internal Register Starting Address mh(2)
(M + N x 3) x 8
7
1
S
I2C Slave Address
0
A
A
A
A
P
I2C Write-
Addressing Byte
Mixed M (Control Byte 1 or Control Byte 0 with Read Bit)
Plus N (Control Byte 0 with Data Bytes), Separated by TSC ACKs
START
STOP(1)
A = Acknowledge (SDA LOW)
N = Not Acknowledge (SDA HIGH)
S = START Condition
From Master to Slave
From Slave to Master
P = STOP Condition
Sr = Repeated START Condition
NOTES: (1) In order to start the next sequence, a STOP condition must be followed by a START condition. If no STOP is
used, then a Repeated START must be used. Also note that is a STOP condition is issued in High-Speed
mode, the mode will revert to the previous mode: Fast or Standard.
(2) mh is a hexadecimal number.
Figure 35. Write Cycle
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REGISTER ACCESS
Data access begins with the master issuing a START (or repeated START) condition followed by the 7-bit
address and a read bit (R/W = 1; see Table 5). When the eighth bit has been received and the address matches,
the slave issues an acknowledge by pulling SDA low for one clock cycle (ACK = 0). The first byte of serial data
then follows. After the first byte has been sent by the slave, it releases the SDA line for the master to issue an
acknowledge (ACK = 0). The slave issues the second byte of serial data upon receiving the acknowledgement
from the master (D7-D0), followed by a not-acknowledge bit (ACK = 1) from the master to indicate that the last
data byte has been received. The master then issues a STOP condition (P) or repeated START (Sr), which ends
the read cycle, as shown in Figure 36 and Figure 37. If the master issues a not-acknowledge (ACK = 1) after
receipt of the first data byte, the master must then issue a stop condition (P) to reset the registers. If the master
is not ready to receive the second data byte, it should issue the acknowledge (ACK = 0), or the master should
stretch the clock. Upon restart of the clock, the second byte of data can be received by the master.
Read Cycle: Sequential, from Register Address mh(2) to (m + n)h(3)
8
8
7
1
1
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
S
I2C Slave Address
A
A
A
A
START I2C Read-Addressing Byte
Register (Address = mh) Content
8
8
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
A
Register (Address = (m + 1)h) Content
8
8
NACK
N
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
A
P
STOP(1)
Register (Address = (m + n)h) Content
A = Acknowledge (SDA LOW)
N = Not Acknowledge (SDA HIGH)
S = START Condition
From Master to Slave
From Slave to Master
P = STOP Condition
Sr = Repeated START Condition
NOTES: (1) In order to start the next sequence, a STOP condition must be followed by a START condition. If no STOP is
used, then a Repeated START must be used. Also note that is a STOP condition is issued in High-Speed
mode, the mode will revert to the previous mode: Fast or Standard.
(2) mh is a hexadecimal number.
(3) If (m+n)h is greater than Fh, then (m + n)h is modulo 16.
Figure 36. Sequential Read Cycle
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Read Cycle: Repeated, Register Address mh(2)
8
8
NACK
N
7
1
1
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
S
I2C Slave Address
A
A
A
A
P
START I2C Read-Addressing Byte
Register (Address = mh) Content
STOP(1)
8
8
NACK
7
1
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
S
I2C Slave Address
1
A
N
P
START I2C Read-Addressing Byte
Register (Address = mh) Content
STOP(1)
8
8
NACK
7
I2C Slave Address
START I2C Read-Addressing Byte
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
S
1
A
N
P
STOP(1)
Register (Address = mh) Content
Or...
8
8
NACK
7
1
1
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
Sr
I2C Slave Address
A
A
A
A
N
I2C Read-Addressing Byte
Register (Address = mh) Content
Repeated
START
8
8
NACK
N
7
1
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
Sr
I2C Slave Address
1
A
I2C Read-Addressing Byte
Register (Address = mh) Content
Repeated
START
8
8
NACK
N
7
Data Byte 1/2
(HIGH Byte)
Data Byte 2/2
(LOW Byte)
Sr
I2C Slave Address
1
A
P
I2C Read-Addressing Byte
Register (Address = mh) Content
STOP(1)
Repeated
START
A = Acknowledge (SDA LOW)
N = Not Acknowledge (SDA HIGH)
S = START Condition
From Master to Slave
From Slave to Master
P = STOP Condition
Sr = Repeated START Condition
NOTES: (1) In order to start the next sequence, a STOP condition must be followed by a START condition. If no STOP is
used, then a Repeated START must be used. Also note that is a STOP condition is issued in High-Speed
mode, the mode will revert to the previous mode: Fast or Standard.
(2) mh is a hexadecimal number.
Figure 37. Repeated Read Cycle
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COMMUNICATION PROTOCOL
The TSC2004 is controlled entirely by registers. Reading and writing to these registers are accomplished by the
use of Control Byte 0, which includes a 4-bit address plus one read/write TSC register control bit. The data
registers defined in Table 10 are all 16-bit, right-adjusted. NOTE: Except for some configuration registers and the
Status register that are full 16-bit registers, the rest of the value registers are 12-bit (or 10-bit) data preceded by
four (or six) zeros.
Configuration Register 0
Table 11. Configuration Register 0 (Reset Value = 4000h for Read; 0000h for Write)
MSB
D15
LSB
D0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
PSM
STS
RM
CL1
CL0
PV2
PV1
PV0
PR2
PR1
PR0
SN2
SN1
SN0
DTW
LSM
PSM—Pen status/control mode. Reading this bit allows the host to determine if the screen is touched. Writing to
this bit selects the mode used to control the flow of converter functions that are either initiated and/or controlled
by host or under control of the TSC2004 responding to a pen touch. When reading, the PSM bit indicates if the
pen is down or not. When writing to this register, this bit determines if the TSC2004 controls the converter
functions, or if the converter functions are host-controlled. The default state is the host-controlled converter
function mode (0). The other state (1) is the TSC-initiated scan function mode that must only collaborate with
C3-C0 = 0000 or 0001 in order to allow the TSC2004 to initiate and control the scan function for XYZ or XY when
a pen touch is detected.
Table 12. PSM Bit Operation
OPERATION
Read
VALUE
DESCRIPTION
0
1
0
1
No screen touch detected
Read
Screen touch detected
Write
Converter functions initiated and/or controlled by host
Converter functions initiated and controlled by the TSC2004
Write
STS—A/D converter status. When reading, this bit indicates if the converter is busy or not busy. Continuous
scans or conversions can be stopped by writing a '1' to this bit, immediately aborting the running converter
function (even if the pen is still down) and causing the A/D converter to power down. The default state for write is
0 (normal operation), and the default state for read is 1 (converter is not busy). NOTE: The same bit can be
written through Control Byte 1. This bit is self-clearing.
Table 13. STS Bit Operation
OPERATION
Read
VALUE
DESCRIPTION
0
1
0
1
Converter is busy
Read
Converter is not busy
Normal operation
Write
Write
Stop converter function and power down
RM—Resolution control. The A/D converter resolution is specified with this bit. See Table 14 for a description of
these bits. This bit is the same whether reading or writing, and defaults to 0. Note that the same bit can be
written through Control Byte 1.
Table 14. A/D Converter Resolution Control
RM
0
FUNCTION
10-bit resolution. Power-up and reset default.
12-bit resolution
1
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CL1, CL0—Conversion clock control. These two bits specify the clock rate that the A/D converter uses to
perform conversion, as shown in Table 15.
Table 15. A/D Converter Conversion Clock Control
CL1
0
CL0
0
FUNCTION
fADC = fOSC/1. This is referred to as the 4MHz A/D converter clock rate, 10-bit resolution only(1)
fADC = fOSC/2. This is referred to as the 2MHz A/D converter clock rate.
fADC = fOSC/4. This is referred to as the 1MHz A/D converter clock rate.
fADC = fOSC/4. This is referred to as the 1MHz A/D converter clock rate.
.
0
1
1
0
1
1
(1) For SNSVDD = 1.2V at –40°C, a lower A/D converter clock rate should be used to allow enough time for conversion settling.
PV2-PV0—Panel voltage stabilization time control. These bits specify a delay time from the moment the touch
screen drivers are enabled to the time the voltage is sampled and a conversion is started. These bits allow the
user to adjust the appropriate settling time for the touch panel and external capacitances. See Table 16 for
settings of these bits. The default state is 000, indicating a 0µs stabilization time. These bits are the same
whether reading or writing.
Table 16. Panel Voltage Stabilization Time Control
PV2
0
PV1
0
PV0
0
STABILIZATION TIME (tPVS)
0µs
100µs
500µs
1ms
0
0
1
0
1
0
0
1
1
1
0
0
5ms
1
0
1
10ms
50ms
100ms
1
1
0
1
1
1
PR2-PR0—Precharge time selection. These bits set the amount of time allowed for precharging any pin
capacitance on the touch screen prior to sensing if a pen touch is happening.
Table 17. Precharge Time Selection
PR2
0
PR1
0
PR0
0
PRECHARGE TIME(tPRE)
20µs
84µs
0
0
1
0
1
0
276µs
0
1
1
340µs
1
0
0
1.044ms
1.108ms
1.300ms
1.364ms
1
0
1
1
1
0
1
1
1
SNS2-SNS0—Sense time selection. These bits set the amount of time the TSC2004 waits to sense whether the
screen is touched after converting a coordinate.
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Table 18. Sense Time Selection
SNS2
SNS1
SNS0
SENSE TIME (tSNS
32µs
)
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
96µs
544µs
608µs
2.080ms
2.144ms
2.592ms
2.656ms
DTW—Detection of pen touch in wait (patent pending). Writing a '1' to this bit enables the pen touch detection in
the background while waiting for the host to issue the converter function in host-initiated/controlled modes. This
background detection allows the TSC2004 to pull high at PINTDAV to indicate no pen touch detected while
waiting for the host to issue the converter function. If the host polls a high state at PINTDAV before the convert
function is sent, the host can abort the issuance of the convert function and stay in the polling PINTDAV mode
until the next pen touch is detected.
LSM—Longer sampling mode. When this bit is set to '1', the extra 500ns of sampling time is added to the normal
sampling cycles of each conversion. This additional time is represented as approximately two internal oscillator
clock cycles. For SNSVDD = 1.2V at –40°C, the LSM bit should be set to '1' so that the sampled signal has
enough time to settle.
Configuration Register 1
Configuration register 1 (CFR1) defines the connection test-bit modes configuration and batch delay selection.
Table 19. Configuration Register 1 (Reset Value = 0000h)
MSB
D15
LSB
D0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
Resrvd Resrvd Resrvd Resrvd TBM3 TBM2 TBM1 TBM0
Resrvd
Resrvd
Resrvd
Resrvd
Resrvd
BTD2
BTD1
BTD0
TBM3-TBM0—Connection test-bit modes (patent pending). These bits specify the mode of test bits used for the
predefined range of the combined X-axis and Y-axis touch screen panel resistance (RTS).
Table 20. Touch Screen Resistance Range and Test-Bit Modes
TEST-BIT MODES
RTS
TBM3
TBM2
TBM1
TBM0
(kΩ)
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0.17
0.17 < RTS ≤ 0.52
0.52 < RTS ≤ 0.86
0.86 < RTS ≤ 1.6
1.6 < RTS ≤ 2.2
2.2 < RTS ≤ 3.6
3.6 < RTS ≤ 5.0
5.0 < RTS ≤ 7.8
7.8 < RTS ≤ 10.5
10.5 < RTS ≤ 16.0
16.0 < RTS ≤ 21.6
21.6 < RTS ≤ 32.6
Reserved
Reserved
Reserved
Only for short-circuit panel test
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BTD2-BTD0—Batch Time Delay mode. These are the selection bits that specify the delay before a
sample/conversion scan cycle is triggered. When it is set, Batch Time Delay mode uses a set of timers to
automatically trigger a sequence of sample-and-conversion events. The mode works for both TSC-initiated scans
(XYZ or XY) and host-initiated scans (XYZ or XY).
A TSC-initiated scan (XYZ or XY) can be configured by setting the PSM bit in CFR0 to '1' and C[3:0] in Control
Byte 1 to '0000' or '0001'. In the case of a TSC-initiated scan (XYZ or XY), the sequence begins with the TSC
responding to a pen touch. After the first processed sample set completes during the batch delay, the scan
enters a wait mode until the end of the batch delay is reached. If a pen touch is still detected at that moment, the
scan continues to process the next sample set, and the batch delay is resumed. The throughput of the processed
sample sets (shown in Table 21 as sample sets per second, or SSPS) is regulated by the selected batch delay
during the time of the detected pen touch. A TSC-initiated scan (XYZ or XY) can be configured by setting the
PSM bit in CFR0 to '1' and C[3:0] in Control Byte 1 to '0000' or '0001'. Note that the throughput of the processed
sample set also depends on the settings of stabilization, precharge, and sense times, and the total number of
samples to be processed per coordinates. If the accrual time of these factors exceeds the batch delay time, the
accrual time dominates. Batch delay time starts when the pen touch initiates the scan function that converts
coordinates.
A host-initiated scan (XYZ or XY) can be configured by setting the PSM bit in CFR0 to '0' and C[3:0] in Control
Byte 1 to '0000' or '0001'. For the host-initiated scan (XYZ or XY), the host must set TSC internal register C[3:0]
in Control Byte 1 to '0000' or '0001' initially after a pen touch is detected; see Conversion Controlled by TSC2004
Initiated by Host (TSMode 2), in the Theory of Operation section. After the scan (XYZ or XY) is engaged, the
throughput of the processed sample sets is regulated by the selected batch delay timer, as long as the initial
detected touch is not interrupted.
Table 21. Touch Screen Throughput and Batch Selection Bits
BATCH DELAY SELECTION
THROUGHPUT FOR TSC-INITIATED
OR HOST-INITIATED SCAN, XYZ OR XY
(SSPS)
DELAY TIME
(ms)
BTD2
BTD1
BTD0
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
0
1
Normal operation throughput depends on settings.
1000
500
250
100
50
2
4
10
20
40
100
25
10
For example, if stabilization time, precharge time, and sense time are selected as 100µs, 84µs, and 96µs,
respectively, and the batch delay time is 2ms, then the scan function enters wait mode after the first processed
sample set until the 2ms of batch delay time is reached. When the scan function starts to process the second
sample set (if the screen is still touched), the batch delay restarts at 2ms (in this example). This procedure
remains regulated by 2ms until the pen touch is not detected or the scan function is stopped by a stop bit or any
reset form.
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Configuration Register 2
Configuration register 2 (CFR2) defines the preprocessor configuration.
Table 22. Configuration Register 2 (Reset Value = 0000h)
MSB
D15
LSB
D0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
MAVE
X
MAVE MAVE
MAVE
AUX
MAVE
TEMP
PINTS1 PINTS0
M1
M0
W1
W0
TZ1
TZ0
AZ1
AZ0
Resrvd
Y
Z
PINTS1 (default 0)—This bit controls the output format of the PINTDAV pin. When this bit is set to '0', the output
format is shown as the AND-form of internal signals of PENIRQ and DAV). When this bit is set to '1', PINTDAV
outputs PENIRQ only.
PINTS0 (default 0)—This bit selects what is output on the PINTDAV pin. If this bit set to '0', the output format of
PINTDAV depends on the selection made on the PINTS1 bit. If this bit set to '1', the internal signal of DAV is
output on PINTDAV.
Table 23. PINTSx Selection
PINTS1
PINTS0
PINTDAV PIN OUTPUT =
0
0
1
1
0
1
0
1
AND combination of PENIRQ (active low) and DAV (active high).
Data available, DAV (active low).
Interrupt, PENIRQ (active low) generated by pen-touch.
Data available, DAV (active low).
M1, M0, W1, W0 (default 0000)—Preprocessing MAV filter control. Note that when the MAV filter is processing
data, the STS bit and the corresponding DAV bits in the status register indicate that the converter is busy until all
conversions necessary for the preprocessing are complete. The default state for these bits is 0000, which
bypasses the preprocessor. These bits are the same whether reading or writing.
TZ1 and TZ0, or AZ1 and AZ0 (default 00)—Zone detection bit definition (for TEMP or AUX measurements).
TZ1 and TZ0 are for the TEMP measurement. AZ1 and AZ0 are for the AUX measurement. The action taken in
zone detection is to store the processed data in the corresponding data registers and to update the
corresponding DAV bits in status register. If the processed data do not meet the selected criteria, these data are
ignored and the corresponding DAV bits are not updated. When zone detection is disabled, the processed data
are simply stored in the corresponding data registers and the corresponding DAV bits are updated without any
comparison of criteria. Note that the converted samples are always processed according to the setting of the
MAVE bits for AUX/TEMP before zone detection takes effect. See Table 30 for thresholds.
Table 24. Zone Detection Bit Definition
TZ1/AZ1
TZ0/AZ0
FUNCTION
0
0
1
1
0
1
0
1
Zone detection is disabled.
When the processed data are below low threshold
When the processed data are between low and high thresholds
When the processed data are above high threshold
MAVE (default is 00000)—MAV filter function enable bit. When the corresponding bit is set to '1', the MAV filter
setup is applied to the corresponding measurement.
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Converter Function Select Register
The Converter Function Select (CFN) register reflects the converter function select status.
Table 25. Converter Function Select Status Register (Reset Value = 0000h)
MSB
LSB
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
CFN15 CFN14 CFN13 CFN12 CFN11 CFN10 CFN9
CFN8
CFN7
CFN6
CFN5
CFN4
CFN3
CFN2
CFN1
CFN0
CFN15-CFN13—Touch screen drivers status. These bits represent the current status of the touch screen drivers
that are turned on. CFN13 is set to '1' if both X+ and X- drivers are turned on. CFN14 is set to '1' if both Y+ and
Y- drivers are turned on. CFN15 is set to '1' if Y+ and X- drivers are turned on. Otherwise, these bits are set to
'0'. These bits are reset to 0h whenever the converter function is either complete, stopped by the STS bit, or
reset (by a hardware reset from the RESET pin or a software reset from SWRST bit in Control Byte 1).
CFN12-CFN0—Converter function select status. These bits represent the converter function currently running,
which is set in bits C3-C0 of Control Byte 1. When the CFNx bit shows '1', where x is the decimal value of
converter function select bits C3-C0, it indicates that the converter function that is set in bits C3-C0 is running.
For example, when CFN2 shows '1', it indicates the converter function set in bits C3-C0 ('0010') is running. The
CFNx bits are reset to 0000h whenever the converter function is complete, stopped by STS bit, or reset (by the
hardware reset from the RESET pin or the software reset from SWRST bit in Control Byte 1). However, if the
TSC-initiated scan function mode is issued (by setting the PSM bit in the CFR0 register to '1'), the CFN0 or
CFN1 bit will not be reset when the corresponding converter function is complete because there is no pen touch.
This event allows the TSC2004 to immediately initiate the scan process (corresponding to CFN0 or CFN1 set to
'1') when the next pen touch is detected.
Table 26. STATUS Register (Reset Value = 0004h)
MSB
D15
LSB
D0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
DAV
Due
X
DAV
Due
Y
DAV
Due
Z1
DAV
Due
Z2
DAV
Due
AUX
DAV
Due
TEMP1 TEMP2
DAV
Due
RESRVD RESET
(read '0') Flag
X
CON
Y
CON
RESRVD
(read '0')
Y
SHR
PDST
ID1
ID0
DAV Bits—Data available bits. These seven bits mirror the operation of the internal signals of DAV. When any
processed data are stored in data registers, the corresponding DAV bit is set to '1'. It stays at '1' until the
register(s) updated to the processed data have been read out by the host.
Table 27. DAV Function
DAV
DESCRIPTION
0
1
No new processed data are available.
Processed data are available. This will stay at 1 until the host has read out all updated registers.
RESET Flag—See Table 28 for the interpretation of the RESET flag bits.
Table 28. RESET Flag Bits
RESET Flag
DESCRIPTION
0
1
Device was reset since last status poll (hardware or software reset).
Device has not been reset since last status poll.
X CON—This bit is '1' if the X axis of the touch screen panel is properly connected to the X drivers. This bit is the
connection test result.
Y CON—This bit is '1' if the Y axis of the touch screen panel is properly connected to the Y drivers. This bit is the
connection test result.
Y SHR—This bit is '1' if there is no short-circuit tested at the Y axis of the touch screen panel. This bit is the
short-circuit test result.
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PDST—Power down status. This bit reflects the setting of the PND0 bit in Control Byte 0. When this bit shows '0',
it indicates A/D converter bias circuitry is still powered on after each conversion and before the next sampling;
otherwise, it indicates A/D converter bias circuitry is powered down after each conversion and before the next
sampling. However, it is powered down between conversion sets. Because this status bit is synchronized with
the internal clock, it does not reflect the setting of the PND0 bit until a pen touch is detected or a converter
function is running.
ID[1:0] Device ID bits: These bits represent the version ID of TSC2004. This version defaults to '00'.
DATA REGISTERS
The data registers of the TSC2004 hold data results from conversions. All of these registers default to 0000h
upon reset.
X, Y, Z1, Z2, AUX, TEMP1 and TEMP2 REGISTERS
The results of all A/D conversions are placed in the appropriate data registers, as described in Table 10. The
data format of the result word (R) of these registers is right-justified, as shown in Table 29.
Table 29. Internal Register Format
MSB
D15
LSB
D0
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
0
0
0
0
R11
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0
Register Map
The TSC2004 has several 16-bit registers that allow control of the device, as well as providing a location to store
results from the TSC2004 until read out by the host microprocessor. Table 30 shows the memory map.
Table 30. Register Content and Reset Values(1)
RESET
A3-A0
(HEX)
REGISTER
NAME
VALUE
(HEX)
D15
0
D14
0
D13
0
D12
0
D11
R11
R11
R11
R11
R11
R11
R11
D10
R10
R10
R10
R10
R10
R10
R10
D9
R9
R9
R9
R9
R9
R9
R9
D8
R8
R8
R8
R8
R8
R8
R8
D7
R7
R7
R7
R7
R7
R7
R7
D6
R6
R6
R6
R6
R6
R6
R6
D5
R5
R5
R5
R5
R5
R5
R5
D4
R4
R4
R4
R4
R4
R4
R4
D3
R3
R3
R3
R3
R3
R3
R3
D2
R2
R2
R2
R2
R2
R2
R2
D1
R1
R1
R1
R1
R1
R1
R1
D0
R0
R0
R0
R0
R0
R0
R0
0
1
2
3
4
5
6
X
Y
0000
0000
0000
0000
0000
0000
0000
0
0
0
0
Z1
0
0
0
0
Z2
0
0
0
0
AUX
Temp1
Temp2
0
0
0
0
0
0
0
0
0
0
0
0
Rsvd
7
Status
S15
S14
S13
S12
S11
S10
S9
0
S7
S6
S5
S3
S2
S1
S0
0004
(2)
8
9
AUX High
AUX Low
Temp High
Temp Low
CFR0
0
0
0
0
0
0
0
0
R11
R11
R11
R11
R11
R11
R11
R10
R10
R10
R10
R10
R10
R10
R9
R9
R9
R9
R9
R9
R9
R8
R8
R8
R8
R8
R8
R8
R7
R7
R7
R7
R7
0
R6
R6
R6
R6
R6
0
R5
R5
R5
R5
R5
0
R4
R4
R4
R4
R4
0
R3
R3
R3
R3
R3
0
R2
R2
R2
R2
R2
R2
R2
R1
R1
R1
R1
R1
R1
R1
R0
R0
R0
R0
R0
R0
R0
0FFF
0000
0FFF
0000
4000
0000
0000
A
B
C
D
E
0
0
0
0
0
0
0
0
R15
0
R14
0
R13
0
R12
0
CFR1
CFR2
R15
R14
R13
R12
R7
R6
0
R4
R3
Converter
Function
Rsvd
F
R15
R14
R13
R12
R10
R9
R8
R7
R6
R5
R4
R3
R2
R1
R0
0000
(2)
Select Status
(1) For all combination bits, the pattern marked as Rsvd (reserved) must not be used. The default pattern is read back after reset.
(2) This bit is reserved.
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REGISTER RESET
There are three way to reset the TSC2004. First, at power-on, a power good signal generates a prolonged reset
pulse internally to all registers.
Second, an external pin, RESET, is available to perform a system reset or allow other peripherals (such as a
display) to reset the device if the pulse meets the timing requirement (at least 10µs wide). Any RESET pulse less
than 5µs will be rejected. To accommodate the timing drift between devices because of process variation, a
RESET pulse width between 5µs to 10µs falls into the gray area that is not recognized, and the result is
undetermined; this situation should be avoided. Refer to Figure 38 for details. A good reset pulse must be low for
at least 10µs. There is an internal spike filter to reject spikes up to 20ns wide.
tR
tR
tWL(RESET) < 5ms
tWL(RESET) ³ 10ms
RESET
State
Normal Operation
Resetting
Initial Condition
NOTE: See Timing Requirements for more information.
Figure 38. External Reset Timing
Finally, a software reset can be activated by writing a '1' to CB1.1 (bit 1 of control byte 1). It should be noted this
reset is not self-clearing so the user must write a '0' to remove the software reset.
A reset clears all registers and loads default values. A power-on reset and external (hardware) reset take
precedence over a software reset. If a software reset is not cleared by the user, it is cleared by either a power-on
reset or an external (hardware) reset.
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THEORY OF OPERATION
TOUCH SCREEN MEASUREMENTS
As noted previously in the discussion of the A/D converter, several operating modes can be used that allow great
flexibility for the host processor. This section examines these different modes.
Conversion Controlled by TSC2004 Initiated by TSC2004 (TSMode 1)
In TSMode 1, before a pen touch can be detected, the TSC2004 must be programmed with PSM = 1 and one of
two scan modes:
1. X-Y-Z Scan (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0000); or
2. X-Y Scan (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0001).
See Table 7 for more information on the converter function select bits.
When the touch panel is touched, and the internal pen-touch signal activates, the PINTDAV output is lowered if it
is programmed as PENIRQ. The TSC2004 then executes the preprogrammed scan function without a host
intervention.
At the same time, the TSC2004 starts up its internal clock. It then turns on the Y-drivers, and after a programmed
panel voltage stabilization time, powers up the A/D converter and converts the Y coordinate. If preprocessing is
selected, several conversions may take place. When data preprocessing is complete, the Y coordinate result is
stored in a temporary register.
If the screen is still touched at this time, the X-drivers are enabled, and the process repeats, but measures the X
coordinate instead, and stores the result in a temporary register.
If only X and Y coordinates are to be measured, then the conversion process is complete. A set of X and Y
coordinates are stored in the X and Y registers. Figure 39 shows a flowchart for this process. The time it takes to
go through this process depends upon the selected resolution, internal conversion clock rate, panel voltage
stabilization time, precharge and sense times, and whether preprocessing is selected. The time needed to get a
complete X and Y coordinate (sample set) reading can beǒcalculated by:
Ǔ
f
LPPRO
fOSC
OHDLY1
fOSC
OH1
fOSC
1
fOSC
OSC )OHCONV
fADC
@
)
ǒ
Ǔ)2 @ N @ ǒB)2 @
(
)
Ǔ ǒ Ǔ ǒ Ǔ
tCOORDINATE
+
)2 @ tPVS)tPRE)tSNS
)
(5)
Where:
tCOORDINATE = time to complete X/Y coordinate reading.
tPVS = panel voltage stabilization time, as given in Table 16.
tPRE = precharge time, as given in Table 17.
tSNS = sense time, as given in Table 18.
N = number of measurements for MAV filter input, as given in Table 3 as N.
(For no MAV: M1-0[1:0] = '00', W1-0[1:0] = '00', N = 1.)
B = number of bits of resolution.
fOSC = TSC onboard OSC clock frequency. See Electrical Characteristics for supply frequency (SNSVDD).
fADC = A/D converter clock frequency, as given in Table 15.
OH1 = overhead time #1 = 2.5 internal clock cycles.
OHDLY1 = total overhead time for tPVS, tPRE, and tSNS = 10 internal clock cycles.
OHCONV = total overhead time for A/D conversion = 3 internal clock cycles.
LPPRO = preprocessor preprocessing time as given in Table 31.
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Table 31. Preprocessing Delay
LPPRO
=
M =
1
W =
FOR B = 12 BIT
FOR B = 10 BIT
1, 4, 8, 16
2
2
3, 7
7
1
3
1
3
7
28
31
31
34
38
24
27
29
32
36
15
15
15
Programmed for
Self-Control
(PSM = 1)
X-Y Scan Mode
(Control Byte1
D[6:3] = 0001)
TSC
Not Addressed
Reading Reading
X-Data Y-Data
Register Register
tCOORDINATE
Sample, Conversion, and
Preprocessing for
Y Coordinate
Sample, Conversion, and
Preprocessing for
X Coordinate
Sample, Conversion, and
Preprocessing for
Y Coordinate
Detecting
Touch
Detecting
Touch
Detecting
Touch
Detecting Touch
PINTDAV Programmed:
Touch is Detected
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
Touch is Detected
As PENIRQ and DAV,
CFR2, D[15:14] = 00
Figure 39. Example of an X and Y Coordinate Touch Screen Scan using TSMode 1
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If the pressure of the touch is also to be measured, the process continues in the same way, but measuring the Z1
and Z2 values instead, and storing the results in temporary registers. Once the complete sample set of data (X,
Y, Z1, and Z2) are available, they are loaded in the X, Y, Z1, and Z2 registers. This process is illustrated in
Figure 40. As before, this process time depends upon the settings described above. The time for a complete X,
Y, Z1, and Z2 coordinate reading is given by:
f
LPPRO
fOSC
OHDLY1
fOSC
OH2
fOSC
1
fOSC
OSC )OHCONV
@
)
ǒ
Ǔ)4 @ N @ ǒB)2 @
(
)
Ǔ ǒ Ǔ ǒ Ǔ
ǒ
Ǔ
tCOORDINATE
+
)3 @ tPVS)tPRE)tSNS
)
fADC
(6)
Where:
OH2 = overhead time #2 = 3.5 internal clock cycles.
Programmed for
Self-Control
TSC
Reading Reading Reading Reading
Z1-Data Z2-Data
Register Register Register Register
Not Addressed
(PSM = 1)
X-Data
Y-Data
X-Y-Z1-Z2 Scan Mode
(Control Byte1
D[6:3] = 0000)
tCOORDINATE
Sample, Conversion,
and Preprocessing for
Z1 Coordinate and Z2 Coordinate
Sample, Conversion,
and Preprocessing for
Y Coordinate
Sample, Conversion,
and Preprocessing for
X Coordinate
Sample, Conversion,
and Preprocessing for
Y Coordinate
Detecting
Touch
Detecting
Touch
Detecting
Touch
Detecting
Touch
Detecting
Touch
PINTDAV Programmed:
Touch is Detected
Touch is Detected
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
Touch is Detected
As PENIRQ and DAV,
CFR2, D[15:14] = 00
Figure 40. Example of an X, Y, and Z Coordinate Touch Screen Scan using TSMode 1
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Conversion Controlled by TSC2004 Initiated by Host (TSMode 2)
In TSMode 2, the TSC2004 detects when the touch panel is touched and causes the internal Pen-Touch signal
to activate, which lowers the PINTDAV output if it is programmed as PENIRQ. The host recognizes the interrupt
request, and then writes to the A/D Converter Control register to select one of the two touch screen scan
functions:
1. X-Y-Z Scan (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0000); or
2. X-Y Scan (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0001).
See Table 7 for more information on the converter function select bits.
The conversion process then proceeds as shown in Figure 41; see the previous sections for more details.
The main difference between this mode and the previous mode is that the host, not the TSC2004, decides when
the touch screen scan begins.
The time needed to convert both X and Y coordinates under host control (not including the time needed to send
the command over the I2C bus) is given by:
f
LPPRO
fOSC
OHDLY1
fOSC
OH1
fOSC
1
fOSC
OSC )OHCONV
fADC
@
)
ǒ
Ǔ)2 @ N @ ǒB)2 @
(
)
Ǔ ǒ Ǔ ǒ Ǔ
ǒ
Ǔ
tCOORDINATE
+
)2 @ tPVS)tPRE)tSNS
)
(7)
TSC
Not
Addressed
Programmed
for
Host-
Controlled
Mode
(PSM = 0)
TSC
Not Addressed
TSC
Not Addressed
Programmed
Reading Reading
X-Data Y-Data
Register Register
for
X-Y
Scan Mode
tCOORDINATE
Waiting for Host to
Write Into
Control Byte 1 D[6:3]
Sample, Conversion,
and Preprocessing for
Y Coordinate
Sample, Conversion,
and Preprocessing for
X Coordinate
Sample, Conversion,
and Preprocessing for
Y Coordinate
Detecting
Touch
Detecting
Touch
Detecting
Touch
Detecting
Touch
PINTDAV Programmed:
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
Touch is Detected
As DAV,
CFR2, D[15:14] = 11 or 01
Touch is Still Here
As PENIRQ and DAV,
CFR2, D[15:14] = 00
Figure 41. Example of an X and Y Coordinate Touch Screen Scan using TSMode 2
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Conversion Controlled by Host (TSMode 3)
In TSMode 3, the TSC2004 detects when the touch panel is touched and causes the internal Pen-Touch signal
to be active, which lowers the PINTDAV output if it is programmed as PENIRQ. The host recognizes the interrupt
request. Instead of starting a sequence in the TSC2004, which then reads each coordinate in turn, the host must
now control all aspects of the conversion. Generally, upon receiving the interrupt request, the host turns on the X
drivers. (NOTE: If drivers are not turned on, the device detects this condition and turns them on before the scan
starts. This situation is why the event of Turn On Drivers is shown as optional in Figure 42 and Figure 43.) After
waiting for the settling time, the host then addresses the TSC2004 again, this time requesting an X coordinate
conversion.
The process is then repeated for the Y and Z coordinates. The processes are outlined in Figure 42 and
Figure 43. Figure 42 shows two consecutive scans on X and Y. Figure 43 shows a single Z scan.
The time needed to convert any single coordinate X or Y under host control (not including the time needed to
send the command over the I2C bus) is given by:
f
LPPRO
fOSC
OHDLY2
fOSC
OH1
fOSC
1
fOSC
OSC )OHCONV
fADC
ǒ
Ǔ)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
) tPRE)tSNS)
(8)
Where:
OHDLY2 = total overhead time for tPRE and tSNS = 6 internal clock cycles.
Programmed for:
Programmed for:
TSC
Not
TSC
Not
Addressed
TSC
Not
Addressed
TSC
Not
Addressed
Programmed
for Host-
Turn On
X
Turn On
Y+ and
Y-
Y
Scan
Reading
X-Data
Register
Reading
Y-Data
Register
Addressed X+ and
X-
Scan
Mode
Controlled
Mode
(PSM = 0)
Mode
(1)
(1)
Drivers
Drivers
tCOORDINATE
tCOORDINATE
Sample, Conversion,
and Preprocessing
for X Coordinate
Sample, Conversion,
and Preprocessing
for Y Coordinate
Waiting for Host to
Write Into Control
Byte 1 D[6:3]
Detecting
Touch
Waiting for Host to Write Into
Control Byte 1 D[6:3]
Detecting Waiting for Host to Write Into
Detecting
Touch
Control Byte 1 D[6:3]
Touch
Touch is Detected
PINTDAV Programmed:
Touch is Detected
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
As PENIRQ and DAV,
CFR2, D[15:14] = 00
NOTE: (1) Optional. If not turned on, it will be turned on by the Scan mode, once detected.
Figure 42. Example of X and Y Coordinate Touch Screen Scan using TSMode 3
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The time needed to convert any Z1 and Z2 coordinate under host control (not including the time needed to send
the command over the I2C bus) is given by:
f
LPPRO
fOSC
OHDLY2
fOSC
OH2
fOSC
1
fOSC
OSC )OHCONV
fADC
ǒ
Ǔ)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
) tPRE)tSNS
)
(9)
Programmed for:
TSC
Not
Addressed
Turn On
Programmed
for
Host-Controlled
Mode
(PSM = 0)
TSC
Not Addressed
TSC
Not Addressed
Reading Reading
Z2-Data
Y+
and
Z
Z1-Data
Scan
Mode
Register Register
X-
Drivers(1)
tCOORDINATE
Sample, Conversion, Sample, Conversion,
Detecting
Touch
Detecting
Touch
Waiting for Host to Write
Into Control Byte 1 D[6:3]
Waiting for Host to Write
Into Control Byte 1 D[6:3]
and Preprocessing
for Z1 Coordinate
and Preprocessing
for Z2 Coordinate
PINTDAV Programmed:
Touch is Detected
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
As PENIRQ and DAV,
CFR2D[15:14] = 00
NOTE: (1) Optional. If not turned on, it will be turned on by the Scan mode, once detected.
Figure 43. Example of Z1 and Z2 Coordinate Touch Screen Scan
(without Panel Stabilization Time) using TSMode 3
If the drivers are not turned on before the touch screen scan mode is programmed, the panel stabilization time
should be included. In this case, the time needed to convert any single X or Y under host control (not including
the time needed to send the command over the I2C bus) is given by:
f
LPPRO
fOSC
OHDLY1
fOSC
OH2
fOSC
1
fOSC
OSC )OHCONV
fADC
ǒ
Ǔ)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
) tPVS)tPRE)tSNS
)
(10)
TSC
Not Addressed
TSC
Not Addressed
TSC
Not Addressed
Programmed
for
Z1-Z2
Programmed for
Host-Controlled
Mode
Reading Reading
Z2-Data
Z1-Data
Register Register
(PSM = 0)
Scan Mode
tCOORDINATE
Sample, Conversion, and
Into Control Byte 1 D[6:3] Preprocessing for Z1, Z2 Coordinates
Detecting
Touch
Detecting
Touch
Waiting for Host to Write
Waiting for Host to Write
Into Control Byte 1 D[6:3]
PINTDAV Programmed:
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
Touch is Still Here
As PENIRQ and DAV,
CFR2D[15:14] = 00
Figure 44. Example of a Z1 and Z2 Coordinate Touch Screen Scan
(with Panel Stabilization Time) using TSMode 3
46
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TSC2004
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
The time needed to convert any single coordinate (either X or Y) under host control (not including the time
needed to send the command over the I2C bus) is given by:
f
LPPRO
fOSC
OHDLY1
fOSC
OH1
fOSC
1
fOSC
OSC )OHCONV
fADC
ǒ
Ǔ)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
) tPVS)tPRE)tSNS
)
(11)
TSC
Not Addressed
TSC
Not Addressed
TSC
Not Addressed
Programmed
Programmed for
Host-Controlled
Mode
Reading
X-Data
Register
for
X
(PSM = 0)
Scan Mode
tCOORDINATE
Detecting
Touch
Detecting
Touch
Waiting for Host to Write
Into Control Byte 1 D[6:3]
Sample, Conversion, and
Preprocessing for X Coordinate
Waiting for Host to Write
Into Control Byte 1 D[6:3]
PINTDAV Programmed:
Touch is Detected
As PENIRQ,
CFR2, D[15:14] = 10
As DAV,
CFR2, D[15:14] = 11 or 01
Touch is Still Here
As PENIRQ and DAV,
CFR2, D[15:14] = 00
Figure 45. Example of a Single X Coordinate Touch Screen Scan
(with Panel Stabilization Time) using TSMode 3
Copyright © 2007–2008, Texas Instruments Incorporated
Submit Documentation Feedback
47
Product Folder Link(s): TSC2004
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
AUXILIARY AND TEMPERATURE MEASUREMENT
The TSC2004 can measure the voltage from the auxiliary input (AUX) and from the internal temperature sensor.
Applications for the AUX can include external temperature sensing, ambient light monitoring for controlling
backlighting, or sensing the current drawn from batteries. There are two converter functions that can be used for
the measurement of the AUX:
1. Non-continuous AUX measurement shown in Figure 46 (converter function select bits C[3:0] = Control Byte 1
D[6:3] = 0101); or
2. Continuous AUX Measurement shown in Figure 47 (converter function select bits C[3:0] = Control Byte 1
D[6:3] = 1000).
See Table 7 for more information on the converter function select bits.
There are also two converter functions for the measurement of the internal temperature sensor:
1. TEMP1 measurement (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0110); or
2. TEMP2 measurement (converter function select bits C[3:0] = Control Byte 1 D[6:3] = 0111).
See Table 7 for more information on the converter function select bits.
For the detailed calculation of the internal temperature sensor, please see the Internal Temperature Sensor
section. These two converter functions have the same timing as the non-continuous AUX measurement
operation as shown in Figure 46; therefore, Equation 12 can also be used for internal temperature sensor
measurement. The time needed to make a non-continuous auxiliary measurement or an internal temperature
sensor measurement is given by:
f
LPPRO
fOSC
OH3
fOSC
1
fOSC
OSC )OHCONV
fADC
)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
(12)
Where:
OH3 = overhead time #3 = 3.5 internal clock cycles.
TSC
Not Addressed
TSC
Not Addressed
TSC
Not Addressed
Reading
AUX-Data
Register
Programmed for
Non-Continuous
AUX Measurement
tCOORDINATE
No Touch
Detected
Sample, Conversion, and
Averaging for AUX Measurement
No Touch
Detected
Host Write to
Control Byte 1 D[6:3]
Waiting for Host to
Read AUX Data
As DAV
Figure 46. Non-Touch Screen, Non-Continuous AUX Measurement
The time needed to make continuous auxiliary measurement is given by:
f
LPPRO
fOSC
OH3
fOSC
1
fOSC
OSC )OHCONV
)N @ ǒB)2 @
(
)
Ǔ@ ǒ Ǔ)ǒ Ǔ
tCOORDINATE
+
fADC
(13)
TSC
Not
Addressed
TSC
Not Addressed
TSC
Not Addressed
TSC
Not Addressed
Programmed for
Continuous
Reading
AUX-Data
Register
Reading
AUX-Data
Register
AUX Measurement
tCOORDINATE
tCOORDINATE
tCOORDINATE
Sample, Conversion,
and Averaging for
AUX Measurement
Sample, Conversion,
and Averaging for
AUX Measurement
Sample, Conversion,
and Averaging for
AUX Measurement
No Touch
Detected
Host to Write to
Control Byte 1 D[6:3]
As DAV
Figure 47. Non-Touch Screen, Continuous AUX Measurement
48
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TSC2004
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
LAYOUT
The following layout suggestions should obtain optimum performance from the TSC2004. However, many
portable applications have conflicting requirements for power, cost, size, and weight. In general, most portable
devices have fairly clean power and grounds because most of the internal components are very low power. This
situation would mean less bypassing for the converter power and less concern regarding grounding. Still, each
application is unique and the following suggestions should be reviewed carefully.
For optimum performance, care should be taken with the physical layout of the TSC2004 circuitry. The basic
SAR architecture is sensitive to glitches or sudden changes on the power supply, reference, ground connections,
and digital inputs that occur just prior to latching the output of the analog comparator. Therefore, during any
single conversion for an n-bit SAR converter, there are n windows in which large external transient voltages can
easily affect the conversion result. Such glitches might originate from switching power supplies, nearby digital
logic, and high power devices. The degree of error in the digital output depends on the reference voltage, layout,
and the exact timing of the external event. The error can change if the external event changes in time with
respect to the SCL input.
With this in mind, power to the TSC2004 should be clean and well-bypassed. A 0.1µF ceramic bypass capacitor
should be added between (SNSVDD to AGND and SNSGND) or (I/OVDD to DGND). A 0.1µF decoupling
capacitor between VREF to AGND is also needed unless the SNSVDD is used as a reference input and is
connected to VREF. These capacitors must be placed as close to the device as possible. A 1µF to 10µF
capacitor may also be needed if the impedance of the connection between SNSVDD and the power supply is
high. The I/OVDD needs to be shorted to the same supply plane as the SNSVDD. Short both SNSVDD and
I/OVDD to the analog VDD plane.
The A/D converter architecture offers no inherent rejection of noise or voltage variation in regards to using an
external reference input, which is of particular concern when the reference input is tied to the power supply for
auxiliary input and temperature measurements. Any noise and ripple from the supply appears directly in the
digital results. While high-frequency noise can be filtered out by the built-in MAV filter, voltage variation as a
result of line frequency (50Hz or 60Hz) can be difficult to remove. Some package options have pins labeled as
NC (no connection). It is recommended that these NC pins be connected to the ground plane. Avoid any active
trace going under the analog pins listed in the Pin Assignments table, unless they are shielded by a ground or
power plane.
All GND (AGND, DGND, SUBGND and SNSGND) pins should be connected to a clean ground point. In many
cases, this point is the analog ground. Avoid connections that are too near the grounding point of a
microcontroller or digital signal processor. If needed, run a ground trace directly from the converter to the
power-supply entry or battery connection point. The ideal layout includes an analog ground plane dedicated to
the converter and associated analog circuitry.
In the specific case of use with a resistive touch screen, care should be taken with the connection between the
converter and the touch screen. Because resistive touch screens have fairly low resistance, the interconnection
should be as short and robust as possible. Loose connections can be a source of error when the contact
resistance changes with flexing or vibrations.
As indicated previously, noise can be a major source of error in touch-screen applications (for example,
applications that require a back-lit LCD panel). This electromagnetic interfence (EMI) noise can be coupled
through the LCD panel to the touch screen and cause flickering of the converted A/D converter data. Several
things can be done to reduce this error, such as using a touch screen with a bottom-side metal layer connected
to ground, which couples the majority of noise to ground. Another way to filter out this type of noise is by using
the TSC2004 built-in MAV filter (see the Preprocessing section). Filtering capacitors, from Y+, Y–, X+, and X– to
ground, can also help. Note, however, that the use of these capacitors increases screen settling time and
requires longer panel voltage stabilization times, and also increases precharge and sense times for the PINTADV
circuitry of the TSC2004. The resistor value varies depending on the touch screen sensor used. The internal
50kΩ pull-up resistor (RIRQ) may be adequate for most of sensors.
Copyright © 2007–2008, Texas Instruments Incorporated
Submit Documentation Feedback
49
Product Folder Link(s): TSC2004
TSC2004
www.ti.com
SBAS408E–JUNE 2007–REVISED MARCH 2008
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (February 2008) to Revision E ............................................................................................. Page
•
•
•
•
•
•
Changed air gap discharge from 18kV to 25kV in the ESD protection discharge sub-bullets of Features........................... 1
Deleted "Target" from the ESD protection discharge sub-bullets of Features ...................................................................... 1
Changed IEC air discharge in the Absolute Maximum Ratings from ±18 to ±25 .................................................................. 2
Changed resistance ratio from 80 to 91 .............................................................................................................................. 17
Changed resistance ratio from 80 to 91 .............................................................................................................................. 17
Changed T factor from 2.648 to 2.573................................................................................................................................. 17
Changes from Revision C (October 2007) to Revision D ............................................................................................... Page
•
•
•
•
•
•
•
•
•
•
•
•
•
Deleted references to WCSP package availability ................................................................................................................ 1
Changed HBM ESD protection from 6kV to 8kV in Features bullet ...................................................................................... 1
Changed clock frequency for SNSVDD = 1.2V from 3.3 to 3.2............................................................................................. 3
Changed clock frequency (for SNSVDD = 1.6V) min value from 3.6 to 3.3 and typ value from 3.9 to 3.7........................... 3
Added SNSVDD = I/OVDD = VREF = 1.6V condition to power-down supply current............................................................. 3
Changed power-down supply current typ value from 0 to 0.023........................................................................................... 3
Changed Figure 9 ............................................................................................................................................................... 10
Changed Equation 8; moved paren..................................................................................................................................... 45
Changed Equation 9; moved paren..................................................................................................................................... 46
Changed Equation 10; moved paren................................................................................................................................... 46
Changed Equation 11; moved paren................................................................................................................................... 47
Changed Equation 12; moved paren................................................................................................................................... 48
Changed Equation 13; moved paren................................................................................................................................... 48
50
Submit Documentation Feedback
Copyright © 2007–2008, Texas Instruments Incorporated
Product Folder Link(s): TSC2004
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TSC2004IRTJR
TSC2004IRTJT
TSC2004IRTJTG4
ACTIVE
QFN
QFN
QFN
RTJ
20
20
20
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
-40 to 85
-40 to 85
-40 to 85
TSC
2004I
ACTIVE
ACTIVE
RTJ
250
250
RoHS & Green
RoHS & Green
NIPDAU
NIPDAU
TSC
2004I
RTJ
TSC
2004I
TSC2004IYZKR
TSC2004IYZKT
ACTIVE
ACTIVE
DSBGA
DSBGA
YZK
YZK
24
24
3000 RoHS & Green
250 RoHS & Green
SNAGCU
SNAGCU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
TSC2004I
TSC2004I
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TSC2004IRTJR
TSC2004IRTJT
TSC2004IYZKR
TSC2004IYZKT
QFN
QFN
RTJ
RTJ
YZK
YZK
20
20
24
24
3000
250
330.0
180.0
180.0
180.0
12.4
12.4
8.4
4.25
4.25
2.75
2.75
4.25
4.25
2.75
2.75
1.15
1.15
0.81
0.81
8.0
8.0
4.0
4.0
12.0
12.0
8.0
Q2
Q2
Q1
Q1
DSBGA
DSBGA
3000
250
8.4
8.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TSC2004IRTJR
TSC2004IRTJT
TSC2004IYZKR
TSC2004IYZKT
QFN
QFN
RTJ
RTJ
YZK
YZK
20
20
24
24
3000
250
356.0
210.0
210.0
210.0
356.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
DSBGA
DSBGA
3000
250
Pack Materials-Page 2
GENERIC PACKAGE VIEW
RTJ 20
4 x 4, 0.5 mm pitch
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
This image is a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
4224842/A
www.ti.com
DATA BOOK
PACKAGE OUTLINE
LEADFRAME EXAMPLE
4222370
DRAFTSMAN:
DATE:
DATE:
DATE:
DATE:
DATE:
DATE:
DATE:
H. DENG
09/12/2016
09/12/2016
09/12/2016
DESIGNER:
CHECKER:
ENGINEER:
APPROVED:
RELEASED:
CODE IDENTITY
NUMBER
H. DENG
01295
SEMICONDUCTOR OPERATIONS
V. PAKU & T. LEQUANG
T. TANG
ePOD, RTJ0020D / WQFN,
20 PIN, 0.5 MM PITCH
09/12/2016
10/06/2016
10/24/2016
E. REY & D. CHIN
WDM
SCALE
SIZE
REV
PAGE
OF
TEMPLATE INFO:
4219125
A
15X
04/07/2016
A
EDGE# 4218519
PACKAGE OUTLINE
WQFN - 0.8 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
RTJ0020D
A
4.1
3.9
B
PIN 1 INDEX AREA
4.1
3.9
DIM A
OPT 1
(0.1)
OPT 2
(0.2)
C
0.8 MAX
SEATING PLANE
0.08 C
0.05
0.00
16X 0.5
(A) TYP
6
10
EXPOSED
THERMAL PAD
5
11
SYMM
ꢀꢁꢂꢃꢁꢄ
4X 2
21
15
1
0.5
0.3
20X
PIN 1 ID
(OPTIONAL)
20
16
SYMM
0.29
0.19
0.1
20X
C A B
C
0.05
4219125 / A 10/2016
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
www.ti.com
EXAMPLE BOARD LAYOUT
WQFN - 0.8 mm max height
RTJ0020D
PLASTIC QUAD FLATPACK - NO LEAD
2.7)
SYMM
20
16
20X (0.6)
1
20X (0.24)
15
(1.1)
TYP
21
SYMM
(3.8)
(0.5)
TYP
ꢅꢃꢁꢀꢆꢇ7<3
VIA
5
11
(R0.05)
TYP
6
10
(3.8)
LAND PATTERN EXAMPLE
SCALE: 20X
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
SOLDER MASK
OPENING
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
NON SOLDER MASK
SOLDER MASK
DEFINED
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4219125 / A 10/2016
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments
literature number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their
locations shown on this view. It is recommended that vias under paste be filled, plugged or tented.
www.ti.com
EXAMPLE STENCIL DESIGN
WQFN - 0.8 mm max height
RTJ0020D
PLASTIC QUAD FLATPACK - NO LEAD
SYMM
(0.69)
TYP
20
16
20X (0.6)
1
20X (0.24)
15
(0.69)
TYP
SYMM
(3.8)
(0.5)
TYP
5
11
(R0.05)
TYP
21
6
10
4X ( 1.19)
(3.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD
78% PRINTED COVERAGE BY AREA
SCALE: 20X
4219125 / A 10/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations..
www.ti.com
R E V I S I O N S
REV
A
DESCRIPTION
ECR
DATE
ENGINEER / DRAFTSMAN
T. TANG / H. DENG
RELEASE NEW DRAWING
2160736
10/24/2016
SCALE
SIZE
REV
PAGE
4219125
5 OF 5
A
NTS
A
D: Max = 2.598 mm, Min =2.538 mm
E: Max = 2.598 mm, Min =2.538 mm
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IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
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TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
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will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated
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BB
TSC2004IRTJTG4
12 位、毫微功耗、4 线触摸屏控制器 | RTJ | 20 | -40 to 85Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TSC2004IYZKR
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with I2C⑩ InterfaceWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TSC2004IYZKR
12 位、毫微功耗、4 线触摸屏控制器 | YZK | 24 | -40 to 85Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TSC2004IYZKT
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with I2C⑩ InterfaceWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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BB
TSC2004IYZKT
12 位、毫微功耗、4 线触摸屏控制器 | YZK | 24 | -40 to 85Warning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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TI
TSC2004_12
1.2V to 3.6V, 12-Bit, Nanopower, 4-WireWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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BB
TSC2005
1.6V to 3.6V, 12-Bit, Nanopower, 4-Wire TOUCH SCREEN CONTROLLER with SPI InterfaceWarning: Undefined variable $rtag in /www/wwwroot/website_ic37/www.icpdf.com/pdf/pdf/index.php on line 217
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